Camera module and electronic device including same

Abstract

A camera module according to an embodiment includes: a lens assembly; an image sensor; an optical image stabilization (OIS) bracket configured to simultaneously rotate the lens assembly and the image sensor based on an axis perpendicular to the optical axis; a housing; a first OIS coil provided to a first side surface of the OIS bracket; a second OIS coil provided to a second side surface of the OIS bracket; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; comprising a first part and a second part, the first part is arranged between a third side surface, opposite to the first side surface, of the OIS bracket and the shell and comprises at least one first guide part, and the second part extends from the first part and is arranged between a fourth side surface, opposite to the second side surface, of the OIS bracket and the shell; at least one first object disposed between the first portion and the third side surface; and at least one second object disposed between the second portion and the housing. The at least one first object may be configured to roll along the at least one first guide portion based on rotation of the OIS carriage. In addition to this, various embodiments as seen in the specification are possible.

Description

Technical Field

[0001] Various embodiments disclosed in this document relate to a camera module and an electronic device including the camera module. Background Art

[0002] Recently, portable terminals such as tablet PCs and notebooks and mobile phones such as smartphones are equipped with high-performance micro camera modules. As portable terminals are miniaturized, image quality may deteriorate because the response to hand shaking during image capture increases. For example, the higher the magnification of the camera, the greater the degree of shaking of the image according to the shaking of the camera.

[0003] Therefore, among camera functions, the shake correction function is a necessary and important function for obtaining a clear picture. Generally, as a shake correction method for the image stabilization function, there are optical image stabilization (OIS) and digital IS (DIS). As an optical shake correction method (such as OIS), there are methods of reducing shake by moving the lens or sensor, and methods of reducing shake by rotating the lens and sensor at the same time. The digital shake correction method (such as DIS) is a method borrowed from a portable terminal, which refers to a method of reducing shake by digital processing. Summary of the invention

[0004] Solution to the problem

[0005] According to an example embodiment, a camera module may include: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to tilt the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side of the OIS bracket; a second OIS coil disposed to a second side of the OIS bracket different from the first side; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side of the OIS bracket opposite to the first side and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side of the OIS bracket opposite to the second side and the housing; at least one first object movably disposed between the first portion and the third side and configured to enable the OIS bracket to move; and at least one second object movably disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The at least one first object may be configured to move along the at least one first guide portion as the OIS bracket tilts.

[0006] An electronic device according to an example embodiment may include a first camera module. The first camera module may include: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an OIS bracket configured to tilt the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side of the OIS bracket; a second OIS coil disposed to a second side of the OIS bracket different from the first side; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side of the OIS bracket opposite to the first side and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side of the OIS bracket opposite to the second side and the housing; at least one first object movably disposed between the first portion and the third side surface and configured to enable the OIS bracket to move; and at least one second object movably disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The at least one first object may be configured to move along the at least one first guide portion as the OIS bracket tilts. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is an exploded perspective view of a camera module according to an embodiment.

[0008] Figure 2 is a perspective view showing a frame according to an embodiment.

[0009] Figure 3 is a diagram illustrating a first portion of a framework according to an embodiment.

[0010] Figure 4 is a perspective view illustrating a printed circuit board and an OIS bracket on which the printed circuit board is disposed according to an embodiment.

[0011] Figure 5 is a perspective view illustrating positions of an OIS coil, an OIS magnet, and a frame in a camera module according to an embodiment.

[0012] Figure 6 is a transparent view illustrating rotation of an OIS bracket when current is applied to a first OIS coil according to an embodiment.

[0013] Figure 7 is a transparent view illustrating rotation of an OIS bracket when current is applied to a second OIS coil according to an embodiment.

[0014] Figure 8is a transparent perspective view showing a sub-housing and a frame according to an embodiment.

[0015] Fig. 9 is a partial perspective view showing a camera module according to an embodiment.

[0016] Fig.10 is a cross-sectional view of a camera module according to an embodiment.

[0017] Fig.11 is a cross-sectional view of a camera module according to an embodiment.

[0018] Fig.12 is a transparent perspective view showing a frame including a magnet according to an embodiment.

[0019] Fig.13 is a perspective view illustrating a printed circuit board and an OIS bracket on which the printed circuit board is disposed according to an embodiment.

[0020] Fig.14 is a perspective view illustrating positions of an OIS coil, an OIS magnet, and a frame in a camera module according to an embodiment.

[0021] Fig.15 is a perspective view showing a camera module according to an embodiment.

[0022] Fig.16 is a diagram showing a plan view showing a front surface and a rear surface of an electronic device including a camera module according to an embodiment.

[0023] Fig.17 yes Fig.16 A cross-sectional view taken along line CC' of the figure.

[0024] Fig.18 is a diagram showing a plan view illustrating the height of a camera module according to an embodiment.

[0025] Fig.19 is a block diagram illustrating an example electronic device in a network environment according to various embodiments.

[0026] Fig. 20 is a block diagram illustrating an example configuration of a camera module according to various embodiments.

[0027] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar elements. Specific embodiments

[0028] Hereinafter, various exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that the present disclosure is not intended to limit the present disclosure to specific embodiments, and includes various modifications, equivalents and / or alternatives of the embodiments of the present disclosure.

[0029] The electronic device of various embodiments of the present disclosure may include, for example, a smart phone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or at least one of a wearable device. According to various embodiments, the wearable device may include at least one of an accessory type (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)), a fabric or clothing integrated type (e.g., electronic clothing), a body-attached type (e.g., a skin pad or a tattoo), or a living implantable type (e.g., an implantable circuit).

[0030] In various embodiments, the electronic device may be a household appliance. The household appliance may include, for example, at least one of a television, a digital video disk (DVD) player, an audio system, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camera, or an electronic photo frame.

[0031] In one embodiment, the electronic device may include at least one of various medical devices (such as various portable medical measuring devices (blood glucose meters, heart rate monitors, blood pressure monitors, or body temperature monitors), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT), cameras, or ultrasonic devices), navigation devices, global navigation satellite systems (GNSS), event data recorders (EDRs), flight data recorders (FDRs), car infotainment devices, ship electronic equipment (such as ship navigation devices or gyrocompasses), avionics equipment, security devices, car hosts, commercial or home robots, automated teller machines (ATMs) in financial institutions, point-of-sale terminals (POS) in stores, or the Internet of Things (such as light bulbs, various sensors, electricity meters or gas meters, sprinklers, smoke alarms, thermostats, street lights, toasters, exercise equipment, hot water tanks, heaters, or boilers).

[0032] According to various embodiments, the electronic device may include at least one of a part of furniture or a building / structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., water, electricity, gas, or radio wave measuring devices). In various embodiments, the electronic device may be one of the aforementioned various devices or a combination thereof. The electronic device of various embodiments may be a flexible electronic device. In addition, the electronic device of the embodiments of the present disclosure is not limited to the above-mentioned devices, and may include new electronic devices brought about by technological development.

[0033] Figure 1 is an exploded perspective view of a camera module 100 according to an embodiment.

[0034] According to an embodiment, the at least one electronic device may include at least one camera module 100. For example, at least one camera module may be disposed on the rear surface of a smartphone to face the rear of the smartphone. However, the present disclosure is not limited thereto. Those skilled in the art may clearly understand that Figure 1 The camera module 100 may be applied to electronic devices equipped with a camera among various electronic devices or mobile devices.

[0035] Reference Figure 1 , the camera module 100 of an embodiment may include a lens assembly 101, an optical image stabilization (OIS) bracket 110 accommodating at least a portion of the lens assembly 101, a frame 130 surrounding at least a portion of the OIS bracket 110, and a housing 120 accommodating the OIS bracket 110 and the frame 130. However, the configuration of the camera module 100 is not limited thereto. The camera module 100 may add or omit at least one of the above components. For example, the camera module 100 may further include a printed circuit board 180 and / or a lower cover 190. In an example, the camera module 100 may further include an image sensor 181.

[0036] According to one embodiment, the lens assembly 101 may be disposed inside the OIS bracket 110. In one embodiment, the lens assembly 101 may include at least one lens. The at least one lens may be aligned along an optical axis. In one example, the lens may be moved forward and backward along the optical axis (e.g., the Z axis) and may be operated to clearly capture a target object as a subject by changing a focus position.

[0037] According to an embodiment, light information of a subject incident (or received) through the lens assembly 101 may be converted into an electric signal and input to an image signal processor through the image sensor 181. However, the present disclosure is not limited thereto.

[0038] According to an embodiment, the image sensor 181 may be disposed on an upper surface of a printed circuit board 180 (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)). The image sensor 181 may be electrically connected to an image signal processor connected to the printed circuit board 180 through a connector. As the connector, a flexible printed circuit board (FPCB) or a cable, etc. may be used.

[0039] According to an embodiment, the image sensor 181 may include, for example, but not limited to, a complementary metal oxide semiconductor (CMOS) sensor or a charge coupled device (CCD) sensor, etc. A plurality of individual pixels may be integrated in the image sensor 181, and each individual pixel may include a microlens, a color filter, and a photodiode. Each individual pixel is a photodetector and may convert input light into an electrical signal. The photodetector may include a photodiode.

[0040] According to an embodiment, the OIS bracket 110 may accommodate at least a portion of the lens assembly 101. For example, the OIS bracket 110 may surround the lens assembly 101. According to an embodiment, the OIS bracket 110 may include a first side surface 111, a third side surface 113 facing the first side surface 111, a second side surface 112 substantially perpendicular to the first side surface 111 and the third side surface 113, and a fourth side surface 114 substantially perpendicular to the first side surface 111 and the third side surface 113 and facing the second side surface 112. However, the present disclosure is not limited thereto.

[0041] According to an embodiment, the OIS bracket 110 may include an opening at a top center portion, through which a portion of the lens assembly 101 may be exposed.

[0042] According to an embodiment, the OIS bracket 110 may include a first OIS coil 161 disposed on the first side surface 111 and a second OIS coil 162 disposed on the second side surface 112. The first OIS coil 161 may be disposed substantially perpendicular to the second OIS coil 162. Figure 1 In FIG. 1 , the OIS coil is shown to be disposed on the side surface of the OIS bracket 110, but the present disclosure is not limited thereto. For example, the OIS magnet may also be disposed on the side surface of the OIS bracket 110. Figure 1 , it is shown that one OIS coil is provided on each side surface of the OIS bracket 110, but the number of the OIS bracket 110 is not limited thereto.

[0043] According to an embodiment, the camera module 100 may include a housing 120, the housing 120 mounting a lens barrel and at least one coil and / or magnet surrounding the lens barrel around an optical axis, the lens barrel mounting at least one or more lenses aligned on the optical axis. For example, the camera module 100 may include a first OIS coil 161 disposed on a first side surface 111 of the OIS bracket 110, a second OIS coil 162 disposed on a second side 112 of the OIS bracket 110, a first OIS magnet 171 disposed to face the first OIS coil 161, and a second OIS magnet 172 disposed to face the second OIS coil 162. For example, see Figure 1 , the housing 120 may include a first OIS magnet 171 and a second OIS magnet 172 on the inner surface. However, the present disclosure is not limited thereto. In another example, the housing 120 may also include a first OIS coil 161 and a second OIS coil 162 on the inner surface, and the OIS bracket 110 may include a first OIS magnet disposed to face the first OIS coil 161 and a second OIS magnet disposed to face the second OIS coil 162.

[0044] According to one embodiment, the housing 120 may accommodate at least a portion of the OIS bracket 110. The housing 120 may be formed in a box shape having an internal space. For example, the housing 120 may be formed to surround at least a portion of the side surface of the OIS bracket 110. However, the present disclosure is not limited thereto. For example, at least a portion of one side surface of the housing 120 may be open. According to one embodiment, the housing 120 may include a sub-housing 121, which is disposed on a side surface of which at least a portion is open. In another example, the sub-housing 121 may also be formed integrally with the housing 120.

[0045] According to one embodiment, the first OIS magnet 171 can be set on the inner surface of the shell 120 facing the first OIS coil 161 set on the OIS bracket 110, and the second OIS magnet 172 can be set on the inner surface of the shell 120 facing the second OIS coil 162 set on the OIS bracket 110.

[0046] In one embodiment, the camera module 100 may use at least one coil and / or magnet included in the housing 120 to perform a function of stabilization (e.g., OIS) of an image acquired by an image sensor (not shown). For example, when at least one OIS coil interacts with at least one OIS magnet, the OIS bracket 110 may rotate the lens assembly 101 and the image sensor 181. For example, the OIS bracket 110 may rotate the lens assembly 101 and the image sensor 181 based on an axis (e.g., an X-axis or a Y-axis) perpendicular to the optical axis. For example, at least one coil may electromagnetically interact with each other under the control of a control circuit. For example, under the control of a processor, the camera module 100 may control the electromagnetic force by controlling the direction and / or intensity of a current passing through at least one coil. Using, for example, a Lorentz force caused by an electromagnetic force, the camera module 100 may rotate at least one of the lens assembly 101 and the OIS bracket 110 including the lens assembly 101 around an axis substantially perpendicular to the optical axis (e.g., a Z-axis), or move in a direction substantially perpendicular to the optical axis.

[0047] According to an embodiment, the housing 120 may include an opening at a top center portion through which a portion of the lens assembly 101 may be exposed.

[0048] According to one embodiment, the camera module 100 may include at least one frame 130 disposed between the OIS bracket 110 and the housing 120. According to one embodiment, the frame 130 may be a member that guides the tilt of the OIS bracket 110 and the image sensor 181. In the present disclosure, the member that guides the tilt of the OIS bracket 110 and the image sensor 181 is referred to as a frame 130, but is not limited thereto. For example, the member for guiding the tilt may be referred to as an intermediate object or a tilting object. For example, since the member that guides the tilt is disposed between (or in the middle of) the housing 120 and the OIS bracket, it may be referred to as an intermediate object. However, the present disclosure is not limited thereto.

[0049] According to an embodiment, at least one frame 130 may include a first portion 131 disposed between a third side 113 (e.g., a third side surface) of the OIS bracket 110 and the housing 120, and a second portion 132 disposed between a fourth side 114 (e.g., a fourth side surface) of the OIS bracket 110 and the housing 120. At least one of the first portion 131 or the second portion 132 may include at least one guide portion. The second portion 132 may extend from the first portion 131. In the present disclosure, the extension may include being formed by one member. The second portion 132 may be substantially perpendicular to the first portion 131. However, the present disclosure is not limited thereto.

[0050] According to one embodiment, the camera module 100 may include at least one object for tilting the OIS bracket 110 and / or the frame 130. For example, the camera module 100 includes at least one first object 141 movably disposed between the first portion 131 and the third side 113, and at least one second object 142 movably disposed between the second portion 132 and the fourth side 114. In one example, at least one of the at least one first object 141 and the at least one second object 142 may include a ball. However, the present disclosure is not limited thereto. For example, at least one first object 141 includes a member that allows the OIS bracket 110 to tilt between the frame 130 and the OIS bracket 110, and at least one second object 142 may include a member that allows the frame 130 and the OIS bracket 110 to tilt between the frame 130 and the housing 120 (e.g., the sub-housing 121). In one example, at least one of the at least one first object 141 or the at least one second object 142 may include a member that can move (e.g., slide or roll) along at least one of an axis or a track, but is not limited thereto.

[0051] According to an embodiment, the camera module 100 may include at least one first object 141 disposed between the first portion 131 and the third side surface 113 , and at least one second object 142 disposed between the second portion 132 and the fourth side surface 114 . Figure 1 The number and / or position of the at least one first object 141 and the at least one second object 142 shown in the figure are not limited to Figure 1 .

[0052] According to an embodiment, at least one first object 141 may contact the OIS bracket 110. The at least one first object 141 may move (rotate) on the OIS bracket 110 within a certain range.

[0053] According to an embodiment, the at least one first object 141 can reduce the friction between the OIS bracket 110 and the frame 130 by forming a point contact between the OIS bracket 110 and the first portion 131 of the frame 130. The above-mentioned action can be performed by moving (rotating) the at least one first object 141 on the OIS bracket 110. The rotation of the at least one first object 141 and the movement of the OIS bracket 110 can occur together.

[0054] According to an embodiment, at least one second object 142 may contact at least a portion of the housing 120. For example, at least one second object 142 may contact the sub-housing 121. At least one second object 142 may also move (rotate) within a certain range on at least a portion of the housing 120 (e.g., the sub-housing 121).

[0055] According to an embodiment, the at least one second object 142 can reduce the friction between the housing 120 and the frame 130 by forming a point contact between the housing 120 (e.g., the sub-housing 121) and the second portion 132 of the frame 130. The above-mentioned effect can be performed by moving (rotating) the at least one second object 142 on the housing 120. The rotation of the at least one second object 142 and the movement of the OIS bracket 110 and / or the frame 130 can occur together.

[0056] According to an embodiment, the frame 130 may include at least one first magnet 151 disposed on the first portion 131 and at least one second magnet 152 disposed on the second portion 132 .

[0057] According to an embodiment, the third side surface 113 may include at least one first yoke facing the at least one first magnet 151. According to an embodiment, the inner surface of the housing 120 (eg, the sub-housing 121) facing the second portion 132 may include at least one second yoke facing the at least one second magnet 152.

[0058] According to one embodiment, the first magnet 151 may be disposed at a position corresponding to at least one yoke disposed on one side surface of the OIS bracket 110, thereby fixing the frame 130 inside the camera module 100. The second magnet 152 may be disposed at a position corresponding to at least one yoke disposed in the housing 120 (e.g., the sub-housing 121), thereby fixing the frame 130 inside the camera module 100. In the present disclosure, a magnet may refer to, for example, a magnet for adsorption. However, the present disclosure is not limited thereto. For example, the magnet may include at least one of a member attracted to at least one yoke disposed on the OIS bracket 110 or a member attracted to at least one yoke disposed on the housing 120.

[0059] According to an embodiment, the at least one printed circuit board 180 may include a slot type printed circuit board. However, the present disclosure is not limited thereto.

[0060] According to an embodiment, the camera module 100 of the present disclosure can reduce the difficulty of manufacturing, simplify assembly, and reduce performance deviation and ensure reliability.

[0061] According to an embodiment, the camera module 100 may be applied with module tilt OIS. In an example, the module tilt OIS may refer to, for example, the image sensor 181 and the OIS bracket being tilted. However, the present disclosure is not limited thereto.

[0062] Figure 2 is a perspective view showing a frame 130 according to an embodiment.

[0063] Figure 2 The frame 130 can be Figure 1 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant information may not be repeated.

[0064] Reference Figure 2 , the frame 130 may have a shape in which a plate is bent. For example, the first portion 131 of the frame 130 may be a plate having one direction (e.g., the Y-axis direction) as a longitudinal direction. The second portion 132 may be a plate extending from the first portion 131 and having a longitudinal direction (e.g., the X-axis direction) substantially perpendicular to the longitudinal direction of the first portion 131. However, the present disclosure is not limited thereto. In one example, the frame 130 has a first side and a second surface, the first side being substantially perpendicular to an axis (e.g., the X-axis) substantially perpendicular to the optical axis, and the second surface being substantially perpendicular to another axis (e.g., the Y-axis) substantially perpendicular to the optical axis.

[0065] According to an embodiment, the first portion 131 may include a first accommodating portion 131A and a second accommodating portion 131B. The second accommodating portion 131B may be formed at a position spaced apart from the first accommodating portion 131A by a predetermined (e.g., specified) distance along the longitudinal direction of the first portion 131. In an example, at least one of the first accommodating portion 131A or the second accommodating portion 131B may include at least one of a groove, an opening, or a track. However, the present disclosure is not limited thereto. As used herein, the longitudinal direction may refer to the direction of the long side of a member. However, the present disclosure is not limited thereto.

[0066] According to an embodiment, the first receiving portion 131A and the second receiving portion 131B may include an OIS bracket (eg, Figure 1 The shape of the first receiving portion 131A and the second receiving portion 131B may be corresponding to the direction in which the OIS bracket 110 rotates. For example, the first receiving portion 131A and the second receiving portion 131B may include a shape bent toward each other in one direction. However, the present disclosure is not limited thereto.

[0067] According to an embodiment, the first portion 131 may include a first bent portion 133 disposed between the first receiving portion 131A and the second receiving portion 131B. The first bent portion 133 may be disposed on an outer surface of the first portion 131. For example, the first bent portion 133 may be convexly formed on a portion of the frame 130 facing the housing (e.g., Figure 1 In one example, the first curved portion 133 may be a shape protruding in a direction (eg, +X direction) from the third side surface 113 of the OIS bracket 110 to the inner surface of the housing, which is substantially parallel to the third side surface 113.

[0068] According to an embodiment, the first curved portion 133 may include a curved shape. For example, the first curved portion 133 may be seamlessly formed from the top edge of the first portion 131 toward the bottom edge of the first portion 131. However, the present disclosure is not limited thereto. In an example, the first curved portion 133 may include a protruding portion protrudingly formed in one direction (e.g., a direction toward the housing).

[0069] According to an embodiment, the second portion 132 may include a third accommodating portion 132A and a fourth accommodating portion 132B. The third accommodating portion 132A may be formed at a position spaced apart from the fourth accommodating portion 132B by a predetermined (e.g., specified) distance along the longitudinal direction of the second portion 132. In one example, at least one of the third accommodating portion 132A or the fourth accommodating portion 132B may include at least one of a groove, an opening, or a track. However, the present disclosure is not limited thereto.

[0070] According to one embodiment, the third receiving portion 132A and the fourth receiving portion 132B may include an OIS bracket (eg, Figure 1 The shape may correspond to the direction in which the OIS bracket 110 and / or the frame 130 rotates. For example, the third receiving portion 132A and the fourth receiving portion 132B may include a shape bent toward each other in one direction. However, the present disclosure is not limited thereto.

[0071] According to one embodiment, the second portion 132 may include a second bent portion 134 disposed between the third accommodating portion 132A and the fourth accommodating portion 132B. The second bent portion 134 may be disposed on an inner surface of the second portion 132. For example, the second bent portion 134 may be convexly formed on a side surface of the frame 130 facing the side surface of the OIS bracket 110. In one example, the second bent portion 134 may be a shape protruding in a direction (e.g., +Y direction) opposite to a direction pointing from the fourth side surface 114 of the OIS bracket 110 to the inner surface of the housing (e.g., the inner surface of the sub-housing 121), and the inner surface is substantially parallel to the fourth side surface 114.

[0072] According to an embodiment, the second curved portion 134 may include a curved shape. For example, the second curved portion 134 may be seamlessly formed from a top edge of the second curved portion 134 toward a bottom edge of the second curved portion 134. However, the present disclosure is not limited thereto.

[0073] According to an embodiment, the second bent portion 134 may be disposed at a position spaced apart by a predetermined (eg, specified) distance from a top edge of the second portion 132 and a bottom edge of the second portion 132. However, the present disclosure is not limited thereto.

[0074] According to an embodiment, the second bent portion 134 may be disposed along a longitudinal direction (eg, an X-axis direction) of the second portion 132 as a longitudinal direction. However, the present disclosure is not limited thereto.

[0075] Figure 3 is a diagram schematically illustrating a first portion 131 of a frame 130 according to an embodiment.

[0076] Figure 3 The frame 130 can be Figure 1 and Figure 2 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0077] Figure 3 The inner surface (eg, facing the inner surface of the first portion 131 of the frame 130) can be schematically shown. Figure 2 The structure of the frame 130 is not limited to Figure 3 For example, the frame 130 may omit at least one of components to be described later, or may further include at least one component.

[0078] Reference Figure 3 , the frame 130 may include at least one guide portion for receiving at least one object 141. The at least one guide portion may be a guide for guiding the OIS bracket 110 and the image sensor 181 relative to the housing (eg Figure 1 For example, the first portion 131 may include at least one of the first guide portion 131C or the second guide portion 131D for guiding the OIS bracket 110 to tilt relative to an axis substantially perpendicular to the optical axis (e.g., the X axis). For example, the second portion 132 includes a third guide portion (e.g., the Y axis) for guiding the OIS bracket 110 and the frame 130 to tilt based on an axis substantially perpendicular to the optical axis (e.g., the Y axis). Figure 6 The third guide portion 132C) and the fourth guide portion (eg Figure 6 In one example, an axis substantially perpendicular to the optical axis (eg, an X-axis or a Y-axis) may be referred to as a reference axis.

[0079] According to an embodiment, the first portion 131 may include at least one second guide portion 131D opposite to the at least one first guide portion 131C about a reference axis (eg, X-axis) along which the OIS bracket is tilted.

[0080] According to one embodiment, the second portion 132 may include a reference axis (eg, Y axis) and at least one third guide portion (eg, Figure 6 At least one fourth guide portion (eg, Figure 6 The frame and the OIS bracket are tilted along the reference axis.

[0081] According to an embodiment, at least one guide portion (eg, first guide portion 131C) is capable of guiding the OIS bracket 110 and the image sensor 181 relative to the housing (eg, Figure 1 The housing 120 in the housing 120 is tilted. For example, at least one guide portion may include at least one of a guide groove, an opening, a shaft, or a track. However, the present disclosure is not limited.

[0082] According to an embodiment, the first guide portion 131C may be formed at a position spaced apart from the second guide portion 131D by a predetermined (e.g., specified) distance along the longitudinal direction (e.g., Y-axis direction) of the first portion 131. In one example, the first receiving portion 131A and the second receiving portion 131B may be disposed between the first guide portion 131C and the second guide portion 131D. However, the present disclosure is not limited thereto. In another example, the first guide portion 131C and the second guide portion 131D may also be disposed between the first receiving portion 131A and the second receiving portion 131B.

[0083] According to an embodiment, the first guide portion 131C and the second guide portion 131D may include a first guide portion 131C and a second guide portion 131D connected to an OIS bracket (eg, Figure 1 The first guide portion 131C and the second guide portion 131D may include a shape corresponding to the direction in which the OIS bracket 110 rotates. For example, the first guide portion 131C and the second guide portion 131D may include a shape that is bent toward each other in one direction. However, the present disclosure is not limited thereto.

[0084] According to an embodiment, at least a portion of at least one first object 141 may be disposed within at least one guide portion (eg, first guide portion 131C and / or second guide portion 131D) to guide the OIS bracket (eg, Figure 1 The OIS bracket 110) rotates along at least one guide portion.

[0085] According to an embodiment, at least a portion of at least one first object 141 may be accommodated in at least one guide portion. Figure 3 , a plurality of first objects 141 may be disposed inside the guide portion in a longitudinal direction of the guide portion. However, the present disclosure is not limited thereto.

[0086] According to an embodiment, the first object 141 may include a first group 141A disposed in the first guide portion 131C and including a plurality of first objects 141. In an example, at least some of the plurality of first objects 141 in the first group 141A may have different shapes and / or sizes. According to an embodiment, the first object 141 may include a second group 141B disposed in the second guide portion 131D and including a plurality of first objects 141. In an example, at least some of the plurality of first objects 141 in the second group 141B may have different shapes and / or sizes. However, the present disclosure is not limited thereto.

[0087] According to an embodiment, at least one first object 141 may be at least partially contained within at least one guide portion and guided along the guide portion (e.g., the inside of a guide groove). In the present disclosure, being guided may, for example, refer to an operation of being contained within an area and moving, rotating, sliding, or rolling therein. However, the present disclosure is not limited thereto.

[0088] According to an embodiment, the frame 130 may include a first magnet 151 disposed between the first guide portion 131C and the second guide portion 131D. The first magnet 151 may be disposed between the first receiving portion 131A and the second receiving portion 131B. In an example, the first magnet 151 may be disposed in a central portion of the first portion 131. However, the present disclosure is not limited thereto. Figure 3 , the first magnet 151 is shown to be exposed from the inner surface of the first portion 131, but the present disclosure is not limited thereto. For example, the first magnet 151 may be disposed inside the first portion 131, so at least a portion thereof may not be visible from the outside.

[0089] although Figure 3 The second portion of the frame 130 (eg Figure 2 The second part 132 is not shown, but the structure of the second part, the position of the components and / or the arrangement relationship of the components can be referenced through the first part 131.

[0090] Figure 4 is a perspective view illustrating a printed circuit board 160 and an OIS bracket 110 on which the printed circuit board 160 is disposed according to an embodiment.

[0091] Figure 4 (a) may be a perspective view of the printed circuit board 160, Figure 4 (b) may be a perspective view of the OIS bracket 110 on which the printed circuit board 160 is disposed.

[0092] Figure 4 The OIS bracket 110 and at least one OIS coil (eg, the first OIS coil 161) may be referred to as Figure 1The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant information may not be repeated.

[0093] According to one embodiment, at least one camera module (eg Figure 1 The camera module 100 may include at least one printed circuit board 160 surrounding at least a portion of the OIS bracket 110. For example, the printed circuit board 160 may be provided from a second side surface (eg, Figure 1 The second side surface 112) is along the first side surface (eg Figure 1 The first side surface 111) extends to the fourth side surface (eg Figure 1 a fourth side surface 114).

[0094] According to one embodiment, at least one coil may be disposed on the printed circuit board 160. For example, see Figure 4 , the printed circuit board 160 may include a first OIS coil 161, a second OIS coil 162, and an AF coil 163. However, the configuration of the printed circuit board 160 is not limited thereto. For example, the printed circuit board 160 may further include at least one coil, or at least one of the aforementioned coils may be omitted. According to an embodiment, the first OIS coil 161 and the second OIS coil 162 may be disposed on an outer surface of the printed circuit board 160, and the AF coil 163 may be disposed on an inner surface of the printed circuit board 160.

[0095] According to an embodiment, the first OIS coil 161 may be fixed to a portion of the printed circuit board 160 corresponding to the first side surface of the OIS bracket 110. The second OIS coil 162 may be fixed to a portion of the printed circuit board 160 corresponding to the second side surface of the OIS bracket 110. The AF coil 163 may be fixed to a portion of the printed circuit board 160 corresponding to the fourth side surface of the OIS bracket 110.

[0096] According to an embodiment, at least one printed circuit board 160 may be electrically connected to at least a portion of the OIS bracket 110 and at least a portion of the AF bracket (not shown). Figure 1When an electronic device (such as a camera module 100) including a camera module 100 is shaken, at least one processor included in the electronic device may provide an OIS control value to compensate for the shake of the electronic device. The electronic device may implement OIS by transmitting an electrical signal corresponding to the OIS control value to an OIS drive coil (such as the first OIS coil 161 and / or the second OIS coil 162) disposed in the OIS bracket 110. When the camera is shooting, at least one processor included in the electronic device may provide an AF control value to adjust the focal length between the subject and the camera, and the electronic device may implement AF by transmitting an electrical signal corresponding to the AF control value to an AF drive coil (such as the AF coil 163) disposed in the AF bracket.

[0097] Figure 5 1 is a partially exploded perspective view schematically illustrating positions of OIS coils 161 and 162 , OIS magnets 171 and 172 , and a frame 130 in a camera module according to an embodiment. Figure 6 is a diagram illustrating a transparent view showing rotation of an OIS bracket when current is applied to the first OIS coil 161 according to an embodiment. Figure 7 is a diagram showing a transparent view showing rotation of an OIS bracket when current is applied to the second OIS coil 162 according to an embodiment.

[0098] Figure 5 , Figure 6 and Figure 7 The camera module can be constructed by Figures 1 to 4 Camera modules (such as Figure 1 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0099] refer to Figure 5 In one embodiment, an OIS magnet for hand shake correction (e.g., optical image stabilizer (OIS)) disposed in a housing of an embodiment may be operated in pair with a coil disposed in an OIS bracket and associated with hand shake correction. In one embodiment, when current is applied to the first OIS coil 161, a lens assembly (e.g., Figure 6 The OIS bracket of the lens assembly 101 may rotate about a direction substantially perpendicular to the optical axis (e.g., the Y-axis direction) (or about a direction substantially perpendicular to the optical axis as an axis). In one embodiment, when current is applied to the second OIS coil 162, the OIS bracket including the lens assembly may rotate about another direction substantially perpendicular to the optical axis (e.g., the X-axis direction) (or about another direction substantially perpendicular to the optical axis as an axis) by electromagnetic interaction between the second OIS coil 162 and the second OIS magnet 172.

[0100] According to an embodiment, the camera module may use at least one coil 163 and / or magnet 173 included in the OIS bracket to perform an autofocus (e.g., AF) control function associated with an image acquired by an image sensor. For example, at least one coil 163 may electromagnetically interact with each other under the control of a control circuit. For example, the camera module may control the electromagnetic force by controlling the direction and / or intensity of a current passing through at least one coil 163 under the control of a processor. The camera module may move at least a portion of the lens assembly 101 and the AF bracket in the optical axis (e.g., Z-axis) direction using the Lorentz force caused by the electromagnetic force.

[0101] According to one embodiment, a structure for performing AF driving may be provided in the OIS bracket 110. For example, the AF magnet 173 may be provided in an AF bracket (not shown), and the AF coil 163 may be provided in an AF housing (not shown). According to one embodiment, the AF housing may be fixed to the OIS bracket 110, and the AF bracket may be provided in a lens assembly (e.g., Figure 6 However, the present disclosure is not limited thereto. According to one embodiment, the AF magnet 173 may operate in pair with the AF coil 163. For example, when current is applied to the AF coil 163, the lens assembly (e.g. Figure 6 The lens assembly 101) can be moved along a direction parallel to the optical axis (eg, the Z-axis direction) through electromagnetic interaction between the AF coil 163 and the AF magnet 173.

[0102] According to an embodiment, the camera module may include at least one position sensor (not shown). For example, the position sensor may be a Hall sensor. According to an embodiment, the camera module (or a driving circuit included in the camera module) may use at least one position sensor to measure the position of the lens assembly ( Figure 6 101) and / or the position of the OIS bracket that accommodates the lens assembly. For example, the camera module can use a position sensor to measure the position on the X axis and / or the position on the Y axis of the lens assembly and / or the OIS bracket.

[0103] Figure 6An embodiment may be an embodiment in which current is applied to the first OIS coil 161. According to an embodiment, when current is applied to the first OIS coil 161, a driving force may be provided in a direction substantially parallel to the optical axis (e.g., the Z-axis direction). When the driving force is provided, at least one second object 142 (142A, 142B) may move (or rotate) along the guide portions 132C and 132D. As at least one second object 142 moves (or rotates) along the guide portions 132C and 132D, the OIS bracket and frame 130 including the lens assembly 101 may rotate around a direction substantially perpendicular to the optical axis (e.g., the Y-axis direction). According to an embodiment, as at least one second object 142 moves (or rotates) along the guide portions 132C and 132D, the OIS bracket and frame 130 including the lens assembly 101 may rotate around a direction substantially parallel to the optical axis (e.g., the X-axis direction) relative to a housing (e.g., a sub-housing 121) including at least one OIS magnet (e.g., the first OIS magnet 171).

[0104] According to an embodiment, at least a portion of at least one second object 142 may be disposed within at least one guide portion (eg, guide portion 132C and / or guide portion 132D) to guide the OIS bracket (eg, Figure 1 The OIS bracket 110) and the frame 130 are rotated along at least one guide portion.

[0105] Figure 7 An embodiment may be an embodiment in which current is applied to the second OIS coil 162. According to one embodiment, when current is applied to the second OIS coil 162, a driving force may be provided in a direction substantially parallel to the optical axis (e.g., the Z-axis direction). When the driving force is provided, at least one first object 141 (141A, 141B) may move (or rotate) along the guide portions 131C and 131D. As the at least one first object 141 moves (or rotates) along the guide portions 131C and 131D, the OIS bracket including the lens assembly 101 may rotate about another direction substantially perpendicular to the optical axis (e.g., the Y-axis direction). According to one embodiment, as the at least one first object 141 moves (or rotates) along the guide portions 131C and 131D, the OIS bracket including the lens assembly 101 may be relative to a housing (e.g., a second OIS magnet 172) including at least one OIS magnet. Figure 1 The housing 120) and the frame 130 rotate around another direction (eg, the Y-axis direction) that is substantially parallel to the optical axis.

[0106] Figure 8 is a transparent perspective view showing the sub housing 121 and the frame 130 according to an embodiment.

[0107] Figure 8The sub-housing 121 and the frame 130 may be referred to as Figures 1 to 7 The same terms or the same reference numerals are used for components that are the same as or substantially the same as those described above, and redundant descriptions may not be repeated.

[0108] The frame 130 of an embodiment may include a third receiving portion 132A and a fourth receiving portion 132B in the second portion 132. According to an embodiment, the housing (eg, the sub-housing 121) may include at least one protrusion received in at least one receiving portion of the frame 130. For example, referring to Figure 8 , the sub-housing 121 may include a first protrusion 121A and a second protrusion 121B on a surface facing the frame 130, and the first protrusion 121A and the second protrusion 121B protrude in a direction toward the frame 130 (e.g., the +Y axis direction). When the second portion 132 of the frame 130 is set to face the sub-housing 120, the first protrusion 121A may be accommodated in the third accommodating portion 132A. The second protrusion 121B may be accommodated in the fourth accommodating portion 132B. Figure 8 , it is shown that the sub housing 121 includes two protrusions, but the number of the protrusions is not limited thereto.

[0109] According to an embodiment, the shape of at least one protrusion (e.g., the first protrusion 121A and the second protrusion 121B) may be formed to correspond to the shape of at least one accommodating portion (e.g., the third accommodating portion 132A and the fourth accommodating portion 132B). According to an embodiment, the first protrusion 121A and the second protrusion 121B may include a shape corresponding to the shape of the OIS bracket (e.g., Figure 1 The first protrusion 121A and the second protrusion 121B may include a shape corresponding to the rotation direction of the OIS bracket 110. For example, the first protrusion 121A and the second protrusion 121B may include a shape bent in a direction toward each other. However, the present disclosure is not limited thereto.

[0110] According to an embodiment, at least one protrusion may be guided along the receiving portion while being received in at least one receiving portion. Figure 1 When the OIS bracket 110 is rotated, the first protrusion 121A may move in the first direction within the third accommodation portion 132A, and the second protrusion 121B may move in the fourth accommodation portion 132B in a direction opposite to the first direction.

[0111] According to an embodiment, when external shock is applied to the electronic device, the first protrusion 121A and / or the second protrusion 121B may perform a role of preventing and / or reducing separation of the frame 130 from the housing. According to an embodiment, when the OIS bracket rotates, the first protrusion 121A and / or the second protrusion 121B may perform a role of limiting the amount of rotation of the OIS bracket.

[0112] According to one embodiment, Figure 8 In the embodiment, the sub-housing 121 includes at least one protrusion and the second portion 132 includes at least one receiving portion, but is not limited thereto. For example, the sub-housing 121 may include at least one receiving portion and the second portion 132 may include at least one protrusion.

[0113] Fig. 9 is a partial perspective view showing a camera module 100 according to an embodiment.

[0114] Fig. 9 The camera module 100 can be Figures 1 to 8 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0115] The frame 130 of an embodiment may include a first receiving portion 131A and a second receiving portion 131B in the first portion 131. According to an embodiment, the OIS bracket 110 may include at least one protrusion received in at least one receiving portion of the frame 130. For example, referring to Fig. 9 , the OIS bracket 110 may include a third protrusion 113A and a fourth protrusion 113B on a surface facing the first portion 131 of the frame 130 (e.g., the third side surface 113), and the third protrusion 113A and the fourth protrusion 113B protrude in a direction toward the first portion 131 of the frame 130 (e.g., the +X axis direction). When the first portion 131 of the frame 130 is set to face the OIS bracket 110 (e.g., the third side surface 113), the third protrusion 113A may be accommodated in the first accommodating portion 131A. The fourth protrusion 113B may be accommodated in the second accommodating portion 131B. Fig. 9 , it is shown that the OIS bracket 110 includes two protrusions, but the number of the protrusions is not limited thereto.

[0116] According to an embodiment, the shape of at least one protrusion (e.g., the third protrusion 113A and the fourth protrusion 113B) may be formed to correspond to the shape of at least one accommodating portion (e.g., the first accommodating portion 131A and the second accommodating portion 131B). According to an embodiment, the third protrusion 113A and the fourth protrusion 113B may include a shape corresponding to the direction in which the OIS bracket 110 rotates. For example, the third protrusion 113A and the fourth protrusion 113B may include a shape that is bent in a direction toward each other. However, the present disclosure is not limited thereto.

[0117] According to an embodiment, at least one protrusion may be guided along the receiving portion while being received in at least one receiving portion. For example, when the OIS bracket 110 rotates, the third protrusion 113A may move in the second direction within the first receiving portion 131A, and the fourth protrusion 113B may move in the second receiving portion 131B in a direction opposite to the second direction.

[0118] According to an embodiment, when external shock is applied to the electronic device, the third protrusion 113A and / or the fourth protrusion 113B may perform a role of preventing and / or reducing separation of the frame 130 from the OIS bracket. According to an embodiment, when the OIS bracket rotates, the third protrusion 113A and / or the fourth protrusion 113B may perform a role of limiting the amount of rotation of the OIS bracket.

[0119] According to one embodiment, Fig. 9 , it is shown that the OIS bracket includes at least one protrusion, and the first portion 131 includes at least one receiving portion, but the present disclosure is not limited thereto. For example, the OIS bracket may include at least one receiving portion, and the first portion 131 may include at least one protrusion.

[0120] Fig.10 is a cross-sectional view of a camera module 100 according to an embodiment.

[0121] Fig.10 Can be Fig. 9 1 is a cross-sectional view of the camera module 100 taken along line AA′.

[0122] Fig.10 The camera module 100 can be Figures 1 to 9 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0123] Reference Fig.10 , the first portion 131 of the frame may include at least one first bent portion 133 protruding toward an inner surface of the housing 120 facing the first portion 131 .

[0124] According to an embodiment, at least one first curved portion 133 may be configured to be equal to or smaller than a reference radius of the Y-axis rotation axis of the OIS bracket 110. Therefore, when the OIS bracket 110 rotates, an air gap between the first portion 131 and the housing 120 is maintained (or when the OIS bracket 110 rotates, a gap between the first portion 131 and the housing 120 is maintained constant), whereby when the OIS bracket 110 rotates, the frame 130 may not collide with the housing 120 or may not cause friction with the inner surface of the housing 120. However, the present disclosure is not limited thereto.

[0125] According to an embodiment, the first portion 131 includes at least one bent portion 133 , thereby preventing and / or reducing separation of at least one first object due to external shock applied to the electronic device.

[0126] Fig.11 is a cross-sectional view of a camera module according to an embodiment.

[0127] Fig.11 Can be Fig. 9 1 is a cross-sectional view of the camera module 100 taken along line BB′.

[0128] Fig.11 The camera module 100 can be Figures 1 to 10 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0129] See also Fig.11 The second portion 132 of the frame may include at least one second bent portion 134 protruding toward the outer surface of the OIS bracket 110 facing the second portion 132. In an embodiment, the second portion 132 may include at least one second bent portion 134 protruding toward the fourth side surface 114 of the OIS bracket 110.

[0130] According to an embodiment, the second portion 132 includes at least one bent portion 134, thereby preventing and / or reducing the at least one second object from being separated due to external shock applied to the electronic device.

[0131] Fig.12 1 is a partial transparent perspective view showing a frame 130 including at least one magnet 151 or 152 according to an embodiment.

[0132] Fig.12 The frame 130 can be Figures 1 to 11 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0133] Reference Fig.12 , the first portion 131 of the frame 130 may include at least one first magnet 151 , and the second portion 132 of the frame 130 may include at least one second magnet 152 .

[0134] According to an embodiment, the length of the first magnet 151 in the longitudinal direction (eg, the Y-axis direction) may be equal to or less than the distance from the first receiving portion 131A to the second receiving portion 131B. However, the present disclosure is not limited thereto.

[0135] According to an embodiment, the width of the first magnet 151 in a direction perpendicular to the longitudinal direction (eg, the Z-axis direction) may be equal to or smaller than the width of the first portion 131 in a direction perpendicular to the longitudinal direction of the first magnet 151. However, the present disclosure is not limited thereto.

[0136] According to an embodiment, the length of the second magnet 152 in the longitudinal direction (eg, the X-axis direction) may be equal to or less than the distance from the third receiving portion 132A to the fourth receiving portion 132B. However, the present disclosure is not limited thereto.

[0137] According to an embodiment, the width of the second magnet 152 in a direction perpendicular to the longitudinal direction (eg, the Z-axis direction) may be equal to or smaller than the width of the second portion 132 in a direction perpendicular to the longitudinal direction of the second magnet 152. However, the present disclosure is not limited thereto.

[0138] According to an embodiment, as the size of the first magnet 151 or the second magnet 152 increases, it can effectively control the movement of the OIS bracket when the electronic device is externally shocked.

[0139] Fig.13 2 is a perspective view illustrating a printed circuit board 260 and an OIS bracket 210 on which the printed circuit board 260 is disposed according to an embodiment.

[0140] Fig.13 The OIS bracket 110 and at least one OIS coil (eg, the first OIS coil 261) may be formed by Figures 1 to 12 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant information may not be repeated.

[0141] According to one embodiment, at least one coil may be disposed on the printed circuit board 260. For example, see Fig.13 , the printed circuit board 260 may include a first OIS coil 261, a second OIS coil 262, a third OIS coil 263, a fourth OIS coil 264, and an AF coil 265. However, the configuration of the printed circuit board 260 is not limited thereto. For example, the printed circuit board 260 may further include at least one coil, or at least one of the aforementioned coils may be omitted. According to one embodiment, the first OIS coil 261, the second OIS coil 262, the third OIS coil 263, and the fourth OIS coil 264 may be disposed on an outer surface of the printed circuit board 260, and the AF coil 265 may be disposed on an inner surface of the printed circuit board 260.

[0142] According to an embodiment, the first OIS coil 261 and the second OIS coil 262 may be fixed to a portion of the printed circuit board 260 corresponding to the first side surface of the OIS bracket 210. In an example, the first OIS coil 261 may be disposed parallel to the second OIS coil 262 (eg, in the X-axis direction). However, the present disclosure is not limited thereto.

[0143] According to one embodiment, the third OIS coil 263 and the fourth OIS coil 264 may be fixed to a portion of the printed circuit board 260 corresponding to the second side surface of the OIS bracket 210, the second side surface being substantially perpendicular to the first side surface. According to one embodiment, the third OIS coil 263 may be arranged to be parallel to the fourth OIS coil 264 (e.g., in the Y-axis direction). However, the present disclosure is not limited thereto.

[0144] Fig.14 2 is a perspective view schematically illustrating positions of OIS coils 261 , 262 , 263 , and 264 , OIS magnets 271 and 272 , and a frame 230 in a camera module according to an embodiment.

[0145] Fig.14 The camera module can be constructed by Figures 1 to 13 Camera modules (such as Figure 1 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0146] See also Fig.14 , an OIS magnet for hand shake correction (e.g., optical image stabilizer (OIS)) disposed in a housing of an embodiment may operate in pairs with a coil disposed in an OIS bracket and associated with hand shake correction. In an embodiment, when current is applied to the first OIS coil 261 and / or the second OIS coil 262, a lens assembly (e.g., Figure 6 The OIS bracket of the lens assembly 101 can be rotated in a direction as an axis substantially perpendicular to the optical axis (e.g., the X-axis direction) by electromagnetic interaction between the first OIS coil 261 and / or the second OIS coil 262 and the first OIS magnet 272. In one embodiment, when current is applied to the third OIS coil 263 and / or the fourth OIS coil 264, the OIS bracket including the lens assembly can be rotated in another direction as an axis substantially perpendicular to the optical axis (e.g., the Y-axis direction) by electromagnetic interaction between the third OIS coil 263 and / or the fourth OIS coil 264 and the second OIS magnet 271.

[0147] Fig.15 is a perspective view showing a camera module 200 according to an embodiment.

[0148] Fig.15 The printed circuit board 260 can be Fig.14 Reference is made to the printed circuit board 260 . Fig.15 The camera module 200 can be Figures 1 to 13 The same reference numerals are used for the same components as those described above, and redundant descriptions may not be repeated.

[0149] See also Fig.15 , a first side surface (eg, Figure 1 The first side surface 111 of the OIS bracket 210 may include at least one protrusion protruding in a direction toward the at least one OIS coil. For example, the first side surface of the OIS bracket 210 may include at least one first protrusion 111A protruding in a direction toward the third OIS coil 263. In one embodiment, the number of the at least one protrusion may correspond to the number of the at least one OIS coil. For example, referring to Fig.15 , when the camera module 200 includes the fourth OIS coil 264 disposed in parallel with the third OIS coil 263 , the first side surface may further include at least one second protrusion 111B. However, the present disclosure is not limited thereto.

[0150] According to an embodiment, the OIS coil may be fixed to the OIS bracket via at least one protrusion. Fig.15 , the third OIS coil 263 may be fixed by the first protrusion 111A, and the fourth OIS coil 264 may be fixed by the second protrusion 111B.

[0151] According to one embodiment, although Fig.15 2, but the second side surface of the OIS bracket 210 (eg Figure 1 The second side surface 112 of the first OIS coil may include at least one third protrusion protruding in a direction toward the first OIS coil. Fig.14 , when the camera module 200 includes a second OIS coil 262 disposed in parallel with the first OIS coil 261, the second side surface may further include at least one fourth protrusion. However, the present disclosure is not limited thereto. According to an embodiment, although not in Fig.15 , but the at least one OIS coil may be fixed to the OIS bracket 210 by at least one protrusion formed on the second side surface of the OIS bracket 210 .

[0152] Fig.16 1 is a diagram showing a plan view showing a front surface and a rear surface of an electronic device 10 including a camera module according to an embodiment. Fig.17 yes Fig.16 A cross-sectional view taken along line CC' of the figure. Fig.18 is a diagram showing a plan view illustrating the height of a camera module according to an embodiment.

[0153] Fig.16 , Fig.17 and Fig.18 The camera module can be Figures 1 to 15 The same terms or the same reference numerals are used for components that are the same or substantially the same as those described above, and redundant descriptions may not be repeated.

[0154] According to an embodiment, the electronic device 10 may include at least one camera module. For example, the at least one camera module may be disposed on the rear surface of the electronic device 10 so as to face the rear of the electronic device 10. According to an embodiment, the electronic device 10 may include a first camera module 20, a second camera module 30, and a third camera module 40. Fig.16 , it is shown that the electronic device 10 includes three camera modules, but the number of camera modules included in the electronic device 10 is not limited thereto.

[0155] Fig.16 The first camera module 20 can be Figures 1 to 15 According to one embodiment, the first camera module 20 may be an ultra-wide-angle camera, the second camera module 30 may be a wide-angle camera, and the third camera module 40 may be a telephoto camera. For example, the third camera module 40 may be a 3x zoom camera. According to one embodiment, the electronic device 10 may further include a distance sensor. However, Fig.16 The types or numbers of camera modules shown in the figure are merely examples and do not limit the scope of the present disclosure. According to one embodiment, the camera modules (e.g. Figure 1 The camera module 100) may be applied to an ultra-wide-angle camera. However, the present disclosure is not limited thereto.

[0156] According to an embodiment, the back cover of the electronic device 10 may include at least one opening. For example, the back cover of the electronic device 10 may include a first opening corresponding to the first camera module 20, a second opening corresponding to the second camera module 30, and a third opening corresponding to the third camera module 40. The back cover of the electronic device 10 may further include an opening corresponding to the distance sensor.

[0157] According to an embodiment, the electronic device 10 may include a processor electrically connected to the camera modules (e.g., the first camera module 20, the second camera module 30, and the third camera module 40). At least some of the operations described in the present disclosure as being performed by the camera modules may be understood to be performed by the processor of the electronic device 10. Moreover, at least some of the operations described in the present disclosure as being performed by the processor of the electronic device 10 may be understood to be performed by the camera modules.

[0158] Reference Fig.16 , the electronic device 10 is shown to include three camera modules, but this is an example and does not limit the scope of the present disclosure. For example, the embodiments of the present disclosure may also be applied to an electronic device including one camera module, and various embodiments of the present disclosure may be applied to an electronic device including multiple camera modules, and various embodiments of the present disclosure may be applied to some or all of the camera modules included in the electronic device.

[0159] According to an embodiment, the electronic device 10 may include a display 11 facing the front of the electronic device 10 (e.g., facing the -z direction) and a rear plate 12 facing the rear of the electronic device 10 (e.g., facing the +z direction). The electronic device 10 may include a cover 13 covering at least a portion of the camera modules (e.g., the first camera module 20, the second camera module 30, and the third camera module 40). In an example, the cover 13 may include, but is not limited to, glass. The cover 13 may be disposed on the rear plate 12 of the electronic device 10.

[0160] According to an embodiment, the height from the display 11 to the cover 13 (eg, the thickness in the z direction) may be greater than or substantially equal to the height from the display 11 to the back plate 12 (eg, the thickness in the z direction). However, the present disclosure is not limited thereto.

[0161] Reference Fig.16 and Fig.17 , an electronic device of an embodiment may include a board on which at least one of the first camera module 20, the second camera module 30, and the third camera module is disposed.

[0162] According to an embodiment, the first camera module 20 may have a first height (D1). For example, the first camera module 20 may have a first height D1 from a reference position (e.g., a board, display 11, a rear plate 12, or a cover 13). The second camera module 30 may have a second height (D2). For example, the second camera module 30 may have a second height D2 from a reference position (e.g., a board, display 11, a rear plate 12, or a cover 13). According to an embodiment, the first height (D1) may be less than the second height (D2). In an example, the camera modules (e.g., Figure 1The camera module 100) can be applied to an ultra-wide-angle camera, thereby preventing and / or reducing at least one camera module from protruding compared to other camera modules.

[0163] refer to Fig.18 When the OIS bracket 310 including the lens assembly 301 of an embodiment rotates (or moves), the OIS bracket 310 may be tilted by forming a certain angle relative to the housing 320. As the OIS bracket 310 tilts, the first camera module 300 may have a height greater than the first height (e.g. Fig.17 For example, referring to Fig.16 , Fig.17 and Fig.18 , the first camera module 300 may have a third height D3 greater than the first height from a reference position (eg, the board 390 , the display 11 , the rear plate 12 , or the cover 13 ).

[0164] According to an embodiment, when the height of the first camera module 300 increases as the OIS bracket 310 is tilted (for example, when the first camera module 300 has the third height (D3)), the height of the first camera module 300 (for example, the third height (D3)) may be lower than or substantially equal to the heights of the other camera modules. For example, the electronic device may control the first camera module 300, wherein the third height (D3) of the first camera module 300 is substantially equal to or lower than the height of the second camera module (for example Fig.17 The second camera module 30 is formed at a second height (D2). However, the present disclosure is not limited thereto.

[0165] refer to Fig.16 , Fig.17 and Fig.18 According to one embodiment, the height of the camera module (eg, the first height (D1), the second height (D2), or the third height ( Fig.18 D3)) in the electronic device (eg Fig.16 The height of the electronic device 10 in the figure (eg, the thickness of the electronic device in the z direction).

[0166] Fig.19 8 is a block diagram illustrating an electronic device 801 in a network environment 800 according to various embodiments. Fig.19, the electronic device 801 in the network environment 800 may communicate with the electronic device 802 via the first network 898 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 804 or the server 808 via the second network 899 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 801 may communicate with the electronic device 804 via the server 808. According to an embodiment, the electronic device 801 may include a processor 820, a memory 830, an input module 850, a sound output module 855, a display module 860, an audio module 870, a sensor module 876, an interface 877, a connection terminal 878, a haptic module 879, a camera module 880, a power management module 888, a battery 889, a communication module 890, a user identification module (SIM) 896, or an antenna module 897. In some embodiments, at least one of the above components (e.g., the connection terminal 878) may be omitted from the electronic device 801, or one or more other components may be added to the electronic device 801. In some embodiments, some of the above-described components (eg, sensor module 876, camera module 880, or antenna module 897) may be implemented as a single integrated component (eg, display module 860).

[0167] The processor 820 may run, for example, software (e.g., program 840) to control at least one other component (e.g., hardware component or software component) of the electronic device 801 connected to the processor 820, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 820 may store a command or data received from another component (e.g., sensor module 876 or communication module 890) in a volatile memory 832, process the command or data stored in the volatile memory 832, and store the result data in a non-volatile memory 834. According to an embodiment, the processor 820 may include a main processor 821 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 823 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 821 in operation. For example, when the electronic device 801 includes a main processor 821 and an auxiliary processor 823, the auxiliary processor 823 may be adapted to consume less power than the main processor 821, or adapted to be dedicated to a specific function. The auxiliary processor 823 may be implemented as a separate part from the main processor 821, or as part of the main processor 821.

[0168] When the main processor 821 is in an inactive (e.g., sleep) state, the auxiliary processor 823 (rather than the main processor 821) may control at least some of the functions or states related to at least one component among the components of the electronic device 801 (e.g., display module 860, sensor module 876, or communication module 890), or when the main processor 821 is in an active state (e.g., running an application), the auxiliary processor 823 may control at least some of the functions or states related to at least one component among the components of the electronic device 801 (e.g., display module 860, sensor module 876, or communication module 890) together with the main processor 821. According to an embodiment, the auxiliary processor 823 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 880 or a communication module 890) that is functionally related to the auxiliary processor 823. According to an embodiment, the auxiliary processor 823 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 801 where the artificial intelligence is executed or via a separate server (e.g., server 808). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0169] The memory 830 may store various data used by at least one component of the electronic device 801 (e.g., the processor 820 or the sensor module 876). The various data may include, for example, software (e.g., the program 840) and input data or output data for commands related thereto. The memory 830 may include a volatile memory 832 or a non-volatile memory 834.

[0170] The program 840 may be stored as software in the memory 830 , and may include, for example, an operating system (OS) 842 , middleware 844 , or an application 846 .

[0171] The input module 850 may receive commands or data to be used by other components (e.g., the processor 820) of the electronic device 801 from outside (e.g., a user) of the electronic device 801. The input module 850 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0172] The sound output module 855 can output sound signals to the outside of the electronic device 801. The sound output module 855 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0173] The display module 860 may visually provide information to the outside (e.g., user) of the electronic device 801. The display device 860 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 860 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0174] The audio module 870 can convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 870 can obtain sound via the input module 850, or output sound via the sound output module 855 or an earphone of an external electronic device (e.g., electronic device 802) directly (e.g., wired) or wirelessly connected to the electronic device 801.

[0175] The sensor module 876 may detect an operating state (e.g., power or temperature) of the electronic device 801 or an environmental state (e.g., a state of a user) outside the electronic device 801, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 876 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0176] The interface 877 may support one or more specific protocols to be used to connect the electronic device 801 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 802). According to an embodiment, the interface 877 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0177] The connection end 878 may include a connector, wherein the electronic device 801 can be physically connected to an external electronic device (e.g., the electronic device 802) via the connector. According to an embodiment, the connection end 878 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0178] The haptic module 879 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 879 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0179] The camera module 880 may capture a still image or a moving image. According to an embodiment, the camera module 880 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0180] The power management module 888 may manage power supply to the electronic device 801. According to an embodiment, the power management module 888 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0181] The battery 889 may power at least one component of the electronic device 801. According to an embodiment, the battery 889 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0182] The communication module 890 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 801 and an external electronic device (e.g., electronic device 802, electronic device 804, or server 808), and perform communication via the established communication channel. The communication module 890 may include one or more communication processors capable of operating independently from the processor 820 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 890 may include a wireless communication module 892 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 894 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 898 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 899 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 892 can identify and authenticate the electronic device 801 in a communication network (such as the first network 898 or the second network 899) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 896.

[0183] The wireless communication module 892 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 892 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 892 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 892 can support various requirements specified in the electronic device 801, an external electronic device (e.g., electronic device 804), or a network system (e.g., a second network 899). According to an embodiment, the wireless communication module 892 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0184] The antenna module 897 may transmit a signal or power to the outside of the electronic device 801 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 801 (e.g., an external electronic device). According to an embodiment, the antenna module 897 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on a substrate. According to an embodiment, the antenna module 897 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 898 or the second network 899) may be selected from the plurality of antennas by, for example, the communication module 890 (e.g., the wireless communication module 892). Subsequently, a signal or power may be transmitted or received between the communication module 890 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 897.

[0185] According to various embodiments, the antenna module 897 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0186] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0187] According to an embodiment, a command or data may be sent or received between the electronic device 801 and the external electronic device 804 via the server 808 connected to the second network 899. Each of the electronic device 802 or the electronic device 804 may be a device of the same type as the electronic device 801, or a device of a different type from the electronic device 801. According to an embodiment, all or some operations to be executed in the electronic device 801 may be executed in one or more of the external electronic device 802, the external electronic device 804, or the server 808. For example, if the electronic device 801 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 801 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 801 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 801. The electronic device 801 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 801 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 804 may include an Internet of Things (IoT) device. The server 808 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 804 or the server 808 may be included in the second network 899. The electronic device 801 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0188] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0189] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0190] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0191] The various embodiments described herein may be implemented as software (e.g., program 840) including one or more instructions stored in a storage medium (e.g., internal memory 836 or external memory 838) that can be read by a machine (e.g., electronic device 801). For example, under the control of a processor, a processor (e.g., processor 820) of the machine (e.g., electronic device 801) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0192] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0193] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0194] Fig. 20 900 is a block diagram illustrating an example configuration of the camera module 880 according to various embodiments. Fig. 20 , the camera module 880 may include a lens assembly 910, a flash 920, an image sensor 930, an image stabilizer 940, a memory 950 (e.g., a buffer memory), or an image signal processor 960. The lens assembly 910 may collect light emitted or reflected from an object whose image is to be captured. The lens assembly 910 may include one or more lenses. According to an embodiment, the camera module 880 may include a plurality of lens assemblies 910. In this case, the camera module 880 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 910 may have the same lens properties (e.g., viewing angle, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from the lens properties of another lens assembly. The lens assembly 910 may include, for example, a wide-angle lens or a telephoto lens.

[0195] The flashlight 920 may emit light, wherein the emitted light is used to enhance the light reflected from the object. According to an embodiment, the flashlight 920 may include one or more light emitting diodes (LEDs) (e.g., red, green, blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or xenon lamps. The image sensor 930 may acquire an image corresponding to the object by converting light emitted or reflected from the object and transmitted through the lens assembly 910 into an electrical signal. According to an embodiment, the image sensor 930 may include one image sensor selected from a plurality of image sensors having different properties (e.g., an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 930 may be implemented using, for example, a charge coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

[0196] The image stabilizer 940 may move the image sensor 930 or at least one lens included in the lens assembly 910 in a specific direction, or control an operational property of the image sensor 930 (e.g., adjust the readout timing) in response to the movement of the camera module 880 or the electronic device 801 including the camera module 880. In this way, at least a portion of the negative effects (e.g., image blur) generated due to the movement of the image being captured is allowed to be compensated. According to an embodiment, the image stabilizer 940 may sense such movement of the camera module 880 or the electronic device 801 using a gyroscope sensor (not shown) or an acceleration sensor (not shown) arranged inside or outside the camera module 880. According to an embodiment, the image stabilizer 940 may be implemented as, for example, an optical image stabilizer. The memory 950 may at least temporarily store at least a portion of the image acquired via the image sensor 930 for subsequent image processing tasks. For example, if multiple images are captured quickly or image capture is delayed due to shutter lag, the acquired original image (e.g., Bayer pattern image, high-resolution image) may be stored in the memory 950, and its corresponding copy image (e.g., low-resolution image) may be previewed via the display module 860. Then, if a specified condition is met (e.g., by a user's input or a system command), at least a portion of the original image stored in the memory 950 may be acquired and processed by, for example, the image signal processor 960. According to an embodiment, the memory 950 may be configured as at least a portion of the memory 830, or the memory 950 may be configured as a separate memory that operates independently of the memory 830.

[0197] The image signal processor 960 may perform one or more image processing on an image acquired via the image sensor 930 or an image stored in the memory 950. The one or more image processing may include, for example, depth map generation, three-dimensional (3D) modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 960 may perform control (e.g., exposure time control or readout timing control) on at least one of the components included in the camera module 880 (e.g., image sensor 930). The image processed by the image signal processor 960 may be stored back to the memory 950 for further processing, or the image may be provided to an external component outside the camera module 880 (e.g., memory 830, display module 860, electronic device 802, electronic device 804, or server 808). According to an embodiment, the image signal processor 960 may be configured as at least a part of the processor 820, or the image signal processor 960 may be configured as a separate processor that operates independently of the processor 820. If the image signal processor 960 is configured as a separate processor from the processor 820 , at least one image processed by the image signal processor 960 may be displayed as it is by the processor 820 via the display module 860 , or may be displayed after being further processed.

[0198] According to an embodiment, the electronic device 801 may include a plurality of camera modules 880 having different properties or functions. In this case, at least one of the plurality of camera modules 880 may form, for example, a wide-angle camera, and at least another of the plurality of camera modules 880 may form a telephoto camera. Similarly, at least one of the plurality of camera modules 880 may form, for example, a front camera, and at least another of the plurality of camera modules 880 may form a rear camera.

[0199] As described above, a camera module (eg, Figure 1The camera module 100) may include: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to rotate the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side surface of the OIS bracket; a second OIS coil disposed to a second side surface of the OIS bracket different from the first side surface; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side surface of the OIS bracket opposite to the first side surface and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side surface of the OIS bracket opposite to the second side surface and the housing; at least one first object disposed between the first portion and the third side surface and configured to enable the OIS bracket to move; and at least one second object disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The at least one first object may be configured to roll along the at least one first guide portion based on the OIS bracket rotating.

[0200] According to an example embodiment, the first portion may include at least one second guide portion facing the at least one first guide portion based on an axis of rotation of the OIS bracket.

[0201] According to an example embodiment, at least one second object may be arranged and configured to be guided along at least one third guide portion (e.g., inside at least one third guide portion) based on the rotation of the OIS bracket, and at least one third guide portion is formed on a surface of the housing facing the second portion. When used herein, guided may refer to movement, rotation, sliding, or rolling motion when received in the working area. However, the present disclosure is not limited thereto.

[0202] According to an example embodiment, the first portion may include at least one fourth guide portion facing the at least one third guide portion based on an axis of rotation of the frame.

[0203] According to an example embodiment, the first portion of the frame may include at least one first magnet, and the second portion of the frame may include at least one second magnet. The third side surface may include at least one first yoke facing the at least one first magnet. The inner surface of the housing facing the second portion may include at least one second yoke facing the at least one second magnet.

[0204] According to an example embodiment, the third side surface may include at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame may include at least one first receiving portion receiving the at least one first protrusion. The at least one first protrusion may be arranged and configured to move along the at least one first receiving portion based on the rotation of the OIS bracket.

[0205] According to an example embodiment, the inner surface of the housing facing the second portion of the frame may include at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame may include at least one second receiving portion for receiving the at least one second protrusion. The at least one second protrusion may be arranged and configured to move along the at least one second receiving portion as the OIS bracket rotates.

[0206] According to an example embodiment, the OIS bracket may include a printed circuit board surrounding at least a portion of a side surface of the OIS bracket. The printed circuit board may include a first OIS coil and a second OIS coil disposed on an outer surface of the printed circuit board, and an auto focus (AF) coil disposed on an inner surface of the printed circuit board facing a fourth side surface.

[0207] According to an example embodiment, the camera module may further include a driving circuit electrically connected to the first OIS coil and the second OIS coil. The driving circuit may be configured to move the OIS bracket on a plane perpendicular to the optical axis by controlling a current applied to at least one of the first OIS coil or the second OIS coil.

[0208] According to an example embodiment, the first portion of the frame may include at least one first bent portion facing the housing.

[0209] According to an example embodiment, the second portion of the frame may include at least one second bent portion facing the fourth side surface of the OIS bracket.

[0210] According to an example embodiment, the first side surface of the OIS bracket may include at least one first protrusion protruding in a direction toward the first OIS coil. The second side surface of the OIS bracket may include at least one second protrusion protruding in a direction toward the second OIS coil. The first OIS coil may be fixed to the OIS bracket by the at least one first protrusion. The second OIS coil may be fixed to the OIS bracket by the at least one second protrusion.

[0211] According to an example embodiment, the camera module may include a third OIS coil and a fourth OIS coil, wherein the third OIS coil is disposed to a first side surface of the OIS bracket and is disposed parallel to the first OIS coil, and the fourth OIS coil is disposed to a second side surface of the OIS bracket that is substantially perpendicular to the first side surface and is disposed parallel to the second OIS coil.

[0212] As described above, an electronic device according to an example embodiment of the present disclosure may include: a first camera module. The first camera module may include: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to rotate the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side surface of the OIS bracket; a second OIS coil disposed to a second side surface of the OIS bracket different from the first side surface; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side surface of the OIS bracket opposite to the first side surface and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side surface of the OIS bracket opposite to the second side surface and the housing; at least one first object disposed between the first portion and the third side surface and configured to enable the OIS bracket to move; and at least one second object disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The at least one first object may be configured to roll along the at least one first guide portion based on the OIS bracket rotating.

[0213] According to an example embodiment, the electronic device may further include at least one of a second camera module including a camera or a third camera module including a camera.

[0214] According to an example embodiment, the first camera module may have a first height, and the second camera module may have a second height greater than the first height. Based on the OIS bracket rotating about an axis perpendicular to the optical axis, the first camera module may have a third height greater than the first height. The third height may be less than or substantially equal to the second height.

[0215] According to an example embodiment, the first portion may include at least one second guide portion facing the at least one first guide portion based on an axis of rotation of the OIS bracket.

[0216] According to an example embodiment, the first portion of the frame may include at least one first magnet, and the second portion of the frame may include at least one second magnet. The third side surface may include at least one first yoke facing the at least one first magnet. The inner surface of the housing facing the second portion may include at least one second yoke facing the at least one second magnet.

[0217] According to an example embodiment, the first portion of the frame may include at least one first bent portion convexly formed on an outer surface facing the housing. The second portion of the frame may include at least one second bent portion convexly formed on an inner surface facing a fourth side surface of the OIS bracket.

[0218] According to an example embodiment, the third side surface may include at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame may include at least one first accommodating portion that accommodates the at least one first protrusion. The at least one first protrusion may be arranged and configured to move along the at least one first accommodating portion based on the rotation of the OIS bracket. The inner surface of the housing facing the second portion of the frame may include at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame may include at least one second accommodating portion that accommodates the at least one second protrusion. The at least one second protrusion may be arranged and configured to move along the at least one second accommodating portion based on the rotation of the OIS bracket.

[0219] As described above, a camera module (eg, Figure 1 The camera module 100) may include: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to tilt the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side of the OIS bracket; a second OIS coil disposed to a second side of the OIS bracket different from the first side; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side of the OIS bracket opposite to the first side and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side of the OIS bracket opposite to the second side and the housing; at least one first object movably disposed between the first portion and the third side and configured to enable the OIS bracket to move; and at least one second object movably disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The at least one first object is configured to move along the at least one first guide portion as the OIS bracket tilts.

[0220] According to an example embodiment, the first portion includes at least one second guide portion opposite to the at least one first guide portion with respect to a reference axis according to which the OIS bracket is tilted.

[0221] According to an example embodiment, the at least one second object is configured to move along at least one third guide portion as the OIS bracket is tilted, the at least one third guide portion being formed on one surface of the housing facing the second portion.

[0222] According to an example embodiment, the second portion includes at least one fourth guide portion opposite to the at least one third guide portion about a reference axis according to which the frame and the OIS bracket are tilted.

[0223] According to an exemplary embodiment, the first portion of the frame includes at least one first magnet, and the second portion of the frame includes at least one second magnet. The third side includes at least one first yoke facing the at least one first magnet. The inner side of the housing facing the second portion includes at least one second yoke facing the at least one second magnet.

[0224] According to an example embodiment, the third side includes at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame includes at least one first receiving portion for receiving the at least one first protrusion. The at least one first protrusion is arranged and configured to move along the at least one first receiving portion as the OIS bracket tilts.

[0225] According to an exemplary embodiment, the inner side of the housing facing the second portion of the frame includes at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame includes at least one second receiving portion for receiving the at least one second protrusion. The at least one second protrusion is arranged and configured to move along the at least one second receiving portion as the OIS bracket tilts.

[0226] According to an example embodiment, the OIS bracket includes a printed circuit board surrounding at least a portion of at least one side of the OIS bracket. The printed circuit board includes a first OIS coil and a second OIS coil disposed on an outer side of the printed circuit board, and an auto focus (AF) coil disposed on an inner side of the printed circuit board facing a fourth side.

[0227] According to an example embodiment, the camera module further includes a driving circuit electrically connected to the first OIS coil and the second OIS coil. The driving circuit is configured to control the OIS bracket to move on a plane perpendicular to the optical axis by controlling a current applied to at least one of the first OIS coil or the second OIS coil.

[0228] According to an example embodiment, the first portion of the frame includes at least one first bent portion formed facing the housing.

[0229] According to an example embodiment, the second portion of the frame includes at least one second bent portion facing the fourth side of the OIS bracket.

[0230] According to an example embodiment, a first side of the OIS bracket includes at least one first protrusion protruding in a direction toward the first OIS coil. A second side of the OIS bracket includes at least one second protrusion protruding in a direction toward the second OIS coil. The first OIS coil is fixed to the OIS bracket by the at least one first protrusion. The second OIS coil is fixed to the OIS bracket by the at least one second protrusion.

[0231] According to an example embodiment, the camera module includes a third OIS coil and a fourth OIS coil, wherein the third OIS coil is disposed to a first side of the OIS bracket and is disposed parallel to the first OIS coil, and the fourth OIS coil is disposed to a second side of the OIS bracket that is substantially perpendicular to the first side and is disposed parallel to the second OIS coil.

[0232] As described above, an electronic device (eg, Fig.16 The electronic device 10 may include a camera module (eg Figure 1 The first camera module includes: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to tilt the lens assembly and the image sensor; a housing accommodating the lens assembly, the image sensor, and the OIS bracket; a first OIS coil disposed to a first side of the OIS bracket; a second OIS coil disposed to a second side of the OIS bracket different from the first side; a first OIS magnet disposed to face the first OIS coil; a second OIS magnet disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side of the OIS bracket opposite to the first side and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side of the OIS bracket opposite to the second side and the housing; at least one first object movably disposed between the first portion and the third side and configured to enable the OIS bracket to move; and at least one second object disposed between the second portion and the housing and configured to enable the frame and the OIS bracket to move. The movable at least one first object is configured to move along the at least one first guide portion as the OIS bracket tilts.

[0233] According to an example embodiment, the electronic device further includes at least one of a second camera module including a camera and / or a third camera module including a camera.

[0234] According to an example embodiment, the first camera module has a first height, and the second camera module has a second height greater than the first height. Based on the OIS bracket being tilted based on an axis perpendicular to the optical axis, the first camera module has a third height greater than the first height. The third height is less than or substantially equal to the second height.

[0235] According to an example embodiment, the first portion includes at least one second guide portion opposite to the at least one first guide portion with respect to a reference axis according to which the OIS bracket is tilted.

[0236] According to an exemplary embodiment, the first portion of the frame includes at least one first magnet, and the second portion of the frame includes at least one second magnet. The third side includes at least one first yoke facing the at least one first magnet. The inner side of the housing facing the second portion includes at least one second yoke facing the at least one second magnet.

[0237] According to an exemplary embodiment, the first portion of the frame comprises at least one first bent portion facing the housing.The second portion of the frame comprises at least one second bent portion facing the fourth side of the OIS bracket.

[0238] According to an exemplary embodiment, the third side includes at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame includes at least one first receiving portion for receiving the at least one first protrusion. The at least one first protrusion is arranged and configured to move along the at least one first receiving portion as the OIS bracket is tilted. The inner side of the housing facing the second portion of the frame includes at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame includes at least one second receiving portion for receiving the at least one second protrusion. The at least one second protrusion is arranged and configured to move along the at least one second receiving portion as the OIS bracket is tilted.

Claims

1. A camera module, comprising: a lens assembly including at least one lens aligned along an optical axis; an image sensor configured to convert light received through the at least one lens into an electrical signal; an optical image stabilization (OIS) bracket configured to tilt the lens assembly and the image sensor; A housing for accommodating the lens assembly, the image sensor and the OIS bracket; a first OIS coil disposed to a first side of the OIS bracket; a second OIS coil disposed to a second side of the OIS bracket different from the first side; a first OIS magnet, disposed to face the first OIS coil; a second OIS magnet, disposed to face the second OIS coil; a frame including a first portion and a second portion, the first portion being disposed between a third side of the OIS bracket opposite to the first side and the housing and including at least one first guide portion, the second portion extending from the first portion and disposed between a fourth side of the OIS bracket opposite to the second side and the housing; at least one first object movably disposed between the first portion and the third side and configured to enable movement of the OIS bracket; as well as at least one second object movably disposed between the second portion and the housing and configured to enable movement of the frame and the OIS bracket, The at least one first object is configured to move along the at least one first guide portion as the OIS bracket is tilted. 2 . The camera module of claim 1 , wherein the first portion comprises at least one second guide portion opposite to the at least one first guide portion about a reference axis based on which the OIS bracket is tilted. 3 . The camera module of claim 1 , wherein the at least one second object is configured to move along at least one third guide portion formed on one surface of the housing facing the second portion as the OIS bracket is tilted. 4 . The camera module of claim 3 , wherein the second portion comprises at least one fourth guide portion opposite to the at least one third guide portion about a reference axis based on which the frame and the OIS bracket are tilted.

5. The camera module of claim 1 , wherein the first portion of the frame comprises at least one first magnet and the second portion of the frame comprises at least one second magnet, wherein the third side comprises at least one first yoke facing the at least one first magnet, and The inner side of the housing facing the second portion includes at least one second yoke facing the at least one second magnet.

6. The camera module of claim 1 , wherein the third side comprises at least one first protrusion protruding in a direction toward the first portion of the frame, wherein the first portion of the frame includes at least one first receiving portion for receiving the at least one first protrusion, and The at least one first protrusion is disposed and configured to move along the at least one first receiving portion as the OIS bracket is tilted.

7. The camera module according to claim 1, wherein an inner side of the housing facing the second portion of the frame includes at least one second protrusion protruding in a direction toward the second portion of the frame, wherein the second portion of the frame includes at least one second receiving portion for receiving the at least one second protrusion, and The at least one second protrusion is disposed and configured to move along the at least one second receiving portion as the OIS bracket is tilted.

8. The camera module of claim 1 , wherein the OIS bracket comprises a printed circuit board surrounding at least a portion of at least one side of the OIS bracket, and The printed circuit board includes the first OIS coil and the second OIS coil disposed on an outer side of the printed circuit board, and an auto focus (AF) coil disposed on an inner side of the printed circuit board facing the fourth side.

9. The camera module of claim 1 , further comprising a driving circuit electrically connected to the first OIS coil and the second OIS coil, and The driving circuit is configured to control the OIS bracket to move in a plane perpendicular to the optical axis by controlling a current applied to at least one of the first OIS coil or the second OIS coil. 10 . The camera module of claim 1 , wherein the first portion of the frame includes at least one first bent portion formed facing the housing. 11 . The camera module of claim 1 , wherein the second portion of the frame comprises at least one second bent portion facing the fourth side of the OIS bracket.

12. The camera module of claim 1 , wherein the first side of the OIS bracket comprises at least one first protrusion protruding in a direction toward the first OIS coil, wherein the second side of the OIS bracket includes at least one second protrusion protruding in a direction toward the second OIS coil, wherein the first OIS coil is fixed to the OIS bracket via the at least one first protrusion, and The second OIS coil is fixed to the OIS bracket via the at least one second protrusion.

13. The camera module according to claim 1, comprising: a third OIS coil disposed to the first side of the OIS bracket and disposed parallel to the first OIS coil; as well as The fourth OIS coil is disposed to the second side of the OIS bracket substantially perpendicular to the first side and is disposed parallel to the second OIS coil. 14 . The camera module of claim 13 , wherein the camera module is disposed adjacent to at least one of the second camera module or the third camera module.

15. The camera module of claim 14, wherein the camera module has a first height, wherein the second camera module has a second height greater than the first height, wherein the camera module has a third height greater than the first height based on the inclination of the OIS bracket based on an axis perpendicular to the optical axis, and Wherein the third height is less than or substantially equal to the second height.

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