Chip mounter special for semiconductor thermoelectric material

Abstract

The invention relates to the technical field of chip mounters, in particular to a special chip mounter for semiconductor thermoelectric materials, which comprises a rack, a connecting mechanism is mounted on the rack, a driving mechanism is mounted on the connecting mechanism, a left-side material taking mechanism and a right-side material taking mechanism are mounted on the driving mechanism, a discharging mechanism is mounted on the connecting mechanism, and the left-side material taking mechanism and the right-side material taking mechanism are mounted on the discharging mechanism. A feeding mechanism is installed on the connecting mechanism, and a correcting mechanism is installed on the connecting mechanism. The connecting mechanism is beneficial for supporting and mounting the driving mechanism, the driving mechanism is beneficial for driving and controlling the left-side material taking mechanism and the right-side material taking mechanism, the materials are clamped, turned over and then attached, the feeding mechanism and the discharging mechanism are matched, multiple materials can be automatically fed, operation is more convenient and efficient, and through mounting of the correction mechanism, the correction efficiency is improved. And the position information of the product can be identified, so that the position angle of the product can be adjusted, and the material can be conveniently taken and pasted.

Description

Technical Field

[0001] The invention relates to the technical field of chip mounters, in particular to a chip mounter dedicated to semiconductor thermoelectric materials. Background Art

[0002] Semiconductor thermoelectric materials refer to semiconductor materials with a large thermoelectric effect, also known as thermoelectric materials. They can directly convert thermal energy into electrical energy, or directly generate cooling from electrical energy. In the production process of semiconductor materials, two products need to be bonded together, and then other processes are carried out to produce finished products for transportation and packaging for subsequent use.

[0003] At present, when semiconductor materials are produced and bonded, most of them are loaded through conveyor belts or manually, and the materials need to be loaded one by one, which is slow and inefficient, thereby reducing the overall processing efficiency of the product. In addition, it is inconvenient to identify the position and direction of the product during bonding, which causes errors during bonding and affects the bonding quality of the product. In addition, multiple processes are required for product conveying and bonding, which occupies a large area and increases labor and equipment costs. Summary of the invention

[0004] In view of the problems in the prior art, the present invention provides a special chip mounter for semiconductor thermoelectric materials.

[0005] The technical solution adopted by the present invention to solve its technical problems is: a special placement machine for semiconductor thermoelectric materials, comprising a frame, a connecting mechanism is installed on the frame, a driving mechanism is installed on the connecting mechanism, a left-side material taking mechanism and a right-side material taking mechanism are installed on the driving mechanism, a discharging mechanism is installed on the connecting mechanism, a loading mechanism is installed on the connecting mechanism, and a correction mechanism is installed on the connecting mechanism.

[0006] Specifically, the connection mechanism includes a table panel, the table panel is installed inside the frame, a cover plate is rotatably connected to one side of the frame, a control panel is installed on the cover plate, and symmetrically distributed gratings are installed on the table panel.

[0007] Specifically, the driving mechanism includes a left longitudinal driving assembly, a left longitudinal driving assembly is installed at one end of the top of the table panel, and a right longitudinal driving assembly is installed at the other end of the top of the table panel. Both ends of the left longitudinal driving assembly and the right longitudinal driving assembly are connected to the table panel in a transverse sliding manner through guide rails and sliders, and one end of the left longitudinal driving assembly and the right longitudinal driving assembly are connected to the table panel in a transverse sliding manner through the left transverse driving assembly and the right transverse driving assembly respectively.

[0008] Specifically, the left-side material picking mechanism includes a first mounting plate, the left-side longitudinal driving assembly is cooperatively connected with the first mounting plate, the top of the first mounting plate is installed with a first adapter plate, one side of the first mounting plate is installed with two first upper and lower slides, the bottom of the two first upper and lower slides are respectively installed with clamping claws, one end of the clamping claw is installed with a flip motor, one side of the first mounting plate is installed with a first CCD, the bottom of the first CCD is installed with a first light source, and the first light source and one side of the first lens are respectively detachably connected to the first mounting plate.

[0009] Specifically, the right-side material picking mechanism includes a second mounting plate, a second mounting plate is connected to the right-side longitudinal driving assembly, a second adapter plate is installed on the top of the second mounting plate, two second upper and lower slides are installed on one side of the second mounting plate, hollow servo motors are respectively installed on the two second upper and lower slides, suction nozzles are respectively installed on the bottom of the two hollow servo motors, two vacuum filters are installed on the top of the second mounting plate, two vacuum generators are installed on the outside of the second mounting plate, a second CCD is installed on one side of the second mounting plate, a second lens is installed at the bottom of the second CCD, a second light source is installed at the bottom of the second lens, and the second light source and one side of the second lens can be decomposed and detachably connected to the second mounting plate.

[0010] Specifically, the discharge mechanism includes a support plate, the support plate is installed on the table panel, two bottom plates are respectively provided at both ends of the top of the support plate, material bins are respectively installed on the two groups of the bottom plates, two upper and lower driving components are respectively installed at both ends of the bottom of the support plate, the two groups of the bottom plates are slidably connected to the top of the support plate through the two groups of upper and lower driving components, and card slots are provided on opposite sides of the inside of the material bin.

[0011] Specifically, a handle is installed on the top of the silo, two limit rods are installed at the center line of the silo, blocks are installed at the four corners of the top of the base plate, the blocks are in contact with the side walls of the silo, and a plurality of guide rods are slidably connected to the support plate, and the top of the guide rod is vertically connected to the bottom of the base plate.

[0012] Specifically, the feeding mechanism includes a connecting plate, and two groups of parallel connecting plates are installed on the table panel. The two groups of connecting plates are located on one side of the two groups of silos. Front and rear drive components are respectively installed on the two groups of connecting plates, and the front and rear drive components are matched with pallets connected.

[0013] Specifically, the correction mechanism includes a fixing plate, the table panel is equipped with a fixing plate, the fixing plate is located between two groups of connecting plates, the fixing plate is equipped with a mounting frame, the mounting frame is equipped with a third light source, the bottom of the mounting frame is equipped with a third lens, the bottom of the mounting frame is equipped with a third CCD, and the third CCD is located at the bottom of the third lens.

[0014] The beneficial effects of the present invention are: (1) The semiconductor thermoelectric material dedicated placement machine described in the present invention facilitates the support and installation of the driving mechanism through the installation of the connecting mechanism, and at the same time provides safety protection for the outside of the frame, so that the equipment can work safely and stably.

[0015] (2) The semiconductor thermoelectric material dedicated chip mounter described in the present invention facilitates the drive control of the left material picking mechanism and the right material picking mechanism through the installation of the drive mechanism, thereby realizing the material clamping and flipping, and performing the alignment position chip mounting work.

[0016] (3) The semiconductor thermoelectric material dedicated placement machine described in the present invention facilitates the stacking and storage of materials through the installation of a material discharge mechanism, thereby facilitating subsequent material collection and loading, and making the operation more convenient and efficient.

[0017] (4) The semiconductor thermoelectric material dedicated placement machine described in the present invention facilitates the access to materials inside the discharge mechanism through the installation of the feeding mechanism, thereby transporting and loading the materials, facilitating subsequent placement work and improving the efficiency of product placement.

[0018] (5) The semiconductor thermoelectric material dedicated chip mounter described in the present invention facilitates the identification of product position information through the installation of a correction mechanism, thereby achieving product position angle adjustment and facilitating better material picking and chip mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 A schematic diagram of the overall structure provided by the present invention; Figure 2 It is a schematic diagram of the connection structure between the table panel and the frame of the present invention; Figure 3 It is a schematic diagram of the connection structure of the left longitudinal drive assembly, the right longitudinal drive assembly and the table panel of the present invention; Figure 4 It is a schematic diagram of the connection structure between the clamping jaw and the first upper and lower slide platform of the present invention; Figure 5 It is a schematic diagram of the connection structure between the suction nozzle and the second upper and lower slide platform of the present invention; Figure 6 It is a schematic diagram of the connection structure between the mounting frame and the fixing plate of the present invention; Figure 7 is a schematic diagram of the connection structure between the third lens and the third CCD of the present invention; Figure 8 It is a schematic diagram of the connection structure between the connection plate and the silo of the present invention; Fig. 9 It is a schematic diagram of the connection structure between the tray and the connecting plate of the present invention; Fig.10 It is a schematic diagram of the connection structure between the silo and the support plate of the present invention; Fig.11 It is a schematic diagram of the connection structure between the silo and the bottom plate of the present invention.

[0021] In the figure: 1, frame; 2, connecting mechanism; 201, cover plate; 202, control panel; 203, grating; 204, table panel; 3, left-side material taking mechanism; 301, first mounting plate; 302, first adapter plate; 303, first up-and-down slide; 304, clamping claw; 305, first CCD; 306, first lens; 307, first light source; 308, flip motor; 4, right-side material taking mechanism; 401, second mounting plate; 402, vacuum filter; 403, vacuum generator; 404, hollow servo motor; 405, nozzle; 406, second CCD; 407, second lens; 408, second light source; 409, second adapter plate; 410, second up-and-down slide ; 5. Driving mechanism; 501. Left longitudinal driving assembly; 502. Right longitudinal driving assembly; 503. Left lateral driving assembly; 504. Right lateral driving assembly; 505. Guide rail; 506. Slider; 6. Loading mechanism; 601. Connecting plate; 602. Front and rear driving assembly; 603. Tray; 7. Discharging mechanism; 701. Support plate; 702. Bin; 703. Up and down driving assembly; 704. Guide rod; 705. Handle; 706. Limit rod; 707. Block; 708. Bottom plate; 709. Slot; 8. Correction mechanism; 801. Mounting frame; 802. Third lens; 803. Third CCD; 804. Fixing plate; 805. Third light source. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] like Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, a semiconductor thermoelectric material special placement machine described in the present invention includes a frame 1, a connecting mechanism 2 is installed on the frame 1, a driving mechanism 5 is installed on the connecting mechanism 2, a left-side material taking mechanism 3 and a right-side material taking mechanism 4 are installed on the driving mechanism 5, a discharging mechanism 7 is installed on the connecting mechanism 2, a loading mechanism 6 is installed on the connecting mechanism 2, and a correction mechanism 8 is installed on the connecting mechanism 2.

[0024] Specifically, Figure 1 and Figure 2 As shown, the connecting mechanism 2 includes a table panel 204, the table panel 204 is installed inside the frame 1, a cover plate 201 is rotatably connected to one side of the frame 1, a control panel 202 is installed on the cover plate 201, and symmetrically distributed gratings 203 are installed on the table panel 204. The installation of the table panel 204 facilitates the support and installation of other equipment, and the installation of the control panel 202 facilitates the drive control of the equipment. Under the action of the cover plate 201, it is beneficial to shield and protect the frame 1, and facilitates subsequent opening and closing loading and unloading operations. The symmetrical installation of the grating 203 plays a role in safety protection, preventing accidents caused by the intervention of staff when the equipment is working.

[0025] Specifically, Figure 2 and Figure 3 As shown, the driving mechanism 5 includes a left longitudinal driving component 501, and the left longitudinal driving component 501 is installed at one end of the top of the table panel 204, and the right longitudinal driving component 502 is installed at the other end of the top of the table panel 204. The two ends of the left longitudinal driving component 501 and the right longitudinal driving component 502 are connected to the table panel 204 in a transverse sliding manner through a guide rail 505 and a slider 506, and one end of the left longitudinal driving component 501 and the right longitudinal driving component 502 are connected to the table panel 204 through a left transverse driving component 503 and a right transverse driving component 504 respectively. 04 sliding connection, through the installation of the left longitudinal drive component 501 and the right longitudinal drive component 502, it is convenient to control the longitudinal movement of the clamping jaw 304 and the suction nozzle 405, and through the installation of the left lateral drive component 503 and the right lateral drive component 504, it is convenient to control the lateral drive of the left longitudinal drive component 501 and the right longitudinal drive component 502, so as to realize the lateral movement control of the clamping jaw 304 and the suction nozzle 405, which is conducive to the good clamping and adsorption of the product, so as to carry out the patch work, and the operation is more flexible and efficient.

[0026] Specifically, Figure 2 and Figure 4As shown, the left-side material-retrieving mechanism 3 includes a first mounting plate 301, the left-side longitudinal driving assembly 501 is matched with the first mounting plate 301, the first adapter plate 302 is installed on the top of the first mounting plate 301, two first upper and lower slides 303 are installed on one side of the first mounting plate 301, the bottoms of the two first upper and lower slides 303 are respectively installed with clamps 304, one end of the clamps 304 is installed with a flip motor 308, a first CCD 305 is installed on one side of the first mounting plate 301, a first lens 306 is installed at the bottom of the first CCD 305, a first light source 307 is installed at the bottom of the first lens 306, and the first light source 307 and the first lens One side of 306 is detachably connected to the first mounting plate 301. The installation of the first adapter plate 302 facilitates the distribution of line connections. The installation of the first mounting plate 301 facilitates the connection of the first upper and lower slides 303. The operation of the two first upper and lower slides 303 facilitates the drive control of the clamping claws 304 to achieve the clamping of the product. The operation of the flipping motor 308 enables the flipping of the clamped product. The installation of the first mounting plate 301 facilitates the installation of the first CCD305, the first lens 306 and the first light source 307, thereby achieving product positioning for photographing and facilitating the subsequent bonding work with another product.

[0027] Specifically, Figure 2 and Figure 5As shown, the right-side material-retrieving mechanism 4 includes a second mounting plate 401, the right-side longitudinal driving assembly 502 is matched with the second mounting plate 401, the second adapter plate 409 is installed on the top of the second mounting plate 401, two second up-and-down slides 410 are installed on one side of the second mounting plate 401, hollow servo motors 404 are respectively installed on the two second up-and-down slides 410, suction nozzles 405 are respectively installed at the bottom of the two hollow servo motors 404, two vacuum filters 402 are installed on the top of the second mounting plate, two vacuum generators 403 are installed on the outer side of the second mounting plate 401, a second CCD 406 is installed on one side of the second mounting plate 401, a second lens 407 is installed at the bottom of the second CCD 406, and a second lens 407 is installed at the bottom of the second lens 407 A second light source 408 is installed, and one side of the second light source 408 and the second lens 407 are disassembled and detachably connected to the second mounting plate 401. The installation of the second adapter plate 409 facilitates the arrangement of line connections. The installation of the second upper and lower slides 410 facilitates the control of the two hollow servo motors 404. With the cooperation of the hollow servo motors 404, the position control of the two suction nozzles 405 is achieved. With the cooperation of the vacuum generator 403 and the vacuum filter 402, the suction of the product by the suction nozzle 405 is achieved. The installation of the second mounting plate 401 facilitates the installation of the second CCD 406, the second lens 407 and the second light source 408, thereby achieving positioning for photographing the product and facilitating the bonding of the sucked product with another product.

[0028] Specifically, Figure 1 , Figure 2 , Figure 8 , Fig.10 and Fig.11 As shown, the discharge mechanism 7 includes a support plate 701, and the support plate 701 is installed on the table panel 204. Two bottom plates 708 are respectively provided at both ends of the top of the support plate 701, and two groups of the bottom plates 708 are respectively provided with a silo 702. Two upper and lower driving components 703 are respectively installed at both ends of the bottom of the support plate 701. The two groups of the bottom plates 708 are slidably connected with the top of the support plate 701 through the two groups of upper and lower driving components 703. The opposite sides of the silo 702 are provided with a card slot 709. The installation of the support plate 701 facilitates the installation of the two groups of the upper and lower driving components 703. Under the drive of the two upper and lower driving components 703, the movement control of the two groups of the silos 702 is realized, which is convenient for subsequent stacking feeding. With the cooperation of the card slot 709, multiple material trays can be stacked and placed, which is convenient for subsequent loading.

[0029] Specifically, Fig.10 and Fig.11As shown, a handle 705 is installed on the top of the silo 702, two limit rods 706 are installed at the inner center line of the silo 702, and blocks 707 are installed at the four corners of the top of the bottom plate 708, respectively, and the blocks 707 are in contact with the side walls of the silo 702. A plurality of guide rods 704 are slidably connected to the support plate 701, and the top of the guide rod 704 is vertically connected to the bottom of the bottom plate 708. The installation of the handle 705 is conducive to taking the silo 702 and facilitating the loading and unloading of the silo 702. The installation of the limit rod 706 is conducive to the contact and limit of the placed material tray, so that the material tray is placed stably. The installation of the plurality of blocks 707 is conducive to the stable engagement of the silo 702 after placement, which plays a role in positioning. The installation of the plurality of guide rods 704 makes the bottom plate 708 and the support plate 701 slide smoothly and stably, which is conducive to stable loading and unloading.

[0030] Specifically, Figure 2 , Figure 8 and Fig. 9 As shown, the loading mechanism 6 includes a connecting plate 601, and two groups of parallel connecting plates 601 are installed on the table panel 204. The two groups of connecting plates 601 are located on one side of two groups of silos 702. Front and rear driving components 602 are respectively installed on the two groups of connecting plates 601. The front and rear driving components 602 are matched and connected with trays 603. The installation of the connecting plate 601 facilitates the connection of the front and rear driving components 602. Through the operation of the front and rear driving components 602, the tray 603 can enter the silo 702 to take materials, so that the material tray is transported to the specified position, and then automatically returns to the silo 702. Through the operation of the silo 702, the material taking work is carried out.

[0031] Specifically, Figure 2 , Figure 6 and Figure 7 As shown, the correction mechanism 8 includes a fixing plate 804, the table panel 204 is mounted with the fixing plate 804, the fixing plate 804 is located between the two groups of connecting plates 601, the fixing plate 804 is mounted with a mounting frame 801, the mounting frame 801 is mounted with a third light source 805, the mounting frame 801 is mounted with a third lens 802 at the bottom, the mounting frame 801 is mounted with a third CCD803 at the bottom, the third CCD803 is located at the bottom of the third lens 802, and the installation of the fixing plate 804 facilitates the connection of the mounting frame 801, thereby realizing the connection of the third light source 805, and through the cooperation of the third lens 802 and the third CCD803, the bottom of the product can be photographed, which is conducive to identifying the position of the product, thereby correcting the angle of the product, and facilitating the subsequent stable patch work.

[0032] When the present invention is in use, firstly, the installation of the table panel 204 facilitates the support and installation of other equipment, and the installation of the control panel 202 facilitates the drive control of the equipment. Under the action of the cover plate 201, it is convenient to shield and protect the frame 1, and facilitate the subsequent opening and closing loading and unloading operations. The symmetrical installation of the grating 203 plays a role in safety protection, preventing accidents caused by the intervention of the staff when the equipment is working. The installation of the left longitudinal drive component 501 and the right longitudinal drive component 502 facilitates the longitudinal movement control of the clamping claw 304 and the suction nozzle 405. The installation of the left transverse drive component 503 and the right transverse drive component 504 facilitates the transverse drive of the left longitudinal drive component 501 and the right longitudinal drive component 502. Through the dynamic control, the lateral movement control of the clamping claw 304 and the suction nozzle 405 is realized, which is conducive to the good clamping and adsorption of the product, so as to carry out the patch work, and the operation is more flexible and efficient. Through the installation of the first adapter plate 302, it is convenient to connect the line distribution. Through the installation of the first mounting plate 301, it is convenient to connect the first upper and lower slides 303. Through the operation of the two first upper and lower slides 303, it is convenient to drive and control the clamping claw 304 to realize the clamping work of the product. Through the operation of the flip motor 308, the flipping of the clamped product is realized. Through the installation of the first mounting plate 301, it is convenient to install the first CCD305, the first lens 306 and the first light source 307, so as to realize the positioning of the product for photographing, which is conducive to the subsequent bonding work with another product. The installation of the second adapter plate 409 facilitates the arrangement of line connections. The installation of the second up-and-down slide 410 facilitates the control of the two hollow servo motors 404. With the cooperation of the hollow servo motors 404, the position control of the two suction nozzles 405 is realized. With the cooperation of the vacuum generator 403 and the vacuum filter 402, the suction nozzles 405 can suck the product. The installation of the second mounting plate 401 facilitates the installation of the second CCD 406, the second lens 407 and the second light source 408, so as to realize the positioning of the product for photographing, and facilitate the lamination of the sucked product with another product. The installation of the support plate 701 facilitates the installation of the two sets of up-and-down drive components 703. Under the drive of the two up-and-down drive components 703, the suction nozzles 405 can be realized. The two groups of silos 702 are now controlled to move, which is convenient for subsequent stacking and feeding. With the cooperation of the card slot 709, it is convenient to stack and clamp multiple material trays, which is convenient for subsequent loading. The installation of the handle 705 is convenient for taking the silo 702, which is convenient for loading and unloading the silo 702. The installation of the limit rod 706 is conducive to the resistance limit of the placed material tray, so that the material tray is placed stably. The installation of multiple card blocks 707 is conducive to the stable clamping of the silo 702 after placement, which plays a role in positioning. The installation of multiple guide rods 704 makes the bottom plate 708 and the support plate 701 slide smoothly and stably, which is conducive to stable loading and unloading. The installation of the connecting plate 601 is conducive to the connection of the front and rear drive components 602. Through the operation of the front and rear drive components 602,The tray 603 enters the silo 702 to pick up materials, so that the tray is transported to the specified position, and then automatically returns to the silo 702. Through the work of the silo 702, the material picking work is carried out. Through the installation of the fixing plate 804, it is convenient to connect the mounting frame 801, so as to realize the connection with the third light source 805. Through the cooperation of the third lens 802 and the third CCD803, the bottom of the product is photographed, which is convenient for identifying the position of the product, so as to correct the angle of the product, which is convenient for the subsequent stable patch work.

[0033] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0034] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A special chip mounter for semiconductor thermoelectric materials, characterized in that: The invention comprises a frame (1), a connecting mechanism (2) being mounted on the frame (1), a driving mechanism (5) being mounted on the connecting mechanism (2), a left-side material taking mechanism (3) and a right-side material taking mechanism (4) being mounted on the driving mechanism (5), a material discharging mechanism (7) being mounted on the connecting mechanism (2), a material loading mechanism (6) being mounted on the connecting mechanism (2), and a correction mechanism (8) being mounted on the connecting mechanism (2).

2. A semiconductor thermoelectric material dedicated chip mounter according to claim 1, characterized in that: The connection mechanism (2) comprises a table panel (204), the table panel (204) is installed inside the frame (1), a cover plate (201) is rotatably connected to one side of the frame (1), a control panel (202) is installed on the cover plate (201), and symmetrically distributed gratings (203) are installed on the table panel (204).

3. A semiconductor thermoelectric material dedicated chip mounter according to claim 2, characterized in that: The driving mechanism (5) comprises a left longitudinal driving component (501), one end of the top of the table panel (204) being mounted with the left longitudinal driving component (501), and the other end of the top of the table panel (204) being mounted with a right longitudinal driving component (502), both ends of the left longitudinal driving component (501) and the right longitudinal driving component (502) being slidably connected to the table panel (204) via guide rails (505) and sliders (506), and one end of the left longitudinal driving component (501) and the right longitudinal driving component (502) being slidably connected to the table panel (204) via a left transverse driving component (503) and a right transverse driving component (504), respectively.

4. A semiconductor thermoelectric material dedicated chip mounter according to claim 3, characterized in that: The left-side material taking mechanism (3) comprises a first mounting plate (301), the first mounting plate (301) is cooperatively connected to the left-side longitudinal driving assembly (501), a first adapter plate (302) is installed on the top of the first mounting plate (301), two first upper and lower slides (303) are installed on one side of the first mounting plate (301), clamping claws (304) are respectively installed on the bottom of the two first upper and lower slides (303), a flip motor (308) is installed on one end of the clamping claw (304), a first CCD (305) is installed on one side of the first mounting plate (301), a first lens (306) is installed on the bottom of the first CCD (305), a first light source (307) is installed on the bottom of the first lens (306), and the first light source (307) and one side of the first lens (306) are respectively detachably connected to the first mounting plate (301).

5. A semiconductor thermoelectric material dedicated chip mounter according to claim 3, characterized in that: The right-side material taking mechanism (4) comprises a second mounting plate (401), the second mounting plate (401) is cooperatively connected to the right-side longitudinal drive assembly (502), a second adapter plate (409) is installed on the top of the second mounting plate (401), two second up-and-down slides (410) are installed on one side of the second mounting plate (401), hollow servo motors (404) are respectively installed on the two second up-and-down slides (410), suction nozzles (405) are respectively installed on the bottoms of the two hollow servo motors (404), two vacuum filters (402) are installed on the top of the second mounting plate, two vacuum generators (403) are installed on the outside of the second mounting plate (401), a second CCD (406) is installed on one side of the second mounting plate (401), a second lens (407) is installed on the bottom of the second CCD (406), a second light source (408) is installed on the bottom of the second lens (407), and the second light source (408) and one side of the second lens (407) are disassembled and detachably connected to the second mounting plate (401).

6. A semiconductor thermoelectric material dedicated chip mounter according to claim 2, characterized in that: The material discharge mechanism (7) comprises a support plate (701), the support plate (701) being mounted on the table panel (204), two bottom plates (708) being respectively arranged at two ends of the top of the support plate (701), material bins (702) being respectively mounted on the two sets of bottom plates (708), two up-and-down drive assemblies (703) being respectively mounted at two ends of the bottom of the support plate (701), the two sets of bottom plates (708) being slidably connected to the top of the support plate (701) via the two sets of up-and-down drive assemblies (703), and card slots (709) being arranged on opposite sides of the inside of the material bin (702).

7. A semiconductor thermoelectric material dedicated chip mounter according to claim 6, characterized in that: A handle (705) is installed on the top of the silo (702), two limit rods (706) are installed at the center line of the silo (702), and clamping blocks (707) are installed at the four corners of the top of the bottom plate (708), and the clamping blocks (707) are in contact with the side walls of the silo (702). A plurality of guide rods (704) are slidably connected to the support plate (701), and the top of the guide rods (704) is vertically connected to the bottom of the bottom plate (708).

8. A semiconductor thermoelectric material dedicated chip mounter according to claim 6, characterized in that: The loading mechanism (6) comprises a connecting plate (601), and two groups of parallel connecting plates (601) are installed on the table panel (204). The two groups of connecting plates (601) are located on one side of the two groups of silos (702). The two groups of connecting plates (601) are respectively installed with front and rear drive components (602), and the front and rear drive components (602) are matched and connected with a tray (603).

9. A semiconductor thermoelectric material dedicated chip mounter according to claim 8, characterized in that: The correction mechanism (8) comprises a fixing plate (804), the fixing plate (804) being mounted on the table panel (204), the fixing plate (804) being located between the two groups of connecting plates (601), the fixing plate (804) being mounted on a mounting frame (801), the mounting frame (801) being mounted on a third light source (805), the mounting frame (801) being mounted on a third lens (802) at the bottom of the mounting frame (801), the mounting frame (801) being mounted on a third CCD (803), and the third CCD (803) being located at the bottom of the third lens (802).

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