Fan-out packaging integrated heat dissipation structure

Abstract

The invention discloses a fan-out packaging integrated heat dissipation structure, and relates to the technical field of semiconductor packaging. The structure comprises at least one chip which is arranged in a mold; the rewiring layer is arranged below the chip and the molding; the solder ball is arranged below the rewiring layer; a first thermal interface layer disposed on the top of the mold; and the integrated radiator is arranged on the first thermal interface layer. According to the fan-out type package integrated heat dissipation structure provided by the invention, the integrated radiator is directly attached to the fan-out type package to enhance heat dissipation of the top passage, so that the requirements of increased power density and heat flux density on heat dissipation performance are met. Molding of the structure can protect the chip, control warping and play a role in supporting the integrated radiator.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, in particular to the field of semiconductor packaging technology, and specifically to a fan-out type package integrated heat dissipation structure. Background Art

[0002] As an emerging and competitive technology, fan-out packaging in the existing technology can meet the requirements of small form factor, high-density integration and high-performance computing for advanced applications in the fields of mobile, 5G and artificial intelligence. Fan-out packaging also provides high packaging flexibility for heterogeneous heterogeneous integration. With the emergence of many technologies such as eWLB (embedded Wafer Level Ball Grid Array) and InFO (Integrated Fan-Out), fan-out packaging has developed rapidly. Compared with other packaging technologies, fan-out packaging has the advantages of small size and good heat dissipation performance because it eliminates the packaging substrate.

[0003] In the fan-out packaging structure of the prior art, heat is mainly dissipated from the bottom heat dissipation path, that is, from the chip to the PCB (Printed Circuit Board), and then diffused from the PCB to the air. It is difficult to diffuse from the top heat dissipation path with higher thermal resistance. With the continuous improvement of chip performance requirements, chip power consumption continues to increase, and the heat dissipation of fan-out packaging increases. Due to the lack of a low thermal resistance heat dissipation path, it is difficult for heat to dissipate from the fan-out package, which will cause the chip to be at a higher operating temperature, damaging system performance and component reliability. Therefore, in the case of high heat flow, thermal management of fan-out packaging becomes a severe challenge, and it becomes extremely important to provide an optimization solution for enhanced heat dissipation. Summary of the invention

[0004] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0005] The inventors found that in the existing fan-out packaging structure, heat is mainly dissipated from the bottom heat dissipation path, that is, from the chip to the PCB (printed circuit board), and then diffused from the PCB to the air, and it is difficult to dissipate from the top heat dissipation path with higher thermal resistance. As the requirements for chip performance continue to increase, chip power consumption continues to increase, and fan-out packaging heat dissipation increases. Due to the lack of a heat dissipation path with lower thermal resistance, it is difficult for heat to fan out from the fan-out package, which will cause the chip to be at a higher operating temperature, damaging system performance and component reliability.

[0006] In order to solve at least one of the above-mentioned problems existing in the prior art, an embodiment of the present application provides a fan-out package integrated heat dissipation structure.

[0007] According to an embodiment of the present application, the present application provides a fan-out package integrated heat dissipation structure, which includes:

[0008] A chip is disposed in the mold, wherein the chip is at least one;

[0009] a redistribution layer disposed below the chip and the molding;

[0010] Solder balls are disposed under the redistribution layer;

[0011] a first thermal interface layer disposed on the molding top;

[0012] The integrated heat sink is arranged on the first thermal interface layer.

[0013] In some embodiments of the present application, the molding material type is epoxy molding compound.

[0014] In some embodiments of the present application, the molding top has an overmold, and the first thermal interface layer is disposed on the overmold.

[0015] In some embodiments of the present application, the molding is used to protect the chip, control warpage, and support the integrated heat sink.

[0016] In some embodiments of the present application, a fan-out package integrated heat dissipation structure further includes:

[0017] A heat spreader is disposed between the first thermal interface layer and the integrated heat sink.

[0018] In some embodiments of the present application, a fan-out package integrated heat dissipation structure further includes:

[0019] The second thermal interface layer is arranged between the heat spreader and the integrated heat sink.

[0020] In some embodiments of the present application, the fan-out package integrated heat dissipation structure is used to diffuse the heat of the chip laterally, vertically, and perform thermal isolation.

[0021] In some embodiments of the present application, the integrated heat sink is provided with at least one flow channel.

[0022] In some embodiments of the present application, gas or liquid is disposed in the flow channel.

[0023] In some embodiments of the present application, a molding through hole is provided in the molding.

[0024] From the above description, it can be seen that an embodiment of the present invention provides a fan-out package integrated heat dissipation structure, and the corresponding fan-out package integrated heat dissipation structure includes: a chip, arranged in a molding, at least one chip; a rewiring layer, arranged below the chip and the molding; a solder ball, arranged under the rewiring layer; a first thermal interface layer, arranged on the top of the molding; and an integrated heat sink, arranged on the first thermal interface layer.

[0025] In summary, the embodiment of the present invention proposes a novel fan-out package integrated heat dissipation structure. In this structure, the integrated heat sink is directly attached to the fan-out package to enhance the heat dissipation of the top channel to meet the requirements of increased power density and heat flux density for heat dissipation performance. The molding of this structure can protect the chip, control warpage, and also play a role in supporting the integrated heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0027] Figure 1 A schematic diagram of a fan-out package integrated heat dissipation structure according to an embodiment of the present application.

[0028] Figure 2 This is a second schematic diagram of the fan-out package integrated heat dissipation structure according to an embodiment of the present application.

[0029] Figure 3 This is a third schematic diagram of the fan-out package integrated heat dissipation structure according to an embodiment of the present application.

[0030] Figure 4 This is a fourth schematic diagram of the fan-out package integrated heat dissipation structure of an embodiment of the present application.

[0031] Reference numerals:

[0032] 1: Integrated heat sink;

[0033] 2: first thermal interface layer;

[0034] 3: Overmolding;

[0035] 4: Molding;

[0036] 5: Chip;

[0037] 6: Rewiring layer;

[0038] 7: Solder ball;

[0039] 8: second thermal interface layer;

[0040] 9: Vacuum chamber;

[0041] 10: Molded through holes. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that the terms "including" and "having" in the specification and claims of the present application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. In the absence of conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0044] In order to solve at least one of the above problems existing in the prior art, in a first aspect, an embodiment of the present application provides a fan-out package integrated heat dissipation structure. Figure 1 As shown, the fan-out package integrated heat dissipation structure includes:

[0045] A chip 5 is disposed in the mold 4, and there is at least one chip 5;

[0046] A redistribution layer 6-RDL (Redistribution Layer), disposed below the chip 5 and the molding 4;

[0047] Solder ball 7-Solder Ball, arranged under the rewiring layer 6;

[0048] The first thermal interface layer 2-TIM1 (Thermal Interface Material), is arranged on the top of the molding 4;

[0049] The integrated heat sink 1 -Heatsink is arranged on the first thermal interface layer 2 .

[0050] exist Figure 1 In the structure shown, the integrated heat sink is directly attached to the fan-out package to enhance the heat dissipation of the top heat dissipation path, which can meet the requirements of increased power density and heat flux density for heat dissipation performance. There are one or more chips (core particles) in the molded package. The molded EMC (made of epoxy molding compound) after wafer-level or panel-level molding has good mechanical strength, excellent adhesion, outstanding electrical insulation, flat surface and low water absorption, which can protect the chip and control warping, and can support the integrated heat sink. At the same time, due to different material properties, it can also play a role in enhancing heat dissipation or thermal isolation.

[0051] In some embodiments of the present invention, the molding material type is epoxy molding compound.

[0052] In some embodiments of the present invention, see Figure 2 The mold 4 has good mechanical strength after the wafer-level or panel-level molding process, so the reinforcement ring can be removed in this structure. In this structure, in order to achieve better heat dissipation, the over-molded part on the back of the chip is removed. The first thermal interface layer-TIM1 is directly used between the chip and the integrated heat sink, thereby greatly reducing the thermal resistance.

[0053] In some embodiments of the present invention, see Figure 2 The molding top has an overmold 3 , and the first thermal interface layer 2 is disposed on the overmold 3 .

[0054] In some embodiments of the present invention, the molding is used to protect the chip, control warpage, and support the integrated heat sink.

[0055] In some embodiments of the present invention, see Figure 3 , a fan-out package integrated heat dissipation structure, further comprising:

[0056] A heat spreader 9 is disposed between the first thermal interface layer 2 and the integrated heat sink 1 ; a second thermal interface layer 8 - TIM2 is disposed between the heat spreader 9 and the integrated heat sink 1 .

[0057] In some embodiments of the present invention, Figure 3The fan-out package integrated heat dissipation structure shown is used to diffuse the heat of the chip laterally and vertically. Specifically, a layer of heat spreader can be added between the integrated heat sink and the first thermal interface layer. Since the heat spreader has a high thermal conductivity and a small diffusion thermal resistance, it is convenient for heat to diffuse rapidly laterally and vertically, so the heat dissipation space outside the package can be fully utilized. A second thermal interface layer is used between the heat spreader and the integrated heat sink to reduce the interface thermal resistance. This structure is expected to be used in HPC, AI and other fields.

[0058] In some embodiments of the present invention, the integrated heat sink is provided with at least one flow channel.

[0059] In some embodiments of the present invention, gas or liquid is arranged in the flow channel. The above-mentioned integrated heat sink can be prepared with different flow channels, and can use fluid working media such as air and liquid for heat dissipation, among which liquid working media has better heat exchange performance.

[0060] In some embodiments of the present invention, see Figure 4 A molded through hole 10-TMV can be set inside the mold, and the inside can be filled with metal, such as copper, to better diffuse the heat of the chip. A material with low thermal conductivity or good thermal isolation performance can be set inside to play a thermal isolation role.

[0061] From the above description, it can be seen that an embodiment of the present invention provides a fan-out package integrated heat dissipation structure, including: a chip, arranged in a mold, at least one chip; a rewiring layer, arranged below the chip and the mold, and the size of the rewiring layer is larger than the size of the chip; a solder ball, arranged under the rewiring layer; a first thermal interface layer, arranged on the top of the mold; an integrated heat sink, arranged on the first thermal interface layer.

[0062] The embodiment of the present invention proposes a novel fan-out package integrated heat dissipation structure. First, in this structure, the integrated heat sink is directly attached to the fan-out package to enhance the heat dissipation of the top heat dissipation path to meet the requirements of increased power density and heat flux density for heat dissipation performance. The molding of this structure can protect the chip, control warping, and also play a role in supporting the integrated heat sink.

[0063] In addition, in a preferred embodiment, the molding on the back of the chip can be removed to achieve better heat dissipation. The integrated heat sink can use fluids such as air and liquid to dissipate heat, among which the liquid has better heat exchange performance. A heat spreader can be further added between the integrated heat sink and the first thermal interface layer. The heat spreader has a small diffusion thermal resistance, which facilitates rapid lateral and longitudinal diffusion of heat, and is expected to be used in fields such as HPC.

[0064] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0065] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0066] The descriptions with reference to the terms "one embodiment", "a specific embodiment", "some embodiments", "for example", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. The order of steps involved in each embodiment is used to schematically illustrate the implementation of the present invention, and the order of steps therein is not limited and may be appropriately adjusted as needed.

[0067] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0068] Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. In the description of this specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of this specification. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, in the absence of contradiction, a person skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0069] The above is only an example of the embodiment of the present specification and is not intended to limit the embodiment of the present specification. For those skilled in the art, the embodiment of the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiment of the present specification shall be included in the scope of the claims of the embodiment of the present specification.

Claims

1. A fan-out package integrated heat dissipation structure, characterized in that: include: A chip is disposed in the mold, wherein the chip is at least one; a redistribution layer disposed below the chip and the molding; Solder balls are disposed under the redistribution layer; a first thermal interface layer disposed on the molding top; The integrated heat sink is arranged on the first thermal interface layer.

2. The fan-out package integrated heat dissipation structure according to claim 1, characterized in that: The molding material type is epoxy molding compound.

3. The fan-out package integrated heat dissipation structure according to claim 1, characterized in that: The molded top has an overmold, and the first thermal interface layer is disposed on the overmold.

4. The fan-out package integrated heat dissipation structure according to claim 1, characterized in that: The molding is used to protect the chip, control warpage, and support the integrated heat sink.

5. The fan-out package integrated heat dissipation structure according to any one of claims 2 or 3, characterized in that: Also includes: A heat spreader is disposed between the first thermal interface layer and the integrated heat sink.

6. The fan-out package integrated heat dissipation structure according to claim 5, characterized in that: Also includes: The second thermal interface layer is arranged between the heat spreader and the integrated heat sink.

7. The fan-out package integrated heat dissipation structure according to claim 6, characterized in that: The fan-out package integrated heat dissipation structure is used to diffuse the heat of the chip laterally, vertically and thermally isolate the heat.

8. The fan-out package integrated heat dissipation structure according to claim 1, characterized in that: The integrated heat sink is provided with at least one flow channel.

9. The fan-out package integrated heat dissipation structure according to claim 8, characterized in that: Gas or liquid is arranged in the flow channel.

10. The fan-out package integrated heat dissipation structure according to claim 1, characterized in that: A molding through hole is provided in the molding.

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