Board edge defect-based reinspection scrapping method and device and storage medium

Abstract

The invention provides a reinspection scrapping method and device based on a plate edge defect and a storage medium. The method comprises the steps that a to-be-reinspected image, containing the plate edge defect, of a to-be-reinspected Strip is acquired and displayed; generating and displaying a defect selection interface on the target display interface after the defect scrapping instruction is monitored; wherein the target display interface displays the image to be rechecked; in the defect selection interface, when a defect confirmation instruction is monitored, generating and displaying a panel edge defect prompt interface; and on the board edge defect prompt interface, when it is monitored that the whole Strip confirms a scrap instruction, taking all the Pcs of the Strip to be rechecked as scrapped Pcs. According to the technical scheme provided by the invention, the whole Strip or the corresponding Pcs can be effectively judged to be scrapped aiming at the existing plate edge defects, and the accuracy and the detection efficiency of the detection result of the defect reinspection system are further improved.

Description

Technical Field

[0001] The present application relates to the technical field of defect detection, and in particular to a method, device and storage medium for re-inspection and scrapping based on board edge defects. Background Art

[0002] Machine vision is a simulation of biological vision using computers, industrial cameras, detection light sources and other related equipment. Specifically, industrial cameras can be used to capture images of samples to be tested, and computers can be used to process the images to extract useful information. The detection technology using machine vision can replace most manual inspections and has been widely used in manufacturing and other fields. For example, after the manufacture of various samples, before the samples leave the factory, they need to be inspected for defects to determine whether the samples are qualified in order to ensure the quality of the samples leaving the factory. The above samples include but are not limited to lithium battery samples, mobile phone middle frame samples, various printed circuit boards, etc.

[0003] Printed Circuit Board (PCB), also often referred to as printed circuit board, is an important electronic component that provides electrical connection and physical support for electronic components. Visual inspection technology detects defects on PCB and outputs defect images. The defect review system is used to review defect images to determine whether a single unit (Pcs) on the PCB is scrapped, or whether the entire strip is scrapped.

[0004] A printed circuit board (PCB) contains multiple independent units. Strip represents the entire printed circuit board, and Pcs represents the independent unit on the Strip. When using machine vision technology to perform appearance defect inspection on various printed circuit boards, the detected defects include defects on the independent units and defects not on the independent units. When the prior art manually re-inspects the defect results detected by machine vision technology, it mainly determines whether the defective independent units need to be judged as scrapped, that is, by comparing the defects on the independent units with the acceptance standards of the independent units, so as to determine whether the independent units need to be scrapped. However, the inventors have found that under some acceptance standards, board edge defects, that is, defects not on the independent units, can also cause the circuit board to be scrapped. Summary of the invention

[0005] In view of this, the present application provides a method, device and storage medium for re-inspection and scrapping based on board edge defects to solve the technical problem in the prior art that it is impossible to determine the scrapping of printed circuit boards based on board edge defects.

[0006] In a first aspect, the present application provides a method for re-inspection and scrapping based on board edge defects, which is applied to a defect re-inspection system, and the method comprises:

[0007] Acquire and display the image of the strip to be re-inspected that contains the board edge defects;

[0008] On the target display interface, when a defect scrapping instruction is monitored, a defect selection interface is generated and displayed; wherein the target display interface displays the image to be re-inspected;

[0009] In the defect selection interface, when a defect confirmation instruction is monitored, a board edge defect prompt interface is generated and displayed;

[0010] In the board edge defect prompt interface, when the entire Strip is monitored for confirmation of scrapping, all Pcs of the Strip to be re-inspected are regarded as scrapped Pcs.

[0011] Preferably, the re-inspection and scrapping method based on board edge defects further comprises:

[0012] In the target display interface, before the defect scrapping instruction is heard, it is heard that the image to be re-inspected is in a selected state.

[0013] Preferably, generating and displaying a defect selection interface includes:

[0014] Acquire a target pre-selected defect set from a database based on the strip to be re-inspected;

[0015] A defect set is preselected according to the target, and a defect selection interface is generated and displayed based on a preset matrix display rule.

[0016] Preferably, a defect scrapping button is provided in the target display interface;

[0017] When the defect scrapping button is triggered, the defect scrapping instruction is monitored;

[0018] Or the defect scrapping button is associated with a defect scrapping shortcut key, and when the defect scrapping shortcut key is triggered, the defect scrapping instruction is monitored.

[0019] Preferably, a defect confirmation button is provided in the defect selection interface;

[0020] After monitoring that any pre-selected defect is in a selected state, when the defect confirmation button is triggered, monitoring the defect confirmation instruction;

[0021] Or the defect confirmation button is associated with a defect confirmation shortcut key, and when the defect confirmation shortcut key is triggered, the defect confirmation instruction is monitored.

[0022] Preferably, the board edge defect prompt interface is provided with text information for prompting and a button for scrapping the whole material;

[0023] When the whole material scrap button is triggered, the whole Strip confirmation scrap instruction is monitored;

[0024] Or the whole material scrapping button is associated with a whole material scrapping shortcut key, and when the whole material scrapping shortcut key is triggered, the whole Strip confirmation scrapping instruction is monitored.

[0025] Preferably, the re-inspection and scrapping method based on board edge defects further comprises:

[0026] After treating all the Pcs of the strip to be re-inspected as scrapped Pcs, add target defect identification information to each Pcs; wherein the target defect identification information is the identification information of the pre-selected defect that is in a selected state when the defect confirmation button is triggered, or is the identification information of the pre-selected defect that is in a selected state when the defect confirmation shortcut key is triggered.

[0027] In a second aspect, the present application provides a re-inspection and scrapping device based on board edge defects, the device comprising:

[0028] The board edge acquisition module is used to acquire and display the image of the strip to be re-inspected containing board edge defects;

[0029] A defect selection module is used to generate and display a defect selection interface on a target display interface when a defect scrapping instruction is triggered; wherein the target display interface displays the image to be re-inspected;

[0030] A board edge prompt module is used to generate and display a board edge defect prompt interface in the defect selection interface when a defect confirmation instruction is triggered;

[0031] The scrap confirmation module is used to treat all the Pcs of the strip to be re-inspected as scrapped Pcs when the confirmation scrap instruction of the entire Strip is triggered in the board edge defect prompt interface.

[0032] In a third aspect, the present application provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the computer instructions to implement the re-inspection and scrapping method based on board edge defects described in the first aspect.

[0033] In a fourth aspect, the present application provides a computer-readable storage medium storing computer instructions, which, when executed by a processor, implements the re-inspection and scrapping method based on board edge defects described in the first aspect.

[0034] The board edge defect-based re-inspection and scrapping method, device, and storage medium provided in the present application have at least the following beneficial effects:

[0035] The technical solution provided in this application can effectively judge and scrap the entire Strip or the corresponding PCs based on the existing board edge defects, further improving the accuracy and efficiency of the detection results of the defect re-inspection system. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the prior art descriptions. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. It should be noted that the drawings described below are schematic and should not be understood as any limitation to the present application. In the drawings:

[0037] Figure 1 A schematic diagram showing a method for re-inspection and scrapping based on board edge defects in one embodiment of the present application is shown;

[0038] Figure 2 A schematic diagram of a re-inspection and scrapping device based on board edge defects in one embodiment of the present application is shown;

[0039] Figure 3 A schematic diagram of a computer device in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0041] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0044] Although the processes described below include multiple operations that appear in a specific order, it should be clearly understood that these processes may also include more or fewer operations, and these operations may be performed sequentially or in parallel.

[0045] Example 1

[0046] The re-inspection and scrapping method based on board edge defects provided by the present application can be applied to the circuit board defect re-inspection scenario. In this scenario, the board edge defects are not bound to the independent units Pcs on the entire printed circuit board. In the re-inspection system, when re-judging whether the defective Pcs are scrapped or not, since the board edge defects are not on the Pcs, it is impossible to judge and scrap the corresponding Pcs for the existing board edge defects. Therefore, in view of the above situation, the system urgently needs to develop a functional module for judging whether the Pcs are scrapped based on the board edge defects. In view of this, there is an urgent need for a re-inspection and scrapping method based on board edge defects.

[0047] See also Figure 1 A method for re-inspection and scrapping based on board edge defects provided in one embodiment of the present application is applied to a defect re-inspection system and may include the following steps.

[0048] S101, acquiring and displaying an image of a strip to be re-inspected containing board edge defects;

[0049] S102, on the target display interface, when a defect scrapping instruction is monitored, a defect selection interface is generated and displayed; wherein the target display interface displays the image to be re-inspected;

[0050] S103, in the defect selection interface, when a defect confirmation instruction is monitored, generating and displaying a board edge defect prompt interface;

[0051] S104, in the board edge defect prompt interface, when the entire Strip is monitored to be scrapped, all the Pcs of the Strip to be re-inspected are regarded as scrapped Pcs.

[0052] In this embodiment, the re-inspection system obtains the defect image detected by the first inspection system from the first inspection system, which is the image to be re-inspected. If there is a board edge defect in the entire piece of material to be re-inspected and it is detected by the first inspection system, the re-inspection system can obtain the image containing the board edge defect, and the defect image in the Pcs is bound to the corresponding Pcs information, while the image containing the board edge defect is not bound to the Pcs information. The re-inspection system can display all defect images of the material to be re-inspected. The display interface displays the corresponding defect images in batches. When the display interface displays an image containing a board edge defect, the current display interface is the target display interface. In the target display interface, the inspection personnel observe the image containing the board edge defect displayed on the interface, and can operate the re-inspection system according to the actual status of the board edge defect. When the inspection personnel determine that the corresponding Pcs or the entire Strip needs to be scrapped according to the current image containing the board edge defect, the defect scrapping operation can be performed. The re-inspection system can monitor the defect scrapping instruction to generate and display a defect selection interface for the inspector to select the defect type of the image, for example, it can be divided into two categories: the type that needs to be scrapped as a whole and the type that does not need to be scrapped as a whole. After the inspector selects and confirms the defect type of the image, a board edge defect prompt interface is generated and displayed to prompt the inspector that the image is a board edge defect. The prompt information generated by the type that needs to be scrapped as a whole is, for example: "The defect is a board edge defect xxxxx, do you want to scrap the entire Strip?" The prompt information generated by the type that does not need to be scrapped as a whole is, for example: "The defect is a board edge defect xxxxx, do you want to scrap the related PCs?" If the inspector confirms that the entire PCs needs to be scrapped, the re-inspection system is operated to generate a confirmation scrapping instruction for the entire Strip. When the re-inspection system monitors the confirmation scrapping instruction for the entire Strip, all PCs of the strip to be re-inspected are scrapped PCs. It is understandable that when the defect type that is not a complete scrapping defect is selected in advance, if the inspection personnel need to scrap the corresponding Pcs in a targeted manner, they can operate the re-inspection system to select the contours of several Pcs adjacent to the board edge defect to confirm the scrapping of the selected Pcs, which will not be repeated here.

[0053] In this embodiment, the image of the strip to be re-inspected containing the board edge defects is obtained and displayed on the target display interface, so that the inspector can directly and clearly see the picture of the existing board edge defects on the display interface. The whole method gradually advances the operation by listening to different instructions, from generating and displaying the defect selection interface after listening to the defect scrapping instruction, to generating and displaying the board edge defect prompt interface after listening to the defect confirmation instruction on the interface, and then to treating all the Pcs of the strip to be re-inspected as scrapped Pcs after listening to the confirmation scrapping instruction of the entire strip on the board edge defect prompt interface. This step-by-step instruction interaction design requires the inspector to make clear operation confirmation at each key step, avoiding wrong judgments caused by misoperation or arbitrary operation, and ensuring the rigor and standardization of the entire scrapping judgment process. When there are board edge defects that are serious enough to require the scrapping of the entire piece of material, all the Pcs of the strip to be re-inspected can be quickly treated as scrapped Pcs. This clear scrapping judgment process can effectively screen out Strips with board edge defects that have been confirmed to fail re-inspection from qualified products, preventing products with obvious board edge defects from entering subsequent processes or reaching customers, thereby effectively ensuring product quality. This implementation method can effectively judge the entire Strip or the corresponding PCs as scrapped based on the existing board edge defects, further improving the accuracy and efficiency of the detection results of the defect re-inspection system.

[0054] Preferably, the re-inspection and scrapping method based on board edge defects further comprises:

[0055] In the target display interface, before the defect scrapping instruction is heard, it is heard that the image to be re-inspected is in a selected state.

[0056] Specifically, multiple defect images with re-inspection can be displayed simultaneously on the display interface, for example, two images can be displayed at the same time, or four images can be displayed at the same time. Therefore, when judging whether the entire Strip or the corresponding PCS containing the board edge defect is scrapped, the corresponding image containing the board edge defect needs to be selected to select and judge the subsequent defect type. In this embodiment, before the defect scrapping instruction is heard, the image to be re-inspected is required to be in a selected state, which makes the entire operation process have clear preconditions and logical order. The inspection personnel need to select the specific image to be re-inspected first, indicating that they have focused on the Strip corresponding to the image to be processed, and then judge whether to issue the defect scrapping instruction and other subsequent operations according to the situation presented by the image. This logical order ensures that each operation step is based on a reasonable premise, avoids arbitrary operations, and makes the entire image-based defect detection and scrapping judgment process more rigorous and orderly, and the correlation between each link is stronger. It further improves the applicability and detection efficiency of the re-inspection system.

[0057] Preferably, generating and displaying a defect selection interface includes:

[0058] Acquire a target pre-selected defect set from a database based on the strip to be re-inspected;

[0059] A defect set is preselected according to the target, and a defect selection interface is generated and displayed based on a preset matrix display rule.

[0060] In this embodiment, the target pre-selected defect set is obtained from the database by associating with the Strip to be re-inspected, which reflects the data-driven operation mode. The database stores a wealth of information related to the defects that may occur in various Strips. Accurately extracting the corresponding pre-selected defect set according to the specific situation of the current Strip to be re-inspected means that it is possible to focus on the most likely types of defects in the Strip, rather than listing all defect options aimlessly. It should be noted that the defect options can also be bound to two upper-level types: the type that needs to be scrapped as a whole and the type that does not need to be scrapped as a whole. This makes it easier to distinguish whether the entire Strip needs to be scrapped in the future, that is, to determine whether to scrap all the Pcs on the Strip or only the few Pcs adjacent to the defect.

[0061] In this embodiment, the target pre-selected defect set is obtained from the database, which reduces the time cost of inspectors to check one by one from a large number of common defects when confirming defects, and can quickly focus on the defect options with the highest relevance to the current Strip to be re-inspected. Combined with the clear and orderly interface presentation under the matrix display rules, inspectors can find and confirm possible defects more quickly, which greatly improves the work efficiency of the defect confirmation link as a whole. It further improves the applicability and detection efficiency of the re-inspection system.

[0062] Preferably, a defect scrapping button is provided in the target display interface;

[0063] When the defect scrapping button is triggered, the defect scrapping instruction is monitored;

[0064] Or the defect scrapping button is associated with a defect scrapping shortcut key, and when the defect scrapping shortcut key is triggered, the defect scrapping instruction is monitored.

[0065] Preferably, a defect confirmation button is provided in the defect selection interface;

[0066] After monitoring that any pre-selected defect is in a selected state, when the defect confirmation button is triggered, monitoring the defect confirmation instruction;

[0067] Or the defect confirmation button is associated with a defect confirmation shortcut key, and when the defect confirmation shortcut key is triggered, the defect confirmation instruction is monitored.

[0068] Preferably, the board edge defect prompt interface is provided with text information for prompting and a button for scrapping the whole material;

[0069] When the whole material scrap button is triggered, the whole Strip confirmation scrap instruction is monitored;

[0070] Or the whole material scrapping button is associated with a whole material scrapping shortcut key, and when the whole material scrapping shortcut key is triggered, the whole Strip confirmation scrapping instruction is monitored.

[0071] In this implementation, the triggering action of the button is associated with the monitoring of the defect scrapping instruction, and a clear operation feedback mechanism is established. Once the inspector clicks the defect scrapping button, the system can accurately capture this operation behavior and convert it into the corresponding defect scrapping instruction. Subsequently, a series of related processes such as generating a defect selection interface can be promoted based on the instruction, ensuring a seamless connection from the inspector's operation intention to the system's execution of the corresponding process, so that the entire operation process can proceed in an orderly manner. Associating shortcut keys with the defect scrapping button further enriches the ways in which inspectors can initiate defect scrapping operations.

[0072] It should be noted that preferably, a shortcut command for directly scrapping the entire Strip can even be set in the re-inspection system, so that when the inspector finds a defect on the edge of the board, all PCs on the entire Strip can be directly confirmed as scrapped without the system generating a prompt message of the defect on the edge of the board, which further improves the applicability and inspection efficiency of the re-inspection system.

[0073] Preferably, the re-inspection and scrapping method based on board edge defects further comprises:

[0074] After treating all the Pcs of the strip to be re-inspected as scrapped Pcs, add target defect identification information to each Pcs; wherein the target defect identification information is the identification information of the pre-selected defect that is in a selected state when the defect confirmation button is triggered, or is the identification information of the pre-selected defect that is in a selected state when the defect confirmation shortcut key is triggered.

[0075] In this embodiment, when it is determined that all the PCs of the strip to be re-inspected need to be scrapped, the operation of adding the target defect identification information is equivalent to a detailed "marking" of these scrapped PCs. It makes the specific defect situation of each scrapped PC have a clear record, which is no longer just a simple scrap judgment result, but further refines the scrap reason by adding identification information, so that when viewing related records or conducting quality traceback analysis later, it can be clearly known that each PC is judged to be scrapped because of what specific defects, which improves the information chain in the entire scrapping process. It is clearly pointed out that the target defect identification information comes from the pre-selected defect that is in the selected state when the defect confirmation button or the defect confirmation shortcut key is triggered, which establishes a clear corresponding relationship. In the previous operation process, the inspector selects the specific pre-selected defect by clicking a button or operating a shortcut key, and the defect identification information corresponding to this operation behavior will be accurately recorded and added to the corresponding scrapped PCs, ensuring the accuracy of the identification information and the consistency with the actual confirmation operation of the inspector, avoiding confusion or incorrect association of the identification information. After adding target defect identification information to each scrapped PC, in the subsequent production process, if a certain type of defect is found to occur too frequently or there is a quality dispute, the company can use this detailed defect identification information to quickly locate which PCs have such problems, and then trace back to the possible causes of the defect in the production process, such as raw material problems, process problems or equipment problems, etc., which helps to accurately analyze the root causes of quality problems so that targeted improvement measures can be taken to improve the overall quality of the product. The applicability and detection efficiency of the re-inspection system are further improved.

[0076] Example 2

[0077] This embodiment provides a re-inspection and scrapping device based on board edge defects, which is described by applying the re-inspection and scrapping method based on board edge defects provided in the above embodiment 1. Figure 2 As shown, a board edge defect-based re-inspection and scrapping device provided by one embodiment of the present application is applied to a defect re-inspection system and may include the following multiple modules.

[0078] The board edge acquisition module is used to acquire and display the image of the strip to be re-inspected containing board edge defects;

[0079] A defect selection module is used to generate and display a defect selection interface on a target display interface when a defect scrapping instruction is triggered; wherein the target display interface displays the image to be re-inspected;

[0080] A board edge prompt module is used to generate and display a board edge defect prompt interface in the defect selection interface when a defect confirmation instruction is triggered;

[0081] The scrap confirmation module is used to treat all the Pcs of the strip to be re-inspected as scrapped Pcs when the confirmation scrap instruction of the entire Strip is triggered in the board edge defect prompt interface.

[0082] The re-inspection and scrapping device based on board edge defects provided in the embodiment of the present application can be applied to the re-inspection and scrapping method based on board edge defects provided in the above-mentioned embodiment 1. For relevant details, refer to the above-mentioned method embodiment. The implementation principle and technical effect are similar and will not be repeated here.

[0083] It should be noted that: the re-inspection and scrapping device based on board edge defects provided in the embodiments of the present application only uses the division of the above-mentioned functional modules / functional units as an example when performing re-inspection and scrapping based on board edge defects. In actual applications, the above-mentioned functions can be assigned to different functional modules / functional units as needed, that is, the internal structure of the re-inspection and scrapping device based on board edge defects is divided into different functional modules / functional units to complete all or part of the functions described above. In addition, the implementation method of the re-inspection and scrapping method based on board edge defects provided in the above-mentioned method embodiment 1 and the implementation method of the re-inspection and scrapping device based on board edge defects provided in this embodiment 2 belong to the same concept. The specific implementation process of the re-inspection and scrapping device based on board edge defects provided in this embodiment 2 is detailed in the above-mentioned method embodiment 1, and will not be repeated here.

[0084] Example 3

[0085] See also Figure 3 As shown, one embodiment of the present application also provides a computer device, which can be a computer device such as a desktop computer, a laptop computer, a handheld computer, and a cloud server. The computer device can include, but is not limited to, a processor and a memory. The processor and the memory are connected via a bus or other means.

[0086] The processor may be a central processing unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, graphics processing units (GPU), embedded neural network processors (NPU) or other dedicated deep learning coprocessors, discrete gate or transistor logic devices, discrete hardware components, or a combination of the above chips.

[0087] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs, non-transitory computer executable programs and modules, such as program instructions / modules corresponding to the methods in the above-mentioned embodiments of the present application. The processor executes various functional applications and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, that is, implementing the methods in the above-mentioned method embodiments.

[0088] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created by the processor, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0089] One embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store a computer program. When the computer program is executed by a processor, the method in the above method embodiment is implemented.

[0090] Those skilled in the art can understand that the implementation of all or part of the processes in the above-mentioned implementation methods of the present application can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the implementation methods of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory (Flash Memory), a hard disk (Hard Disk Drive, abbreviated: HDD) or a solid-state drive (SSD), etc.; the storage medium can also include a combination of the above-mentioned types of memory.

[0091] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] Although the embodiments of the present application are described in conjunction with the accompanying drawings, they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description without departing from the concept of the present application. It is not necessary and impossible to list all the embodiments here. The obvious changes or modifications derived from this are still within the scope of protection created by the present application. Therefore, the scope of protection of the patent application shall be based on the attached claims.

Claims

1. A re-inspection and scrapping method based on board edge defects, characterized in that: The method comprises: Acquire and display the image of the strip to be re-inspected that contains the board edge defects; On the target display interface, when a defect scrapping instruction is monitored, a defect selection interface is generated and displayed; wherein the target display interface displays the image to be re-inspected; In the defect selection interface, when a defect confirmation instruction is monitored, a board edge defect prompt interface is generated and displayed; In the board edge defect prompt interface, when the entire Strip is monitored for confirmation of scrapping, all Pcs of the Strip to be re-inspected are regarded as scrapped Pcs.

2. The method for re-inspection and scrapping based on board edge defects according to claim 1 is characterized in that: Also includes: In the target display interface, before the defect scrapping instruction is heard, it is heard that the image to be re-inspected is in a selected state.

3. The method for re-inspection and scrapping based on board edge defects according to claim 2 is characterized in that: The generating and displaying the defect selection interface comprises: Acquire a target pre-selected defect set from a database based on the strip to be re-inspected; A defect set is preselected according to the target, and a defect selection interface is generated and displayed based on a preset matrix display rule.

4. The method for re-inspection and scrapping based on board edge defects according to claim 1 is characterized in that: A defective scrap button is provided in the target display interface; When the defect scrapping button is triggered, the defect scrapping instruction is monitored; Or the defect scrapping button is associated with a defect scrapping shortcut key, and when the defect scrapping shortcut key is triggered, the defect scrapping instruction is monitored.

5. The method for re-inspection and scrapping based on board edge defects according to claim 1 is characterized in that: A defect confirmation button is provided in the defect selection interface; After monitoring that any pre-selected defect is in a selected state, when the defect confirmation button is triggered, monitoring the defect confirmation instruction; Or the defect confirmation button is associated with a defect confirmation shortcut key, and when the defect confirmation shortcut key is triggered, the defect confirmation instruction is monitored.

6. The method for re-inspection and scrapping based on board edge defects according to claim 1 is characterized in that: The board edge defect prompt interface is provided with text information for prompting and a button for scrapping the whole material; When the whole material scrap button is triggered, the whole Strip confirmation scrap instruction is monitored; Or the whole material scrapping button is associated with a whole material scrapping shortcut key, and when the whole material scrapping shortcut key is triggered, the whole Strip confirmation scrapping instruction is monitored.

7. The method for re-inspection and scrapping based on board edge defects according to claim 1 is characterized in that: Also includes: After treating all the Pcs of the strip to be re-inspected as scrapped Pcs, add target defect identification information to each Pcs; wherein the target defect identification information is the identification information of the pre-selected defect that is in a selected state when the defect confirmation button is triggered, or is the identification information of the pre-selected defect that is in a selected state when the defect confirmation shortcut key is triggered.

8. A re-inspection and scrapping device based on board edge defects, characterized in that: The device comprises: The board edge acquisition module is used to acquire and display the image of the strip to be re-inspected containing board edge defects; A defect selection module is used to generate and display a defect selection interface on a target display interface when a defect scrapping instruction is triggered; wherein the target display interface displays the image to be re-inspected; A board edge prompt module is used to generate and display a board edge defect prompt interface in the defect selection interface when a defect confirmation instruction is triggered; The scrap confirmation module is used to treat all the Pcs of the strip to be re-inspected as scrapped Pcs when the confirmation scrap instruction of the entire Strip is triggered in the board edge defect prompt interface.

9. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor implements the re-inspection and scrapping method based on board edge defects as described in any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the re-inspection and scrapping method based on board edge defects according to any one of claims 1 to 7 is implemented.

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