Sensor module with backlight

Abstract

The invention provides a sensor module with backlight. The sensor module comprises a circuit carrier plate, a sensing unit, a light-emitting part and a light guide plate. The circuit carrier has a first surface and a second surface opposite to the first surface. The sensing unit is electrically fixed on the first surface. The light-emitting part is electrically fixed on the second surface. The light guide plate is provided with a groove and faces the second surface. The light-emitting part is contained in the groove. Light emitted by the light-emitting part enters the light guide plate through the wall face of the groove and is emitted out from the periphery of the light guide plate. Wherein the circuit carrier plate is provided with a connecting part, and the connecting part passes through the side of the periphery of the light guide plate. According to the invention, the uniformity of backlight in the sensor module can be improved.

Description

Technical Field

[0001] The invention relates to a sensor module, and in particular to a sensor module with a backlight. Background Art

[0002] At present, some sensors are designed with a backlight assembly structure, which can participate in the sensing of the sensor or serve as a decoration of the sensor, or provide indication. The backlight assembly is usually arranged under the circuit carrier for carrying the sensing assembly in the sensor, and the connection line between the circuit carrier and the outside of the sensor (such as a flexible circuit carrier) usually interferes with the presentation of the backlight assembly, for example, making the light output of the backlight assembly uneven. Summary of the invention

[0003] The invention provides a sensor module with backlight, which improves the presentation of backlight by arranging connecting circuits around the backlight structure.

[0004] In order to achieve the above-mentioned purpose, the present invention proposes a sensor module, which includes a circuit carrier, a sensing unit, a light-emitting component and a light guide plate, wherein the circuit carrier has a first surface and a second surface opposite to the first surface; the sensing unit is electrically fixed on the first surface; the light-emitting component is electrically fixed on the second surface; the light guide plate has a groove, the light guide plate is arranged toward the second surface, the light-emitting component is accommodated in the groove, the light emitted by the light-emitting component enters the light guide plate through the wall of the groove and is emitted from the periphery of the light guide plate, wherein the circuit carrier has a connecting portion, and the connecting portion passes through the side of the periphery of the light guide plate.

[0005] As an optional technical solution, the connecting portion of the circuit carrier is light-transmissive; or, the connecting portion of the circuit carrier has at least one hole; or, the circuit carrier and the light guide plate are stacked in a vertical direction, and the connecting portion of the circuit carrier extends obliquely along the vertical direction on the side of the surrounding.

[0006] As an optional technical solution, the circuit carrier has a main body portion and the connecting portion extending from the main body portion, and the sensing unit and the light-emitting element are electrically fixed to the main body portion.

[0007] As an optional technical solution, part of the connecting portion is located between the light guide plate and the side wall surface of the accommodating groove.

[0008] As an optional technical solution, the sensor module further includes a housing having a receiving groove, the circuit board, the sensing unit, the light-emitting element and the light guide plate are received in the receiving groove, and the sensing surface of the sensing unit faces the opening of the receiving groove.

[0009] As an optional technical solution, the shell is light-conducting, and has a top surface and an annular light-transmitting area located on the top surface. The annular light-transmitting area surrounds the opening of the accommodating groove, and the light emitted from the surrounding of the light guide plate enters the shell through the wall of the accommodating groove.

[0010] As an optional technical solution, the housing has a channel, the channel communicates with the accommodating groove and the outside of the housing, and the connecting part of the circuit carrier passes through the channel.

[0011] As an optional technical solution, the channel is located at the bottom or side wall of the accommodating groove.

[0012] As an optional technical solution, the groove is located at the geometric center of the surface of the light guide plate.

[0013] As an optional technical solution, the wall surface of the groove includes the bottom wall surface of the groove and / or the side wall surface of the groove.

[0014] The present invention provides a sensor module with a backlight. By setting the connecting part of the circuit carrier as a light-transmitting structure, the light emitted from the light guide plate can at least partially pass through the connecting part, thereby reducing the unevenness of the backlight. Furthermore, the connecting part can also have at least one hole or extend obliquely in a vertical direction to reduce the degree of shielding of the light by the connecting part and improve the uniformity of the backlight. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0016] Figure 1 is a schematic diagram of a sensor module with backlight according to a first embodiment;

[0017] Figure 2 for Figure 1 An exploded view of the sensor module with backlight;

[0018] Figure 3 for Figure 1 A cross-sectional view of a sensor module with a backlight along line XX;

[0019] Figure 4 for Figure 3 A schematic diagram of the path of light emitted by the light emitting element;

[0020] Figure 5 for Figure 1 A schematic diagram of a sensor module with backlight in which a circuit carrier is stacked on a light guide plate;

[0021] Figure 6 is a schematic diagram of a circuit carrier stacked on a light guide plate according to a second embodiment;

[0022] Figure 7 FIG. 4 is a schematic diagram of a circuit carrier stacked on a light guide plate according to a third embodiment. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0024] See also Figures 1 to 3 ;in, Figure 2 Perspective and Figure 1 different, Figure 1 FIG. 2 is a schematic diagram of a sensor module with a backlight according to a first embodiment. Figure 2 Shown Figure 1 An exploded view of a sensor module with backlight. Figure 3 Shown Figure 1 A cross-sectional view of a sensor module with backlight along line XX. Figures 1 to 3 As shown, the sensor module with backlight (hereinafter referred to as sensor module 1) includes a housing 10, a circuit board 12, a sensing unit 14, and a light emitting element 16 ( Figure 2 , its outline is drawn with dotted lines), light guide plate 18 and protective cover 20. The housing 10 has a receiving groove 102, and the circuit carrier 12, the sensing unit 14, the light emitting element 16, the light guide plate 18 and the protective cover 20 are received in the receiving groove 102. Among them, the protective cover 20, the circuit carrier 12 and the light guide plate 18 are stacked in the vertical direction Dv (indicated by a double-headed arrow in the figure). A circuit is formed on the circuit carrier 12. The circuit carrier 12 includes a main body portion 122 and a connecting portion 124 extending from the main body portion 120. The main body portion 122 has a first surface 122a and a second surface 122b opposite to the first surface 122a, the first surface 122a faces the protective cover 20, and the second surface 122b faces the upper surface 182 of the light guide plate 18. The sensing unit 14 is electrically fixed on the first surface 122a, and the light emitting element 16 is electrically fixed on the second surface 122b. The light guide plate 18 forms a groove 184 on the upper surface 182, and the light emitting element 16 is received in the groove 184. The protection cover 20 completely covers the sensing unit 14, and can protect the sensing surface 14a (facing the opening 102a of the receiving groove 102) of the sensing unit 14.

[0025] In the first embodiment, the housing 10 is light-conducting (for example, made of a light-transmitting material). The housing 10 has a top surface 104 and an annular light-transmitting area 106 located on the top surface 104 ( Figure 1The annular light-transmitting area 106 surrounds the opening 102a of the receiving groove 102. Figure 4 (wherein the cross-section line of the sensor module 1 is removed to facilitate the presentation of the light path). Figure 4 Shown Figure 3 Schematic diagram of the path of light emitted by the light emitting element. Figure 4 As shown, the light emitted by the light emitting element 16 (indicated by arrows in Figure 4 The light emitted from the periphery 186 of the light guide plate 18 is directed toward the wall surface 102b (i.e., the side wall surface) of the receiving groove 102, so that the light emitted from the periphery 186 of the light guide plate 18 (i.e., the side surface) enters the housing 10 through the wall surface 184a, 184b of the receiving groove 184 (wherein the wall surface 184a is the bottom wall surface of the receiving groove 184, the wall surface 184b is the side wall surface of the receiving groove 184, and the side wall surface is composed of four connected wall surfaces. The light emitted from the periphery 186 of the light guide plate 18 is directed toward the wall surface 102b (i.e., the side wall surface) of the receiving groove 102, so that the light emitted from the periphery 186 of the light guide plate 18 (i.e., the side surface of the light guide plate 18) enters the housing 10 through the wall surface 102b of the receiving groove 102 (specifically, the side wall surface of the receiving groove 102). The light in the housing 10 can be emitted upward from the housing 10 through the annular light-transmitting area 106, and the emitted light can have an indication or decorative function according to the actual design.

[0026] In addition, in the first embodiment, although the light-emitting element 16 is represented by a single block in the figure, in actual applications, the light-emitting element 16 can be a single light-emitting unit or a collection of multiple light-emitting units that are separated and arranged, and each light-emitting unit can also include at least one light-emitting crystal grain (for example, but not limited to a light-emitting diode crystal grain). In addition, in the first embodiment, the light-emitting element 16 simultaneously emits light to all wall surfaces of the groove 184 (including the bottom wall surface 184a and all four side wall surfaces 184b), but in actual applications, it can also only emit light to the wall surface 184a (i.e., the bottom wall surface), one or more wall surfaces 184b (i.e., the side wall surfaces), or a combination of their wall surfaces, which can be determined according to actual conditions and will not be elaborated on. In addition, in the first embodiment, the groove 184 is located at the geometric center of the upper surface 182 of the light guide plate 18 (see Figure 2 ), this structure helps to achieve uniformity of light output from the annular light-transmitting area 106. In addition, in the first embodiment, the sensor module 1 uses a light-emitting element 16 (with a groove 184) to provide a light source, but in actual applications, multiple light-emitting elements (with one or more grooves 184) can also be used to provide a light source, which will not be described in detail. In addition, in actual applications, a reflective structure can be added to the lower surface 188 (relative to the upper surface 182) of the light guide plate 18, such as attaching a reflective sheet or coating the lower surface 188 to form a reflective layer, which can increase the light utilization rate and the uniformity of light output (from the periphery 186 of the light guide plate 18, that is, the side surface of the light guide plate 18).

[0027] See also Figure 2 and Figure 3 The circuit board 12 is electrically connected to the outside via its connecting portion 124. The housing 10 has a channel 108, which connects the receiving groove 102 and the outside of the housing 10. The connecting portion 124 passes through the channel 108. In the first embodiment, the channel 108 is located at the bottom 102c of the receiving groove 102 (i.e., exposed at the bottom wall surface); however, in actual applications, the channel 108 may also be located at the side wall of the receiving groove 102 (i.e., exposed at one of the side wall surfaces, i.e., the side wall surface 102b).

[0028] In addition, in the first embodiment, the connecting portion 124 passes through the peripheral side 186a (with Figure 3 From the perspective of the right side, it is the side of the surrounding 186. At this time, part of the connecting portion 124 is located between the surrounding 186 of the light guide plate 18 and the side wall 102b of the receiving groove 102. Therefore, the connecting portion 124 will block the light emitted from the surrounding side 186a. By designing the connecting portion 124 (such as material, shape, etc.), the influence of the aforementioned shielding on the uniformity of the light emitted from the annular light-transmitting area 106 can be reduced. Please refer to Figure 5 , Figure 5 Shown Figure 1 Schematic diagram of the circuit carrier 12 in the sensor module 1 with backlight being stacked on the light guide plate 18. In the first embodiment, the connecting portion 124 is light-transmissive (for example, made of a light-transmissive material), which can increase the ratio of light penetrating the connecting portion 124, thereby reducing the shielding effect of the connecting portion 124. However, the actual application is not limited to this.

[0029] For example, see Figure 6 , Figure 6 The schematic diagram of the circuit carrier according to the second embodiment is shown as being stacked on the light guide plate. Figure 6 As shown, in the second embodiment, the connection portion 324 of the circuit carrier 32 has at least one hole 324a (two holes in this embodiment). The light emitted from the peripheral side 186a of the light guide plate 18 can pass through the connection portion 324 through the hole 324a, thereby reducing the shielding effect of the connection portion 124. In practical applications, without affecting the circuit routing, the connection portion 324 can have more holes, and their positions are not limited to alignment. Alternatively, the connection portion 324 itself can also be light-transmissive (for example, made of a light-transmissive material) to further reduce the shielding effect of the connection portion 324.

[0030] For another example, see Figure 7 , Figure 7 The schematic diagram of the circuit carrier according to the third embodiment is shown as being stacked on the light guide plate. Figure 7As shown, in the third embodiment, the connection portion 424 of the circuit carrier 42 extends obliquely along the vertical direction Dv at the peripheral side 186a. In the horizontal direction Dh (perpendicular to the vertical direction Dv), the influence range of the connection portion 424 at the peripheral side 186a is increased (compared to Figure 5 , Figure 6 However, in the horizontal direction Dh, each segment S1, S2, S3 (shown in dotted lines) Figure 7 This structural configuration helps to reduce the light from the annular light-transmitting area 106 (see Figure 1 In addition, in the present embodiment, the connecting portion 424 is disposed obliquely on the entire circumferential side 186a, that is, the connecting portion 424 is inclined to extend in the horizontal direction Dh, which can increase the light transmittance ratio of each segment S1, S2, and S3, thereby helping to further reduce the unevenness of light emitted from the annular light-transmitting area 106. In addition, according to the teachings of the aforementioned first and second embodiments, the connecting portion 424 can also be made of a light-transmitting material, or / and a through hole can be formed on the connecting portion 424, which can also help reduce the shielding effect of the connecting portion 424, which will not be described in detail.

[0031] Also, see Figure 2 In the first embodiment, the circuit carrier 12 is formed by a single board, such as but not limited to a flexible circuit board. In practical applications, the circuit carrier 12 may also be a combination. For example, the main body 122 of the circuit carrier 12 is formed by a printed circuit board, and the connecting portion 124 of the circuit carrier 12 is formed by a flexible circuit board, and the two may be directly fixedly connected or detachably connected via a connector.

[0032] In addition, in actual applications, the sensing unit 14 of the sensor module 1 can be a fingerprint recognition component, and the material or structure of the protective cover 20 is modified according to the recognition principle of the fingerprint recognition component (for example, optical, capacitive or other methods to obtain fingerprints). In this case, the sensor module 1 is a fingerprint recognition device; in actual applications, the sensor module 1 can be integrated into a keyboard.

[0033] In summary, the present invention provides a sensor module with a backlight. By configuring the connecting portion of the circuit carrier to be a light-transmitting structure, the light emitted from the light guide plate can at least partially pass through the connecting portion, thereby reducing the degree of uneven backlight. Furthermore, the connecting portion may also have at least one hole or extend obliquely in a vertical direction to reduce the degree of light shielding by the connecting portion and improve the uniformity of the backlight.

[0034] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A sensor module, characterized in that: The sensor module includes: A circuit carrier having a first surface and a second surface opposite to the first surface; A sensing unit, electrically fixed on the first surface; A light emitting element, electrically fixed on the second surface; as well as A light guide plate having a groove, the light guide plate is arranged toward the second surface, the light emitting element is accommodated in the groove, the light emitted by the light emitting element enters the light guide plate through the wall of the groove and is emitted from the periphery of the light guide plate, wherein the circuit carrier has a connecting portion, and the connecting portion passes through the side of the periphery of the light guide plate.

2. The sensor module according to claim 1, wherein: The connecting portion of the circuit carrier is light-transmissive; or, the connecting portion of the circuit carrier has at least one hole; or, the circuit carrier and the light guide plate are stacked in a vertical direction, and the connecting portion of the circuit carrier extends obliquely along the vertical direction beside the surrounding.

3. The sensor module according to claim 1, wherein: The circuit carrier has a main body portion and the connecting portion extending from the main body portion. The sensing unit and the light-emitting element are electrically fixed to the main body portion.

4. The sensor module according to claim 1, wherein: Part of the connecting portion is located between the light guide plate and the side wall surface of the accommodating groove.

5. The sensor module according to claim 1, wherein: The sensor module further comprises a housing having a receiving groove, wherein the circuit carrier, the sensing unit, the light emitting element and the light guide plate are received in the receiving groove, and a sensing surface of the sensing unit faces an opening of the receiving groove.

6. The sensor module according to claim 5, wherein: The shell is light-guiding and has a top surface and an annular light-transmitting area located on the top surface. The annular light-transmitting area surrounds the opening of the accommodating groove. Light emitted from the periphery of the light guide plate enters the shell through the wall of the accommodating groove.

7. The sensor module according to claim 5, wherein: The shell has a channel, the channel is connected with the accommodating groove and the outside of the shell, and the connecting part of the circuit carrier passes through the channel.

8. The sensor module according to claim 7, wherein: The channel is located at the bottom or side wall of the accommodating groove.

9. The sensor module according to claim 1, wherein: The groove is located at the geometric center of the surface of the light guide plate.

10. The sensor module according to claim 1, wherein: The wall surface of the groove includes the bottom wall surface of the groove and / or the side wall surface of the groove.

Images