A fully automatic chip screening and testing machine

Abstract

The present invention discloses a fully automatic chip screening and testing machine, which is fully automatic in feeding and comprehensively testing the chips to ensure the stable and reliable quality of the screened chips. The machine comprises: a frame, which comprises a work surface and a top bracket, the work surface of the frame is provided with a wafer buffer and grading module, and a chip detection component, the top bracket is provided with a first wafer handling module and a second wafer handling module; and an automatic loading and multi-box buffering transmission rack for wafer cassettes, which comprises a stacked cassette placement rack and a cassette transfer mechanism, the top LP platform of the cassette placement rack is used to dock with a crane and place cassettes or allow the crane to take away cassettes, at least one layer of the cassette placement rack is a wafer pick-and-place station, at least one layer of the cassette placement rack is a cassette buffer zone, and the cassette transfer mechanism is used to transfer cassettes at various positions.

Description

Technical Field

[0001] The present invention relates to the technical field of chip screening, and in particular to a fully automatic chip screening and testing machine. Background Art

[0002] Currently, chip screening machines are semi-automatic, requiring manual loading and unloading of wafers and cassettes. This wastes labor, results in low equipment utilization, and lacks comprehensive chip inspection capabilities. This can lead to defective products being passed off as good, impacting product quality. Therefore, there is an urgent need to develop fully automated screening and inspection machines to ensure the quality of the chips after screening. Summary of the Invention

[0003] In response to the above problems, the present invention provides a fully automatic chip screening and testing machine, which automatically feeds materials and performs comprehensive testing on chips to ensure that the quality of the screened chips is stable and reliable.

[0004] A fully automatic chip screening and testing machine, characterized in that it comprises:

[0005] The rack includes a work surface and a top bracket. The work surface of the rack is provided with a wafer buffer and binning module and a chip detection component. The top bracket is provided with a first wafer handling module and a second wafer handling module.

[0006] And the automatic loading of wafer cassettes and multi-cassette buffer transfer rack, which includes stacked cassette placement racks and cassette transfer mechanisms. The top LP platform of the cassette placement rack is used to dock with a crane and place cassettes or allow the crane to take away cassettes. At least one layer of the cassette placement rack is a wafer pick-and-place station, and at least one layer of the cassette placement rack is a cassette buffer. The cassette transfer mechanism is used to transfer cassettes at various positions.

[0007] The automatic loading and multi-box buffer transfer frame of the wafer material box is arranged at the periphery of one end of the automatic loading and multi-box buffer transfer frame in the length direction of the wafer material box, the wafer buffer and binning module is arranged at a position of the work surface close to the automatic loading and multi-box buffer transfer frame of the wafer material box, and the chip detection component is arranged at a position of the work surface away from the automatic loading and multi-box buffer transfer frame of the wafer material box;

[0008] The wafer buffer and binning module is provided with multiple groups of material boxes, and the multiple groups of material boxes of the wafer buffer and binning module are divided into a wafer to be inspected buffer area, an NG buffer area, an empty film wafer area, and a full wafer placement area;

[0009] The chip inspection component includes a wafer inspection rack, a wafer chip placement rack, a rotary inspection machine, and a chip pick-and-place module. The wafer chip placement rack is provided with a good product placement rack and an NG product placement rack. The rotary inspection machine is provided with a feed wafer visual positioning and inspection mechanism, and an outfeed wafer and visual inspection mechanism. The chip pick-and-place module places the chips removed from the wafer inspection rack on the rotary inspection machine for multi-station inspection. The qualified chips are mounted on the good wafers on the good product placement rack by the chip pick-and-place module, and the NG chips are mounted on the NG wafers on the NG product placement rack by the chip pick-and-place module.

[0010] The first wafer handling module transfers the wafers in the magazine at the wafer pick-and-place station to the magazine in the wafer buffer area to be inspected, and at the same time transfers the wafers in the magazines in the NG buffer area and the full wafer placement area to the receiving magazine at the wafer pick-and-place station;

[0011] The second wafer transport module transfers the wafers in the material box in the wafer buffer area to the wafer inspection placement rack, transfers the wafers with chips removed from the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area.

[0012] It is further characterized by:

[0013] The magazine placement rack includes multi-layer magazine areas on both sides and a magazine transport mechanism in the middle. The magazine transport mechanism includes a lifting mechanism, a translation mechanism on both sides, and a magazine clamping cylinder. The magazine transport mechanism reasonably distributes the magazines to the corresponding positions to ensure the operations of placing and receiving magazines and delivering and receiving wafers by the overhead crane.

[0014] The first wafer handling module includes a first XYZ three-axis drive module and a horizontal and vertical flip clamping mechanism. The horizontal and vertical flip clamping mechanism includes a flip motor with 90° horizontal and vertical flipping and a clamping cylinder assembly. When the flip motor drives the clamping cylinder assembly to be set horizontally, it is used to place or remove wafers from the wafer pick-and-place station. When the flip motor drives the clamping cylinder assembly to be set vertically, it is used to place or remove wafers from the corresponding material box of the wafer buffer and binning module, which ensures smooth and reliable operation of the entire structure.

[0015] A buffer support suction cup is provided at the bottom of the output end of the first wafer transport module, and the buffer support suction cup ensures that the vertical position of the wafer is stable and reliable when the clamping cylinder assembly is in a vertical state;

[0016] The rotary inspection machine is equipped with a feed wafer visual positioning and inspection mechanism, an outfeed wafer and visual inspection mechanism, a chip correction visual station, and at least two sets of chip visual inspection stations. The rotary inspection machine is used for six-sided chip inspection and IR inspection. The chip visual inspection station is equipped with an AOI / IR integrated camera, which integrates visible light inspection and infrared penetration inspection. It can identify the appearance defects and internal hidden defects of the chip, and through the four-sided prism design, it can realize the inspection of 5 sides of the chip through 1 camera. Therefore, two sets of chip visual inspection stations can realize the inspection of all sides of the chip, saving 4 cameras, greatly reducing the space and cost occupied by the inspection module.

[0017] The chip detection component also includes a nozzle detection visual station corresponding to the chip pick-and-place module and a nozzle wiping mechanism, which cleans and detects the nozzle without affecting production efficiency, effectively preventing the nozzle from contaminating and damaging the chip;

[0018] A wafer correction platform is also provided on the upper front end of the material box placement rack. The first wafer handling module takes the wafer out of the material box at the wafer pick-up and placement station and places it on the wafer correction platform for correction. Afterwards, the clamping claws of the clamping cylinder assembly take away the corrected wafer to ensure that the position of the wafer is stable and reliable.

[0019] After adopting the structure of the present invention, the overhead crane delivers the material to the top LP platform of the cassette placement rack, and the cassette transfer mechanism transports it to the wafer pick-up and placement station. The excess cassettes can be temporarily stored in the cassette buffer. After the wafer pick-up and placement station is vacant, the cassettes in the cassette buffer are transported to the wafer pick-up and placement station; the first wafer transport module takes the incoming wafers from the cassette at the wafer pick-up and placement station and puts them into the cassette in the wafer buffer area to be inspected, and then the second wafer transport module takes and places the incoming wafers between the wafer buffer area to be inspected and the wafer inspection placement rack; the chips are placed one by one on the rotary inspection machine for screening through the chip pick-up and placement module, and the qualified chips are mounted on the good wafers on the good placement rack, and the NG chips are mounted on the N For the NG wafers on the G product placement rack, the second wafer transport module transfers the wafers with chips removed from the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area; the first transport module then transfers the full wafers in the full wafer placement area and the NG buffer area to the wafer pick-and-place station, and the material box transport mechanism transports the corresponding qualified material boxes and NG material boxes to the top-level LP platform, which are pulled away by the overhead crane; it automatically feeds materials and inspects the chip ring surface to ensure the stable and reliable quality of the screened chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the wafer routing process of the present invention;

[0022] Figure 3 Schematic diagram of the arrangement of the material box placement rack of the present invention (the arrow in the figure indicates the transfer movement direction of the material box transfer mechanism);

[0023] Figure 4 It is a partial enlarged structural schematic diagram of the present invention;

[0024] Figure 5 This is a partially enlarged schematic diagram of the output end of the first transport module of the present invention;

[0025] Figure 6 Schematic diagram of the top view of the chip detection assembly of the present invention;

[0026] The names corresponding to the serial numbers in the figure are as follows:

[0027] Rack 100, automatic loading of wafer cassettes and multi-cassette buffer transfer rack 200;

[0028] Work surface 10, top support 20, wafer buffer and grading module 30, wafer buffer area for inspection 301, NG buffer area 302, empty film wafer area 303, full wafer placement area 304, chip detection component 40, first wafer handling module 50, first XYZ three-axis drive module 51, horizontal and vertical flip clamping mechanism 52, flip motor 53, clamping cylinder assembly 54, buffer support suction cup 55, second wafer handling module 60, material box placement rack 70, top LP platform 71, wafer pick-and-place station 72, material box buffer area 73 , wafer correction platform 74, material box transfer mechanism 80, lifting mechanism 81, translation mechanism 82, material box clamping cylinder 83, wafer inspection placement rack 90, wafer chip placement rack 110, good product placement rack 111, NG product placement rack 112, rotary inspection machine 120, feeding wafer visual positioning and inspection mechanism 121, discharging wafer and visual inspection mechanism 122, chip correction visual station 123, chip visual inspection station 124, nozzle inspection visual station 125, nozzle wiping mechanism 126, chip pick-and-place module 130. DETAILED DESCRIPTION

[0029] A fully automatic chip screening and testing machine, see Figures 1-6 , which includes:

[0030] The rack 100 includes a work surface 10 and a top support 20. The work surface of the rack 100 is provided with a wafer buffer and binning module 30 and a chip detection component 40. The top support 20 is provided with a first wafer handling module 50 and a second wafer handling module 60.

[0031] and an automatic loading and multi-box buffering and transporting rack 200 for wafer cassettes, which includes stacked cassette placement racks 70 and a cassette transfer mechanism 80. The top LP platform 71 of the cassette placement rack 70 is used to dock with a crane and place cassettes or allow the crane to take away cassettes. At least one layer of the cassette placement rack 70 is a wafer pick-and-place station 72, and at least one layer of the cassette placement rack 70 is a cassette buffer 73. The cassette transfer mechanism 80 is used to transfer cassettes at various positions.

[0032] The automatic loading and multi-box buffer transfer rack 200 for wafer cassettes is arranged at the periphery of one end in the longitudinal direction of the frame 100. A wafer buffer and binning module 30 is arranged at a position of the work surface 10 close to the automatic loading and multi-box buffer transfer rack 200 for wafer cassettes. A chip detection component 40 is arranged at a position of the work surface 10 away from the automatic loading and multi-box buffer transfer rack 200 for wafer cassettes.

[0033] The wafer buffer and binning module 30 is provided with multiple groups of magazines, which are divided into a wafer to be inspected buffer area 301, an NG buffer area 302, an empty film wafer area 303, and a full wafer placement area 304;

[0034] The chip inspection assembly 40 includes a wafer inspection rack 90, a wafer chip placement rack 110, a rotary inspection machine 120, and a chip pick-and-place module 130. The wafer chip placement rack 110 is provided with a good product placement rack 111 and an NG product placement rack 112. The rotary inspection machine 120 is provided with an infeed wafer visual positioning and inspection mechanism 121 and an outfeed wafer and visual inspection mechanism 122. The chip pick-and-place module 130 places the chips removed from the wafer inspection rack 90 on the rotary inspection machine 120 for multi-station inspection. The qualified chips are mounted on the good wafers on the good product placement rack 111 by the chip pick-and-place module 130, and the NG chips are mounted on the NG wafers on the NG product placement rack 112 by the chip pick-and-place module 130.

[0035] The first wafer handling module 50 transfers the wafers in the magazine at the wafer handling station 72 to the magazine in the wafer buffer area 301 to be inspected, and at the same time transfers the wafers in the magazines in the NG buffer area 302 and the full wafer placement area 304 to the receiving magazine at the wafer handling station 72;

[0036] The second wafer transport module 60 transfers the wafers in the material box of the wafer to be inspected buffer area 301 to the wafer inspection placement rack 90, transfers the wafers with chips removed from the wafer inspection placement rack 90 to the empty film wafer area 303, transfers the wafers in the empty film wafer area 303 to the wafer chip placement rack 110, transfers the good wafers with chips attached on the wafer chip placement rack 110 to the full wafer placement area 304, and transfers the NG wafers with NG chips attached on the wafer chip placement rack 110 to the material box of the NG buffer area 302.

[0037] In a specific embodiment, the magazine rack 70 includes multi-layered magazine areas on both sides and a magazine transport mechanism 80 in the middle. The magazine transport mechanism 80 includes a lifting mechanism 81, translation mechanisms 82 on both sides, and a magazine clamping cylinder 83. The magazine transport mechanism 80 reasonably distributes the magazines to the corresponding positions to ensure the operations of placing and receiving magazines and delivering wafers to and from the overhead crane.

[0038] The first wafer handling module 50 includes a first XYZ three-axis drive module 51 and a horizontal and vertical flip clamping mechanism 52. The horizontal and vertical flip clamping mechanism 52 includes a flip motor 53 with 90° horizontal and vertical flipping and a clamping cylinder assembly 54. When the flip motor 53 drives the clamping cylinder assembly 54 to be set horizontally, it is used to place or remove wafers from the wafer placement station 72. When the flip motor 53 drives the clamping cylinder assembly 54 to be set vertically, it is used to place or remove wafers from the corresponding material box of the wafer buffer and binning module 30, which ensures smooth and reliable operation of the entire structure.

[0039] A buffer support suction cup 55 is provided at the bottom of the output end of the first wafer transport module 50. The buffer support suction cup 55 ensures that the vertical position of the wafer is stable and reliable when the clamping cylinder assembly 54 is in a vertical state.

[0040] The rotating inspection machine 120 is provided with an infeed wafer visual positioning and inspection mechanism 121, an outfeed wafer and visual inspection mechanism 122, a chip correction visual station 123, and at least two sets of chip visual inspection stations 124. The rotating inspection machine 120 is used for six-sided chip inspection and IR inspection. The chip visual inspection station 124 is provided with an AOI / IR integrated camera, which integrates visible light inspection and infrared penetration inspection. It can identify the appearance defects and internal hidden defects of the chip, and through the four-sided prism design, it can realize the inspection of five sides of the chip through one camera. Therefore, two sets of chip visual inspection stations can realize the inspection of all sides of the chip, saving four cameras and greatly reducing the space and cost occupied by the inspection module.

[0041] The chip inspection assembly 40 also includes a nozzle inspection visual station 125 corresponding to the chip pick-and-place module 130 and a nozzle wiping mechanism 126, which cleans and inspects the nozzles without affecting production efficiency, effectively preventing nozzle contamination and chip damage.

[0042] A wafer correction platform 74 is also provided at the upper front end of the material box placement rack 70. The first wafer transport module 50 takes the wafer out of the material box at the wafer pick-up and placement station 72 and places it on the wafer correction platform 74 for correction. Afterwards, the clamping claws of the clamping cylinder assembly 54 take away the corrected wafer to ensure that the position of the wafer is stable and reliable.

[0043] Its working principle is as follows: the overhead crane delivers the material to the top LP platform of the cassette placement rack, and the cassette transfer mechanism transports it to the wafer pick-and-place station. The excess cassettes can be temporarily stored in the cassette buffer. After the wafer pick-and-place station is vacant, the cassettes in the cassette buffer will be transported to the wafer pick-and-place station; the first wafer transport module takes the incoming material from the cassette at the wafer pick-and-place station and puts it into the cassette in the wafer inspection buffer area, and then the second wafer transport module takes and places the incoming wafer between the wafer inspection buffer area and the wafer inspection placement rack; the chips are placed one by one on the rotary inspection machine for screening through the chip pick-and-place module, and the qualified chips are mounted on the good wafers on the good placement rack, and the NG chips are mounted on the NG The NG wafers on the wafer inspection rack, the second wafer handling module transfers the wafers with chips removed on the wafer inspection rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area; the first handling module then transfers the full wafers in the full wafer placement area and the NG buffer area to the wafer pick and place station, and the material box transfer mechanism transports the corresponding qualified material boxes and NG material boxes to the top-level LP platform, which are pulled away by the overhead crane; it automatically feeds materials and inspects the chip ring surface to ensure the stable and reliable quality of the screened chips.

[0044] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0045] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A fully automatic chip screening and testing machine, characterized in that: It includes: The rack includes a work surface and a top bracket. The work surface of the rack is provided with a wafer buffer and binning module and a chip detection component. The top bracket is provided with a first wafer handling module and a second wafer handling module. And the automatic loading of wafer cassettes and multi-cassette buffer transfer rack, which includes stacked cassette placement racks and cassette transfer mechanisms. The top LP platform of the cassette placement rack is used to dock with a crane and place cassettes or allow the crane to take away cassettes. At least one layer of the cassette placement rack is a wafer pick-and-place station, and at least one layer of the cassette placement rack is a cassette buffer. The cassette transfer mechanism is used to transfer cassettes at various positions. The automatic loading and multi-box buffer transfer frame of the wafer material box is arranged at the periphery of one end of the automatic loading and multi-box buffer transfer frame in the length direction of the wafer material box, the wafer buffer and binning module is arranged at a position of the work surface close to the automatic loading and multi-box buffer transfer frame of the wafer material box, and the chip detection component is arranged at a position of the work surface away from the automatic loading and multi-box buffer transfer frame of the wafer material box; The wafer buffer and binning module is provided with multiple groups of material boxes, and the multiple groups of material boxes of the wafer buffer and binning module are divided into a wafer to be inspected buffer area, an NG buffer area, an empty film wafer area, and a full wafer placement area; The chip inspection component includes a wafer inspection rack, a wafer chip placement rack, a rotary inspection machine, and a chip pick-and-place module. The wafer chip placement rack is provided with a good product placement rack and an NG product placement rack. The rotary inspection machine is provided with a feed wafer visual positioning and inspection mechanism, and an outfeed wafer and visual inspection mechanism. The chip pick-and-place module places the chips removed from the wafer inspection rack on the rotary inspection machine for multi-station inspection. The qualified chips are mounted on the good wafers on the good product placement rack by the chip pick-and-place module, and the NG chips are mounted on the NG wafers on the NG product placement rack by the chip pick-and-place module. The first wafer handling module transfers the wafers in the magazine at the wafer pick-and-place station to the magazine in the wafer buffer area to be inspected, and at the same time transfers the wafers in the magazines in the NG buffer area and the full wafer placement area to the receiving magazine at the wafer pick-and-place station; The second wafer transport module transfers the wafers in the material box in the wafer buffer area to the wafer inspection placement rack, transfers the wafers with chips removed from the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area.

2. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The material box placement rack includes multi-layer material rack areas on both sides and a material box conveying mechanism in the middle position. The material box conveying mechanism includes a lifting mechanism, a translation mechanism on both sides, and a material box clamping cylinder. The material box conveying mechanism reasonably distributes the material boxes to the corresponding positions to ensure the operations of placing material boxes, receiving material boxes, and sending and receiving wafers by the overhead crane.

3. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The first wafer transport module includes a first XYZ three-axis drive module and a horizontal and vertical flipping clamping mechanism. The horizontal and vertical flipping clamping mechanism includes a flipping motor with 90° horizontal and vertical flipping and a clamping cylinder assembly. When the flipping motor drives the clamping cylinder assembly to be set horizontally, it is used to place or remove the wafer from the wafer placement station. When the flipping motor drives the clamping cylinder assembly to be set vertically, it is used to place or remove the wafer from the corresponding material box of the wafer cache and grading module.

4. The fully automatic chip screening and testing machine according to claim 3, characterized in that: A buffer support suction cup is provided at the bottom of the output end of the first wafer transport module.

5. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The rotating inspection machine is equipped with a feeding wafer visual positioning and inspection mechanism, an outgoing wafer and visual inspection mechanism, a chip correction visual station, and at least two groups of chip visual inspection stations. The rotating inspection machine is used for six-sided chip inspection and IR inspection, and the chip visual inspection station is equipped with an AOI / IR integrated camera.

6. The fully automatic chip screening and testing machine according to claim 5, characterized in that: The chip detection component also includes a nozzle detection visual station and a nozzle wiping mechanism corresponding to the chip pick-and-place module.

7. The fully automatic chip screening and testing machine according to claim 1, characterized in that: A wafer correction platform is also provided on the upper front end of the material box placement rack. The first wafer transport module takes the wafer out of the material box at the wafer pick-up and placement station and places it on the wafer correction platform for correction. Then the clamping claw of the clamping cylinder assembly takes away the corrected wafer.

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