A laser beam pose debugging method of a reflective double-pivot laser device

Abstract

The application discloses a laser beam pose debugging method of a reflective double-pivot laser device, and solves the problems of a complicated process, low efficiency, difficult operation and high adjustment cost of an existing laser beam pose debugging method. The application adds an indicating laser source or an imaging component on hardware, forms impact spots on a positioning plate by rotating a double-pivot C shaft four times, observes the relative positions of the impact spots, judges the tilt direction of the processing laser, adjusts a fine adjustment screw of the reflective double-pivot laser device, and thus the debugging is completed. The method is simple to operate, does not need to disassemble the double-pivot, does not need to transform the existing laser processing device, greatly improves the adjustment efficiency, saves time cost, and is suitable for various laser processing devices.

Description

Technical Field

[0001] This invention relates to a laser precision adjustment method, specifically to a laser beam pose adjustment method for a reflective double-axis laser device. Background Technology

[0002] Large components such as the engine casing are crucial support and load-bearing parts of aero engines, requiring extremely high strength, rigidity, and reliability. With the development of the aviation industry, aero engine casings are continuously evolving towards thinner walls, integral construction, and greater complexity, significantly increasing manufacturing difficulty.

[0003] Large components of aero-engines are weight-reduced using a combination of laser engraving and chemical milling. Laser processing offers advantages such as a small heat-affected zone, no limitations imposed by material mechanical properties, no tool wear, and no processing stress, making it widely used for machining hard and brittle materials, difficult-to-machine metals, and thin-walled parts. Laser engraving technology has become a major method for lightweight manufacturing of large, thin-walled components such as engine casings, with the dual-axis laser processing head being a core component. For processing equipment, the dual-axis refers to the two rotating axes at the processing head. See Chinese invention patent CN109352192B, "A Multi-Level Anti-Collision System for a Dual-Axis Laser Processing Head." The dual-axis typically includes an A-axis and a C-axis, arranged orthogonally to achieve multi-angle processing. For reflective dual-axis laser equipment, the laser beam's pose determines the spatial positioning accuracy of the laser focal point after passing through the dual-axis, directly affecting the machining accuracy of the part.

[0004] like Figure 1 As shown, the reflective double-axis laser device includes a laser source 1, an optical four-dimensional adjustment system 2 installed on the optical path of the laser source 1, a double-axis mounted on the active end of the optical four-dimensional adjustment system 2, and a focusing mirror 5 set at the exit end of the double-axis. The double-axis includes a C-axis 3 and an A-axis 4, with the rotation directions of the C-axis 3 and A-axis 4 perpendicular to each other. The C-axis 3 is installed between the A-axis 4 and the optical four-dimensional adjustment system 2. When the C-axis 3 rotates, it causes the laser beam to oscillate in the XY plane of the coordinate system. When the A-axis 4 rotates, it causes the laser beam to oscillate in the YZ plane of the coordinate system. The mounting end face of the double-axis is parallel to the XY plane of the machine tool. The laser beam enters the C-axis 3 and A-axis 4 sequentially through the optical four-dimensional adjustment system 2. The optical four-dimensional adjustment system 1 is equipped with a first fine-tuning screw 6 and a second fine-tuning screw 9, as well as corresponding translation mechanisms, which are used to adjust the angles of the internal reflectors in the α and β directions or the degrees of freedom in two directions in the XYZ space, thereby adjusting the position and attitude of the laser beam.

[0005] It can be seen that the direction of the laser beam is parallel to the rotation axis of the C-axis 3, and adjusting the C-axis is a key step for adjusting the direction of the laser beam in the device. However, in the prior art, the adjustment of the pointing accuracy of the laser beam of the reflective double-pendulum-axis laser device needs to disassemble the double-pendulum-axis, move the machining machine along the Z-axis multiple times, impact a plurality of millimeter spots on the acrylic plate at each time of movement, and then make the laser beam parallel to the Z-axis of the machining machine through the plurality of millimeter spots, or rely on high-precision laser beam quality analyzers and other instruments, resulting in high cost of adjusting the direction of the laser beam, and the adjustment process is complicated, low in efficiency, and difficult to operate. SUMMARY

[0006] In order to solve the technical problems of the prior laser beam pose adjustment method, which is complicated, low in efficiency, difficult to operate, and high in cost, the present application provides a laser beam pose adjustment method for a reflective double-pendulum-axis laser device.

[0007] The technical scheme adopted by the present application is as follows:

[0008] A laser beam pose adjustment method for a reflective double-pendulum-axis laser device, characterized in that it comprises the following steps:

[0009] Step 1: A positioning plate is fixedly arranged on the working platform of the machining machine, so that the positioning plate is parallel to the working platform;

[0010] Step 2: The reflective double-pendulum-axis laser device is adjusted so that the machining laser focal point emitted by the laser source is on the surface of the positioning plate, and the C-axis is at zero position, so that the rotation axis of the A-axis is parallel to the X-axis of the coordinate system of the machining machine;

[0011] Step 3: The reflective double-pendulum-axis laser device is started, and the machining laser forms an impact spot P0 on the positioning plate;

[0012] Step 4: An indicating laser source or an imaging assembly is arranged above the positioning plate on the side of the machining laser, so that the indicating laser emitted by the indicating laser source or the mark point on the imaging surface is indicated on the impact spot P0 position on the positioning plate;

[0013] Step 5: The C-axis is rotated by 90°, 180°, and 270° in turn, and after each rotation, the machining machine is moved so that the mark point on the indicating laser or the imaging surface is indicated again on the impact spot P0 position, and then the machining laser forms impact spots P 90 , P 180 , P 270 on the positioning plate respectively;

[0014] Step 6: A first connecting line between the impact spots P0 and P 180 , and a second connecting line between the impact spots P 90 and P 270a second connecting line between the impact spots P0 and P 90 , a third connecting line between the impact spots P 180 and P 270 , a fourth connecting line between the impact spots P 90 and P 180 , a fifth connecting line between the impact spots P 270 and P 180 , and a sixth connecting line between the impact spots P 90 and P 270 , obtaining an intersection I of the first connecting line and the second connecting line, obtaining a distance Δd1 between a midpoint I1 of the first connecting line and the intersection I, and obtaining a distance Δd2 between a midpoint I2 of the second connecting line and the intersection I.

[0015] Step 7, calculating an angle θ1≈tan -1 (Δd1 / f) between the machining laser and the C-axis rotation axis, and calculating an angle θ2≈tan -1 (Δd2 / f) between the machining laser and the A-axis rotation axis, where f is a focal length of a focusing mirror in the reflective double-gimbal laser device.

[0016] Step 8, adjusting the pose of the machining laser based on the angle θ1 and the angle θ2.

[0017] Step 9, replacing the positioning plate, making the replaced positioning plate parallel to the work platform, and repeating steps 3 to 8 until the midpoint I1 of the first connecting line and the midpoint I2 of the second connecting line reach a preset coincidence degree, thereby completing the laser beam pose adjustment of the reflective double-gimbal laser device.

[0018] Further, step 8 specifically includes:

[0019] 8.1) obtaining an adjustment angle A1 and A2 of the machining laser when the first fine adjustment screw and the second fine adjustment screw in the reflective double-gimbal laser device each rotate one circle;

[0020] 8.2) calculating a number n1 of circles that the first fine adjustment screw needs to adjust, and a number n2 of circles that the second fine adjustment screw needs to adjust, where n1=θ1 / A1 and n2=θ2 / A2;

[0021] 8.3) rotating the first fine adjustment screw n1 circles and rotating the second fine adjustment screw n2 circles, thereby adjusting the pose of the machining laser.

[0022] Further, step 6 specifically includes:

[0023] obtaining a positioning plate picture having impact spots P0, P 90 , P 180 , P 270 through a camera, and obtaining positions of the impact spots P0, P 90 , P 180 , P 270 through a microscope measurement system, obtaining a first connecting line between the impact spots P0 and P 180 and a second connecting line between the impact spots P 90 and P 270 , obtaining an intersection I of the first connecting line and the second connecting line, obtaining a distance Δd1 between a midpoint I1 of the first connecting line and the intersection I, and obtaining a distance Δd2 between a midpoint I2 of the second connecting line and the intersection I.

[0024] Further, after step 2 and before step 3, further comprising the step of adjusting the laser parameter:

[0025] Adjusting the output power of the laser source so that the machining laser output forms a minimum size impact spot on the positioning plate.

[0026] Further, in steps 3 and 5, when forming impact spots P0, P 90 , P 180 , P 270 , the laser source is turned on for 0.5 seconds.

[0027] Further, the positioning plate uses an anodized black aluminum plate.

[0028] Further, in step 4:

[0029] When the indicating laser source is set, the indicating laser emitted by the indicating laser source forms a light spot on the positioning plate with a diameter ≤0.5mm.

[0030] The beneficial effects of the present application are:

[0031] 1. The laser beam pose debugging method of the reflective double-pivot-axis laser device provided by the present application only needs to add an indicating laser source or an imaging component on the hardware, forms impact spots on the positioning plate by rotating the double-pivot-axis C-axis four times, observes the relative positions of the impact spots, judges the tilt direction of the machining laser, and adjusts the fine adjustment screw of the reflective double-pivot-axis laser device to complete the debugging. This method is simple to operate, does not need to disassemble the double-pivot-axis, does not need to modify the existing laser processing device, greatly improves the adjustment efficiency, saves time cost, and is suitable for various laser processing devices.

[0032] 2. The present application obtains the relative positional relationship between the four impact spots, obtains the included angle between the machining laser pointing direction and the C-axis and A-axis rotation axes of the double-pivot-axis from the relative positional relationship, thereby obtaining accurate adjustment parameters, and accurately adjusts the pointing direction of the machining laser. The adjustment process is fast and simple.

[0033] 3. The present application adjusts the output power of the laser source so that the machining laser output forms a minimum size impact spot on the positioning plate, reduces the error of calculating the angle θ1 and the angle θ2, improves the adjustment accuracy of each time, and makes the adjustment more efficient and faster.

[0034] 4. The present application obtains the positioning plate picture with impact spots P0, P 90 , P 180 , P 270 by a camera, and obtains the impact spots P0, P 90 , P 180 , P270 The position is acquired conveniently and efficiently, and the position precision is higher. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a structural schematic diagram of a laser processing device in a double-pivot structure form;

[0036] Figure 2 is a structural schematic diagram in the implementation process of a laser beam pose debugging method of a reflective double-pivot laser device of the present application;

[0037] Figure 3 is a structural schematic diagram of forming four spots on a positioning plate in an embodiment of the present application.

[0038] REFERENCE NUMERALS

[0039] 1-laser source, 11-processing laser, 2-optical four-dimensional adjustment system, 3-C axis, 4-A axis, 5-focusing mirror, 6-first fine adjustment screw, 7-indicating laser source, 71-indicating laser, 8-positioning plate, 9-second fine adjustment screw, 10-imaging assembly, 101-marking point on imaging surface. DETAILED DESCRIPTION

[0040] The technical solutions of the present application will be described clearly and completely in combination with the drawings and embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0041] The laser beam pose debugging method of the reflective double-pivot laser device provided in the embodiment, as shown in Figure 2 , comprises the following steps:

[0042] Step 1, a positioning plate 8 is fixedly arranged on a work platform of a processing machine tool, so that the positioning plate 8 is parallel to the work platform; the positioning plate 8 is made of an anodized black aluminum plate.

[0043] Step 2, the reflective double-pivot laser device is adjusted, so that the focal point of processing laser 11 emitted by the laser source 1 of the reflective double-pivot laser device is on the surface of the positioning plate 8, and the C axis 3 is at zero position, so that the rotation axis of the A axis 4 is parallel to the X axis of the self-coordinate system of the processing machine tool;

[0044] Step 3, the reflective double-pivot laser device is started, so that the processing laser 11 forms an impact spot P0 on the positioning plate 8; when the impact spots P0, P 90 , P 180 , P 270 are formed, the laser source 1 is turned on for 0.5 seconds.

[0045] In other embodiments, the laser parameters can also be adjusted at this time:

[0046] The output power of the laser source 1 is adjusted so that the machining laser 11 output forms the smallest and clearest impact spot on the positioning plate 8.

[0047] Step 4, an indicating laser source 7 or an imaging assembly 10 is arranged above the positioning plate 8 on one side of the machining laser 11 so that the indicating laser 71 emitted by the indicating laser source 7 or the mark point 101 on the imaging surface indicates the position of the impact spot P0; when the indicating laser source 7 is arranged, the diameter of the light spot formed by the indicating laser 71 emitted by the indicating laser source 7 on the positioning plate 8 is ≤0.5mm.

[0048] Step 5, as shown in Figure 3 , the C-axis is rotated 390°, 180°, and 270° in turn, and after each rotation, the machining tool is moved so that the indicating laser 71 or the mark point 101 on the imaging surface indicates the position of the impact spot P0 again, and then the machining laser 11 forms impact spots P 90 , P 180 , and P 270 on the positioning plate 8, respectively. When the impact spots P0, P 90 , P 180 , and P 270 are formed, the laser source 1 is turned on for 0.5 seconds.

[0049] Step 6, the positioning plate 8 with the impact spots P0, P 90 , P 180 , and P 270 is photographed by a camera; the positions of the impact spots P0, P 90 , P 180 , and P 270 are measured by a microscope measurement system, the first connecting line between the impact spots P0 and P 180 and the second connecting line between the impact spots P 90 and P 270 are obtained, the intersection I of the first connecting line and the second connecting line is obtained, the distance Δd1 between the midpoint I1 of the first connecting line and the intersection I is obtained, and the distance Δd2 between the midpoint I2 of the second connecting line and the intersection I is obtained.

[0050] Step 7, the angle θ1≈tan -1 Δd1 / f=0.15° between the machining laser 11 and the rotation axis of the C-axis 3 is calculated, and the angle θ2≈tan -1 Δd2 / f=0.23° between the machining laser 11 and the rotation axis of the A-axis 4 is calculated, where f is the focal length of the focusing mirror 5 in the reflective double-pendulum-axis laser device, and f=190.5mm in this embodiment;

[0051] Step 8, adjust the pose of the machining laser 11 based on the deflection angle θ1 and the deflection angle θ2; specifically comprising:

[0052] 8.1, obtain the adjustment angle A1 = 0.28° and A2 = 0.28° of the machining laser 11 when the first fine adjustment screw 6 and the second fine adjustment screw 9 are each rotated 1 circle in the reflective double swing shaft laser device;

[0053] 8.2, calculate the number of circles n1 = θ1 / A1 and n2 = θ2 / A2 that the first fine adjustment screw 6 and the second fine adjustment screw 9 need to adjust; the embodiment calculates n1 = 0.54 circles and n2 = 0.82 circles;

[0054] 8.3, rotate the first fine adjustment screw 0.54 circles and the second fine adjustment screw 0.82 circles, thereby adjusting the pose of the machining laser 11.

[0055] Step 9, replace the positioning plate 8, make the replaced positioning plate 8 parallel to the workbench, repeat steps 3 to 8 until the midpoint I1 of the first line and the midpoint I2 of the second line reach the preset coincidence degree, then the pose adjustment of the machining laser is completed, and the laser beam pose adjustment of the reflective double swing shaft laser device is completed.

[0056] Finally, the first fine adjustment screw and the second fine adjustment screw are fixed by using thread fastening glue and the like to avoid rotation, and then the machining operation is performed.

[0057] The method provided in the embodiment forms impact spots on the positioning plate 8 by continuously rotating the double swing shaft C 390°, 180° and 270° for multiple times, indicates the laser source 7 or the imaging assembly as an adjustment reference, obtains the adjustment circle number of the first fine adjustment screw 6 and the second fine adjustment screw 9 by measuring the position relationship and the deflection angle θ1 and the deflection angle θ2 of the formed spots, and adjusts the pointing direction of the machining laser 11. In addition, the deflection amount of the laser impact spot is measured by using the microscope measurement system by means of the above method, the pose of the machining laser can be calibrated more accurately, and the purpose of making the machining laser parallel to the double swing shaft C rotation axis is achieved. Therefore, the method is fast and simple, high in precision, good in economy, and convenient for laser beam pose adjustment of the double swing shaft type laser machining machine tool.

[0058] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for adjusting the laser beam pose of a reflective double-axis laser device, characterized in that, Includes the following steps: Step 1: Fix a positioning plate (8) on the working platform of the machining tool so that the positioning plate (8) is parallel to the working platform; Step 2: Adjust the reflective double-axis laser equipment so that the focal point of the processing laser (11) emitted by its laser source (1) is on the surface of the positioning plate (8), and the C-axis (3) is at zero position, so that the rotation axis of the A-axis (4) is parallel to the X-axis of the machine tool's own coordinate system. Step 3: Start the reflective double-axis laser equipment so that the processing laser (11) forms an impact spot P0 on the positioning plate (8); Step 4: Set an indicator laser source (7) or imaging component (10) on one side of the processing laser (11) and above the positioning plate (8), so that the indicator laser (71) emitted by the laser or the mark point (101) on the imaging surface points to the position of the impact spot P0 on the positioning plate (8); when setting the indicator laser source (7), make the diameter of the light spot formed by the indicator laser (71) emitted by the indicator laser source (7) on the positioning plate (8) ≤0.5mm; Step 5: Rotate the C-axis (3) sequentially by 90°, 180°, and 270°. After each rotation, move the machine tool so that the indicator laser (71) or the marker point (101) on the imaging surface is again pointed to the position of the impact spot P0. Then, use the processing laser (11) to form the impact spot P0 on the positioning plate (8). 90 P 180 P 270 ; Step 6: Obtain the impact spots P0 and P 180 The first line connecting them and the impact spot P 90 and P 270 Find the second line connecting the first and second lines, obtain the intersection point I of the first and second lines, then obtain the distance Δd1 between the midpoint I1 of the first line and the intersection point I, and obtain the distance Δd2 between the midpoint I2 of the second line and the intersection point I. Step 7: Calculate the angle θ1 ≈ tan θ1 between the machining laser (11) and the rotation axis of the C-axis (3). -1 (Δd1 / f), and calculate the deflection angle θ2≈tan between the machining laser (11) and the rotation axis of A-axis (4). -1 (Δd2 / f), where f is the focal length of the focusing mirror (5) in the reflective double-axis laser device; Step 8: Adjust the pose of the processing laser (11) based on the deflection angles θ1 and θ2; Step 9: Replace the positioning plate (8) so that the replacement positioning plate (8) is parallel to the working platform. Repeat steps 3 to 8 until the midpoint I1 of the first line and the midpoint I2 of the second line reach the preset overlap, and complete the laser beam pose adjustment of the reflective double-axis laser equipment.

2. The laser beam pose adjustment method for a reflective dual-axis laser device according to claim 1, characterized in that, Step 8 specifically includes: 8.1) Obtain the corresponding adjustment angles A1 and A2 of the processing laser (11) when the first fine-tuning screw (6) and the second fine-tuning screw (9) in the reflective double-axis laser device rotate 1 revolution each; 8.2) Calculate the number of turns required for the first fine-tuning screw (6) n1=θ1 / A1 and the number of turns required for the second fine-tuning screw (9) n2=θ2 / A2; 8.3) Rotate the first fine-tuning screw (6) n1 turns and the second fine-tuning screw (9) n2 turns to adjust the position of the processing laser (11).

3. The laser beam pose adjustment method for a reflective dual-axis laser device according to claim 1 or 2, characterized in that, Step 6 specifically involves: Acquired by camera with impact spots P0, P 90 P 180 P 270 The positioning plate (8) image; the impact spots P0 and P in the image were obtained by a microscope measurement system. 90 P 180 P 270 The location of the impact spot P0 and P is obtained. 180 The first line connecting them and the impact spot P 90 and P 270 Find the second line connecting the first and second lines, obtain the intersection point I of the first and second lines, then obtain the distance Δd1 between the midpoint I1 of the first line and the intersection point I, and obtain the distance Δd2 between the midpoint I2 of the second line and the intersection point I.

4. The laser beam pose adjustment method for the reflective dual-axis laser device according to claim 3, characterized in that, After step 2 and before step 3, there is also a step of adjusting the laser parameters: Adjust the output power of the laser source (1) so that the processing laser (11) output by it forms a minimum-sized impact spot on the positioning plate (8).

5. The laser beam pose adjustment method for a reflective dual-axis laser device according to claim 4, characterized in that: In steps 3 and 5, impact spots P0 and P are formed. 90 P 180 P 270 At that time, the laser source (1) is turned on for 0.5 seconds.

6. The laser beam pose adjustment method for a reflective dual-axis laser device according to claim 5, characterized in that: The positioning plate (8) is made of anodized black aluminum plate.

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