Tactile sense driving circuit, tactile sense driving circuit board, and tactile sense driving device

Abstract

The invention discloses a tactile driving circuit, a tactile driving circuit board and tactile driving equipment, and relates to the technical field of tactile feedback. The tactile driving circuit is applied to a tactile feedback substrate, the tactile feedback substrate comprises a touch substrate and an actuator connected with the touch substrate, and the tactile driving circuit comprises an amplifying circuit connected with a driving input end and used for amplifying a driving signal input by the driving input end; the current expanding circuit is connected with the power supply end, the driving output end and the output end of the amplifying circuit, the driving output end is further used for being connected with an actuator, and the current expanding circuit is used for conducting connection between the power supply end and the driving output end according to signals output by the amplifying circuit and generating driving current on a connection path. The drive current is used to drive the actuator to vibrate.

Description

Haptic drive circuit, haptic drive circuit board, and haptic drive device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to PCT international patent application number PCT / CN2023 / 108884, entitled “A driving circuit and tactile feedback system,” filed with the PCT receiving office on July 24, 2023, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0003] The present disclosure relates to the field of tactile feedback, and in particular to a tactile driving circuit, a tactile driving circuit board, and a tactile driving device. Background Art

[0004] Haptic feedback is a cutting-edge technology in the field of virtual reality and human-computer interaction. Multimedia terminals such as smartphones and tablets that use haptic feedback technology have broad application prospects in education, entertainment, and medical fields.

[0005] Overview

[0006] The present disclosure provides a haptic drive circuit applied to a haptic feedback substrate. The haptic feedback substrate includes a touch substrate and an actuator connected to the touch substrate. The haptic drive circuit includes:

[0007] an amplifier circuit connected to the driving input terminal, and configured to amplify the driving signal inputted from the driving input terminal; and

[0008] The current expansion circuit is respectively connected to the power supply end, the drive output end and the output end of the amplifier circuit. The drive output end is also used to connect to the actuator. The current expansion circuit is used to conduct the connection between the power supply end and the drive output end according to the signal output by the amplifier circuit, and generate a drive current on the connection path. The drive current is used to drive the actuator to vibrate.

[0009] In some embodiments, the signal output by the amplifier circuit includes a first amplified signal and a second amplified signal with opposite phases, the power supply terminal includes a first power supply terminal and a second power supply terminal, and the current expansion circuit includes:

[0010] a first current expansion branch, connected to the first power supply terminal, the driving output terminal, and the output terminal of the amplifier circuit, respectively, and configured to conduct the connection between the first power supply terminal and the driving output terminal according to the first amplified signal; and

[0011] The second current expansion branch is respectively connected to the second power supply terminal, the driving output terminal and the output terminal of the amplifier circuit, and is used to conduct the connection between the second power supply terminal and the driving output terminal according to the second amplified signal.

[0012] In some embodiments, the first current expansion branch includes: a first transistor, a control electrode of the first transistor is connected to the output terminal of the amplifier circuit, a first electrode of the first transistor is connected to the first power supply terminal, and a second electrode of the first transistor is connected to the driving output terminal;

[0013] The second current expansion branch includes: a second transistor, a control electrode of the second transistor is connected to the output terminal of the amplifier circuit, a first electrode of the second transistor is connected to the second power supply terminal, and a second electrode of the second transistor is connected to the drive output terminal;

[0014] The first transistor and the second transistor are of opposite transistor types, and the transistor types include an N-type transistor and a P-type transistor.

[0015] In some embodiments, the current expansion circuit further includes at least one of the following:

[0016] a first resistor connected between the second electrode of the first transistor and the driving output terminal;

[0017] a second resistor connected between the second electrode of the second transistor and the driving output terminal; and

[0018] The third resistor is connected between the output end of the amplifier circuit and the driving output end.

[0019] In some embodiments, the amplification circuit includes:

[0020] a first operational amplifier, wherein a non-inverting input terminal of the first operational amplifier is connected to the driving input terminal, an inverting input terminal of the first operational amplifier is connected to a ground potential, and an output terminal of the first operational amplifier is connected to the current expansion circuit;

[0021] a fourth resistor connected between the inverting input terminal of the first operational amplifier and the ground potential; and

[0022] A fifth resistor is connected between the inverting input terminal of the first operational amplifier and the driving output terminal.

[0023] In some embodiments, the amplification circuit includes:

[0024] a second operational amplifier, wherein a non-inverting input terminal of the second operational amplifier is connected to the ground potential, an inverting input terminal of the second operational amplifier is connected to the driving input terminal, and an output terminal of the second operational amplifier is connected to the current expansion circuit;

[0025] a sixth resistor connected between the inverting input terminal of the second operational amplifier and the driving input terminal; and

[0026] A seventh resistor is connected between the inverting input terminal of the second operational amplifier and the driving output terminal.

[0027] In some embodiments, the frequency of the driving signal is greater than or equal to 5 KHz and less than or equal to 50 KHz.

[0028] The present disclosure provides a haptic driving circuit board, comprising:

[0029] A base substrate, and at least one haptic driving circuit according to any one of the embodiments, wherein the haptic driving circuit is disposed on a first surface of the base substrate.

[0030] In some embodiments, the driving input terminal and the driving output terminal are further provided on the first surface, the driving input terminal and the driving output terminal are located on different sides of the amplifying circuit, and the current expansion circuit is located on a side of the amplifying circuit close to the driving output terminal.

[0031] In some embodiments, the power supply terminal is further provided on the first surface, the first surface includes a first side and a second side oppositely arranged along a first direction, the drive input terminal and the power supply terminal are arranged side by side close to the first side, and the drive output terminal is arranged close to the second side.

[0032] In some embodiments, the power supply terminal includes a first power supply terminal and a second power supply terminal, the current expansion circuit includes a first current expansion branch and a second current expansion branch, the first current expansion branch is respectively connected to the first power supply terminal, the drive output terminal, and the output terminal of the amplifier circuit, and the second current expansion branch is respectively connected to the second power supply terminal, the drive output terminal, and the output terminal of the amplifier circuit; and

[0033] The first flow expansion branch and the second flow expansion branch are arranged on the first surface along a second direction, and the second direction is perpendicular to the first direction.

[0034] In some embodiments, the current expansion circuit is packaged on the substrate in a direct-plug packaging manner.

[0035] In some embodiments, the haptic driver circuit board further includes:

[0036] At least one first heat sink is arranged on the first surface of the substrate, the first heat sink includes a first heat sink and a plurality of first heat sinks arranged parallel to one side of the first heat sink, two adjacent first heat sinks are separated from each other to form a heat dissipation duct, and the surface of the first heat sink facing away from the first heat sink is tightly attached to the current expansion circuit.

[0037] In some embodiments, the plurality of first heat sinks are arranged along a normal direction of the first surface;

[0038] The tactile driving circuit board also includes: at least one first fan, which is arranged on a first side and / or a second side of at least one first radiator, and the first side and the second side are two sides arranged opposite to each other along a third direction, and the third direction is parallel to the first surface and the surface of the first heat sink facing the first heat sink.

[0039] In some embodiments, the plurality of first heat sinks are arranged along a third direction, the third direction being parallel to the first surface and a surface of the first heat sink facing the first heat sink, and the base substrate is provided with an opening, the opening being in communication with a heat dissipation duct of the first heat sink;

[0040] The tactile driving circuit board further includes: at least one second fan, which is arranged on a third side and / or a fourth side of the first radiator, and the third side and the fourth side are two sides arranged opposite to each other along the normal direction of the first surface.

[0041] In some embodiments, the current expansion circuit is packaged on the substrate using a surface mount package.

[0042] In some embodiments, the haptic driver circuit board further includes:

[0043] a second heat sink disposed on a surface of the base substrate facing away from the current expansion circuit, the second heat sink comprising a second heat dissipation plate and a plurality of second heat dissipation fins disposed parallel to the second heat dissipation plate and facing away from the base substrate, with adjacent second heat dissipation fins spaced apart from each other to form a heat dissipation duct; and

[0044] The third fan is arranged on a side of the second heat sink away from the base substrate.

[0045] In some embodiments, the tactile driving circuit board includes a plurality of the tactile driving circuits, the plurality of the tactile driving circuits are arranged in an array on the first surface, and different tactile driving circuits are connected to different driving input terminals and different driving output terminals.

[0046] In some embodiments, the first surface includes a first side and a third side that are adjacent to each other, and the plurality of driving units are arranged in an array along an extension direction of the first side and an extension direction of the third side, respectively.

[0047] In some embodiments, the haptic driver circuit board further includes:

[0048] A power supply module is connected to the power supply end, and is used to generate a second voltage signal based on the first voltage signal provided by the power supply end, and output the second voltage signal to a signal generator. The signal generator is used to provide the drive signal to the drive input end, and the voltage amplitude of the second voltage signal is smaller than the voltage amplitude of the first voltage signal.

[0049] The present disclosure provides a tactile feedback device, comprising:

[0050] A tactile feedback substrate, comprising a touch substrate and an actuator connected to the touch substrate; and

[0051] The haptic driving circuit as described in any embodiment, or the haptic driving circuit board as described in any embodiment.

[0052] In some embodiments, the actuator includes at least one of the following: a PZT piezoelectric film, a monolithic piezoelectric ceramic, a stacked piezoelectric ceramic, a cymbal-type piezoelectric ceramic, a monolithic polyvinylidene fluoride film, a stacked polyvinylidene fluoride film, a cymbal-type polyvinylidene fluoride film, and a linear motor.

[0053] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below.

[0054] BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the description of the embodiments or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0056] FIG1 exemplarily shows a structural diagram of a first tactile driving circuit;

[0057] FIG2 exemplarily shows a structural diagram of a second tactile driving circuit;

[0058] FIG3 exemplarily shows a structural diagram of a tactile driving device;

[0059] FIG4 exemplarily shows several output waveforms of the first haptic driving circuit;

[0060] FIG5 exemplarily shows a schematic structural diagram of a first haptic driving circuit board;

[0061] FIG6 exemplarily shows a photograph of a first haptic driving circuit board;

[0062] FIG7 exemplarily shows a schematic structural diagram of a second haptic driving circuit board;

[0063] FIG8 exemplarily shows a photograph of a second haptic driving circuit board;

[0064] FIG9 exemplarily shows a schematic structural diagram of a third haptic driving circuit board;

[0065] FIG10 exemplarily shows a photograph of a third haptic driving circuit board;

[0066] FIG11 exemplarily shows a structural diagram of a fourth haptic driving circuit board;

[0067] FIG12 exemplarily shows a photograph of a fourth type of haptic driving circuit board.

[0068] Detailed description

[0069] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0070] The tactile feedback substrate includes a touch substrate and an actuator connected to the touch substrate. By applying a driving signal to the actuator, the actuator drives the touch substrate to vibrate, thereby realizing a tactile feedback function on the surface of the touch substrate.

[0071] Tactile feedback is usually achieved in two ways. First, the actuator drives the touch substrate to vibrate at a low frequency to simulate the tactile feedback of a button. Second, the actuator drives the touch substrate to vibrate at a high frequency to produce a film squeeze effect, thereby changing the friction coefficient between the touch body (such as a finger) and the surface of the touch substrate to simulate virtual surface tactile feedback effects such as texture and freeze.

[0072] The present disclosure provides a tactile feedback substrate 31 , as shown in FIG3 . The tactile feedback substrate 31 includes a touch substrate 311 and an actuator 312 connected to the touch substrate 311 .

[0073] As shown in Fig. 3, the haptic driving circuit 32 includes an amplifier circuit 321 and a current expansion circuit 322. The amplifier circuit 321 is connected to the driving input terminal Vin and is used to amplify the driving signal inputted from the driving input terminal Vin.

[0074] As shown in Figure 1 or Figure 2, the current expansion circuit 322 is respectively connected to the power supply terminal V+ / V-, the drive output terminal Vout and the output terminal of the amplifier circuit 321. The drive output terminal Vout is also used to connect to the actuator 312. The current expansion circuit 322 is used to conduct the connection between the power supply terminal V+ / V- and the drive output terminal Vout according to the signal output by the amplifier circuit 321, and generate a drive current on the connection path. The drive current is used to drive the actuator 312 to vibrate.

[0075] For example, the drive input terminal Vin can be input by an external device such as a signal generator, or by a signal generating circuit. The drive signal input to the drive input terminal Vin can be a regular waveform such as a sine wave, a rectangular wave, a triangular wave, or an irregular waveform, and this disclosure does not limit this.

[0076] Exemplarily, the amplifier circuit 321 is used to amplify the voltage of the driving signal, and the current expansion circuit 322 serves to increase or expand the driving current.

[0077] Exemplarily, the driving signal inputted by the driving input terminal Vin is, for example, a low-voltage signal, and the amplifier circuit 321 is configured to amplify the inputted low-voltage signal into a high-voltage signal.

[0078] The tactile driving circuit 32 provided in the present disclosure expands the low-power driving signal into a high-power signal through the amplification circuit 321 and the current expansion circuit 322. The high-power signal can drive the actuator 312 in the tactile feedback substrate 31 and can drive the actuator 312 at high frequency (such as ultrasonic segment drive).

[0079] Exemplarily, as shown in FIG. 1 or FIG. 2 , the amplifying circuit 321 and the current expanding circuit 322 are two circuits that are interconnected and separately provided.

[0080] The power supply terminal V+ / V- is used to supply power to the current expansion circuit 322. Exemplarily, the power supply terminal V+ / V- includes a first power supply terminal V+ and a second power supply terminal V-.

[0081] Exemplarily, the signal output by the amplifier circuit 321 includes a first amplified signal and a second amplified signal having opposite phases. For example, the voltage value of the first amplified signal is positive, and the voltage value of the second amplified signal is negative. Alternatively, the voltage value of the first amplified signal is negative, and the voltage value of the second amplified signal is positive.

[0082] For example, as shown in FIG1 or FIG2 , the current expansion circuit 322 includes a first current expansion branch KL1 and a second current expansion branch KL2. The first current expansion branch KL1 is connected to the first power supply terminal V+, the driver output terminal Vout, and the output terminal of the amplifier circuit 321, respectively. The first current expansion branch KL1 is configured to conduct a connection between the first power supply terminal V+ and the driver output terminal Vout based on a first amplified signal. The second current expansion branch KL2 is connected to the second power supply terminal V−, the driver output terminal Vout, and the output terminal of the amplifier circuit 321, respectively. The second current expansion branch KL2 is configured to conduct a connection between the second power supply terminal V− and the driver output terminal Vout based on a second amplified signal.

[0083] For example, the first current expansion branch KL1 can conduct the connection between the first power supply terminal V+ and the drive output terminal Vout under the action of the first amplified signal, and generate a drive current in the connection path between the first power supply terminal V+ and the drive output terminal Vout. The second current expansion branch KL2 can conduct the connection between the second power supply terminal V- and the drive output terminal Vout under the action of the second amplified signal, and generate a drive current in the connection path between the second power supply terminal V- and the drive output terminal Vout.

[0084] Exemplarily, as shown in Figure 1 or Figure 2, the first current expansion branch KL1 includes: a first transistor M1, the control electrode of the first transistor M1 is connected to the output end of the amplifier circuit 321, the first electrode of the first transistor M1 is connected to the first power supply end V+, and the second electrode of the first transistor M1 is connected to the drive output end Vout.

[0085] Exemplarily, as shown in Figure 1 or Figure 2, the second current expansion branch KL2 includes: a second transistor M2, the control electrode of the second transistor M2 is connected to the output end of the amplifier circuit 321, the first electrode of the second transistor M2 is connected to the second power supply end V-, and the second electrode of the second transistor M2 is connected to the drive output end Vout.

[0086] The first transistor M1 and the second transistor M2 are of opposite transistor types, which include an N-type transistor and a P-type transistor.

[0087] Exemplarily, when the voltage value of the first amplified signal is positive and the voltage value of the second amplified signal is negative, the first transistor M1 is an N-type transistor and the second transistor M2 is a P-type transistor. When the voltage value of the first amplified signal is negative and the voltage value of the second amplified signal is positive, the first transistor M1 is a P-type transistor and the second transistor M2 is an N-type transistor.

[0088] For example, the first transistor M1 and the second transistor M2 may be thin film transistors or field effect transistors, etc., which is not limited in the present disclosure.

[0089] Exemplarily, as shown in FIG. 1 or FIG. 2 , the current expansion circuit 322 may further include: a first resistor R1 connected between the second electrode of the first transistor M1 and the driving output terminal Vout.

[0090] For example, as shown in FIG. 1 or FIG. 2 , the current expansion circuit 322 may further include: a second resistor R2 connected between the second electrode of the second transistor M2 and the driving output terminal Vout.

[0091] Exemplarily, as shown in FIG. 1 or FIG. 2 , the current expansion circuit 322 may further include: a third resistor R3 connected between the output terminal of the amplifying circuit 321 and the driving output terminal Vout.

[0092] The first resistor R1 , the second resistor R2 , and the third resistor R3 are all current limiting protection resistors.

[0093] Exemplarily, as shown in Figure 1, the amplification circuit 321 includes: a first operational amplifier AMP1, the non-inverting input terminal of the first operational amplifier AMP1 is connected to the driving input terminal Vin, the inverting input terminal of the first operational amplifier AMP1 is connected to the ground potential GND, and the output terminal of the first operational amplifier AMP1 is connected to the current expansion circuit 322; a fourth resistor R4, connected between the inverting input terminal of the first operational amplifier AMP1 and the ground potential GND; and a fifth resistor R5, connected between the inverting input terminal of the first operational amplifier AMP1 and the driving output terminal Vout.

[0094] As shown in Figure 1, a drive signal is input to the non-inverting input of the first operational amplifier AMP1. The voltage of the drive signal is forward amplified by the first operational amplifier AMP1 and reaches the output of the first operational amplifier AMP1. The amplified signal is then output from the output of the first operational amplifier AMP1 to the current expansion circuit 322. Forward amplification means that the output amplified signal has the same phase as the input drive signal. The amplification factor of the first operational amplifier AMP1 is (R4+R5) / R4, and this factor can be adjusted by adjusting the resistance values ​​of the fourth resistor R4 and the fifth resistor R5.

[0095] Exemplarily, as shown in Figure 2, the amplification circuit 321 includes: a second operational amplifier AMP2, the non-inverting input terminal of the second operational amplifier AMP2 is connected to the ground potential GND, the inverting input terminal of the second operational amplifier AMP2 is connected to the driving input terminal Vin, and the output terminal of the second operational amplifier AMP2 is connected to the current expansion circuit 322; a sixth resistor R6, connected between the inverting input terminal of the second operational amplifier AMP2 and the driving input terminal Vin; and a seventh resistor R7, connected between the inverting input terminal of the second operational amplifier AMP2 and the driving output terminal Vout.

[0096] As shown in FIG2 , a driving signal is input to the inverting input terminal of the second operational amplifier AMP2. The voltage of the driving signal is reversely amplified by the second operational amplifier AMP2 and reaches the output terminal of the second operational amplifier AMP2. The amplified signal is then output from the output terminal of the second operational amplifier AMP2 to the current expansion circuit 322. Reverse amplification means that the output amplified signal has a phase opposite to that of the input driving signal.

[0097] The sixth resistor R6 and the seventh resistor R7 are feedback resistors, and the amplification factor of the second operational amplifier AMP2 is R7 / R6. The amplification factor of the second operational amplifier AMP2 is changed by adjusting the resistance values ​​of the sixth resistor R6 and the seventh resistor R7.

[0098] The voltage of the driving signal is reversely amplified by the second operational amplifier AMP2, and the feedback circuit formed by the sixth resistor R6 and the seventh resistor R7 can suppress nonlinear distortion and make the amplification factor more stable and accurate.

[0099] Illustratively, the power supply terminals V+ / V- are further connected to the amplifier circuit 321 and are also used to power the amplifier circuit 321. For example, as shown in FIG1 , the first power supply terminal V+ is connected to the positive electrode of the first operational amplifier AMP1, and the second power supply terminal V- is connected to the negative electrode of the first operational amplifier AMP1. Alternatively, as shown in FIG2 , the first power supply terminal V+ is connected to the positive electrode of the second operational amplifier AMP2, and the second power supply terminal V- is connected to the negative electrode of the second operational amplifier AMP2.

[0100] Exemplarily, as shown in FIG1 and FIG2 , the non-inverting input terminal of the first operational amplifier AMP1 or the second operational amplifier AMP2 is further connected to the ground potential GND via the resistor R0 .

[0101] Exemplarily, the frequency of the driving signal is the resonance frequency of the touch substrate 311 .

[0102] Exemplarily, the driving signal is a high-frequency signal, and the frequency of the driving signal (ie, the driving frequency) is greater than or equal to 5 KHz or 20 kHz, and less than or equal to 50 KHz.

[0103] It should be noted that the driving signal may also be a low-frequency signal, for example, the frequency of the driving signal is greater than or equal to 50 Hz and less than or equal to 500 Hz.

[0104] Exemplarily, the voltage value of the driving signal is greater than or equal to -10V and less than or equal to 10V; or the voltage value of the driving signal is greater than or equal to 0V and less than or equal to 20V.

[0105] The inventors tested the output signal of the tactile driving circuit 32 shown in Figure 1, and the test results are shown in Figure 4. When the input driving signal frequency is 10KHz and the waveform is a square wave, the waveform output by the driving output terminal Vout is shown in Figure 4a. When the input driving signal frequency is 25KHz and the waveform is a sine wave, the waveform output by the driving output terminal Vout is shown in Figure 4b. When the input driving signal frequency is 49.5KHz and the waveform is a triangle wave, the waveform output by the driving output terminal Vout is shown in Figure 4c. It can be seen from Figure 4 that the waveform output by the driving output terminal Vout is not distorted and can drive the actuator 312. It should be noted that the capacitance value of the actuator 312 used in the test shown in Figure 4 is 50nF.

[0106] The present disclosure provides a tactile driving circuit board, as shown in Figure 5, Figure 7, Figure 9 or Figure 11, the tactile driving circuit board includes: a base substrate 51, and at least one tactile driving circuit 32 provided in any embodiment, and the tactile driving circuit 32 is arranged on the first surface S1 of the base substrate 51.

[0107] Those skilled in the art will appreciate that the haptic driver circuit board provided in the present disclosure has the advantages of the aforementioned haptic driver circuit 32. The haptic driver circuit board provided in the present disclosure can be integrated into electronic products such as vehicle displays, mobile phones, wearable devices, notebooks, and monitors, providing users with a rich and realistic tactile experience.

[0108] Exemplarily, as shown in Figures 5, 7, 9 or 11, a driving input terminal Vin and a driving output terminal Vout are also provided on the first surface S1, the driving input terminal Vin and the driving output terminal Vout are located on different sides of the amplifier circuit 321, and the current expansion circuit 322 is located on the side of the amplifier circuit 321 close to the driving output terminal Vout.

[0109] As shown in FIG. 5 , FIG. 7 , FIG. 9 or FIG. 11 , the driving input terminal Vin is located on the left side of the amplifying circuit 321 , and the driving output terminal Vout is located on the right side of the amplifying circuit 321 .

[0110] 5 , 7 , 9 or 11 , the first surface S1 includes a first side a1 and a second side a2 oppositely arranged along a first direction f1 , the driving input terminal Vin is arranged close to the first side a1 , and the driving output terminal Vout is arranged close to the second side a2 .

[0111] Exemplarily, as shown in FIG. 5 , FIG. 7 or FIG. 11 , the current expansion circuit 322 is located between the amplifying circuit 321 and the driving output terminal Vout.

[0112] Exemplarily, as shown in FIG9 , the current expansion circuit 322 is disposed side by side with the driving output terminal Vout and close to the second side a2 .

[0113] Exemplarily, as shown in FIG5 , FIG7 , FIG9 or FIG11 , a power supply terminal V+ / V− is further provided on the first surface S1 , and the driving input terminal Vin and the power supply terminal V+ / V− are arranged side by side close to the first side a1 .

[0114] For example, as shown in FIG1 or FIG2 , the power supply terminal V+ / V- includes a first power supply terminal V+ and a second power supply terminal V-, and the current expansion circuit 322 includes a first current expansion branch KL1 and a second current expansion branch KL2. The first current expansion branch KL1 is respectively connected to the first power supply terminal V+, the driver output terminal Vout, and the output terminal of the amplifier circuit 321, and the second current expansion branch KL2 is respectively connected to the second power supply terminal V-, the driver output terminal Vout, and the output terminal of the amplifier circuit 321. As shown in FIG5 , FIG7 , FIG9 , or FIG11 , the first current expansion branch KL1 and the second current expansion branch KL2 are arranged along a second direction f2 on the first surface S1, and the second direction f2 is perpendicular to the first direction f1.

[0115] In a specific implementation, there may be multiple ways to package the current expansion circuit 322 on the base substrate 51 , and different packaging methods correspond to different heat dissipation structures, which are exemplarily described below.

[0116] In the first example, as shown in FIG. 5 or FIG. 7 , the current expansion circuit 322 is packaged on the substrate 51 in a through-hole packaging manner, that is, the current expansion circuit 322 is a through-hole component.

[0117] Exemplarily, one or more of the components disposed on the first surface S1 , such as the amplifier circuit 321 , the power supply terminal V+ / V−, the driving input terminal Vin, the driving output terminal Vout, and the capacitor C, are all through-hole components.

[0118] Exemplarily, the pads of the through-hole components pass through the base substrate 51 , for example, may pass through from the first surface S1 (ie, the top layer) and be soldered on the lower layer of the base substrate 51 .

[0119] Exemplarily, the base substrate 51 is made of, for example, an epoxy board FR-4, and the thickness of the epoxy board FR-4 is, for example, greater than or equal to 1 mm and less than or equal to 2 mm.

[0120] It should be noted that the haptic drive circuit board shown in Figure 5 includes the haptic drive circuit shown in Figure 1, and Figure 6 shows a top view and a side view of the haptic drive circuit board shown in Figure 5. The haptic drive circuit board shown in Figure 7 includes the haptic drive circuit shown in Figure 2, and Figure 8 shows a top view of the haptic drive circuit board shown in Figure 7.

[0121] Exemplarily, as shown in FIG6 or FIG7, the tactile driving circuit board further includes: at least one first heat sink SR1, the first heat sink SR1 is arranged on the first surface S1 of the base substrate 51, the first heat sink SR1 includes a first heat dissipation plate SR11, and a plurality of first heat dissipation fins SR12 arranged parallel to one side of the first heat dissipation plate SR11, two adjacent first heat dissipation fins SR12 are separated from each other to form a heat dissipation air duct, and the surface of the first heat dissipation plate SR11 facing away from the first heat dissipation fin SR12 is tightly fitted with the current expansion circuit 322.

[0122] Exemplarily, as shown in FIG6 or FIG7, the tactile driving circuit board includes two first heat sinks SR1, one first heat sink SR1 is tightly fitted with the first current expansion branch KL1 (such as the first transistor M1), and the other first heat sink SR1 is tightly fitted with the second current expansion branch KL2 (such as the second transistor M2).

[0123] Exemplarily, as shown in FIG6 b , the plurality of first heat sinks SR12 in the first heat sink SR1 are arranged along the normal direction fr of the first surface S1 .

[0124] Exemplarily, as shown in a in Figure 6, the tactile driving circuit board also includes: at least one first fan FAN1, the first fan FAN1 is arranged on the first side and / or second side of at least one first radiator SR1, the first side and the second side are two sides arranged opposite to each other along a third direction f3, and the third direction f3 is parallel to the first surface S1 and the surface of the first heat sink SR11 facing the first heat sink SR12.

[0125] In this way, by arranging the first fan FAN1 on the first side and / or the second side of the first heat sink SR1 , air in the heat dissipation duct of the first heat sink SR11 can flow, and at the same time, heat generated by the current expansion circuit 322 can be taken away.

[0126] 6 , the haptic driving circuit board includes two first fans FAN1 , and the two first fans FAN1 are oppositely arranged on both sides of the two first heat sinks SR1 along a third direction f3 , which is parallel to the second direction f2 .

[0127] Exemplarily, as shown in Figure 7, the multiple first heat sinks SR12 in the first heat sink SR1 are arranged along the third direction f3, the third direction f3 is parallel to the first surface S1 and the surface of the first heat sink SR11 facing the first heat sink SR12, and an opening HL is provided on the base substrate 51, and the opening HL is interconnected with the heat dissipation duct of the first heat sink SR1.

[0128] For example, as shown in FIG8 , the haptic driver circuit board further includes at least one second fan FAN2 , which is disposed on a third side and / or a fourth side of the first heat sink SR1 , where the third side and the fourth side are two opposite sides disposed along the normal direction fr of the first surface S1 . The third side is, for example, a side of the first heat sink SR1 facing away from the base substrate 51 , and the fourth side is a side of the base substrate 51 facing away from the first surface S1 .

[0129] In this way, by arranging the second fan FAN2 on the third side and / or the fourth side of the first heat sink SR1, the air in the heat dissipation duct of the first heat sink SR11 can flow and take away the heat generated by the current expansion circuit 322.

[0130] In FIG8 , the tactile driving circuit board includes two second fans FAN2 , and the two second fans FAN2 are both arranged on the third side of the first radiator SR1 , that is, the two second fans FAN2 are arranged on the side of the two first radiators SR1 away from the base substrate 51 , and the second fans FAN2 are arranged in a one-to-one correspondence with the first radiators SR1 .

[0131] In the second example, as shown in FIG9 , the current expansion circuit 322 is packaged on the base substrate 51 in a surface-mount packaging manner, that is, the current expansion circuit 322 is a surface-mount component.

[0132] Exemplarily, one or more of the components disposed on the first surface S1 , such as the amplifier circuit 321 , the power supply terminal V+ / V−, the driving input terminal Vin, the driving output terminal Vout, and the capacitor C, are surface-mount components.

[0133] Exemplarily, the pads of the surface-mount components are only attached to the first surface S1 of the base substrate 51 , and soldering is performed between the first surface S1 and the surface-mount components.

[0134] 10 shows a side view of the haptic driving circuit board shown in FIG. 9 .

[0135] Exemplarily, as shown in Figure 10, the base substrate 51 includes a metal substrate 101, an insulating layer 102 and a circuit layer 103 stacked in sequence, wherein the metal substrate 101 is, for example, a single-layer aluminum substrate, the circuit layer 103 is, for example, a copper foil layer, the connecting lines between the interconnected surface-mount components are arranged on the circuit layer 103, and the surface-mount components are arranged on the side of the circuit layer 103 away from the metal substrate 101.

[0136] For example, as shown in FIG10 , the haptic driver circuit board further includes a second heat sink SR2 disposed on a surface of the base substrate 51 facing away from the current expansion circuit 322. The second heat sink SR2 includes a second heat dissipation plate SR21 and a plurality of second heat dissipation fins SR22 disposed parallel to the second heat dissipation plate SR21 and facing away from the base substrate 51. Adjacent second heat dissipation fins SR22 are spaced apart from each other to form a heat dissipation duct. The surface of the second heat dissipation plate SR21 facing away from the second heat dissipation fins SR22 is in close contact with the base substrate 51.

[0137] Exemplarily, as shown in FIG10 , the haptic driving circuit board further includes: a third fan FAN3 , which is disposed on a side of the second heat sink SR2 away from the base substrate 51 .

[0138] Exemplarily, the haptic driving circuit board may include one haptic driving circuit 32 (as shown in FIG. 5 , FIG. 7 , or FIG. 9 ), or may include multiple haptic driving circuits 32 (as shown in FIG. 11 , four).

[0139] Exemplarily, as shown in FIG11 , a plurality of haptic driving circuits 32 are arranged in an array on the first surface S1 , and different haptic driving circuits 32 are connected to different driving input terminals Vin and different driving output terminals Vout.

[0140] By configuring different tactile driving circuits 32 to connect different driving input terminals Vin and different driving output terminals Vout, the tactile driving circuits 32 are independent of each other, and different tactile driving circuits 32 can output different signals.

[0141] Exemplarily, as shown in FIG11 , the first surface S1 includes a first side a1 and a third side a3 adjacent to each other, and a plurality of tactile driving circuits 32 are arranged in an array along the extending direction of the first side a1 and the extending direction of the third side a3 .

[0142] In FIG. 11 , the first side a1 extends in the second direction f2 , and the third side a3 extends in the first direction f1 , that is, the plurality of haptic driving circuits 32 are arranged in an array along the first direction f1 and the second direction f2 .

[0143] Exemplarily, as shown in FIG11 , the tactile driving circuit 32 includes four tactile driving circuits 32 , namely a first tactile driving circuit 32A, a second tactile driving circuit 32B, a third tactile driving circuit 32C and a fourth tactile driving circuit 32D, and the four tactile driving circuits 32 are arranged in two rows and two columns.

[0144] As shown in FIG11 , the four haptic driving circuits 32 are connected to four driving input terminals Vin and four driving output terminals Vout in a one-to-one correspondence. The driving input terminal Vin connected to the first haptic driving circuit 32A is the first driving input terminal Vin1, and the driving output terminal Vout connected to the first haptic driving circuit 32A is the first driving output terminal Vout1. The driving input terminal Vin connected to the second haptic driving circuit 32B is the second driving input terminal Vin2, and the driving output terminal Vout connected to the second haptic driving circuit 32B is the second driving output terminal Vout2. The driving input terminal Vin connected to the third haptic driving circuit 32C is the third driving input terminal Vin3, and the driving output terminal Vout connected to the third haptic driving circuit 32C is the third driving output terminal Vout3. The driving input terminal Vin connected to the fourth haptic driving circuit 32D is the fourth driving input terminal Vin4, and the driving output terminal Vout connected to the fourth haptic driving circuit 32D is the fourth driving output terminal Vout4.

[0145] In a specific implementation, the driving currents output by different tactile driving circuits 32 can be used to excite different actuators 312 , and of course can also excite the same actuator 312 , which is not limited in this disclosure.

[0146] For example, as shown in FIG11 , the haptic driver circuit board further includes a power module DY connected to the power supply terminals V+ / V- and configured to generate a second voltage signal based on a first voltage signal provided by the power supply terminals V+ / V-, and output the second voltage signal to a signal generator. The signal generator is configured to provide a drive signal to the drive input terminal Vin. The voltage amplitude of the second voltage signal is smaller than the voltage amplitude of the first voltage signal. In other words, the power module DY is configured to supply power to the signal generator.

[0147] For example, as shown in Figure 11, power module DY includes a voltage generating unit DY1 and a voltage output terminal DY2. Voltage generating unit DY1 is connected to power supply terminals V+ / V- and voltage output terminal DY2, respectively, and is configured to generate a second voltage signal based on a first voltage signal provided by power supply terminals V+ / V-. The second voltage signal has a voltage amplitude of, for example, 3.3V, 5V, or 12V. Voltage output terminal DY2 is configured to connect to a signal generator and output the second voltage signal to the signal generator. Voltage output terminal DY2 is, for example, an electrical connector or connector.

[0148] Figure 12 shows a top view of the haptic driver circuit board shown in Figure 11. As shown in Figure 12, the haptic driver circuit board includes eight first heat sinks SR1, with each haptic driver circuit 32 equipped with two first heat sinks SR1. For each haptic driver circuit 32, the first current expansion branch KL1 is closely attached to one first heat sink SR1, and the second current expansion branch KL2 is closely attached to another first heat sink SR1.

[0149] Exemplarily, similar to the first radiator SR1 shown in Figure 6, the multiple first heat sinks SR12 in the first radiator SR1 shown in Figure 12 are arranged along the normal direction of the first surface S1. As shown in Figure 12, four first fans FAN1 can be set on the first surface S1, wherein two first fans FAN1 are relatively arranged on both sides of the four first radiators SR1 on the left along the third direction f3, and the other two first fans FAN1 are relatively arranged on both sides of the four first radiators SR1 on the right along the third direction f3. The third direction f3 is, for example, parallel to the second direction f2.

[0150] The present disclosure provides a tactile feedback device, as shown in FIG3 , including: a tactile feedback substrate 31 including a touch substrate 311 and an actuator 312 connected to the touch substrate 311 ; and a tactile driving circuit 32 as provided in any embodiment.

[0151] Those skilled in the art will appreciate that the tactile feedback device provided by the present disclosure has the advantages of the above-mentioned tactile drive circuit 32. The tactile feedback device provided by the present disclosure can be integrated into products such as vehicle displays, mobile phones, wearable devices, notebooks, and monitors to provide users with a rich and realistic tactile experience.

[0152] Illustratively, the actuator 312 includes at least one of the following: a PZT piezoelectric film, a monolithic piezoelectric ceramic, a stacked piezoelectric ceramic, a cymbal-type piezoelectric ceramic, a monolithic polyvinylidene fluoride film, a stacked polyvinylidene fluoride film, a cymbal-type polyvinylidene fluoride film, and a linear motor.

[0153] Exemplarily, the touch substrate 311 is a touch display panel.

[0154] Exemplarily, a touch display panel includes a touch circuit and a display panel. The touch circuit may be integrated within the display panel or may be provided independently of the display panel. The touch circuit may be a capacitive touch circuit or a resistive touch circuit.

[0155] The present disclosure provides a tactile feedback device, as shown in FIG3 , including: a tactile feedback substrate 31 including a touch substrate 311 and an actuator 312 connected to the touch substrate 311 ; and a tactile driving circuit board as provided in any embodiment.

[0156] Those skilled in the art will appreciate that the tactile feedback device provided by the present disclosure has the advantages of the above-mentioned tactile driver circuit board. The tactile feedback device provided by the present disclosure can be integrated into products such as car displays, notebooks, and monitors to provide users with a rich and realistic tactile experience.

[0157] Illustratively, the actuator 312 includes at least one of the following: a PZT piezoelectric film, a monolithic piezoelectric ceramic, a stacked piezoelectric ceramic, a cymbal-type piezoelectric ceramic, a monolithic polyvinylidene fluoride film, a stacked polyvinylidene fluoride film, a cymbal-type polyvinylidene fluoride film, and a linear motor.

[0158] Exemplarily, the touch substrate 311 is a touch display panel.

[0159] Exemplarily, a touch display panel includes a touch circuit and a display panel. The touch circuit may be integrated within the display panel or may be provided independently of the display panel. The touch circuit may be a capacitive touch circuit or a resistive touch circuit.

[0160] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure.

[0161] In this disclosure, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0162] In this specification, the terms "electrically connected" and "coupled" include components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0163] In this disclosure, "plurality" means two or more, and "at least one" means one or more, unless otherwise specifically defined. "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C," and both include the following combinations of A, B, and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C. "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0164] The use of "for" or "configured to" in this disclosure is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0165] As used in this disclosure, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0166] As used in this disclosure, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, where the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, a deviation within 10° or 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within 10° or 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute equality and approximate flushness, where the acceptable deviation range for approximate flushness can be, for example, that the distance between the two being flush is less than or equal to 5% of either one's size.

[0167] It will be understood that when a layer or element is referred to as being disposed on one side of another layer or substrate, the layer or element may be directly disposed on the other layer or substrate, or an intervening layer may be present between the layer or element and the other layer or substrate.

[0168] The present disclosure describes exemplary embodiments with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown in this disclosure, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A tactile drive circuit, applied to a tactile feedback substrate, the tactile feedback substrate comprising a touch substrate and an actuator connected to the touch substrate, the tactile drive circuit comprising: an amplifier circuit, connected to the driving input terminal, and used to amplify the driving signal inputted from the driving input terminal; as well as The current expansion circuit is respectively connected to the power supply terminal, the drive output terminal and the output terminal of the amplifier circuit. The drive output terminal is also used to connect to the actuator. The current expansion circuit is used to conduct the connection between the power supply terminal and the drive output terminal according to the signal output by the amplifier circuit, and generate a drive current on the connection path. The drive current is used to drive the actuator to vibrate.

2. The haptic drive circuit according to claim 1, wherein: The signal output by the amplifier circuit includes a first amplified signal and a second amplified signal with opposite phases, the power supply end includes a first power supply end and a second power supply end, and the current expansion circuit includes: a first current expansion branch, connected to the first power supply terminal, the driving output terminal and the output terminal of the amplifier circuit respectively, and configured to conduct the connection between the first power supply terminal and the driving output terminal according to the first amplified signal; and The second current expansion branch is respectively connected to the second power supply terminal, the drive output terminal and the output terminal of the amplifier circuit, and is used to conduct the connection between the second power supply terminal and the drive output terminal according to the second amplified signal.

3. The haptic drive circuit according to claim 2, wherein: The first current expansion branch includes: a first transistor, a control electrode of the first transistor is connected to the output end of the amplifier circuit, a first electrode of the first transistor is connected to the first power supply end, and a second electrode of the first transistor is connected to the drive output end; The second current expansion branch includes: a second transistor, a control electrode of the second transistor is connected to the output end of the amplifier circuit, a first electrode of the second transistor is connected to the second power supply end, and a second electrode of the second transistor is connected to the drive output end; The transistor types of the first transistor and the second transistor are opposite, and the transistor types include an N-type transistor and a P-type transistor.

4. The haptic drive circuit according to claim 3, wherein: The current expansion circuit further includes at least one of the following: A first resistor, connected between the second electrode of the first transistor and the driving output terminal; A second resistor connected between the second electrode of the second transistor and the driving output terminal; as well as The third resistor is connected between the output end of the amplifier circuit and the driving output end.

5. The haptic drive circuit according to claim 1, wherein: The amplifying circuit comprises: a first operational amplifier, wherein a non-inverting input terminal of the first operational amplifier is connected to the driving input terminal, an inverting input terminal of the first operational amplifier is connected to a ground potential, and an output terminal of the first operational amplifier is connected to the current expansion circuit; a fourth resistor connected between the inverting input terminal of the first operational amplifier and the ground potential; and A fifth resistor is connected between the inverting input terminal of the first operational amplifier and the driving output terminal.

6. The haptic driving circuit according to claim 1, wherein: The amplifying circuit comprises: a second operational amplifier, wherein a non-inverting input terminal of the second operational amplifier is connected to a ground potential, an inverting input terminal of the second operational amplifier is connected to the driving input terminal, and an output terminal of the second operational amplifier is connected to the current expansion circuit; a sixth resistor connected between the inverting input terminal of the second operational amplifier and the driving input terminal; and A seventh resistor is connected between the inverting input terminal of the second operational amplifier and the driving output terminal.

7. The haptic drive circuit according to any one of claims 1 to 6, wherein: The frequency of the driving signal is greater than or equal to 5 KHz and less than or equal to 50 KHz.

8. A tactile drive circuit board, comprising: A substrate, and at least one haptic drive circuit according to any one of claims 1 to 7, wherein the haptic drive circuit is arranged on a first surface of the substrate.

9. The haptic driving circuit board according to claim 8, wherein: The driving input terminal and the driving output terminal are also arranged on the first surface. The driving input terminal and the driving output terminal are located on different sides of the amplifying circuit, and the current expansion circuit is located on a side of the amplifying circuit close to the driving output terminal.

10. The haptic driving circuit board according to claim 9, wherein: The power supply terminal is also arranged on the first surface, and the first surface includes a first side edge and a second side edge arranged opposite to each other along a first direction, the driving input terminal and the power supply terminal are arranged side by side close to the first side edge, and the driving output terminal is arranged close to the second side edge.

11. The haptic driving circuit board according to claim 10, wherein: The power supply end includes a first power supply end and a second power supply end, the current expansion circuit includes a first current expansion branch and a second current expansion branch, the first current expansion branch is respectively connected to the first power supply end, the drive output end and the output end of the amplifier circuit, and the second current expansion branch is respectively connected to the second power supply end, the drive output end and the output end of the amplifier circuit; and The first flow expansion branch and the second flow expansion branch are arranged on the first surface along a second direction, and the second direction is perpendicular to the first direction.

12. The haptic driving circuit board according to claim 8, wherein: The packaging method of the current expansion circuit on the substrate is direct plug-in packaging.

13. The haptic driving circuit board according to claim 12, wherein: The tactile drive circuit board also includes: At least one first heat sink is arranged on the first surface of the substrate, the first heat sink includes a first heat sink and a plurality of first heat sinks arranged parallel to one side of the first heat sink, two adjacent first heat sinks are separated from each other to form a heat dissipation duct, and the surface of the first heat sink facing away from the first heat sink is tightly attached to the current expansion circuit.

14. The haptic driving circuit board according to claim 13, wherein: The plurality of first heat sinks are arranged along a normal direction of the first surface; The tactile driving circuit board also includes: at least one first fan, which is arranged on a first side and / or a second side of at least one of the first heat sinks, and the first side and the second side are two sides arranged opposite to each other along a third direction, and the third direction is parallel to the first surface and the surface of the first heat sink facing the first heat sink.

15. The haptic driving circuit board according to claim 13, wherein: The plurality of first heat sinks are arranged along a third direction, the third direction is parallel to the first surface and the surface of the first heat sink facing the first heat sink, the substrate is provided with an opening, and the opening is communicated with the heat dissipation duct of the first heat sink; The haptic driving circuit board further includes: at least one second fan, which is disposed on a third side and / or a fourth side of the first heat sink, and the third side and the fourth side are two sides disposed opposite to each other along a normal direction of the first surface.

16. The haptic driving circuit board according to claim 8, wherein: The packaging method of the current expansion circuit on the substrate is surface mount packaging.

17. The haptic driving circuit board according to claim 16, wherein: The tactile drive circuit board also includes: a second heat sink, arranged on a surface of the substrate away from the current expansion circuit, the second heat sink comprising a second heat sink plate, and a plurality of second heat sink fins arranged in parallel on a side of the second heat sink away from the substrate, and two adjacent second heat sink fins are separated from each other to form a heat dissipation duct; and The third fan is arranged on a side of the second heat sink away from the substrate.

18. The haptic drive circuit board according to any one of claims 8 to 17, wherein: The tactile driving circuit board includes a plurality of the tactile driving circuits, which are arranged in an array on the first surface, and different tactile driving circuits are connected to different driving input terminals and different driving output terminals.

19. The haptic driving circuit board according to claim 18, wherein: The first surface includes a first side edge and a third side edge that are adjacent to each other, and the plurality of driving units are arranged in an array along an extension direction of the first side edge and an extension direction of the third side edge, respectively.

20. The haptic driving circuit board according to claim 18, wherein: The tactile drive circuit board also includes: A power supply module is connected to the power supply end, and is used to generate a second voltage signal according to the first voltage signal provided by the power supply end, and output the second voltage signal to a signal generator, and the signal generator is used to provide the drive signal to the drive input end, and the voltage amplitude of the second voltage signal is smaller than the voltage amplitude of the first voltage signal.

21. A tactile feedback device, comprising: A tactile feedback substrate, comprising a touch substrate and an actuator connected to the touch substrate; as well as The tactile drive circuit according to any one of claims 1 to 7, or the tactile drive circuit board according to any one of claims 8 to 20.

22. The tactile feedback device according to claim 21, wherein The actuator includes at least one of the following: a PZT piezoelectric film, a monolithic piezoelectric ceramic, a stacked piezoelectric ceramic, a cymbal-type piezoelectric ceramic, a monolithic polyvinylidene fluoride film, a stacked polyvinylidene fluoride film, a cymbal-type polyvinylidene fluoride film, and a linear motor.

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