A high-precision electronic chip processing positioning device and its usage method

Abstract

This invention discloses a high-precision electronic chip processing positioning device and its usage method, relating to the field of electronic chip processing positioning technology. It includes a plate, a rod, and a rotating plate. A control unit is mounted on the top of the plate, and the rod is also mounted on the top of the plate. A hydraulic telescopic unit is symmetrically mounted on one side of the rod and is electrically connected to the control unit. A moving frame is mounted on the output end of the hydraulic telescopic unit, and a rotating support mechanism is provided inside the moving frame. A laser ranging unit is mounted on one side of the rod and is electrically connected to the control unit. This invention places the wafer on the rotating plate, and then uses the laser ranging unit to measure the wafer's movement distance, thereby facilitating the placement of the processing positioning device below a cutting device for precise, evenly spaced cuts.

Description

Technical Field

[0001] This invention relates to the field of electronic chip processing and positioning technology, specifically to a high-precision electronic chip processing and positioning device and its usage method. Background Technology

[0002] Electronic chips are generally obtained by dicing wafers. A wafer integrates multiple chips. When dicing a wafer to obtain chips, the wafer needs to be fixed to ensure the stability of the chips when they are cut and separated. Some processing positioning devices can position and fix the chips.

[0003] The shortcomings of existing machining positioning devices are:

[0004] 1. Existing technology JPH0446727A discloses a plate positioning device in a plate processing line. This technology does not have a structure for moving the workpiece that needs to be positioned at equal intervals, and it is impossible to make the fixed workpiece move multiple times at equal intervals in one direction. Therefore, a high-precision electronic chip processing positioning device that can move at equal intervals in one direction is needed to solve this problem.

[0005] 2. The prior art JP2003010932A discloses a positioning device for stamping components. This technology does not have the function of changing the orientation of the positioned product. After the product is positioned, the orientation of the product cannot be changed, which makes it inconvenient for the cutter to cut the product from multiple directions. Therefore, a high-precision electronic chip processing positioning device is needed to solve this problem by rotating the chip after positioning it.

[0006] 3. The prior art JP2001096485A discloses a positioning device and a processing device. This technology does not have a structure for collecting the positioned workpiece. After the positioned workpiece is processed, it is impossible to collect the workpiece, which does not simplify the workpiece collection process and makes the operation cumbersome. Therefore, a high-precision electronic chip processing positioning device that can collect the cut chips is needed to solve this problem.

[0007] 4. The prior art CN209811766U discloses a fixing fixture for electronic chip processing. This technology does not have a structure for collecting the positioned workpiece after processing. When an additional collection frame is set to collect the chip, the chip is easily damaged when it falls into the collection frame from a height. Therefore, a high-precision electronic chip processing positioning device with a collection structure is needed to solve this problem. Summary of the Invention

[0008] One objective of this application is to provide a high-precision electronic chip processing positioning device and its usage method, which can solve the technical problems raised in the prior art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a high-precision electronic chip processing positioning device, comprising a plate, a rod, and a rotating plate. A control unit is installed on the top of the plate, and a rod is installed on the top of the plate. A hydraulic telescopic unit is symmetrically installed on one side of the rod, and the hydraulic telescopic unit is electrically connected to the control unit. A movable frame is installed at the output end of the hydraulic telescopic unit, and a rotating support mechanism is provided inside the movable frame. A laser ranging unit is installed on one side of the rod, and the laser ranging unit is electrically connected to the control unit.

[0010] Multiple plates are mounted on the top of the plate one. A hydraulic telescopic unit two is mounted on the front of the plate two and is electrically connected to the control unit. A movable plate two is mounted on the output end of the hydraulic telescopic unit two. An electric telescopic unit two is mounted on the top of the movable plate two and is electrically connected to the control unit. A pressure plate one is mounted on the output end of the electric telescopic unit two.

[0011] Preferably, support plates are symmetrically installed at the bottom of the first plate.

[0012] Preferably, the rotating support mechanism includes a rotating column and a rotating plate, the rotating column being movably mounted on the bottom inner wall of the movable frame, and the rotating plate being mounted on the top of the rotating column.

[0013] Preferably, an electric telescopic unit is symmetrically installed on both sides of the movable frame, and the electric telescopic unit is electrically connected to the control unit. A movable plate is installed at the output end of the electric telescopic unit.

[0014] Preferably, a plurality of pressure sensing units are installed on one side of the movable plate, and the pressure sensing units are electrically connected to the control unit. A limit plate is installed at the input end of the pressure sensing unit, and a rubber pad is installed on one side of the limit plate.

[0015] Preferably, a rubber pad is installed at the bottom of the pressure plate.

[0016] Preferably, a right-angle plate is installed on the top of the first pressure plate, a micro motor is installed on the top of the right-angle plate, and the micro motor is electrically connected to the control unit. A rotating rod is installed at the output end of the micro motor, a second pressure plate is installed at one end of the rotating rod, and a second rubber pad is installed at the bottom of the second pressure plate.

[0017] Preferably, a frame is installed on the back of the plate body one, a collection box is installed on the inner side of the frame, an electric telescopic unit three is installed on the bottom inner wall of the collection box, and the electric telescopic unit three is electrically connected to the control unit. A pressure sensing unit two is installed at the output end of the electric telescopic unit three, and the pressure sensing unit two is electrically connected to the control unit. A lifting plate is installed at the input end of the pressure sensing unit two, and a rubber pad three is installed on the top of the lifting plate.

[0018] Preferably, the high-precision electronic chip processing positioning device is used as follows:

[0019] S1. Install the processing positioning device below the cutting device, then place the finished wafer with multiple chips above the rotating plate, and then move the limiting plates on both sides inward to squeeze and limit the wafer. At the same time, the pressure sensing unit detects the pressure of the limiting plate on the wafer to avoid excessive pressure on the wafer. Then the moving frame moves to the left by the distance of one chip, and the pressure plate one and pressure plate two move down to press the wafer.

[0020] S2. Next, the cutter of the cutting device moves down to cut the wafer. Then, the first and second pressure plates move up, and the moving frame drives the wafer to move to the left by one chip's distance. The cutter of the cutting device continues to move down to cut the wafer.

[0021] S3. Then the rotating plate rotates, causing the wafer to rotate 90 degrees, so that the dicing device continues to dicing the wafer in the original dicing direction perpendicular to the wafer.

[0022] S4. After cutting, the micro motor drives the second pressure plate to rotate to be parallel with the first pressure plate. Then the first and second pressure plates move down and then move backward to push the chip on the rotating plate into the collection box.

[0023] Preferably, step S4 further includes the following steps:

[0024] S41. Before the chip enters the collection box, the lifting plate moves upward first to reduce the descent distance of the chip, thereby reducing the damage caused by chip collision. As the pressure detected by the pressure sensing unit increases, the lifting plate moves downward accordingly.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. The present invention places the wafer on a rotating plate, and then the moving distance of the wafer can be measured by a laser ranging unit, thereby making it convenient to place the processing positioning device below the cutting device for precise cutting at equal intervals.

[0027] 2. When the present invention is used in a cutting device, after the cutter cuts the wafer at equal intervals from one direction, the wafer can be turned by rotating the rotating plate, thereby facilitating the cutting of the wafer at equal intervals from another direction.

[0028] 3. After the cutting is completed, the micro motor drives the second pressure plate to rotate to be parallel with the first pressure plate. Then the first and second pressure plates move down, and then the first and second pressure plates move backward to push the chip on the rotating plate into the collection box. At the same time, the rotation of the second pressure plate to be parallel with the first pressure plate makes it easy to place the wafer on the rotating plate.

[0029] 4. In this invention, before the chip enters the collection box, the lifting plate moves upward first, reducing the descent distance of the chip and thus reducing the damage caused by chip collision. As the pressure detected by the pressure sensing unit increases, the lifting plate moves downward accordingly. Attached Figure Description

[0030] Figure 1 This is a perspective view of the present invention;

[0031] Figure 2 This is a schematic diagram of the movable frame structure of the present invention;

[0032] Figure 3 This is a schematic diagram of the rotating plate structure of the present invention;

[0033] Figure 4 This is a schematic diagram of the structure of the movable plate of the present invention;

[0034] Figure 5 This is a schematic diagram of the plate structure of the present invention;

[0035] Figure 6 This is a schematic diagram of the second structure of the movable plate of the present invention;

[0036] Figure 7 This is a schematic diagram of the frame structure of the present invention;

[0037] Figure 8 This is a schematic diagram of the collection box structure of the present invention;

[0038] Figure 9 This is a flowchart illustrating the method of using the present invention.

[0039] In the diagram: 1. Plate 1; 2. Control unit; 3. Support plate; 4. Rod; 5. Hydraulic telescopic unit 1; 6. Moving frame; 7. Rotating column; 8. Rotating plate; 9. Laser ranging unit; 10. Electric telescopic unit 1; 11. Moving plate 1; 12. Plate 2; 13. Hydraulic telescopic unit 2; 14. Moving plate 2; 15. Electric telescopic unit 2; 16. Pressure plate 1; 17. Right-angle plate; 18. Micro motor; 19. Rotating rod; 20. Pressure plate 2; 21. Rubber pad 1; 22. Rubber pad 2; 23. Frame; 24. Collection box; 25. Electric telescopic unit 3; 26. Lifting plate; 27. Rubber pad 3; 28. Pressure sensing unit 1; 29. ​​Limiting plate; 30. Rubber pad 4; 31. Pressure sensing unit 2. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0043] Please see Figure 1 , Figure 2 and Figure 3 The present invention provides an embodiment of a high-precision electronic chip processing positioning device;

[0044] The device includes a plate 1, a rod 4, and a rotating plate 8. A control unit 2 is mounted on the top of plate 1. Support plates 3 are symmetrically mounted on the bottom of plate 1. The rod 4 is mounted on the top of plate 1. A hydraulic telescopic unit 5 is symmetrically mounted on one side of rod 4 and is electrically connected to the control unit 2. A movable frame 6 is mounted on the output end of the hydraulic telescopic unit 5. A rotating support mechanism, including a rotating column 7 and a rotating plate 8, is installed inside the movable frame 6. The rotating column 7 is movably mounted through the bottom inner wall of the movable frame 6, and the rotating plate 8 is mounted on the top of the rotating column 7. A laser ranging unit 9 is mounted on one side of rod 4 and is electrically connected to the control unit 2. Plate 1 provides installation positions for other components of the device. The control unit 2 is a controller capable of receiving signals from the laser ranging unit 9, pressure sensing unit 28, and pressure sensing unit 31. The signal can simultaneously control the hydraulic telescopic unit 15, the electric telescopic unit 10, the hydraulic telescopic unit 23, the electric telescopic unit 25, the micro motor 18, and the electric telescopic unit 325. The support plate 3 can support the plate body 11, and the rod body 4 can provide an installation position for the hydraulic telescopic unit 15. The hydraulic telescopic unit 15 is a hydraulic cylinder that can convert hydraulic energy into kinetic energy, thereby driving the moving frame 6 to move left and right. The moving frame 6 can drive the rotating plate 8 to move left and right, thereby driving the wafer placed on the rotating plate 8 to move left and right. The rotating column 7 can rotate, thereby causing the rotating plate 8 to rotate. The rotating plate 8 can cause the wafer placed on the rotating plate 8 to rotate, which facilitates the cutting of the wafer from different directions, so that the chip on the wafer can be completely cut out. The laser ranging unit 9 is a laser rangefinder that can measure its own distance from the moving frame 6, thereby facilitating the determination of the wafer's position.

[0045] Please see Figure 1 , Figure 5 and Figure 6 The present invention provides an embodiment of a high-precision electronic chip processing positioning device;

[0046] The system includes a second plate 12 and a second movable plate 14. Multiple second plates 12 are mounted on the top of the first plate 1. A hydraulic telescopic unit 13 is mounted on the front of each second plate 12, and the hydraulic telescopic unit 13 is electrically connected to the control unit 2. The output end of the hydraulic telescopic unit 13 is equipped with the second movable plate 14. An electric telescopic unit 15 is mounted on the top of the second movable plate 14, and the electric telescopic unit 15 is electrically connected to the control unit 2. A pressure plate 16 is mounted on the output end of the electric telescopic unit 15, and a rubber pad 21 is mounted on the bottom of the pressure plate 16. The second plate 12 can provide hydraulic... Telescopic unit 2 13 provides an installation position, allowing the hydraulic telescopic unit 2 13 to be installed. The hydraulic telescopic unit 2 13 is a hydraulic cylinder that can convert hydraulic energy into kinetic energy, thereby driving the moving plate 2 14 to move back and forth. The moving plate 2 14 can drive the electric telescopic unit 2 15, pressure plate 1 16 and pressure plate 2 20 to move back and forth. The electric telescopic unit 2 15 is an electric telescopic rod that can convert electrical energy into kinetic energy, thereby driving the pressure plate 1 16 to move up and down. The rubber pad 21 can prevent the pressure plate 1 16 from directly contacting the wafer, thereby avoiding damage to the wafer.

[0047] Please see Figure 1 , Figure 2 and Figure 4 The present invention provides an embodiment of a high-precision electronic chip processing positioning device;

[0048] The device includes an electric telescopic unit 10 and a movable plate 11. The electric telescopic units 10 are symmetrically installed on both sides of the movable frame 6 and are electrically connected to the control unit 2. The movable plate 11 is installed at the output end of the electric telescopic unit 10. Multiple pressure sensing units 28 are installed on one side of the movable plate 11 and are electrically connected to the control unit 2. A limit plate 29 is installed at the input end of the pressure sensing unit 28, and a rubber pad 30 is installed on one side of the limit plate 29. The electric telescopic unit 10 is an electric telescopic rod that converts electrical energy into kinetic energy, thereby driving the movable plate 11 to move left and right. The movable plate 11, by moving left and right, can drive the limit plate 29 to move left and right. The pressure sensing unit 28 is a pressure sensor that can detect the pressure of the limit plate 29 on the wafer. The limit plate 29 can limit the wafer, keeping it in the middle position of the rotating plate 8. The rubber pad 30 can prevent the limit plate 29 from directly contacting the wafer and causing wafer damage.

[0049] Please see Figure 1 , Figure 5 and Figure 6 The present invention provides an embodiment of a high-precision electronic chip processing positioning device;

[0050] The device includes a right-angle plate 17 and a micro motor 18. The right-angle plate 17 is mounted on the top of the pressure plate 16, and the micro motor 18 is mounted on the top of the right-angle plate 17. The micro motor 18 is electrically connected to the control unit 2. A rotating rod 19 is mounted on the output end of the micro motor 18. A pressure plate 20 is mounted on one end of the rotating rod 19. A rubber pad 22 is mounted on the bottom of the pressure plate 20. The right-angle plate 17 provides a mounting position for the micro motor 18. The micro motor 18 can convert electrical energy into kinetic energy, thereby driving the rotating rod 19 to rotate. The rotating rod 19 can drive the pressure plate 20 to rotate. The pressure plate 20 can press the wafer by moving downward. At the same time, the pressure plate 20 can move backward to push the cut chip into the collection box 24 by rotating to be parallel with the pressure plate 16. The rubber pad 22 can prevent the pressure plate 20 from directly contacting the chip and causing chip damage.

[0051] Please see Figure 1 , Figure 7 and Figure 8 The present invention provides an embodiment of a high-precision electronic chip processing positioning device;

[0052] The system includes a frame 23, which is mounted on the back of the plate 1. A collection box 24 is mounted on the inner side of the frame 23. An electric telescopic unit 25 is mounted on the bottom inner wall of the collection box 24 and is electrically connected to the control unit 2. A pressure sensing unit 31 is mounted on the output end of the electric telescopic unit 25 and is electrically connected to the control unit 2. A lifting plate 26 is mounted on the input end of the pressure sensing unit 31, and a rubber pad 27 is mounted on the top of the lifting plate 26. The frame 23 can... The collection box 24 provides an installation location for the collection box 24, which collects the chips. The electric telescopic unit 25 is an electric telescopic rod that can convert electrical energy into kinetic energy, thereby driving the pressure sensing unit 21 and the lifting plate 26 to move up and down. The pressure sensing unit 21 can detect the pressure of the chip above the lifting plate 26. The lifting plate 26 can reduce the distance the chip falls by moving upward, thereby reducing the impact damage when the chip falls. The rubber pad 27 can prevent the chip from directly colliding with the lifting plate 26 and causing damage to the lifting plate 26.

[0053] The usage method of the high-precision electronic chip processing positioning device is as follows:

[0054] S1. Install the processing positioning device below the cutting device, then place the finished wafer with multiple chips above the rotating plate 8, and then move the limiting plates 29 on both sides inward to squeeze and limit the wafer. At the same time, the pressure sensing unit 28 detects the pressure of the limiting plate 29 on the wafer to avoid excessive pressure from the limiting plate 29 on the wafer. Then, the moving frame 6 moves to the left by the distance of one chip, and the pressure plate 16 and pressure plate 20 move down to press the wafer.

[0055] S2. Next, the cutter of the cutting device moves down to cut the wafer. Then, the pressure plate 16 and the pressure plate 20 move up. The moving frame 6 drives the wafer to move to the left by one chip's distance. The cutter of the cutting device continues to move down to cut the wafer.

[0056] S3. Then the rotating plate 8 rotates, causing the wafer to rotate 90 degrees, so that the dicing device continues to dicing the wafer in the original dicing direction perpendicular to the wafer.

[0057] S4. After the cutting is completed, the micro motor 18 drives the second pressure plate 20 to rotate to be parallel with the first pressure plate 16. Then the first pressure plate 16 and the second pressure plate 20 move down. Subsequently, the first pressure plate 16 and the second pressure plate 20 move backward to push the chip on the rotating plate 8 into the collection box 24.

[0058] S4 also includes the following steps:

[0059] S41. Before the chip enters the collection box 24, the lifting plate 26 moves upward first to reduce the descent distance of the chip, thereby reducing the damage caused by the chip collision. As the pressure detected by the pressure sensing unit 2 31 increases, the lifting plate 26 moves downward accordingly.

[0060] Working Principle: Before using the high-precision electronic chip processing positioning device, it should be checked for any issues that might affect its use. The positioning device is installed below the cutting device. Then, the finished wafer with multiple chips is placed above the rotating plate 8. The limiting plates 29 on both sides move inwards to compress and limit the wafer. Simultaneously, the pressure sensing unit 28 detects the pressure of the limiting plates 29 on the wafer to prevent excessive pressure. Then, the moving frame 6 moves to the left by the distance of one chip. The pressure plates 16 and 20 move downwards to press the wafer firmly. Next, the cutting blade of the cutting device moves downwards to cut the wafer. Then, the pressure plates 16 and 20 move upwards, and the moving frame 6 moves... The wafer continues to move to the left by one chip's distance, and the dicing device's dicing blade continues to move downward to cut the wafer. Then, the rotating plate 8 rotates, causing the wafer to rotate 90 degrees, so that the dicing device continues to cut the wafer in a direction perpendicular to the original cutting direction. After the cutting is completed, the micro motor 18 drives the pressure plate 20 to rotate until it is parallel to the pressure plate 16. Then, the pressure plate 16 and the pressure plate 20 move downward. Subsequently, the pressure plate 16 and the pressure plate 20 move backward to push the chip on the rotating plate 8 into the collection box 24. Before the chip enters the collection box 24, the lifting plate 26 moves upward first to reduce the chip's descent distance, thereby reducing the damage caused by chip collision. As the pressure detected by the pressure sensing unit 2 31 increases, the lifting plate 26 moves downward accordingly.

[0061] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the rights involved.

Claims

1. A high-precision electronic chip processing positioning device, characterized in that: The device includes a plate (1), a rod (4), and a rotating plate (8). A control unit (2) is installed on the top of the plate (1). A rod (4) is installed on the top of the plate (1). A hydraulic telescopic unit (5) is symmetrically installed on one side of the rod (4). The hydraulic telescopic unit (5) is electrically connected to the control unit (2). A movable frame (6) is installed at the output end of the hydraulic telescopic unit (5). A rotating support mechanism is provided inside the movable frame (6). A laser ranging unit (9) is installed on one side of the rod (4). The laser ranging unit (9) is electrically connected to the control unit (2). Multiple plates (12) are installed on the top of the plate body one (1). A hydraulic telescopic unit two (13) is installed on the front of the plate body two (12). The hydraulic telescopic unit two (13) is electrically connected to the control unit (2). A movable plate two (14) is installed at the output end of the hydraulic telescopic unit two (13). An electric telescopic unit two (15) is installed on the top of the movable plate two (14). The electric telescopic unit two (15) is electrically connected to the control unit (2). A pressure plate one (16) is installed at the output end of the electric telescopic unit two (15). The rotating support mechanism includes a rotating column (7) and a rotating plate (8). The rotating column (7) is movably installed on the bottom inner wall of the movable frame (6), and the rotating plate (8) is installed on the top of the rotating column (7). A right-angle plate (17) is installed on the top of the first pressure plate (16), a micro motor (18) is installed on the top of the right-angle plate (17), and the micro motor (18) is electrically connected to the control unit (2). A rotating rod (19) is installed at the output end of the micro motor (18), a second pressure plate (20) is installed at one end of the rotating rod (19), and a second rubber pad (22) is installed at the bottom of the second pressure plate (20). A frame (23) is installed on the back of the plate (1). A collection box (24) is installed on the inner side of the frame (23). An electric telescopic unit (25) is installed on the bottom inner wall of the collection box (24). The electric telescopic unit (25) is electrically connected to the control unit (2). A pressure sensing unit (31) is installed at the output end of the electric telescopic unit (25). The pressure sensing unit (31) is electrically connected to the control unit (2). A lifting plate (26) is installed at the input end of the pressure sensing unit (31). A rubber pad (27) is installed on the top of the lifting plate (26).

2. The high-precision electronic chip processing positioning device according to claim 1, characterized in that: Support plates (3) are symmetrically installed at the bottom of the plate (1).

3. The high-precision electronic chip processing positioning device according to claim 1, characterized in that: Electric telescopic unit 1 (10) is symmetrically installed on both sides of the movable frame (6), and the electric telescopic unit 1 (10) is electrically connected to the control unit (2). The output end of the electric telescopic unit 1 (10) is equipped with a movable plate 1 (11).

4. The high-precision electronic chip processing positioning device according to claim 3, characterized in that: Multiple pressure sensing units (28) are installed on one side of the movable plate (11), and the pressure sensing units (28) are electrically connected to the control unit (2). A limit plate (29) is installed at the input end of the pressure sensing unit (28), and a rubber pad (30) is installed on one side of the limit plate (29).

5. The high-precision electronic chip processing positioning device according to claim 1, characterized in that: A rubber pad (21) is installed at the bottom of the pressure plate (16).

6. The method of using the high-precision electronic chip processing positioning device according to claim 4, characterized in that: The method of using the high-precision electronic chip processing positioning device is as follows: S1. Install the processing positioning device below the cutting device, then place the finished wafer with multiple chips above the rotating plate (8), and then the limiting plates (29) on both sides move inward to squeeze and limit the wafer. At the same time, the pressure sensing unit (28) detects the pressure of the limiting plate (29) on the wafer to avoid excessive pressure on the wafer. Then the moving frame (6) moves to the left by the distance of one chip, and the pressure plate (16) and pressure plate (20) move down to press the wafer. S2. Then the cutter of the cutting device moves down to cut the wafer. Then the first pressure plate (16) and the second pressure plate (20) move up. The moving frame (6) drives the wafer to move to the left by one chip distance. The cutter of the cutting device continues to move down to cut the wafer. S3. Then the rotating plate (8) rotates and drives the wafer to rotate 90 degrees, so that the cutting device continues to cut the wafer into chips in a direction perpendicular to the original cutting direction of the wafer. S4. After the cutting is completed, the micro motor (18) drives the second pressure plate (20) to rotate to be parallel with the first pressure plate (16). Then the first pressure plate (16) and the second pressure plate (20) move down. Then the first pressure plate (16) and the second pressure plate (20) move backward to push the chip on the rotating plate (8) into the collection box (24).

7. The method of using the high-precision electronic chip processing positioning device according to claim 6, characterized in that: The S4 process also includes the following steps: S41. Before the chip enters the collection box (24), the lifting plate (26) moves upward first to reduce the chip's descent distance, thereby reducing the damage caused by the chip collision. As the pressure detected by the pressure sensing unit (31) increases, the lifting plate (26) moves downward accordingly.

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