Heat storage system

By using inert gas cylinders and fans to pressurize the thermal storage system, and combining heating elements and insulation layers to optimize heat exchange, the problem of low heat transfer efficiency in traditional thermal storage devices is solved, enabling rapid heat release and cooling, and improving the safety and efficiency of the system.

CN119594772BActive Publication Date: 2026-05-05CHINA ENERGY INVESTMENT CORP LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHINA ENERGY INVESTMENT CORP LTD
Filing Date
2024-03-22
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

Traditional solid thermal storage devices are atmospheric pressure type, with low heat transfer efficiency, slow heat transfer speed, and easy leakage of high temperature gas, resulting in slow temperature rise and fall of the thermal storage device.

Method used

The internal structure of the thermal storage system is pressurized using inert gas cylinders and a fan. The thermal storage body is heated by heating elements. The pressurized gas is used to increase the heat release rate, and the system pressure is kept stable by the gas cylinders. The heat exchange process is optimized by combining the insulation layer and temperature measuring device.

Benefits of technology

This improves the heat release efficiency and cooling speed of the thermal storage system, prevents the leakage of high-temperature gas, and enhances the system's safety and energy utilization efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This disclosure provides a thermal storage system, including a thermal storage device with a thermal storage space and an air inlet and an air outlet communicating with the thermal storage space. The thermal storage space contains a thermal storage body for storing and releasing heat and a heating element capable of heating the thermal storage body; a heat exchanger with pipes connected to the air inlet and the air outlet; a fan located on the pipe between the heat exchanger and the air inlet for introducing gas, after heat exchange by the heat exchanger, into the thermal storage space through the air inlet; and a gas cylinder located on the pipe between the fan and the air inlet for pressurizing the gas inside the thermal storage system. This thermal storage system can heat the body using the heating element and pressurize the gas inside the system using the gas cylinder to improve the heat release efficiency of the thermal storage system and achieve rapid cooling.
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Description

Technical Field

[0001] This disclosure relates to the field of thermal energy storage and utilization technology, and more specifically, to a thermal energy storage system. Background Technology

[0002] Currently, most traditional solid thermal energy storage devices are atmospheric pressure devices. The internal gas pressure of the device is at atmospheric pressure during the thermal storage process. Furthermore, the traditional closed thermal energy storage unit structure has low heat transfer efficiency and slow heat transfer speed, which leads to slow temperature rise and fall of the thermal energy storage device and problems such as easy leakage of high-temperature gas. Summary of the Invention

[0003] The purpose of this disclosure is to provide a thermal storage system that can pressurize the gas inside the thermal storage system using an inert gas cylinder group and a fan to increase the heat release rate of the thermal storage system, thereby at least partially solving the above-mentioned problems. The inert gas cylinder group has interlocking components to maintain stable system pressure and reduce pressure instability caused by changes in gas temperature inside the system.

[0004] To achieve the above objectives, this disclosure provides a thermal storage system, including a thermal storage device, namely a thermal storage space, and an air inlet and an air outlet communicating with the thermal storage space. The thermal storage space is provided with a thermal storage body for storing and releasing heat and a heating element capable of heating the thermal storage body; a heat exchanger, with a pipeline connected to the air inlet and the air outlet; a fan, disposed on the pipeline between the heat exchanger and the air inlet, for inputting the gas after heat exchange by the heat exchanger into the thermal storage space through the air inlet; and a gas cylinder, disposed on the pipeline between the fan and the air inlet, for pressurizing the gas filling the interior of the thermal storage system.

[0005] Optionally, the gas is an inert gas; the preset pressure in the heat storage system is 0.6 to 1 MPa.

[0006] Optionally, the heat storage body includes a first heat storage section and a second heat storage section arranged alternately along the vertical direction of the heat storage space, wherein the heating element is disposed in the second heat storage section.

[0007] Optionally, the first heat storage section is constructed as a plate-shaped heat storage body, and the second heat storage section is constructed as multiple strip-shaped heat storage bodies. The multiple strip-shaped heat storage bodies extend along a first direction and are arranged at intervals between adjacent plate-shaped heat storage bodies along a second direction perpendicular to the first direction. Along the second direction, a heating element is provided between any two adjacent strip-shaped heat storage bodies.

[0008] Optionally, the heating element includes: a support member including a mounting groove extending along the first direction, the support member being disposed between two adjacent strip-shaped heat storage bodies; and a heating wire, at least partially disposed within the mounting groove of the support member.

[0009] Optionally, the two ends of the mounting groove are respectively formed with openings, and the two openings are respectively connected to the air inlet and the air outlet; the heat storage device is provided with a gas distributor that is connected to the air inlet and the plurality of openings.

[0010] Optionally, the mounting groove is constructed as a U-shaped groove, with the bottom wall of the U-shaped groove attached to the first heat storage part and the opposite side walls of the U-shaped groove attached to the second heat storage part.

[0011] Optionally, the thickness of the second heat storage section in the vertical direction is greater than the vertical extension height of the sidewall of the U-shaped groove.

[0012] Optionally, the heat storage device further includes an insulation layer; the insulation layer is disposed between the heat storage space and the outer wall of the heat storage device, and the insulation layer contains insulation material.

[0013] Optionally, the heat storage system further includes a first branch and a second branch located between the heat exchanger and the fan and connected in parallel. The first branch is equipped with a preheater, and the outlet end of the heat exchanger is equipped with a temperature measuring device.

[0014] Optionally, the thermal storage device further includes: a temperature sensor located at the air inlet and the air outlet; a pressure sensor located at the top of the thermal storage device; a flow meter located at the air inlet and the air outlet; and a safety valve located at the top of the thermal storage device.

[0015] Through the above technical solution, namely the thermal storage system provided in this disclosure, the heating element inside the thermal storage device can heat the thermal storage body. After the thermal storage body is heated to the preheating temperature, the fan can be turned on to transport room temperature gas through the air inlet to the thermal storage space to absorb the heat of the thermal storage body. The gas that has absorbed the heat is transported to the heat exchanger through the pipeline and exchanges heat with the water on the cold side of the heat exchanger. The heated water can be used by the heat user. At this time, the gas, after absorbing the heat, re-enters the fan and is blown into the thermal storage space again for circulation. The gas cylinder can pressurize the inside of the thermal storage system. When the gas pressurized to the preset pressure exchanges heat with the thermal storage body through the thermal storage space, it can increase the heat release rate of the thermal storage material in the thermal storage body. At the same time, the gas cylinder can also maintain a certain pressure inside the thermal storage system. In this way, the overall heat release efficiency of the thermal storage system can be improved, and the rapid cooling of the thermal storage system can be achieved.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of a thermal storage system provided in an exemplary embodiment of this disclosure;

[0019] Figure 2 This is a cross-sectional view of the thermal storage body provided in an exemplary embodiment of this disclosure;

[0020] Figure 3 yes Figure 2 A magnified view of part A;

[0021] Figure 4 This is a side view of the heating element provided in an exemplary embodiment of this disclosure;

[0022] Figure 5 This is a side view of another embodiment of the heating element provided in the exemplary embodiments of this disclosure;

[0023] Figure 6 This is a front view of another embodiment of the heating element provided in the exemplary embodiments of this disclosure;

[0024] Figure 7 This is a comparison curve of the heating efficiency of heating elements with various structures provided in the exemplary embodiments of this disclosure;

[0025] Figure 8 This is a graph showing the change in the convective heat coefficient of the gas as a function of pressure, provided in an exemplary embodiment of this disclosure.

[0026] Explanation of reference numerals in the attached figures

[0027] 1-Heat storage device; 101-Heat storage space; 102-Air inlet; 103-Air outlet; 104-First branch; 105-Second branch; 106-Temperature sensor; 107-Pressure sensor; 108-Flow meter; 109-Safety valve; 110-Heat storage body; 111-First heat storage section; 112-Second heat storage section; 120-Heating element; 121-Support component; 122-Mounting groove; 123-Heating wire; 124-Opening; 130-Gas distributor; 140-Insulation layer; 141-Insulation material; 150-Pressure regulating valve; 2-Heat exchanger; 3-Fan; 4-Preheater; 5-Temperature measuring device; 6-Gas cylinder. Detailed Implementation

[0028] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0029] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of the component or structure itself, and terms such as "first" and "second" are used to distinguish one element from another and do not have sequentiality or importance. In addition, the same reference numerals in different reference drawings denote the same element.

[0030] In this disclosure, an XYZ coordinate system is established for the thermal storage device 1, with reference to... Figure 1 and Figure 2 As shown, where, as Figure 1 The direction of the X arrow in the middle is the first direction, that is... Figure 2 The direction extending inwards from the plane in the diagram is the first direction, the direction of the Y arrow is the second direction, and the direction of the Z arrow is the third direction, which is the vertical direction. The first, second, and third directions are perpendicular to each other.

[0031] Through research, the inventors discovered that most traditional solid thermal energy storage devices are atmospheric or near-atmospheric pressure devices. The internal gas pressure of the device is at atmospheric pressure during the thermal storage process. Furthermore, the traditional closed thermal energy storage unit structure has low heat transfer efficiency and slow heat transfer speed, which leads to slow temperature rise and fall of the thermal energy storage device and problems such as easy leakage of high-temperature gas.

[0032] Based on this, the present disclosure provides a thermal storage system, with reference to Figures 1 to 8As shown, the thermal storage system includes a thermal storage device 1, a heat exchanger 2, a fan 3, and a gas cylinder 6. The thermal storage device 1 includes a thermal storage space 101 and an air inlet 102 and an air outlet 103 connected to the thermal storage space 101. The thermal storage space 101 contains a thermal storage body 110 for storing and releasing heat and a heating element 120 for heating the thermal storage body 110. The heat exchanger 2 is connected to the air inlet 102 and the air outlet 103. The fan 3 is located on the pipeline between the heat exchanger 2 and the air inlet 102, and is used to input the gas after heat exchange by the heat exchanger 2 into the thermal storage space 101 through the air inlet 102. The gas cylinder 6 is located on the pipeline between the fan 3 and the air inlet 102, and is used to pressurize the gas inside the thermal storage system. With this arrangement, the heating element 120 inside the thermal storage device 1 can heat the thermal storage body 110. After the heat storage body 110 is heated to a preset temperature, gas is pressurized by filling the internal pipeline of the heat storage system through the gas cylinder 6. The fan 3 is turned on, and the room temperature gas is transported through the air inlet 102 to the heat storage space 101 to absorb the heat of the heat storage body 110. The gas that has absorbed the heat is transported through the pipeline to the heat exchanger 2 to exchange heat with the water on the cold side of the heat exchanger 2. After being heated, the water on the cold side can be used by the heat user. At this time, the gas, after absorbing the heat, re-enters the fan 3 and is blown back into the heat storage space 101 for circulation. When the pressurized gas exchanges heat with the heat storage body 110 through the heat storage space 101, it can increase the heat release rate of the heat storage material in the heat storage body 110. The gas cylinder 6 can also maintain a certain pressure inside the heat storage system. In this way, the overall heat release efficiency of the heat storage system can be improved, and the heat storage system can be cooled down quickly. In addition, this disclosure does not limit the type of material of the heat storage body 110, but requires that the thermal conductivity of the material be ≥30W / (mK).

[0033] In some preferred embodiments, the fan 3 may be a centrifugal fan with a pressurization function, but this disclosure does not limit it.

[0034] In some implementations, reference Figure 1 As shown, the gas can be an inert gas; the preset pressure within the thermal storage system is 0.6–1 MPa. In this way, the inert gas has relatively stable chemical properties and is less likely to react chemically with other substances or metals in the thermal storage system. This increases the number of gas cycles within the thermal storage system and its service life. Setting the preset pressure to a range greater than atmospheric pressure, such as 0.6–1.0 MPa (6 to 10 times atmospheric pressure), allows the pressure within the thermal storage system to be increased to 0.6–1.0 MPa via gas cylinder 6. The pressurized gas is then circulated within the thermal storage system via fan 3. Related experiments have verified that this significantly improves the heat release rate of the thermal storage material within the thermal storage body 110.

[0035] Based on relevant experimental verification, and with reference... Figure 8 As shown, the horizontal axis represents the gas pressure value, and the vertical axis represents the gas convective heat transfer coefficient. The gas convective heat transfer coefficient increases with increasing pressure. The larger the convective heat transfer coefficient, the faster the gas can drive the heat storage material to release heat. Setting the preset pressure between 0.6 and 1.0 MPa can improve the heat release rate of the heat storage material and avoid the danger of cylinder explosion caused by excessive pressure.

[0036] In some implementations, reference Figures 2 to 4 As shown, the heat storage body 110 includes a first heat storage section 111 and a second heat storage section 112 arranged alternately along the vertical direction of the heat storage space 101, wherein a heating element 120 is disposed in the second heat storage section 112. This arrangement allows for greater utilization of the heat storage space 101 by alternating the first heat storage section 111 and the second heat storage section 112. Furthermore, the alternating arrangement of the first heat storage section 111 and the second heat storage section 112 allows the heating element 120 disposed in the second heat storage section 112 to simultaneously heat both sections, achieving a better heat storage effect.

[0037] In some implementations, reference Figures 2 to 4 As shown, the first heat storage section 111 is constructed as a plate-shaped heat storage body, and the second heat storage section 112 is constructed as multiple strip-shaped heat storage bodies. These strip-shaped heat storage bodies extend along a first direction and are spaced apart between adjacent plate-shaped heat storage bodies along a second direction perpendicular to the first direction. In the second direction, a heating element 120 is provided between any two adjacent strip-shaped heat storage bodies. With this arrangement, [reference needed] Figure 2 As shown, multiple plate-shaped and multiple strip-shaped heat storage bodies can jointly absorb the heat generated by the heating element 120, thereby increasing the heat storage and release rate of the heat storage body 110. The multiple heating elements 120 can simultaneously store heat in the plate-shaped and strip-shaped heat storage bodies, thereby improving the heat storage efficiency of the plate-shaped and strip-shaped heat storage bodies.

[0038] In some implementations, reference Figures 2 to 4 As shown, the heating element 120 includes a support member 121, which includes a mounting groove 122 extending along a first direction. The support member 121 is disposed between two adjacent strip-shaped heat storage bodies. A heating wire 123 is also present, at least partially disposed within the mounting groove 122 of the support member 121. This arrangement allows the mounting groove 122 within the support member 121 to accommodate the heating wire 123, and the support member 121, located adjacent to the two strip-shaped heat storage bodies, can effectively supply heat to the heat storage bodies.

[0039] Furthermore, in some preferred embodiments, the heating wire may be a metal heating wire with a high resistivity material, such as an iron-chromium-aluminum alloy or a nickel-chromium wire, etc., which is not limited in this disclosure.

[0040] In some preferred embodiments, reference Figure 4 As shown, the heating wire can extend spirally along the extension direction of the mounting groove 122, which can provide a better heating effect for the strip-shaped heat storage body.

[0041] In some implementations, reference Figure 2 and Figure 3 As shown, the two ends of the mounting groove 122 form openings 124 respectively, and the two openings 124 are connected to the air inlet 102 and the air outlet 103 respectively; the heat storage device 1 is provided with a gas distributor 130 that is connected to the air inlet 102 and the multiple openings 124. With this arrangement, the opening 124 allows the gas entering through the inlet 102 to enter the mounting slot 122 and then exit through the outlet 103. In this arrangement, the gas entering the mounting slot 122 can better absorb the heat from the first heat storage unit 111 and the second heat storage unit 112, thereby improving the efficiency of heat exchange. The input end of the gas distributor 130 is connected to the inlet 102, and the output end is connected to each of the multiple openings 124. In this way, before the gas enters the heat storage space 101 through the inlet 102, it will be evenly distributed to each opening 124 by the gas distributor 130, thereby improving the uniformity of the gas entering the multiple mounting slots 122 and better absorbing the heat from the first heat storage unit 111 and the second heat storage unit 112.

[0042] In some implementations, reference Figure 2 and Figure 3 As shown, the mounting groove 122 is constructed as a U-shaped groove, with its bottom wall surface attached to the first heat storage unit 111 and its opposite side walls attached to the second heat storage unit 112. This arrangement reduces the distance between the U-shaped groove and the first and second heat storage units 111 and 112, allowing the heat generated by the heating wire 123 to be transferred to the first and second heat storage units 111 and 112 more quickly, thus improving the heat storage efficiency of the heat storage system.

[0043] In other embodiments, reference is made to Figure 5 and Figure 6 As shown, the mounting slot 122 can also be constructed as follows: Figure 6 The number of the orifice-shaped slots shown is arranged at intervals along the extension direction of the support member 121. The heating wire 123 partially abuts against the bottom wall of the orifice-shaped slot. Heat can be transferred to the first heat storage part 111 and the second heat storage part 112 through the gap between any two adjacent orifice-shaped slots to complete the heat storage of the first heat storage part 111 and the second heat storage part 112. This can also improve the heat storage efficiency of the heat storage system. This disclosure does not limit this.

[0044] Based on relevant experimental verification, and with reference... Figure 7As shown, the mounting groove structure corresponding to Model 1 is a traditional fully sealed mounting groove, the mounting groove structure corresponding to Model 2 is an orifice-shaped groove mounting groove, and the mounting groove structure corresponding to Model 3 is a U-shaped groove mounting groove. The horizontal axis represents time, and the vertical axis represents the average temperature of the heat storage body 110. The slope of the curve indicates the speed of heat storage for different mounting groove structures, such as... Figure 7 As shown, the thermal storage efficiency is slowest when a fully sealed installation tank is used for thermal storage, higher when an orifice-shaped installation tank is used, and highest when a U-shaped installation tank is used.

[0045] In some implementations, reference Figure 2 and Figure 3 As shown, the thickness of the second heat storage section 112 in the vertical direction is greater than the vertical extension height of the U-shaped groove sidewall. With this arrangement, the first heat storage section 111 and the second heat storage section 112 are spaced apart in the third direction. The thickness of the second heat storage section 112 being greater than the height of the U-shaped groove sidewall prevents the first heat storage section 111 above the second heat storage section 112 from damaging the spirally extending heating wire 123. Simultaneously, it also allows for a certain space between the heating wire 123 and the first heat storage section 111, preventing the heating wire 123 from directly contacting the first heat storage section 111 and causing localized overheating.

[0046] In some implementations, reference Figure 2 and Figure 3 As shown, the heat storage device 1 also includes an insulation layer 140; the insulation layer 140 is disposed between the heat storage space 101 and the outer wall of the heat storage device 1, and the insulation layer 140 contains insulation material 141. In this way, the insulation material 141 in the insulation layer 140 can prevent heat loss and gas escape from the heat storage device 1, indirectly improving the heat storage efficiency of the heat storage system. Furthermore, referring to... Figure 2 and Figure 3 As shown, the insulation layer 140 can be provided in multiple layers between the heat storage space 101 and the outer wall of the heat storage device 1 to improve the heat storage space 101 insulation effect. At the same time, this disclosure does not limit the material used for the insulation material 141. For example, the insulation material 141 can be one or a combination of materials such as aluminum silicate, aerogel, and calcium silicate.

[0047] In some implementations, reference Figure 1As shown, the thermal storage system also includes a first branch 104 and a second branch 105 located between the heat exchanger 2 and the fan 3 and connected in parallel. A preheater 4 is installed on the first branch 104, and a temperature measuring device 5 is installed at the outlet of the heat exchanger. With this arrangement, the temperature measuring device 5 can measure the temperature of the gas discharged through the heat exchanger 2, and can also send opening / closing signals to the shut-off valves on the first branch 104 and / or the second branch 105 via its internal sensor based on the gas temperature, thereby controlling the opening or closing of the shut-off valves on the first branch 104 and / or the second branch 105. (Refer to...) Figure 1 As shown, the first branch 104 and the second branch 105 are respectively equipped with shut-off valves. When the temperature of the gas discharged from the heat exchanger 2 is higher than 250°C, the temperature measuring device 5 can control the shut-off valve on the first branch 104 to open and the shut-off valve on the second branch 105 to close. At this time, the gas passes through the preheater 4, and the cold water in the preheater 4 is preheated to cool the gas. After the cooled gas is below 250°C, it can re-enter the fan 3 for circulation. When the temperature of the gas discharged from the heat exchanger 2 is lower than 250°C, the temperature measuring device 5 can control the shut-off valve on the first branch 104 to close and the shut-off valve on the second branch 105 to open. The gas directly passes through the second branch 105 and re-enters the fan 3 for circulation. In this way, the safety hazard of the fan 3 overheating due to excessively high gas temperature can be reduced, and the energy utilization efficiency of the heat storage system can also be improved.

[0048] In a preferred embodiment of this disclosure, the preheater 4 can be any type of preheater such as a shell-and-tube preheater or a plate preheater, and the heat exchanger can be any type of heat exchanger such as a direct contact heat exchanger, a storage heat exchanger, or a partition heat exchanger. This disclosure does not limit the types of heat exchangers used.

[0049] Furthermore, the temperature measuring device 5 provided in this disclosure can be any type of temperature measuring device. For example, it can be a temperature sensor electrically connected to the shut-off valve. The probe of the temperature sensor can contact the gas to receive a signal indicating whether the gas temperature is higher than 250°C. The shut-off valve can be an electric valve electrically connected to the temperature sensor. When a signal indicating that the gas temperature is higher than or equal to 250°C is received, the electric valve on the first branch 104 is energized and opened, and the electric valve on the second branch 105 is closed. When a signal indicating that the gas temperature is lower than 250°C is received, the electric valve on the second branch 105 is energized and opened, and the electric valve on the first branch 104 is closed. This disclosure does not limit the scope of the application.

[0050] In some implementations, reference Figure 1As shown, the thermal storage device 1 also includes a temperature sensor 106, a pressure sensor 107, a flow meter 108, and a safety valve 109. The temperature sensor 106 is located at the air inlet 102 and the air outlet 103, the pressure sensor 107 is located at the top of the thermal storage device 1, the flow meter 108 is located at the air inlet 102 and the air outlet 103, and the safety valve 109 is located at the top of the thermal storage device 1. With this arrangement, the temperature sensor 106 can measure the temperature of the gas at the air inlet 102 and the air outlet 103, so that the staff can monitor the temperature of the thermal storage body 110 in real time. The pressure sensor 107 can facilitate the staff to monitor the internal pressure of the thermal storage device 1 in real time, so as to prevent the thermal storage device 1 from bursting or other dangerous situations due to excessive pressure. When the internal pressure of the thermal storage device 1 is too high, the system interlock protection automatically opens the safety valve 109 to release the excessive pressure inside the thermal storage system for emergency avoidance, thereby improving the safety of the thermal storage system.

[0051] In some preferred embodiments of this disclosure, the heat storage device 1 is further provided with a pressure regulating valve 150, so that the operator can adjust the internal pressure of the heat storage device 1 through the pressure regulating valve 150 to improve the heat release efficiency of the heat storage system.

[0052] This disclosure exemplarily describes the operation of a thermal storage system, which may include, for example, the following steps:

[0053] Heat storage process: Before heating, the air in the system is replaced by an inert gas cylinder group. The heating element 120 inside the heat storage device 1 is heated by power supply. The heat generated by the heating element 120 is transferred to the first heat storage section 111 and the second heat storage section 112. When the temperature value displayed by the temperature sensor 106 of the control system reaches the preset temperature, the system automatically turns off the power and stops heating the heating element 120. At this time, the heat storage process is completed.

[0054] Heat release process: When the first heat storage unit 111 and the second heat storage unit 112 are heated to the preset temperature, inert gas is injected into the heat storage system through the gas cylinder 6, and the internal pressure of the heat storage system is increased to the preset pressure. Then, the fan 3 is turned on, and the fan 3 will circulate the gas inside the heat storage system pipeline. The gas in the heat storage device 1 will enter the pipeline through the gas outlet 103. The gas in the pipeline first passes through the heat exchanger 2 and exchanges heat with the water on the cold side of the heat exchanger 2, heating the water on the cold side into high-temperature water or high-temperature steam. At this time, the gas temperature decreases. After the gas passes through the temperature measuring device, the temperature will be detected by the temperature measuring device. If the gas temperature is lower than 250°C, the gas will be released. If the temperature is above 250℃, the temperature measuring device can control the shut-off valve on the second branch 105 to open and the shut-off valve on the first branch 104 to close. The gas will then directly enter the fan 3 again through the second branch 105 for the next cycle. If the gas temperature is above 250℃, the temperature measuring device will control the shut-off valve on the first branch 104 to open and the shut-off valve on the second branch 105 to close. The gas will then enter the preheater 4 to preheat the cold water in the preheater 4 and exchange heat again. The cooled gas will then enter the fan 3 again for the next cycle, thus completing the heat release process. The heated water in the heat exchanger can be circulated to the heat user through an external water pump.

[0055] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0056] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0057] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A thermal storage system, characterized in that, include: A heat storage device includes a heat storage space and an air inlet and an air outlet communicating with the heat storage space. The heat storage space is provided with a heat storage body for storing and releasing heat and a heating element capable of heating the heat storage body. A heat exchanger, with piping connected to the air inlet and the air outlet; A fan is installed on the pipeline between the heat exchanger and the air inlet, and is used to input the gas after heat exchange by the heat exchanger into the heat storage space through the air inlet. as well as A gas cylinder, located on the pipeline between the fan and the air inlet, is used to pressurize the gas inside the thermal storage system, so that the preset pressure inside the thermal storage system reaches 0.6~1MPa; the fan is used to circulate the pressurized gas inside the thermal storage system to increase the heat release rate of the thermal storage material inside the thermal storage body. The heat storage body includes a first heat storage section and a second heat storage section arranged alternately along the vertical direction of the heat storage space, wherein the heating element is disposed in the second heat storage section; The first heat storage section is constructed as a plate-shaped heat storage body, and the second heat storage section is constructed as multiple strip-shaped heat storage bodies. The multiple strip-shaped heat storage bodies extend along a first direction and are arranged at intervals between two adjacent plate-shaped heat storage bodies along a second direction perpendicular to the first direction. Along the second direction, a heating element is provided between any two adjacent strip-shaped heat storage bodies. The heating element includes: a support member including a mounting groove extending along the first direction, the support member being disposed between two adjacent strip-shaped heat storage bodies; and a heating wire, at least partially disposed within the mounting groove of the support member; The mounting groove has openings at both ends, and the two openings are respectively connected to the air inlet and the air outlet; the heat storage device is equipped with a gas distributor that is connected to the air inlet and the plurality of openings. The gas distributor is used to evenly distribute gas to each of the mounting slots; The mounting groove includes multiple orifice-shaped grooves, and the number of orifice-shaped grooves is arranged at intervals along the extension direction of the support member. The heating wire part abuts against the bottom wall of the orifice-shaped groove. Heat can be transferred to the first heat storage part and the second heat storage part through the gap between any two adjacent orifice-shaped grooves to complete the heat storage of the first heat storage part and the second heat storage part.

2. The thermal storage system according to claim 1, characterized in that, The gas used is an inert gas.

3. The thermal storage system according to claim 1, characterized in that, The mounting groove is constructed as a U-shaped groove, with the bottom wall of the U-shaped groove attached to the first heat storage part and the opposite side walls of the U-shaped groove attached to the second heat storage part.

4. The thermal storage system according to claim 3, characterized in that, The thickness of the second heat storage section in the vertical direction is greater than the vertical extension height of the sidewall of the U-shaped groove.

5. The thermal storage system according to claim 1, characterized in that, The heat storage device also includes an insulation layer; The insulation layer is disposed between the heat storage space and the outer wall of the heat storage device, and the insulation layer contains insulation material.

6. The thermal storage system according to claim 1, characterized in that, The thermal storage system also includes a first branch and a second branch located between the heat exchanger and the fan and connected in parallel. The first branch is equipped with a preheater, and the outlet end of the heat exchanger is equipped with a temperature measuring device.

7. The thermal storage system according to claim 6, characterized in that, The thermal storage device also includes: Temperature sensors are located at the air inlet and the air outlet; A pressure sensor is located on the top of the thermal storage device; Flow meters are installed at the air inlet and the air outlet; and A safety valve is located at the top of the thermal storage device.

Citation Information

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