Method and system for manufacturing an electronic interface comprising a fine needle array

Abstract

A processing system is provided, which includes a substrate (80), a fine needle array (81-85) on the substrate, a holding member (12) holding the substrate, an electrolyte tank (21) configured to receive an electrolyte, at least one electrode plate (22-26) in the electrolyte tank, an actuator module (30) configured to move the fine needle array held on the holding member relative to the electrolyte tank, a measurement module (40) for detecting the position of the fine needle in the electrolyte and generating measurement data according to the detection result, wherein the movement of the fine needle array is controlled according to the measurement data, and a power supply module (60) configured to apply current to the electrode plate and the fine needle array. The processing system can achieve the purpose of mass and rapid production.

Description

[0001] Priority Claim

[0002] This application claims priority to U.S. Provisional Application No. 63 / 344,047, filed May 20, 2022, the full disclosure of which is incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to a system and method for manufacturing an electronic interface having an array of fine needles.

[0004] Prior Technology

[0005] Electrochemical machining (ECM) has become a viable method for machining parts in many modern industrial applications, especially when manufacturing parts made of difficult-to-machine materials and with complex structures. ECM is a machining method that alters the shape of a workpiece by electrochemically dissolving and removing material from it. In ECM, a high current flows between the electrode and the workpiece, utilizing an electrolyte material consisting of a negatively charged electrode (cathode), a conductive liquid (electrolyte), and a conductive workpiece (anode). At the anode surface, the surface metal is oxidized and dissolved in the electrolyte, thus changing its shape. At the cathode, a reduction reaction occurs, typically producing hydrogen gas. The electrolyte carries away the metal hydroxides formed during machining.

[0006] Current electrochemical machining processes can only process a single workpiece at a time, which is insufficient for mass production and rapid manufacturing. Therefore, the development of electrochemical removal methods that can avoid these problems is desired. Summary of the Invention

[0007] One aspect of this disclosure provides a processing system. The processing system includes: a substrate; a fine needle array located on the substrate; a holder configured to hold the substrate; an electrolyte tank configured to receive an electrolyte; at least one electrode plate located within the electrolyte tank; an actuator module configured to move the fine needle array held on the holder relative to the electrolyte tank; a measurement module configured to detect the position of the fine needles in the electrolyte and generate measurement data based on the detection result, wherein the movement of the fine needle array is controlled based on the measurement data; and a power supply module configured to apply current to the electrode plate and the fine needle array.

[0008] Another aspect of this disclosure provides an electronic interface. The electronic interface includes: a substrate having a lower surface and an edge surrounding the lower surface; and an array of pins located on the lower surface of the substrate, wherein each pin comprises a conductive material and has a tapered end away from the lower surface of the substrate, wherein the pin array includes: a first pin positioned around the center of the lower surface and having a first tapered angle at its lower end; and a second pin disposed adjacent to the edge of the substrate and having a second tapered angle at its lower end, the second tapered angle being smaller than the first tapered angle.

[0009] Another aspect of this disclosure provides a processing method. The processing method includes: moving an array of fine needles into an electrolyte received in an electrolyte tank; generating measurement data related to the position of the fine needles in the electrolyte; and when the measurement data meets a preset standard, applying an electric current to the array of fine needles and an electrode plate located in the electrolytic tank, thereby changing the shape of each fine needle by an electrochemical processing technique.

[0010] The above description is not intended to depict every embodiment or implementation of this disclosure. Attached Figure Description

[0011] A better understanding of the various aspects of the embodiments of the present invention can be achieved by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, according to standard industrial practice, the various structures are not drawn to scale. In fact, for clarity of explanation, the dimensions of the various structures may be arbitrarily increased or decreased.

[0012] Figure 1 A block diagram of a processing system according to one or more embodiments of the present disclosure is shown.

[0013] Figure 2 A schematic cross-sectional view of a processing system according to one or more embodiments of the present disclosure is shown.

[0014] Figure 3 A schematic view of the reaction zone is shown according to one or more embodiments of the present disclosure.

[0015] Figure 4 A top view of a reaction area connected to a power module is shown according to one or more embodiments of the present disclosure.

[0016] Figure 5 A top view of the electronic interface before processing is shown according to one or more embodiments of the present disclosure.

[0017] Figure 6 Showing Figure 5 Side view of the electronic interface.

[0018] Figure 7 Showing Figure 6 A cross-sectional view of one of the many needles shown.

[0019] Figure 8 A flowchart illustrating a method for fabricating an electronic interface according to one or more embodiments of the present disclosure is shown.

[0020] Figure 9 A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is moved to contact the electrolyte surface.

[0021] Figure 10 Showing Figure 9 The diagram illustrates the relative relationship between the tip of the fine needle and the electrolyte during operation, where the tip of one fine needle is not immersed in the electrolyte.

[0022] Figure 11 A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is placed at predetermined positions within an electrolyte tank.

[0023] Figure 12 The diagram illustrates the passivation layer formed at the interface between the fine needle and the electrolyte after a period of electrochemical processing.

[0024] Figure 13 A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is lifted.

[0025] Figure 14 A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is removed from an electrolyte bath.

[0026] Figure 15 A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is rotated to face an image capture component.

[0027] Figure 16 A schematic diagram of an electronic interface after processing is shown according to one or more embodiments of the present disclosure.

[0028] Figure 17 A schematic view of the reaction zone is shown according to one or more embodiments of the present disclosure.

[0029] Figure 18 A schematic view of an electrode plate according to one or more embodiments of the present disclosure is shown.

[0030] Figure 19 A schematic view of an electrode plate according to one or more embodiments of the present disclosure is shown.

[0031] Figure 20A schematic view is shown illustrating one stage of a method for performing electrochemical processing, in which an array of fine needles is inserted into an electrode plate within an electrolyte tank.

[0032] Figure 21 A flowchart illustrating a method for fabricating an electronic interface according to one or more embodiments of the present disclosure is shown.

[0033] Figure 22 A schematic diagram of an electronic interface after processing is shown according to one or more embodiments of the present disclosure.

[0034] Figure 23 A schematic diagram of an electronic interface prior to processing is shown according to one or more embodiments of the present disclosure.

[0035] Figure 24 A flowchart illustrating a method for fabricating an electronic interface according to one or more embodiments of the present disclosure is shown.

[0036] Figure 25 A schematic diagram of an electronic interface after processing is shown according to one or more embodiments of the present disclosure.

[0037] Implementation

[0038] The following detailed description should be read with reference to the accompanying drawings, in which similar elements in different drawings are numbered the same. The detailed description and the drawings, which are not necessarily drawn to scale, depict exemplary embodiments and are not intended to limit the scope of the invention. The depicted exemplary embodiments are intended to be illustrative only. Selected features of any exemplary embodiment may be incorporated into additional embodiments unless expressly stated otherwise.

[0039] The terminology used in this specification is intended to describe particular embodiments and is not intended to be limiting. The terms “a,” “an,” and “the” also include plural forms unless expressly indicated otherwise. When used in this specification, the terms “comprising” and / or “including” specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components.

[0040] Furthermore, for ease of description, spatially relative terms such as “below,” “under,” “down,” “above,” “on,” “above,” and similar terms may be used herein to describe the relationship between one element or feature and another element or feature(s), as shown in the figures. The spatially relative terms are intended to cover not only the orientation depicted in the figures but also different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatially relative descriptive terms used herein shall be interpreted accordingly.

[0041] Figure 1 A block diagram of a processing system 1 according to one or more embodiments of the present disclosure is shown. According to some embodiments, the processing system 1 is configured to perform electrochemical machining on a workpiece and includes a processing assembly 3 and an operation station 7. In this disclosure, the workpiece to be processed may be an electronic interface used as a probe card in a semiconductor testing process. In some embodiments, the electronic interface includes an array of microneedles with a width of about 5 μm to about 500 μm. It should be understood that while embodiments of the present disclosure disclose a system for processing electronic interfaces, the present disclosure is not intended to be limited thereto. The system and method can be used to process any workpiece that can initiate oxidation and / or reduction reactions during an electrochemical process.

[0042] The processing assembly 3 is the manufacturing site and includes a processing tool 10, a reaction zone 20, an actuator module 30, a measurement module 40, an optical inspection module 50, and a power supply module 60. The operator station 7 is used to control and monitor the operation of the processing assembly 3. The operator station 7 may include a processor 71, a memory 72, a controller 73, an input / output interface 74 (hereinafter referred to as "I / O interface"), a communication interface 75, and a power supply 76.

[0043] In some embodiments, the processing tool 10 includes a platform 11, a retainer 12, a protective shell 13, and an venting element 14. The platform 11 supports the retainer 12. Figure 2As shown, in one exemplary embodiment, platform 11 includes a frame 114, a horizontal arm 112, and a vertical arm 113. Actuator 31 of actuator module 30 is fixed to the top of frame 114. A ball screw 111 is connected to actuator 31 and extends within frame 114, driving horizontal arm 112 to move in the vertical direction (Z-axis direction). Additionally, actuator 32 of actuator module 30 is fixed to horizontal arm 112 to drive vertical arm 113 to move in the horizontal direction (X-axis and / or Y-axis direction). Furthermore, actuator 33 of actuator module 30 is fixed to a pivot 115 connecting horizontal arm 112 and vertical arm 113. The lower end of vertical arm 113 is connected to retainer 12. When actuator 33 is driven, retainer 12 rotates about pivot 115. Platform 11 is mounted on protective shell 13, and exhaust device 14 is installed on top of protective shell 13 to exhaust the gas generated during the electrochemical process.

[0044] The reaction zone 20 is placed below the retainer 12. Figure 3 A schematic view of the reaction region 20 according to one or more embodiments of the present disclosure is shown, and Figure 4 A top view of the reaction zone 20 is shown. In some embodiments, the reaction zone 20 includes an electrolyte tank 21 and a plurality of electrode plates, such as electrode plates 22, 23, 24, 25, and 26. The electrolyte tank 21 may be rectangular in shape, having four transverse sidewalls 212, 213, 215, and 216 and a bottom wall 214. The electrolyte tank 21 defines an internal space for containing the electrolyte, and an open end is formed at the top of the electrolyte tank 21. Electrode plates 22, 23, 24, 25, and 26 are located in the internal space of the electrolyte tank 21 and are connected to the inner surface of the wall of the electrolyte tank 21. Specifically, electrode plates 22 and 23 are connected to the transverse sidewalls 212 and 213 opposite to each other. Electrode plates 25 and 26 are connected to the transverse sidewalls 215 and 216 opposite to each other. Electrode plate 24 is connected to the bottom wall 214. Electrode plates 22, 23, 24, 25, and 26 are made of a material with rust-proof and corrosion-resistant properties. For example, electrode plates 22, 23, 24, 25, and 26 may be made of stainless steel, but this disclosure is not limited thereto. More electrode plates may be arranged in the electrolyte tank 21 in different orientations from electrode plates 22, 23, 25, and 26.

[0045] In some embodiments, electrode plates 22, 23, 24, 25, and 26 are electrically connected to power module 60 to act as cathodes in the electrochemical process. Power module 60 is a DC power supply and may include a power pulse generator configured to independently control the current supply to electrode plates 22, 23, 24, 25, and 26. For example, electrode plates 22 and 23 are electrically connected to power module 60 via wires, electrode plates 25 and 26 are electrically connected to power module 60 via another wire, and electrode plate 24 is electrically connected to power module 60 via another wire. The pulse pattern of the current applied to electrode plates 22 and 23 is not the same as the pulse pattern of the current applied to electrode plates 25 and 26.

[0046] In some embodiments, during the electrochemical process, the power module 60 alternately applies current to electrode plates 22 and 23 and electrode plates 25 and 26. For example, the current applied to electrode plates 22 and 23 is in an off state, while the current applied to electrode plates 25 and 26 is in an on state. The pulse frequency of the current applied to electrode plate 24 may be different from the pulse frequency of the current applied to electrode plates 22, 23, 25, and 26. In some embodiments, the pulse frequency of the current applied to electrode plate 24 is lower than the pulse frequency of the current applied to electrode plates 22, 23, 25, and 26. In some other embodiments, the power module 60 continuously applies current to electrode plate 24 during the electrochemical process.

[0047] In some embodiments, such as Figure 2 As shown, reaction zone 20 also includes transducer 27. Transducer 27 is located within the internal space of electrolyte tank 21. Transducer 27 can be an ultrasonic transducer, which converts electrical energy into mechanical (acoustic) energy based on the piezoelectric effect and then converts it back. The electrolyte in electrolyte tank 21 can vibrate during the electrochemical process via transducer 27.

[0048] Reference Figure 2 The optical detection module 50 is configured to capture images of a workpiece in the processing system 1 before, during, or after electrochemical processing. In some embodiments, the optical detection module 50 includes a plurality of image capture components, such as image capture components 51 and 52.

[0049] An image capture component 51 is disposed below the reaction zone 20 and configured to capture images of the workpiece processed in the reaction zone 20. An electrode plate 24 is disposed on the bottom wall 214 of the electrolyte tank 21. Figure 3In the case of the image capture assembly 51, the electrode plate 24 is located between the image capture assembly 51 and the holder 12 (or the workpiece held by the holder). In some embodiments, in order to facilitate the image capture assembly 51 to observe the workpiece, the electrode plate 24 is made of a transparent conductive oxide, such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), niobium-doped anatase TiO2 (NTO), or zinc oxide.

[0050] Image capture assembly 52 is located above reaction zone 20 and configured to capture an image of the workpiece after it has been removed from reaction zone 20. In some embodiments, image capture assembly 52 is fixed to the sidewall of protective housing 13 and positioned above reaction zone 20. In some embodiments, the light incident surface of image capture assembly 52 is arranged vertically (i.e., parallel to the Z-axis). Data associated with the images captured by image capture assemblies 51 and 52 can be transmitted to operator station 7 for further analysis.

[0051] Reference Figure 5-7 According to some embodiments of this disclosure, the workpiece to be processed in the processing system 1 is an electronic interface 8. The electronic interface 8 is part of a probe card used in a semiconductor testing tool (not shown). In some embodiments, the electronic interface 8 includes a substrate 80 and an array of pins, such as pins 81, 82, 83, 84, and 85. The substrate 80 has a lower surface 801 and four edges 802 surrounding the lower surface 801. Pin 83 is located at the center C of the lower surface 801, and pins 81 and 85 are located adjacent to two edges 802. Pin 82 is located between pins 81 and 83, and pin 84 is located between pins 83 and 85. Pins 81, 82, 83, 84, and 85 may be arranged along a straight line perpendicular to or inclined relative to the edges 802, or they may be arranged along a diagonal of the lower surface 801.

[0052] Pins 81, 82, 83, 84, and 85 are arranged in a matrix pattern on the lower surface 801 of the substrate 80. Although in the embodiment shown in the figures, 25 pins are arranged in a 5×5 matrix on the substrate 80, this disclosure is not limited to this embodiment. The electronic interface can accommodate any number of pins. In one exemplary embodiment, 1200 pins are provided on the substrate 80. Pins 81, 82, 83, 84, and 85 can be fixed to the lower surface 801 of the substrate 80 by any suitable method. For example, pins 81, 82, 83, 84, and 85 can be fixed to the substrate by welding, bonding, fastening, etc.

[0053] In some embodiments, at least one of the needles 81, 82, 83, 84, and 85 comprises a composite structure. For example, needle 85 extends along a longitudinal axis L perpendicular to the lower surface 801 of substrate 80. Needle 85 includes an inner portion 8501 and an outer portion 8502. The outer portion 8502 is farther from the longitudinal axis L than the inner portion 8501. The inner portion 8501 and the outer portion 8502 are formed of different conductive materials. In some embodiments, the conductivity of the outer portion 8502 is greater than that of the inner portion 8501. Additionally or alternatively, the hardness of the outer portion 8502 is less than that of the inner portion 8501. By such a configuration, needle 85 provides optimal conductivity without compromising its structural strength. In one exemplary embodiment, the inner portion 8501 comprises tungsten (W), and the outer portion 8502 comprises molybdenum (Mo). Substrate 80 may be made of a conductive material such as aluminum or stainless steel. Needles 81, 82, 83, 84, and 85 are electrically connected to substrate 80. When the substrate 80 is connected to the power module 60, the fine needles 81, 82, 83, 84 and 85 are energized and act as anodes in the electrochemical process.

[0054] Reference Figure 2 The measurement module 40 is configured to monitor at least one parameter in the machining system 1 in real time. In some embodiments, the measurement module 40 is located in the machining assembly 3 and may provide real-time monitoring of the movement of the retainer 12 (or the electronic interface 8 when it is mounted on the retainer 12). For example, the measurement module 40 is connected to an actuator 31 for driving the retainer 12 to move along the Z-axis and includes a detector for detecting force changes in the actuator 31. The measurement module 40 may include a strain gauge to measure the tension or compression of the ball screw 111. Alternatively, the measurement module 40 may include a pressure gauge to measure the pressure applied to the ball screw 111 by the actuator 31. Historical data on force changes representing normal and successful conditions are recorded in the memory 72 of the operator station 7. The processor 71 of the operator station 7 can perform anomaly diagnosis through comparative analysis of the historical data.

[0055] Refer again Figure 1 The processor 71 may include any processing circuitry operable to process measurement data generated by the measurement module 40 to determine whether an anomaly has occurred. In various aspects, the processor 71 may be implemented as a general-purpose processor, a multi-processor on a chip (CMP), a special-purpose processor, an embedded processor, a digital signal processor (DSP), a network processor, an input / output (I / O) processor, a media access control (MAC) processor, a radio baseband processor, a coprocessor, a microprocessor (e.g., a Complex Instruction Set Computer (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, and / or a Very Long Instruction Word (VLIW) microprocessor) or other processing means.

[0056] In some embodiments, memory 72 may include any machine-readable or computer-readable medium capable of storing data, including both volatile / non-volatile memory and removable / non-removable memory capable of storing one or more software programs. Software programs may include, for example, application programs, user data, device data and / or configuration data, file data related to environmental parameters, or combinations thereof. Software programs may contain instructions executable by various components of operator station 7. For example, memory 72 may include read-only memory (ROM), random access memory (RAM), dynamic RAM (DRAM), disk storage (e.g., floppy disk, hard disk, optical disk, magnetic disk), or cards (e.g., magnetic cards, optical cards) or any other type of medium suitable for storing information. In one embodiment, memory 72 may contain a set of instructions stored in any acceptable form of machine-readable instructions. The set of instructions may contain a series of operations following the detection of an anomaly in processing system 1 based on signals obtained by measurement module 40.

[0057] Controller 73 is configured to control one or more components of machining system 1. In some embodiments, controller 73 is configured to drive movement of holder 12 of machining tool 10 and to apply current to electronic interface 8 and electrode plates 22, 23, 24, 25, and 26. Controller 73 includes a control element, such as a microcontroller. Controller 73 issues control signals to actuator module 30 in response to a command from processor 71.

[0058] In some embodiments, I / O interface 74 may include any suitable mechanism or component to enable at least one user to provide input to operator station 7 or to provide output to that user. For example, I / O interface 74 may include any suitable input mechanism, including but not limited to buttons, keypads, keyboards, dials, touchscreens, or motion sensors. In some embodiments, I / O interface 74 may include a capacitive sensing mechanism, or a multi-touch capacitive sensing mechanism (e.g., a touchscreen). In some embodiments, I / O interface 74 may include a visual peripheral output device for providing a display visible to the user. For example, the visual peripheral output device may include a screen, such as a liquid crystal display (LCD) screen.

[0059] In some embodiments, the communication interface 75 may include any suitable hardware, software, or a combination of hardware and software capable of coupling the operator station 7 to one or more networks and / or additional devices (such as actuator module 30). The communication interface 75 may be configured to operate using any suitable technology for the required set of control information signals for using communication protocols, services, or operating procedures. The communication interface 75 may include suitable physical connectors for connection to a corresponding communication medium (whether wired or wireless). In some embodiments, the operator station 7 may include a system bus coupling the various system components, including a processor 71, memory 72, controller 73, and I / O interface 74. The system bus may be any custom bus suitable for computing device applications.

[0060] Figure 8 A flowchart illustrating a method S10 for fabricating an electronic interface according to one or more embodiments of the present disclosure is shown. For illustration, it will be combined with... Figure 1 , Figure 2 as well as Figure 9-15 The attached document Figure 1 This flowchart is described below. In different embodiments, some described stages may be replaced or omitted.

[0061] In step S11, the array of fine needles is placed into the electrolyte bath. In some embodiments, the fine needles (e.g., needles 81, 82, 83, 84, and 85) are first fixed to the substrate 80. Figure 9 As shown, the substrate 80 is then mounted together with the pins 81, 82, 83, 84, and 85 onto the retainer 12. Figure 2 The actuator 31 is positioned so that its lower surface 801 faces downwards. After the substrate 80 is fixed to the holder 12, the actuator 31 ( Figure 2 The device intervenes, driving the retainer 12 downward and moving the fine needle into the electrolyte tank 21.

[0062] In step S12, measurement data relating to the position of the needles in the electrolyte 90, which is received in an electrolyte tank, is generated. In some embodiments, a measurement module 40 mounted on the actuator 31 generates the measurement data by measuring the forces generated during the downward movement of the needles 81, 82, 83, 84, and 85. Surface tension generates upward resistance when in contact with the electrolyte surface; this resistance is detected to determine whether all needles are in contact with the electrolyte surface. Figure 10As shown, in possible abnormal situations, the tips of some needles, such as tip 840 of needle 84, fail to insert into the electrolyte surface as expected. In this case, the detector will only detect the surface tensions f11, f12, f13, and f15 applied to the tips 810, 820, 830, and 850 of the other needles 81, 82, 83, and 85. If the measured data does not meet the preset standard after comparison with historical data in step S13, step S14 is performed, which includes removing the array of needles 81, 82, 83, 84, and 85 from the electrolyte tank 21. After removal, the needles can be adjusted to a uniform height by, for example, grinding or compression. If the needles cannot be properly adjusted, they may be discarded.

[0063] If no abnormalities are found, the method continues to step S15, in which the array of fine needles 81, 82, 83, 84, and 85 is moved to predetermined positions in the electrolyte tank 21, such as... Figure 11 As shown. The aforementioned predetermined positions are the preset distances of the needles 81, 82, 83, 84, and 85 below the electrolyte 90 surface. This distance can be determined empirically or by analyzing historical data generated in the previous processing procedure. Alternatively, the immersion distance can be determined based on the maximum chamfer (i.e., minimum cone angle) formed along the diameter direction of the needle. In embodiments where the needles are processed using the immersion method (the needles remain stationary with respect to the electrode plate), the immersion distances of the needles 81, 82, 83, 84, and 85 can be in the range of approximately 5 μm to approximately 5 mm, depending on the angle formed along the diameter direction of the needle (i.e., the minimum cone angle). In embodiments where the needles are processed using the dynamic drawing method, the immersion distance is determined by the length of the bevel of the needle. The longer the bevel length (i.e., the smaller the cone angle), the larger the immersion distance should be.

[0064] In step S16, an electrochemical machining (ECM) process is performed. During ECM, the power module 60 applies direct current (DC) to the needles 81, 82, 83, 84, and 85 and the electrode plates 22, 23, 24, 25, and 26 to create a bias voltage between the needles 81, 82, 83, 84, and 85 and the electrode plates 22, 23, 24, 25, and 26. In some embodiments, a positive bias voltage is applied to the electrode plates 22, 23, 24, 25, and 26, and a negative bias voltage is applied to the holder 12, such that the needles 81, 82, 83, 84, and 85 are anodes, and the electrode plates 22, 23, 24, 25, and 26 are cathodes. Therefore, when electrons flow from the needles 81, 82, 83, 84, and 85 through the electrolyte 90 to the electrode plates 22, 23, 24, 25, and 26, oxidation occurs on the surfaces of the needles 81, 82, 83, 84, and 85. Generally, the power module 60 can be a constant voltage or constant current power supply, capable of providing power between approximately 0 watts and approximately 100 watts, voltage between approximately 1 V and approximately 60 V, and current between approximately 0 amperes and approximately 200 amperes. Additionally, the power module 60 can apply a constant current or periodic current pulses. The frequency of the periodic current pulses is below 2.5 kHz. The power module 60 can be a high-frequency pulse power supply with three power output modes: high-frequency square wave, sine wave, and DC power supply. Using a high-frequency pulse power supply, the migration rate of ions in the ionization reaction can be altered by controlling the power output mode. However, the specific operating specifications of the power supply may vary depending on the application. In embodiments where the fine needles 81, 82, 83, 84, and 85 are formed of different conductive materials with different redox potentials, the voltage applied to the fine needles 81, 82, 83, 84, and 85 is greater than the maximum redox potential of the fine needles 81, 82, 83, 84, and 85.

[0065] In some embodiments, such as Figure 12 As shown, during ECM processing of needles 81, 82, 83, 84, and 85, the width of the needles gradually decreases, and passivation layers 91, 92, 93, 94, and 95 may form in the form of oxides around the lower ends of needles 81, 82, 83, 84, and 85. These passivation layers will inhibit material removal and reduce the surface finish of the needles. It has been observed that the thickness of the passivation layer formed on needle 83 located at the center C of substrate 80 is greater than the thickness of the passivation layers formed on needles 81 and 85 located at the edge 802 of substrate 80. As a result, the oxidation reaction of needle 83 located at the center of substrate 80 is slower compared to that of needles 81 and 85 located at the edge 802 of substrate 80, resulting in a lower material removal rate. Therefore, as Figure 12As shown, the lower ends of needles 81, 82, 83, 84, and 85 are chamfered at different angles. In one exemplary embodiment, chamfers 811, 821, 831, 841, and 851 are formed at the lower ends of needles 81, 82, 83, 84, and 85. The angle formed between chamfer 831 of needle 83 and its adjacent surface is greater than the angle between chamfer 821 of needle 82 and its adjacent surface, and the included angle between chamfer 821 of needle 82 and its adjacent surface is greater than the included angle between chamfer 811 of needle 81 and its adjacent surface.

[0066] In some embodiments, the appearance of the needles 81, 82, 83, 84, and 85 during processing is inspected by the image capture component 51. Images generated by the image capture component 51 are transmitted to the operation station 7 for analysis. If the image analysis results deviate from the expected standard, the operation station 7 adjusts the processing parameters to optimize the appearance of the needles. Adjustable processing parameters may include, but are not limited to, changing the applied voltage, adjusting the needle movement speed or pattern, changing the temperature of the electrolyte 90, and changing the vibration frequency of the transducer 27.

[0067] In step S17, the height positions of the fine needles 81, 82, 83, 84, and 85 are changed during the electrochemical machining process. In some embodiments, the fine needles 81, 82, 83, 84, and 85 are processed by an electrochemical machining process combined with a dynamic drawing method, in which the height of the fine needles is gradually increased until the fine needles are removed from the surface of the electrolyte 90. The upward movement speed of the fine needles 81, 82, 83, 84, and 85 can remain constant or can vary. For example, the fine needles 81, 82, 83, 84, and 85 may move more slowly in the initial stage of the upward movement and more quickly in the later stage. That is, the closer the fine needles 81, 82, 83, 84, and 85 are to the surface of the electrolyte 90, the slower their movement speed.

[0068] In another embodiment, the needles 81, 82, 83, 84, and 85 initially move upward without disengaging their lower ends from the surface of the electrolyte 90, and then move downward. This up-and-down movement can be repeated multiple times until the entire electrochemical processing is completed, and can be performed simultaneously with the aforementioned speed changes.

[0069] In some embodiments, the electrochemical machining process occurs during the downward, low-speed movement of the needles 81, 82, 83, 84, and 85 after their lower ends have contacted the surface of the electrolyte 90. However, it should be noted that this disclosure is not limited to this embodiment. In other embodiments, the needles 81, 82, 83, 84, and 85 may remain stationary during the electrochemical machining process and may be removed from the electrolyte immediately after the electrochemical machining is completed.

[0070] In some embodiments, the speed at which the needles 81, 82, 83, 84, and 85 move is preset based on previously successful processing parameters. Alternatively, the speed of needle movement can be determined based on parameters monitored in real time, including but not limited to: changes in power transfer energy between the cathode and anode, changes in the power output waveform, and changes in axial movement speed. In some embodiments, step S17 is omitted. The needles 81, 82, 83, 84, and 85 are processed using an electrochemical machining process combined with an immersion method, in which the needles remain stationary for a predetermined time and are lifted to leave the electrolyte 90 after the electrochemical machining process is completed.

[0071] In step S18, the flow of electrolyte 90 is driven during the electrochemical processing. In some embodiments, the flow of electrolyte can be driven by the up-and-down movement of fine needles 81, 82, 83, 84, and 85 as previously described. In other embodiments, the flow of electrolyte 90 can be driven by a transducer 27 located within the electrolyte tank 21. The transducer 27 can generate vibrations of a fixed or varying frequency to induce flow of electrolyte 90 within the electrolyte tank 21. In still other embodiments, the flow of electrolyte 90 can be generated by changing the electric field generated by the applied direct current. For example, as... Figure 4 As shown, the power module 60 can first supply current to electrode plates 22 and 23 for a first time period, then stop supplying power, and then the power module 60 can supply power to electrode plates 25 and 26 for a second time period. The second time period can immediately follow the first time period. In some embodiments, the flow of electrolyte 90 in the electrolyte tank can minimize or eliminate the possibility of forming a passivation layer on the surface of the needles, thereby improving the uniformity of appearance of adjacent needles.

[0072] In step S19, the array of fine needles 81, 82, 83, 84, and 85 is removed from the electrolyte tank 21. In some embodiments, such as Figure 14 As shown, after the ECM processing is completed, the fine needles 81, 82, 83, 84 and 85 are removed from the electrolyte tank 21, and the current supply to the fine needles 81, 82, 83, 84 and 85 and the electrode plates 22, 23, 24, 25 and 26 is stopped.

[0073] In step S20, an image of an array of needles 81, 82, 83, 84, and 85 is generated to examine the geometry of the needles 81, 82, 83, 84, and 85. In some embodiments, when the ECM process is complete, images of the machined needles 81, 82, 83, 84, and 85 are captured by image capture component 52 and transmitted to operation station 7 for storage. Data associated with the images of the machined product is then matched with the processing parameters used in the manufacturing process to optimize subsequent processing parameters. In some embodiments, the machined needles can be photographed in their original positions without removing them from the holder 12. For example, as... Figure 15 As shown, the holder 12 can rotate 90 degrees about the pivot 115 so that the needle faces directly towards the light-incident surface 521 of the image capture assembly 52. ​​In addition, the distance between the holder 12 and the image capture assembly 52 can be adjusted by moving the horizontal arm 112 to achieve proper focusing of the needle.

[0074] Figure 16 A schematic diagram of the electronic interface 8 after processing according to one or more embodiments of the present disclosure is shown. In some embodiments, each pin is tapered at its lower end on the lower surface 801 away from the substrate 80. Due to the formation of a passivation layer during ECM processing, the taper angle of the pins near the center C of the lower surface 801 is larger than that of the pins away from the center C of the lower surface 801. For example, pins 83 located around the center C of the lower surface 801 have a first taper angle at their lower ends, and pins 81 positioned near the edge 802 of the substrate 80 have a second taper angle at their lower ends. The second taper angle is smaller than the first taper angle. The inconsistency in taper angles does not directly affect the performance of the electronic interface, as long as the length difference between adjacent pins is within tolerance. Compared to conventional electronic interfaces, the electrical contacts (aluminum (copper) pads / copper pillars / bumps) of the electronic interface suitable for this embodiment can have a smaller area and a greater number (i.e., higher pitch density). Therefore, the electronic interface of this embodiment can fully meet the stringent requirements of advanced packaging technologies.

[0075] Figure 17 A schematic view of the reaction zone 20a according to one or more embodiments of the present disclosure is shown. Figure 17 The use of and Figure 3 The same component symbols are used to refer to the same or equivalent components. For the sake of simplicity, details about these components will not be repeated. The difference between reaction zone 20a and reaction zone 20 includes the replacement of electrode plates 22, 23, 24, and 25 with electrode plate 28a.

[0076] In some embodiments, such as Figure 18As shown, electrode plate 28a includes multiple through holes, each defining a processing area. Processing areas, such as processing areas 281a, 282a, 283a, 284a, and 285a, are correspondingly provided with pins 81, 82, 83, 84, and 85 of electronic interface 8. During ECM processing, pins 81, 82, 83, 84, and 85 are inserted into processing areas 281a, 282a, 283a, 284a, and 285a, respectively. In some embodiments, the electric field in each processing area 281a, 282a, 283a, 284a, and 285a is independently controlled by power module 60. Therefore, the current density applied to two adjacent processing areas can be different. Electrode plate 28a can be fixed to an opening above electrolyte tank 21 by a suitable fixing device and electrically connected to power module 60.

[0077] In some embodiments, the thickness of the electrode plate 28a is equal to or greater than the length of the portion of the needle immersed in the electrolyte. In this embodiment, the portion of the needle immersed in the electrolyte is completely surrounded by the processing area, which increases the oxidation reaction rate. However, it should be noted that this disclosure is not limited to this embodiment. In another embodiment, such as Figure 19 As shown, electrode plate 28b has a relatively thin thickness, and when fine needles are immersed in the electrolyte, they pass through the processing areas of electrode plate 28b, such as processing areas 281b, 282b, 283b, 284b, and 285b.

[0078] Figure 21 A flowchart of a method S30 for fabricating an electronic interface 8 using an electrode plate 28a according to one or more embodiments of the present disclosure is shown. In method S30, steps S31, S33, S34, S36, S38, S39 and S40 are similar to steps S11, S13, S14, S16, S18, S19 and S20, and will not be described again.

[0079] In step S32, in addition to using the mechanism described in step S12 to determine whether all needles are simultaneously immersed in the electrolyte 90 by measuring resistance, the immersion status of the needles can also be detected by monitoring the current changes in each processing area of ​​the electrode plate 28a. Since power is applied independently to each processing area, an electrical connection is formed between the energized needle and the corresponding processing area when the needle enters it. Therefore, by detecting the current in the processing area, it can be determined whether the needle has been successfully immersed in the electrolyte.

[0080] In step S35, an array of fine needles is inserted into the processing area of ​​electrode plate 28a. Depending on the required geometry of the final product, the lower ends of the fine needles, away from the lower surface of substrate 80, may be located within or below the processing area of ​​electrode plate 28a. However, it should be understood that many changes and modifications can be made to the embodiments of this disclosure. In some embodiments, electrode plates 28a or 28b are placed in an electrolyte and maintained at a distance from the electrolyte surface. The lower ends of the fine needles are immersed in the electrolyte but not inserted into the processing area of ​​electrode plates 28a or 28b.

[0081] In step S37, after analyzing the image generated by the image capture component 51, if the appearance of some needles is found to be inconsistent with the expected standards, the mechanism described in step S17 can be adopted. Alternatively, the appearance can be adjusted by regulating the current intensity in the processing area receiving the needles, thereby increasing or decreasing the oxidation reaction rate of the needles. By independently controlling the oxidation reaction rate of each needle during processing, and... Figure 16 Compared to the needles shown, needles processed using this method exhibit a higher degree of similarity in appearance. For example, as shown... Figure 22 As shown, the lower ends of the fine needles processed using this method, 815, 825, 835, 845, and 855, exhibit highly similar taper angles, which further enhances the uniformity and consistency of the final product.

[0082] Figure 23 A schematic view of an electronic interface 8c connected to a power module 60 is shown in one or more embodiments according to this disclosure. Figure 23 The use of and Figure 6 The same component symbols are used to refer to the same or equivalent components. For simplicity, details regarding these components will not be repeated. The difference between electronic interface 8c and electronic interface 8 includes replacing substrate 80 with substrate 80c. In some embodiments, substrate 80c is a printed circuit board on which multiple conductive paths, such as conductive paths 861, 862, 863, 864, and 865, are formed. In some embodiments, each pin 81, 82, 83, 84, and 85 is electrically connected to one conductive path 861, 862, 863, 864, and 865 of substrate 80c, respectively. However, it should be noted that this disclosure is not limited to this embodiment. In another embodiment, two or more pins may be connected to the same conductive path and have the same current intensity during ECM processing.

[0083] Figure 24A flowchart of a method S50 for fabricating an electronic interface 8c using the reaction region 20 according to one or more embodiments of the present disclosure is shown. In method S50, steps S51, S53, S54, S55, S57, S58, S59 and S60 are similar to steps S11, S13, S14, S15, S18, S19 and S20, and will not be described again.

[0084] In step S52, in addition to using the mechanism described in step S12 to determine whether all needles are simultaneously immersed in the electrolyte 90 via resistance measurement, the immersion status can also be detected. The state of the needles is controlled by monitoring the current changes of each of the needles 81, 82, 83, 84, and 85. Since power is applied independently to each of the needles 81, 82, 83, 84, and 85, an electrical connection is established between the energized needle and the electrode plate when the needle comes into contact with the electrolyte. Therefore, by detecting the current of the needles 81, 82, 83, 84, and 85, it is possible to identify which needles are not immersed in the electrolyte. The data collected in step S52 can be used in step S56, in which the identified needles are further processed.

[0085] In step S56, power for performing the electrochemical machining process is supplied to the needles. In some embodiments, the power module 60 applies current to needles 81, 82, 83, 84, and 85 via conductive paths 861, 862, 863, 864, and 865, allowing the current intensity of needles 81, 82, 83, 84, and 85 to be independently controlled during the ECM process. The current intensity of needles 81, 82, 83, 84, and 85 can be determined based on the matching results of previous product appearances and the parameters used. For example, if the image analysis results of the previous product show that the cone angle of needle 83 is greater than that of needle 81, the power module 60 can be controlled to provide a higher current intensity to needle 83 while providing a lower current intensity to needle 81 to enhance the uniformity and consistency of the final product.

[0086] Regarding the foregoing description, it should be understood that changes may be made to details, particularly in terms of the construction materials used and the shape, size, and arrangement of components, without departing from the scope of the invention. This specification and the described embodiments are merely exemplary, and the true scope and spirit of the invention are defined by the following claims.

Claims

1. A processing system, characterized in that, It includes: One substrate; A fine needle array is located on the substrate; A retainer is configured to retain the substrate; An electrolyte tank is configured to receive an electrolyte; At least one electrode plate is located inside the electrolyte tank; An actuator module is configured to move the array of needles held on the holder relative to the electrolyte tank; A measurement module is configured to detect the position of the fine needles in the electrolyte and generate measurement data based on the detection results, wherein the movement of the fine needle array is controlled based on the measurement data; as well as A power module is configured to apply current to the electrode plates and the array of fine needles. The measurement module is used to measure the frictional force generated between the fine needle and the electrolyte or to measure the current flowing through the fine needle.

2. The processing system according to claim 1, characterized in that, It also includes an image capture component located below a bottom wall of the electrolyte tank, wherein the image capture component is configured to monitor shape changes of the needle array during the electrochemical processing.

3. The processing system according to claim 2, characterized in that, In the electrochemical processing, the electrode plate is located between the image capture component and the fine needle array, wherein the electrode plate comprises a transparent conductive oxide.

4. The processing system according to claim 1, characterized in that, It also includes an image capture component configured to examine the shape of the needle array after the electrochemical processing.

5. The processing system according to claim 1, characterized in that, The substrate includes a printed circuit board electrically connected to the power module, wherein at least two of the pins are electrically connected to two conductive paths formed in the printed circuit board, and the power module applies current to the two pins via the two conductive paths.

6. The processing system according to claim 1, characterized in that, It also includes two pairs of electrode plates, wherein the electrolyte tank includes multiple transverse sidewalls, and each of the two pairs of electrode plates is located at two opposite transverse sidewalls.

7. The processing system according to claim 1, characterized in that, The electrode plate is placed adjacent to the upper opening of the electrolyte tank and defines at least two different processing areas, wherein the power module independently controls the current applied to each processing area.

8. The processing system according to claim 1, characterized in that, It also includes a transducer placed in the electrolyte tank and configured to generate vibrations in the electrolyte in the electrolyte tank.

9. An electronic interface, characterized in that, It includes: A substrate having a lower surface and an edge surrounding said lower surface; and An array of fine needles is located on the lower surface of the substrate, wherein each of the fine needles comprises a conductive material and has a tapered end away from the lower surface of the substrate. The fine needle array includes: A first fine needle is positioned around the center of the lower surface, and the lower end of the first fine needle has a first tapered angle. A second fine needle is disposed near the edge of the substrate, and the lower end of the second fine needle has a second cone angle, the second cone angle being smaller than the first cone angle. The fine needle array further includes a third fine needle located between the first fine needle and the second fine needle, the lower end of the third fine needle having a third cone angle, the third cone angle being smaller than the first cone angle but larger than the second cone angle.

10. The electronic interface according to claim 9, characterized in that, The substrate includes a printed circuit board, wherein at least two of the fine needles are electrically connected to two conductive paths formed in the printed circuit board.

11. The electronic interface according to claim 9, characterized in that, The substrate includes a conductive substrate, and the fine needle array is electrically connected to the conductive substrate.

12. The electronic interface according to claim 9, characterized in that, At least one of the fine needles extends along a longitudinal axis perpendicular to the lower surface of the substrate and includes an inner portion and an outer portion, wherein the outer portion is farther from the longitudinal axis than the inner portion, and the inner portion and the outer portion are formed of different conductive materials.

13. A processing method, characterized in that, It includes: The fine needle array is moved into the electrolyte received in an electrolyte tank; Generate measurement data related to the position of the fine needle in the electrolyte; as well as When the measurement data meets a preset standard, an electric current is applied to the array of fine needles and an electrode plate located in the electrolyte tank, thereby changing the shape of each fine needle through an electrochemical processing technology. The measurement data is related to the frictional force generated between the fine needle and the electrolyte.

14. The processing method according to claim 13, characterized in that, The current is applied to the array of needles in the form of pulses.

15. The processing method according to claim 13, characterized in that, The electrode plate has multiple processing areas, and the method further includes inserting the fine needle array into the processing areas of the electrode plate, wherein different current intensities are applied to the processing areas.

16. The processing method according to claim 13, characterized in that, It also includes generating an image of the array of needles to examine the geometry of the needles.

17. The processing method according to claim 13, characterized in that, At least one of the fine needles is formed of two conductive materials with different reduction potentials, wherein the power applied to at least the fine needle has a voltage greater than the maximum reduction potential of the two conductive materials.

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