Continuous welding device for chip packaging

By designing a continuous welding device for chip packaging, using the injection port and fan to heat the solder paste, the solder melting problem caused by high temperature radiation during the welding process is solved, efficient welding is achieved and welding quality is ensured.

CN119634870APending Publication Date: 2025-03-18安徽钜芯半导体科技股份有限公司
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Patent Information

Application Number
CN202411979381.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

During the welding process of existing chip packaging, high temperature radiation will cause the solder of nearby components to melt, which may cause the components to fall off and affect the solder quality.

Method used

A continuous soldering device for chip packaging is designed to extrude solder paste to the base of the chip body through the spray port, and heat the inside of the protective case with a fan and heating wire to melt the solder paste. At the same time, the pins of the chip body are separated by the second partition to prevent the solder paste from sticking into a short circuit, and the lifting block is isolated through the storage chamber to prevent heat from affecting the solder paste.

Benefits of technology

The solder paste at multiple array feet is realized at the same time, which reduces welding time, improves welding efficiency, and prevents the impact of heat radiation on components, ensuring welding quality.

✦ Generated by Eureka AI based on patent content.
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Abstract

The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging continuous welding device which comprises a machining table, a conveying belt is arranged at the top end of the machining table, a plurality of limiting carrying discs are arranged on the outer side of the conveying belt at equal intervals, PCBs can be placed in the limiting carrying discs, and chip bodies are arranged at the top ends of the PCBs. A machine base is fixed to one side of the top end of the machining table, a lifting assembly is installed in the machine base, a protective shell is arranged below the lifting assembly, air pipes are arranged on the two sides of the protective shell correspondingly, fans are installed in the two air pipes correspondingly, a heating wire is installed in one air pipe, and a lifting block is arranged below the protective shell. A plurality of material spraying openings are formed in the bottom end of the lifting block; soldering paste can be extruded to the pins of the chip body through the material spraying opening, the interior of the protective shell can be heated through the draught fan and the heating wire, the soldering paste at the array pins of the chip body is melted, the soldering paste at the array pins can be melted at the same time in this way, and the time needed by welding is shortened.
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