Ultrasonic nebulizer and self-feedback regulated nebulization cooling system

Abstract

The application discloses an ultrasonic atomization heat dissipation technology, in particular to an ultrasonic atomizer and an atomization cooling system with self-feedback regulation and control, belonging to the technical field of cooling and heat dissipation. The ultrasonic atomizer is composed of a piezoelectric ultrasonic transducer arranged in a liquid storage cavity, an array of micro-porous silicon sheets and grooves. The ultrasonic atomizer is arrayed to form an array ultrasonic atomization module. Then, a liquid distribution pipeline is used to provide liquid to be atomized for each ultrasonic atomizer. A temperature monitoring module is used to monitor the temperature of each heat dissipation area of an object to be cooled. An atomization control module is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation area, and control the corresponding ultrasonic atomizer to perform ultrasonic atomization. The application can effectively regulate the cooling intensity according to the hot spots, improve the heat exchange uniformity and cooling efficiency, and realize intelligent cooling with high efficiency and low energy consumption.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of cooling and heat dissipation, and relates to an ultrasonic atomization heat dissipation technology, in particular to an ultrasonic atomizer and a self-feedback regulated atomization cooling system. BACKGROUND

[0002] With the development of high integration and high power of electronic equipment, the heat dissipation problem caused by high heat flux generated by equipment work has become a key factor limiting the performance improvement of devices. If the heat generated by the equipment during work cannot be efficiently dissipated, the overheat working condition will occur, and the temperature will exceed the safety threshold of the equipment, which will cause serious damage to the service life of the equipment.

[0003] The heat exchange capacity of traditional air cooling and single-phase liquid cooling is difficult to meet the increasing heat dissipation demand, and although the emerging cooling technologies represented by microchannels, spray cooling and high-speed jetting have high heat dissipation capacity, they still have problems such as low heat exchange uniformity and local hot spots, so that when the heat dissipation demand of the object to be cooled is not uniform in time and space, the heat dissipation potential cannot be fully developed. The ultrasonic atomization technology uses high-frequency oscillation of piezoelectric ceramics to apply ultrasonic waves to liquid to form tiny droplets, and the atomization level can be controlled by changing the frequency and voltage of the ultrasonic waves to regulate the heat dissipation intensity, so that the technology has great potential in high-efficiency heat dissipation and overcoming the time and space non-uniformity of heat dissipation.

[0004] However, the existing cooling system has not fully developed the potential of ultrasonic atomization technology, and new ultrasonic atomization cooling technology is urgently needed to meet the increasingly complex heat dissipation demand. SUMMARY

[0005] One of the purposes of the present application is to provide an ultrasonic atomizer to solve the problems of high energy consumption and low efficiency of the atomizer in the prior art.

[0006] Another purpose of the present application is to provide a self-feedback regulated atomization cooling system, which sets the above-mentioned ultrasonic atomizer array and independently controls the partitions, cooperates with a temperature monitoring module, and performs partition cooling to solve the problem of temperature non-uniformity. Especially when the surface temperature non-uniformity of the heat management system changes sharply, it brings great threat to the safe work of electronic components. The present application solves the problem of temperature non-uniformity and has great application value.

[0007] Technical scheme: The present application adopts the following technical scheme:

[0008] On the one hand, the present application provides an ultrasonic atomizer, which comprises

[0009] a liquid storage cavity, a misting nozzle is arranged on one side of the liquid storage cavity;

[0010] A piezoelectric ultrasonic transducer is arranged on the side of the liquid storage cavity opposite to the atomizing nozzle, and is used to generate ultrasonic waves for atomization.

[0011] An array of micro-holes is arranged in the liquid storage cavity and covers the atomizing nozzle, and a cavity for storing the liquid to be atomized is formed between the piezoelectric ultrasonic transducer and the array of micro-holes.

[0012] At least the array of micro-holes arranged in the region directly opposite to the atomizing nozzle is provided with an array of micro-hole nozzles, and the hole size of the micro-hole nozzles gradually decreases from the inside to the outside.

[0013] Further, the liquid storage cavity is provided with at least one liquid inlet.

[0014] Further, the micro-hole nozzles are micron-level conical holes, and the size of the large-hole end of the conical holes is 40-100 microns.

[0015] Further, the taper of the conical holes is 50-70 degrees.

[0016] Further, the surface of the piezoelectric ultrasonic transducer is further provided with a metal plate for increasing the ultrasonic transmission efficiency.

[0017] In another aspect, the present application provides a self-feedback controlled atomizing cooling system, which comprises

[0018] An array of ultrasonic atomizers is arranged in the array of ultrasonic atomizers, and each ultrasonic atomizer is directly opposite to a heat dissipation region of the object to be cooled.

[0019] A liquid distribution pipeline is provided for each ultrasonic atomizer to provide the liquid to be atomized.

[0020] A temperature monitoring module is used to monitor the temperature of each heat dissipation region of the object to be cooled.

[0021] An atomizing control module is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation region, and to control the corresponding ultrasonic atomizer to perform ultrasonic atomization.

[0022] Further, the array of ultrasonic atomizers comprises a cavity body and a plurality of arrayed grooves arranged on the cavity body, and each groove forms an ultrasonic atomizer, and the liquid distribution pipeline is arranged in the cavity body and comprises a liquid inlet main pipe, a liquid outlet main pipe and branch pipes, the branch pipes are arranged between the liquid inlet main pipe and the liquid outlet main pipe, and are used to connect the liquid inlets of each ultrasonic atomizer.

[0023] Further, the atomization cooling system further comprises a liquid circulation module, the liquid circulation module comprising: a circulating pump, a cooler and a collection pipe for collecting high-temperature working fluid of the heat dissipation area, the collection pipe and the liquid outlet main pipe being connected to the cooler through a circulation pipe after being merged, and the working fluid being sent to the liquid inlet main pipe through the circulating pump after being cooled by the cooler and pressurized for recycling.

[0024] Further, the temperature monitoring module is an infrared temperature measuring instrument, and the temperature distribution of the object to be cooled is obtained through infrared temperature measurement technology.

[0025] Further, the atomization control module comprises a computer, a signal generator and a power amplifier connected in sequence, and the power amplifier is connected to each ultrasonic atomizer through a cable to realize independent control of each ultrasonic atomizer.

[0026] Compared with the prior art, the present application has the following beneficial technical effects:

[0027] (1) Compared with ordinary water-cooled plate heat exchange and micro-channel heat exchange, the present application can realize automatic regulation and control of the cooling intensity of different areas to meet the spatial and temporal non-uniformity requirements of heat dissipation. By identifying local hot spots and feeding back to the power input signal to regulate the piezoelectric ceramic vibration to change the ultrasonic spray cooling intensity, intelligent and efficient heat dissipation is realized.

[0028] (2) Compared with the traditional cooling method, the present application can realize higher heat exchange efficiency and lower operating cost. By forming a liquid droplet impact surface with a larger surface area through ultrasonic waves, the working fluid can be more fully utilized for two-phase heat exchange, and the heat exchange capacity is higher. At the same time, the demand for liquid volume is small, thereby reducing the demand for pipeline liquid supply, reducing the burden of pipeline and liquid supply, and reducing the cost.

[0029] (3) The ultrasonic spray cooling technology can be realized in a micro-integrated manner, has practical engineering application value, and provides technical support for compact integrated high-power working micro-electronic device heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a schematic diagram of the ultrasonic atomizer in embodiment 1 of the present application.

[0031] Figure 2 It is a top view of the array micro-porous silicon sheet in embodiment 1 of the present application.

[0032] Figure 3 It is a schematic diagram of the use principle of the ultrasonic atomizer in embodiment 1 of the present application.

[0033] Figure 4 It is a schematic diagram of the ultrasonic atomizer in embodiment 2 of the present application.

[0034] Figure 5The schematic diagram of the self-feedback regulated atomizing cooling system in embodiment 3 of the present application.

[0035] Figure 6 The schematic diagram of the array ultrasonic atomizing module in embodiment 3 of the present application.

[0036] Figure 7 The schematic diagram of the array ultrasonic atomizing module in embodiment 3 of the present application. Figure 6 The A-A sectional view in embodiment 3 of the present application.

[0037] Figure 8 The A-A sectional view in embodiment 3 of the present application. Figure 7 The partial enlarged schematic diagram C in embodiment 3 of the present application.

[0038] Figure 9 The B-B sectional view in embodiment 3 of the present application. Figure 6 The B-B sectional view in embodiment 3 of the present application.

[0039] Figure 10 The B-B sectional view in embodiment 3 of the present application. Figure 9 The partial enlarged schematic diagram D in embodiment 3 of the present application.

[0040] Figure 11 The partial enlarged schematic diagram D in embodiment 3 of the present application. Figure 5 The schematic diagram of the array ultrasonic atomizing module in embodiment 3 of the present application.

[0041] 100-ultrasonic atomizer, 110-liquid storage cavity, 120-atomizing nozzle, 130-piezoelectric ultrasonic transducer, 131-piezoelectric ceramic sheet, 132-positive signal input terminal, 133-negative signal input terminal; 140-array microporous silicon sheet, 141-microporous nozzle; 150-liquid inlet; 160-jet; 170-metal plate;

[0042] 200-array ultrasonic atomizing module, 210-cavity body, 220-groove;

[0043] 300-liquid distribution pipeline; 310-liquid inlet main pipe, 320-liquid outlet main pipe, 330-branch pipe;

[0044] 400-temperature monitoring module;

[0045] 500-atomizing control module, 510-computer, 520-signal generator, 530-power amplifier, 540-signal input bus;

[0046] 600-liquid circulation module, 610-circulation pump, 620-cooler, 630-circulation pipe, 640-collection pipe;

[0047] 700-object to be cooled, 710-box body. DETAILED DESCRIPTION

[0048] The embodiments of the present application will be further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0049] In the description of the present application, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0050] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] Embodiment 1: as shown in the figure, the present embodiment provides an ultrasonic atomizer 100, comprising Figures 1 to 3

[0052] a liquid storage cavity 110, one side of the liquid storage cavity 110 is provided with an atomizing nozzle 120;

[0053] a piezoelectric ultrasonic transducer 130, arranged in the liquid storage cavity 110 and opposite to the atomizing nozzle 120, for generating ultrasonic waves for atomization; and

[0054] an array of microporous silicon wafers 140, arranged in the liquid storage cavity 110 and covering the atomizing nozzle 120, forming a cavity for storing liquid to be atomized between the piezoelectric ultrasonic transducer 130 and the array of microporous silicon wafers 140;

[0055] Among them, at least the array of microporous silicon wafers 140 in the area opposite to the atomizing nozzle 120 is provided with array distributed microporous nozzles 141, and the pore size of the microporous nozzles 141 gradually decreases from inside to outside.

[0056] The liquid storage cavity 110 of the present embodiment is formed by cavity milling or other processing, Figure 1 is a schematic view of the cross section of the cavity, Figure 2 is a schematic view of the array of microporous silicon wafers 140 in the top view, Figure 3 ​As shown in Fig. 1, the piezoelectric ultrasonic transducer 130 is installed at the top of the cavity, the atomizing nozzle 120 is opened at the bottom of the cavity, and the full-liquid operation in the liquid storage cavity 110 is the most ideal state. In this embodiment, the piezoelectric ultrasonic transducer 130 is set with a frequency and a power. When the piezoelectric ultrasonic transducer 130 is excited by an alternating electric field with the set frequency and power, the dielectric inside the piezoelectric ultrasonic transducer 130 generates mechanical vibration, realizing the electric-mechanical conversion, and generating ultrasonic waves with the required frequency and power. The piezoelectric material as the vibration source determines the characteristics of the output sound waves. The sound waves are transmitted through the liquid medium and generate complex physical oscillation effects inside the liquid. In the main direction of ultrasonic wave transmission, the micro-porous nozzle 141 with gradually changing size is arranged in the present application. Through the size gradient effect, the sound pressure is focused, and sufficient pressure gradient is formed in the micro-porous nozzle 141, and a pressure peak is formed at the outlet tip of the micro-porous nozzle 141. When the pressure peak acts on the liquid and can overcome the inertial force and surface tension of the liquid, the liquid droplets can be excited from the liquid, and the jet flow 160 of the liquid droplets is formed, as shown in Fig. 2. The working fluid atomization has the technical advantages of adjustable control and miniaturization. Figure 3

[0057] The existing technology also has two technologies of piezoelectric spraying and pressure atomization using piezoelectric materials. The piezoelectric spraying uses the piezoelectric ceramic sheet 131 to drive the porous sheet to vibrate to "screen" out the liquid droplets. The pressure atomization is to disperse the liquid into a group of small liquid droplets by the pressure difference in the nozzle vortex chamber. Compared with the existing technology, the present application adopts a different atomization mechanism and has the following technical advantages:

[0058] (1) The ultrasonic atomization of the present application can accurately control the speed and size of the liquid droplets by adjusting the frequency and power of the ultrasonic waves, and the working flow range can be wider, so as to realize the accurate heat control of the heat dissipation object. The generated atomized particles are more uniform in size and distribution, and are particularly suitable for objects with high requirements for temperature uniformity. The piezoelectric spraying uses the piezoelectric ceramic sheet 131 to drive the porous sheet to vibrate to "screen" out the liquid droplets, so that the adjustable control range is limited. It is difficult to meet the fine control, and the working flow range is also limited. The main mechanism of the pressure atomization is to disperse the liquid into droplets by the pressure difference. The uniformity of the atomized particles is relatively poor, and the particle size is greatly affected by the nozzle diameter and the spraying pressure.

[0059] (2) The ultrasonic atomization of the present application does not produce excessive liquid droplet splashing or unnecessary working fluid waste in the atomization process, can accurately deliver the liquid droplet group to the target area, and reduces unnecessary loss. The piezoelectric atomization and the pressure atomization have a large spraying impact force, and the large air power can disturb the sprayed liquid droplets and cause the conical spraying mode, which is easy to cause splashing and raw material waste, and the dispersibility of the atomized particles leads to a low utilization rate of the cooling working fluid.

[0060] ​(3) The ultrasonic atomization structure is compact, compared with the traditional atomization means, and avoids the conflict between space density and power consumption. The acoustic atomization only needs a small amount of electric energy to excite the liquid droplets in the working process, and the energy consumption is low. At the same time, the ultrasonic atomization almost has no mechanical noise, and is suitable for application scenarios that require a quiet working environment. The pressure spray usually needs compressed air or mechanical drive to generate high-pressure airflow, and the energy consumption is relatively high. The piezoelectric spray uses the piezoelectric ceramic sheet 131 to drive the porous sheet to vibrate, and a large mechanical noise may be generated during the working process.

[0061] As a specific embodiment, the micropore nozzle 141 is a micron-level conical hole, the size of the large hole end of the conical hole is 40-100 microns, and the size of the small hole end of the conical hole is 4-20 microns; the taper of the conical hole is 50-70 degrees, and the thickness of the array micropore silicon sheet 140 is generally about 20-80 microns; it should be noted that the size of the small hole of the conical hole is selected in relation to the contact angle of the micropore nozzle 141, the liquid surface tension, and the pressure in the liquid storage cavity 110, and at least needs to meet the condition that under the working pressure in the liquid storage cavity 110, if the piezoelectric ultrasonic transducer 130 is not started, the liquid (working fluid) will not be sprayed out of the micropore nozzle 141.

[0062] The conical hole can be a circular conical hole, or a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid, or the like. As an example, the conical hole is a quadrangular pyramid hole, the large-diameter end of the quadrangular pyramid hole has a side length of 50 microns, the taper is 56 degrees, the small opening end has a side length of 5 microns, and the thickness of the array micropore silicon sheet 140 is about 33 microns.

[0063] As a specific embodiment, the piezoelectric ultrasonic transducer 130 is a piezoelectric ceramic sheet 131, the top of the piezoelectric ceramic sheet 131 is provided with a signal input positive electrode end 132, one side of the bottom of the piezoelectric ceramic sheet 131 is provided with a signal input negative electrode end 133, and the piezoelectric ceramic sheet 131 itself is mounted on the top wall in the liquid storage cavity 110 by glue or other mounting structures.

[0064] As a specific embodiment, the liquid storage cavity 110 is provided with at least one liquid inlet 150, and the working fluid is continuously supplied to the liquid storage cavity 110 through the liquid inlet 150. As an example, the liquid inlet 150 is arranged on the side wall of the liquid storage cavity 110.

[0065] It should be noted that the material of the array micropore silicon sheet 140 is not limited, and the reason for using a silicon sheet is that the micropore nozzle 141 with the required size and shape can be efficiently processed.

[0066] Example 2: The same as example 1, as shown in Figure 4 The difference is that the surface of the piezoelectric ultrasonic transducer 130 is further provided with a metal plate 170 for increasing the ultrasonic transmission efficiency, and specifically, the metal plate 170 is an aluminum plate attached to the bottom of the piezoelectric ceramic sheet 131.

[0067] Embodiment 3: as shown in Figure 5 and Figure 6 The present embodiment provides a self-feedback regulated atomizing cooling system, comprising

[0068] an array ultrasonic atomizing module 200 formed by array distribution of a plurality of ultrasonic atomizers 100, each of which is directly opposite to a heat dissipation area of the object to be cooled 700;

[0069] a liquid distribution pipeline 300 for providing liquid to be atomized to each of the ultrasonic atomizers 100;

[0070] a temperature monitoring module 400 for monitoring the temperature of each heat dissipation area of the object to be cooled 700; and

[0071] an atomizing control module 500 for setting the ultrasonic frequency and power according to the temperature of each heat dissipation area and controlling the corresponding ultrasonic atomizer 100 to perform ultrasonic atomization.

[0072] The present embodiment sets the array of ultrasonic atomizers 100 in Embodiment 1, uses the liquid distribution pipeline 300 to provide liquid to be atomized to each of the ultrasonic atomizers 100, uses the temperature monitoring module 400 to monitor the temperature of each heat dissipation area of the object to be cooled 700, and uses the atomizing control module 500 to set the ultrasonic frequency and power according to the temperature of each heat dissipation area and control the corresponding ultrasonic atomizer 100 to perform ultrasonic atomization; thus, high-efficiency partitioned precise cooling and heat dissipation of the object to be cooled 700 are achieved, and the cooling and heat dissipation capacity can be automatically adjusted according to the heat distribution of the object to be cooled 700, effectively preventing local overheating and also preventing local excessive heat dissipation of the object to be cooled 700, thus causing energy invalid waste.

[0073] As a preferred embodiment, as shown in Figures 6 to 10 The array ultrasonic atomizing module 200 comprises a cavity body 210 and a plurality of array distributed grooves 220 arranged on the cavity body 210, each of which forms an ultrasonic atomizer 100 as a liquid storage groove, as shown in Figure 8 The liquid distribution pipeline 300 is arranged in the cavity body 210 and comprises a liquid inlet main pipe 310, a liquid outlet main pipe 320 and branch pipes 330, the branch pipes 330 are arranged between the liquid inlet main pipe 310 and the liquid outlet main pipe 320 and are used to connect the liquid inlets 150 of each of the ultrasonic atomizers 100.

[0074] As a preferred embodiment, as shown in Figure 5 and Figure 11As shown, the atomization cooling system further comprises a liquid circulation module 600, which comprises a circulating pump 610, a cooler 620 and a collection pipe 640 for collecting high-temperature working fluid in the heat dissipation area, the collection pipe 640 and the liquid outlet main pipe 320 are connected to the cooler 620 through the circulation pipe 630, and the working fluid is cooled by the cooler 620, pressurized by the circulating pump 610 and then sent to the liquid inlet main pipe 310 for circulation.

[0075] As shown in the figure, Figure 11 In order to meet the collection of high-temperature working fluid in the collection pipe 640, the object to be cooled 700 is placed in a box 710, and the cooling working fluid sprayed by the ultrasonic atomizer 100 is collected through the box 710 after cooling the object to be cooled 700, and the collection pipe 640 is connected to the bottom low point of the box 710, and the collected high-temperature working fluid is collected and sent to the cooler 620 through the circulation pipe 630, realizing circulation.

[0076] As shown in the figure, Figure 11 The temperature monitoring module 400 is an infrared thermometer, and the temperature distribution of the object to be cooled 700 is obtained by infrared temperature measurement technology. The object to be cooled 700 of the present application can be an electronic device, and it should be noted that the cooling working fluid should be insulating relative to the electronic device, such as R134a, HFE7100, liquid ammonia, n-pentane and other low-boiling-point liquid working fluids or deionized water.

[0077] As shown in the figure, Figure 5 The atomization control module 500 comprises a computer 510, a signal generator 520 and a power amplifier 530 connected in sequence, and the power amplifier 530 is connected to each ultrasonic atomizer 100 through a cable, realizing independent control of each ultrasonic atomizer 100.

[0078] The working process of the present application is as follows: after the atomization cooling system is started, the liquid circulation module 600 starts to run, and the cooling working fluid will enter the cavity body 210 through the liquid distribution pipe 300 and flow out; during the working fluid circulation process, the temperature monitoring module 400 starts to run, the temperature distribution of the target heat dissipation surface is obtained by infrared imaging technology, and is fed back to the atomization control module 500, and after analysis, the optimized cooling strategy is obtained, the input alternating current power frequency and voltage of each ultrasonic atomizer 100 are controlled, different electrical signals are input to the corresponding ultrasonic atomizer 100 according to the temperature conditions of different cooling subunit areas; each ultrasonic atomizer 100 is driven to work by the corresponding electrical signal, and forms a high-speed impact of micro-droplets on the target surface for cooling. The cooling working fluid completing the heat exchange process flows back to the circulation pipe 630 through the liquid discharge pipe, and completes the work.

[0079] Specific control, the computer 510 receives the monitoring signal of the temperature monitoring module 400, analyzes the temperature distribution of the target heat dissipation surface, judges the temperature of each partition unit according to the set partition unit, and the set value difference is used as the control signal (proportional control or PID control) signal generator 520 to generate the corresponding control signal, and the power amplifier 530 is used to adjust the power of the corresponding ultrasonic atomizer 100.

[0080] The present application utilizes the ultrasonic spray cooling technology, has the advantages of low power consumption, small amount of working medium, high heat dissipation efficiency and small device size, can greatly improve the heat dissipation level of electronic devices, reduce the design cost and operation burden of the cooling system; on the other hand, the controllable characteristics of ultrasonic spray are utilized, a self-feedback control atomization cooling method is proposed, the local hot spots are identified and fed back to the atomization control module 500, the piezoelectric ceramic vibration is adjusted to change the ultrasonic spray cooling strength, the intelligent control of cooling strength in different areas can be realized, the time and space non-uniformity requirement of heat dissipation can be met, and intelligent and efficient heat dissipation can be realized.

[0081] Each ultrasonic atomizer corresponds to different areas of the cooling heat dissipation surface, the temperature monitoring module monitors the temperature distribution of the heat dissipation surface in real time, and feeds back to the atomization control module, the atomization control module adjusts the frequency-voltage input of each ultrasonic atomizer according to the temperature distribution of the heat dissipation surface to change the spray intensity (spray speed, droplet size, flow rate, etc.) of the atomizer to control the cooling strength, and finally realizes self-feedback control of high-speed atomization cooling, and meets the time and space non-uniformity requirement of heat dissipation.

[0082] The above embodiments are only used to illustrate the present application, and are not limited to the present application. Although the present application is described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present application do not deviate from the spirit and scope of the present application, and should be covered in the scope of the claims of the present application.

Claims

1. A self-regulated feedback mist cooling system, characterized in that, Comprising an array ultrasonic atomization module formed by a plurality of ultrasonic atomizers arranged in an array, each ultrasonic atomizer facing a heat dissipation area of the object to be cooled; a liquid distribution pipeline for providing liquid to be atomized to each ultrasonic atomizer; a temperature monitoring module for monitoring the temperature of each heat dissipation area of the object to be cooled; and an atomization control module for setting the ultrasonic frequency and power according to the temperature of each heat dissipation area and controlling the corresponding ultrasonic atomizer to perform ultrasonic atomization; the array ultrasonic atomization module comprises a cavity body and a plurality of array-arranged grooves arranged on the cavity body, each groove forming an ultrasonic atomizer as a liquid storage cavity; the ultrasonic atomizer comprises a liquid storage cavity with an atomization nozzle formed on one side; a piezoelectric ultrasonic transducer arranged in the liquid storage cavity opposite the atomization nozzle for generating ultrasonic waves for atomization; and an array microporous silicon wafer arranged in the liquid storage cavity and covering the atomization nozzle, forming a cavity for storing liquid to be atomized between the piezoelectric ultrasonic transducer and the array microporous silicon wafer; wherein at least the array microporous silicon wafer opposite the atomization nozzle region is provided with array-arranged microporous nozzles, the microporous nozzles gradually decreasing in size from the inside to the outside; the surface of the piezoelectric ultrasonic transducer is further provided with a metal plate for increasing the ultrasonic transmission efficiency; the microporous nozzle is a micron-level conical hole, the large hole end of the conical hole has a size of 40-100 microns, and the small hole end of the conical hole has a size of 4-20 microns; the taper of the conical hole is 50-70 degrees, and the thickness of the array microporous silicon wafer is 20-80 microns; the liquid storage cavity is provided with at least one liquid inlet, and the liquid distribution pipeline is arranged in the cavity body and comprises a liquid inlet main pipe, a liquid outlet main pipe and branch pipes distributed between the liquid inlet main pipe and the liquid outlet main pipe for connecting the liquid inlets of each ultrasonic atomizer.

2. The atomizing cooling system of claim 1, wherein It further comprises a liquid circulation module, which comprises a circulating pump, a cooler and a collection pipe for collecting high-temperature working fluid of the heat dissipation area, the collection pipe and the liquid outlet main pipe are connected to the cooler through a circulating pipe after merging, and the working fluid is cooled by the cooler and then pressurized by the circulating pump before being sent to the liquid inlet main pipe for circulation.

3. The atomizing cooling system of claim 1, wherein, The temperature monitoring module is an infrared thermometer, which obtains the temperature distribution of the object to be cooled by infrared temperature measurement technology.

4. The atomizing cooling system of claim 1, wherein, The atomization control module comprises a computer, a signal generator and a power amplifier connected in sequence, the power amplifier is connected to each ultrasonic atomizer through a cable to realize independent control of each ultrasonic atomizer.

Images