Oxygen sensor chip assembly module and oxygen sensor assembly equipment

Abstract

The invention discloses an oxygen sensor chip assembling module and oxygen sensor assembling equipment. The oxygen sensor chip assembling module comprises a conveying module and an oxygen sensor chip feeding module; the conveying module comprises a plurality of jigs moving in the conveying direction, and the jigs are suitable for bearing oxygen sensor bases; the oxygen sensor chip feeding module comprises a guide mechanism, the guide mechanism is matched with one of the jigs, the guide mechanism comprises a guide support and a positioning clamping jaw which is connected to the guide support and can be opened and closed, the guide support is provided with a guide hole, and an oxygen sensor chip can penetrate through the guide hole; the positioning clamping jaw is suitable for clamping and positioning an oxygen sensor base; a guide hole, a positioning clamping jaw and a jig are sequentially arranged in the vertical direction. The guide mechanism is arranged, and the positioning clamping jaw of the guide mechanism is matched with the guide hole, so that the relative positions of the oxygen sensor chip and the oxygen sensor base are fixed, and the assembly precision of the oxygen sensor chip and the oxygen sensor base is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of oxygen sensor production equipment, and in particular to an oxygen sensor chip assembly module and oxygen sensor assembly equipment. Background Art

[0002] In the related art, during the manufacturing process of the oxygen sensor, the oxygen sensor chip, the oxygen sensor mounting part and the oxygen sensor base need to be assembled. During the assembly process, the moving positioning accuracy of the oxygen sensor base and the oxygen sensor chip is required to be extremely high, which leads to the problem of assembly difficulty. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an oxygen sensor chip assembly module and an oxygen sensor assembly device, which can clamp and position the oxygen sensor base and the oxygen sensor to-be-installed component as a whole through a positioning clamp, and set a guide hole fixed relatively to the positioning clamp for guiding the oxygen sensor chip, so as to ensure accurate positioning of the oxygen sensor chip, the oxygen sensor to-be-installed component and the oxygen sensor base, and efficient assembly.

[0004] On the one hand, an embodiment of the present invention provides an oxygen sensor chip assembly module for producing an oxygen sensor, wherein the oxygen sensor includes an oxygen sensor base and an oxygen sensor chip, including: A conveying module, comprising a plurality of jigs moving along a conveying direction, wherein the jigs are suitable for carrying the oxygen sensor base; The oxygen sensor chip loading module includes a guiding mechanism, which is adapted to one of the several jigs. The guiding mechanism includes a guiding bracket and a positioning clamp connected to the guiding bracket and capable of opening and closing. The guiding bracket is provided with a guiding hole, which is suitable for the oxygen sensor chip to pass through; the positioning clamp is suitable for clamping and positioning the oxygen sensor base; along the vertical direction, the guiding hole, the positioning clamp and the jig are arranged in sequence.

[0005] According to some embodiments of the present invention, the guiding bracket includes a guiding movable module and two guiding clamping arms, the two guiding clamping arms are suitable for independently moving along a first direction under the drive of the guiding movable module, and the two guiding clamping arms can be combined and surrounded to form the guiding hole.

[0006] According to some embodiments of the present invention, the fixture includes a loading base and a chip adjustment mechanism, the loading base is provided with a loading through hole, the chip adjustment mechanism includes a chip adjustment plate, the chip adjustment plate is provided in the loading through hole and can telescopically move along the axis of the loading through hole.

[0007] According to some embodiments of the present invention, the oxygen sensor chip assembly module also includes a chip height adjustment mechanism, which is adapted to one of the several jigs, and the chip height adjustment mechanism includes an adjustment rod and an adjustment drive assembly, and the adjustment rod is suitable for being connected to the chip adjustment plate under the drive of the adjustment drive assembly, and driving the chip adjustment plate to perform telescopic movement.

[0008] According to some embodiments of the present invention, one of the chip adjustment sheet and the adjustment rod is provided with a limiting groove, and the other is provided with an inserting portion matched with the limiting groove.

[0009] According to some embodiments of the present invention, the chip adjustment piece is provided with a first limiting portion and a second limiting portion, and the first limiting portion and the second limiting portion are sequentially arranged along the extension and contraction direction of the chip adjustment piece; The loading base is provided with an elastic limiting pin, and the elastic head of the elastic limiting pin is suitable for cooperating with the first limiting portion or the second limiting portion to limit the position.

[0010] According to some embodiments of the present invention, the loading base further comprises an elastically retractable plug connector, the chip adjustment sheet is provided with a plug connector slot corresponding to the plug connector, and the plug connector slot is located between the first limiting portion and the second limiting portion; The plug-in slot is provided with a stop surface and a guide surface which are arranged in sequence along the extension and retraction direction of the chip adjustment piece, the stop surface is perpendicular to the extension and retraction direction, the guide surface is arranged at an angle to the extension and retraction direction, the plug-in connector can move and retract along the guide surface, and the stop surface can abut against the plug-in connector to limit the position.

[0011] According to some embodiments of the present invention, the fixture also includes a base positioning block, which is fixed to one side of the axis of the loading base, and the base positioning block is provided with a base positioning groove, the opening of the base positioning groove faces the axis of the loading base, and the base positioning groove is suitable for cooperating with the oxygen sensor base to limit the position.

[0012] According to some embodiments of the present invention, the conveying module also includes a plurality of positioning mechanisms, wherein the positioning mechanisms are fixed to one side of the jig, the positioning mechanisms include a positioning push rod and a push rod driving component, and the jig is provided with a jig positioning groove that cooperates with the positioning push rod, and the positioning push rod is suitable for being cooperated and fixed with the jig positioning groove under the drive of the push rod driving component.

[0013] On the other hand, the present invention further provides an oxygen sensor assembly device, comprising the oxygen sensor chip assembly module as described above.

[0014] The embodiments of the present invention have at least the following beneficial effects: by providing a guide mechanism, the positioning claws of the guide mechanism cooperate with the guide holes to fix the relative positions of the oxygen sensor chip and the oxygen sensor base, thereby ensuring the assembly accuracy between the two. There is no need to provide a high-precision mobile conveying module conveying fixture or a conveying mechanism to convey the oxygen sensor chip, and there is no need to provide a high-precision match between the oxygen sensor base and the fixture, or a high-precision clamping between the conveying mechanism and the oxygen sensor chip. This greatly reduces the manufacturing cost of the oxygen sensor chip assembly module and effectively improves the efficiency and yield of oxygen sensor assembly.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 This is a structural schematic diagram of an oxygen sensor chip assembly module according to an embodiment of the present invention; Figure 2 for Figure 1 A magnified view of the part A in the middle; Figure 3 A top view of a fixture and an oxygen sensor according to an embodiment of the present invention; Figure 4 for Figure 3 A cross-sectional view along section line BB; Figure 5 It is a schematic diagram of assembling a jig and a chip height adjustment mechanism according to an embodiment of the present invention; Figure 6 This is a top view of an oxygen sensor assembly device according to an embodiment of the present invention.

[0017] Reference numerals: 400, conveying module; 410, fixture; 411, fixture positioning groove; 412, loading base; 4121, loading through hole; 4122, elastic limiting pin; 4123, plug connector; 413, chip adjustment mechanism; 4131, chip adjustment sheet; 41311, limiting groove; 41312, first limiting portion; 41313, second limiting portion; 41314, plug-in groove; 41315, stop surface; 41316, guide surface; 414, base positioning block; 4141, base positioning groove; 440, positioning mechanism; 441, positioning ejector pin; 442, ejector pin driving member; 470, chip height adjustment mechanism; 471, adjustment rod; 4711, plug-in portion; 472, adjustment drive assembly; 100, oxygen sensor chip loading module; 130, guiding mechanism; 131, guiding bracket; 1311, guiding hole; 1312, guiding moving module; 1313, guiding clamping arm; 132, positioning clamping claw; 910. Oxygen sensor chip; 920. Oxygen sensor base; 930. Oxygen sensor mounting parts. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, "several" means one or more, "multiple" means more than two, greater than, less than, and exceeding are understood as not including the number itself, and "above", "below", and "within" are understood as including the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation” and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention based on the specific content of the technical solution.

[0022] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 6As shown, on the one hand, an embodiment of the present invention provides an oxygen sensor chip assembly module for producing an oxygen sensor, wherein the oxygen sensor includes an oxygen sensor base 920, an oxygen sensor to-be-mounted component 930, and an oxygen sensor chip 910, and the oxygen sensor chip assembly module includes a conveying module 400 and an oxygen sensor chip loading module 100; the conveying module 400 includes a plurality of jigs 410 moving along a conveying direction (in the figure, the X direction), and the jigs 410 are suitable for carrying the oxygen sensor base 920; the oxygen sensor chip loading module 100 includes a guiding mechanism 130, which is adapted to one of the plurality of fixtures 410. The guiding mechanism 130 includes a guiding bracket 131 and a positioning jaw 132 connected to the guiding bracket 131 and capable of opening and closing. The guiding bracket 131 is provided with a guiding hole 1311, and the guiding hole 1311 is suitable for the oxygen sensor chip 910 to pass through; the positioning jaw 132 is suitable for clamping and positioning the oxygen sensor base 920; along the vertical direction, the guiding hole 1311, the positioning jaw 132 and the fixture 410 are sequentially arranged.

[0023] It should be noted that in the related art, during the manufacturing process of the oxygen sensor, the oxygen sensor chip 910, the oxygen sensor mounting part 930 and the oxygen sensor base 920 need to be assembled. Usually, the oxygen sensor chip 910 is directly moved to the top of the jig 410 by a conveying mechanism and assembled with the oxygen sensor base 920 carried by the jig 410. In order to ensure the efficiency of the assembly process, this technical solution has high requirements on the movement accuracy of the conveying mechanism and the jig 410, as well as the clamping accuracy of the conveying mechanism and the oxygen sensor chip 910 or the placement accuracy of the oxygen sensor base 920 on the jig 410. There are problems of high precision requirements, high cost and low assembly efficiency.

[0024] According to the oxygen sensor chip assembly module of the embodiment of the present invention, the jig 410 transports the oxygen sensor base 920 along the conveying direction, assembles other components except the oxygen sensor chip 910 (such as the oxygen sensor to-be-installed part 930) during the conveying process, and then moves to the bottom of the oxygen sensor chip loading module 100, and the oxygen sensor base 920 is clamped by the positioning claw 132 of the guiding mechanism 130, so that the oxygen sensor base 920 and the oxygen sensor to-be-installed part 930 are adjusted as a whole to correspond to the guiding hole 1311, and the oxygen sensor chip 910 is guided by the guiding hole 1311 and assembled with the oxygen sensor base 920 and the oxygen sensor to-be-installed part 930.

[0025] According to the oxygen sensor chip assembly module of the embodiment of the present invention, by setting the guiding mechanism 130, the positioning claws 132 of the guiding mechanism 130 cooperate with the guiding hole 1311 to fix the relative positions of the oxygen sensor chip 910 and the oxygen sensor base 920, thereby ensuring the assembly accuracy between the two. There is no need to set up a high-precision mobile conveying module 400 to convey the jig 410 or a transport mechanism to transport the oxygen sensor chip 910, and there is no need to set up high-precision cooperation between the oxygen sensor base 920 and the jig 410, or high-precision clamping between the transport mechanism and the oxygen sensor chip 910, which greatly reduces the manufacturing cost of the oxygen sensor chip assembly module and effectively improves the efficiency and yield rate of oxygen sensor assembly.

[0026] In some embodiments, in combination Figure 1 and Figure 2 As shown, the guide bracket 131 includes a guide moving module 1312 and two guide clamping arms 1313. The two guide clamping arms 1313 are suitable for independently moving along a first direction (in the Y direction shown in the figure) under the drive of the guide moving module 1312. The two guide clamping arms 1313 can be aligned and surrounded to form a guide hole 1311. The two aligned guide clamping arms 1313 can adapt to oxygen sensor chips 910 of different sizes by adjusting the distance between them; and the two guide clamping arms 1313 can move independently along the first direction, that is, the guide hole 1311 formed by the two guide clamping arms 1313 can also move along the first direction to adapt to the oxygen sensor chip 910 and different types of oxygen sensor bases 920 (the position of the oxygen sensor chip 910 relative to the oxygen sensor base 920 after assembly is different), thereby improving the adaptation effect of the guide bracket 131.

[0027] In this embodiment, there are two guiding arms 1313 and they move along the first direction. In other embodiments, there may be more guiding arms 1313 and the moving direction of the guiding arms 1313 may be radial to the guiding hole 1311 to enclose the guiding hole 1311.

[0028] In this embodiment, the guiding moving module 1312 is in the form of a slide table and a slide groove. In other embodiments, it can also be a cylinder, a screw module, etc.

[0029] In some embodiments, in combination Figure 3 and Figure 4 As shown, the fixture 410 includes a loading base 412 and a chip adjustment mechanism 413. The loading base 412 is provided with a loading through hole 4121. The chip adjustment mechanism 413 includes a chip adjustment piece 4131. The chip adjustment piece 4131 is provided in the loading through hole 4121 and can telescopically move along the axis of the loading through hole 4121.

[0030] In the present embodiment, when the oxygen sensor chip 910 is not installed on the fixture 410, the fixture 410 of the conveying module 400 flows along the conveying direction and gradually carries the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 during the flow process. The chip adjustment piece 4131 of the chip adjustment mechanism 413 is in an extended state at this time, which is used to occupy part of the installation position required by the oxygen sensor chip 910, thereby simplifying the loading difficulty of the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 (the staff or the loading mechanism can install the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 on the chip adjustment piece 4131); and, after the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 cooperate with the chip adjustment piece 4131, the oxygen sensor chip 910 is gradually inserted into the oxygen sensor to-be-installed part 930 in the oxygen sensor base 920 through the contraction of the chip adjustment piece 4131, thereby greatly reducing the assembly difficulty of the oxygen sensor chip 910.

[0031] In this embodiment, the height of the chip adjustment piece 4131 can be controlled to adapt to oxygen sensor chips 910 of different specifications (different lengths).

[0032] In some embodiments, in combination Figure 1 and Figure 5 As shown, the oxygen sensor chip assembly module also includes a chip height adjustment mechanism 470, which is adapted to one of the plurality of fixtures 410. The chip height adjustment mechanism 470 includes an adjustment rod 471 and an adjustment drive assembly 472. The adjustment rod 471 is adapted to be connected to the chip adjustment plate 4131 under the drive of the adjustment drive assembly 472, and drives the chip adjustment plate 4131 to perform telescopic movement.

[0033] In the present embodiment, it can be understood that the assembly of the oxygen sensor is generally provided with a pre-pressing mechanism, and the pre-pressing mechanism is to preliminarily press the oxygen sensor installation part 930 and the oxygen sensor chip 910 into shape (such as a talcum powder prefabricated block, a front end bushing, a rear end bushing, etc.). Through pre-pressing, the material distribution is ensured to be uniform, the internal stress is reduced, and cracks or deformation in subsequent processing are avoided. During the pre-pressing process, the oxygen sensor chip 910 needs to be inserted into the oxygen sensor installation part 930 to a certain depth. When the fixture 410 moves to the bottom of the pre-pressing mechanism, the chip adjustment plate 4131 is pulled down by the adjustment rod 471 of the chip height adjustment mechanism 470 to ensure that the pre-pressing pressure head of the pre-pressing mechanism does not contact the oxygen sensor chip 910.

[0034] In this embodiment, the adjustment drive assembly 472 is formed by combining a plurality of linear motion modules to realize the three-dimensional movement of the adjustment rod 471. The linear motion module can be a cylinder, a slide module, a screw module, etc.

[0035] In some embodiments, in combination Figure 5As shown, one of the chip adjustment piece 4131 and the adjustment rod 471 is provided with a limiting groove 41311 , and the other is provided with an inserting portion 4711 matched with the limiting groove 41311 .

[0036] In this embodiment, taking the chip adjustment plate 4131 as an example in which a limiting groove 41311 is set and the adjustment rod 471 as an example in which a plug-in portion 4711 is set, the groove wall of the limiting groove 41311 is suitable for abutting against the plug-in portion 4711, and by changing the groove wall abutted against by the plug-in portion 4711, the adjustment rod 471 can pull down the chip adjustment plate 4131 or move up the chip adjustment plate 4131.

[0037] In other embodiments, the connection mechanism between the chip adjustment piece 4131 and the adjustment rod 471 may also be a magnetic connection, a snap connection, etc.

[0038] In some embodiments, in combination Figure 3 and Figure 4 As shown, the chip adjustment piece 4131 is provided with a first limiting portion 41312 and a second limiting portion 41313, and the first limiting portion 41312 and the second limiting portion 41313 are arranged in sequence along the extension and retraction direction of the chip adjustment piece 4131 (Z direction as shown in the figure); the loading base 412 is provided with an elastic limiting pin 4122, and the elastic head of the elastic limiting pin 4122 is suitable for cooperating with the first limiting portion 41312 or the second limiting portion 41313 for limiting.

[0039] In this embodiment, the chip adjustment piece 4131 moves down to the first limiting portion 41312 and cooperates with the elastic limiting pin 4122, and the chip adjustment piece 4131 cannot move down further, thereby ensuring that the oxygen sensor chip 910 above the chip adjustment piece 4131 will not fall out of the fixture 410; the chip adjustment piece 4131 moves up to the second limiting portion 41313 and cooperates with the elastic limiting pin 4122, and the chip adjustment piece 4131 cannot move up further, thereby ensuring that the chip adjustment piece 4131 will not fall out of the fixture 410; and the positions of the first limiting portion 41312 and the second limiting portion 41313 can be set based on the distance that the oxygen sensor chip 910 needs to penetrate into the oxygen sensor base 920 and the oxygen sensor to-be-installed component 930. Compared with adjusting the distance of the drive assembly 472 to set the electrical control, mechanical limiting is more reliable.

[0040] In some embodiments, in combination Figure 3 and Figure 4As shown, the loading base 412 also includes a plug connector 4123 that can be elastically extended and retracted, and the chip adjustment piece 4131 is provided with a plug slot 41314 corresponding to the plug connector 4123, and the plug slot 41314 is located between the first limiting portion 41312 and the second limiting portion 41313; the plug slot 41314 is provided with a stop surface 41315 and a guide surface 41316 which are sequentially arranged along the extension and retraction direction of the chip adjustment piece 4131, the stop surface 41315 is perpendicular to the extension and retraction direction, and the guide surface 41316 is arranged at an angle to the extension and retraction direction, the plug connector 4123 can move and retract along the guide surface 41316, and the stop surface 41315 can abut against the plug connector 4123 for limitation.

[0041] In this embodiment, when the chip adjustment piece 4131 moves upward, the guide surface 41316 of the plug-in slot 41314 abuts against the plug connector 4123 and pushes the plug connector 4123 upward, so that the plug connector 4123 has a tendency of elastic compression, so that the plug connector 4123 is disengaged from the plug-in slot 41314, until the chip adjustment piece 4131 moves to the second limiting portion 41313 and cooperates with the elastic limiting pin 4122 to limit the chip adjustment piece 4131, and the chip adjustment piece 4131 stops moving; when the chip adjustment piece 4131 moves downward, the plug connector 4123 moves along the side wall of the chip adjustment piece 4131 until the plug connector 4123 is inserted into the plug-in slot 41314 along the guide surface 41316, until the plug connector 4123 abuts against the stop surface 41315 and cannot move further, thereby fixing the position of the chip adjustment piece 4131, and at the same time, the first limiting portion 41312 cooperates with the elastic limiting pin 4122 to limit the chip.

[0042] In this embodiment, the plug slot 41314 is arranged to cooperate with the plug connector 4123, so that the plug connector 4123 can limit and support the chip adjustment piece 4131. When the chip adjustment piece 4131 is used to support the oxygen sensor chip 910, the plug connector 4123 and the plug slot 41314, the first limiting portion 41312 and the elastic limiting pin 4122 jointly fix the chip adjustment piece 4131, thereby improving the supporting effect on the oxygen sensor chip 910 and preventing the first limiting portion 41312 and the elastic limiting pin 4122 from being damaged by excessive force.

[0043] Furthermore, thanks to the angle setting of the stop surface 41315 and the guide surface 41316, the plug connector 4123 slides along the guide surface 41316 to achieve plug-in mating, without the need for additional equipment to drive the plug connector 4123 to move, thereby reducing the volume of the fixture 410 and reducing the cost of use.

[0044] In this embodiment, the chip adjustment piece 4131 can be moved upwards by a staff member manually or by setting a lifting mechanism under the chip adjustment piece 4131 ; the chip adjustment piece 4131 can be moved downwards by the aforementioned chip height adjustment mechanism 470 .

[0045] In some embodiments, in combination Figure 5 As shown, the fixture 410 also includes a base positioning block 414, which is fixed to one side of the axis of the loading base 412. The base positioning block 414 is provided with a base positioning groove 4141, and the opening of the base positioning groove 4141 faces the axis of the loading base 412. The base positioning groove 4141 is suitable for cooperating with the oxygen sensor base 920 to limit the position.

[0046] In this embodiment, when the loading base 412 receives the oxygen sensor base 920, the surface of the outer shell portion of the oxygen sensor base 920 cooperates with the base positioning groove 4141, and moves in the extension direction of the base positioning groove 4141. The base positioning groove 4141 effectively limits the rotation of the oxygen sensor base 920 during loading or moving, so as to ensure the accurate positioning of the oxygen sensor base 920 and ensure the accuracy and efficiency of the downstream processes (oxygen sensor chip 910 assembly, pre-pressing, etc.).

[0047] In this embodiment, there is one base positioning block 414 having a base positioning groove 4141 with a triangular cross-section. Of course, the number of base positioning blocks 414 and the shape of the base positioning groove 4141 can be adaptively adjusted based on the shape of the oxygen sensor base 920 .

[0048] In some embodiments, in combination Figure 1 As shown, the conveying module 400 also includes a plurality of positioning mechanisms 440, which are fixed to one side of the jig 410. The positioning mechanism 440 includes a positioning push rod 441 and a push rod driving component 442. A jig positioning groove 411 that cooperates with the positioning push rod 441 is provided on the jig 410. The positioning push rod 441 is suitable for being fixed in cooperation with the jig positioning groove 411 under the drive of the push rod driving component 442.

[0049] In this embodiment, after the jig 410 moves to the corresponding workstation, the positioning push rod 441 of the positioning mechanism 440 is extended by the push rod driving member 442 and inserted into the jig positioning groove 411 to limit the jig 410, ensuring that the jig 410 is accurately positioned during the loading or assembly process of any module.

[0050] In this embodiment, the end of the positioning push rod 441 is a triangular head, and the fixture positioning groove 411 is a triangular groove. Of course, the specific shapes of the end of the positioning push rod 441 and the fixture positioning groove 411 can be adaptively adjusted.

[0051] In this embodiment, the push rod driving component 442 is a cylinder. In other embodiments, it can also be a slide module, a screw module, etc.

[0052] On the other hand, the present invention further provides an oxygen sensor assembly device, comprising the above oxygen sensor chip assembly module.

[0053] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An oxygen sensor chip assembly module for producing an oxygen sensor, the oxygen sensor comprising an oxygen sensor base (920) and an oxygen sensor chip (910), characterized in that: include: A conveying module (400), comprising a plurality of jigs (410) that move along a conveying direction, wherein the jigs (410) are suitable for carrying the oxygen sensor base (920); An oxygen sensor chip loading module (100) comprises a guiding mechanism (130), wherein the guiding mechanism (130) is adapted to be matched to one of the plurality of jigs (410), wherein the guiding mechanism (130) comprises a guiding support (131) and a positioning jaw (132) connected to the guiding support (131) and capable of opening and closing, wherein the guiding support (131) is provided with a guiding hole (1311), wherein the guiding hole (1311) is suitable for the oxygen sensor chip (910) to pass through; and the positioning jaw (132) is suitable for clamping and positioning the oxygen sensor base (920); and along the vertical direction, the guiding hole (1311), the positioning jaw (132) and the jig (410) are sequentially arranged.

2. The oxygen sensor chip assembly module according to claim 1, characterized in that: The guiding bracket (131) comprises a guiding movable module (1312) and two guiding clamping arms (1313), wherein the two guiding clamping arms (1313) are adapted to independently move along a first direction under the drive of the guiding movable module (1312), and the two guiding clamping arms (1313) can be combined to surround and form the guiding hole (1311).

3. The oxygen sensor chip assembly module according to claim 1, characterized in that: The fixture (410) comprises a loading base (412) and a chip adjustment mechanism (413); the loading base (412) is provided with a loading through hole (4121); the chip adjustment mechanism (413) comprises a chip adjustment piece (4131); the chip adjustment piece (4131) is arranged in the loading through hole (4121) and is capable of telescopic movement along the axis of the loading through hole (4121).

4. The oxygen sensor chip assembly module according to claim 3, characterized in that: The oxygen sensor chip assembly module further comprises a chip height adjustment mechanism (470), wherein the chip height adjustment mechanism (470) is adapted to be matched to one of the plurality of jigs (410), wherein the chip height adjustment mechanism (470) comprises an adjustment rod (471) and an adjustment drive assembly (472), wherein the adjustment rod (471) is adapted to be connected to the chip adjustment plate (4131) under the drive of the adjustment drive assembly (472), and drives the chip adjustment plate (4131) to perform telescopic movement.

5. The oxygen sensor chip assembly module according to claim 4, characterized in that: One of the chip adjustment piece (4131) and the adjustment rod (471) is provided with a limiting groove (41311), and the other is provided with a plug-in portion (4711) that cooperates with the limiting groove (41311).

6. The oxygen sensor chip assembly module according to claim 4, characterized in that: The chip adjustment piece (4131) is provided with a first limiting portion (41312) and a second limiting portion (41313), and the first limiting portion (41312) and the second limiting portion (41313) are arranged in sequence along the extension and retraction direction of the chip adjustment piece (4131); The loading base (412) is provided with an elastic limiting pin (4122), and the elastic head of the elastic limiting pin (4122) is suitable for cooperating with the first limiting portion (41312) or the second limiting portion (41313) to limit the position.

7. The oxygen sensor chip assembly module according to claim 6, characterized in that: The material loading base (412) further comprises an elastically retractable plug connector (4123), the chip adjustment sheet (4131) is provided with a plug connector slot (41314) corresponding to the plug connector (4123), and the plug connector slot (41314) is located between the first limiting portion (41312) and the second limiting portion (41313); The plug-in slot (41314) is provided with a stop surface (41315) and a guide surface (41316) which are sequentially arranged along the extension and retraction direction of the chip adjustment piece (4131); the stop surface (41315) is perpendicular to the extension and retraction direction; the guide surface (41316) is arranged at an angle to the extension and retraction direction; the plug-in connector (4123) can move and retract along the guide surface (41316); and the stop surface (41315) can abut against the plug-in connector (4123) to limit the position.

8. The oxygen sensor chip assembly module according to claim 3, characterized in that: The fixture (410) further comprises a base positioning block (414), wherein the base positioning block (414) is fixed to one side of the axis of the loading base (412), and the base positioning block (414) is provided with a base positioning groove (4141), wherein the opening of the base positioning groove (4141) faces the axis of the loading base (412), and the base positioning groove (4141) is suitable for cooperating with the oxygen sensor base (920) for limiting position.

9. The oxygen sensor chip assembly module according to any one of claims 1 to 8, characterized in that: The conveying module (400) further comprises a plurality of positioning mechanisms (440), wherein the positioning mechanisms (440) are fixed to one side of the jig (410), the positioning mechanisms (440) comprising a positioning push rod (441) and a push rod driving member (442), and a jig positioning groove (411) cooperating with the positioning push rod (441) is provided on the jig (410), and the positioning push rod (441) is suitable for being matched and fixed with the jig positioning groove (411) under the drive of the push rod driving member (442).

10. An oxygen sensor assembly device, characterized in that: It comprises the oxygen sensor chip assembly module as described in any one of claims 1 to 9.

Images