Ultrasonic imaging device

Abstract

The invention provides an ultrasonic imaging device capable of realizing imaging of a target part with good precision in a speed section in an X-axis direction which cannot be realized by a conventional structure. An ultrasonic imaging device (100) irradiates a subject (10) with ultrasonic waves, and images an irradiated section of the ultrasonic waves by means of the transmitted waves of the ultrasonic waves. A first support frame (13) for supporting a first probe holder (12) for supporting a first probe (11) for transmitting ultrasonic waves and a second support frame (23) for supporting a second probe holder (22) for supporting a second probe (21) for receiving transmitted waves are disposed in an X-axis direction indicating a direction in which a subject (10) is scanned, and are driven parallel to the X-axis direction.

Description

Technical Field

[0001] The invention relates to an ultrasonic imaging device. Background Art

[0002] In an ultrasonic imaging device, a probe holder on which a probe is mounted is driven from one end of the subject to the other end in the X-axis direction, and after reaching the other end, it is driven in the Y-axis direction for a certain amount, and then again driven from the other end to one end in the X-axis direction. This process is repeated to scan the entire surface of the subject.

[0003] Patent document 1 discloses that in a transmission-type ultrasonic imaging system, the probe holder is a holder for fixing a first ultrasonic probe part, which can be driven in the ±Z-axis direction via a first Z-axis scanning part, and the L-shaped part is a part for fixing a second ultrasonic probe part, which can be driven in the ±Z-axis direction via a second Z-axis scanning part.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 6397600 ( Figure 3 , paragraph 0050) Summary of the invention

[0007] In order to increase the integration density and cut more integrated circuit chips from one semiconductor wafer, the number of layers of semiconductor wafers is increased and the diameter is enlarged. In order to detect defects in such semiconductor wafers, the method of irradiating ultrasonic waves to the object and obtaining the reflected waves, such as a reflection-type ultrasonic imaging device, reduces the signal strength and makes it difficult to perform high-precision inspection.

[0008] In the ultrasonic imaging device disclosed in Patent Document 1, ultrasonic waves are transmitted from a first ultrasonic probe to a subject, and a transmission signal transmitted from the subject is received by a second ultrasonic probe. Thus, compared with an ultrasonic imaging device using a reflection method, a high-resolution inspection image can be obtained on a desired inspection object plane even when inspecting a subject having a large number of layers.

[0009] Furthermore, in commercially available ultrasonic imaging devices, the diameter of semiconductor wafers has been increased by lengthening the support frame supporting the probe holder to 300 mm. In addition, in order to further improve production efficiency, the market is demanding a reduction in tact time.

[0010] However, in the ultrasonic imaging device of Patent Document 1, since the probe holder is arranged perpendicularly to the X-axis direction and scans in the X-axis direction, vibration occurs when the speed exceeds a certain speed, which affects the accuracy of imaging the target part. Therefore, in the structure in which the probe holder is arranged perpendicularly to the X-axis direction and scans in the X-axis direction, there is a problem that the cycle time reduction that is a market demand cannot be met.

[0011] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an ultrasonic imaging device capable of imaging a target part with high accuracy even in a velocity range in the X-axis direction which cannot be realized with the conventional configuration.

[0012] Technical solutions to solve problems

[0013] In order to achieve the above-mentioned purpose, the ultrasonic imaging device of the present invention repeatedly performs driving actions to irradiate the entire subject with ultrasonic waves, and uses its transmitted waves to image the irradiated part of the ultrasonic waves. In the driving action, the subject is driven from one end to the other end in the X-axis direction, and after reaching the other end and driving a certain amount in the Y-axis direction, it is then driven from the other end to one end in the X-axis direction. The ultrasonic imaging device is characterized in that it includes: a first support frame supporting a first probe holder, wherein the first probe holder holds a first probe for transmitting the ultrasonic waves; a second support frame supporting a second probe holder, wherein the second probe holder holds a second probe for receiving the transmitted waves; a platform for placing the subject; and a probe holder support frame, which is configured in the The encircling frame of the platform in the vertical direction of the platform loading surface, the first probe holder is installed on the probe holder support frame via the first probe holder X-axis guide mechanism, and the second probe holder is installed on the probe holder support frame via the second probe holder X-axis guide mechanism, and the length direction of the first support frame and the length direction of the second support frame are arranged to be parallel to the X-axis direction indicating the direction of scanning the subject placed on the platform, and are driven parallel to the X-axis direction, and the first probe holder is moved in the X-axis direction synchronously with the movement of the first support frame by means of the first probe holder X-axis guide mechanism, and the second probe holder is moved in the X-axis direction synchronously with the movement of the second support frame by means of the second probe holder X-axis guide mechanism. Other aspects of the present invention are described in the embodiments described later.

[0014] Effects of the Invention

[0015] According to the present invention, it is possible to accurately image a target part even in a speed range in the X-axis direction that cannot be realized with a conventional configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a diagram showing the structure of a transmission method ultrasonic imaging apparatus according to this embodiment.

[0017] Figure 2 It is a diagram showing an outline of a scanning unit according to this embodiment.

[0018] Figure 3 It is a front view showing details of the scanning unit of this embodiment.

[0019] Figure 4 It is a diagram showing a driving method of the scanning unit according to this embodiment.

[0020] Figure 5 It is a diagram showing a change in the arrangement direction of the support frame according to the present embodiment.

[0021] Figure 6 It is a diagram showing the driving range in the X-axis direction and the installation position of the reinforcing member in this embodiment.

[0022] Figure 7 It is a figure which shows the detail of the probe holder receiving mechanism of this embodiment.

[0023] Figure 8 It is a diagram showing the driving range in the Z-axis direction according to the present embodiment. DETAILED DESCRIPTION

[0024] The embodiments for carrying out the present invention will be described in detail with reference to the drawings as appropriate.

[0025] Figure 1 1 is a diagram showing a configuration of a transmission-based ultrasonic imaging apparatus 100 according to the present embodiment.

[0026] The ultrasonic imaging device 100 includes a control device 50, a scanning unit 30 (mechanical unit), and ultrasonic probes (a first probe 11, a second probe 21 (reference Figure 3 )). The ultrasonic imaging device 100 is placed on the subject 10 (reference Figure 2 , Figure 3 ) within an inspection range, ultrasonic waves are irradiated via a probe to irradiation points set at predetermined intervals and transmitted waves are obtained, interface echoes representing the waveform of the bonding interface to be inspected are extracted from the transmitted waves, pixelated information is generated based on the signal intensity of the interface echoes for all irradiation points or specific irradiation points, an image of the bonding interface is generated based on the pixelated information of the generated irradiation points, and defects are found.

[0027] The control device 50 includes a processing unit 51 that performs control processing of the scanning position of the ultrasonic probe, control processing of sending and receiving ultrasonic waves, etc., an image generating unit 52 that generates an ultrasonic image by irradiating ultrasonic waves from the first probe 11 and acquiring transmitted waves using the second probe 21, and an input / output unit 53.

[0028] The scanning unit 30 includes a first probe holder 12 holding a first probe 11 and a second probe holder 22 holding a second probe 21 on a platform 39. The first probe holder 12 is controlled by a first control unit 19, and the second probe holder 22 is controlled by a second control unit 29.

[0029] In the ultrasonic imaging device 100, the first probe 11 held by the first probe holder 12 is placed on the subject 10 (refer to Figure 2 , Figure 3 ) moves above the subject 10 and transmits ultrasonic waves, and the second probe 21 held by the second probe holder 22 moves below the subject 10 and receives the transmission waves transmitted from the subject. An image of the ultrasonic irradiated portion is generated based on the received transmission waves. For the ultrasonic imaging device 100, it is required to make the generated image clearer. Therefore, the first probe 11 and the second probe 21 need to suppress vibration as much as possible. This embodiment solves this problem. In addition, Figure 2 In the embodiment, ultrasonic waves are transmitted from the first probe 11 and the second probe 21 receives the transmitted waves, but ultrasonic waves may be transmitted from the second probe 21 and the first probe 11 receives the transmitted waves.

[0030] In this embodiment, as a method for solving the above-mentioned problem, measures are taken with respect to the arrangement and driving direction of the support frame of the probe.

[0031] Figure 2 It is a diagram showing the outline of the scanning unit 30 according to the present embodiment. Figure 3 It is a front view showing details of the scanning unit 30 according to the present embodiment. Figure 4 is a diagram showing a driving method of the scanning unit 30 according to this embodiment. Figure 2 It is omitted Figure 3 FIG. 4 is a diagram of a probe holder support mechanism 47 (eg, a mechanism including a housing 32, a probe holder support bracket 31, etc.) of the first probe holder 12 and the second probe holder 22. In addition, Figure 3 In the embodiment, the foot of the platform 39 is omitted. Figure 3 The probe holder support mechanism 47, reference Figure 7 Described in the following text.

[0032] Figure 2The scanning unit 30 shown is configured to include a first support frame 13 that supports a first probe holder 12 that holds a first probe 11 for transmitting ultrasonic waves, a second support frame 23 that supports a second probe holder 22 that holds a second probe 21 for receiving transmitted waves, a frame support portion 34 to which the first support frame 13 and the second support frame 23 are mounted, and an X-axis drive shaft 41 that drives the frame support portion 34. The first support frame 13 and the second support frame 23 are arranged toward the X-axis direction that indicates the direction in which the subject 10 is scanned. In this state, the frame support portion 34 is driven in the X-axis direction by the X-axis drive shaft 41, so that the first support frame 13 and the second support frame 23 are driven in parallel with the X-axis direction.

[0033] On the outside of the stage 39, a Y-axis drive shaft 42, a first Y-axis guide 44, and a second Y-axis guide 45 are arranged parallel to the Y-axis direction of the stage 39. A mounting table 46 for mounting the X-axis drive shaft 41 is arranged on the Y-axis drive shaft 42, the first Y-axis guide 44, and the second Y-axis guide 45. The X-axis drive shaft 41 that drives the first support frame 13 and the second support frame 23 via the frame support portion 34 is arranged parallel to the X-axis direction. With such a structure, the X-axis drive shaft can be driven parallel to the Y-axis direction through the Y-axis drive shaft.

[0034] Figure 4 yes Figure 3 The top view shows that the first support frame 13 supporting the first probe holder 12 can be driven in the X-axis direction, that is, the second support frame 23 supporting the second probe holder 22 can move in the X-axis direction. In addition, it is shown that the mounting table 46 can move in the Y-axis direction. For details, refer to Figure 7 Described in the following text.

[0035] According to the above structure, the scanning unit 30 can drive the probe holder on which the probe is installed from one end of the subject to the other end in the X-axis direction, and after reaching the other end, drive a certain amount in the Y-axis direction, and then drive from the other end to one end again in the X-axis direction. By repeating this process, the scanning unit 30 can scan the entire surface of the subject.

[0036] In this embodiment, the first aspect is to suppress the vibration when the probe moves, and the first support frame 13 and the second support frame 23 are installed on the frame support part 34 toward the X-axis direction, and the X-axis driving shaft 41 moves, thereby driving the first support frame 13 and the second support frame 23 in the X-axis direction.

[0037] Figure 55 is a diagram showing a change in the arrangement direction of the support frame of the present embodiment. In the conventional type of scanning unit 30, as shown in structure 5A, the support frame of the probe holder is arranged perpendicularly to the X-axis direction, and moves in a manner in which the length direction of the support frame is perpendicular to the X-axis direction. As a result, due to the influence of inertial force, vibration occurs when driven at a speed above a certain speed. Therefore, at a higher speed, the probe holder cannot be moved, and there is a limit to the amount of work per unit time. The influence of inertial force is significant near the two ends in the X-axis direction, that is, when the movement of the probe in the X-axis direction starts or stops. In addition, as described in the subject, in the case of a 300mm semiconductor wafer, the support frame supporting the probe holder is required to be longer than 300mm.

[0038] In this embodiment, as shown in the structure 5B, the support frame is operated so that the longitudinal direction is parallel to the X-axis direction. This can suppress the influence of the inertial force and the occurrence of vibration.

[0039] Furthermore, in order to suppress vibration, the present embodiment has been improved in the following two aspects.

[0040] The first is to set Figure 6 The reinforcing member 35 shown in the figure is used to strengthen the two support frames, and the second is provided with Figure 7 The probe holder support mechanism 47 is shown.

[0041] <Reinforcement member for reinforcing the support frame>

[0042] Figure 6 It is a diagram showing the driving range in the X-axis direction and the installation position of the reinforcing member 35 in this embodiment. Figure 6 In the case of the position state 6A, the left end of the subject 10 in the X-axis direction is covered, and in the case of the position state 6B, the right end of the subject 10 in the X-axis direction is covered. Figure 6 As shown, at least one reinforcing member 35 is provided between the first support frame 13 and the second support frame 23. Specifically, at least one reinforcing member 35 connecting the first support frame 13 and the second support frame 23 is provided at a position where the first probe holder 12 and the second probe holder 22 do not contact the platform 39 when the first probe holder 12 and the second probe holder 22 are driven in the driving range in the X-axis direction.

[0043] <Probe holder support mechanism>

[0044] Figure 7 1 is a diagram showing the details of the probe holder support mechanism 47 of the present embodiment. The probe holder support mechanism 47 is configured to include a probe holder support bracket 31 having a first probe holder X-axis guide mechanism 14 and a second probe holder X-axis guide mechanism 24, and a housing 32 of the same shape as the probe holder support bracket 31, which is larger than the probe holder support bracket 31.

[0045] Specifically, the probe holder support frame 31 is provided as a surrounding frame of the platform 39 arranged in the vertical direction of the platform 39. The probe holder support frame 31 has a rectangular frame structure, and is arranged to surround the platform 39 in the X-axis direction and the Z-axis direction, and the platform 39 is penetrated in the Y-axis direction (refer to Figure 4 ).

[0046] The first probe holder 12 is mounted on the probe holder support frame 31 via the first probe holder X-axis guide mechanism 14 , and similarly, the second probe holder 22 is mounted on the probe holder support frame 31 via the second probe holder X-axis guide mechanism 24 .

[0047] As described above, this embodiment has a structure for suppressing the vibration of the probe holder, that is, the vibration of the probe. The following describes how to perform specific operations of the probe holder, and how to arrange the probe and adjust the focal length under such a structure.

[0048] The first probe holder X-axis guide mechanism 14 and the second probe holder X-axis guide mechanism 24 adopt a general linear guide structure. The linear guide is a mechanical element component that uses a bearing realized by rotational motion to play a role in making a heavy object move linearly easily. In addition, it is not necessary to be limited to this structure.

[0049] The first probe holder 12 moves in the X-axis direction synchronously with the movement of the first support frame 13 by means of the first probe holder X-axis guide mechanism 14, and the second probe holder 22 moves in the X-axis direction synchronously with the movement of the second support frame 23 by means of the second probe holder X-axis guide mechanism 24.

[0050] Next, the arrangement of the first probe 11 and the second probe 21 will be described.

[0051] The first probe 11 and the second probe 21 are Figure 7 As shown in the probe holder support mechanism 47, the center point of the first probe 11 and the center point of the second probe 21 are arranged on the same straight line in the vertical direction. With this structure, the first probe 11 and the second probe 21 move synchronously in the X-axis direction and the Y-axis direction on the basis of adopting a vibration suppression structure.

[0052] Next, adjustment of the focal length of the probe will be described.

[0053] like Figure 7As shown in FIG. 1 , a housing 32 having the same shape as that of the probe holder bracket 31 is provided outside the probe holder bracket 31. The housing 32 is fixed to a stage 46 that is driven only in the Y-axis direction along with the movement of the Y-axis drive shaft together with the X-axis drive shaft 41, and is not driven in the X-axis direction or the Z-axis direction, but is driven only in the Y-axis direction together with the stage 46. When the direction vertically intersecting the stage is defined as the Z-axis direction, the probe holder bracket 31 is attached to the housing 32 via a pair of bracket Z-axis guide mechanisms 36, 36 disposed on both sides of the probe holder bracket 31. In addition, the bracket Z-axis guide mechanism 36 uses the above-mentioned linear guide portion.

[0054] The probe holder support bracket 31 is driven by the movement of the support bracket driving motor 33 installed on the upper part of the probe holder support bracket 31 and the ball screw 37 connected to the support bracket driving motor 33, and moves in the Z-axis direction within the shell 32 through a pair of support bracket Z-axis guide mechanisms 36, 36.

[0055] use Figure 8 The driving range in the Z-axis direction indicates that the probe holder bracket 31 moves, thereby the first probe holder 12 and the second probe holder 22 move in the Z-axis direction.

[0056] Figure 8 It is a diagram showing the driving range in the Z-axis direction according to the present embodiment. Figure 8 In the case of position state 8A, the probe holder bracket 31 is located at the upper side in the Z-axis direction, and in the case of position state 8B, the probe holder bracket 31 is located at the lower side in the Z-axis direction.

[0057] The first probe holder 12 is mounted on the probe holder support frame 31 via the first probe holder X-axis guide mechanism 14. The first probe holder 12 is mounted on the first support frame 13 via the first probe holder Z-axis guide mechanism 15 and moves independently of the first support frame 13 in the Z-axis direction.

[0058] The second probe holder 22 is mounted on the probe holder support frame 31 via the second probe holder X-axis guide mechanism 24. The second probe holder 22 is mounted on the second support frame 23 via the second probe holder Z-axis guide mechanism 25 and moves independently of the second support frame 23 in the Z-axis direction.

[0059] The first probe holder 12 and the second probe holder 22 move in the Z-axis direction in synchronization with the movement of the probe holder bracket 31 in the Z-axis direction. That is, the first probe 11 and the second probe 21 move in synchronization in the Z-axis direction while maintaining the spacing therebetween.

[0060] The amount of movement in the Z-axis direction is adjusted so that the focus is set on the subject for the ultrasonic waves irradiated from the first probe 11. Since the second probe 21 receives only the transmitted waves from the subject, there is no need to particularly set the focus.

[0061] The ultrasonic imaging device 100 according to the present embodiment described above has the following features.

[0062] (1) The ultrasonic imaging device 100 is an ultrasonic imaging device that irradiates an object 10 with ultrasonic waves and images the irradiated portion of the ultrasonic waves using the transmitted waves, wherein a first support frame 13 that supports a first probe holder 12 that holds a first probe 11 for transmitting ultrasonic waves and a second support frame 23 that supports a second probe holder 22 that holds a second probe 21 for receiving transmitted waves are arranged in the X-axis direction that indicates the direction in which the object 10 is scanned, and are driven parallel to the X-axis direction. Thus, it is possible to image the target portion with good accuracy even in a speed range in the X-axis direction that cannot be achieved with a conventional structure.

[0063] (2) The ultrasonic imaging device 100 of (1) above includes a probe holder support frame 31 that is arranged in a vertical direction of the platform 39 and is formed as a surrounding frame of the platform 39. The first probe holder 12 is mounted on the probe holder support frame 31 via the first probe holder X-axis guide mechanism 14, and the second probe holder 22 is mounted on the probe holder support frame 31 via the second probe holder X-axis guide mechanism 24 (see Figure 7 ).

[0064] (3) In the ultrasonic imaging device 100 of (2) above, the first probe holder 12 is moved in the X-axis direction synchronously with the movement of the first support frame 13 by means of the first probe holder X-axis guide mechanism 14, and the second probe holder 22 is moved in the X-axis direction synchronously with the movement of the second support frame 23 by means of the second probe holder X-axis guide mechanism 24 (see Figure 3 , Figure 6 ).

[0065] (4) The ultrasonic imaging device 100 of (2) above has a housing 32 that is larger than the probe holder bracket 31 on the outside of the probe holder bracket 31. When the direction perpendicularly intersecting the platform is defined as the Z-axis direction, the probe holder bracket 31 is mounted on the housing 32 via a pair of bracket Z-axis guide mechanisms 36 disposed on both sides of the probe holder bracket (see FIG. Figure 7 ).

[0066] (5) In the ultrasonic imaging device 100 of (4) above, the probe holder bracket 31 is driven by a bracket driving motor 33 mounted on the probe holder bracket 31 and moves along a pair of bracket Z-axis guide mechanisms 36, 36 in the Z-axis direction within the housing 32 (see Figure 8 ).

[0067] (6) In the ultrasonic imaging device 100 of (5) above, the center point of the first probe 11 and the center point of the second probe 21 are arranged on the same straight line in the vertical direction (refer to Figure 7 ).

[0068] (7) In the ultrasonic imaging device 100 of (6), the first probe holder 12 is mounted on the first support frame 13 via the first probe holder Z-axis guide mechanism 15, and the second probe holder 22 is mounted on the second support frame 23 via the second probe holder Z-axis guide mechanism 25. By means of the first probe holder Z-axis guide mechanism 15 and the second probe holder Z-axis guide mechanism 25, the first probe 11, the second probe 21 and the probe holder support frame 31 are moved in the Z-axis direction synchronously and the spacing distance between the first probe 11 and the second probe 21 is maintained, so as to adjust the focal length of the first probe (see FIG. 1 ). Figure 8 ).

[0069] (8) The ultrasonic imaging device 100 of (1) above has a Y-axis driving shaft 42 disposed on the outer side of the platform 39 in parallel with the Y-axis direction of the platform 39, and an X-axis driving shaft 41 disposed in parallel with the X-axis direction for driving the first support frame 13 and the second support frame 23 via the frame support portion 34, and the X-axis driving shaft 41 is driven in parallel with the Y-axis direction by means of the Y-axis driving shaft 42 (see Figure 3 , Figure 4 ).

[0070] (9) The ultrasonic imaging device 100 of (1) above has at least one reinforcing member 35 connecting the first support frame 13 and the second support frame 23, and the reinforcing member 35 is arranged at a position where the reinforcing member 35 does not contact the platform 39 when the first probe holder 12 and the second probe holder 22 are driven within the driving range in the X-axis direction (see Figure 6 ).

[0071] In addition, the present invention is not limited to the above-mentioned embodiments, and includes various modified examples. In addition, the above-mentioned embodiments are described in detail to explain the present invention in an easy-to-understand manner, and are not limited to all structures that must be described. In addition, for a part of the structure of each embodiment, other structures can be added, deleted, or replaced.

[0072] Description of Reference Numerals

[0073] 10 Subjects

[0074] 11 First Probe

[0075] 12 First probe holder

[0076] 13. First support frame

[0077] 14 First probe holder X-axis guide mechanism

[0078] 15 First probe holder Z-axis guide mechanism

[0079] 19 First Control Unit

[0080] 21 Second Probe

[0081] 22 Second probe holder

[0082] 23 Second support frame

[0083] 24 Second probe holder X-axis guide mechanism

[0084] 25 Second probe holder Z-axis guide mechanism

[0085] 29 Second Control Unit

[0086] 30 Scanning Department

[0087] 31 Probe holder bracket

[0088] 32 Shell

[0089] 33 Bracket drive motor

[0090] 34 rack support

[0091] 35 Reinforcement components

[0092] 36 bracket Z-axis guide mechanism

[0093] 37 Ball Screw

[0094] 39 Platforms

[0095] 41 X-axis drive shaft

[0096] 42 Y-axis drive shaft

[0097] 44 first Y-axis guide

[0098] 45 second Y-axis guide

[0099] 46 Loading table

[0100] 47 Probe holder support mechanism

[0101] 50 Control device

[0102] 51 Processing Department

[0103] 52 Image generation unit

[0104] 53 Input and output section

[0105] 100 Ultrasonic imaging device.

Claims

1. An ultrasonic imaging device, which repeatedly performs a driving action to irradiate the entire subject with ultrasonic waves, and uses the transmitted waves to image the irradiated part of the ultrasonic waves, wherein in the driving action, the subject is driven from one end to the other end in the X-axis direction, and after reaching the other end and driving a certain amount in the Y-axis direction, it is then driven from the other end to one end in the X-axis direction. The ultrasonic imaging device is characterized by comprising: a first support frame supporting a first probe holder, wherein the first probe holder holds a first probe for transmitting the ultrasonic wave; a second support frame supporting a second probe holder, wherein the second probe holder holds a second probe for receiving the transmitted wave; a platform for placing the subject; and a probe holder bracket, which is arranged as a surrounding frame of the platform in a vertical direction of the mounting surface of the platform, The first probe holder is mounted on the probe holder support frame via a first probe holder X-axis guide mechanism, and the second probe holder is mounted on the probe holder support frame via a second probe holder X-axis guide mechanism, The first support frame and the second support frame are arranged so that the longitudinal direction thereof is parallel to an X-axis direction indicating a direction in which the subject placed on the platform is scanned, and are driven in parallel to the X-axis direction, and The first probe holder moves in the X-axis direction synchronously with the movement of the first support frame by means of the first probe holder X-axis guide mechanism, The second probe holder moves in the X-axis direction in synchronization with the movement of the second support frame by means of the second probe holder X-axis guide mechanism.

2. The ultrasonic imaging device according to claim 1, wherein: A housing having a shape larger than the probe holder bracket is provided on the outer side of the probe holder bracket, When a direction vertically intersecting the stage is defined as a Z-axis direction, the probe holder bracket is attached to the housing via a pair of bracket Z-axis guide mechanisms disposed on both sides of the probe holder bracket.

3. The ultrasonic imaging device according to claim 2, wherein: The probe holder bracket is moved in the Z-axis direction within the housing along the pair of bracket Z-axis guide mechanisms by a driving force applied from a bracket driving motor attached to the probe holder bracket.

4. The ultrasonic imaging device according to claim 3, wherein: The center point of the first probe and the center point of the second probe are arranged on the same straight line in the vertical direction.

5. The ultrasonic imaging device according to claim 4, wherein: The first probe holder is mounted on the first support frame via a first probe holder Z-axis guide mechanism, and the second probe holder is mounted on the second support frame via a second probe holder Z-axis guide mechanism. By means of the Z-axis guiding mechanism of the first probe holder and the Z-axis guiding mechanism of the second probe holder, the first probe and the second probe are moved in the Z-axis direction synchronously with the movement of the probe holder support frame and the spacing distance between the first probe and the second probe is maintained, so as to adjust the focal length of the first probe.

6. The ultrasonic imaging device according to claim 1, wherein: A Y-axis driving shaft is arranged on the outer side of the platform in parallel with the Y-axis direction of the platform. An X-axis driving shaft is arranged parallel to the X-axis direction to drive the first support frame and the second support frame via a frame supporting portion, The X-axis driving shaft is driven in parallel with the Y-axis direction by means of the Y-axis driving shaft.

7. The ultrasonic imaging device according to claim 1, wherein: The ultrasonic imaging device has at least one reinforcing component connecting the first support frame and the second support frame, and the reinforcing component is arranged at a position where the reinforcing component does not contact the platform when the first probe holder and the second probe holder are driven within the driving range of the X-axis direction.

Images