Integrated Cooling Module for Computer Chassis

Abstract

The present invention discloses an integrated heat dissipation module for a computer chassis, which relates to the technical field of computer chassis heat dissipation; specifically, it includes a mounting plate fixed inside the chassis cavity. A swinging mechanism is provided on the top of the mounting plate, and an adsorption component is clamped at the end of the swinging mechanism. A heat dissipation component is provided on the top of the swinging mechanism, and a heat conduction coil is wound inside and outside the heat dissipation component. Fixing screws are provided at the four corners of the top of the mounting plate. The heat dissipation component includes a fixing frame, a heat insulation plate, a side frame, a W-shaped copper tube, a top frame, and a slot. Two fixing frames are connected to the inner wall of the chassis by bolts. Slots are opened at the four corners on the opposite sides of the two fixing frames. The W-shaped copper tube is inserted into the slot, and the side frames are welded to the outer surface of the W-shaped copper tube at equal intervals in sequence. The present invention not only solves the problem that the heat dissipation space of the heat dissipation module in the traditional chassis is compressed, resulting in poor heat dissipation effect, but also increases the heat conduction area, improves the heat dissipation efficiency, and avoids the problem of high local temperature caused by heat accumulation.

Description

Technical Field

[0001] The present invention relates to the technical field of computer chassis heat dissipation, and particularly to an integrated heat dissipation module for a computer chassis. Background Art

[0002] An integrated heat dissipation module for a computer chassis is a device used to improve the heat dissipation effect of a computer. With the continuous improvement of computer performance and integration, a large amount of heat is generated during the operation of computer hardware, and overheating may cause hardware damage and performance degradation. Therefore, an effective heat dissipation system is crucial for maintaining the stable operation of a computer. The design of the integrated heat dissipation module for a computer chassis aims to provide an efficient heat dissipation solution. By optimizing the heat dissipation structure and air duct design, it can effectively reduce the working temperature of computer hardware and maintain hardware stability and performance. With the continuous progress of technology and the increasing demand for high-performance computers, the functions and performance of computer hardware are also constantly improving. However, with the improvement of hardware performance, the heat generated by the computer during operation also increases correspondingly, resulting in the heat dissipation problem becoming an important factor restricting the stability and performance of the computer. To solve this problem, computer manufacturers and hardware designers have continuously explored innovative heat dissipation solutions, and the integrated heat dissipation module has emerged as the times require.

[0003] After retrieval, the invention with the Chinese patent application number CN201922306322X discloses an integrated heat dissipation module for a CPU chip and a graphics card, including: a chassis body, a main board, and a radiator module; the main board is respectively provided with a CPU chip and a graphics card, and the main board is arranged inside the chassis body; the radiator module is arranged above the main board, the radiator module is movably connected to the chassis through a detachable connection device, and the radiator module further includes a heat dissipation bottom plate, heat dissipation fins, and a radiator; the bottom surface of the heat dissipation bottom plate is provided with a first heat conducting plate matching the size and height of the CPU chip on the main board, and a second heat conducting plate matching the size and height of the graphics card on the main board. This integrated heat dissipation module is easier to maintain, more convenient for installation, disassembly and assembly, and has a lower cost. The following are the deficiencies of the integrated heat dissipation module for a CPU chip and a graphics card in the above invention:

[0004] Although the above device makes the size of the chassis smaller, the production process is simpler, and the production efficiency is improved, when the whole device is stuck above the main board, the heat dissipation space is compressed, and the heat dissipation effect of the heat in the space through the heat dissipation fins is relatively poor. Therefore, there is an urgent need for an integrated heat dissipation module for a computer chassis. Summary of the Invention

[0005] The purpose of the present invention is to solve the deficiencies existing in the prior art and propose an integrated heat dissipation module for a computer chassis.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] An integrated heat dissipation module for a computer chassis, including a mounting plate fixed inside the chassis cavity. A swing mechanism is provided at the top of the mounting plate, and an adsorption component is clamped at the end of the swing mechanism. A heat dissipation component is provided at the top of the swing mechanism, and heat conduction coils are wound inside and outside the heat dissipation component. Fixing screws are provided at the four corners of the top of the mounting plate.

[0008] Preferably: The heat dissipation component includes a fixing frame, a heat insulation plate, side frames, a W-shaped copper tube, a top frame and slots. The two fixing frames are connected to the inner wall of the chassis by bolts. Slots are opened at the four corners on the opposite sides of the two fixing frames. The W-shaped copper tube is inserted into the slots, and the side frames are welded to the outer surface of the W-shaped copper tube at equal intervals in sequence. When the heat in the chassis converges, it is conducted and concentrated above the heat insulation plate through the equally spaced side frames. At this time, the heat above the heat insulation plate is conducted through the heat conduction coils.

[0009] Further: The top frame is welded to the top of the side frames, the heat insulation plate is connected to the middle of the bottom of the fixing frames in an interference fit manner, and temperature sensors are respectively provided on the outer walls of the tops of the two fixing frames.

[0010] Based on the above solution: The heat conduction coils include a water pipe one and a water pipe two. The inner sides of the water pipe one and the water pipe two pass through the equally spaced W-shaped copper tubes, and the water pipe one and the water pipe two are integrally formed. The water inlet ends of the water pipe one and the water pipe two are connected and fixed through a connecting sleeve. When the heat above the heat insulation plate is conducted by the equally spaced W-shaped copper tubes, the heat will be conducted by the water pipe one and the water pipe two. At the same time, the heat inside and outside the W-shaped copper tube is absorbed by the water pipe one and the water pipe two.

[0011] In a better solution among the above solutions: The adsorption component includes an arc-shaped frame, a microfiber cloth, a groove and a card hole. The arc-shaped frame is clamped at the swing end of the swing mechanism through the card hole. The groove is opened inside the arc-shaped frame, the card holes are opened on both sides of the inner wall of the bottom of the groove, and the microfiber cloth is fixedly connected to the side of the arc-shaped frame.

[0012] As a further solution of the present invention: The swing mechanism includes a rotating shaft, a fixed seat, a first screw, a Z-shaped guide rod, a swing rod, a second screw, a servo motor, a connecting rod, and a clamping projection. The fixed seat is fixedly connected to both sides of the top of the mounting plate. The first screw and the second screw are rotatably connected to the inside of the two fixed seats through bearings, and the servo motor is fixedly connected to one side of the top of the mounting plate through bolts. By starting the servo motor to drive the second screw to rotate, the rotating second screw synchronously drives the first screw to rotate. At this time, the Z-shaped guide rods on the circumferences of the first screw and the second screw move in opposite directions. At this time, the swing rod on the circumference of the second screw drives the Z-shaped guide rod at its end downward, and the swing rod on the circumference of the first screw drives the Z-shaped guide rod at its end upward. Thereby, the connecting rod is driven to rotate a certain angle around the rotating shaft, so that the adsorption components on the connecting rod are attached to the heat dissipation net.

[0013] At the same time, the output end of the servo motor is threadedly connected to the end of the second screw. The two Z-shaped guide rods are respectively sleeved on the circumferences of the first screw and the second screw. The two Z-shaped guide rods are centrosymmetric, and the two swing rods are rotatably connected to the ends of the two Z-shaped guide rods.

[0014] As a preferred embodiment of the present invention: The rotating shaft is rotatably connected to one side of the top of the mounting plate. The connecting rod is arranged on the top circumference of the rotating shaft. The two ends of the connecting rod form a rotational fit with the ends of the two swing rods. The clamping projections are fixedly connected to both sides of the top of the connecting rod, and the clamping projections are in interference connection with the clamping holes. The first screw and the second screw are connected through a clamping component.

[0015] At the same time, the clamping component includes a protrusion, a clamping groove, a fixed ball, and a spherical groove. The protrusions are respectively arranged on the top of the first screw and the bottom of the second screw. The spherical groove is opened at the end of the second screw, and the fixed ball is fixedly connected to the end of the first screw. When the first screw and the second screw are butted, the protrusions on the first screw and the second screw are clamped with the clamping grooves, and the fixed ball at the end of the first screw is adsorbed in the spherical groove of the second screw, effectively realizing the butting of the first screw and the second screw.

[0016] As a more optimal solution of the present invention: The clamping grooves are respectively opened at the top of the first screw and the bottom of the second screw. The protrusions are in mutual fitting and clamping with the clamping grooves, and the fixed ball and the spherical groove are mutually adsorbed.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. For this integrated heat dissipation module of the computer case, when the heat in the case converges, it is conducted through the equally spaced side frames and concentrated above the heat insulation plate. At this time, the heat above the heat insulation plate is conducted through the heat conduction coil, which not only solves the problem that the heat dissipation space of the traditional heat dissipation module in the case is compressed, resulting in poor heat dissipation effect, but also increases the heat conduction area, improves the heat dissipation efficiency, and avoids the problem of local high temperature caused by heat convergence.

[0019] 2. For the integrated heat dissipation module of the computer chassis, when the heat above the heat insulation plate is conducted by the W-shaped copper tubes arranged at equal distances, the heat will be conducted by water pipe one and water pipe two. At the same time, the heat inside and outside the W-shaped copper tubes is absorbed by water pipe one and water pipe two, effectively promoting the heat dissipation effect inside the chassis and ensuring the rapid conduction of heat.

[0020] 3. For the integrated heat dissipation module of the computer chassis, the swinging mechanism works to drive the arc-shaped frame to swing left and right. The microfiber cloth on one side of the arc-shaped frame can effectively adsorb the heat dissipation net, avoiding the adsorption of dust by the side heat dissipation net of the chassis during operation, ensuring the circulation and dissipation of heat inside the chassis, preventing the problem that the pores of the heat dissipation net are blocked by dust during long-term operation of the chassis, and promoting the smooth flow of heat conduction.

[0021] 4. For the integrated heat dissipation module of the computer chassis, by starting the servo motor to drive the rotation of screw two, the rotating screw two synchronously drives the rotation of screw one. At this time, the Z-shaped guide rods on the circumferences of screw one and screw two move in opposite directions. At this time, the swing rod on the circumference of screw two drives the Z-shaped guide rod at its end downward, while the swing rod on the circumference of screw one drives the Z-shaped guide rod at its end upward, thereby driving the connecting rod to rotate a certain angle around the rotating shaft, making the adsorption component on the connecting rod attach to the heat dissipation net, promoting the microfiber cloth to adsorb the dust on the heat dissipation net, effectively ensuring the removal of dust on the heat dissipation net and ensuring the working quality of the heat dissipation net.

[0022] 5. For the integrated heat dissipation module of the computer chassis, when screw one and screw two are docked, the protrusions on screw one and screw two are engaged with the card slots, and the fixed ball at the end of screw one is adsorbed in the spherical groove of screw two, effectively realizing the docking of screw one and screw two. This not only effectively promotes the connection and fixation of screw one and screw two, ensures the synchronization of their rotation, but also facilitates the loading, unloading and replacement of screw one and screw two. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is the front view structural schematic diagram of the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0024] Figure 2 is the side view structural schematic diagram of the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0025] Figure 3 is the top view structural schematic diagram of the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0026] Figure 4 is the structural schematic diagram of the swinging mechanism in the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0027] Figure 5Partial structural schematic diagram of the swinging mechanism in the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0028] Figure 6 Structural schematic diagram of the heat dissipation component in the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0029] Figure 7 Structural schematic diagram of the heat conduction coil pipe in the integrated heat dissipation module of the computer chassis proposed by the present invention;

[0030] Figure 8 Cross-sectional structural schematic diagram of the butt joint of the first screw and the second screw in the integrated heat dissipation module of the computer chassis proposed by the present invention.

[0031] In the figure: 1, mounting plate; 2, fixing screw; 3, adsorption component; 4, heat dissipation component; 5, swinging mechanism; 6, connecting sleeve; 7, heat conduction coil pipe; 8, temperature sensor; 301, arc-shaped frame; 302, microfiber cloth; 303, groove; 304, card hole; 401, fixing frame; 402, heat insulation plate; 403, side frame; 404, W-shaped copper pipe; 405, top frame; 406, slot; 501, rotating shaft; 502, fixing seat; 503, first screw; 504, Z-shaped guide rod; 505, swing rod; 506, second screw; 507, servo motor; 508, connecting rod; 509, convex; 510, protrusion; 511, card slot; 512, fixing ball; 513, spherical groove; 701, first water pipe; 702, second water pipe. Specific embodiments

[0032] The technical solutions of the present invention will be further described in detail below in conjunction with specific embodiments.

[0033] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0034] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0035] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "linkage", and "setting" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Embodiment 1:

[0037] An integrated heat dissipation module for a computer chassis, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown in

[0038] To solve the problem that the heat dissipation space of the heat dissipation module in the traditional chassis is compressed, resulting in a poor heat dissipation effect; as Figure 6 and Figure 7 shown, the heat dissipation component 4 includes a fixing frame 401, a heat insulation plate 402, a side frame 403, a W-shaped copper tube 404, a top frame 405, and a slot 406. The two fixing frames 401 are connected to the inner wall of the chassis by bolts. The slots 406 are opened at the four corners on the opposite sides of the two fixing frames 401. The W-shaped copper tube 404 is inserted into the slots 406. The side frames 403 are welded to the outer surface of the W-shaped copper tube 404 at equal intervals in sequence, and the top frame 405 is welded to the top of the side frames 403. The heat insulation plate 402 is connected to the middle of the bottom of the fixing frame 401 in an interference fit. Temperature sensors 8 are respectively fixed to the outer walls of the tops of the two fixing frames by bolts. The model of the temperature sensor 8 is MAX31865. The temperature inside the chassis can be sensed by the two temperature sensors 8, and the temperature signal is transmitted to the control system of the chassis.

[0039] When the heat inside the chassis converges, it is conducted and concentrated above the heat insulation plate 402 through the side frames 403 arranged at equal intervals. At this time, the heat above the heat insulation plate 402 is conducted through the heat conduction coil 7, which not only solves the problem that the heat dissipation space of the heat dissipation module in the traditional chassis is compressed, resulting in a poor heat dissipation effect, but also increases the heat conduction area, improves the heat dissipation efficiency, and avoids the problem of local high temperature caused by heat convergence.

[0040] The heat conduction coil 7 includes a first water pipe 701 and a second water pipe 702. The inner sides of the first water pipe 701 and the second water pipe 702 pass through the interior of equally spaced W-shaped copper tubes 404, and the first water pipe 701 and the second water pipe 702 are integrally formed. The water inlet ends of the first water pipe 701 and the second water pipe 702 are connected and fixed by a connecting sleeve 6.

[0041] When the heat above the heat insulation plate 402 is conducted by the equally spaced W-shaped copper tubes 404, the heat will be conducted by the first water pipe 701 and the second water pipe 702. At the same time, the heat inside and outside the W-shaped copper tubes 404 is absorbed by the first water pipe 701 and the second water pipe 702, effectively promoting the heat dissipation effect inside the chassis and ensuring the rapid conduction of heat.

[0042] In order to adsorb the heat dissipation net on the side of the chassis during the heat conduction process and ensure the heat dissipation quality; as Figure 2 、 Figure 3 、 Figure 5 shown, the adsorption assembly 3 includes an arc-shaped frame 301, a microfiber cloth 302, a groove 303 and a card hole 304. The arc-shaped frame 301 is clamped to the swing end of the swing mechanism 5 through the card hole 304. The groove 303 is opened inside the arc-shaped frame 301, and the card holes 304 are opened on both sides of the bottom inner wall of the groove 303. The microfiber cloth 302 is fixedly connected to the side of the arc-shaped frame 301.

[0043] When the swing mechanism 5 works to drive the arc-shaped frame 301 to swing left and right, the microfiber cloth 302 on one side of the arc-shaped frame 301 can effectively adsorb the heat dissipation net, avoiding the adsorption of dust by the heat dissipation net on the side of the chassis during the operation of the chassis, ensuring the circulation and dissipation of heat inside the chassis, preventing the problem that the pores of the heat dissipation net are blocked by dust during long-term operation of the chassis, and promoting the smooth flow of heat conduction.

[0044] In this embodiment, when the heat inside the chassis converges, it is conducted and concentrated above the heat insulation plate 402 through the equally spaced side frames 403. At this time, the heat above the heat insulation plate 402 is conducted by the heat conduction coil 7. During this period, the heat above the heat insulation plate 402 will be conducted by the first water pipe 701 and the second water pipe 702. At the same time, the heat inside and outside the W-shaped copper tubes 404 is absorbed by the first water pipe 701 and the second water pipe 702. During this process, when the swing mechanism 5 works to drive the arc-shaped frame 301 to swing left and right, the microfiber cloth 302 on one side of the arc-shaped frame 301 can effectively adsorb the heat dissipation net, avoiding the adsorption of dust by the heat dissipation net on the side of the chassis during the operation of the chassis.

[0045] Embodiment 2:

[0046] The integrated heat dissipation module of the computer chassis, as Figure 2 、 Figure 4 、 Figure 5 、 Figure 8As shown in the figure, in order to effectively adsorb the heat dissipation net and ensure the working quality of the heat dissipation net; the swing mechanism 5 includes a rotating shaft 501, a fixed seat 502, a first screw 503, a Z-shaped guide rod 504, a swing rod 505, a second screw 506, a servo motor 507, a connecting rod 508 and a clamping projection 509. The fixed seat 502 is fixedly connected to both sides of the top of the mounting plate 1. The first screw 503 and the second screw 506 are rotatably connected to the inside of the two fixed seats 502 through bearings. The servo motor 507 is fixedly connected to one side of the top of the mounting plate 1 through bolts. The output end of the servo motor 507 is connected to the end of the second screw 506 through threads. The two Z-shaped guide rods 504 are respectively sleeved on the circumferences of the first screw 503 and the second screw 506. The two Z-shaped guide rods 504 are centrosymmetric. The two swing rods 505 are rotatably connected to the ends of the two Z-shaped guide rods 504;

[0047] The rotating shaft 501 is rotatably connected to one side of the top of the mounting plate 1. The connecting rod 508 is threadedly connected to the top circumference of the rotating shaft 501. The two ends of the connecting rod 508 form a rotational fit with the ends of the two swing rods 505. The clamping projections 509 are fixedly connected to both sides of the top of the connecting rod 508. The clamping projections 509 and the clamping holes 304 are in interference connection with each other. The first screw 503 and the second screw 506 are connected through a clamping component. The model of the servo motor 507 is SG90;

[0048] By starting the servo motor 507 to drive the second screw 506 to rotate, the rotating second screw 506 synchronously drives the first screw 503 to rotate. At this time, the Z-shaped guide rods 504 on the circumferences of the first screw 503 and the second screw 506 move in opposite directions. At this time, the swing rod 505 on the circumference of the second screw 506 drives the Z-shaped guide rod 504 at its end downward, and the swing rod 505 on the circumference of the first screw 503 drives the Z-shaped guide rod 504 at its end upward. Thereby driving the connecting rod 508 to rotate around the rotating shaft 501 by a certain angle, so that the adsorption component 3 on the connecting rod 508 adheres to the heat dissipation net, promoting the microfiber cloth 302 to adsorb the dust on the heat dissipation net, effectively ensuring the removal of the dust on the heat dissipation net and ensuring the working quality of the heat dissipation net.

[0049] The clamping component includes a protrusion 510, a clamping groove 511, a fixed ball 512 and a spherical groove 513. The protrusions 510 are respectively arranged at the top of the first screw 503 and the bottom of the second screw 506. The spherical groove 513 is opened at the end of the second screw 506. The fixed ball 512 is fixedly connected to the end of the first screw 503. The clamping grooves 511 are respectively opened at the top of the first screw 503 and the bottom of the second screw 506. The protrusion 510 and the clamping groove 511 are mutually fitted and clamped. The fixed ball 512 and the spherical groove 513 are mutually adsorbed;

[0050] When the first screw 503 is butted against the second screw 506, the protrusions 510 on the first screw 503 and the second screw 506 are engaged with the card slots 511, and the fixing balls 512 at the end of the first screw 503 are adsorbed in the spherical grooves 513 of the second screw 506, effectively realizing the butting of the first screw 503 and the second screw 506. This not only effectively promotes the connection and fixation of the first screw 503 and the second screw 506, ensuring the synchronization of their rotations, but also facilitates the loading, unloading and replacement of the first screw 503 and the second screw 506.

[0051] As described above, only the preferred specific embodiments of the present invention are given, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered within the protection scope of the present invention.

Claims

1. An integrated heat dissipation module for a computer chassis, comprising a mounting plate (1) fixed to the inner cavity of the chassis, characterized in that, A swing mechanism (5) is provided at the top of the mounting plate (1), and an adsorption component (3) is clamped at the end of the swing mechanism (5). A heat dissipation component (4) is provided at the top of the swing mechanism (5), and heat conduction coils (7) are wound around the inside and outside of the heat dissipation component (4). Fixing screws (2) are provided at the four corners of the top of the mounting plate (1); The swing mechanism (5) includes a rotating shaft (501), a fixed seat (502), a first screw (503), a Z-shaped guide rod (504), a swing rod (505), a second screw (506), a servo motor (507), a connecting rod (508) and a clamping projection (509). The fixed seat (502) is fixedly connected to both sides of the top of the mounting plate (1). The first screw (503) and the second screw (506) are rotatably connected to the inside of the two fixed seats (502) through bearings. The servo motor (507) is fixedly connected to one side of the top of the mounting plate (1) through bolts. The output end of the servo motor (507) is connected to the end of the second screw (506) through threads. The two Z-shaped guide rods (504) are respectively sleeved on the circumferences of the first screw (503) and the second screw (506). The two Z-shaped guide rods (504) are centrosymmetric. The two swing rods (505) are rotatably connected to the ends of the two Z-shaped guide rods (504). The rotating shaft (501) is rotatably connected to one side of the top of the mounting plate (1). The connecting rod (508) is arranged on the top circumference of the rotating shaft (501). The two ends of the connecting rod (508) form a rotating fit with the ends of the two swing rods (505). The clamping projections (509) are fixedly connected to both sides of the top of the connecting rod (508), and the clamping projections (509) are in interference connection with the clamping holes (304). The first screw (503) and the second screw (506) are connected through a clamping component; The clamping component includes a protrusion (510), a clamping groove (511), a fixed ball (512) and a spherical groove (513). The protrusions (510) are respectively arranged on the top of the first screw (503) and the bottom of the second screw (506). The spherical groove (513) is opened at the end of the second screw (506). The fixed ball (512) is fixedly connected to the end of the first screw (503). The clamping grooves (511) are respectively opened on the top of the first screw (503) and the bottom of the second screw (506). The protrusion (510) is in close fit and clamping connection with the clamping groove (511). The fixed ball (512) and the spherical groove (513) are adsorbed to each other.

2. The integrated heat dissipation module for a computer chassis according to claim 1, wherein The heat dissipation component (4) includes a fixed frame (401), a heat insulation plate (402), a side frame (403), a W-shaped copper tube (404), a top frame (405) and a slot (406). The two fixed frames (401) are connected to the inner wall of the chassis through bolts. The slots (406) are opened at the four corners on the opposite sides of the two fixed frames (401). The W-shaped copper tube (404) is inserted into the slots (406) internally, and the side frames (403) are welded to the outer surface of the W-shaped copper tube (404) at equal intervals in sequence.

3. The integrated heat dissipation module for a computer chassis according to claim 2, characterized in that, The top frame (405) is welded to the top of the side frame (403), and the heat insulation plate (402) is interference-fitted to the middle of the bottom of the fixed frame (401). Temperature sensors (8) are respectively arranged on the outer walls of the tops of the two fixed frames (401).

4. The integrated heat dissipation module for a computer chassis according to claim 1, wherein The heat conduction coil (7) includes a first water pipe (701) and a second water pipe (702). The inner sides of the first water pipe (701) and the second water pipe (702) pass through the interiors of equidistantly arranged W-shaped copper tubes (404). The first water pipe (701) and the second water pipe (702) are integrally formed, and the water inlet ends of the first water pipe (701) and the second water pipe (702) are connected and fixed through a connecting sleeve (6).

5. The integrated heat dissipation module for a computer chassis according to claim 1, wherein, The adsorption assembly (3) includes an arc-shaped frame (301), a microfiber cloth (302), a groove (303), and a card hole (304). The arc-shaped frame (301) is clamped to the swinging end of the swinging mechanism (5) through the card hole (304). The groove (303) is opened inside the arc-shaped frame (301), the card holes (304) are opened on both sides of the bottom inner wall of the groove (303), and the microfiber cloth (302) is fixedly connected to the side of the arc-shaped frame (301).

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