Light emitting device

Abstract

A light emitting device includes: a substrate having a polygonal shape; a light-emitting region including a plurality of light-emitting elements and each having a first electrode and a second electrode; a first contact region disposed in a peripheral region of the light emitting region; and a moisture-proof ring. The first electrode is provided on each of the light-emitting elements, and the second electrode is a common electrode shared by the light-emitting elements, the moisture-proof ring having a first portion arranged at a first distance from the long side and a second portion arranged at a second distance from the long side, and the first contact area is arranged between the second portion of the moisture-proof ring and the light emitting area in the second direction.

Description

Technical Field

[0001] The present disclosure relates to a light emitting device, for example a light emitting device having a light emitting element. Background Art

[0002] An optical writing device (OLED-PH: OLED print head) used in an imaging device using an organic light emitting diode (OLED) as a light emitting source has been proposed. Since the OLED and a transistor for driving the OLED can be formed on the same substrate, the OLED-PH is advantageous for miniaturization and cost reduction. In particular, in the case where a silicon wafer is used as a substrate, a driving circuit can be finely formed. As a result, the density of the OLED as a light emitting source can be increased. Therefore, a higher definition image can be formed.

[0003] Japanese Patent Publication No. 2021-30565 discloses an OLED-PH in which a plurality of rectangular light-emitting devices are arranged in a linear shape, each of which has a plurality of OLEDs. In the OLED-PH, each light-emitting device has a plurality of OLEDs that are supplied with current through a common power supply wiring. Therefore, the cost of the OLED-PH can be further reduced by reducing the cost of the light-emitting device.

[0004] Here, a light emitting device can be obtained by forming a plurality of light emitting devices on a substrate and then cutting the substrate to obtain a single light emitting device. Therefore, cost reduction can be achieved by increasing the yield of light emitting devices on one substrate.

[0005] In addition, in each OLED in Japanese Patent Publication No. 2021-30565, the lower electrode is an independent electrode and the upper electrode is a common electrode. Since the upper electrode is made of a material that is transparent to the emission wavelength of the light-emitting layer, its resistance is generally high. In addition, since the upper electrode is a common electrode, the driving current of multiple OLEDs flows into the upper electrode, and the voltage drop is large. As a result, uneven luminous brightness may occur. In order to suppress the voltage drop of the upper electrode, it is desirable to have multiple contact areas between the upper electrode and the low-resistance wiring for providing a potential to the upper electrode.

[0006] In the manufacturing process of OLED, electrodes and organic layers are deposited on a substrate by vacuum deposition using a deposition mask to form an OLED. Since the deposition mask opening area is large, the deposition mask tends to bend. The bending of the deposition mask is suppressed by making a part of the deposition mask directly contact the substrate. Therefore, a columnar structure for direct contact, called a rib, is formed on the deposition mask. In the case of a rectangular light-emitting device, the opening aspect ratio of the deposition mask becomes larger, and the mask tends to bend in the long side direction of the opening. Therefore, it is necessary to arrange the rib direct contact area along the long side between the light-emitting devices adjacent in the short side direction.

[0007] As described above, in order to suppress the voltage drop of the upper electrode (common electrode), it is effective to arrange the contact area along the long side direction between the upper electrode and the low resistance wiring for providing the potential to the upper electrode. On the other hand, the rib direct contact area must be arranged along the long side direction. Therefore, the contact area must be arranged to avoid interference with the terminal pad portion and the rib direct contact area for electrical connection to the outside.

[0008] For example, the contact region, the terminal pad portion and the rib direct contact region may be sequentially arranged from the OLED arrangement region along the short side direction. However, this arrangement enlarges the chip, thereby reducing the yield of light emitting devices per substrate and hindering cost reduction. Summary of the invention

[0009] The present disclosure provides a light emitting device capable of improving productivity and achieving cost reduction.

[0010] According to some embodiments, a light emitting device includes: a substrate having a polygonal shape, a long side direction thereof being a first direction, and a short side direction thereof being a second direction; a light emitting region including a plurality of light emitting elements disposed on the substrate, and each of the plurality of light emitting elements having a first electrode and a second electrode, wherein a light emitting layer is located between the first electrode and the second electrode; a first contact region disposed in a peripheral region of the light emitting region of the substrate and electrically connected to the second electrode; and a moisture-proof ring disposed on the substrate and surrounding the light emitting region and the first contact region. The first electrode of each of the plurality of light emitting elements is electrically separated, and the second electrode is a common electrode shared by the plurality of light emitting elements, the moisture-proof ring having a first portion and a second portion disposed along one long side of the light emitting region of the substrate, the first portion being located at a first distance from the long side in the second direction, and the second portion being located at a second distance from the long side in the second direction, the first distance being greater than the second distance, and the first contact region being disposed between the second portion of the moisture-proof ring and the light emitting region in the second direction.

[0011] According to some embodiments, a light emitting device includes: a substrate having a polygonal shape, a long side direction of which is a first direction, and a short side direction of which is a second direction; a light emitting region including a plurality of light emitting elements disposed on the substrate, and each of the plurality of light emitting elements has a first electrode and a second electrode, wherein a light emitting layer is located between the first electrode and the second electrode; a first contact region and a second contact region, which are arranged in a peripheral region of the light emitting region of the substrate and are electrically connected to the second electrode; and a moisture-proof ring disposed on the substrate and surrounding the light emitting region, the first contact region, and the second contact region. The first electrode of each of the plurality of light emitting elements is electrically separated, and the second electrode is a common electrode shared by the plurality of light emitting elements, the moisture-proof ring includes a first recess on one long side, and the first recess of the moisture-proof ring is arranged between the first contact region and the second contact region.

[0012] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figures 1A to 1C shows the arrangement of a substrate and a deposition mask of a light emitting device according to Embodiment 1;

[0014] Figure 2 is a cross-sectional view of an example of a light emitting device according to Embodiment 1;

[0015] Figure 3 is a plan view of an example of a light emitting device according to Embodiment 1;

[0016] Figure 4A It is taken along the A-A' plane Figure 3 A cross-sectional view of an example of a light emitting device in;

[0017] Figure 4B It is taken along the B-B' plane Figure 3 A cross-sectional view of an example of a light emitting device in;

[0018] Figure 5 is a plan view of an example of a light emitting device according to Embodiment 2;

[0019] Figure 6 is a plan view of an example of a light emitting device according to Embodiment 2;

[0020] Figure 7 It is taken along the C-C' plane Figure 6 A cross-sectional view of an example of a light emitting device in; and

[0021] FIG. 8A to FIG. 8C is a diagram showing the configuration of an imaging apparatus according to Embodiment 3. DETAILED DESCRIPTION

[0022] Example 1

[0023] Will refer to Figure 1A-Figure 1C , Figure 2 , Figure 3 , Figure 4A and Figure 4B An embodiment of the light emitting device according to the present disclosure is described. It should be noted that the following embodiment examples are merely examples of the present invention, and the numerical values, shapes, materials, components, arrangement of components, and connection forms thereof do not limit the present invention.

[0024] In the following description, OLED will be used as an example of a light emitting element. It should be noted that the present disclosure is not limited to OLED, and can be applied to current driven light emitting devices in general.

[0025] Figure 1A An example of a light emitting device 002 according to the present embodiment formed on a silicon wafer 001 is shown. The light emitting device 002 is formed in rows and columns on the silicon wafer 001. In the case of a polygonal (e.g., rectangular) light emitting device having long sides and short sides, the yield of one silicon wafer varies greatly depending on the size of the short side. Therefore, making the short side as short as possible is effective in achieving cost reduction. In addition, when a silicon wafer is used as a substrate, a drive circuit can be finely formed. As a result, the density of the OLED can be increased. By increasing the density, a higher definition image can be formed.

[0026] Figure 1B An example of a deposition mask 003 for forming an OLED on a light-emitting device 002 is shown. A plurality of openings 004 are arranged in the deposition mask 003, and the openings 004 and the light-emitting device 002 are arranged at equal intervals. After the light-emitting device 002 on the silicon wafer 001 is overlapped with the openings 004 of the deposition mask 003 in a plan view, the silicon wafer 001 and the deposition mask 003 are brought into close contact with each other, and an electrode and an organic layer are deposited on the light-emitting device by vacuum deposition, thereby forming an OLED.

[0027] Figure 1C An example of a cross-sectional structure of a silicon wafer 001 and a deposition mask 003 in close contact with each other is shown. Ribs 005 are arranged on the deposition mask 003. The ribs 005 allow the silicon wafer 001 and the deposition mask 003 to maintain a constant distance apart when the silicon wafer 001 and the deposition mask 003 are in close contact with each other. In addition, the ribs 005 minimize the area in which the deposition mask 003 contacts the light emitting device 002, and suppress or prevent the transfer of foreign matter and scratches to the light emitting device 002, thereby suppressing or preventing the occurrence of sealing defects.

[0028] Figure 2is a schematic cross-sectional view showing an example of an OLED and a transistor connected to the OLED.

[0029] A transistor is an example of an active element. The transistor may be a thin film transistor (TFT). Figure 2 An OLED 020 and a transistor 014 are shown.

[0030] The transistor 014 is disposed on the silicon substrate 010 , and is configured to include a transistor gate 013 , a transistor drain 012 , and a transistor source 011 .

[0031] There is a wiring 017 formed of many contact plugs 015_1 to 015_4 that electrically connect the transistor drain 012 and the OLED 020 and many metal wirings 016_1 to 016_4. An insulating layer 019 is provided between the wirings. Figure 2 In FIG. 1 , the insulating layer 019 is shown as a single layer, but may have a stacked structure of a plurality of layers.

[0032] The OLED 020 is configured to include a first electrode 016_4 , an organic compound layer 021 having a light emitting layer, and a second electrode 022 .

[0033] exist Figure 2 , the organic compound layer is shown as a single layer, but the organic compound layer 021 may be a plurality of layers. In the OLED 020, the second electrode 022 is a transparent electrode and can extract light from the organic compound layer 021 to the outside. A protective layer 025 for reducing degradation of the OLED is provided on the second electrode 022. The second electrode 022 of the OLED 020 is shared by a plurality of OLEDs 020 and serves as a common electrode.

[0034] In the light emitting device 002 , a combination of an OLED 020 and a transistor 014 is repeatedly arranged in the row direction and the column direction.

[0035] A structure 027 having a large step in a layer immediately below the organic compound layer 021 is formed between the OLEDs 020. The structure 027 electrically insulates the organic compound layer 021 while forming an electrical connection with the second electrode 022.

[0036] The method of electrically connecting to the electrodes (source, drain) included in the transistor is not limited to Figure 2 The source or drain of the transistor can be electrically connected according to the polarity of the first electrode 016_4 and the polarity of the transistor.

[0037] exist Figure 2 In the present invention, transistors are used as switching elements, but other switching elements may be used instead.

[0038] The transistor is not limited to a transistor using a single crystal silicon wafer, but may be a thin film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include single crystal silicon, amorphous silicon, and non-single crystal silicon (such as microcrystalline silicon) and non-single crystal oxide semiconductors (such as indium zinc oxide and indium gallium zinc oxide).

[0039] Figure 3 1 is a schematic diagram showing a form of a light emitting device according to the present embodiment. The light emitting device according to the present embodiment is in a rectangular shape, wherein the long sides are parallel to the first direction and the short sides are parallel to the direction crossing the first direction.

[0040] In the light emitting device, when the light emitting region is formed along the long side direction, in the peripheral region of the light emitting region, members other than the light emitting region (such as a contact region) can be arranged adjacent to the light emitting region in the short side direction.

[0041] The substrate 101 is a polygonal shape, and an example of a substrate 101 having a rectangular shape as an example of a polygonal shape will be described here. In this specification, the long side direction of the rectangular substrate 101 is referred to as the first direction, and the short side direction perpendicular to the long side direction is referred to as the second direction. In addition, the polygonal shape in this specification also includes a shape with rounded corners. A moisture-proof ring 100 is arranged on the rectangular substrate 101, and the moisture-proof ring 100 has the function of suppressing and preventing moisture from penetrating into the light-emitting device. In addition, a light-emitting area 102, a first contact area 103_1 and a second contact area 103_2, and pads 104_1 and 104_2 are arranged inside the moisture-proof ring 100. In the light-emitting area 102, light-emitting elements are arranged in the row direction and the column direction. The first contact area 103_1 and the second contact area 103_2 are areas where wiring electrically connected to the common electrode of the OLED is arranged. The pads 104_1 and 104_2 are electrically connected to the contact area.

[0042] In the light-emitting region 102, a plurality of light-emitting elements are arranged in rows and columns. As described above, each light-emitting element is constructed to include a light-emitting layer, a first electrode, and a second electrode, wherein the light-emitting layer is located between the first electrode and the second electrode. The first electrode is an independent electrode provided for each light-emitting element, and the second electrode is a common electrode provided for all light-emitting elements.

[0043] The first contact region 103_1 and the second contact region 103_2 are adjacent regions of the light emitting region 102 of the substrate 101, and are disposed inside the moisture-proof ring 100. In addition, the recess 105, the first contact region 103_1, the second contact region 103_2, and the pads 104_1 and 104_2 are arranged between the light emitting region 102 and one long side end of the substrate 101. In other words, the recess 105, the first contact region 103_1, the second contact region 103_2, and the pads 104_1 and 104_2 are arranged on the same side in the short side direction relative to the light emitting region 102. In addition, the recess 105 is arranged between the first contact region 103_1 and the second contact region 103_2. In addition, the recess 105, the first contact region 103_1, the second contact region 103_2, and the pads 104_1 and 104_2 are arranged in a string along the long side direction. Figure 3 In the example of FIG. 1 , the pad 104_1 , the first contact region 103_1 , the recess 105 , the second contact region 103_2 , and the pad 104_2 are sequentially arranged in a string along the long side direction.

[0044] The moisture-proof ring 100 is a protective ring made of a wiring layer and is arranged to surround the light-emitting area 102, the first contact area 103_1, the second contact area 103_2, and the pads 104_1 and 104_2. The moisture-proof ring 100 has one or more recesses 105 on one long side of the substrate. The moisture-proof ring 100 has a narrow width portion 100_2 and wide width portions 100_1 and 100_3, and the wide width portions 100_1 and 100_3 are respectively arranged on both sides of the narrow width portion 100_2 in the long side direction (first direction). The wide width portion described herein refers to a portion whose width of the shape of the portion surrounded by the moisture-proof ring 100 is wider than other portions in the short axis direction. Similarly, the narrow width portion refers to a portion whose width of the shape of the portion surrounded by the moisture-proof ring 100 is narrower than other portions in the short axis direction. Therefore, the width of the narrow width portion 100_2 in the short side direction (second direction) is shorter than that of the wide width portions 100_1 and 100_3, and the width of the wide width portions 100_1 and 100_3 in the short side direction is longer than that of the narrow width portion 100_2.

[0045] In other words, the moisture-proof ring 100 has a first portion and a second portion extending along one side (for example, one side extending along the long side direction or the first direction) of the substrate 101. Figure 3The distance from the lower side of the substrate 100 to the first portion (the first distance) is greater than the distance from the side of the substrate 101 to the second portion (the second distance). That is, the distance from the side of the substrate 101 to the first portion is greater than the distance from the side of the substrate 101 to the second portion. Therefore, for example, the narrow width portion 100_2 may have the first portion. In addition, the wide width portion 100_1 or 100_3 may have the second portion.

[0046] The positions of the narrow width portion 100_2 and the wide width portions 100_1 and 100_3 in the short side direction of one of their long sides are the same, and the positions of the narrow width portion 100_2 and the wide width portions 100_1 and 100_3 in the short side direction of the other long side are different. Due to the presence of the narrow width portion 100_2, the periphery of the moisture-proof ring 100 has a concave portion. In the present embodiment, this portion is referred to as a recess 105. The recess 105 is a direct contact area for direct contact with a rib that is a part of a deposition mask in a film forming process. The width of the narrow width portion 100_2 in the short side direction is smaller than the width of the wide width portions 100_1 and 100_3 in the short side direction by the width of the recess 105 in the short side direction. The first contact area 103_1 and the second contact area 103_2 are arranged in the wide width portions 100_1 and 100_3 of the moisture-proof ring 100, respectively. In other words, in the region of the light emitting region side of the moisture proof ring 100 , the first contact region 103_1 and the second contact region 103_2 are arranged adjacent to the second portion of the moisture proof ring 100 .

[0047] The driving circuit for the light-emitting device is formed inside the moisture-proof ring 100 (not shown in the figure). When the OLED is formed, the rib 005 of the deposition mask 003 is in direct contact with the recess 105 of the moisture-proof ring 100 (in other words, the outer side of the moisture-proof ring 100 at the narrow width portion 100_2), thereby maintaining a certain distance. The rib 005 minimizes the area in which the deposition mask contacts the light-emitting device, and suppresses or prevents the transfer of foreign matter and scratches to the light-emitting device, thereby suppressing or preventing the occurrence of sealing defects. In addition, in the case where the rib 005 is in direct contact with the substrate, the insulating film on the substrate may be scratched. As a result, there is a concern that the sealing performance of the light-emitting device will deteriorate. In this embodiment, since the recess 105 as the direct contact area of ​​the rib 005 is arranged on the outer side of the moisture-proof ring, the sealing performance of the device is ensured.

[0048] The second electrode (upper electrode / common electrode) 022 of the OLED in this embodiment is made of a transparent electrode material. Therefore, the wiring resistance is relatively high. In addition, since the second electrode 022 is also a common electrode, current flows out from multiple OLEDs, and the voltage drop at the second electrode 022 becomes larger. Therefore, depending on the distance to the contact area to which the potential is provided, the voltage applied to each OLED differs. Therefore, between OLEDs to which a voltage for emitting light with the same brightness is applied, the actual light emitting brightness is different, and shadows, etc. may occur.

[0049] The light emitting device according to the present embodiment has at least two contact regions (103_1, 103_2) between the second electrode (upper electrode / common electrode) 022 and the power supply wiring along the end of the long side of the light emitting device. By making the second electrode 022 contact with the power supply wiring having a low resistance at multiple positions in the long side direction, the resistance of the second electrode 022 can be reduced. Therefore, even in the case where a plurality of OLEDs have a common second electrode 022, the voltage drop of the second electrode 022 related to the position can be suppressed, and the shadow of the light emission brightness can be suppressed.

[0050] The first contact area 103_1 or the second contact area 103_2 and the direct contact area of ​​the rib 005 of the deposition mask 003 can be arranged in a string along the short side direction of the chip. However, in this case, in the short side direction, an area dedicated to the rib is set between the light-emitting devices, and the chip size increases the area of ​​the area dedicated to the rib. In the light-emitting device according to the present embodiment, the recess 105 of the moisture-proof ring as the rib direct contact area is arranged between the first contact area 103_1 and the second contact area 103_2. Therefore, the distance in the short side direction between the light-emitting devices can be reduced. Therefore, the number of light-emitting devices that can be arranged in the short side direction on a silicon wafer can be increased, and the yield of the light-emitting device can be increased.

[0051] Figure 4A It is taken along the line A-A' Figure 3 040_2 has a stacked structure in which contact plugs 045_1 to 045_4 and metal wirings 046_1 to 046_4 are stacked, and extends from the surface of the light emitting device to a depth reaching the silicon substrate 010 on which the circuit elements are formed. The contact plugs 045_1 to 045_4 and metal wirings 046_1 to 046_4 constituting the moisture-proof ring 040_2 are formed in the same layer as the contact plugs 015_1 to 015_4 and metal wirings 016_1 to 016_4 constituting the wiring 017. In this way, the moisture-proof ring 040 has the same layer structure as the multilayer wiring structure of the internal circuit, and can be formed simultaneously with the internal circuit through a common process.

[0052] The cross-sectional structure of the moisture-proof ring 100 is the same as that of the moisture-proof ring 040_2 at any position of the light-emitting device. Therefore, the moisture-proof ring 040_2 has the same cross-sectional structure as the moisture-proof ring 040_1.

[0053] The moisture-proof rings 040_1 and 040_2 and the protective layer 025 of the OLED are in physical contact with each other, and have a function of reducing or preventing moisture from penetrating into the OLED.

[0054] The protective layer 025 of the OLED is removed in the scratch region 041. Therefore, in the case where a light emitting device is cut out from a silicon wafer, chipping of the protective layer 025 can be reduced or prevented.

[0055] In the contact region 103_1, the second electrode (common electrode) 022 of the OLED and the metal wiring 056-4 are in physical contact with each other. The pad 104_1 is constructed to include a metal wiring 056_3 at the same layer as the metal wiring 046_3. A low-resistance power wiring is laid from the pad 104_1 to immediately below the contact region 103_1, and the metal wiring 056_3 is electrically connected to the metal wiring 056_4 at a low resistance through the contact plug 055-4. In the present embodiment, the pad is at the same layer as the metal wiring 046_3, but the pad can be at the same layer as the metal wiring 046_4, and is not necessarily limited to the pad in the cross-sectional structure of the present embodiment.

[0056] Figure 4B It is taken along the line B-B' Figure 3 040_3 has a stacked structure in which contact plugs 045_1 to 045_4 and metal wirings 046_1 to 046_4 are stacked, and extends from the surface of the light emitting device to a depth reaching the silicon substrate 010 on which the circuit elements are formed. For example, the contact plugs 045_1 to 045_4 and metal wirings 046_1 to 046_4 constituting the moisture-proof ring 040_3 may be formed in the same layer as the contact plugs 015_1 to 015_4 and metal wirings 016_1 to 016_4 constituting the wiring 017. In this way, the moisture-proof ring 040 has the same layer structure as the multilayer wiring structure of the internal circuit, and can be formed simultaneously with the internal circuit through a shared process.

[0057] The cross-sectional structure of the moisture-proof ring 100 may be the same as that of the moisture-proof ring 040_1 at any position of the light-emitting device. In this case, the moisture-proof rings 040_1, 040_3, and 040_4 have the same cross-sectional structure.

[0058] The moisture-proof rings 040_1 to 040_4 and the protective layer 025 of the OLED are in physical contact with each other, and have the function of reducing or preventing moisture from penetrating into the OLED. In addition, one or more contact plugs 045 and metal wirings 046 of the moisture-proof ring 040 may be partially replaced with a layer using the same material as the protective layer 025. Since the protective layer 025 is formed of a material capable of reducing moisture penetration, the moisture-proof property of the moisture-proof ring 040 may be maintained even when such replacement is performed.

[0059] The protective layer 025 of the OLED is removed in the scratch region 041. Therefore, in the case where a light emitting device is cut out from a silicon wafer, chipping of the protective layer 025 can be reduced or prevented.

[0060] Four light-emitting elements 020_1 to 020_4 and four transistors 014_1 to 014_4 electrically connected to the light-emitting elements are arranged in the light-emitting region 102 along the BB' cross section. In the contact region 103_2, the second electrode (common electrode) 022 of the OLED is in physical contact with the metal wiring 056-4. The pad 104_2 is constructed to include a metal wiring 056_3 at the same layer as the metal wiring 046_3. The low-resistance power wiring 056_3 is led out from the pad 104_2 to the immediate lower part of the contact region 103_2, and the metal wiring 056_3 is electrically connected to the metal wiring 056_4 at a low resistance through the contact plug 055-4. In the present embodiment, the pad is at the same layer as the metal wiring 046_3, but the pad can be at the same layer as the metal wiring 046_4, not limited to the pad in the cross-sectional structure of the present embodiment.

[0061] By adopting the configuration described in this embodiment, the effects of suppressing brightness shadow of the light emitting device, improving yield, and manufacturing at low cost can be obtained.

[0062] Example 2

[0063] A second embodiment of the light emitting device according to the present disclosure will be specifically described. It should be noted that only the parts different from the above outline and the first embodiment will be described, and the same or similar parts are represented by the same reference numerals and will not be described.

[0064] Figure 5 is a schematic diagram showing one form of a light emitting device according to the present embodiment.

[0065] On a rectangular substrate 101, a moisture-proof ring 200, a light-emitting region 102 in which light-emitting pixels arranged in row and column directions are arranged, contact regions 203_1 to 203_5 electrically connected to a common electrode of OLED, and pads 204_1 to 204_3 electrically connected to the contact regions are arranged.

[0066] In the present embodiment, the moisture-proof ring 200 is configured so that five wide width parts 200_1, 200_3, 200_5, 200_7 and 200_9 and four narrow width parts 200_2, 200_4, 200_6 and 200_8 are alternately arranged. The narrow width parts 200_2, 200_4, 200_6 and 200_8 are parts whose width in the short side direction is shorter than the width in the short side direction of the wide width parts 200_1, 200_3, 200_5, 200_7 and 200_9. As in the first embodiment, the wide width parts 200_1, 200_3, 200_5, 200_7 and 200_9 may have a second part, and the narrow width parts 200_2, 200_4, 200_6 and 200_8 may have a first part. Here, an example of five wide-width portions and four narrow-width portions is shown, but the number is not particularly limited.

[0067] Due to the presence of the wide width parts 200_1, 200_3, 200_5, 200_7 and 200_9, the outer peripheral shape of the moisture-proof ring 200 includes a plurality of recesses. In the present embodiment, these parts are referred to as recesses 205_1 to 205_4 of the moisture-proof ring. The recesses 205_1 to 205_4 are all direct contact areas for direct contact with the ribs that are part of the deposition mask in the film forming process. In the present embodiment, the plurality of recesses 205_1 to 205_4 of the moisture-proof ring 200 are arranged along the long side of the light-emitting device. Therefore, the arrangement interval of the rib direct contact area on the silicon wafer can be narrowed, and the deformation of the deposition mask can be suppressed. In addition, by narrowing the arrangement interval of the rib direct contact area, the length of each recess as the direct contact area in the long side direction can be shortened, and the interval between the first contact area and the second contact area can be reduced. Therefore, the resistance of the common electrode in the center of the light-emitting device can be further reduced, and the brightness shadow of the light-emitting device can be further suppressed. Since the contact areas 203_1 to 203_3 of the common electrode and the power wiring and the recessed parts 205_1 to 205_3 of the moisture-proof ring are alternately arranged on the light-emitting device, the resistance of the common electrode can be reduced at multiple locations.

[0068] Since components other than the light-emitting region such as the contact region of the light-emitting device are arranged in a series along the long side direction, the light-emitting device can be further miniaturized, the yield on the silicon wafer can be improved, and the cost of the light-emitting device can be reduced. In this specification, "components A and B are arranged in a series along the first direction" means that when viewed from the first direction relative to a plane perpendicular to the first direction, there is a portion where component A and component B overlap.

[0069] Figure 6 FIG. 1 is a schematic diagram showing another form of the light emitting device according to the present embodiment. Figure 5Compared with the light-emitting device of the present invention, some loops 206_1 and 206_2 for driving the light-emitting device are added. The loops 206_1 and 206_2 are arranged in a series along the long side direction. In other words, the loops 206_1 and 206_2 are additionally arranged in a manner of overlapping when viewed from above with respect to a plane perpendicular to the long side direction. The loops 206_1 and 206_2 are also arranged in a series along the long side direction together with the contact areas 203_1 to 203_3 and the pads 204_1 to 204_3.

[0070] Specific examples of the loops 206_1 and 206_2 include an input protection loop, an input loop to which data for each drive is input, and a logic loop for processing data, but are not limited thereto. Regardless of the type of the loop, the length of the light emitting device in the short side direction can be reduced by providing a loop region at the same position as that of the contact region and the pad region and arranging the loop in the loop region.

[0071] Figure 7 It is taken along the line C-C' Figure 6 In addition to adding loop 206_1, the structure is similar to Figure 4A The structure is the same.

[0072] By adopting the configuration described in this embodiment, shadowing of the brightness of the light emitting device can be effectively suppressed.

[0073] Example 3

[0074] Fig. 8A 3 is a schematic diagram of an imaging device 340 according to an example of the present disclosure. The imaging device 340 has a photosensitive member 327, an exposure section 328, a developing section 331, a charging section 330, a transfer section 332, a conveying section 333, and a fixing section 335. The photosensitive member 327 is irradiated with light 329 from the exposure section 328, and an electrostatic latent image is formed on the surface of the photosensitive member 327. In the exposure section 328, the light emitting device according to Embodiment 1 or Embodiment 2 is applied as an exposure light source. The developing section 331 has a toner and the like. The charging section 330 charges the photosensitive member 327. The transfer section 332 transfers the developed image to a recording medium 334. The conveying section 333 conveys the recording medium 334. The recording medium 334 is, for example, paper. The fixing section 335 fixes the image formed on the recording medium 334.

[0075] Figure 8B and Figure 8C 328 is a schematic diagram showing a state where a plurality of light emitting devices 336 are arranged in the exposure section 328. Line 337 indicates a direction parallel to the axis of the photosensitive member, and indicates a direction in which the OLED is arranged. This direction is the same as the direction of the axis about which the photosensitive member 327 rotates. This direction may also be referred to as the long axis direction of the photosensitive member 327. Figure 8B, the OLEDs are arranged along the long axis direction of the photosensitive member 327.

[0076] Figure 8C Shown with Figure 8B Arrangement of different light emitting devices 338. In this example, four columns of light emitting devices are arranged in a direction (row direction) intersecting the long axis direction. The light emitting devices 338 are arranged to sequentially form a first column, a second column, a third column, and a fourth column. In each of the first column and the second column, the light emitting portions are alternately arranged along the column direction. In other words, the light emitting devices 338 in the first column and the light emitting devices 338 in the second column are arranged at different positions in the row direction.

[0077] In the first column, a plurality of light emitting devices 338 are arranged at intervals. In the second column, light emitting devices are arranged at positions corresponding to the spaces between the light emitting devices 338 in the first column. That is, a plurality of light emitting portions are also arranged at intervals in the row direction.

[0078] Figure 8C The arrangement in can be modified into, for example, a grid arrangement, a jigsaw arrangement or a checkerboard arrangement.

[0079] The present invention is not limited to the above-described embodiments, and various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, the following claims are attached to disclose the scope of the invention.

[0080] According to the present disclosure, it is possible to improve the yield of light emitting devices and achieve cost reduction.

[0081] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A light emitting device, comprising: a substrate having a polygonal shape, a long side direction of which is a first direction, and a short side direction of which is a second direction; a light emitting region comprising a plurality of light emitting elements disposed on the substrate, wherein each of the plurality of light emitting elements has a first electrode and a second electrode, wherein a light emitting layer is located between the first electrode and the second electrode; a first contact region disposed in a peripheral region of the light emitting region of the substrate and electrically connected to the second electrode; and a moisture-proof ring, which is disposed on the substrate and surrounds the light-emitting area and the first contact area, wherein: The first electrode of each of the plurality of light emitting elements is electrically separated, and the second electrode is a common electrode shared by the plurality of light emitting elements, The moisture-proof ring has a first portion and a second portion arranged along one long side of the light-emitting area of ​​the substrate, the first portion being located at a first distance from the long side in the second direction, and the second portion being located at a second distance from the long side in the second direction, The first distance is greater than the second distance, and, The first contact area is arranged between the second portion of the moisture-proof ring and the light-emitting area in the second direction.

2. The light emitting device according to claim 1, wherein: The moisture-proof ring has a first narrow width portion and a first wide width portion, wherein the first narrow width portion has the first portion on the one long side, and the first wide width portion has the second portion on the one long side. The first narrow width portion of the moisture-proof ring is located between the first wide width portion and the second wide width portion in the first direction. The first contact area is provided in the first wide width portion, and, A second contact region electrically connected to the second electrode is provided in the second wide-width portion.

3. The light emitting device according to claim 2, wherein: The positions of the first narrow width portion and the first wide width portion in the second direction relative to the one long side are different from each other, and, Positions of the first narrow width portion and the first wide width portion in the second direction coincide with each other with respect to the other long side.

4. The light emitting device according to claim 3, wherein: In the first wide width portion of the moisture-proof ring, the first contact region is arranged on the one long side with respect to the light emitting region.

5. The light emitting device according to any one of claims 1 to 4, further comprising: A pad, which is adjacent to the second portion, is arranged in a region on the light emitting region side of the moisture proof ring and is electrically connected to the first contact region.

6. The light emitting device according to any one of claims 1 to 4, further comprising: A loop region, which is adjacent to the second portion, is arranged in a region on the light emitting region side of the moisture proof ring, and a part of a loop for driving the light emitting element is formed in the loop region.

7. The light emitting device according to claim 1, wherein: The moisture-proof ring has a first narrow width portion and a first wide width portion, the first narrow width portion having the first portion on the one long side, the first wide width portion having the second portion on the one long side, and, The moisture-proof ring includes the first narrow width portion, a second narrow width portion disposed on the one long side of the light emitting region, and the first wide width portion disposed between the first narrow width portion and the second narrow width portion.

8. A light emitting device, comprising: a substrate having a polygonal shape, a long side direction of which is a first direction, and a short side direction of which is a second direction; a light emitting region comprising a plurality of light emitting elements disposed on the substrate, wherein each of the plurality of light emitting elements has a first electrode and a second electrode, wherein a light emitting layer is located between the first electrode and the second electrode; a first contact region and a second contact region which are arranged in a peripheral region of the light emitting region of the substrate and are electrically connected to the second electrode; and a moisture-proof ring, which is disposed on the substrate and surrounds the light-emitting area, the first contact area and the second contact area, wherein: The first electrode of each of the plurality of light emitting elements is electrically separated, and the second electrode is a common electrode shared by the plurality of light emitting elements, The moisture-proof ring includes a first recess on one long side, and The first recess of the moisture barrier ring is arranged between the first contact area and the second contact area.

9. The light emitting device according to claim 8, wherein: The moisture-proof ring further includes a second recessed portion on the one long side, and The second recess, the first contact region, the first recess, and the second contact region are arranged in sequence.

10. The light emitting device according to claim 8, wherein: The first contact region, the second contact region, and the first recessed portion of the moisture-proof ring are arranged between the light-emitting region and one long side end of the substrate.

11. The light emitting device according to claim 8, wherein: The first contact area, the first recessed portion of the moisture-proof ring, and the second contact area are arranged in a series along the first direction.

12. The light emitting device according to claim 8, wherein: In the case of forming the light emitting element, the first recessed portion of the moisture proof ring is a region contacted by a portion of a mask for deposition.

13. The light emitting device according to claim 8, further comprising: A first pad and a second pad are arranged in a peripheral area of ​​the light emitting area of ​​the substrate and are electrically connected to the first contact area and the second contact area, respectively, wherein: The first contact region, the first pad, the first recess of the moisture-proof ring, the second contact region, and the second pad are arranged between the light-emitting region and one long side end of the substrate.

14. The light emitting device according to claim 13, wherein: The first pad, the first contact region, the first recess of the moisture-proof ring, the second contact region, and the second pad are arranged in a series along the first direction.

15. The light emitting device according to claim 8, further comprising: A loop region is arranged in a peripheral region of the light emitting region of the substrate, and forms a part of a loop for driving the light emitting element in the loop region, wherein: The first contact region, the second contact region, the loop region, and the first recessed portion of the moisture-proof ring are arranged between the light-emitting region and one long side end of the substrate.

16. The light emitting device according to claim 15, wherein: The first contact area, the loop area, the first recess of the moisture-proof ring, and the second contact area are arranged in a series along the first direction.

17. The light emitting device according to claim 8, further comprising: a first pad and a second pad, which are arranged in a peripheral area of ​​the light emitting area of ​​the substrate and are electrically connected to the first contact area and the second contact area, respectively; and A loop region is arranged in a peripheral region of the light emitting region of the substrate, and forms a part of a loop for driving the light emitting element in the loop region, wherein: The first contact region, the second contact region, the first pad, the second pad, the loop region, and the first recessed portion of the moisture-proof ring are arranged between the light-emitting region and one long side end of the substrate.

18. The light emitting device according to claim 17, wherein: The first pad, the first contact region, the loop region, the first recess of the moisture-proof ring, the second contact region, and the second pad are arranged in a series along the first direction.

19. An imaging device comprising: Photosensitive member: a charging section that charges the photosensitive member; an exposure section having the light emitting device according to any one of claims 1 to 18 and forming an electrostatic latent image on a surface of the photosensitive member; a developing unit that develops the electrostatic latent image; and A transfer unit transfers the developed image to a recording medium.

Images