A batch electroplating equipment for injection molded parts

Abstract

The present invention discloses a batch electroplating equipment for injection molded parts, which relates to the field of electroplating equipment, including an electroplating tank, wherein one side of the inner part of the electroplating tank is provided with an electroplating chamber, a pressure chamber and a release chamber in sequence from top to bottom, and the other side of the inner part of the electroplating tank is provided with a recovery chamber, and the recovery chamber is connected to the electroplating chamber through a recovery channel. The present invention is based on the arrangement of a support rod and a sealing box, so that when a movable cover opens the electroplating chamber upward, the electroplating solution in the pressure chamber is sealed, and when the movable cover seals the electroplating chamber downward, the electroplating solution in the pressure chamber will continue to enter the electroplating chamber, so that the electroplating process is basically carried out in a sealed environment, reducing the pollution caused to the workshop and the impact on the health of personnel; and the electroplating process is carried out continuously, reducing losses.

Description

Technical Field

[0001] The invention relates to the field of electroplating equipment, and in particular to batch electroplating equipment for injection molded parts. Background Art

[0002] The surface condition and processing requirements during electroplating, selecting the appropriate steps, and performing necessary finishing on the surface of the parts to make the parts have a smooth and clean surface are important links in obtaining high-quality coatings.

[0003] When electroplating injection molded parts, exposed electroplating is usually performed. The heat generated by electroplating and the electroplating solution are mixed in the air, causing environmental pollution in the workshop and affecting the health of operators.

[0004] Therefore, it is necessary to propose a batch electroplating equipment for injection molded parts to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a batch electroplating equipment for injection molded parts to solve the problem that the heat generated by electroplating and the electroplating solution are mixed in the air during the electroplating process of injection molded parts, causing workshop environmental pollution and affecting the health of operators.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: an injection molded part batch electroplating device, comprising an electroplating tank, wherein one side of the electroplating tank is provided with an electroplating chamber, a pressure chamber and a release chamber in sequence from top to bottom, and the other side of the electroplating tank is provided with a recovery chamber, and the recovery chamber is connected to the electroplating chamber through a recovery channel;

[0007] A storage circulation mechanism for storing the electroplating solution is provided below the electroplating tank, the output end of the storage circulation mechanism is communicated with the interior of the release chamber, and the input end of the storage circulation mechanism is communicated with the interior of the recovery chamber;

[0008] The electroplating chamber is used to place the injection molded parts to be electroplated, and the storage circulation mechanism pumps the electroplating solution through the release chamber, the pressure chamber, the electroplating chamber, the recovery channel, and the recovery chamber in sequence, and then enters the storage circulation mechanism for circulation again, and the injection molded parts are electroplated when the electroplating solution flows through the electroplating chamber;

[0009] A movable cover is provided on the upper part of the electroplating chamber in a lifting manner, and support rods are fixedly provided on the upper and lower surfaces of the movable cover, and a conductive clamp is provided in the middle of the support rod, and the conductive clamp clamps a plurality of injection molded parts at the same time, and the conductive clamp comprises a first conductive mesh plate, a second conductive mesh plate and a first spring telescopic rod, the first conductive mesh plate is fixedly provided on the support rod, the second conductive mesh plate is slidably provided, and the injection molded parts are clamped between the first conductive mesh plate and the second conductive mesh plate, a side of the second conductive mesh plate away from the first conductive mesh plate is fixedly connected to the first spring telescopic rod, and an end of the first spring telescopic rod away from the second conductive mesh plate is fixedly connected to the movable cover;

[0010] A motor for driving the movable cover to flip 180 degrees is arranged on one side of the movable cover, and an electric cylinder for driving the motor and the movable cover to lift and lower is arranged on one side of the electroplating tank. When the electric cylinder drives the movable cover to descend and seal above the electroplating cavity, a completely sealed processing space is formed inside the electroplating tank and is used for electroplating injection molded parts.

[0011] Preferably, the storage circulation mechanism comprises a storage box, a second circulation pipe is provided on one side of the storage box, a first circulation pipe is provided on the other side of the storage box, an end of the first circulation pipe away from the storage box is communicated with the interior of the recovery chamber, an end of the second circulation pipe away from the storage box is communicated with the interior of the release chamber, and the electroplating solution is stored in the storage box;

[0012] The second circulation pipeline and the first circulation pipeline are both provided with solenoid valves, wherein the first circulation pipeline is also provided with a vacuum pump, and the second circulation pipeline is also provided with a pressure pump.

[0013] Preferably, the pressure chamber and the relief chamber are separated by a lower partition, the outer periphery of the lower partition is movably fitted on the inner wall of the electroplating tank, and the outer periphery of the lower partition is sealed with the inner wall of the electroplating tank, a pressure relief hole is provided on the lower partition, a pressure relief rod is slidably provided in the pressure relief hole, a sealing plate is fixedly provided on the upper end of the pressure relief rod, the diameter of the sealing plate is larger than the diameter of the pressure relief rod, the sealing plate is sealed at the upper end of the pressure relief hole, the diameter of the pressure relief hole is larger than the diameter of the pressure relief rod, the lower end of the pressure relief rod is telescopically arranged with the lower inner wall of the electroplating tank, and a spring is connected at the telescopic position;

[0014] The lower partition plate is also provided with a plurality of nozzles, the upper ends of the nozzles are communicated with the interior of the pressure chamber, and the lower ends of the nozzles are communicated with the interior of the relief chamber.

[0015] Preferably, the electroplating chamber and the pressure chamber are separated by an upper partition, the upper partition is fixedly arranged on the inner wall of the electroplating tank, a telescopic groove is arranged in the middle of the upper partition, and a sealing box is movably arranged in the telescopic groove;

[0016] The sealing box is a rectangular box structure, and connecting grooves are arranged on all sides of the rectangular box structure. A convex edge is fixedly arranged at the outer edge of the upper end of the rectangular box structure, and a second spring telescopic rod distributed vertically is fixedly connected between the upper surface of the upper partition and the bottom surface of the convex edge;

[0017] The sealing box corresponds to the support rod. When the movable cover is sealed above the electroplating chamber, the support rod resists the sealing box to descend and enables the electroplating chamber and the pressure chamber to communicate through the connecting groove.

[0018] Preferably, an electric telescopic rod is arranged between the lower partition and the inner wall of the lower end of the release chamber, and the electric telescopic rod comprises an electric telescopic cylinder and an electric telescopic core, the lower end of the electric telescopic cylinder is fixedly connected to the inner wall of the lower end of the release chamber, the upper end of the electric telescopic core is fixedly connected to the lower surface of the lower partition, the lower end of the electric telescopic core is movably extended into the electric telescopic cylinder, and a piston plate is fixedly arranged at one end of the electric telescopic core that is movably extended into the electric telescopic cylinder, an internal spring is fixedly connected between the upper surface of the piston plate and the upper inner wall of the electric telescopic cylinder, a second electromagnet is fixedly arranged on the bottom of the piston plate, a first electromagnet is fixedly arranged on the inner wall of the lower end of the electric telescopic cylinder, and the first electromagnet is arranged corresponding to the second electromagnet;

[0019] When the first electromagnet and the second electromagnet are energized, the first electromagnet and the second electromagnet generate magnetic attraction or repulsion to control the lower partition to move up and down inside the electroplating tank.

[0020] Preferably, the upper end of the recovery chamber is sealed with a fixed cover.

[0021] Preferably, a rectangular block is fixedly provided on the inner wall of the upper end of the recovery chamber, and the recovery channel is provided in the rectangular block. One end of the recovery channel connected to the inside of the recovery chamber is higher than the electroplating chamber.

[0022] Preferably, sealing rings are fixedly provided on the upper and lower surfaces of the movable cover, and the sealing rings are arranged along the outer edge of the movable cover.

[0023] Preferably, the hole on the electroplating tank for the pressure release rod to be extended and retracted is sealed with the outer ring of the pressure release rod.

[0024] Preferably, the inner and outer surfaces of the electroplating tank and the inner and outer structural surfaces of the electroplating tank are coated with an anti-corrosion layer.

[0025] Technical effects and advantages of the present invention:

[0026] 1. The present invention can electroplate several injection molded parts at the same time, and because the first spring telescopic rod has elastic telescopic ability, when the electroplating solution enters the electroplating cavity, it will impact the second conductive mesh plate to shake and rise and fall within a certain range, so that the electroplating solution fully flows between the first conductive mesh plate and the second conductive mesh plate, thereby fully electroplating the entire surface of the injection molded part;

[0027] 2. When electroplating the injection molded parts, the operator can simultaneously clamp the injection molded parts on the conductive fixture outside the electroplating tank, so that the injection molded parts can be electroplated and taken out by flipping the movable cover to continuously electroplate, thereby improving the electroplating efficiency;

[0028] 3. If the pressure of the electroplating solution exceeds the set threshold, the pumping power of the pressure pump can be immediately reduced to reduce the pressure of the electroplating solution subsequently pumped into the pressure chamber, and the original electroplating solution in the pressure chamber is reversed to the release chamber for release, so that the electroplating solution acting on the injection molded part always maintains a suitable pressure, solving the problem of pressure delay in electrical component adjustment;

[0029] 4. Based on the arrangement of the support rod and the sealing box, when the movable cover opens the electroplating chamber upward, the electroplating solution in the pressure chamber is sealed. When the movable cover seals the electroplating chamber downward, the electroplating solution in the pressure chamber will continue to enter the electroplating chamber, so that the electroplating process is basically carried out in a sealed environment, reducing the pollution caused to the workshop and the impact on the health of personnel; and the electroplating process is carried out continuously, reducing losses;

[0030] 5. The size of the pressure chamber and the relief chamber can be adjusted accordingly. When the lower partition is raised or lowered, the internal spring is stretched or compressed accordingly, thereby changing the maximum pressure of the electroplating solution pumped into the pressure chamber. The maximum pressure threshold of the electroplating solution in the pressure chamber can be adjusted according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structure of the batch electroplating equipment for injection molded parts of the present invention.

[0032] Figure 2 It is a schematic diagram of the internal structure of the batch electroplating equipment for injection molded parts of the present invention.

[0033] Figure 3 It is a cross-sectional view of the batch electroplating equipment for injection molded parts of the present invention.

[0034] Figure 4 It is a schematic diagram of the movable cover structure of the present invention.

[0035] Figure 5 For the present invention Figure 3 A schematic diagram of the enlarged structure in the middle.

[0036] Figure 6It is a schematic structural diagram of the movable cover of the present invention when it is closed.

[0037] Figure 7 It is a schematic structural diagram of the electroplating tank from one perspective of the present invention.

[0038] Figure 8 This is a schematic structural diagram of the electroplating tank of the present invention from another perspective.

[0039] Fig. 9 It is a cross-sectional view of the electroplating tank of the present invention.

[0040] In the figure: 1, electroplating tank; 2, fixed cover; 3, movable cover; 31, sealing ring; 4, support rod; 5, conductive clamp; 51, first conductive mesh plate; 52, second conductive mesh plate; 53, first spring telescopic rod; 6, motor; 7, electric cylinder; 8, storage box; 9, first circulation pipeline; 10, vacuum pump; 11, solenoid valve; 12, second circulation pipeline; 13, pressure pump; 14, recovery chamber; 15, recovery channel; 16, electroplating chamber; 17, pressure chamber; 18, relief cavity; 19, electric telescopic rod; 1901, electric telescopic cylinder; 1902, electric telescopic core; 1903, internal spring; 1904, piston plate; 1905, first electromagnet; 1906, second electromagnet; 20, pressure release rod; 201, sealing plate; 21, sealing box; 2101, connecting groove; 2102, convex edge; 2103, second spring telescopic rod; 22, nozzle; 23, pressure release hole; 24, telescopic groove; 25, upper partition; 26, rectangular block; 27, lower partition. DETAILED DESCRIPTION

[0041] The present invention provides Figure 1-Figure 9 The illustrated device for batch electroplating of injection molded parts comprises an electroplating tank 1, wherein one side of the inner part of the electroplating tank 1 is provided with an electroplating chamber 16, a pressure chamber 17 and a release chamber 18 in sequence from top to bottom, and the other side of the inner part of the electroplating tank 1 is provided with a recovery chamber 14, and the recovery chamber 14 is connected to the electroplating chamber 16 through a recovery channel 15;

[0042] A storage circulation mechanism for storing the electroplating solution is provided below the electroplating tank 1 , the output end of the storage circulation mechanism is communicated with the interior of the release chamber 18 , and the input end of the storage circulation mechanism is communicated with the interior of the recovery chamber 14 .

[0043] Specifically, the storage circulation mechanism includes a storage box 8, a second circulation pipe 12 is provided on one side of the storage box 8, a first circulation pipe 9 is provided on the other side of the storage box 8, an end of the first circulation pipe 9 away from the storage box 8 is communicated with the interior of the recovery chamber 14, and an end of the second circulation pipe 12 away from the storage box 8 is communicated with the interior of the release chamber 18, and the electroplating solution is stored in the storage box 8;

[0044] The second circulation pipeline 12 and the first circulation pipeline 9 are both provided with solenoid valves 11, wherein the first circulation pipeline 9 is also provided with a vacuum pump 10, and the second circulation pipeline 12 is also provided with a pressure pump 13; the injection molded parts to be electroplated are placed in the electroplating chamber 16, and the electroplating tank 1 is sealed, and the electroplating tank 1 is evacuated to a vacuum state by the vacuum pump 10, and the pressure pump 13 is started. The pressure pump 13 pumps the electroplating solution stored in the storage box 8 through the release chamber 18, the pressure chamber 17, the electroplating chamber 16, the recovery channel 15, and the recovery chamber 14 in sequence, and then enters the storage box 8 again for circulation, and the electroplating solution is electroplated when flowing through the electroplating chamber 16; finally, the electroplated injection molded parts can be taken out.

[0045] refer to Figure 1 and Figure 4 As shown in the figure, a movable cover 3 is provided above the electroplating chamber 16 in a lifting manner, and a support rod 4 is fixedly provided on the upper and lower surfaces of the movable cover 3. A conductive clamp 5 is provided in the middle of the support rod 4. The conductive clamp 5 clamps a plurality of injection molded parts at the same time. The conductive clamp 5 includes a first conductive mesh plate 51, a second conductive mesh plate 52 and a first spring telescopic rod 53. The first conductive mesh plate 51 is fixedly provided on the support rod 4, and the second conductive mesh plate 52 is slidably provided. The injection molded parts are clamped between the first conductive mesh plate 51 and the second conductive mesh plate 52, and the second conductive mesh plate 52 is away from the first conductive mesh plate 51. One side of the first conductive mesh plate 51 is fixedly connected to the first spring telescopic rod 53, and one end of the first spring telescopic rod 53 away from the second conductive mesh plate 52 is fixedly connected to the movable cover 3; the present invention can electroplate a plurality of injection molded parts at the same time, and because the first spring telescopic rod 53 has elastic telescopic ability, when the electroplating solution enters the electroplating cavity 16, it will impact the second conductive mesh plate 52 to shake and rise and fall within a certain range, so that the electroplating solution fully flows between the first conductive mesh plate 51 and the second conductive mesh plate 52, thereby fully electroplating the entire surface of the injection molded part.

[0046] For further reference, Figure 2 and 4 As shown in the figure, a motor 6 for driving the movable cover 3 to flip 180 degrees is arranged on one side of the movable cover 3, and an electric cylinder 7 for driving the motor 6 and the movable cover 3 to lift and lower is arranged on one side of the electroplating tank 1. When the electric cylinder 7 drives the movable cover 3 to descend and seal above the electroplating cavity 16, a completely sealed processing space is formed inside the electroplating tank 1 and is used for electroplating the injection molded parts. When the injection molded parts are being electroplated, the operator can simultaneously clamp the injection molded parts on the conductive clamp 5 outside the electroplating tank 1, so that after the injection molded parts are taken out after being electroplated, the movable cover 3 can be flipped over to continuously carry out electroplating, thereby improving the electroplating efficiency.

[0047] refer to Figure 5 and Fig. 9As shown in the figure, the pressure chamber 17 and the relief chamber 18 are separated by a lower partition 27, the outer periphery of the lower partition 27 is movably fitted on the inner wall of the electroplating tank 1, and the outer periphery of the lower partition 27 and the inner wall of the electroplating tank 1 are kept sealed, and a pressure relief hole 23 is provided on the lower partition 27, and a pressure relief rod 20 is slidably provided in the pressure relief hole 23, and a sealing plate 201 is fixedly provided on the upper end of the pressure relief rod 20, and the diameter of the sealing plate 201 is larger than the diameter of the pressure relief rod 20, and the sealing plate 201 is sealed at the upper end of the pressure relief hole 23, and the diameter of the pressure relief hole 23 is larger than the pressure relief hole 23. The diameter of the rod 20, the lower end of the pressure relief rod 20 is telescopically arranged with respect to the lower inner wall of the electroplating tank 1, and a spring is connected at the telescopic part; a plurality of nozzles 22 are also arranged on the lower partition plate 27, the upper end of the nozzle 22 is connected with the interior of the pressure chamber 17, and the lower end of the nozzle 22 is connected with the interior of the relief chamber 18; when the electroplating solution in the storage box 8 is pumped into the relief chamber 18, the electroplating solution is sprayed from the nozzle 22 into the pressure chamber 17, and the electroplating solution after passing through the pressure chamber 17 enters the electroplating chamber 16 to electroplate the injection molded parts.

[0048] The plating solution pumped into the plating chamber 16 has a certain pressure, which ensures that the surface of the injection molded parts can be fully plated. In order to prevent the plating solution pumped into the plating chamber 16 and the pressure chamber 17 from having too high a pressure and eroding the surface of the injection molded parts, a pressure relief rod 20 is provided in the present invention. Since the lower partition 27 can move relative to the pressure relief rod 20, when the pressure of the plating solution in the pressure chamber 17 is too high, the lower partition 27 will be pressed down, thereby separating the sealing plate 201 from the lower partition 27. At this time, the plating solution in the pressure chamber 17 can flow back from the pressure relief hole 23 to the relief chamber 18 to be relieved. When the pressure is relieved, the pumping power can be appropriately reduced.

[0049] It should be noted that a pressure sensor or other device may be provided inside the pressure chamber 17 to monitor the pressure of the electroplating solution. If it is detected that the pressure of the electroplating solution exceeds the set threshold, the pumping power of the pressure pump 13 may be immediately reduced to reduce the pressure of the electroplating solution subsequently pumped into the pressure chamber 17. The original electroplating solution in the pressure chamber 17 is reversed to the release chamber 18 for release, so that the electroplating solution acting on the injection molded part always maintains an appropriate pressure, thereby solving problems such as delay in adjusting the pressure of electrical components.

[0050] refer to Figure 2 and Figure 5As shown in the figure, the plating chamber 16 and the pressure chamber 17 are separated by an upper partition 25, and the upper partition 25 is fixedly arranged on the inner wall of the plating tank 1. A telescopic groove 24 is arranged in the middle of the upper partition 25, and a sealing box 21 is movably arranged in the telescopic groove 24; the sealing box 21 is a rectangular box structure, and connecting grooves 2101 are arranged on all sides of the rectangular box structure. A convex edge 2102 is fixedly arranged at the outer edge of the upper end of the rectangular box structure, and a second spring telescopic rod 2103 distributed vertically is fixedly connected between the upper surface of the upper partition 25 and the bottom surface of the convex edge 2102; the sealing box 21 corresponds to the support rod 4, and the movable cover 3 is sealed in the plating chamber. 16, the support rod 4 resists the sealing box 21 to descend and connect the plating chamber 16 with the pressure chamber 17 through the connecting groove 2101. Based on the arrangement of the support rod 4 and the sealing box 21, when the movable cover 3 opens the plating chamber 16 upward, the plating solution in the pressure chamber 17 is sealed. When the movable cover 3 seals the plating chamber 16 downward, the plating solution in the pressure chamber 17 will continue to enter the plating chamber 16, so that the electroplating process is basically carried out in a sealed environment, which reduces the pollution to the workshop and the impact on the health of personnel; and the electroplating process is carried out continuously to reduce losses.

[0051] refer to Figure 5 As shown in the figure, in the present invention, an electric telescopic rod 19 is arranged between the lower partition 27 and the inner wall of the lower end of the release chamber 18, and the electric telescopic rod 19 includes an electric telescopic cylinder 1901 and an electric telescopic core 1902. The lower end of the electric telescopic cylinder 1901 is fixedly connected to the inner wall of the lower end of the release chamber 18, and the upper end of the electric telescopic core 1902 is fixedly connected to the lower surface of the lower partition 27. The lower end of the electric telescopic core 1902 is movably extended into the electric telescopic cylinder 1901, and a piston plate 1904 is fixedly arranged at one end of the electric telescopic core 1902 that is movably extended into the electric telescopic cylinder 1901. An internal spring 1903 is fixedly connected between the upper surface of the piston plate 1904 and the upper inner wall of the electric telescopic cylinder 1901, and the bottom of the piston plate 1904 is fixedly arranged There is a second electromagnet 1906, and a first electromagnet 1905 is fixedly arranged on the inner wall of the lower end of the electric telescopic cylinder 1901, and the first electromagnet 1905 is arranged corresponding to the second electromagnet 1906; when the first electromagnet 1905 and the second electromagnet 1906 are energized, the first electromagnet 1905 and the second electromagnet 1906 generate magnetic attraction or repulsion, and control the lower partition 27 to move up and down inside the electroplating tank 1, and the chamber sizes of the pressure chamber 17 and the relief chamber 18 can be adjusted accordingly. When the lower partition 27 is raised or lowered, the internal spring 1903 is stretched or compressed accordingly, so that the maximum pressure of the electroplating solution pumped into the pressure chamber 17 changes, and the maximum pressure threshold of the electroplating solution in the pressure chamber 17 can be adjusted according to actual needs.

[0052] refer to Figure 1As shown in , in actual use, a fixed cover 2 is sealed at the upper end of the recovery chamber 14; a rectangular block 26 is fixedly arranged on the inner wall of the upper end of the recovery chamber 14, and the recovery channel 15 is arranged in the rectangular block 26. One end of the recovery channel 15 connected to the inside of the recovery chamber 14 is higher than the electroplating chamber 16. The upper and lower surfaces of the movable cover 3 are fixedly provided with sealing rings 31, which are arranged along the outer edge of the movable cover 3. The sealing ring 31 is used to ensure the sealing performance of the movable cover 3 when it is sealed above the electroplating chamber 16.

[0053] It should also be noted that in the present invention, the hole for the pressure release rod 20 to be retracted on the electroplating tank 1 is sealed with the outer ring of the pressure release rod 20 to prevent leakage of the electroplating solution. Accordingly, the sealing between the fixed cover 2 and the recovery chamber 14, the sealing between the movable cover 3 and the electroplating chamber 16, the sealing between the outer periphery of the sealing box 21 and the inner wall of the telescopic groove 24, the sealing between the electric telescopic core 1902 and the electric telescopic cylinder 1901, etc. all require corresponding sealing treatments, which will not be elaborated here; the inner and outer surfaces of the electroplating tank 1 and the inner and outer structural surfaces of the electroplating tank 1 are coated with an anti-corrosion layer to prevent corrosion by the electroplating solution.

Claims

1. A batch electroplating device for injection molded parts, comprising an electroplating tank (1), characterized in that: An electroplating chamber (16), a pressure chamber (17) and a release chamber (18) are sequentially arranged on one side of the interior of the electroplating tank (1) from top to bottom, and a recovery chamber (14) is arranged on the other side of the interior of the electroplating tank (1), wherein the recovery chamber (14) is connected to the electroplating chamber (16) via a recovery channel (15); A storage circulation mechanism for storing the electroplating solution is provided below the electroplating tank (1), the output end of the storage circulation mechanism being in communication with the interior of the release chamber (18), and the input end of the storage circulation mechanism being in communication with the interior of the recovery chamber (14); The electroplating chamber (16) is used to place the injection molded parts to be electroplated, and the storage circulation mechanism pumps the electroplating solution through the release chamber (18), the pressure chamber (17), the electroplating chamber (16), the recovery channel (15), and the recovery chamber (14) in sequence, and then enters the storage circulation mechanism for circulation again, and the injection molded parts are electroplated when the electroplating solution flows through the electroplating chamber (16); A movable cover (3) is provided above the electroplating chamber (16) in a lifting manner, support rods (4) are fixedly provided on the upper and lower surfaces of the movable cover (3), a conductive clamp (5) is provided in the middle of the support rod (4), and the conductive clamp (5) clamps a plurality of injection molded parts simultaneously, the conductive clamp (5) comprises a first conductive mesh plate (51), a second conductive mesh plate (52) and a first spring telescopic rod (53), the first conductive mesh plate (51) is fixedly provided on the support rod (4), the second conductive mesh plate (52) is slidably provided, and the injection molded parts are clamped between the first conductive mesh plate (51) and the second conductive mesh plate (52), a surface of the second conductive mesh plate (52) away from the first conductive mesh plate (51) is fixedly connected to the first spring telescopic rod (53), and an end of the first spring telescopic rod (53) away from the second conductive mesh plate (52) is fixedly connected to the movable cover (3); A motor (6) for driving the movable cover (3) to flip 180 degrees is disposed on one side of the movable cover (3), and an electric cylinder (7) for driving the motor (6) and the movable cover (3) to lift and lower is disposed on one side of the electroplating tank (1). When the electric cylinder (7) drives the movable cover (3) to descend and seal above the electroplating cavity (16), a completely sealed processing space is formed inside the electroplating tank (1) and is used for electroplating injection molded parts; The electroplating chamber (16) and the pressure chamber (17) are separated by an upper partition (25), the upper partition (25) being fixedly arranged on the inner wall of the electroplating tank (1), a telescopic groove (24) being arranged in the middle of the upper partition (25), and a sealing box (21) being movably arranged in the telescopic groove (24); The sealing box (21) is a rectangular box structure, and connecting grooves (2101) are arranged on all four sides of the rectangular box structure. A convex edge (2102) is fixedly arranged at the outer edge of the upper end of the rectangular box structure, and a second spring telescopic rod (2103) distributed vertically is fixedly connected between the upper surface of the upper partition (25) and the bottom surface of the convex edge (2102); The sealing box (21) corresponds to the support rod (4), and when the movable cover (3) is sealed above the electroplating chamber (16), the support rod (4) contacts the sealing box (21) and descends, thereby allowing the electroplating chamber (16) and the pressure chamber (17) to communicate with each other through the communication groove (2101).

2. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: The storage circulation mechanism comprises a storage box (8), a second circulation pipe (12) is arranged on one side of the storage box (8), a first circulation pipe (9) is arranged on the other side of the storage box (8), an end of the first circulation pipe (9) away from the storage box (8) is connected to the interior of the recovery chamber (14), and an end of the second circulation pipe (12) away from the storage box (8) is connected to the interior of the release chamber (18), and the electroplating solution is stored in the storage box (8); The second circulation pipeline (12) and the first circulation pipeline (9) are both provided with a solenoid valve (11), wherein the first circulation pipeline (9) is also provided with a vacuum pump (10), and the second circulation pipeline (12) is also provided with a pressure pump (13).

3. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: The pressure chamber (17) and the relief chamber (18) are separated by a lower partition (27), the outer periphery of the lower partition (27) is movably fitted on the inner wall of the electroplating tank (1), and the outer periphery of the lower partition (27) and the inner wall of the electroplating tank (1) are kept sealed, the lower partition (27) is provided with a pressure relief hole (23), a pressure relief rod (20) is slidably arranged in the pressure relief hole (23), a sealing plate (201) is fixedly arranged at the upper end of the pressure relief rod (20), the diameter of the sealing plate (201) is larger than the diameter of the pressure relief rod (20), the sealing plate (201) is sealed at the upper end of the pressure relief hole (23), the diameter of the pressure relief hole (23) is larger than the diameter of the pressure relief rod (20), the lower end of the pressure relief rod (20) is telescopically arranged with respect to the lower inner wall of the electroplating tank (1), and a spring is connected at the telescopic position; A plurality of nozzles (22) are also provided on the lower partition plate (27), the upper ends of the nozzles (22) being in communication with the interior of the pressure chamber (17), and the lower ends of the nozzles (22) being in communication with the interior of the release chamber (18).

4. The batch electroplating equipment for injection molded parts according to claim 3, characterized in that: An electric telescopic rod (19) is provided between the lower baffle (27) and the inner wall of the lower end of the release chamber (18), and the electric telescopic rod (19) comprises an electric telescopic cylinder (1901) and an electric telescopic core (1902), the lower end of the electric telescopic cylinder (1901) is fixedly connected to the inner wall of the lower end of the release chamber (18), the upper end of the electric telescopic core (1902) is fixedly connected to the lower surface of the lower baffle (27), the lower end of the electric telescopic core (1902) is movably extended into the interior of the electric telescopic cylinder (1901), and the electric telescopic core (1902) is movable. 2) A piston plate (1904) is fixedly arranged at one end that movably extends into the interior of the electric telescopic cylinder (1901); an internal spring (1903) is fixedly connected between the upper surface of the piston plate (1904) and the upper inner wall of the electric telescopic cylinder (1901); a second electromagnet (1906) is fixedly arranged at the bottom of the piston plate (1904); a first electromagnet (1905) is fixedly arranged on the inner wall of the lower end of the electric telescopic cylinder (1901); the first electromagnet (1905) and the second electromagnet (1906) are arranged correspondingly; When the first electromagnet (1905) and the second electromagnet (1906) are energized, the first electromagnet (1905) and the second electromagnet (1906) generate magnetic attraction or repulsion, thereby controlling the lower partition (27) to move up and down inside the electroplating tank (1).

5. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: The upper end of the recovery chamber (14) is sealed with a fixed cover (2).

6. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: A rectangular block (26) is fixedly arranged on the inner wall of the upper end of the recovery chamber (14), and the recovery channel (15) is arranged in the rectangular block (26). One end of the recovery channel (15) communicating with the interior of the recovery chamber (14) is higher than the electroplating chamber (16).

7. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: Sealing rings (31) are fixedly provided on the upper and lower surfaces of the movable cover (3), and the sealing rings (31) are arranged along the outer edge of the movable cover (3).

8. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: The hole on the electroplating tank (1) through which the pressure release rod (20) is extended and retracted is sealed with the outer ring of the pressure release rod (20).

9. The batch electroplating equipment for injection molded parts according to claim 1, characterized in that: The inner and outer surfaces of the electroplating tank (1) and the inner and outer structural parts surfaces of the electroplating tank (1) are all coated with an anti-corrosion layer.

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