Cascade fluidic oscillatory jet device for chip cooling

Abstract

The application discloses a cascade fluid oscillation jet device for chip heat dissipation, which comprises an inlet jet plate, a plurality of jet plates, a jet bottom plate, an outlet cover plate and a fluid oscillation structure. The plurality of jet plates are arranged in series. One side of the inlet jet plate and the jet plate is provided with the fluid oscillation structure. The fluid oscillation structure comprises a shunt cavity and at least two oscillation cavities, which are used for converting the steady flow of fluid into periodic oscillation jet. The jet bottom plate is provided with a plurality of flow channels. The jet outlet of the fluid oscillation structure is located directly above the plurality of flow channels. The ribs are formed between the flow channels. The outlet cover plate, the jet plate, the inlet jet plate and the jet bottom plate at the bottom are connected as a whole. The application can solve the problem of heat dissipation of the non-uniform heating chip heat source in the prior art. According to the actual application requirement, the in-phase or anti-phase non-steady periodic oscillation jet can be formed, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to fluid oscillation jet devices, and more particularly to a cascaded fluid oscillation jet device for chip heat dissipation. Background Technology

[0002] As the performance of electronic chips continues to improve, thermal management issues are becoming increasingly prominent, becoming a major factor restricting their development. A significant increase in heat flux density leads to rapid heat accumulation inside the chip, easily forming high-temperature areas, which in turn affects the stability and performance of the device. Currently, effective heat dissipation technologies for high heat flux density chips are insufficient, especially for heat-generating chips with localized hot spots, where effective methods for temperature equalization and heat dissipation are lacking.

[0003] In chip cooling technology, there are two main approaches: passive and active. Active cooling technology involves actively intervening in the heat transfer process of a fluid through external power or energy input to improve heat transfer efficiency. This is achieved by utilizing mechanical vibration, electromagnetic fields, and fluid excitation to enhance the speed of heat transfer within the fluid. Fluid excitation, in particular, involves using an exciter to introduce disturbances and inject energy into the fluid, transforming steady-state flow into unsteady flow, thereby increasing the degree of fluid turbulence.

[0004] Fluid oscillation devices are a novel type of unsteady-state excitation technology. They can generate an active excitation effect at the outlet solely based on the inherent properties of the fluid, without mechanical or electromagnetic components, thus producing an unsteady oscillating jet. Compared to traditional exciters such as solenoid valves, they offer advantages such as high reliability and stability, making them suitable for operation in various harsh environments. However, the overall design of these devices is largely the same, including an oscillation chamber inlet, a mixing chamber, two feedback channels, and a jet outlet. Their geometry lacks novelty and cannot simultaneously achieve independent oscillation of multiple jets, failing to address the hotspot problem of multi-heat-generating chips or improve temperature uniformity. Summary of the Invention

[0005] In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, the purpose of this invention is to provide a cascaded fluid oscillation jet device for chip heat dissipation. This device connects multiple fluid oscillation devices in series. The fluid oscillation structure adopts an in-phase or out-of-phase design to generate two or more oscillating jets at the jet outlet, and there is no strong interference between the fluids.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] A cascaded fluid oscillation jet device for chip heat dissipation includes:

[0008] Inlet jet plate, used for flow diversion;

[0009] Multiple jet plates are connected in series and attached together. The inlet jet plate and one side of the jet plate are provided with a fluid oscillation structure. The fluid oscillation structure includes a flow splitting cavity and at least two oscillation cavities, which are used to transform the steady flow of fluid into a periodic oscillating jet.

[0010] The jet base plate has a liquid outlet in the middle of one side and multiple flow channels on its inner surface. The flow channels correspond one-to-one with the inlet jet plate and the jet outlets of the multiple jet plates, and ribs are formed between the flow channels.

[0011] An outlet cover plate is used for sealing; the outlet cover plate, the jet plate, the inlet jet plate, and the jet base plate located at the bottom are connected as a whole;

[0012] The fluid oscillation structure can be designed in phase or out of phase.

[0013] The fluid oscillation structure adopts a phase-in-phase design, so the jet outlet of the fluid oscillation structure emits two or more oscillating jets with the same deflection frequency and phase; specifically, it includes two independent and structurally identical oscillation cavities, the two oscillation cavities have the same structure, and each oscillation cavity includes an oscillation cavity inlet, a mixing cavity, a left attachment wall, a left channel return port, a right channel return port, a left channel inlet, a right channel inlet, a left feedback channel, a right feedback channel, and a jet outlet;

[0014] The mixing chamber is connected to the left channel return port, the right channel return port, the left channel inlet, the right channel inlet, and the jet outlet, respectively; the left attachment wall and the right attachment arm are located on the left and right sides of the mixing chamber, respectively; the left channel inlet and the left channel return port are connected through the left feedback channel, and the right channel inlet and the right channel return port are connected through the right feedback channel;

[0015] The fluid vibration structure adopts an anti-phase design, so that two or more oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out of the jet outlet of the fluid oscillation structure.

[0016] Specifically, it includes the left oscillation cavity inlet, right oscillation cavity inlet, left mixing cavity, right mixing cavity, left attachment wall, middle attachment wall 1, middle attachment wall 2, right attachment wall, right attachment wall, left channel return port, middle channel return port, right channel return port, left channel inlet, middle channel inlet, right channel inlet, left feedback channel, middle feedback channel, right feedback channel, left jet outlet and right jet outlet;

[0017] The aforementioned feedback channel is a common feedback channel;

[0018] The first and second attachment walls are located on both sides of the central feedback channel. The first attachment wall is located on one side of the left oscillation cavity, and the second attachment wall is located on one side of the right oscillation cavity. The left and right oscillation cavities are connected through a common feedback channel. The inlet of the central channel and the outlet of the central channel are connected through the central feedback channel.

[0019] When there are more than two oscillating cavities, multiple oscillating cavities are connected in parallel on the same shunt cavity;

[0020] The thickness of the ribs is equal to the wall thickness of the fluid oscillation structure, and the ribs are arranged along the fluid flow direction.

[0021] Furthermore, the bottom surface of the jet base plate is tightly bonded to the heat source surface of the heating chip through a thermal interface material with high thermal conductivity.

[0022] Furthermore, one side of the outlet cover is provided with a sealing ring groove, and the bottom is provided with two threaded holes for connecting the jet base plate.

[0023] Furthermore, a portion of the fluid entering through the central channel inlet flows through the central feedback channel and is divided into two streams, which simultaneously act on the main jets of the two mixing chambers, causing the main jets in the two mixing chambers to deflect in opposite directions.

[0024] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0025] (1) The fluid oscillation structure enhances the fluid disturbance in the flow channel inside the jet base plate and strengthens convective heat dissipation;

[0026] (2) The thickness of the jet base plate ribs is equal to that of the fluid oscillation structure. On the one hand, it can isolate the interference between the oscillating jets of multiple jet plates. On the other hand, it can make full use of the heat exchange area of ​​the jet base plate to remove more heat from the heat-generating chip.

[0027] (3) Two or more oscillating jets with the same deflection frequency and phase in the same phase design can make the cooling medium flow in the same direction, which can have a better heat dissipation effect on the local hot spots of the heat-generating chip; two or more oscillating jets with the same deflection frequency and phase difference of half a cycle in the opposite phase design can make the cooling medium flow in two different directions, which can improve the temperature uniformity of the heat-generating chip. Attached Figure Description

[0028] Figure 1 This is an exploded structural diagram of the cascaded fluid oscillation jet device of the present invention with the same phase design;

[0029] Figure 2 This is a schematic diagram of the front of the jet plate of the fluid oscillation structure in phase design of the present invention;

[0030] Figure 3This is a schematic diagram of the reverse side of the jet plate of the fluid oscillation structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the jet base plate of the fluid oscillation structure of the present invention;

[0032] Figure 5 This is a schematic diagram of the in-phase design of the fluid oscillation structure of the present invention;

[0033] Figure 6 This is a schematic diagram of the fluid flow path at t=0T in the in-phase design of the fluid oscillation structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the fluid oscillation structure in phase design of the present invention, showing the flow path at t=0.5T.

[0035] Figure 8 This is a schematic diagram of the inverse design of the fluid oscillation structure of the present invention;

[0036] Figure 9 This is a schematic diagram of the fluid oscillation structure reverse design of the present invention at t=0T, representing the flow path of the volume.

[0037] Figure 10 This is a schematic diagram of the flow path at t=0.5T for the reverse design of the fluid oscillation structure of the present invention;

[0038] Figure 11 This is a schematic diagram of the fluid oscillation structure of the present invention, in which the three oscillators are designed to be in phase.

[0039] Figure 12 This is a schematic diagram of the fluid oscillation structure of the present invention, in which the three oscillators are designed to be out of phase. Detailed Implementation

[0040] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0041] Example 1

[0042] like Figure 1 As shown, a cascaded fluid oscillation jet device for chip heat dissipation includes an inlet jet plate 1, multiple jet plates 2, an outlet cover plate 3, a jet base plate 4, a first sealing washer 5, a fixing bolt 6, a flat washer 7, a locking nut 8, a second sealing washer 9, and a fastening screw 10.

[0043] In this embodiment, multiple jet plates are connected in series and closely fitted between the inlet jet plate 1 and the outlet cover plate 3. The inlet jet plate 1 and the jet plate 2 are provided with a fluid oscillation structure 11. Each jet plate is sealed with a first sealing washer 5 and connected together by a fixing bolt 6, a flat washer 7, and a locking nut 8. The jet base plate 4 is located below the jet plate 2 and has connecting through holes at the four corners. It is sealed with a second sealing washer 9 and connected to the inlet jet plate 1 and the outlet cover plate 3 as a whole by fastening screws 10.

[0044] like Figure 1 , Figure 2 and 3 As shown, the inlet jet plate 1 is mainly used for diversion and sealing. It has a liquid inlet 211 at the top and two threaded holes 101 at the bottom for connecting to the jet base plate 4. One side of the jet plate 2 has a first sealing ring groove 23, and the other side has a fluid oscillation structure 11. The side with the fluid oscillation structure 11 is in close contact with the side of the adjacent jet plate 2 with the first sealing ring groove 23. The fluid oscillation structure 11 is composed of a diversion chamber 21 and an oscillation chamber 22.

[0045] The outlet cover plate 3 is mainly used for sealing. One side is provided with a sealing ring groove to prevent leakage of the cooling working fluid, and the bottom is provided with two threaded holes 31 for connecting the jet base plate 4.

[0046] like Figure 1 and Figure 4 As shown, the jet base plate 4 is provided with a second sealing ring groove 44, and a liquid outlet 41 is provided in the middle of one side. Multiple flow channels 42 are opened on its inner surface. The forms include, but are not limited to, parallel flow channels, serpentine flow channels, fractal flow channels, etc. The flow channels 42 correspond one-to-one with the jet outlets 2230 of the inlet jet plate 1 and multiple jet plates 2 installed on it. Ribs 43 are formed between each flow channel 42 to ensure that the oscillating jets generated by the jet outlets 2230 do not interfere with each other. The thickness of the ribs 43 is equal to the wall thickness of the fluid oscillation structure 11.

[0047] The bottom surface of the jet base plate 4 is tightly bonded to the heat source surface of the heating chip through a thermal interface material with high thermal conductivity, eliminating air gaps and reducing contact thermal resistance. The thermal interface material includes, but is not limited to, thermally conductive silicone grease, liquid metal, graphene thermal conductive film, etc. The number of flow channels 42 of the jet base plate 4 is adjusted according to the heat source surface area of ​​the heating chip to be cooled. The fins 43 are arranged along the fluid flow direction, which on the one hand enhances the disturbance and guides the fluid flow, and on the other hand provides support, thereby improving the structural strength of the base plate. For each local heating area, a closed jet space is formed together with the fluid oscillation structure 11 to avoid the interference between the oscillating jets generated by the jet outlet 2230 from adversely affecting the heat transfer performance and ensuring the cooling effect.

[0048] The working principle of a cascaded fluid oscillation jet device for chip heat dissipation is as follows: the cooling medium flows into the cascaded fluid oscillation jet device from the inlet 211 of the inlet jet plate 1, flows through the fluid oscillation structure 11 provided in the inlet jet plate 1 and multiple jet plates 2, and the oscillating jet flowing out from the jet outlet 2230 impacts the surface of the flow channel 42 of the jet base plate 4, enhancing the heat dissipation of the heat-generating chip area. Then, it converges on both sides of the flow channel 42 of the jet base plate 4, flows to the outlet 41, and then flows out of the cascaded fluid oscillation jet device, thereby carrying away the heat generated by the heat-generating chip.

[0049] The fluid oscillation structure 11 can be designed in the same phase or in opposite phase, and can generate two oscillating jets in the same phase or in opposite phase at the oscillating jet outlet 2230, transforming the steady flow of the fluid into a periodic oscillating jet, increasing the degree of turbulence, and thus improving the heat transfer performance.

[0050] The fluid oscillation structures of multiple jet plates can all be in-phase, all out-of-phase, or alternately arranged. Depending on the actual application requirements, the periodic unsteady oscillating jets formed in-phase or out-of-phase can continuously disrupt the boundary layer of the jet base plate, enhancing the convective heat transfer effect. The number of oscillation cavities can be increased or decreased according to actual needs.

[0051] like Figure 11 and Figure 12 As shown, the fluid oscillation structure 11 includes at least two oscillation chambers. When the number of oscillation chambers is greater than two, multiple oscillation chambers are connected in parallel in the same branching chamber, that is, they share a common inlet.

[0052] Specifically, in the in-phase design, multiple oscillating cavities are independent of each other and have the same structure.

[0053] When the design is inverted, two adjacent oscillators in multiple oscillators share a single feedback channel.

[0054] like Figure 5 As shown, when there are two oscillation cavities, the fluid oscillation structure 11 is designed with two independent and identical oscillation cavities on the left and right sides, containing four feedback channels. This allows two oscillating jets with the same deflection frequency and phase to flow out from the jet outlets 2230 on the left and right sides, resulting in better heat dissipation for local hot spots in the heat-generating chip. Figure 8 As shown, the fluid oscillation structure 11 is designed with two non-independent oscillation cavities on the left and right sides, each with a common feedback channel. It contains three feedback channels, which can enable the jet outlets 2230 on the left and right sides to flow out oscillating jets with the same deflection frequency and a phase difference of half a cycle, thereby improving the temperature uniformity of the heat-generating chip.

[0055] This embodiment uses two oscillation cavities, and the in-phase design is as follows:

[0056] like Figure 5 As shown, the flow-dividing cavity 21 of the fluid oscillation structure 11, designed in phase, is provided with an inlet 211 and a flow-dividing boss 212; the oscillation cavity 22 includes a right oscillation cavity 221 and a left oscillation cavity 222; the right oscillation cavity 221 and the left oscillation cavity 222 have the same structure. Taking the left oscillation cavity 222 as an example, its structure is described as follows: the left oscillation cavity 222 includes an oscillation cavity inlet 2220, a mixing cavity 2221, a right attachment wall 2222, a left attachment wall 2223, a right channel return port 2224, a left channel return port 2225, a right channel inlet 2226, and a left channel inlet 2227. The right feedback channel 2228, the left feedback channel 2229, and the jet outlet 2230 are connected; the mixing chamber 2221 is connected to the right channel return port 2224, the left channel return port 2225, the right channel inlet 2226, the left channel inlet 2227, and the jet outlet 2230; the right attachment wall 2222 and the left attachment wall 2223 are located on the left and right sides of the mixing chamber 2221; the right channel inlet 2226 and the right channel return port 2224 are connected through the right feedback channel 2228; the left channel inlet 2227 and the left channel return port 2225 are connected through the left feedback channel 2229.

[0057] like Figure 6 As shown, in this embodiment, the working process of a complete oscillation cycle is as follows: at t=0T (T represents the period of change of the fluid deflection angle at the jet outlet from positive to negative), the fluid enters from the inlet 2220 of the oscillation chamber, flows through the left and right mixing chambers, and flows along the attachment wall due to the "Coanda effect". When the main jet in the mixing chamber 2221 flows along the left attachment wall 2223, the fluid in the mixing chamber 2221 forms a counterclockwise vortex ring. Most of the fluid flows out from the jet outlet 2230, and a small amount of fluid flows into the mixing chamber 2221 through the left feedback channel 2229 and interacts with the main jet. The main jet in the mixing chamber 2221 is deflected to the right attachment wall 2222; as Figure 7 As shown, at t=0.5T, when the main jet in mixing chamber 2221 flows along the right attachment wall 2222, the fluid in mixing chamber 2221 forms a clockwise vortex ring. A small amount of fluid flows into mixing chamber 2221 through the right feedback channel 2228 and interacts with the main jet. The main jet in mixing chamber 2221 is deflected to the left attachment wall 2223. Through the above process, a complete oscillation cycle is formed. The oscillation sequence of the right oscillation chamber is consistent with that of the left oscillation chamber. Therefore, the two oscillating jets with the same deflection frequency and phase flow out from the jet outlet 2230 of the left and right mixing chambers.

[0058] In this embodiment, the two oscillation cavities are designed to be out of phase:

[0059] like Figure 8As shown, the oscillation cavity 22 includes a left oscillation cavity inlet 2201, a right oscillation cavity inlet 2202, a left mixing cavity 2203, a right mixing cavity 2204, a left attachment wall 2205, a middle first attachment wall 2206, a middle second attachment wall 2207, a right attachment wall 2208, a left channel return port 2209, a middle channel return port 2210, a right channel return port 2211, a left channel inlet 2212, a middle channel inlet 2213, a right channel inlet 2214, and a left feedback channel 2215. The system includes a central feedback channel 2216, a right feedback channel 2217, a left jet outlet 2218, and a right jet outlet 2219. The central feedback channel 2216 is a common feedback channel. The left oscillation cavity and the right oscillation cavity are connected through the common feedback channel, i.e., the central feedback channel 2216. The central channel inlet 2213 and the central channel outlet 2210 are connected through the central feedback channel 2216. The first attachment wall 2206 and the second attachment wall 2207 are located on the left and right sides of the central feedback channel 2216, respectively.

[0060] like Figure 9 As shown, in this embodiment, the working process of a complete oscillation cycle is as follows: at t=0T, the main jet of fluid enters the left mixing chamber 2203 from the left oscillation chamber inlet 2201 and flows along the middle first attachment wall 2206. The main jet of fluid enters the right mixing chamber 2204 from the right oscillation chamber inlet 2202 and flows along the middle second attachment wall 2207. A small amount of fluid flows into the middle feedback channel 2216 from the middle channel inlet 2213 and then flows out from the middle channel return port 2210. The two streams act simultaneously on the main jets in the left mixing chamber 2203 and the right mixing chamber 2204. The main jet in the left mixing chamber 2203 deflects towards the left attachment wall 2205, and the main jet in the right mixing chamber 2204 deflects towards the right attachment wall 2208. The deflection directions of the main jets in the two mixing chambers are opposite. Figure 10 As shown, at t = 0.5 T, the main jets in the two mixing chambers flow along the left attachment wall 2205 and the right attachment wall 2208, respectively. The feedback fluids in the left feedback channel 2215 and the right feedback channel 2217 act on the fluids in the two mixing chambers, and thus two oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out from the jet outlets of the left and right mixing chambers.

[0061] This invention employs a fluid oscillation structure on multiple series-connected jet plates to generate oscillating jets with a certain frequency and diffusion angle. It does not rely on any driving device and can form periodic unsteady oscillating jets with the same or opposite phase according to actual application requirements. This can continuously disrupt the boundary layer of the jet base plate. The number of oscillation cavities can be increased or decreased according to actual needs. The thickness of the jet base plate ribs is the same as the wall thickness of the fluid oscillation structure of the jet plate, which minimizes the interference between fluids and increases the effective cooling coverage area. This increases the amount of cooling applied to the chip surface, effectively improving the temperature uniformity inside the chip and reducing local hot spots.

[0062] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the embodiments described above. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A cascaded fluidic oscillatory jet device for chip cooling, characterized in that, include: Inlet jet plate, used for flow diversion; Multiple jet plates are connected in series and attached together. The inlet jet plate and one side of the jet plate are provided with a fluid oscillation structure. The fluid oscillation structure includes a flow splitting cavity and at least two oscillation cavities, which are used to transform the steady flow of fluid into a periodic oscillating jet. The jet base plate has a liquid outlet in the middle of one side and multiple flow channels on its inner surface. The flow channels correspond one-to-one with the inlet jet plate and the jet outlets of the multiple jet plates, and ribs are formed between the flow channels. An outlet cover plate is used for sealing; the outlet cover plate, the jet plate, the inlet jet plate, and the jet base plate located at the bottom are connected as a whole; The fluid oscillation structure can be designed in phase or out of phase. The fluid oscillation structure adopts a phase-in-phase design, so the jet outlet of the fluid oscillation structure emits two or more oscillating jets with the same deflection frequency and phase; specifically, it includes two independent and structurally identical oscillation cavities, the two oscillation cavities have the same structure, and each oscillation cavity includes an oscillation cavity inlet, a mixing cavity, a left attachment wall, a right attachment wall, a left channel return port, a right channel return port, a left channel inlet, a right channel inlet, a left feedback channel, a right feedback channel, and a jet outlet; The mixing chamber is connected to the left channel return port, the right channel return port, the left channel inlet, the right channel inlet, and the jet outlet, respectively; the left attachment wall and the right attachment arm are located on the left and right sides of the mixing chamber, respectively; the left channel inlet and the left channel return port are connected through the left feedback channel, and the right channel inlet and the right channel return port are connected through the right feedback channel; The fluid vibration structure adopts an anti-phase design, so that two or more oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out of the jet outlet of the fluid oscillation structure. Specifically, it includes the left oscillation cavity inlet, right oscillation cavity inlet, left mixing cavity, right mixing cavity, left attachment wall, middle attachment wall 1, middle attachment wall 2, right attachment wall, left channel return port, middle channel return port, right channel return port, left channel inlet, middle channel inlet, right channel inlet, left feedback channel, middle feedback channel, right feedback channel, left jet outlet, and right jet outlet; The aforementioned feedback channel is a common feedback channel; The first and second attachment walls are located on both sides of the central feedback channel. The first attachment wall is located on one side of the left oscillation cavity, and the second attachment wall is located on one side of the right oscillation cavity. The left and right oscillation cavities are connected through a common feedback channel. The inlet of the central channel and the outlet of the central channel are connected through the central feedback channel. When there are more than two oscillating cavities, multiple oscillating cavities are connected in parallel on the same shunt cavity; The thickness of the ribs is equal to the wall thickness of the fluid oscillation structure, and the ribs are arranged along the fluid flow direction.

2. The cascade fluidic oscillator jet device of claim 1, wherein, The bottom surface of the jet base plate is tightly bonded to the heat source surface of the heating chip through a thermal interface material with high thermal conductivity.

3. The cascade fluidic oscillator jet device of claim 1, wherein, One side of the outlet cover is provided with a sealing ring groove, and the bottom is provided with two threaded holes for connecting the jet base plate.

4. The cascade fluidic oscillator jet device of claim 1, wherein, The fluid entering through the central channel inlet flows through the central feedback channel and is divided into two streams, which simultaneously act on the main jets of the two mixing chambers, causing the main jets in the two mixing chambers to deflect in opposite directions.

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