Photoelectric coupler testing device and testing method

Abstract

The invention provides a photoelectric coupler testing device, and the device comprises a socket which is used for connecting a to-be-tested photoelectric coupler; the plurality of test switches are connected to different poles of the photoelectric coupler to be tested and are used for controlling the on-off of current of each pole of the photoelectric coupler to be tested so as to test the switching characteristics of the photoelectric coupler to be tested; the testing switches are respectively connected to different poles of the photoelectric coupler to be tested, and the on-off state of current of each pole of the photoelectric coupler to be tested is accurately controlled by controlling the on-off of the testing switches, so that the testing accuracy of the photoelectric coupler to be tested is improved. Changes of input and output current signals of the photoelectric coupler are monitored through an external test system, and a time difference from input signal change to output signal response is recorded, so that the switching time of the photoelectric coupler is accurately measured.

Description

Technical Field

[0001] The present application relates to the technical field of testing equipment, and in particular to a photoelectric coupler testing device and a testing method. Background Art

[0002] Photocouplers are electrical components based on the principle of optical interaction, and are widely used in electronic circuits for signal isolation, reception, transmission, and control. The time parameters of photocouplers, especially the switching time, are key indicators of photocouplers, and have a direct impact on the response speed and transmission quality of the circuit. Current test devices can only test the input characteristics, output characteristics, and transmission characteristics of photocouplers, but cannot test the switching characteristics of photocouplers. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a photoelectric coupler testing device and a testing method to solve the problem that the existing testing device cannot test the switching characteristics of the photoelectric coupler.

[0004] Based on the above purpose, the present application provides a photoelectric coupler testing device, comprising:

[0005] A socket for connecting the photocoupler to be tested;

[0006] A plurality of test switches, each of which is connected to a different pole of the photoelectric coupler to be tested, for controlling the on-off of the current at each pole of the photoelectric coupler to be tested, so as to test the switch characteristics of the photoelectric coupler to be tested;

[0007] The mounting base is used for mounting the socket and the test switch.

[0008] Optionally, it also includes a test motherboard and a test daughterboard installed on the mounting seat, the test motherboard is used to install the test switch; the test daughterboard is used to install the socket.

[0009] Optionally, a mounting groove is opened downwardly on the upper surface of the mounting seat, the test mother board is located in the mounting groove, and the lower surface of the test daughter board is connected to the upper surface of the mounting seat.

[0010] Optionally, a positioning groove communicating with the mounting groove is downwardly opened on the upper surface of the mounting seat, and a positioning point plugged into the positioning groove is provided on the test motherboard.

[0011] Optionally, the mounting base is also provided with an external interface connected to the test motherboard for connecting to an external test system to power the test switch. The lower surface of the test motherboard is connected to a banana plug for connecting to an external test system to power the photoelectric coupler to be tested and transmit signals.

[0012] Optionally, the test sub-board is provided with a pin header, the pin header is electrically connected to the socket, the test mother board is provided with a pin header seat, the pin header seat is electrically connected to the relay switch, and the pin header is plugged into the pin header seat.

[0013] Optionally, the test switch is a relay switch, the first pole of the photoelectric coupler to be tested is connected to a first relay switch, the second pole of the photoelectric coupler to be tested is connected to a second relay switch, and the third pole of the photoelectric coupler to be tested is connected to a third relay switch.

[0014] Optionally, the relay switches are arranged in multiple groups to test multiple groups of photoelectric couplers to be tested.

[0015] Based on the same inventive concept, the present disclosure also provides a photoelectric coupler testing method, which is applied to the above-mentioned testing device and includes the following steps:

[0016] Connect the photocoupler to be tested to the test switch through the socket;

[0017] The test switch controls the on and off of the current of each pole of the photoelectric coupler to be tested, and obtains the switch characteristic information of the photoelectric coupler to be tested according to the output current information of the photoelectric coupler to be tested.

[0018] As can be seen from the above description, the photoelectric coupler testing device provided by the present application includes a socket, a plurality of test switches and a mounting seat, the socket is used to connect the photoelectric coupler to be tested, the mounting seat is used to install the socket and the test switch, these test switches are respectively connected to different poles of the photoelectric coupler to be tested, and by controlling the on-off state of these test switches, the on-off state of the current at each pole of the photoelectric coupler to be tested is accurately controlled, and the changes of the input and output current signals of the photoelectric coupler are monitored by an external test system, and the time difference from the input signal change to the output signal response is recorded, so as to accurately measure the switching time of the photoelectric coupler. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a schematic diagram of the structure of the test device of the embodiment of the present application;

[0021] Figure 2 A circuit diagram of a photoelectric coupler according to an embodiment of the present application;

[0022] Figure 3A schematic diagram of a relay switch according to an embodiment of the present application;

[0023] Figure 4 This is a flow chart of the testing method of the embodiment of the present application.

[0024] Figure numerals: 1. socket; 2. test switch; 3. mounting seat; 31. mounting slot; 32. external interface; 4. test motherboard; 41. pin header; 5. test daughter board. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0026] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] Based on the background, optocoupler, as an electrical component based on the principle of optical interaction, is based on the use of optical signals to isolate and transmit between input and output circuits. This feature makes optocouplers widely used in electronic circuits for signal isolation, reception, transmission and control, providing a strong guarantee for the stability and safety of the circuit.

[0028] Regarding the time parameters of the optocoupler, especially the switching time, it is one of the key indicators to measure its performance. The switching time directly determines the response speed and transmission quality of the optocoupler in the circuit. Specifically, the switching time includes pulse rise time, pulse fall time, fall transmission delay time and rise transmission delay time. These time parameters reflect the time delay of the optocoupler from receiving the input signal to generating the corresponding output signal. For high-speed circuits, these delays may affect the performance of the entire system.

[0029] However, the test devices currently available on the market can only test the input characteristics, output characteristics and transmission characteristics of the optocoupler, but cannot directly test its switching characteristics.

[0030] The following is combined with Figure 1-4 The embodiments of the present application will be described in detail.

[0031] like Figure 1 As shown, a photoelectric coupler testing device comprises:

[0032] Socket 1, used to connect the photocoupler to be tested;

[0033] A plurality of test switches 2, each of which is connected to a different pole of the photoelectric coupler to be tested, and is used to control the on-off of the current at each pole of the photoelectric coupler to be tested, so as to test the switching characteristics of the photoelectric coupler to be tested;

[0034] The mounting base 3 is used to mount the socket 1 and the test switch 2 .

[0035] Specifically, the socket 1 is a universal socket 1 to be compatible with photoelectric couplers of various models and specifications, and the socket 1 may be provided with multiple groups of plug interfaces to simultaneously plug in multiple photoelectric couplers to implement sequential testing of multiple photoelectric couplers.

[0036] In this embodiment, the photocoupler test device includes a socket 1, a plurality of test switches 2 and a mounting seat 3. The socket 1 is used to connect the photocoupler to be tested, and the mounting seat 3 is used to install the socket 1 and the test switch 2. These test switches 2 are respectively connected to different poles of the photocoupler to be tested. By controlling the on-off state of these test switches 2, the on-off state of the current at each pole of the photocoupler to be tested is accurately controlled. The changes of the input and output current signals of the photocoupler are monitored by an external test system, and the time difference from the input signal change to the output signal response is recorded, so as to accurately measure the switching time of the photocoupler.

[0037] In some embodiments, Figure 1 As shown, a photoelectric coupler testing device also includes a testing motherboard 4 and a testing daughterboard 5 installed on the mounting seat 3, wherein the testing motherboard 4 is used to install the testing switch 2; and the testing daughterboard 5 is used to install the socket 1.

[0038] In addition, the test sub-board 5 is provided with a pin header, which is electrically connected to the socket 1 , and the test mother board 4 is provided with a pin header seat 41 , which is electrically connected to the relay switch, and the pin header is plugged into the pin header seat 41 .

[0039] Specifically, the test motherboard 4 can be integrated with a signal conditioning module for preprocessing and amplifying the test signal to improve the accuracy and sensitivity of the test. The test template can also be integrated with a heat dissipation structure, such as a heat sink, heat dissipation holes, etc., to ensure stability and reliability under long-term testing. In addition, the number of test switches 2 can be configured according to test requirements to improve the flexibility of the test; the test motherboard 4 adopts a modular design to improve the flexibility of the test and facilitate subsequent maintenance and upgrades.

[0040] Furthermore, the socket 1 is mounted on the upper surface of the test sub-board 5, the pin row is mounted on the lower surface of the test sub-board 5, the pin row is electrically connected to the socket 1, and a pin row seat 41 is provided on the upper surface of the test motherboard 4, the pin row seat 41 is connected to the pin row, so as to realize the electrical connection between the test switch 2 and the photoelectric coupler to be tested through the socket 1, and the plug-in design of the pin row and the pin row seat 41 ensures good electrical connectivity and signal transmission stability between the test switch 2 and the photoelectric coupler to be tested. At the same time, this plug-in method also facilitates the rapid connection and disconnection between the test sub-board 5 and the test motherboard 4, thereby improving the maintenance efficiency of the device.

[0041] In this embodiment, the test sub-board 5 provides an installation position for the socket 1, and the test motherboard 4 provides an installation position for the test switch 2. The separate design of the test sub-board 5 and the test motherboard 4 allows the socket 1 and the test switch 2 to have sufficient installation space, and facilitates the subsequent debugging and maintenance of the socket 1 and the test switch 2. The photoelectric coupler to be tested is electrically connected to the socket 1, and the socket 1 is electrically connected to the test switch 2 through the pin header and the pin header seat 41, ensuring good electrical connectivity and signal transmission stability between the test switch 2 and the photoelectric coupler to be tested, while reducing the complexity of internal wiring, reducing test errors caused by wiring errors or interference, thereby improving the accuracy of the test.

[0042] In some embodiments, Figure 1 As shown, a mounting groove 31 is opened downward on the upper surface of the mounting seat 3 , the test mother board 4 is located in the mounting groove 31 , and the lower surface of the test daughter board 5 is connected to the upper surface of the mounting seat 3 .

[0043] In addition, the mounting base 3 is also provided with an external interface 32 connected to the test motherboard 4, which is used to connect to an external test system to power the test switch 2. The lower surface of the test motherboard 4 is connected to a banana plug, which is used to connect to an external test system to power the photoelectric coupler to be tested and transmit signals.

[0044] In the embodiment of the present application, the mounting groove 31 is used to mount the test motherboard 4, and the test sub-board 5 is equivalent to a cover plate directly covering the mounting groove 31, so as to prevent the external environment from affecting the operation of the components and circuits on the test motherboard 4. The test motherboard 4 is located below the test sub-board 5. The layout of the two is compact and reasonable, which is conducive to the miniaturization of the test device and is easy to carry. The design of the external interface 32 facilitates the connection of the test device with the power supply of the external test system, so as to control the on and off of the test switch. The lower surface of the test motherboard 4 is connected with a banana plug, which facilitates the external test system to power the photocoupler to be tested, and realizes remote control and real-time transmission of data. The external test system can be a semiconductor discrete device test system.

[0045] In some embodiments, a positioning groove communicating with the mounting groove 31 is formed downwardly on the upper surface of the mounting seat 3 , and a positioning point plugged into the positioning groove is formed on the test motherboard 4 .

[0046] Specifically, the side wall of the positioning groove is provided with an elastic structure so as to provide a certain buffer and clamping force when the positioning point is inserted into the positioning groove, thereby ensuring a stable connection between the test motherboard 4 and the mounting seat 3 .

[0047] In this embodiment, the positioning grooves and the positioning points are plugged in, which facilitates the installation of the test motherboard 4 at a designated position of the mounting seat 3 and helps to enhance the connectivity between the test motherboard 4 and the mounting seat 3 .

[0048] In some embodiments, Figure 2 and Figure 3 As shown, the test switch 2 is a relay switch, the first pole of the photoelectric coupler to be tested is connected to the first relay switch, the second pole of the photoelectric coupler to be tested is connected to the second relay switch, and the third pole of the photoelectric coupler to be tested is connected to the third relay switch.

[0049] In addition, the relay switches are arranged in multiple groups to test multiple groups of photoelectric couplers to be tested.

[0050] Specifically, the first pole of the photoelectric coupler to be tested is the positive pole, also the base (B pole), connected to the BS terminal and the BF terminal of the first relay switch, the second pole of the photoelectric coupler to be tested is the C pole (collector), connected to the CS terminal and the CF terminal of the second relay switch, the third pole of the photoelectric coupler to be tested is the E pole (emitter), the third pole is also the negative pole (emitter), connected to the ES terminal and the EF terminal of the third relay switch, and the power supplies of the first relay switch, the second relay switch and the third relay switch are connected in series.

[0051] Furthermore, the model of the relay switch can be selected as G6B-2214P or TQ2-5V, the model of the first relay switch is TQ2-5V, and the models of the second relay switch and the third relay switch are G6B-2214P. When testing the switching characteristics of the MOS tube, the first relay switch of the TQ2-5V model can control the short circuit of the upper half bridge of the MOS tube, which provides the necessary conditions for the test and helps to comprehensively evaluate the performance of the MOS tube.

[0052] Furthermore, Figure 3 The first relay switch, the second relay switch and the third relay switch in the dotted frame are a group of relay switches. The relay switches are arranged in multiple groups, and each group of photoelectric couplers has a corresponding group of relay switches for testing.

[0053] In this embodiment, the test switch 2 is a relay switch, which can be driven by different control signals (such as voltage, current, light signal, etc.), so that the action of the test switch 2 can be flexibly matched with various test requirements. The test switch 2 is used as a control switch to realize the connection and disconnection of different poles of the photoelectric coupler (positive pole / base B, collector C, emitter E and negative pole), thereby performing a photoelectric coupler switch performance test.

[0054] Based on the same inventive concept, Figure 4 As shown, corresponding to any of the above embodiments, the present application also provides a photoelectric coupler testing method, comprising the following steps:

[0055] S101: Connect the photoelectric coupler to be tested to the test switch 2 through the socket 1;

[0056] Specifically, different pins of the optocoupler to be tested are inserted into the corresponding plug-in interfaces of socket 1. According to the test requirements, different pins (different poles) of multiple optocouplers to be tested can be correspondingly inserted into the plug-in interfaces of socket 1. Different plug-in interfaces of socket 1 are connected to corresponding test switch 1, so that different pins (different poles) of the optocoupler to be tested are correspondingly connected to different test switches 2.

[0057] S102: The test switch 2 controls the on-off of the current of each pole of the photoelectric coupler to be tested, and obtains the switch characteristic information of the photoelectric coupler to be tested according to the output current information of the photoelectric coupler to be tested.

[0058] Specifically, the external test system inputs an initial current to the photocoupler to be tested, and after ensuring that the current signal is stable, the external test system controls the test switch connected to different poles of the photocoupler to be tested to open or close according to the test requirements, thereby controlling the on-off of the current at each pole of the photocoupler to be tested. The external test system tests the output current of the photocoupler to be tested, thereby analyzing the switching characteristics of the photocoupler, such as the switching speed and response time, and recording relevant information. The test requirements can also be repeated under different conditions (such as different input currents, different ambient temperatures, etc.).

[0059] In this embodiment, the above-mentioned photoelectric coupler testing method has the beneficial effects of the corresponding device embodiment, which will not be described in detail here.

[0060] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the described method.

[0061] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0062] It is understandable that before using the technical solutions of each embodiment of the present disclosure, the type, scope of use, usage scenarios, etc. of the personal information involved will be informed to the user in an appropriate manner, and the user's authorization will be obtained.

[0063] For example, in response to receiving an active request from a user, a prompt message is sent to the user to clearly remind the user that the operation requested to be performed will require obtaining and using the user's personal information. Thus, the user can independently choose whether to provide personal information to software or hardware such as an electronic device, application, server, or storage medium that performs the operation of the technical solution of the present disclosure according to the prompt message.

[0064] As an optional but non-limiting implementation, in response to receiving the user's active request, the prompt information may be sent to the user in the form of a pop-up window, in which the prompt information may be presented in text form. In addition, the pop-up window may also carry a selection control for the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0065] It is understandable that the above notification and the process of obtaining user authorization are merely illustrative and do not constitute a limitation on the implementation of the present disclosure. Other methods that meet relevant laws and regulations may also be applied to the implementation of the present disclosure.

[0066] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0067] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0068] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0069] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A photoelectric coupler testing device, characterized in that: include: A socket (1) for connecting a photoelectric coupler to be tested; A plurality of test switches (2), each of the test switches (2) being connected to a different pole of the photoelectric coupler to be tested, and used to control the on / off of the current at each pole of the photoelectric coupler to be tested, so as to test the switch characteristics of the photoelectric coupler to be tested; A mounting base (3) is used to mount the socket (1) and the test switch (2).

2. A photoelectric coupler testing device according to claim 1, characterized in that: It also comprises a test motherboard (4) and a test daughterboard (5) mounted on the mounting seat (3); the test motherboard (4) is used to mount the test switch (2); and the test daughterboard (5) is used to mount the socket (1).

3. A photoelectric coupler testing device according to claim 2, characterized in that: The upper surface of the mounting seat (3) is provided with a mounting groove (31) downwardly, the test mother board (4) is located in the mounting groove (31), and the lower surface of the test daughter board (5) is connected to the upper surface of the mounting seat (3).

4. The photoelectric coupler testing device according to claim 3, characterized in that: The upper surface of the mounting seat (3) is provided with a positioning groove extending downwardly and communicating with the mounting groove (31), and the test motherboard (4) is provided with a positioning point plugged into the positioning groove.

5. The photoelectric coupler testing device according to claim 4, characterized in that: The mounting base (3) is also provided with an external interface (32) connected to the test motherboard (4) for connecting to an external test system to supply power to the test switch (2); a banana plug is connected to the lower surface of the test motherboard (4) for connecting to an external test system to supply power to the photoelectric coupler to be tested and to transmit signals.

6. The photoelectric coupler testing device according to claim 2, characterized in that: The test sub-board (5) is provided with a pin header, the pin header is electrically connected to the socket (1), the test motherboard (4) is provided with a pin header seat (41), the pin header seat (41) is electrically connected to the relay switch, and the pin header is plugged into the pin header seat (41).

7. The photoelectric coupler testing device according to claim 1, characterized in that: The test switch (2) is a relay switch, the first pole of the photoelectric coupler to be tested is connected to the first relay switch, the second pole of the photoelectric coupler to be tested is connected to the second relay switch, and the third pole of the photoelectric coupler to be tested is connected to the third relay switch.

8. The photoelectric coupler testing device according to claim 1, characterized in that: The relay switches are arranged in multiple groups to test multiple groups of photoelectric couplers to be tested.

9. A photoelectric coupler testing method, applied to the testing device according to any one of claims 1 to 8, characterized in that: The following steps are involved: Connecting the photoelectric coupler to be tested to the test switch (2) via the socket (1); The test switch (2) controls the on and off of the current of each pole of the photoelectric coupler to be tested, and obtains the switch characteristic information of the photoelectric coupler to be tested according to the output current information of the photoelectric coupler to be tested.

Images