Wafer test box, wafer test system and wafer test method

Abstract

The invention discloses a wafer test box. The wafer test box comprises a first shell, a second shell, a first fluid interface and a gas supply device, the first shell is provided with a first magnetic piece. The second shell is provided with a second magnetic piece, and the second magnetic piece and the first magnetic piece are correspondingly arranged, so that the first shell and the second shell are tightly combined to form a test space. The first shell comprises a probe card, the second shell carries a wafer, and when the first shell and the second shell are combined, the probe is electrically contacted with a welding pad of the wafer. The first fluid interface is arranged on the first shell or the second shell and used for receiving external gas from the outside to the test space. After the testing space receives external air, the air pressure value in the testing space is larger than the atmospheric pressure. The invention also provides a wafer test system and a wafer test method.

Description

Technical Field

[0001] The invention relates to a wafer test, and in particular to a wafer test box, a wafer test system and a wafer test method capable of suppressing discharge at a probe tip. Background Art

[0002] When the wafer completes the design of the integrated circuit, the wafer needs to undergo a burn-in test and an electrical test. Traditionally, the wafer burn-in and reliability test is performed by testing each wafer separately through a test machine and a probe card. Each wafer is placed on a carrier and electrically contacted with the probe of the probe card to complete the test. Therefore, when the number of wafers is large, more test machines and probe cards are required, and the test process generates greater time and equipment costs.

[0003] In the prior art, in order to improve the efficiency of the burn-in test, a composite test unit system has been developed, which can perform burn-in tests on multiple wafers at the same time. The aforementioned system has multiple test unit arrays in one test device, each wafer is respectively configured in each test unit array, and each test unit has at least one chuck to fix the wafer, and the wafer is connected to the tester for burn-in test or electrical test.

[0004] On the other hand, a wafer test box has been developed recently, which pre-positions the probe card and wafer and places them in the wafer test box. The wafer test box is directly and electrically connected to the test machine, and the wafer test box is placed in the test unit to perform a burn-in test or an electrical test. The upper and lower shells of the existing wafer test box are combined in a snap-on or vacuum manner. The snap-on type has limited effect on the combination and fixation of the upper and lower shells, and there are problems with uneven force and deformation. In addition, during the test process, the probe card is prone to tip discharge due to the high voltage provided for testing, which can easily damage the probe card or the wafer.

[0005] Therefore, how to improve the use effect of the wafer test box through the improvement of the structural design to overcome the above-mentioned defects has become one of the important issues that the industry wants to solve. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a wafer testing box in view of the shortcomings of the prior art, which is characterized by comprising: a first shell having a first magnetic component; a second shell having a second magnetic component, the second magnetic component being arranged corresponding to the first magnetic component so that the first shell and the second shell are tightly combined to form a testing space; wherein the first shell includes a probe card, the second shell carries a wafer, and when the first shell and the second shell are combined, at least one probe is electrically contacted with at least one pad of the wafer; a first fluid interface is arranged on the first shell or the second shell to receive external gas from the outside to the testing space; and a gas supply device having a first fluid flow channel, the first fluid flow channels are respectively connected to the first fluid interface, so that the gas supply device provides external gas to the testing space; wherein, after the testing space receives the external gas, the air pressure value in the testing space is greater than the atmospheric pressure.

[0007] Preferably, the external gas includes an inert gas.

[0008] Preferably, the magnetic attraction between the first magnetic member and the second magnetic member is set according to the air pressure value in the test space.

[0009] Preferably, the magnetic attraction between the first magnetic member and the second magnetic member increases with the increase of the air pressure, so that the needle pressure of the electrical contact between the probe and at least one pad of the wafer remains unchanged.

[0010] Preferably, the first shell is magnetically connected to the test end, and the second shell is magnetically connected to the supporting base.

[0011] Preferably, the wafer test box further comprises a switching device, which is located between the first fluid interface and the gas supply device, and the switching device is used to allow external gas to enter the test space or leak out of the test space through the first fluid flow channel.

[0012] Preferably, the wafer testing box further comprises a second fluid interface, which is arranged on the first shell or the second shell, and the second fluid interface is connected to the gas supply device to allow external gas to enter the testing space or leak out of the testing space.

[0013] Preferably, the gas supply device has a second fluid flow channel connected to the second fluid interface.

[0014] Preferably, the first fluid interface and the second fluid interface are used simultaneously to allow external gas to enter the test space or to escape from the test space; or one of the first fluid interface and the second fluid interface is used to allow external gas to enter the test space, and the other is used to allow external gas to escape from the test space.

[0015] Preferably, after the probe card and the wafer in the wafer testing box complete the testing procedure, the external air escapes and the first shell and the second shell are released from the tightly combined state.

[0016] Preferably, the wafer testing box further comprises a sealing member located between the first shell and the second shell, and the sealing member surrounds the testing space.

[0017] The present invention further proposes a wafer testing system, comprising a wafer testing box, a discharge sensor and an air pressure sensor. The discharge sensor is arranged on one side of the first shell or the second shell, and is used to detect whether a tip discharge occurs at least in one probe. The air pressure sensor is used to detect the air pressure value of the test space of the wafer testing box.

[0018] Preferably, the wafer testing system further comprises a control circuit respectively connected to the discharge sensor and the air pressure sensor.

[0019] The present invention also provides a wafer testing method, including a detection step, a monitoring step and a control step. Detection step: Detecting the air pressure value of the test space in the wafer test box, the wafer test box is executing the test program. Monitoring step: Monitoring whether the probe in the wafer test box has tip discharge. Control step: Maintaining the air pressure value of the test space or enhancing the air pressure value of the test space according to the result of the monitoring step.

[0020] One of the beneficial effects of the present invention is that the wafer test box, wafer test system and wafer test method provided by the present invention can increase the pressure of the injected inert gas by adjusting the magnetic attraction force, especially increase the atmospheric pressure inside the wafer test box to exceed the external air pressure or even several times, thereby effectively and significantly reducing the tip discharge phenomenon in the test procedure, reducing the damage to the probe card or wafer, and reducing the test cost.

[0021] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 4 is a schematic diagram of a wafer testing box according to a first embodiment of the present invention.

[0023] Figure 2 FIG. 4 is another schematic diagram of the wafer testing box according to the first embodiment of the present invention.

[0024] Figure 3 FIG. 4 is a schematic diagram of a wafer testing box according to a second embodiment of the present invention.

[0025] Figure 4 FIG. 4 is a schematic diagram of a wafer testing box according to a third embodiment of the present invention.

[0026] Figure 5 FIG. 4 is a schematic diagram of a wafer testing box according to a fourth embodiment of the present invention.

[0027] Figure 6FIG. 4 is a schematic diagram of a wafer testing box according to a fifth embodiment of the present invention.

[0028] Figure 7 FIG. 4 is a schematic diagram of a wafer testing box according to a sixth embodiment of the present invention.

[0029] Figure 8 FIG. 4 is a schematic diagram of a wafer testing box according to a seventh embodiment of the present invention.

[0030] Fig. 9 It is a schematic diagram of a process of a wafer testing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following is an explanation of the implementation of the "wafer test box" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted in actual size. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0032] See also Figure 1 as well as Figure 2 , Figure 1 FIG. 4 is a schematic diagram of a wafer testing box according to a first embodiment of the present invention. Figure 2 FIG. 4 is another schematic diagram of the wafer testing box according to the first embodiment of the present invention.

[0033] The wafer testing box 1A includes a first housing 11 and a second housing 12. The first housing 11 has a first magnetic member 111, and the second housing 12 has a second magnetic member 121. Figure 1 as well as Figure 2 , the wafer test box 1A of this embodiment is shown from a side view.

[0034] In the present embodiment, the shape of the wafer testing box 1A may be square, circular or other shapes, which may be adjusted according to actual needs and is not limited in the present invention.

[0035] The first magnetic member 111 is disposed around the first housing 11. The second magnetic member 121 is also disposed around the second housing 12. Figure 1 as well as Figure 2As shown, the wafer test box 1A includes at least one set of corresponding first magnetic components 111 and second magnetic components 121. Each set of corresponding first magnetic components 111 and second magnetic components 121 are arranged correspondingly. That is, the position where the first magnetic component 111 is arranged on the first shell 11 corresponds to the position where the second magnetic component 121 is arranged on the second shell 12.

[0036] See also Figure 1 In this embodiment, the wafer test box 1A includes a first fluid interface 11F1. The first fluid interface 11F1 is disposed on the first housing 11 or the second housing 12. The first fluid interface 11F1 is used to receive external gas from the outside to the test space TS.

[0037] The first fluid interface 11F1 is connected to the gas supply device 6. The gas supply device 6 has a first fluid flow channel 61. The first fluid flow channel 61 is connected to the first fluid interface 11F1, so that the gas supply device 6 provides external gas to the test space TS.

[0038] In this embodiment, the external gas is normal air or an inert gas. The inert gas includes nitrogen, helium, neon, argon or krypton, etc. According to some embodiments, the external gas is a mixed inert gas.

[0039] In addition, after the gas supply device 6 injects gas into the test space TS, the pressure of the test space TS will be greater than the external atmospheric pressure.

[0040] Since the gas supply device 6 injects gas into the test space TS, the internal pressure of the test space TS will be greater than the external pressure. Therefore, the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 is set according to the air pressure value in the test space TS. That is, when one of the first magnetic component 111 and the second magnetic component 121 is a permanent magnet, the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 will predetermine the strength of the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 according to the expected air pressure in the test space TS.

[0041] When one of the first magnetic component 111 and the second magnetic component 121 is a non-permanent magnet, the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 can be enhanced as the air pressure value in the test space TS increases. In other words, the air pressure value in the test space TS can be adjusted according to actual needs. Correspondingly, the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 can also be flexibly adjusted.

[0042] In this embodiment, the first housing 11 is magnetically connected to the test terminal T1 using the electrical connection port 118 , and the second housing 12 is magnetically connected to the supporting base SB.

[0043] Furthermore, in this embodiment, the wafer test box 1A only includes a first fluid interface 11F1. The external gas provided by the gas supply device 6 is only injected, and there is no other exhaust pipe. Therefore, when the first shell 11 and the second shell 12 are separated, the air pressure will be naturally released, and the injected external gas will naturally dissipate.

[0044] The present invention also proposes a wafer test system, including a wafer test box 1A and an air pressure sensor 18, wherein the air pressure sensor 18 is used to detect the air pressure in the wafer test box 1A (test space TS). The wafer test system also includes a discharge sensor 17. The discharge sensor is used to monitor whether the probe 1121 in the wafer test box 1A has a tip discharge. According to some embodiments, the air pressure sensor 18 detects the current air pressure value of the test space TS. The discharge sensor 17 monitors whether the probe has a tip discharge. If there is no tip discharge, the system maintains the current air pressure value of the test space TS. If a tip discharge occurs, the system controls the wafer test box 1A to inject external gas into the test space TS, and the pressure value inside the test space TS can suppress the discharge of the probe tip. According to some other embodiments, the magnetic attraction between the first shell 11 and the second shell 12 is increased, and the pressure value in the test space TS is further increased to improve the discharge of the probe tip. In some embodiments, the wafer test system also includes a control circuit, which is respectively connected to the discharge sensor and the air pressure sensor. When the probe tip discharge occurs, the control circuit can calculate the pressure value required to suppress the tip discharge, and inject external gas into the test space TS so that the pressure value of the test space TS reaches the calculated pressure value. This is further described below.

[0045] In this embodiment, the discharge sensor 17 may be a light sensor, which may transmit monitoring image information or monitoring signals to an analysis circuit (not shown) for analysis. The analysis circuit (not shown) may analyze the conditions, probability, and other big data of tip discharge by monitoring the image information or monitoring signals to analyze the pressure and properties of the injected inert gas, the test procedure of the wafer test box 1A, and the voltage of the probe in the preheating procedure.

[0046] Furthermore, the user or manufacturer can design the magnitude of the magnetic attraction between the first magnetic member 111 and the second magnetic member 121 according to actual needs to withstand the air pressure of the wafer test box 1A, such as the location of the first magnetic member 111 and the second magnetic member 121, or the material selection of the first magnetic member 111 and the second magnetic member 121, or the number of the first magnetic member 111 and the second magnetic member 121, or when the first magnetic member 111 and the second magnetic member 121 are electromagnets, the strength of the magnetic force can be adjusted.

[0047] The present invention can inject inert gas or nitrogen into the wafer test box 1A to make the pressure inside the wafer test box 1A higher than the pressure of the external environment, thereby suppressing the occurrence of corona discharge.

[0048] See also Figure 1 as well as Figure 2 , the first magnetic component 111 and the second magnetic component 121 are respectively arranged in the first shell 11 and the second shell 12. The first shell 11 includes a first convex structure 11F extending downward. Similarly, the second shell 12 also includes a second convex structure 12F extending upward. In this embodiment, the first magnetic component 111 is arranged in the first convex structure 11F. The second magnetic component 121 is arranged in the second convex structure 12F.

[0049] The first convex structure 11F and the second convex structure 12F are arranged correspondingly. When the first shell 11 and the second shell 12 are tightly combined through the first magnetic member 111 and the second magnetic member 121 , the first convex structure 11F will be tightly combined with the second convex structure 12F.

[0050] A seal 16 is provided between the first convex structure 11F and the second convex structure 12F of the wafer test box 1A. The seal may be an O-ring. The seal 16 is used to strengthen the airtightness after the first shell 11 and the second shell 12 are combined. The seal 16 may be provided around the test space TS, and define the test space TS with the first shell 11 and the second shell 12. In some embodiments, the seal 16 may be provided on the first convex structure 11F or on the second convex structure 12F, which may be adjusted according to actual needs and is not limited in the present invention. When the first shell 11 and the second shell 12 are tightly combined through the first magnetic component 111 and the second magnetic component 121, the first convex structure 11F of the first shell 11 and the second convex structure 12F of the second shell 12 are tightly combined through the seal.

[0051] Furthermore, Figure 1 In the illustrated embodiment, a probe card 112 is further disposed in the first housing 11. The probe card 112 includes one or more probes 1121. When the first housing 11 and the second housing 12 are combined, one or more probes 1121 will protrude toward the second housing 12. Further, in this embodiment, a wafer 13 is further disposed in the wafer test box 1A, and the second housing 12 carries the wafer 13. When the first housing 11 and the second housing 12 are combined, one or more probes 1121 will protrude toward the second housing, so that the probes 1121 abut against the pads (test contact points) of the wafer 13 for electrical contact.

[0052] The present application does not limit the first magnetic member 111 and the second magnetic member 121 to face each other. If the two can generate magnetic attraction to combine and fix the first shell 11 and the second shell 12, it is within the scope of protection of the present application. According to some embodiments, one of the first magnetic member 111 and the second magnetic member 121 is a non-permanent magnet, such as an electromagnet, and the other is a permanent magnet or a non-magnetic magnetic conductive object, such as a magnetic conductive object such as iron, cobalt or nickel.

[0053] In this embodiment, there may be multiple first magnetic components 111 and multiple second magnetic components 121 . The number of first magnetic components 111 is the same as the number of second magnetic components 121 . The present invention does not limit the number of first magnetic components 111 and second magnetic components 121 .

[0054] See also Figure 3 , Figure 3 FIG. 4 is a schematic diagram of a wafer testing box according to a second embodiment of the present invention.

[0055] The wafer test box 1B is similar to the wafer test box 1A of the first embodiment. The difference is that the gas supply device 6 also includes a switching device 62, which is connected and arranged between the gas supply device 6 and the first fluid interface 11F1. In this embodiment, the switching device 62 is a switching device for gas supply / pressure relief, which is a two-way valve. When the gas supply device 6 provides external gas, the switching device 62 (two-way valve) is switched to the forward direction (only in and not out). When the test space TS is depressurized (releasing the gas in the space), the switching device 62 (two-way valve) is switched to the reverse direction (only out and not in). Therefore, the test space TS and the gas supply device 6 can be switched in direction by the switching device 62, so as to achieve the function of using the gas supply device 6 to supply external gas to increase the atmospheric pressure, or to use the switching device 62 for pressure relief. In this embodiment, the switching device 62 is connected to the control circuit (not shown) to switch the direction through the control circuit (not shown).

[0056] According to some embodiments, there are a plurality of first fluid interfaces 11F1 (more than two), and the fluid channel connected to at least one of them is connected to the aforementioned switching device 62 (eg, a two-way valve). The operation of the two-way valve 62 is as described above.

[0057] See also Figure 4 , Figure 41 is a schematic diagram of a wafer test box according to a third embodiment of the present invention. The wafer test box 1C is similar to the wafer test box 1A according to the first embodiment. The main difference is that the wafer test box 1C includes a plurality of first fluid interfaces 11F1. The plurality of first fluid interfaces 11F1 are respectively arranged on the first shell 11 or the second shell 12. Although the number of the first fluid interfaces 11F1 is more than two, the external gas provided by the gas supply device 6 is the same as the test space TS of the wafer test box 1A according to the first embodiment, and both are only inlet (injected) but not outlet (not discharged from the first fluid interface 11F1).

[0058] See also Figure 5 , Figure 5 FIG. 4 is a schematic diagram of a wafer testing box according to a fourth embodiment of the present invention.

[0059] The wafer testing box 1D is similar to the wafer testing box 1B of the first embodiment, except that the wafer testing box 1D includes a plurality of first fluid interfaces 11F1 , which are connected to the gas supply device 6 via a switching device 62 .

[0060] Similarly, in the present embodiment, the switching device 62 is a switching device for gas supply / pressure relief, and is a two-way valve. In one embodiment, the switching device 62 is connected to one of the first fluid interfaces 11F1, and when the gas supply device 6 provides external gas, the switching device 62 (two-way valve) is switched to the forward direction (in only, not out). When the test space TS is being depressurized (releasing the gas in the space), the switching device 62 (two-way valve) is switched to the reverse direction (out only, not in). Therefore, the test space TS and the gas supply device 6 can be switched between the directions of the switching device 62, so as to achieve the function of using the gas supply device 6 to supply external gas to increase the atmospheric pressure, or using the gas supply device 6 for pressure relief.

[0061] Similarly, the switching device 62 is connected to a control circuit (not shown) to switch the direction through the control circuit (not shown).

[0062] In addition, in this embodiment, the first magnetic member 111 and the second magnetic member 121 are permanent magnets or non-magnetic magnetic conductive objects, so the magnetic barrier assembly 19A can be a magnetic shielding assembly, which is movably disposed in the second housing 12. The magnetic barrier assembly 19A of this embodiment can also be applied to the wafer test boxes 1A-1C of the previous embodiments.

[0063] See also Figure 6 , Figure 6 FIG. 4 is a schematic diagram of a wafer testing box according to a fifth embodiment of the present invention.

[0064] The wafer testing box 1E of this embodiment is similar to the wafer testing box 1A of the first embodiment, and the main difference is that the wafer testing box 1E includes a first fluid interface 11F1 and a second fluid interface 11F2 .

[0065] The first fluid interface 11F1 is connected to the gas supply device 6 to inject the gas provided by the gas supply device 6 into the test space TS of the wafer test box 1E. The second fluid interface 11F2 is used to depressurize the test space TS to release the gas in the test space TS.

[0066] In addition, in this embodiment, the first magnetic member 111 and the second magnetic member 121 are non-permanent magnets, so the magnetic barrier assembly 19B is a control circuit that can adjust the magnetic attraction of the first magnetic member 111 and the second magnetic member 121. The magnetic barrier assembly 19B of this embodiment can also be applied to the wafer test boxes 1A-1C of the previous embodiments.

[0067] See also Figure 7 , Figure 7 FIG. 4 is a schematic diagram of a wafer testing box according to a sixth embodiment of the present invention.

[0068] The wafer test box 1F is similar to the wafer test box 1E, the main difference being that the first fluid interface 11F1 is connected to the gas supply device 6 via the first one-way switching device 63 , and the second fluid interface 11F2 is connected to the gas containing device 7 via the second one-way switching device 73 .

[0069] When the gas supply device 6 provides external gas, the first one-way switching device 63 (one-way valve) is open, that is, only the gas supply device 6 can provide external gas to the test space TS of the wafer test box 1E. At this time, the second one-way switching device 64 (one-way valve) is closed.

[0070] When the test space TS is depressurized (gas in the release space), the first one-way switching device 63 (one-way valve) is closed and the second one-way switching device 64 is opened. At this time, the gas in the test space TS can be released into the gas containing device 7.

[0071] See also Figure 8 , Figure 8 FIG. 4 is a schematic diagram of a wafer testing box according to a seventh embodiment of the present invention.

[0072] The wafer test box 1G is similar to the wafer test box 1E, the main difference being that the first fluid interface 11F1 is connected to the gas supply device 6 via the first one-way switching device 63 , and the second fluid interface 11F2 is connected to the gas supply device 6 via the second one-way switching device 64 .

[0073] When the gas supply device 6 provides external gas, the first one-way switching device 63 (one-way valve) is open, that is, only the gas supply device 6 can provide external gas to the test space TS of the wafer test box 1E. At this time, the second one-way switching device 64 (one-way valve) is closed.

[0074] When the test space TS is depressurized (gas in the space is released), the first one-way switching device 63 (one-way valve) is closed and the second one-way switching device 64 is opened. At this time, the gas in the test space TS can be released into the gas supply device 6.

[0075] It should be noted that the present invention does not limit the number of the first fluid interface and the second fluid interface, and the positions where the first fluid interface and the second fluid interface are respectively distributed. The embodiments of the present invention are only for illustration and are not technical limitations.

[0076] See also Fig. 9 , Fig. 9 1 is a flow chart of a wafer testing method according to an embodiment of the present invention. The wafer testing method 100 includes a detection step S1, a monitoring step S2 and a control step S3. Detection step S1: Detecting the air pressure value of the test space in the wafer test box, while the wafer test box is executing a test procedure. Monitoring step S2: Monitoring whether the probe in the wafer test box has tip discharge. Control step S3: Maintaining the air pressure value of the test space or enhancing the air pressure value of the test space according to the result of the monitoring step.

[0077] Since the wafer test box executes the test procedure, when testing at a high voltage, it is easy for the probes to generate tip discharge. Therefore, the detection step S1, the monitoring step S2 and the control step S3 are used to solve the problem of tip discharge of the probe. Specifically, when testing at a high voltage, in order to avoid the occurrence of tip discharge, the present invention introduces gas into the test space to increase the air pressure in the test space to suppress tip discharge; when it is detected that the probe still has tip discharge, it means that the pressure value of the test space in the wafer test box is not large enough. Therefore, by pressurizing (such as the aforementioned injection of external gas to enhance the pressure value of the test space), the tip discharge of the probe is further suppressed. If it is detected that the probe does not have tip discharge, it means that the pressure value in the test space is suitable for the current probe to detect the voltage of the wafer, and the pressure in the test space is maintained at this time. According to some embodiments, the wafer test box, such as the wafer test box of the first embodiment, when the probe is detected to have tip discharge, can also enhance the magnetic attraction of the first shell and the second shell, and further increase the pressure value in the test space.

[0078] [Beneficial Effects of Embodiments]

[0079] One of the beneficial effects of the present invention is that the wafer test box, wafer test system and wafer test method provided by the present invention can increase the pressure of the injected inert gas by adjusting the magnetic attraction force, especially increase the atmospheric pressure inside the wafer test box to exceed the external air pressure or even several times, thereby effectively and significantly reducing the tip discharge phenomenon in the test procedure, reducing the probe damage of the probe card, and reducing the test cost.

[0080] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the claims of the present invention.

Claims

1. A wafer testing box, characterized in that: include: A first housing having a first magnetic member; A second shell has a second magnetic component, wherein the second magnetic component is arranged corresponding to the first magnetic component so that the first shell and the second shell are tightly combined to form a test space; The first housing includes a probe card, the probe card includes at least one probe, the second housing carries a wafer, and when the first housing and the second housing are combined, the at least one probe is in electrical contact with at least one pad of the wafer; A first fluid interface, disposed on the first shell or the second shell, for receiving external gas into the test space; as well as A gas supply device having a first fluid flow channel, wherein the first fluid flow channel is connected to the first fluid interface, so that the gas supply device provides the external gas to the test space; Wherein, after the test space receives the external gas, the air pressure value in the test space is greater than the atmospheric pressure outside the wafer test box.

2. The wafer testing box according to claim 1, characterized in that: The external gas includes an inert gas.

3. The wafer testing box according to claim 1, characterized in that: The magnetic attraction between the first magnetic component and the second magnetic component is set according to the air pressure value in the test space.

4. The wafer testing box as claimed in claim 3, characterized in that: The magnetic attraction between the first magnetic member and the second magnetic member increases as the air pressure value increases, so that the needle pressure of the electrical contact between the at least one probe and the at least one bonding pad of the wafer remains unchanged.

5. The wafer testing box according to claim 1, characterized in that: The first shell is magnetically connected to the test end, and the second shell is magnetically connected to the supporting seat.

6. The wafer testing box according to claim 1, characterized in that: The wafer test box further comprises a switching device, which is located between the first fluid interface and the gas supply device, and the switching device is used to allow the external gas to enter the test space or leak out of the test space through the first fluid flow channel.

7. The wafer testing box according to claim 1, characterized in that: It also includes a second fluid interface, which is arranged on the first shell or the second shell, and is connected to the gas supply device to allow the external gas to enter the test space or leak out of the test space.

8. The wafer testing box according to claim 7, characterized in that: The gas supply device has a second fluid flow channel, and the second fluid flow channel is connected to the second fluid interface.

9. The wafer testing box according to claim 7, characterized in that: The first fluid interface and the second fluid interface are simultaneously used to allow the external gas to enter the test space or leak out of the test space; or one of the first fluid interface and the second fluid interface is used to allow the external gas to enter the test space, and the other is used to allow the external gas to leak out of the test space.

10. The wafer testing box according to claim 1, wherein: When the probe card and the wafer in the wafer testing box complete the testing procedure, the external gas escapes, and the first shell and the second shell release the tightly combined state.

11. The wafer testing box according to claim 1, wherein: The wafer testing box further comprises a sealing member located between the first shell and the second shell, wherein the sealing member surrounds the testing space.

12. A wafer testing system, characterized in that: The wafer testing system comprises: The wafer testing box according to claim 1; a discharge sensor, disposed on one side of the first shell or the second shell, the discharge sensor being used to detect whether the at least one probe has tip discharge; and An air pressure sensor is used to detect the air pressure value of the test space.

13. The wafer testing system according to claim 12, wherein: The wafer testing system also includes a control circuit, which is connected to the discharge sensor and the air pressure sensor respectively.

14. A wafer testing method, characterized in that: The wafer testing method comprises: A detection step, detecting the air pressure value of the test space in the wafer test box, wherein the wafer test box is executing a test procedure; A monitoring step, monitoring whether a probe in the wafer test box has tip discharge; and A control step is performed to maintain the air pressure value of the test space or to increase the air pressure value of the test space according to the result of the monitoring step.

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