Implant processing equipment

Abstract

The invention relates to the technical field of implant processing equipment, and provides implant processing equipment which comprises a frame body, a lifting table, a lifting mechanism, a clamp, a rotating shaft, a driving mechanism and a laser, the lifting mechanism is used for driving the lifting table to lift and move; the lifting mechanism is arranged on the frame body; the fixture is used for placing and fixing an implant; the rotating shaft is vertically arranged and rotationally connected to the frame body; the clamp is arranged at the top end of the rotating shaft; the driving mechanism is used for driving the rotating shaft to rotate; the driving mechanism is arranged on the frame body; the laser is used for emitting a laser beam to the implant on the clamp; and the laser is arranged on the lifting platform.

Description

Technical Field

[0001] The present invention belongs to the technical field of implant processing equipment, and more specifically, relates to an implant processing equipment. Background Art

[0002] Advantages of porous implants: The porous structure can effectively adjust the elastic modulus of the implant, making it closer to the elasticity of natural bone, which reduces the stress shielding effect, allowing the bone tissue to obtain normal physiological load and avoid osteoporosis or bone resorption. At the same time, the porous structure allows blood and nutrients to flow more freely, facilitating the transmission of nutrients, thereby accelerating the formation of bone tissue on the surface and inside the implant, improving the health of the implant-bone interface, and thus improving its long-term stability. (Reference patents: CN202410921499.3, CN202310042761.2, CN202210973324.8)

[0003] Current manufacturing limitations of porous implants: Porous structures are difficult to manufacture and usually require 3D metal printing methods, such as selective laser melting (SLM) (reference patents: CN202410921499.3, CN202310042816.X, CN202210973324.8), which results in high costs and slow production efficiency. At the same time, the density of 3D printed materials is usually lower than that of traditional processed materials. Especially in the design of porous structures, there may be tiny pores or defects, resulting in a decrease in mechanical strength, and it is easy to break or fatigue damage under high bite forces. In addition, 3D printing technology is not as good as CNC processing in terms of control accuracy, especially small detail structures are difficult to control uniformly, which may lead to insufficient connection accuracy between the implant and the abutment, affecting the sealing of the connection interface, and thus increasing the risk of inflammation and infection around the implant. Summary of the invention

[0004] The purpose of the present invention is to provide an implant processing device to solve the technical problem of difficulty in manufacturing porous implants in the prior art.

[0005] To achieve the above object, the technical solution adopted by the present invention is: to provide an implant processing device, comprising:

[0006] Frame;

[0007] Lifting platform;

[0008] Lifting mechanism; the lifting mechanism is used to drive the lifting platform to move up and down; the lifting mechanism is arranged on the frame;

[0009] A fixture; the fixture is used to place and fix the implant;

[0010] The rotating shaft is vertically arranged and rotatably connected to the frame; the clamp is arranged at the top end of the rotating shaft;

[0011] Driving mechanism; the driving mechanism is used to drive the rotating shaft to rotate; the driving mechanism is arranged on the frame;

[0012] Laser; the laser is used to emit a laser beam to the implant on the fixture; the laser is arranged on the lifting platform.

[0013] Furthermore, the lifting mechanism includes: a first motor arranged on the frame, a first annular transmission belt, a slide rail vertically arranged on the frame, the lifting platform slidably arranged on the slide rail, and a screw rod arranged on the frame and threadedly connected to the lifting platform; the first motor is connected to the screw rod through a first annular transmission belt.

[0014] Furthermore, the driving mechanism includes: a second motor and a second annular transmission belt arranged on the frame; the second motor is transmission-connected to the rotating shaft via the second annular transmission belt.

[0015] Further, when the laser emits the laser beam, the first motor and the second motor stop rotating.

[0016] Furthermore, it also includes: a first reducer and a second reducer; the first motor is drivingly connected to the first annular transmission belt through the first reducer, and the second motor is drivingly connected to the second annular transmission belt through the second reducer.

[0017] Furthermore, the laser has a control unit for controlling the power of the laser beam.

[0018] Furthermore, the laser can process a hole array on the surface of the implant; the hole diameter of each hole on the hole array ranges from 300 to 800 um, and the hole array has a porosity of 50% to 80%.

[0019] Furthermore, it also includes: a first seat body arranged on the lifting platform and having a first slide groove; the laser is slidably arranged in the first slide groove; and the extension direction of the first slide groove is parallel to the direction of the laser beam.

[0020] Furthermore, it also includes: a laser rangefinder arranged on the lifting platform; the clamp is located between the laser rangefinder and the laser; the laser beam and the distance measuring beam emitted by the laser rangefinder are in opposite directions.

[0021] Furthermore, the diameter of the ranging light beam emitted by the laser rangefinder is smaller than the spot diameter of the laser beam.

[0022] Furthermore, before the laser beam irradiates the implant, the laser rangefinder first measures the distance of the implant.

[0023] Furthermore, before the laser beam irradiates the implant, the laser rangefinder first moves up and down with the lifting platform and measures the distance of the implant.

[0024] Furthermore, it also includes: a lens; the lens is located between the workstation and the laser rangefinder.

[0025] Furthermore, it also includes: a protective cover and a baffle; the baffle and the protective cover form a protective cover arranged on the outside of the laser rangefinder; the lens is detachably fixed on the baffle.

[0026] Furthermore, there are multiple lasers; the laser beams emitted by the multiple lasers can intersect with each other on the surface of the implant to form through holes.

[0027] Furthermore, there are multiple lasers; the laser beams emitted by the multiple lasers have different powers and / or spot diameters.

[0028] Furthermore, it also includes: a transmission plate and a second seat body; the second seat body is arranged on the lifting platform; the second seat body has a second slide groove, and the transmission plate is slidably arranged in the second slide groove; a positioning hole is opened on the transmission plate; the clamp includes: a bearing outer ring clamped in the positioning hole, a bearing inner ring arranged on the inner side of the bearing outer ring, a conical identification column arranged on the bearing inner ring, and a clamp arranged on the identification column and used to cooperate with the implant; the bearing inner ring is magnetic, and the top of the rotating shaft has a magnet for adsorbing the bearing inner ring.

[0029] Furthermore, it also includes: a nozzle for spraying toward the implant on the fixture and a gas source storing an inert gas; the nozzle is connected to the gas source.

[0030] Furthermore, it also includes: a counterweight block arranged at the bottom of the frame.

[0031] The beneficial effects of the implant processing equipment provided by the present invention are as follows: compared with the prior art, the implant processing equipment provided by the present invention has a vertically arranged rotating shaft, and the rotating shaft is directly or indirectly rotatably connected to the frame, and the driving mechanism can drive the rotating shaft to rotate relative to the frame; a clamp is arranged at the top of the rotating shaft, and the implant can be fixed on the clamp, and when the rotating shaft rotates, the clamp can be driven to rotate, and when the clamp rotates, the implant can be driven to rotate; the lifting mechanism can drive the lifting platform to move up and down, and a laser is arranged on the lifting platform, and the laser can move up and down with the lifting platform, and the laser can emit a laser beam to irradiate the implant to perform laser processing on the implant, and the laser beam can form a depression or hole on the implant when it is irradiated on the implant, which is very convenient for processing porous implants. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A three-dimensional schematic diagram of an implant processing device provided in an embodiment of the present invention Figure 1 ;

[0033] Figure 2 A three-dimensional schematic diagram of an implant processing device (with the lifting platform hidden) provided in an embodiment of the present invention;

[0034] Figure 3 A three-dimensional schematic diagram of an implant processing device provided in an embodiment of the present invention Figure 2 ;

[0035] Figure 4 A three-dimensional schematic diagram of an implant processing device (having two lasers) provided in an embodiment of the present invention;

[0036] Figure 5 A three-dimensional schematic diagram of an implant processing device (having four lasers) provided in an embodiment of the present invention;

[0037] Figure 6 A three-dimensional schematic diagram of an implant processing device (cooperation between a transfer plate and a fixture) provided in an embodiment of the present invention;

[0038] Figure 7 A schematic top view of an implant processing device (cooperation between a transfer plate and a fixture) provided in an embodiment of the present invention;

[0039] Figure 8 for Figure 7 Schematic diagram of the AA section diagram of the fixture and the shaft;

[0040] Fig. 9 A three-dimensional schematic diagram of an implant processing device (with a baffle and a protective cover on the outside of the laser rangefinder) provided in an embodiment of the present invention.

[0041] Among them, the reference numerals in the figure are:

[0042] 1-frame; 21-lifting platform; 22-first seat; 23-second seat; 24-transmission plate; 3-lifting mechanism; 31-first motor; 32-first annular transmission belt; 33-slide rail; 34-screw; 35-first reducer; 4-clamp; 41-bearing inner ring; 42-bearing outer ring; 43-identification column; 44-holder; 5-rotating shaft; 6-driving mechanism; 61-second motor; 62-second annular transmission belt; 63-second reducer; 7-laser; 8-laser rangefinder; 91-lens; 92-protective cover; 93-baffle; 94-nozzle; 95-counterweight; 96-implant. DETAILED DESCRIPTION

[0043] It should be noted that the specific embodiments are only used to explain the present invention, and are not used to limit the present invention.

[0044] It should be noted that, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. Among them, A and B can be singular or plural respectively.

[0045] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" or "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. When an element is referred to as being "fixed on" or "set on" another element, it may be directly on the other element or indirectly on the other element.

[0046] It should be noted that the directions or positional relationships indicated by terms such as “length”, “width”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0047] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0048] It should be noted that the term "plurality" means two or more than two, unless otherwise clearly and specifically defined.

[0049] Please also read Figures 1 to 9 , the implant processing equipment provided by the present invention is now described. The implant processing equipment includes: a frame 1, a lifting platform 21, a lifting mechanism 3, a fixture 4, a rotating shaft 5, a driving mechanism 6, and a laser 7; the lifting mechanism 3 is used to drive the lifting platform 21 to move up and down; the lifting mechanism 3 is arranged on the frame 1; the fixture 4 is used to place and fix the implant 96; the rotating shaft 5 is vertically arranged and rotatably connected to the frame 1; the fixture 4 is arranged at the top of the rotating shaft 5; the driving mechanism 6 is used to drive the rotating shaft 5 to rotate; the driving mechanism 6 is arranged on the frame 1; the laser 7 is used to emit a laser beam to the implant 96 on the fixture 4; the laser 7 is arranged on the lifting platform 21.

[0050] In this way, the rotating shaft 5 is arranged vertically, and the rotating shaft 5 is directly or indirectly connected to the frame 1 for rotation, and the driving mechanism 6 can drive the rotating shaft 5 to rotate relative to the frame 1; a clamp 4 is arranged at the top of the rotating shaft 5, and the implant 96 can be fixed on the clamp 4, and when the rotating shaft 5 rotates, the clamp 4 can be driven to rotate, and when the clamp 4 rotates, the implant 96 can be driven to rotate; the lifting mechanism 3 can drive the lifting platform 21 to move up and down, and a laser 7 is arranged on the lifting platform 21, and the laser 7 can move up and down with the lifting platform 21, and the laser 7 can emit a laser beam to irradiate the implant 96 to perform laser processing on the implant 96, and the laser beam can form a depression or hole on the implant 96 when it is irradiated on the implant 96, and it is very convenient to process the porous implant 96.

[0051] In one embodiment, the fixture 4 is a boss, and a cavity on the implant 96 (such as a cavity into which the abutment is inserted) is clamped on the boss.

[0052] In one embodiment, the fixture 4 is a clamp.

[0053] In one embodiment, the implant 96 may be referred to in the Chinese invention patent: (publication number: CN114767299A; name: self-drilling oral implant; applicant: Guangdong Jianchi Biotechnology Co., Ltd.).

[0054] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, the lifting mechanism 3 includes: a first motor 31 arranged on the frame 1, a first annular transmission belt 32, a slide rail 33 arranged vertically on the frame 1, a lifting platform 21 slidingly arranged on the slide rail 33, and a screw 34 arranged on the frame 1 and threadedly connected to the lifting platform 21; the first motor 31 is connected to the screw 34 through the first annular transmission belt 32. In this way, the first motor 31 drives the screw 34 to rotate through the first annular transmission belt 32 to drive the lifting frame to lift.

[0055] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, the driving mechanism 6 includes: a second motor 61 and a second annular transmission belt 62 arranged on the frame 1; the second motor 61 is connected to the rotating shaft 5 through the second annular transmission belt 62. In this way, the second motor 61 drives the rotating shaft 5 to rotate through the second annular transmission belt 62.

[0056] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, when the laser 7 emits a laser beam, the first motor 31 and the second motor 61 stop rotating. In this way, pulse laser drilling is a continuous process, and only when the surface being punched is relatively still can a complete and regular hole be formed. When the first motor 31 and the second motor 61 are rotating, pulse laser drilling is performed, and a rounded rectangular hole will be formed on the surface of the implant 96, and the specified hole depth cannot be met. In one embodiment, for this purpose, the first motor 31 and the second motor 61 are preferably stepper motors, which stop rotating and perform pulse laser drilling after each specified number of steps.

[0057] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a first reducer 35 and a second reducer 63; the first motor 31 is connected to the first annular transmission belt 32 through the first reducer 35, and the second motor 61 is connected to the second annular transmission belt 62 through the second reducer 63. In this way, the movement accuracy of the implant 96 fixture 4 and the tray can be improved, and the laser drilling position can be more accurate.

[0058] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, the laser 7 has a control unit for controlling the power of the laser beam. In this way, the depth of the hole is controlled by controlling the output power of the laser generating device. Usually, the top of the implant 96 is a solid part, and a deeper hole is required to reduce its modulus. However, there is an interface at the neck of the implant 96, and the hole on its surface cannot penetrate the hole to the interface, which will cause penetration. At the same time, if the hole is too deep, it will easily cause the implant 96 to break. Therefore, it is necessary to control the output power of the laser generating device to prepare different hole depths.

[0059] For further information, see Figures 1 to 9As a specific embodiment of the implant processing device provided by the present invention, the laser 7 can process a hole array on the surface of the implant 96; the aperture of each hole on the hole array ranges from 300 to 800 um, and the porosity of the hole array is 50% to 80%. This is similar to the internal structure and modulus of the human jaw, which helps the long-term stability of the implant 96.

[0060] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a first seat body 22 provided on the lifting platform 21 and having a first slide groove; the laser 7 is slidably arranged in the first slide groove; and the extension direction of the first slide groove is parallel to the direction of the laser beam. In this way, the laser 7 slides along the first slide groove to adjust the position where the laser 7 is focused.

[0061] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it also includes: a laser rangefinder 8 arranged on the lifting platform 21; the fixture 4 is located between the laser rangefinder 8 and the laser 7; the laser beam and the distance measuring beam emitted by the laser rangefinder 8 are in opposite directions. In this way, the laser rangefinder 8 can measure the distance of a certain point on the surface of the implant 96, and the lateral position (lateral: refers to the radial direction of the rotating shaft 5 (or the direction of the laser beam)) of a certain point, so that this lateral position information can be transmitted to the computer, and it can be determined whether the lateral position of the point is on the focus point, and then the laser generating device is moved according to the degree of deviation from the focus point, so that the drilling laser is focused on the point. Specifically, for example, the laser rangefinder 8 measures the distance D1 to a point on the surface of the implant 96, and it is known that the distance from the center axis of the implant 96 (implant 96 fixture 4) to the laser rangefinder 8 is D2, then the lateral position L1 of the point is D2-D1, and at the same time, it is known that the distance from the pulse laser focus to the center axis of the implant 96 (implant 96 fixture 4) is L2, so the computer can compare the sizes of L1 and L2 to determine whether the point is at the focal point. If not, the computer controls the motor according to the deviation size to move the pulse laser generating device along its pulse laser emission direction to make the focal point close to the surface of the implant 96, that is, until L1=L2.

[0062] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, the diameter of the ranging light beam emitted by the laser rangefinder 8 is smaller than the spot diameter of the laser beam. In this way, the point position of the laser processing can be controlled.

[0063] For further information, see Figures 1 to 9As a specific embodiment of the implant processing device provided by the present invention, before the laser beam irradiates the implant 96, the laser rangefinder 8 first measures the distance of the implant 96. In this way, the laser distance measurement and the pulse laser drilling will not be performed at the same time, avoiding interference with the accuracy of the laser distance measurement, and providing reaction time for the calculation of the computer and the movement of the laser generating device.

[0064] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, before the laser beam irradiates the implant 96, the laser rangefinder 8 first moves up and down with the lifting platform 21 and measures the distance of the implant 96. In this way, the laser rangefinder 8 moves vertically to obtain multiple lateral positions of the implant 96 surface, and the diameter of the measured implant 96 can be obtained through the maximum lateral position, and when the laser rangefinder 8 takes points at a fixed time frequency and moves vertically at a constant speed, the length of the measured implant 96 can be calculated according to the number of lateral positions. When the diameter and length of the measured implant 96 are identified, the corresponding program can be used for drilling. For example, under the condition of uniform porosity, a small-diameter implant 96 requires fewer holes per cross section to meet the porosity requirements, so the second motor 61 must be controlled to rotate more steps before pulse laser drilling, while a large-diameter implant 96 has a larger circumference, and each cross section requires more holes to meet the porosity requirements, so the second motor 61 must be controlled to rotate less steps before pulse laser drilling to ensure that the porosity of each diameter of the implant 96 is consistent. Similarly, under the condition of uniform porosity, the spacing of the punched sections is consistent, so a shorter implant 96 requires fewer punched sections, and a longer implant 96 requires more punched sections. Therefore, the first motor 31 needs to control its rotation steps according to the length of the implant 96 until the Nth section completely covers the implant 96.

[0065] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a lens 91; the lens 91 is located between the work station and the laser rangefinder 8. In this way, the lens 91 can facilitate the measurement laser of the laser rangefinder 8 to pass through the baffle 93 and measure the surface of the implant 96. At the same time, laser processing is prone to produce sputtering waste to contaminate the lens 91, so the lens 91 must be replaced in time, and the detachable function can improve the replacement efficiency.

[0066] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a protective cover 92 and a baffle 93; the baffle 93 and the protective cover 92 form a protective cover arranged outside the laser rangefinder 8; the lens 91 is detachably fixed on the baffle 93. In this way, the laser rangefinder 8 is prevented from being polluted by the outside world and processing waste, and the measurement accuracy is guaranteed.

[0067] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, the number of lasers 7 is multiple; the laser beams emitted by multiple lasers 7 can cross each other on the surface of the implant 96 to form through holes. In this way, the hole structure is interconnected, which can make the implant interlocked with the bone, thereby improving the bonding ability, and thus has higher stability. At the same time, the interconnection of the hole structure is more conducive to the freer circulation of blood and nutrients, and facilitates the transmission of nutrients, thereby accelerating the formation of bone tissue on the surface and inside of the implant 96. (For example: Patent CN202410921499.3 forms a technical document based on the interconnection of the hole structure); the laser rangefinder 8 assists in adjusting the punching method is more important for the preparation of the through hole. Since the surface of the implant 96 is composed of a variety of curved surfaces, when the surface deviates from the predetermined plane, the two holes cannot form an interconnection, so it is necessary to adjust the position of the pulse laser generating device according to the actual position of the punching point on the surface of the implant 96.

[0068] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, the number of lasers 7 is multiple; the laser beams emitted by the multiple lasers 7 have different powers and / or spot diameters. In this way, by controlling different pulse laser generating devices to punch holes on the surface of the implant 96 to adjust parameters such as porosity, pore size, and hole depth, personalized punching of the surface of the implant 96 is achieved to match the bone strength and elastic modulus of the cortical bone, cancellous bone, or the entire implant cavity interface, thereby designing a personalized porous implant 96, thereby improving the stress shielding effect, matching the bone strength and elastic modulus of the implant cavity interface, effectively improving the bonding strength, increasing the bone bonding rate, and long-term stability, and improving the implant success rate. (For example: Patent CN202310042761.2 forms a technical document based on adjusting the porosity and pore size to match the bone strength and elastic modulus of the implant cavity interface).

[0069] For further information, see Figures 1 to 9As a specific embodiment of the implant processing equipment provided by the present invention, it also includes: a transmission piece 24 and a second seat body 23; the second seat body 23 is arranged on the lifting platform 21; the second seat body 23 has a second slide groove, and the transmission piece 24 is slidably arranged in the second slide groove; the transmission piece 24 is provided with a positioning hole; the fixture 4 includes: a bearing outer ring 42 clamped in the positioning hole, a bearing inner ring 41 arranged on the inner side of the bearing outer ring 42, a conical identification column 43 arranged on the bearing inner ring 41, and a clamp 44 arranged on the identification column 43 and used to cooperate with the implant 96; the bearing inner ring 41 is magnetic, and the top of the rotating shaft 5 has a magnet for adsorbing the bearing inner ring 41. In this way, the transmission piece 24 can slide freely with the implant 96 clamp, and at the same time, when the implant 96 fixture 4 is aligned with the rotating shaft 5, the bearing inner ring 41 can provide the friction required for the rotation of the fixture 4 under the suction force of the magnet to ensure its normal drilling operation.

[0070] In one embodiment, the conical identification column 43 is coaxially arranged with the rotating shaft 5 .

[0071] In one embodiment, the holder 44 may be: a clamp 4 .

[0072] In one embodiment, the bearing outer ring 42 is inserted and fixed in the positioning hole.

[0073] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a nozzle 94 for spraying toward the implant 96 on the fixture 4 and a gas source storing an inert gas; the nozzle 94 is connected to the gas source. In this way, the inert gas can prevent the laser irradiation area from undergoing an oxidation reaction due to high temperature.

[0074] For further information, see Figures 1 to 9 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a counterweight block 95 arranged at the bottom of the frame 1. In this way, the counterweight block can ensure the stability of the device operation, thereby improving the processing accuracy.

[0075] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. Implant processing equipment, characterized in that: include: Frame; Lifting platform; Lifting mechanism; The lifting mechanism is used to drive the lifting platform to move up and down; The lifting mechanism is arranged on the frame; A fixture; the fixture is used to place and fix the implant; The rotating shaft is vertically arranged and rotatably connected to the frame; the clamp is arranged at the top end of the rotating shaft; Driving mechanism; the driving mechanism is used to drive the rotating shaft to rotate; the driving mechanism is arranged on the frame; Laser; the laser is used to emit a laser beam to the implant on the fixture; the laser is arranged on the lifting platform.

2. The implant processing device according to claim 1, characterized in that: The lifting mechanism includes: a first motor arranged on the frame, a first annular transmission belt, a slide rail vertically arranged on the frame, the lifting platform slidably arranged on the slide rail, and a screw rod arranged on the frame and threadedly connected to the lifting platform; the first motor is connected to the screw rod through the first annular transmission belt.

3. The implant processing device according to claim 2, characterized in that: The driving mechanism comprises: a second motor and a second annular transmission belt arranged on the frame; the second motor is transmission-connected to the rotating shaft via the second annular transmission belt.

4. The implant processing device according to claim 3, characterized in that: When the laser emits the laser beam, the first motor and the second motor stop rotating.

5. The implant processing device according to claim 3, characterized in that: Also includes: A first reducer and a second reducer; the first motor is drivingly connected to the first annular transmission belt via the first reducer, and the second motor is drivingly connected to the second annular transmission belt via the second reducer.

6. The implant processing device according to claim 1, characterized in that: The laser has a control unit for controlling the power of the laser beam.

7. The implant processing device according to claim 1, characterized in that: The laser can process a hole array on the surface of the implant; the aperture of each hole on the hole array ranges from 300 to 800 um, and the hole array comprises a plurality of holes with a porosity of 50% to 80%.

8. The implant processing device according to claim 1, characterized in that: Also includes: A first seat body is arranged on the lifting platform and has a first slide groove; the laser is slidably arranged in the first slide groove; and the extension direction of the first slide groove is parallel to the direction of the laser beam.

9. The implant processing device according to claim 1, characterized in that: Also includes: A laser rangefinder is arranged on the lifting platform; the clamp is located between the laser rangefinder and the laser; and the laser beam and the distance measuring beam emitted by the laser rangefinder are in opposite directions.

10. The implant processing device according to claim 9, characterized in that: The diameter of the ranging light beam emitted by the laser rangefinder is smaller than the spot diameter of the laser beam.

11. The implant processing device according to claim 9, characterized in that: Before the laser beam irradiates the implant, the laser rangefinder first measures the distance of the implant.

12. The implant processing device according to claim 9, characterized in that: Before the laser beam irradiates the implant, the laser rangefinder first moves up and down with the lifting platform and measures the distance of the implant.

13. The implant processing device according to claim 9, characterized in that: Also includes: Lens; the lens is located between the workstation and the laser rangefinder.

14. The implant processing device according to claim 13, characterized in that: Also includes: A protective cover and a baffle; the baffle and the protective cover form a protective cover arranged on the outside of the laser rangefinder; the lens is detachably fixed on the baffle.

15. The implant processing device according to claim 1, characterized in that: There are multiple lasers; the laser beams emitted by the multiple lasers can intersect with each other on the surface of the implant to form through holes.

16. The implant processing device according to claim 1, characterized in that: There are multiple lasers; the laser beams emitted by the multiple lasers have different powers and / or spot diameters.

17. The implant processing device according to claim 1, characterized in that: Also includes: A conveying plate and a second seat body; the second seat body is arranged on the lifting platform; The second seat body is provided with a second slide groove, and the transmission piece is slidably arranged in the second slide groove; a positioning hole is opened on the transmission piece; the clamp includes: a bearing outer ring clamped in the positioning hole, a bearing inner ring arranged on the inner side of the bearing outer ring, a conical identification column arranged on the bearing inner ring, and a clamp arranged on the identification column and used to cooperate with the implant; the bearing inner ring is magnetic, and the top of the rotating shaft has a magnet for adsorbing the bearing inner ring.

18. The implant processing device according to claim 1, characterized in that: Also includes: A nozzle for spraying toward the implant on the fixture and a gas source storing inert gas; the nozzle is connected to the gas source.

19. The implant processing device according to claim 1, characterized in that: Also includes: A counterweight block is arranged at the bottom of the frame.

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