Display panel, preparation method thereof and display device

Abstract

A display panel includes: a driving substrate; an anode layer disposed on the driving substrate, the anode layer including a plurality of anodes; an isolation structure layer disposed on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; a plurality of stack structures, one stack structure at least partially located within one of the first openings; the stack structure including a first light-emitting layer, a charge generation layer, a second light-emitting layer, and a cathode layer stacked in a direction away from the driving substrate; an insulating structure disposed between an edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure including the isolation structure layer and / or a stack structure adjacent to the stack structure.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel, a manufacturing method thereof, and a display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display technology is a technology that uses light-emitting materials to emit light under the drive of current to realize display. OLED display has the advantages of ultra-light, ultra-thin, high brightness, large viewing angle, low voltage, low power consumption, fast response, high definition, shock resistance, bendable, low cost, simple process, less use of raw materials, high luminous efficiency, and wide temperature range.

[0003] Tandem Organic Light Emitting Diode (Tandem OLED) is an OLED device structure formed by stacking multiple conventional OLED devices in series through a charge generation layer (CGL). The display panel manufactured by using Tandem OLED technology has the characteristics of high brightness, low power consumption, and long service life. SUMMARY

[0004] In one aspect, a display panel is provided. The display panel includes: a driving substrate; an anode layer disposed on the driving substrate, the anode layer including a plurality of anodes; an isolation structure layer disposed on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; a plurality of stack structures, one stack structure at least partially located in one of the first openings; the stack structure including a first light-emitting layer, a charge generation layer, a second light-emitting layer, and a cathode layer stacked in a direction away from the driving substrate; an insulating structure disposed between an edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure including the isolation structure layer and / or a stack structure adjacent to the stack structure.

[0005] In some embodiments, the insulating structure includes: a first groove, the first groove being located within a range of the first opening, the first groove spacing a part of the edge of the stack structure and a conductive structure adjacent to the part of the edge of the stack structure.

[0006] In some embodiments, the first groove is located within a boundary range of the stack structure, and the first groove is adjacent to a spacing between a boundary of the isolation structure layer and a boundary of the stack structure.

[0007] In some embodiments, a part of an edge of the stack structure is recessed towards a center of the first opening to form a notch, and the notch and the isolation structure layer enclose the first groove.

[0008] In some embodiments, the display panel further comprises a pixel definition layer located on a side of the isolation structure layer close to the driving substrate; the pixel definition layer defines a plurality of second openings, one of which is located within a range of one of the first openings, and one of the second openings overlaps one of the anodes; the first groove is located between a boundary of the second opening and a boundary of the first opening.

[0009] In some embodiments, the insulating structure comprises a first groove located between two adjacent stack structures, and the first groove cuts off the isolation structure layer between the two adjacent stack structures.

[0010] In some embodiments, the isolation structure layer comprises a plurality of first isolation portions and a plurality of second isolation portions, the plurality of first isolation portions and the plurality of second isolation portions are arranged in a cross shape to define a plurality of the first openings; a part of at least one of the first isolation portions and the second isolation portions for enclosing the first opening is cut off by the first groove.

[0011] In some embodiments, in two of the stack structures adjacent to two sides of the first groove, a part of an edge of at least one of the stack structures is recessed towards a center of the first opening to form a part of a boundary of the first groove.

[0012] In some embodiments, a periphery of one of the stack structures is provided with at least two first grooves, and the at least two first grooves are arranged at intervals around the stack structure.

[0013] In some embodiments, the cathode layer comprises a first sub-portion and a second sub-portion; the first sub-portion overlaps the anode in a direction perpendicular to the driving substrate; the second sub-portion passes through a gap between two adjacent first grooves, one end of the second sub-portion is electrically connected to the first sub-portion, and the other end of the second sub-portion is electrically connected to the isolation structure layer.

[0014] In some embodiments, the cathode layer further comprises a third sub-portion located between the first groove and a boundary of the first opening, the third sub-portion is electrically connected to the second sub-portion and the isolation structure layer.

[0015] In some embodiments, the first groove at least penetrates the cathode layer, the second light-emitting layer, and the charge generation layer.

[0016] In some embodiments, in the first recess, edges of at least the cathode layer, the second light-emitting layer and the charge generation layer in the stack structure are aligned or substantially aligned in a direction perpendicular to the driving substrate.

[0017] In some embodiments, the insulating structure comprises: an insulating portion covering part of the sidewall of the first opening and located between part of the edge of the stack structure and the isolation structure layer.

[0018] In some embodiments, the isolation structure layer comprises: a first sub-isolation layer, a second sub-isolation layer and a third sub-isolation layer sequentially stacked in a direction away from the driving substrate, the side surface of the second sub-isolation layer is recessed relative to the side surface of the first sub-isolation layer and the side surface of the third sub-isolation layer; the insulating portion covers the side surface of the third sub-isolation layer, part of the surface of the third sub-isolation layer beyond the second sub-isolation layer close to the driving substrate and the side surface of the second sub-isolation layer.

[0019] In some embodiments, the display panel further comprises: a first insulating layer disposed on the side of the isolation structure layer away from the driving substrate, and the insulating portion is made of the same material as the first insulating layer and is connected thereto.

[0020] In some embodiments, the plurality of stack structures comprises at least a first stack structure and a second stack structure, the light-emitting color of the first stack structure is different from the light-emitting color of the second stack structure; the display panel further comprises: a first encapsulation sub-layer located on the side of the first stack structure away from the driving substrate, and a second encapsulation sub-layer located on the side of the second stack structure away from the driving substrate; the insulating portion between the second stack structure and the isolation structure layer comprises a first sub-layer made of the same material as the first encapsulation sub-layer.

[0021] In some embodiments, the plurality of stack structures further comprises a third stack structure, the light-emitting colors of the first stack structure, the second stack structure and the third stack structure are different; the insulating portion between the third stack structure and the isolation structure layer comprises a second sub-layer made of the same material as the first encapsulation sub-layer.

[0022] In some embodiments, the insulating structure further comprises: a second recess; the second recess is located within the range of the first opening, and the second recess separates part of the edge of the first stack structure and the isolation structure layer adjacent to part of the edge of the first stack structure; or, the second recess is located between the first stack structure and the stack structure adjacent to the first stack structure, and the second recess cuts off the isolation structure layer adjacent to the first stack structure.

[0023] In some embodiments, the periphery of one of the first stack structures is provided with at least one of the second grooves and at least one of the insulating portions, and the at least one of the second grooves and the at least one of the insulating portions are arranged at intervals around the first stack structure; the periphery of one of the second stack structures and / or one of the third stack structures is provided with at least two of the insulating portions, and the at least two of the insulating portions are arranged at intervals around the second stack structure or the third stack structure.

[0024] In another aspect, a method for manufacturing a display panel is provided. The method includes: forming an anode layer on a driving substrate, the anode layer comprising a plurality of anodes; forming an isolation structure layer on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; forming a plurality of stack structures, one stack structure at least partially located in one of the first openings; the stack structure comprising a first light-emitting layer, a charge generation layer, a second light-emitting layer, and a cathode layer arranged in a stack in a direction away from the driving substrate; and forming an insulating structure between an edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure comprising the isolation structure layer and / or a stack structure adjacent to the stack structure.

[0025] In some embodiments, the forming of the insulating structure comprises: etching the stack structure to form a first groove, the first groove serving as the insulating structure; wherein the first groove is located within the range of the first opening, and the first groove separates a part of the edge of the stack structure and the isolation structure layer adjacent to the part of the edge of the stack structure; or etching the isolation structure layer to form a first groove, the first groove serving as the insulating structure; wherein the first groove is located between two adjacent stack structures, and the first groove cuts off the isolation structure layer between the two adjacent stack structures.

[0026] In some embodiments, the forming of the insulating structure comprises: forming an insulating portion, the insulating portion serving as the insulating structure; wherein the insulating portion covers a part of the sidewall of the first opening, and is located between a part of the edge of the stack structure and the isolation structure layer.

[0027] In some embodiments, the forming the plurality of stacked structures and the forming the insulating part comprises: sequentially forming a first stacked structure film and a first encapsulation film; the first stacked structure film covers the plurality of first openings and the isolation structure layer, and the first encapsulation film covers the first stacked structure; removing the first stacked structure film and the first encapsulation film located in a second target opening in the plurality of first openings to form a first stacked structure, a first encapsulation sub-layer, and a first sub-layer; wherein the first stacked structure film located in a first target opening in the plurality of first openings forms the first stacked structure, the first encapsulation film located in the first target opening forms the first encapsulation sub-layer, and the first encapsulation film covering the sidewall of the second target opening forms the first sub-layer; the first sub-layer serves as the insulating part; forming a second stacked structure in the second target opening; the light-emitting color of the second stacked structure is different from the light-emitting color of the first stacked structure.

[0028] In yet another aspect, a display device is provided. The display device includes the display panel according to any of the above embodiments, a circuit board, and the display panel is electrically connected with the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described in the following description are only the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, etc. of the product related to the embodiments of the present disclosure.

[0030] Figure 1 A structural diagram of a display device according to some embodiments;

[0031] Figure 2 A structural diagram of a display panel according to some embodiments;

[0032] Figure 3 A structural diagram of another display panel according to some embodiments;

[0033] Figure 4 A structural diagram in the preparation process of a display panel according to some embodiments;

[0034] Figure 5 A structural diagram in the preparation process of another display panel according to some embodiments;

[0035] Figure 6 A partial structural diagram of a display panel according to some embodiments;

[0036] Figure 7 A partial structure diagram of another display panel according to some embodiments;

[0037] Figure 8 A structure diagram of yet another display panel according to some embodiments;

[0038] Figure 9 A partial top view of a display panel according to some embodiments;

[0039] Figure 10 A structure diagram of yet another display panel according to some embodiments;

[0040] Figure 11 A partial top view of another display panel according to some embodiments;

[0041] Figure 12 A structure diagram of yet another display panel according to some embodiments;

[0042] Figure 13 A partial top view of yet another display panel according to some embodiments;

[0043] Figure 14 A structure diagram of yet another display panel according to some embodiments;

[0044] Figure 15 A partial top view of yet another display panel according to some embodiments;

[0045] Figure 16 A structure diagram of yet another display panel according to some embodiments;

[0046] Figure 17 A partial top view of yet another display panel according to some embodiments;

[0047] Figure 18 A flow chart of a method for manufacturing a display panel according to some embodiments;

[0048] Figures 19-25 A cross-sectional structure diagram corresponding to each step in a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0050] Unless the context clearly requires otherwise, throughout the description and the claims, the term "comprise," and variations thereof (e.g., "comprises" and "comprising"), will be construed to be inclusive in a manner consistent with the term's plain meaning, namely, "including but not limited to." In describing the description, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example" or "some examples," and the like, mean that a particular feature, structure, material, or characteristic is included in at least one embodiment or example of the disclosure, but that it can not be included in other embodiments or examples. The illustrative appearance of the foregoing terms in various places in the description are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0051] Hereinafter, the terms "first", "second", etc. are used only for the purpose of description and should not be construed as indicating or implying relative importance or implying the number of the technical features indicated. Thus, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the disclosure, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0052] In describing some embodiments, "coupled" and "connected," and variations thereof, can be used. The term "connected" should be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components have direct physical contact or electrical contact. The term "coupled" or "communicatively coupled" can also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0053] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C", and includes the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0054] "A and / or B" includes the following three combinations: only A, only B, and a combination of A and B.

[0055] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0056] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the scale of the layers and regions can be shown in the drawings, which can distort the representation of the actual sizes of the layers and regions. Thus, the exemplary embodiments should not be construed as limited to the precise shapes and dimensions illustrated in the drawings, but rather, the exemplary embodiments are to include shapes and dimensions that are within the scope of what is illustrated in the drawings. For example, etched regions shown as rectangular will typically have curved features. Thus, the regions illustrated in the drawings are schematic and not intended to be limiting of the actual shapes of the regions of the devices, and are not intended to limit the scope of the exemplary embodiments.

[0057] Some embodiments of the disclosure provide a display device that can be any display device that displays images whether in motion (e.g., video) or stationary (e.g., a still image) and whether textual or pictorial. More specifically, it is contemplated that the display devices of the described embodiments can be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projections, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry) and the like.

[0058] Figure 1 A structural diagram of a display device according to some embodiments. As shown in the figure, the display device 1000 includes a frame 100, a cover plate 200, a display panel 300, a circuit board 400, and other electronic components including a camera. Figure 1 As shown in the figure, the display device 1000 includes a frame 100, a cover plate 200, a display panel 300, a circuit board 400, and other electronic components including a camera.

[0059] The longitudinal section of the frame 100 is in a U shape, the display panel 300, the circuit board 400, and other electronic components including a camera are arranged in the frame 100, the circuit board 400 is located between the display panel 300 and the frame 100, and the cover plate 200 is located on the light-out side of the display panel 300. Wherein, the side of the display panel 300 for displaying images is the light-out side of the display panel 300, and the side of the display panel 300 facing away from the light-out side of the display panel 300 is the non-light-out side of the display panel 300.

[0060] For example, the circuit board 400 is located on the non-light-emitting side of the display panel 300, and the circuit board 400 is electrically connected to the display panel 300. The circuit board 400 is used to provide driving signals to the display panel 300, thereby ensuring the normal display of the display panel 300.

[0061] For example, the display panel 300 described above can be: an organic light-emitting diode (OLED).

[0062] OLED (Light Emitting Diode) display panels, quantum dot light-emitting diodes (LEDs)

[0063] This disclosure does not specifically limit the types of display panels, such as those using QLED (Quick Light Emitting Diodes), Micro LED (Micro Light Emitting Diodes), or Mini LED (Mini Light Emitting Diodes). The following description uses the aforementioned display panel 300 as an example of an OLED display panel to illustrate some embodiments of this disclosure.

[0064] In some examples, such as Figure 2 and Figure 3 As shown, the display panel 300 includes a driving substrate 1 and multiple light-emitting devices 2.

[0065] For example, such as Figure 2 As shown, the driving substrate 1 includes a substrate 11 and a circuit structure layer 12 stacked sequentially.

[0066] For example, the types of substrate 11 mentioned above include various types, and can be selected and set according to actual needs.

[0067] For example, the substrate 11 described above can be a rigid substrate. This rigid substrate can be a glass substrate or a polymethyl methacrylate (PMMA) substrate, etc.

[0068] For example, the substrate 11 described above can be a flexible substrate. This flexible substrate can be a polyethylene terephthalate (PET) substrate, a polyethylene naphthalate (PEN) substrate, or a polyimide (PI) substrate, etc. In this case, the display panel 300 can, for example, achieve a flexible display.

[0069] Optionally, the substrate 11 can be formed as a single layer, a double layer, or a multilayer. The embodiments of this disclosure do not limit this.

[0070] For example, the circuit structure layer 12 described above is disposed on the substrate 11. It is understood that the circuit structure layer 12 refers to the film layer containing the array of multiple pixel driving circuits, including multiple patterned conductive layers and insulating layers. For example, the circuit structure layer 12 includes multiple pixel driving circuits 120 and multiple signal lines, etc.

[0071] The pixel driving circuit 120 is generally composed of electronic devices such as thin-film transistors (TFTs) and capacitors. For example, the pixel driving circuit 120 can specifically be a structure such as "2T1C", "6T1C", "7T1C", "6T2C", or "7T2C". Here, "T" represents a transistor, such as a thin-film transistor. The number before "T" indicates the number of transistors. "C" represents a capacitor, and the number before "C" indicates the number of capacitors. In the accompanying drawings of some embodiments of this disclosure, only one thin-film transistor 121 is shown as an example. For example, the thin-film transistor 121 can be a driving transistor.

[0072] It is understood that the thin-film transistors included in the pixel driving circuit 120 can be top-gate thin-film transistors or bottom-gate thin-film transistors, and this disclosure does not limit this. For example, Figure 2 The thin-film transistor 121 shown is a top-gate thin-film transistor.

[0073] In addition, the plurality of thin-film transistors 121 may include low-temperature polysilicon thin-film transistors (LTPS TFTs) and / or metal oxide thin-film transistors (Oxide TFTs).

[0074] like Figure 2 As shown, the light-emitting device 2 is located on the driving substrate 1.

[0075] The light emitting device 2 and the pixel driving circuit 120 in the driving substrate 1 are electrically connected. The pixel driving circuit 120 can provide a driving signal for the light emitting device 2 to drive the light emitting device 2 to emit light.

[0076] The electrical connection relationship between the light emitting device 2 and the pixel driving circuit 120 can include various examples, which can be selected and arranged according to actual needs, and the present disclosure does not limit this.

[0077] For example, the plurality of pixel driving circuits 120 and the plurality of light emitting devices 2 can be one-to-one coupled. For another example, one pixel driving circuit 120 can be coupled with a plurality of light emitting devices 2. For another example, a plurality of pixel driving circuits 120 can be coupled with one light emitting device 2.

[0078] Hereinafter, the present disclosure will take one pixel driving circuit 120 coupled with one light emitting device 2 as an example to schematically describe the structure of the display panel 300.

[0079] For example, in the display panel 300, the pixel driving circuit 120 can generate a driving signal, each light emitting device 2 can emit light under the driving action of the driving signal generated by the corresponding pixel driving circuit 120, and the light emitted by the plurality of light emitting devices 2 cooperates with each other, so that the display panel 300 realizes image display.

[0080] For example, the above-mentioned light emitting device 2 can be a Tandem OLED light emitting device.

[0081] For example, as shown in Figure 2 and Figure 3 The light emitting device 2 includes an anode 21, a cathode layer 22, a plurality of light emitting layers 23 stacked between the anode 21 and the cathode layer 22, and a charge generation layer 24 arranged between any adjacent light emitting layers 23. The plurality of light emitting layers 23, the charge generation layer 24, and the cathode layer 22 can be referred to as a stacked structure 20.

[0082] The anode 21 is closer to the driving substrate 1 than the cathode layer 22. In this way, the anode 21 can be electrically connected to the drain of a thin film transistor 121 used as a driving transistor in the pixel driving circuit 120.

[0083] For example, the number of light emitting layers 23 can be two, three, or other numbers, which are not limited here.

[0084] For example, as shown in Figure 2 and Figure 3 , Figure 2 and Figure 3 both show two light emitting layers 23. Specifically, as shown in Figure 3As shown, the light-emitting layer 23 comprises a first light-emitting layer 231 and a second light-emitting layer 232. The first light-emitting layer 231 and the second light-emitting layer 232 are arranged in sequence away from the driving substrate 1.

[0085] In addition, the plurality of light-emitting layers 23 in the same light-emitting device 2 emit light rays of the same or similar color. In this way, the concentration of the spectral superposition of the plurality of light-emitting layers 23 in the same light-emitting device 2 can be improved, and the color purity and the light-emitting efficiency of the light-emitting device 2 can be improved.

[0086] For example, as shown in FIG. 1, the light-emitting device 2 comprises a driving substrate 1, a first electrode 21, a second electrode 22, a light-emitting layer 23, and a charge generation layer 24. Figure 3 As shown, the charge generation layer 24 comprises an N-type charge generation layer (N-CGL) 241 and a P-type charge generation layer (P-CGL) 242 arranged in sequence.

[0087] The N-type charge generation layer 241 is closer to the first light-emitting layer 231 than the P-type charge generation layer 242, so that electrons can be provided to the first light-emitting layer 231. The P-type charge generation layer 242 is closer to the second light-emitting layer 232 than the N-type charge generation layer 241, so that holes can be provided to the second light-emitting layer 232.

[0088] For example, the materials of the N-type charge generation layer 241 and the P-type charge generation layer 242 can include metals, non-doped organic matter, P-type and N-type doped organic PN junctions, metal oxides, etc., which are not limited here.

[0089] For example, the first light-emitting layer 231 and the second light-emitting layer 232 form a tandem structure in series through the charge generation layer 24, and the charge generation layer 24 is arranged between any adjacent light-emitting layers 23 (for example, the first light-emitting layer 231 and the second light-emitting layer 232 described above) to improve the injection ability of the charge carriers, thereby effectively improving the light-emitting efficiency of the light-emitting device 2 and prolonging the service life of the light-emitting device 2. In addition, the light-emitting efficiency of the light-emitting device 2 can be multiplied with the increase in the number of light-emitting layers 23, and the service life of the light-emitting device 2 can be exponentially increased at the same brightness.

[0090] It should be noted that the light emitting device 2 can further include one or more of an election transporting layer (ETL), an election injection layer (EIL), a hole blocking layer (HBL), a hole transporting layer (HTL), an electron blocking layer (EBL), and a hole injection layer (HIL) in addition to the anode 21, the cathode layer 22, and the plurality of light emitting layers 23.

[0091] As shown in FIG. 2A, the light emitting device 2 can further include a first hole transporting layer (HTL) 25 between the first light emitting layer 231 and the anode 21. The first hole transporting layer 25 can be configured to improve the transportability of holes. Figure 3

[0092] Optionally, the light emitting device 2 can further include a first hole injection layer (HIL) between the first hole transporting layer 25 and the anode 21. The first hole injection layer can be configured to reduce the injection barrier of holes.

[0093] As shown in FIG. 2A, the light emitting device 2 can further include a first hole blocking layer (HBL) 26 between the first light emitting layer 231 and the charge generation layer 24. The first hole blocking layer 26 can be configured to impede the transportability of electrons. Figure 3

[0094] As shown in FIG. 2A, the light emitting device 2 can further include a second hole blocking layer (HBL) 27 between the second light emitting layer 232 and the cathode layer 22. The second hole blocking layer 27 can be configured to impede the transportability of electrons. Figure 3

[0095] Optionally, the light emitting device 2 can further include an electron transporting layer (EIL) between the second hole blocking layer 27 and the cathode layer 22. The electron transporting layer can be configured to improve the transportability of electrons.

[0096] In some examples, as shown in FIG. 2A, the light emitting device 2 can further include a first hole transporting layer (HTL) 25 between the first light emitting layer 231 and the anode 21. The first hole transporting layer 25 can be configured to improve the transportability of holes. Figure 2 ​​​As shown, the display panel 300 further includes a pixel defining layer 3 disposed on the driving substrate 1, the pixel defining layer 3 defining a plurality of second openings 31, one of the second openings 31 overlapping an anode 21.

[0097] For example, a second opening 31 exposes the entirety of an anode 21. Also for example, a second opening 31 exposes a portion of an anode 21, another portion of which is covered by the pixel-defining layer 3. Embodiments of this disclosure are not intended to be limiting.

[0098] For example, the shapes of the plurality of second openings 31 can be various, such as circular, quadrilateral, pentagonal, hexagonal, etc., and the embodiments of this disclosure do not limit them.

[0099] When the driving substrate 1 includes a substrate 11 and a circuit structure layer 12 stacked sequentially, the pixel defining layer is disposed on the side of the circuit structure layer 12 away from the substrate 11.

[0100] In some examples, such as Figure 2 As shown, the display panel 300 also includes a planarization layer 01 located between the driving substrate 1 and the light-emitting device 2. The planarization layer 01 is used to provide a flat surface for the plurality of light-emitting devices 2.

[0101] In one implementation, such as Figure 4 As shown, a groove 101 is designed on the planarization layer 01. This groove 101 is offset from the second opening 31 of the pixel defining layer 3. The surface of the pixel defining layer 3 adjacent to the groove 101 that is away from the planarization layer 01 has a large step difference with the surface of the planarization layer 01 near the pixel defining layer 3. During the formation of the stacked structure 20 (including the light-emitting layer 23, charge-generating layer 24, and cathode layer 22 of the light-emitting device 2), the entire stacked structure film is formed first. Due to the large step difference, the stacked structure on the surface of the pixel defining layer 3 adjacent to the groove 101 that is away from the driving substrate 1 is separated from the stacked structure in the groove 101. The stacked structure 20 on the surface of the pixel defining layer 3 that is away from the driving substrate 1 contacts the anode 21 to form the light-emitting device 2. The stacked structure located in the groove 101 can be removed.

[0102] However, in the above implementation methods, combined with Figure 5 and Figure 6As shown, at the groove 101, the cathode layer 22 may wrap around the light-emitting layer 23 and the charge-generating layer 24 near the edge of the groove 101. This causes the cathode layer 22 to come into contact with the charge-generating layer 24, resulting in leakage from the cathode layer 22 to the charge-generating layer 24 during operation of the light-emitting device 2. This leads to a decrease in the luminous efficiency of the light-emitting device 2. Specifically, leakage from the cathode layer 22 to the charge-generating layer 24 reduces the voltage difference between the anode 21 and the cathode layer 22 of the light-emitting device 2, resulting in insufficient light emission from the light-emitting device 2.

[0103] In other implementations, such as Figure 7 As shown, the display panel 300 further includes an isolation structure layer 4 disposed on the driving substrate 1. The isolation structure layer 4 has a plurality of first openings 41, one of which overlaps with an anode 21. The top view of the isolation structure layer 4 resembles a grid, and the plurality of first openings 41 constitute the mesh of the grid structure.

[0104] For example, the isolation structure layer 4 can be a stacked structure of metallic materials. The metallic material can be a pure metal or a metal compound. Metallic materials include titanium (Ti), aluminum (Al), molybdenum (Mo), or other ferrous metals. For example, the isolation structure layer 4 can be a Ti / Al / Ti stacked structure. As another example, the isolation structure layer 4 can be a Mo / Al / Mo stacked structure. The isolation structure layer 4 can have two, three, or more layers. The embodiments of this disclosure are not limited in this regard. It is only necessary to ensure that the isolation structure layer 4 has an undercut structure.

[0105] For example, the cross-sectional shape of the isolation structure layer 4 is an "I" shape, a "T" shape, or an inverted trapezoidal shape, etc. For example, as Figure 7 As shown, the cross-sectional view of the isolation structure layer 4 has an "I" shaped structure.

[0106] For example, the orthographic projection of an anode 21 on the driving substrate 1 is located within the orthographic projection of a first opening 41 on the driving substrate 1.

[0107] In the case where the display panel 300 also includes an isolation structure layer 4, the cathode layers 22 of two adjacent light-emitting devices 2 are spaced apart and not directly connected. However, the two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4 to ensure that the light-emitting layers 23 in each light-emitting device 2 can receive approximately the same electrical signal transmitted from the cathode layers 22. This helps improve the accuracy of the electrical signals received by multiple light-emitting layers 23, thereby improving the display uniformity of the display panel 300.

[0108] For example, such as Figure 7As shown, in the first opening 41, the stack structure 20 (including the light-emitting layer 23, the charge generation layer 24 and the cathode layer 22 of the light-emitting device 2) is in contact with the isolation structure layer 4 near the edge of the isolation structure layer 4. That is, the edge of the charge generation layer 24 in the stack structure 20 is in contact with the isolation structure layer 4. It should be noted that Figure 7 In the above, only the charge generation layer 24 and the cathode layer 22 in the stack structure 20 are shown, and other film layers in the stack structure 20 are not labeled in detail.

[0109] As can be seen from the above, the cathode layer 22 is electrically connected to the isolation structure layer 4. During the operation of the light-emitting device 2, the charge generation layer 24 and the cathode layer 22 are indirectly connected through the isolation structure layer 4. The cathode layer 22 will leak current to the charge generation layer 24 through the isolation structure layer 4, resulting in a smaller voltage difference between the anode 21 and the cathode layer 22 of the light-emitting device 2, thereby causing the light-emitting efficiency of the light-emitting device 2 to decrease, causing the light-emitting device 2 to emit light insufficiently, and further affecting the display effect of the display panel 300.

[0110] Based on this, in an embodiment of the present disclosure, a display panel 300 is provided.

[0111] As shown in the above, Figure 8 The display panel 300 includes a driving substrate 1, an anode layer 02, an isolation structure layer 4, a plurality of stack structures 20, and an insulating structure 5.

[0112] The anode layer 02 is disposed on the driving substrate 1, and the anode layer 02 includes a plurality of anodes 21. The isolation structure layer 4 is disposed on the driving substrate 1. The isolation structure layer 4 has a plurality of first openings 41, and one first opening 41 overlaps one anode 21. One stack structure 20 is at least partially located in one first opening 41.

[0113] For example, the stack structure 20 includes a first light-emitting layer 231, a charge generation layer 24, a second light-emitting layer 232, and a cathode layer 22 which are stacked in a direction away from the driving substrate 1. It should be noted that Figure 8 In the above, only the charge generation layer 24 and the cathode layer 22 in the stack structure 20 are shown, and other film layers in the stack structure 20 are not labeled in detail.

[0114] As shown in the above, Figure 8 and Figure 9 The insulating structure 5 is disposed between the edge of the stack structure 20 and a conductive structure 6 adjacent to the stack structure 20. The conductive structure 6 includes the isolation structure layer 4 and / or the stack structure 20 adjacent to the stack structure 20.

[0115] The insulating structure 5 is arranged between the edge of the laminated structure 20 and the conductive structure 6 adjacent to the laminated structure 20, so that the edge of the laminated structure 20 and the conductive structure 6 adjacent to the laminated structure 20 are spaced apart from each other and are not connected and in contact.

[0116] As shown in Figure 9 , the edge of the laminated structure 20 and the isolation structure layer 4 are insulated by the insulating structure 5; at the same time, the edge of the laminated structure 20 and the isolation structure layer 4 are electrically connected, so as to realize the electrical connection between the two adjacent cathode layers 22.

[0117] As shown in Figure 8 and Figure 9 , the number of insulating structures 5 can be multiple.

[0118] In addition, the number of insulating structures 5 corresponding to one first opening 41 can be one or multiple. Embodiments of the present disclosure do not limit this.

[0119] As shown in Figure 8 and Figure 9 , the insulating structure 5 is arranged between the edge of the laminated structure 20 and the isolation structure layer 4. As shown in , the conductive structure 6 includes the isolation structure layer 4 and the laminated structure 20 adjacent to the laminated structure 20, and the insulating structure 5 is arranged between the two laminated structures 20.

[0120] In this embodiment, by arranging the insulating structure 5 between the edge of the laminated structure 20 and the conductive structure 6 (including the isolation structure layer 4 and / or the laminated structure 20 adjacent to the laminated structure 20) adjacent to the laminated structure 20, the insulating structure 5 is arranged between the edge of the laminated structure 20 and the conductive structure 6 (including the isolation structure layer 4 and / or the laminated structure 20 adjacent to the laminated structure 20) adjacent to the laminated structure 20, and the insulating structure 5 is arranged between the two laminated structures 20. As shown in

[0121] In addition, in some examples, the charge generation layers 24 in the plurality of laminated structures 20 are connected to each other to form an integral charge generation layer 24, which can reduce the probability of crosstalk between the plurality of light emitting devices 2 on the basis of reducing the probability of leakage of the cathode layer 22 to the charge generation layer 24.

[0122] In some embodiments, in combination with Figure 8 andFigure 9 As shown, the insulating structure 5 comprises a first recess 51, the first recess 51 is located in the range of the first opening 41, and the first recess 51 separates the part of the edge of the laminated structure 20 and the conductive structure 6 adjacent to the part of the edge of the laminated structure 20.

[0123] Exemplarily, the number of the first recess 51 corresponding to one first opening 41 can be one or more. Embodiments of the present disclosure do not limit this.

[0124] In some examples, the orthographic projection of the first recess 51 on the driving substrate 1 is located in the range of the orthographic projection of the first opening 41 on the driving substrate 1.

[0125] It should be noted that the above-mentioned "the first recess 51 separates the part of the edge of the laminated structure 20 and the conductive structure 6 adjacent to the part of the edge of the laminated structure 20" means that the first recess 51 insulates between the part of the edge of the laminated structure 20 and the conductive structure 6 adjacent to the part of the edge of the laminated structure 20.

[0126] In the embodiment, by setting the first recess 51, the part of the edge of the laminated structure 20 and the conductive structure 6 adjacent to the part of the edge of the laminated structure 20 are separated, and the insulation between the edge of the charge generation layer 24 in the laminated structure 20 and the conductive structure 6 adjacent to the edge of the charge generation layer 24 is achieved. In the working process of the light emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to the cathode layer 22, and is cut off at the edge of the conductive structure 6 adjacent to the cathode layer 22, thereby reducing the probability that the voltage on the cathode layer 22 in the laminated structure 20 leaks to the charge generation layer 24 through the conductive structure 6 adjacent to the laminated structure 20, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0127] It should be noted that there are many ways to set the first recess 51, which can be selected according to actual needs.

[0128] In an implementation manner, as shown in Figure 10 and Figure 11 The first recess 51 is located in the boundary range of the laminated structure 20, and the first recess 51 has a spacing between the boundary of the isolation structure layer 4 and the boundary of the laminated structure 20.

[0129] Exemplarily, in the case that the first recess 51 is located in the boundary range of the laminated structure 20, the conductive structure 6 comprises the isolation structure layer 4. The first recess 51 separates the part of the edge of the laminated structure 20 and the isolation structure layer 4, and achieves the insulation between the part of the edge of the laminated structure 20 and the isolation structure layer 4.

[0130] For example, the orthographic projection of the first groove 51 on the driving substrate 1 is located within the orthographic projection of the first opening 41 on the driving substrate 1, and there is a gap between the boundary of the orthographic projection of the first groove 51 on the driving substrate 1 and the boundary of the orthographic projection of the first opening 41 on the driving substrate 1.

[0131] For example, a plurality of first grooves 51 can be formed by etching the stacked structure 20. The sidewalls of the first grooves 51 are formed by a portion of the edge of the stacked structure 20.

[0132] By adopting the above configuration, the first groove 51 is used to separate a portion of the edge of the stacked structure 20 from the conductive structure 6 adjacent to the edge of the stacked structure 20, thereby achieving insulation between the portion of the edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent to it and then cut off at the edge of the adjacent conductive structure 6. This reduces the probability that the voltage on the cathode layer 22 in the stacked structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the stacked structure 20, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0133] In other implementations, such as Figure 8 and Figure 10 As shown, a portion of the edge of the laminated structure 20 is recessed towards the center of the first opening 41 to form a notch, and the notch and the isolation structure layer 4 form a first groove 51.

[0134] For example, in the case where a portion of the edge of the stacked structure 20 is recessed towards the center of the first opening 41 to form a notch, and the notch and the insulating structure layer 4 surround the first groove 51, the conductive structure 6 includes the insulating structure layer 4. The first groove 51 spaces the portion of the edge of the stacked structure 20 and the insulating structure layer 4.

[0135] For example, the orthographic projection of the first groove 51 on the driving substrate 1 is located within the orthographic projection of the first opening 41 on the driving substrate 1, and there is a partial overlap between the boundary of the orthographic projection of the first groove 51 on the driving substrate 1 and the boundary of the orthographic projection of the first opening 41 on the driving substrate 1.

[0136] For example, a plurality of first grooves 51 can be formed by etching the stacked structure 20. The sidewalls of the first grooves 51 are formed by a portion of the edge of the stacked structure 20 and a portion of the edge of the isolation structure layer 4.

[0137] In the embodiment, the first groove 51 is formed in the above manner to separate the partial edge of the laminated structure 20 and the isolation structure layer 4 adjacent to the partial edge of the laminated structure 20, so as to realize the insulation between the partial edge of the charge generation layer 24 in the laminated structure 20 and the isolation structure layer 4. In the working process of the light emitting device 2, the electrical signal on the cathode layer 22 is sequentially transmitted to the isolation structure layer 4 and then cut off at the edge of the isolation structure layer 4 close to the first groove 51, so as to reduce the probability that the voltage on the cathode layer 22 in the laminated structure 20 leaks to the charge generation layer 24 through the isolation structure layer 4 adjacent thereto, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0138] In addition, the partial edge of the laminated structure 20 is recessed to form a gap close to the center of the first opening 41, and at the gap, the edge of the laminated structure 20 is isolated from the isolation structure layer 4 adjacent thereto, so as to further reduce the contact area between the laminated structure 20 and the isolation structure layer 4, further reduce the probability that the voltage on the cathode layer 22 leaks to the charge generation layer 24 through the isolation structure layer 4 adjacent to the laminated structure 20, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0139] In some embodiments, as shown in Figure 8 and Figure 10 In the case that the display panel 300 further includes the pixel defining layer 3 located on the side of the isolation structure layer 4 close to the driving substrate 1, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41.

[0140] For example, the orthographic projection of the first groove 51 on the driving substrate 1 is arranged staggered with the orthographic projection of the second opening 31 on the driving substrate 1.

[0141] In addition, in the case that the first groove 51 is located within the boundary range of the laminated structure 20, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, and there is a gap between the first groove 51 and the boundary of the second opening 31 and the boundary of the first opening 41, as shown in Figure 12 In the case that the partial edge of the laminated structure 20 is recessed to form a gap close to the center of the first opening, and the gap and the isolation structure layer 4 enclose the first groove 51, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, there is a gap between the first groove 51 and the boundary of the second opening 31, and the first groove 51 coincides with part of the boundary of the first opening 41, as shown in Figure 13

[0142] ​By adopting the above configuration, the first groove 51 can be used to separate a portion of the edge of the stacked structure 20 from the isolation structure layer 4 or the adjacent conductive structure 6, thereby achieving insulation between a portion of the edge of the charge generation layer 24 in the stacked structure 20 and the isolation structure layer 4 or the adjacent conductive structure 6. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 and then cut off at the edge of the conductive structure 6 near the insulating structure 5, thereby reducing the probability that the cathode layer 22 will leak current to the charge generation layer 24 through the isolation structure layer 4, thus improving the luminous efficiency of the light-emitting device 2. In addition, the first groove 51 is located between the boundary of the second opening 31 and the boundary of the first opening 41, that is, the first groove 51 and the second opening 31 are staggered, thereby avoiding affecting the performance of the light-emitting device 2.

[0143] In some embodiments, combined with Figure 12 and Figure 13 As shown, the insulating structure 5 includes: a first groove 51, which is located between two adjacent stacked structures 20, and the first groove 51 cuts off the isolation structure layer 4 between the two adjacent stacked structures 20.

[0144] For example, such as Figure 13 As shown, the conductive structure 6 includes a stacked structure 20 adjacent to the stacked structure 20. A first groove 51 separates a portion of the edge of the stacked structure 20 from the stacked structure 20 adjacent to a portion of the edge of the stacked structure 20.

[0145] For example, such as Figure 13 As shown, the edge of the stacked structure 20 adjacent to the first groove 51 is insulated from the adjacent stacked structure 20 through the first groove 51, and the remaining edges of the stacked structure 20 are connected to the isolation structure layer 4 to realize the electrical connection between the multiple cathode layers 22.

[0146] For example, during the manufacturing process of the display panel 300, an etching process can be used to remove a portion of the isolation structure layer 4 to form the aforementioned first groove 51. Also for example, during the manufacturing process of the display panel 300, an etching process can be used to remove a portion of the isolation structure layer 4 and a portion of the laminated structure 20 adjacent to the isolation structure layer 4 to form the aforementioned first groove 51.

[0147] By adopting the above configuration, by removing at least part of the isolation structure layer 4 to form the first groove 51, the edge of the charge generation layer 24 adjacent to the first groove 51 and the adjacent conductive structure 6 in the stacked structure 20 are insulated. During the operation of the light-emitting device 2, the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 can be reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0148] In some embodiments, as shown in FIG. 1A, the display panel 300 includes a plurality of light-emitting devices 2 arranged in an array. Each light-emitting device 2 includes a driving substrate 1, a first electrode layer 21, a charge generation layer 24, a second electrode layer 22, and a light-emitting layer 23. The driving substrate 1 is arranged on the bottom of the display panel 300. The first electrode layer 21 is arranged on the driving substrate 1. The charge generation layer 24 is arranged on the first electrode layer 21. The second electrode layer 22 is arranged on the charge generation layer 24. The light-emitting layer 23 is arranged on the second electrode layer 22. The light-emitting layer 23 is arranged between the second electrode layer 22 and the charge generation layer 24. Figure 9 As shown in FIG. 1A, the isolation structure layer 4 includes a plurality of first isolation portions 401 and a plurality of second isolation portions 402. The plurality of first isolation portions 401 and the plurality of second isolation portions 402 are arranged in a cross manner to define a plurality of first openings 41. The portion of at least one of the first isolation portions 401 and the second isolation portions 402 for surrounding the first openings 41 is truncated by the first groove 51.

[0149] For example, the plurality of first isolation portions 401 extend along a first direction, and the plurality of second isolation portions 402 extend along a second direction. The first direction intersects the second direction. The angle between the first direction and the second direction can be selected according to actual needs. For example, the angle between the first direction and the second direction is 85°, 88°, or 90°, etc.

[0150] In some examples, the portion of the first isolation portions 401 for surrounding the first openings 41 is truncated by the first groove 51. In other examples, the portion of the second isolation portions 402 for surrounding the first openings 41 is truncated by the first groove 51. In yet other examples, the portion of the first isolation portions 401 and the second isolation portions 402 for surrounding the first openings 41 is truncated by the first groove 51.

[0151] With the above arrangement, the portion of at least one of the first isolation portions 401 and the second isolation portions 402 for surrounding the first openings 41 is truncated by the first groove 51, i.e., the area of the isolation structure layer 4 around the stack structure 20 in the first openings is reduced, thereby reducing the contact area between the stack structure 20 and the isolation structure layer 4. During the working process of the light-emitting device 2, the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 can be reduced, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0152] In some embodiments, as shown in FIG. 1A, the display panel 300 includes a plurality of light-emitting devices 2 arranged in an array. Each light-emitting device 2 includes a driving substrate 1, a first electrode layer 21, a charge generation layer 24, a second electrode layer 22, and a light-emitting layer 23. The driving substrate 1 is arranged on the bottom of the display panel 300. The first electrode layer 21 is arranged on the driving substrate 1. The charge generation layer 24 is arranged on the first electrode layer 21. The second electrode layer 22 is arranged on the charge generation layer 24. The light-emitting layer 23 is arranged on the second electrode layer 22. The light-emitting layer 23 is arranged between the second electrode layer 22 and the charge generation layer 24. Figure 11 As shown in FIG. 1A, among the two stack structures 20 adjacent to the two sides of the first groove 51, at least one of the stack structures 20 has a part of the edge thereof recessed towards the center of the first opening 41, forming a part of the boundary of the first groove 51.

[0153] For example, the orthographic projection of the first groove 51 on the driving substrate 1 partially overlaps the orthographic projection of the first opening 41 on the driving substrate 1.

[0154] For example, the sidewall of the first groove 51 is composed of a part of the sidewall of the stack structure 20 and a part of the sidewall of the isolation structure layer 4.

[0155] With the above arrangement, the first groove 51 is formed, the area of the isolation structure layer 4 around the stack structure 20 located in the first opening is reduced, thereby reducing the contact area of the stack structure 20 and the conductive structure adjacent thereto, and in the working process of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be reduced, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0156] In some embodiments, as shown in Figure 13 , Figure 9 and Figure 9 , at least two first grooves 51 are arranged around one stack structure 20, and the at least two first grooves 51 are arranged at intervals around the stack structure 20.

[0157] For example, the number of the first grooves 51 arranged around one stack structure 20 can be two, three or more. Embodiments of the present disclosure do not limit this. For example, as shown in Figure 11 , the number of the first grooves 51 arranged around one stack structure 20 is four. The four first grooves 51 are arranged at intervals around the stack structure 20.

[0158] In some examples, in the plurality of first grooves 51 arranged around one stack structure 20, the plurality of first grooves 51 can all be located within the boundary range of the stack structure 20, and the plurality of first grooves 51 have a spacing between the boundary of the isolation structure layer 4 and the boundary of the stack structure 20, as shown in Figure 13 . In other examples, in the plurality of first grooves 51 arranged around one stack structure 20, the plurality of first grooves 51 are all formed by the partial edges of the stack structure 20 being recessed to form notches towards the center of the first opening 41, and are enclosed by the notches and the isolation structure layer 4, as shown in Figure 9 . In yet other examples, in the plurality of first grooves 51 arranged around one stack structure 20, part of the first grooves 51 are formed by the partial edges of the stack structure 20 being recessed to form notches towards the center of the first opening 41, and are enclosed by the notches and the isolation structure layer 4; and part of the first grooves 51 are formed by removing part of the isolation structure layer 4, as shown in Figure 11 . Embodiments of the present disclosure do not limit this.

[0159] With the above arrangement, at least two first grooves 51 are arranged around one stack structure 20, which can further reduce the contact area of the stack structure 20 and the conductive structure adjacent thereto, and in the working process of the light-emitting device 2, the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 can be further reduced, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0160] In some embodiments, as shown inFigure 9 , Figure 11 As shown, the cathode layer 22 includes a first sub-part 221 and a second sub-part 222. The first sub-part 221 overlaps with the anode 21 in a direction perpendicular to the driving substrate 1; the second sub-part 222 passes through the gap between two adjacent first grooves 51, one end of the second sub-part 222 is electrically connected to the first sub-part 221, and the other end of the second sub-part 222 is electrically connected to the isolation structure layer 4.

[0161] It should be noted that in the top view of the display panel 300, the orthographic projection of the cathode layer 22 in a stacked structure 20 basically overlaps with the orthographic projection of the other film layers in the stacked structure 20. Figure 9 and Figure 11 Only the cathode layer 22 in the stacked structure 20 is shown in the figure, while the other film layers in the stacked structure 20 are not labeled in detail.

[0162] For example, the orthographic projection of the first sub-part 221 onto the driving substrate 1 covers the orthographic projection of the anode 21 onto the driving substrate 1. The orthographic projection of the second sub-part 222 onto the driving substrate 1 is offset from the orthographic projection of the anode 21 onto the driving substrate 1.

[0163] For example, the number of second sub-parts 222 electrically connected to the first sub-part 221 can be one or more. The embodiments of this disclosure do not limit this. For example, as Figure 9 and Figure 9 As shown, there are four second sub-parts 222 that are electrically connected to the first sub-part 221. This ensures that there is a certain contact area between the cathode layer 22 and the isolation structure layer 4, thus guaranteeing the effectiveness of the electrical connection between the cathode layer 22 and the isolation structure layer 4.

[0164] By adopting the above configuration, the contact area between the stacked structure 20 and its adjacent conductive structure 6 can be reduced. During the operation of the light-emitting device 2, the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 can be reduced, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300. Furthermore, it can ensure that two adjacent cathode layers 22 are electrically connected through the isolation structure layer 4, which is used to ensure that the light-emitting layers 23 in each light-emitting device 2 can receive approximately the same electrical signal transmitted by the cathode layer 22. This is beneficial to improving the accuracy of the electrical signals received by multiple light-emitting layers 23, and thus improving the display uniformity of the display panel 300.

[0165] In some embodiments, such as Figure 14 As shown, the cathode layer 22 further includes a third sub-part 223, which is located between the boundary of the first groove 51 and the first opening 41, and is electrically connected to the second sub-part 222 and the isolation structure layer 4.

[0166] For example, the cathode layer 22 includes one third sub-portion 223, or multiple third sub-portions 223. The embodiments of the present disclosure do not limit the number of third sub-portions 223 included in the cathode layer 22. For example, as shown in FIG. 2, the cathode layer 22 includes four third sub-portions 223. Figure 15

[0167] As described above, the first sub-portion 221 is electrically connected to the second sub-portion 222 and the isolation structure layer 4. In the present embodiment, the multiple third sub-portions 223 are electrically connected to the second sub-portion 222, and the third sub-portions 223 are electrically connected to the isolation structure layer 4. Thus, the contact area between the edge of the stack structure 20 and the isolation structure layer 4 can be reduced, and the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 during the operation of the light-emitting device 2 can be reduced, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300. In addition, the effectiveness of the electrical connection between the cathode layer 22 and the isolation structure layer 4 can be ensured, thereby ensuring that the light-emitting layer 23 in each light-emitting device 2 can receive substantially the same electrical signal transmitted by the cathode layer 22, which is conducive to improving the accuracy of the electrical signal received by the multiple light-emitting layers 23 and improving the display uniformity of the display panel 300.

[0168] In some embodiments, the first recess 51 extends through at least the cathode layer 22, the second light-emitting layer 232, and the charge generation layer 24.

[0169] In some examples, the first recess 51 further extends through the first light-emitting layer 231.

[0170] With the above arrangement, the first recess 51 can achieve insulation between the edge of the charge generation layer 24 in the stack structure 20 and the conductive structure 6 adjacent to the stack structure 20, thereby reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 during the operation of the light-emitting device 2, improving the light-emitting efficiency of the light-emitting device 2, and ensuring the display effect of the display panel 300.

[0171] In some embodiments, in the first recess 51, the edges of at least the cathode layer 22, the second light-emitting layer 232, and the charge generation layer 24 in the stack structure 20 are aligned or substantially aligned in a direction perpendicular to the driving substrate 1.

[0172] In some implementations, the cathode layer 22 wraps the edges of the light-emitting layer 23 and the charge generation layer 24, i.e., the edge of the cathode layer 22 in the direction perpendicular to the driving substrate 1 exceeds the edges of the light-emitting layer 23 and the charge generation layer 24, thereby wrapping the edges of the light-emitting layer 23 and the charge generation layer 24.

[0173] ​In the embodiments of the present disclosure, at least the edges of the cathode layer 22, the second light-emitting layer 232 and the charge generation layer 24 are aligned or substantially aligned in a direction perpendicular to the driving substrate 1, so that the edge of the cathode layer 22 is isolated from the edge of the charge generation layer 24, thereby reducing the probability of the cathode layer 22 leaking to the charge generation layer 24 through the isolation structure layer 4 or the stack structure adjacent to the stack structure 20 during the operation of the light-emitting device 2, and thus improving the light-emitting efficiency of the light-emitting device 2.

[0174] In some embodiments, as shown in Figure 14 and Figure 14 The insulating structure 5 includes an insulating portion 52, which covers part of the sidewall of the first opening 41 and is located between part of the edge of the stack structure 20 and the isolation structure layer 4.

[0175] For example, the insulating portion 52 isolates part of the sidewall of the isolation structure layer 4 from the stack structure 20, so as to insulate part of the sidewall of the isolation structure layer 4 from the stack structure 20; and part of the sidewall of the isolation structure layer 4 is connected to the stack structure 20, so that the adjacent cathode layers 22 are electrically connected through the isolation structure layer 4.

[0176] For example, the material of the insulating portion 52 can include an inorganic material. The inorganic material can include one or more of a combination of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0177] In the embodiments, by arranging the insulating portion 52 to cover part of the sidewall of the first opening 41 of the isolation structure layer 4, the contact area between the stack structure 20 and the isolation structure layer 4 is reduced, so as to ensure that the adjacent two cathode layers 22 are electrically connected through the isolation structure layer 4, to ensure that the light-emitting layers 23 in the light-emitting devices 2 can receive substantially the same electrical signal transmitted by the cathode layer 22, which is conducive to improving the accuracy of the electrical signal received by the plurality of light-emitting layers 23, and thus improving the display uniformity of the display panel 300; and the contact area between the stack structure 20 and the isolation structure layer 4 is reduced, so as to reduce the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0178] In some embodiments, as shown in Figure 16As shown, the isolation structure layer 4 includes a first sub-isolation layer 411, a second sub-isolation layer 412, and a third sub-isolation layer 413 sequentially stacked along a direction away from the driving substrate 1. The side surface of the second sub-isolation layer 412 is recessed relative to the side surface of the first sub-isolation layer 411 and the side surface of the third sub-isolation layer 413. The insulating portion 52 covers the side surface of the third sub-isolation layer 413, the portion of the third sub-isolation layer 413 extending beyond the second sub-isolation layer 412 near the surface of the driving substrate 1, and the side surface of the second sub-isolation layer 412.

[0179] For example, the materials of the first sub-isolation layer 411 and the third sub-isolation layer 413 can be titanium (Ti), and the material of the second sub-isolation layer 412 can be aluminum (Al). Since Ti and Al have different wet etching rates, during the etching process to form the isolation structure layer 4, the second sub-isolation layer 412 is less affected by etching, while the etching rates of the first sub-isolation layer 411 and the third sub-isolation layer 413 are faster, facilitating the formation of an undercut structure (e.g., an "I"-shaped structure). Those skilled in the art can also select other suitable materials, as long as the above-mentioned technical effects can be achieved; the embodiments of this disclosure do not limit this.

[0180] In some examples, the insulating portion 52 also covers the portion of the first sub-isolation layer 411 that extends beyond the second sub-isolation layer 412 away from the surface of the driving substrate 1.

[0181] It is understandable that the first sub-isolation layer 411 is relatively thin. During the manufacturing process of the display panel 300, the stacked structure 20 formed in the first opening 41 will be directly deposited on the surface of the first sub-isolation layer 411 that extends beyond the second sub-isolation layer 412 and is far away from the driving substrate 1.

[0182] In this embodiment, by covering the side of the third sub-isolation layer 413, the surface of the third sub-isolation layer 413 extending beyond the second sub-isolation layer 412 near the driving substrate 1, and the side of the second sub-isolation layer 412 with the insulating portion 52, insulation between a portion of the edge of the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20 can be achieved. That is, the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stacked structure 20 is reduced, thereby reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the luminous efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0183] In some embodiments, such as Figure 17 As shown, the display panel 300 further includes: a first insulating layer 7 disposed on the side of the isolation structure layer 4 away from the driving substrate 1, wherein the insulating portion 52 is made of the same material as the first insulating layer 7 and is connected to it.

[0184] Exemplarily, the edge of the first insulating layer 7 is aligned or approximately aligned with the edge of the third sub-isolation layer 413 in the isolation structure layer 4 in a direction perpendicular to the driving substrate 1.

[0185] Exemplarily, the plan view structure of the first insulating layer 7 is similar to a grid.

[0186] Exemplarily, the material of the first insulating layer 7 can be an inorganic material. The inorganic material can include a combination of one or more of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0187] It can be understood that the insulating portion 52 is of the same material as and connected to the first insulating layer 7, that is, the insulating portion 52 is provided in the same layer as the first insulating layer 7.

[0188] In addition, it can be easily understood that the “same layer” mentioned in the embodiments of the present disclosure refers to a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask plate to form by a one-time patterning process. According to different specific patterns, the one-time patterning process can include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure can be continuous or discontinuous, and these specific patterns can also be at different heights or have different thicknesses.

[0189] The “patterning process” mentioned above can refer to a process including photolithography, or a process including photolithography and etching steps, and can also include printing, inkjet and other processes for forming predetermined patterns; the photolithography process refers to a process of forming a pattern using photoresist, mask plate, exposure machine and the like, including film forming, exposure, development and the like. The corresponding patterning process can be selected according to the structure formed in the present disclosure.

[0190] In the embodiment, the insulating portion 52 is of the same material as and connected to the first insulating layer 7, that is, the insulating portion 52 and the first insulating layer 7 can be formed by a one-time patterning process, that is, the insulating portion 52 is formed at the same time as the first insulating layer 7, which is simple in process and can form the insulating portion 52 without additional preparation steps of the display panel 300, thereby wrapping part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the laminated structure 20, thereby reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 in the working process of the light emitting device 2, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0191] In some embodiments, as Figure 17 and Figure 16As shown, the plurality of stacked structures 20 at least includes a first stacked structure 210 and a second stacked structure 220, the first stacked structure 210 has a different light emitting color from the second stacked structure 220. The display panel 300 further includes: a first encapsulation sub-layer 81 located on a side of the first stacked structure 210 away from the driving substrate 1, and a second encapsulation sub-layer 82 located on a side of the second stacked structure 220 away from the driving substrate 1; the insulating part 52 between the second stacked structure 220 and the isolation structure layer 4 includes a first sub-layer 521, the first sub-layer 521 is made of the same material as the first encapsulation sub-layer 81.

[0192] In some examples, the first stacked structure 210 has a red light emitting color, and the second stacked structure 220 has a green light emitting color. In other examples, the first stacked structure 210 has a blue light emitting color, and the second stacked structure 220 has a green light emitting color. In yet other examples, the first stacked structure 210 has a blue light emitting color, and the second stacked structure 220 has a red light emitting color. Embodiments of the present disclosure do not limit this.

[0193] For example, the first encapsulation sub-layer 81 is used to shield and protect the light emitting layer 23 and the cathode layer 22 in the first stacked structure 210. The second encapsulation sub-layer 82 is used to shield and protect the light emitting layer 23 and the cathode layer 22 in the second stacked structure 220.

[0194] For example, the first encapsulation sub-layer 81 and the second encapsulation sub-layer 82 can be made of inorganic materials. The inorganic materials can include a combination of one or more of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON).

[0195] For example, the first sub-layer 521 included in the insulating part 52 between the second stacked structure 220 and the isolation structure layer 4 can be formed by the same patterning process as the first encapsulation sub-layer 81.

[0196] For example, the insulating part 52 between the second stacked structure 220 and the isolation structure layer 4 can further include other film layers. For example, the insulating part 52 can further include: a film layer arranged in the same layer as the light emitting layer 23 in the first stacked structure 210, a film layer arranged in the same layer as the cathode layer 22 in the first stacked structure 210, and a film layer arranged in the same layer as the charge generation layer 24 in the first stacked structure 210, etc.

[0197] For example, the first stacked structure 210 and the first encapsulation sub-layer 81 can be formed by one patterning process.

[0198] In addition, it should be noted that the first stacked structure 210 and the second stacked structure 220 are separately manufactured.

[0199] Specifically, the first stack structure film and the first encapsulation film can be formed first, and then the first stack structure 210 and the first encapsulation sub-layer 81 in the first target opening in the plurality of first openings 41 can be formed by a one-time patterning process. After the first stack structure 210 and the first encapsulation sub-layer 81 are formed, the second stack structure 220 and the second encapsulation sub-layer 82 in the second target opening in the plurality of first openings 41 can be formed.

[0200] On this basis, a part of the first stack structure film and a part of the first encapsulation film can be deposited in the second target opening in the plurality of first openings 41, so as to form the insulating part 52 between the second stack structure 220 and the isolation structure layer 4.

[0201] In the embodiment, the first sub-layer 521 included in the insulating part 52 between the second stack structure 220 and the isolation structure layer 4 is made of the same material as the first encapsulation sub-layer 81 covering the first stack structure 210, and can be formed by a one-time patterning process, which is simple and can form the insulating part 52 without additional preparation steps of the display panel 300, so as to wrap part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stack structure 20, and reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 in the working process of the light-emitting device 2, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0202] In some embodiments, as shown in FIG. 1B, the plurality of stack structures 20 further include a third stack structure 230, and the light-emitting colors of the first stack structure 210, the second stack structure 220 and the third stack structure 230 are different. Figure 17

[0203] For example, the light-emitting color of the first stack structure 210 is red, the light-emitting color of the second stack structure 220 is blue, and the light-emitting color of the third stack structure 230 is green.

[0204] For example, the light-emitting color of the first stack structure 210 is red, the light-emitting color of the second stack structure 220 is blue, and the light-emitting color of the third stack structure 230 is green.

[0205] ​Exemplarily, the insulation portion 52 between the third stack structure 230 and the isolation structure layer 4 can further include other film layers. For example, the insulation portion 52 can further include a film layer arranged in the same layer as the light-emitting layer 23 in the first stack structure 210, a film layer arranged in the same layer as the cathode layer 22 in the first stack structure 210, and a film layer arranged in the same layer as the charge generation layer 24 in the first stack structure 210.

[0206] Exemplarily, the first stack structure 210, the second stack structure 220, and the third stack structure 230 are separately manufactured.

[0207] Specifically, the first stack structure film and the first encapsulation film can be formed first, and then the first stack structure 210 and the first encapsulation sub-layer 81 in the first target opening in the plurality of first openings 41 can be formed by a one-time patterning process. After the first stack structure 210 and the first encapsulation sub-layer 81 are formed, the second stack structure 220 and the second encapsulation sub-layer 82 in the second target opening in the plurality of first openings 41 can be formed, and the third stack structure 230 in the first opening 41 can be formed.

[0208] On this basis, part of the first stack structure film and part of the first encapsulation film can be deposited in the plurality of first openings 41 for forming the third stack structure 230, so as to form the insulation portion 52 between the third stack structure 230 and the isolation structure layer 4.

[0209] In the embodiment, the second sub-layer 522 included in the insulation portion 52 between the third stack structure 230 and the isolation structure layer 4 is made of the same material as the first encapsulation sub-layer 81 covering the first stack structure 210, and can be formed by a one-time patterning process, which is simple in process and can form the insulation portion 52 without additional preparation steps of the display panel 300, so as to wrap part of the edge of the isolation structure layer 4, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the stack structure 20, and reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 in the working process of the light-emitting device 2, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0210] In some embodiments, as Figure 15 and Figure 15As shown, the insulating structure 5 further comprises: a second groove 53; the second groove 53 is located within the range of the first opening 41, and the second groove 53 separates the partial edge of the first stack structure 210 and the isolation structure layer 4 adjacent to the partial edge of the first stack structure 210; or, the second groove 53 is located between the first stack structure 210 and the stack structure 20 adjacent to the first stack structure 210, and the second groove 53 truncates the isolation structure layer 4 adjacent to the first stack structure 210.

[0211] For example, the orthographic projection of the second groove 53 on the driving substrate 1 is located within the orthographic projection of the first opening 41 on the driving substrate 1.

[0212] For example, the number of the second grooves 53 corresponding to one first stack structure 210 can be one or more. Embodiments of the present disclosure do not make any limitation in this regard.

[0213] In the embodiment, by setting the second groove 53, the partial edge of the first stack structure 210 and the conductive structure 6 adjacent to the partial edge of the first stack structure 210 are separated, so as to realize the insulation setting between the edge of the charge generation layer 24 in the first stack structure 210 adjacent to the second groove 53 and the conductive structure 6 adjacent to the first stack structure 210. In the working process of the light emitting device 2, the electrical signal on the cathode layer 22 is cut off at the edge of the adjacent conductive structure 6 after being transmitted to the adjacent conductive structure 6, thereby reducing the probability that the voltage on the cathode layer 22 in the stack structure 20 leaks to the charge generation layer 24 through the conductive structure 6 adjacent to the stack structure 20, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0214] In some embodiments, as Figure 3 As shown, the periphery of one first stack structure 210 is provided with at least one second groove 53 and at least one insulating part 52, and the at least one second groove 53 and the at least one insulating part 52 are arranged to be spaced around the first stack structure 210.

[0215] As Figure 3 As shown, the periphery of one second stack structure 220 and / or one third stack structure 230 is provided with at least two insulating parts 52, and the at least two insulating parts 52 are arranged to be spaced around the second stack structure 220 or the third stack structure 230.

[0216] For example, the insulating part 52 arranged around one second stack structure 220 can be two or more. For example, the insulating part 52 arranged around one third stack structure 230 can be two or more. Embodiments of the present disclosure do not make any limitation in this regard.

[0217] In this embodiment, by arranging at least one second groove 53 and at least one insulating part 52 around the first stack structure 210, the insulation between the partial edge of the charge generation layer 24 in the first stack structure 210 and the adjacent conductive structure 6 is achieved; at least two insulating parts 52 are arranged around the second stack structure 220 and / or the third stack structure 230, so as to achieve the insulation between the partial edge of the charge generation layer 24 in the second stack structure 220 and the third stack structure 230 and the adjacent conductive structure 6; in the working process of the light-emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the adjacent conductive structure 6, and is cut off at the edge of the adjacent conductive structure 6, thereby reducing the probability that the voltage on the cathode layer 22 in the stack structure 20 (including the first stack structure 210, the second stack structure 220, and the third stack structure 230) leaks to the charge generation layer 24 through the conductive structure 6 adjacent to the stack structure 20, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0218] In some embodiments, as shown in FIG. 6, the display panel 300 further includes a light extraction layer (CPL) 9 located on the side of the plurality of light-emitting devices 2 away from the driving substrate 1. Figure 18

[0219] For example, the light extraction layer 9 can be located on the side of the cathode layer 22 away from the driving substrate 1. The light extraction layer 9 is used to protect the cathode layer 22 and can also be used to improve the light extraction efficiency of the light-emitting device 2.

[0220] For example, the material of the light extraction layer 9 has the characteristics of high refractive index and low absorption coefficient, which is beneficial to improve the light extraction effect of the light-emitting device 2. On this basis, the length of the microcavity can be adjusted by changing the thickness of the light extraction layer 9, and the color deviation and efficiency of the light-emitting device 2 can be adjusted.

[0221] In some embodiments, as shown in FIG. 6, the display panel 300 further includes a light extraction layer (CPL) 9 located on the side of the plurality of light-emitting devices 2 away from the driving substrate 1. Figures 19-25 For example, the light extraction layer 9 can be located on the side of the cathode layer 22 away from the driving substrate 1. The light extraction layer 9 is used to protect the cathode layer 22 and can also be used to improve the light extraction efficiency of the light-emitting device 2.

[0222] For example, the encapsulation layer 10 can be a thin film encapsulation (TFE), or can be an encapsulation substrate.

[0223] ​For example, the encapsulation layer 10 includes a first inorganic layer, an organic layer, and a second inorganic layer which are sequentially stacked. The first inorganic layer and the second inorganic layer play a main role of blocking water and / or oxygen from invading the light emitting device 2, and the organic layer plays a role of auxiliary encapsulation and planarization.

[0224] The material of the organic layer includes a polymer combination of one or more of an acrylic-based polymer, a silicon-based polymer, and an epoxy-based polymer. The material is fabricated on each light emitting device 2 by using an Ink Jet Printing (IJP) method, and is subjected to ultraviolet (UV) curing to form the organic encapsulation layer.

[0225] The material of the first inorganic layer and the second inorganic layer includes a combination of one or more of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON). The inorganic encapsulation layer can be formed by using a Chemical Vapor Deposition (CVD) process.

[0226] Embodiments of the present disclosure also provide a manufacturing method of a display panel, for example, for manufacturing the display panel 300 provided in some embodiments above. In the manufacturing method, Figure 18 a flowchart of the manufacturing method of the display panel 300 provided in some embodiments of the present disclosure; Figure 5 cross-sectional structure diagrams corresponding to respective steps in the manufacturing method of the display panel 300 according to some embodiments.

[0227] It should be understood that, Figure 18 The steps shown are not exclusive and other steps can be performed before, after, or between any of the steps shown. In addition, some of the steps can be performed simultaneously, or can be performed in an order different from Figure 19 the order shown.

[0228] As Figure 20 shown, the manufacturing method includes a1-a4 as follows.

[0229] a1: As Figure 19 shown, an anode layer 02 is formed on the driving substrate 1, and the anode layer 02 includes a plurality of anodes 21.

[0230] For example, the structure of the driving substrate 1 can be referred to the description in some embodiments above, and will not be repeated here.

[0231] For example, the anode layer 02 can be made of transparent metal oxide conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), fluorine-doped tin oxide (FTO), etc. In another example, the anode layer is a laminated composite structure made of the transparent metal oxide conductive material and a metal material (e.g., silver Ag). For example, the anode layer is a laminated composite structure of ITO / Ag / ITO.

[0232] For example, the anode layer 02 can be made of transparent metal oxide conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), fluorine-doped tin oxide (FTO), etc. In another example, the anode layer is a laminated composite structure made of the transparent metal oxide conductive material and a metal material (e.g., silver Ag). For example, the anode layer is a laminated composite structure of ITO / Ag / ITO.

[0233] a2: as Figure 21 As shown in FIG. 2, the isolation structure layer 4 is formed on the driving substrate 1, and the isolation structure layer 4 has a plurality of first openings 41, one of which overlaps one of the anodes 21.

[0234] For example, the material and structure of the isolation structure layer 4 can refer to the description of some embodiments described above, which will not be repeated here.

[0235] The isolation structure layer 4 is used to separate the laminated structures 20 of different light emitting devices 2. By providing the isolation structure layer 4, any two laminated structures 20 can be separated by the isolation structure layer 4 during the preparation of the display panel 300, and the isolation structure layer 4 is used to separate the light emitting devices 2 in the display panel 300, which effectively reduces the preparation difficulty of the display panel 300, reduces the preparation cost of the display panel 300, and makes the arrangement density of the light emitting devices in the display panel 300 not limited by the size of the FMM, which is beneficial to improve the aperture ratio of the display panel 300, improve the pixel density of the display panel 300, and does not need to use the FMM and etching process, avoiding the problem of inaccurate alignment.

[0236] For example, the isolation structure layer 4 can be formed by a sputtering process.

[0237] In the case that the isolation structure layer 4 comprises the first sub-isolation layer 411, the second sub-isolation layer 412 and the third sub-isolation layer 413 which are sequentially stacked, forming the isolation structure layer 4 by using the sputtering process can specifically include: sequentially forming the first sub-isolation film, the second sub-isolation film and the third sub-isolation film on the driving substrate 1 by using the sputtering process. Etching the first sub-isolation film, the second sub-isolation film and the third sub-isolation film, since the second sub-isolation film is less affected by etching, the first sub-isolation film and the third sub-isolation film have a faster etching speed, thereby forming the isolation structure layer 4 with an Undercut structure.

[0238] In some examples, the display panel 300 further comprises a pixel definition layer 3. In the case that the display panel 300 further comprises the pixel definition layer 3, before forming the isolation structure layer 4 on the driving substrate 1, the preparation method further comprises: forming the pixel definition layer 3 on the driving substrate 1, as shown in Figure 24

[0239] The material of the pixel definition layer 3 comprises an inorganic material or an organic insulating material.

[0240] For example, in the case that the pixel definition layer 3 comprises an inorganic material, a pixel definition film with a certain thickness can be formed on the driving substrate 1 by using a physical vapor deposition (PVD) or a plasma enhanced chemical vapor deposition (PECVD) method, and then a photolithography process is used to pattern the pixel definition film to form the pixel definition layer 3 with a plurality of second openings 31.

[0241] For example, in the case that the pixel definition layer 3 comprises an organic material, a pixel definition film with a certain thickness can be formed on the driving substrate 1 by using a coating process, and then a photolithography process is used to pattern the pixel definition film to form the pixel definition layer 3 with a plurality of second openings 31.

[0242] In some examples, the display panel 300 further comprises a first insulating layer 7 disposed on the side of the isolation structure layer 4 away from the driving substrate 1. In the case that the display panel 300 further comprises the first insulating layer 7, after forming the isolation structure layer 4 on the driving substrate 1, the preparation method further comprises: forming the first insulating layer 7 on the side of the isolation structure layer 4 away from the driving substrate 1, as shown in Figure 25

[0243] ​​The material of the first insulating layer 7 can include inorganic material. For example, a first insulating film with a certain thickness can be formed by physical vapor deposition or plasma enhanced chemical vapor deposition method, and then the first insulating film can be patterned by photolithography process to form the first insulating layer 7.

[0244] a3: forming a plurality of stacked structures 20, one stacked structure 20 at least partially located in one first opening 41. The stacked structure 20 includes a first light-emitting layer 231, a charge generation layer 24, a second light-emitting layer 232, and a cathode layer 22 stacked in a direction away from the driving substrate 1.

[0245] For example, the stacked structure 20 can be formed by photolithography process.

[0246] The photolithography process can include the following steps: first, forming an entire layer of stacked structure film, then coating photoresist on the stacked structure film after forming the entire layer of stacked structure film, then setting a mask plate on the side of the photoresist away from the substrate, exposing and developing the stacked structure film through the mask plate, removing the exposed part of the photoresist, and retaining the part of the photoresist that has not been exposed, thereby forming a patterned photoresist; then etching the stacked structure film with the patterned photoresist as a mask, removing the part of the stacked structure film that is not shielded by the patterned photoresist, thereby obtaining a plurality of stacked structures 20 located in the first opening 41. Finally, the display panel 300 to be formed can be placed in a stripping solution to dissolve and strip off the patterned photoresist layer.

[0247] a4: forming an insulating structure 5 between the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20, the conductive structure 6 including the isolation structure layer 4 and / or the stacked structure 20 adjacent to the stacked structure 20.

[0248] In the display panel 300 formed by the above preparation method, the insulating structure 5 is formed between the edge of the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20, thereby achieving insulation between the part of the edge of the charge generation layer 24 in the stacked structure 20 and the conductive structure 6 adjacent to the stacked structure 20. During the operation of the light-emitting device 2, the electrical signal on the cathode layer 22 is cut off at the edge of the adjacent conductive structure 6 after being transmitted to the adjacent conductive structure 6, thereby reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 through the adjacent conductive structure 6, improving the light-emitting efficiency of the light-emitting device 2, and ensuring the display effect of the display panel 300.

[0249] In some embodiments, the above step a4 includes etching the stacked structure 20 to form a first recess 51, and the first recess 51 serves as the insulating structure 5.Figure 22 As shown.

[0250] The first groove 51 is located in the range of the first opening 41, and the first groove 51 separates the partial edge of the laminated structure 20 and the conductive structure 6 adjacent to the partial edge of the laminated structure 20.

[0251] In some embodiments, after the step a4, the preparation method further comprises forming the encapsulation layer 10, such as Figure 23 As shown.

[0252] In some embodiments, the step a4 comprises etching the isolation structure layer 4 to form the first groove 51, and the first groove 51 is the insulating structure 5.

[0253] The first groove 51 is located between the two adjacent laminated structures 20, and the first groove 51 cuts off the isolation structure layer 4 between the two adjacent laminated structures 20.

[0254] By etching the laminated structure 20 or the isolation structure layer 4 to form the first groove 51, the partial edge of the laminated structure 20 and the conductive structure 6 adjacent to the partial edge of the laminated structure 20 are separated, and the insulating arrangement between the edge of the charge generation layer 24 in the laminated structure 20 adjacent to the first groove 51 and the conductive structure 6 adjacent to the laminated structure 20 is realized. In the working process of the light emitting device 2, the electrical signal on the cathode layer 22 is transmitted to the conductive structure 6 adjacent thereto and is cut off at the edge of the conductive structure 6 adjacent thereto, thereby reducing the probability that the voltage on the cathode layer 22 in the laminated structure 20 will leak to the charge generation layer 24 through the conductive structure 6 adjacent to the laminated structure 20, thereby improving the light emitting efficiency of the light emitting device 2 and ensuring the display effect of the display panel 300.

[0255] In some embodiments, the step a4 comprises forming the insulating part 52, and the insulating part 52 is the insulating structure 5; the insulating part 52 covers part of the sidewall of the first opening 41 and is located between the partial edge of the laminated structure 20 and the isolation structure layer 4.

[0256] For example, the material of the insulating part 52 comprises inorganic material. For example, the insulating part 52 can be formed by physical vapor deposition or plasma enhanced chemical vapor deposition method.

[0257] In the embodiment, the insulating portion 52 is arranged to cover part of the sidewall of the first opening 41 of the isolation structure layer 4, so as to reduce the contact area between the stacked structure 20 and the isolation structure layer 4, which can ensure the electrical connection between the two adjacent cathode layers 22 through the isolation structure layer 4, so as to ensure that the light-emitting layers 23 in the light-emitting devices 2 can receive approximately the same electrical signal transmitted by the cathode layers 22, which is beneficial to improve the accuracy of the electrical signal received by the multiple light-emitting layers 23, and further beneficial to improve the display uniformity of the display panel 300. In addition, the contact area between the stacked structure 20 and the isolation structure layer 4 is reduced, so as to reduce the probability of the voltage on the cathode layer 22 leaking to the charge generation layer 24 in the working process of the light-emitting device 2, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0258] In some embodiments, the plurality of stacked structures 20 includes a plurality of first stacked structures 210, a plurality of second stacked structures 220, and a plurality of third stacked structures 230. The plurality of first stacked structures 210, the plurality of second stacked structures 220, and the plurality of third stacked structures 230 are separately prepared.

[0259] Specifically, the first stacked structure 210 is first formed, as shown in FIG. 6A. ​ After the preparation of the first stacked structure 210 is completed, the second stacked structure 220 is continuously formed, as shown in FIG. 6B. ​ After the preparation of the second stacked structure 220 is completed, the third stacked structure 230 is continuously formed.

[0260] In some examples, the plurality of stacked structures 20 and the forming of the insulating portion 52 include:

[0261] (1) sequentially forming a first stacked structure film and a first encapsulation film; the first stacked structure film covers the plurality of first openings 41 and the isolation structure layer 4, and the first encapsulation film covers the first stacked structure.

[0262] For example, the material of the first encapsulation film can be an inorganic material. In the case where the material of the first encapsulation film is an inorganic material, the first encapsulation film can be formed by using a chemical vapor deposition (CVD) process.

[0263] (2) removing the first stacked structure film and the first encapsulation film in the second target opening in the plurality of first openings 41, to form the first stacked structure 210, a first encapsulation sub-layer 81, and a first sub-layer 521.

[0264] The first laminated structure thin film located in the first target opening in the plurality of first openings 41 forms a first laminated structure 210, the first encapsulation thin film located in the first target opening forms a first encapsulation sub-layer 81, and the first encapsulation thin film covering the sidewall of the second target opening forms a first sub-layer 521. The first sub-layer 521 serves as an insulation part 52.

[0265] (3) Forming a second laminated structure 220 in the second target opening; the light-emitting color of the second laminated structure 220 is different from that of the first laminated structure 210.

[0266] In some examples, the plurality of first openings 41 further includes a third target opening, and a third laminated structure 230 is located in the third target opening.

[0267] For example, in the first encapsulation thin film, the part of the first encapsulation thin film located in the third target opening forms a second sub-layer 522. The insulation part 52 between the third laminated structure 230 and the isolation structure layer 4 includes the second sub-layer 522.

[0268] For example, after forming the second laminated structure 220 in the second target opening, the third laminated structure 230 is formed in the third target opening.

[0269] In this embodiment, the first sub-layer 521 included in the insulation part 52 between the second laminated structure 220 and the isolation structure layer 4 and the second sub-layer 522 included in the insulation part 52 between the third laminated structure 230 and the isolation structure layer 4 are formed at the same time as the first laminated structure 210 and the first encapsulation sub-layer 71 are formed, so that the insulation part 52 can be formed without additional preparation steps of the display panel 300, and the part of the edge of the isolation structure layer 4 is wrapped, thereby reducing the contact area between the charge generation layer 24 and the isolation structure layer 4 in the laminated structure 20, thereby reducing the probability of voltage leakage from the cathode layer 22 to the charge generation layer 24 during the operation of the light-emitting device 2, thereby improving the light-emitting efficiency of the light-emitting device 2 and ensuring the display effect of the display panel 300.

[0270] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical scope disclosed by the present disclosure, which shall be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a driving substrate; an anode layer disposed on the driving substrate, the anode layer comprising a plurality of anodes; an isolation structure layer disposed on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; a plurality of stack structures, one stack structure at least partially located in one first opening; the stack structure comprising, in a direction away from the driving substrate, a first light-emitting layer, a charge generation layer, a second light-emitting layer, and a cathode layer; an insulating structure disposed between an edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure comprising the isolation structure layer and / or a stack structure adjacent to the stack structure; the insulating structure comprising: a first groove; the first groove being located within a range of the first opening, the first groove spacing a part of the edge of the stack structure and a conductive structure adjacent to the part of the edge of the stack structure; or, the first groove being located between two adjacent stack structures, and the first groove cutting off the isolation structure layer between the two adjacent stack structures; the cathode layer comprising: a first sub-portion and a second sub-portion; the first sub-portion overlapping the anode in a direction perpendicular to the driving substrate; the second sub-portion passing through a gap between two adjacent first grooves, one end of the second sub-portion being electrically connected to the first sub-portion, and the other end of the second sub-portion being electrically connected to the isolation structure layer.

2. The display panel of claim 1, wherein, The first groove is located within a boundary range of the stack structure, and the first groove is spaced apart from a boundary of the isolation structure layer and a boundary of the stack structure.

3. The display panel of claim 1, wherein, A part of the edge of the stack structure is recessed in a direction close to a center of the first opening to form a notch, and the notch and the isolation structure layer enclose the first groove.

4. The display panel of claim 1, wherein, Further comprising: a pixel definition layer located on a side of the isolation structure layer close to the driving substrate; the pixel definition layer defining a plurality of second openings, one second opening being located within a range of one first opening, and one second opening overlapping one anode; the first groove being located between a boundary of the second opening and a boundary of the first opening.

5. The display panel of claim 1, wherein, The isolation structure layer comprises a plurality of first isolation portions and a plurality of second isolation portions, the plurality of first isolation portions and the plurality of second isolation portions being arranged in a cross manner to define a plurality of first openings; a part of at least one of the first isolation portion and the second isolation portion for enclosing the first opening is cut off by the first groove.

6. The display panel of claim 1 or 5, wherein, In two stack structures adjacent to both sides of the first groove, a part of the edge of at least one of the stack structures is recessed in a direction close to a center of the first opening to form a part of a boundary of the first groove.

7. The display panel of claim 6, wherein, At least two first grooves are arranged around one stack structure, and the at least two first grooves are arranged spaced apart around the stack structure.

8. The display panel of claim 1, wherein The cathode layer further comprises a third sub-portion between the first recess and the boundary of the first opening, and the third sub-portion is electrically connected with the second sub-portion and the isolation structure layer.

9. The display panel of claim 8, wherein, The first recess at least penetrates the cathode layer, the second light-emitting layer, and the charge generation layer.

10. The display panel of claim 9, wherein, In the first recess, edges of at least the cathode layer, the second light-emitting layer, and the charge generation layer in the stack structure are aligned or approximately aligned in a direction perpendicular to the driving substrate.

11. A display panel, characterized by, Comprise: a driving substrate; an anode layer disposed on the driving substrate, the anode layer comprising a plurality of anodes; an isolation structure layer disposed on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; a plurality of stack structures, one stack structure at least partially located in one first opening; the stack structure comprising a first light-emitting layer, a charge generation layer, a second light-emitting layer, and a cathode layer stacked in a direction away from the driving substrate; an insulating structure disposed between the edges of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure comprising the isolation structure layer and / or a stack structure adjacent to the stack structure; the insulating structure comprising an insulating portion covering part of the sidewall of the first opening and located between part of the edges of the stack structure and the isolation structure layer; the isolation structure layer comprising a first sub-isolation layer, a second sub-isolation layer, and a third sub-isolation layer stacked in a direction away from the driving substrate, the side surface of the second sub-isolation layer being recessed relative to the side surface of the first sub-isolation layer and the side surface of the third sub-isolation layer; the insulating portion covering the side surface of the third sub-isolation layer, part of the surface of the third sub-isolation layer beyond the second sub-isolation layer close to the driving substrate, and the side surface of the second sub-isolation layer.

12. The display panel of claim 11, wherein, Further comprise: a first insulating layer disposed on the side of the isolation structure layer away from the driving substrate, the insulating portion and the first insulating layer being of the same material and connected.

13. The display panel of claim 11 or 12, wherein, The plurality of stack structures at least comprises a first stack structure and a second stack structure, the light-emitting color of the first stack structure being different from the light-emitting color of the second stack structure; the display panel further comprises a first encapsulation sub-layer located on the side of the first stack structure away from the driving substrate, and a second encapsulation sub-layer located on the side of the second stack structure away from the driving substrate; the insulating portion between the second stack structure and the isolation structure layer comprises a first sub-layer, the first sub-layer being of the same material as the first encapsulation sub-layer.

14. The display panel of claim 13, wherein, The plurality of stack structures further comprises a third stack structure, the light-emitting colors of the first stack structure, the second stack structure, and the third stack structure being different: the insulating portion between the third stack structure and the isolation structure layer comprises a second sub-layer, the second sub-layer being of the same material as the first encapsulation sub-layer.

15. The display panel of claim 14, wherein, The insulating structure further comprises a second recess; The second recess is located in the range of the first opening, and the second recess separates part of the edge of the first stack structure and the isolation structure layer adjacent to part of the edge of the first stack structure; or The second recess is located between the first stack structure and the stack structure adjacent to the first stack structure, and the second recess cuts off the isolation structure layer adjacent to the first stack structure.

16. The display panel of claim 15, wherein, At least one second recess and at least one insulation portion are arranged around the first stack structure, and the at least one second recess and the at least one insulation portion are arranged around the first stack structure. At least two insulation portions are arranged around the second stack structure and / or the third stack structure, and the at least two insulation portions are arranged around the second stack structure or the third stack structure.

17. A method for manufacturing a display panel, characterized by, The preparation method for forming the display panel of claim 1 comprises: forming an anode layer on a driving substrate, the anode layer comprising a plurality of anodes; forming an isolation structure layer on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; forming a plurality of stack structures, one stack structure at least partially located in one first opening; the stack structure comprising a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer arranged in a stack away from the driving substrate; forming an insulation structure between the edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure comprising the isolation structure layer and / or a stack structure adjacent to the stack structure; the forming of the insulation structure comprises: etching the stack structure to form a first recess, the first recess serving as the insulation structure; wherein the first recess is located in the range of the first opening, and the first recess separates part of the edge of the stack structure and the isolation structure layer adjacent to part of the edge of the stack structure; or etching the isolation structure layer to form a first recess, the first recess serving as the insulation structure; wherein the first recess is located between two adjacent stack structures, and the first recess cuts off the isolation structure layer between the two adjacent stack structures.

18. A method for manufacturing a display panel, characterized by, The preparation method for forming the display panel of claim 11 comprises: forming an anode layer on a driving substrate, the anode layer comprising a plurality of anodes; forming an isolation structure layer on the driving substrate, the isolation structure layer having a plurality of first openings, one first opening overlapping one anode; forming a plurality of stack structures, one stack structure at least partially located in one first opening; the stack structure comprising a first light-emitting layer, a charge generation layer, a second light-emitting layer and a cathode layer arranged in a stack away from the driving substrate; forming an insulation structure between the edge of the stack structure and a conductive structure adjacent to the stack structure, the conductive structure comprising the isolation structure layer and / or a stack structure adjacent to the stack structure; the forming of the insulation structure comprises: forming an insulating part as the insulating structure; wherein the insulating part covers part of the sidewall of the first opening and is located between part of the edge of the stack structure and the isolation structure layer.

19. The method of claim 18, wherein, The forming of the plurality of stack structures and the forming of the insulating part comprise: sequentially forming a first stack structure film and a first encapsulation film; the first stack structure film covers the plurality of first openings and the isolation structure layer, and the first encapsulation film covers the first stack structure; removing the first stack structure film and the first encapsulation film located in a second target opening of the plurality of first openings to form a first stack structure, a first encapsulation sub-layer and a first sub-layer; wherein the first stack structure film located in a first target opening of the plurality of first openings forms the first stack structure, the first encapsulation film located in the first target opening forms the first encapsulation sub-layer, and the first encapsulation film covering the sidewall of the second target opening forms the first sub-layer; the first sub-layer serves as the insulating part; forming a second stack structure in the second target opening; the light-emitting color of the second stack structure is different from that of the first stack structure.

20. A display device comprising: The display panel comprises: The display panel according to any one of claims 1-16; The circuit board is electrically connected with the display panel.

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