Portable electronic device

Abstract

The present disclosure relates to a portable electronic device comprising: a housing comprising: a frame at least partially defining an interior volume, the frame forming a first recess on an interior surface of the frame; and a back plate at least partially defining an interior volume, the back plate forming a second recess on an interior surface of the back plate; and a coupler disposed entirely within the internal volume and interconnecting the frame with the backplane, the coupler comprising: a portion engaging the first recess of the frame; and a protrusion positioned within the second recess of the back plate and interlocked with the second recess; the part is a first protruding part which is adhered in a first concave part of the frame; the first recess extends into the frame at an acute angle relative to the side wall of the frame; the protrusion extends perpendicular to the outer surface of the back plate into the second recess.

Description

[0001] This patent application is a divisional application of the invention patent application with application number 202111441781.4, application date November 30, 2021, and invention name “electronic device”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 160,684, entitled “ELECTRONIC DEVICE,” filed on March 12, 2021, the entire disclosure of which is hereby incorporated by reference. Technical Field

[0004] The embodiments described herein generally relate to electronic devices. More particularly, the embodiments of the present invention relate to portable electronic device components, systems, and architectures. Background Art

[0005] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablet computers, and watches, typically include a type of housing or casing that houses internal components.

[0006] Components of an electronic device, such as processors, memory, cooling devices, input components and other components may partially determine the available functionality and performance level of the electronic device. In addition, the arrangement of these components and their related systems relative to each other in the device may also determine the performance level of the electronic device.

[0007] Continuous advancements in electronic devices and their components have resulted in considerable performance improvements as well as new uses and functions. However, existing components and structures of electronic devices may limit the performance level of such devices. For example, conventional arrangements of components in existing electronic device architectures and conventional designs of the components themselves may limit the performance of electronic devices by failing to effectively distribute or remove heat generated by components of the electronic device. In addition, the design of components and their arrangement may also affect other properties of the device, such as the overall size of the device, the amount of noise generated by the device, the specific function of the device, the cost of manufacturing the device, and the like. Therefore, it may be desirable to further customize and arrange the components of electronic devices to provide additional or enhanced functionality without introducing or adding undesirable device characteristics. Summary of the invention

[0008] According to some aspects of the present disclosure, a portable electronic device may include a housing including a frame and a back plate. The portable electronic device may include a coupler interconnecting the frame and the back plate. The coupler may define a first protrusion that engages the frame. The coupler may define a second protrusion that engages the back plate.

[0009] In some examples, the coupler may include a rigid polymer and have a dielectric constant of at least 2ε at 1 MHz. The first protrusion may be adhered within a first recessed portion of the frame. The first recessed portion may extend into the frame at an acute angle relative to the sidewall of the frame. The second protrusion may be adhered within a second recessed portion of the backplate. The housing may include a first curved surface and a second curved surface interconnected by a linear surface of the housing. The coupler may interconnect the frame and the backplate adjacent to the linear surface. The portable electronic device may also include a dielectric component that extends at least partially between the frame and the backplate. The dielectric component may be at least partially disposed between the first protrusion and the second protrusion of the coupler.

[0010] In some examples, the portable electronic device may further include a display module, a cover glass, a first pressure-sensitive adhesive tape, and a second pressure-sensitive adhesive tape. The cover glass may be disposed above the display module. The first pressure-sensitive adhesive tape may couple a corner of the cover glass to the housing. The second pressure-sensitive adhesive tape may couple the cover glass to a linear portion of the housing. The dynamic shear strength of the first pressure-sensitive adhesive tape may be greater than the dynamic shear strength of the second pressure-sensitive adhesive tape.

[0011] According to another aspect of the present disclosure, an electronic device may include a housing, a processor, an electronic component, a flexible trace, and a biasing element. The processor may be disposed within the housing. The electronic component may be at least partially positioned within the housing. The flexible trace may include a first end electrically coupled to the processor. The flexible trace may include a second end electrically coupled to the electronic component. The biasing element may contact the flexible trace between the first end and the second end.

[0012] In some examples, the biasing element includes a compressible foam. The biasing element may be disposed between the electronic component and the flexible trace. The first end may be electrically coupled to a first electrical contact of the processor. The second end may be electrically coupled to a second electrical contact of the electronic component. The length of the flexible trace may be greater than a distance between the first electrical contact and the second electrical contact. The biasing element may place the flexible trace under tension. The electronic component may be a display module.

[0013] According to another aspect of the present disclosure, an electronic device may include a housing, a processor, an antenna, a display module, and a ground layer. The processor and the antenna may be disposed in the housing. The display may be at least partially disposed in the housing. The ground layer may be at least partially disposed above the first surface and the second surface of the display module. The ground layer may electrically ground the display module to the housing.

[0014] In some examples, the ground layer may contact the housing at a first position on the housing. The ground layer may contact the housing at a second position on the housing. The first position and the second position may be separated by a distance. The ground layer may be a conductive tape adhered to the back surface and the side surface of the display module to ground the current induced in the display module by operating the antenna. The ground layer may include a portion at least partially disposed above the first surface and the second surface of the display module. The ground layer may include a first tab electrically connecting the portion to the housing. The ground layer may include a second tab electrically connecting the portion to the housing.

[0015] In some examples, the electronic device may include a cover glass attached to the housing. A first tab may be disposed between the cover glass and the housing. An intermediate material may enable the cover glass to move independently of the first tab. The electronic device may include a coating or decorative layer disposed over at least a portion of the ground layer. The ground layer may include a first protrusion and a second protrusion. The first protrusion and the second protrusion may form a thinned section configured to flex when the display module moves relative to the housing.

[0016] According to another aspect of the present disclosure, a portable electronic device includes: a shell, the shell including: a frame, the frame at least partially defines an internal volume, the frame forming a first recess on the internal surface of the frame; and a back panel, the back panel at least partially defines the internal volume, the back panel forming a second recess on the internal surface of the back panel; and a coupler, the coupler is completely arranged in the internal volume and interconnects the frame with the back panel, the coupler including: a portion that engages the first recess of the frame; and a protrusion positioned in the second recess of the back panel and interlocked with the second recess; the portion is the first protrusion adhered to the first recess of the frame; the first recess extends into the frame at an acute angle relative to the side wall of the frame; the protrusion extends into the second recess perpendicular to the external surface of the back panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals refer to like structural elements, and wherein:

[0018] Figure 1A A front view of the electronic device is shown.

[0019] Figure 1B Shows Figure 1A Close-up cross-sectional front view of an electronic device.

[0020] Figure 1C Shows Figure 1A A cross-sectional perspective view of an electronic device.

[0021] Figure 2A A close-up cross-sectional front view of an electronic device is shown.

[0022] Figure 2B Shows Figure 2A A cross-sectional side view of an electronic device.

[0023] Figure 2C Shows Figure 2A A cross-sectional side view of an electronic device.

[0024] Figure 3A A cross-sectional front view of an electronic device is shown.

[0025] Figure 3B A cross-sectional front view of an electronic device is shown.

[0026] Figure 4A A cross-sectional side view of an electronic device is shown.

[0027] Figure 4B Shows Figure 4A Close-up cross-sectional side view of an electronic device.

[0028] Figure 4C Shows Figure 4A Close-up cross-sectional side view of an electronic device.

[0029] Figure 5A A close-up front view of a sensor array of an electronic device is shown.

[0030] Figure 5B shows the light blocking layer applied Figure 5A Close-up front view of the sensor array.

[0031] Figure 6 A close-up cross-sectional side view of a display module is shown.

[0032] Fig. 7A A close-up front view of the display module is shown.

[0033] Figure 7B Shows Fig. 7A A close-up cross-sectional perspective view of the display module.

[0034] Figure 8 A close-up cross-sectional front view of a sensor array of an electronic device is shown.

[0035] Fig. 9 A close-up cross-sectional side view of a display module is shown.

[0036] Fig. 10A A cross-sectional top view of a display module is shown.

[0037] Fig. 10B Shows Fig. 10A A detailed view of the display module.

[0038] Fig.11 A close-up cross-sectional side view of a display module is shown.

[0039] Fig. 12A A rear perspective view of the display module is shown.

[0040] Fig. 12B Shows Fig. 12A A partially exploded rear perspective view of a display module.

[0041] Fig.13A A cross-sectional rear view of an electronic device is shown.

[0042] Fig. 13B Shows Fig.13A Millimeter wave antennas for electronic devices.

[0043] Fig. 13C Shows Fig.13A Millimeter wave antennas for electronic devices.

[0044] Fig.14 A close-up cross-sectional side view of an electronic device is shown.

[0045] Fig.15A A partial cross-sectional rear view of an electronic device is shown.

[0046] Fig. 15B Shows Fig.15A Close-up perspective view of an electronic device.

[0047] Fig.16A A close-up cross-sectional side view of an electronic device is shown.

[0048] Fig. 16B A close-up cross-sectional side view of an electronic device is shown.

[0049] Fig. 16C A close-up cross-sectional side view of an electronic device is shown.

[0050] Fig.16D A close-up perspective view of an electronic device is shown. DETAILED DESCRIPTION

[0051] This specification provides examples and does not limit the scope, applicability or configuration set forth in the claims. Therefore, it should be understood that the functions and arrangements of the elements discussed may be changed without departing from the spirit and scope of the present disclosure, and various embodiments may appropriately omit, replace or add other programs or components. In addition, in other embodiments, the features described with respect to some embodiments may be combined.

[0052] According to one aspect of the present disclosure, a portable electronic device may include a housing that at least partially defines an internal volume. A display may be coupled to the housing and may be covered by a glass cover that, together with the housing, may define the internal volume of the device. The device may include multiple components that may provide desired functionality and performance levels. For example, the device may include one or more couplers that interconnect various portions of the housing. Additionally or alternatively, the portable electronic device may include one or more millimeter wave antennas. Additionally or alternatively, the electronic device may include one or more grounding elements or grounding layers that electrically ground the display to the housing.

[0053] The following will refer to FIG. 1A to FIG. 16D to discuss these examples and other examples. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for illustrative purposes only and should not be construed as limiting. In addition, as used herein, a system, method, article, component, feature, or sub-feature comprising at least one of a first option, a second option, or a third option should be understood to refer to a system, method, article, component, feature, or sub-feature that may include one of each listed option (e.g., only one first option, only one second option, only one third option), multiple of a single listed option (e.g., two or more first options), two options at the same time (e.g., one first option and one second option), or a combination thereof (e.g., two first options and one second option).

[0054] Figure 1A An electronic device 100 , such as a tablet computing device, is depicted. Figure 1A The tablet computer of is only one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of portable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device, a portable electronic device, or simply a device.

[0055] The electronic device 100 includes a housing 102 that at least partially surrounds a display 104. The housing 102 may at least partially define an interior volume that may enclose or partially enclose a display and other internal components of the electronic device 100. The housing 102 may be formed of one or more components such as a frame and a back plate that are operably connected together. Alternatively, the housing 102 may be formed of a single piece that is operably connected to the display 104.

[0056] Display 104 may provide visual output to a user. Display 104 may include any suitable display technology, including but not limited to liquid crystal display elements, light emitting diode elements, organic light emitting display elements, organic electroluminescent elements, and the like.

[0057] Cover sheet 108 may be positioned over the front surface (or a portion of the front surface) of electronic device 100. In some examples, at least a portion of cover sheet 108 may sense touch input and / or force input. Cover sheet 108 may be formed using any suitable material (such as glass, plastic, sapphire, or a combination thereof). In some examples, touch input and force input may be received by a portion of cover sheet 108 that covers display 104. In some examples, touch input and / or force input may be received across other portions of cover sheet 108 and / or portions of housing 102. Cover sheet 108 and housing 102 may together define an interior volume of electronic device 100.

[0058] The various layers of the display stackup, such as the cover sheet 108, the display 104, the touch sensor layer, the force sensor layer, etc., may be adhered together using an adhesive and / or may be supported by a common frame or portion of the housing 102. The common frame may extend around the perimeter or a portion of the perimeter of the layers, may be segmented around the perimeter or a portion of the perimeter, or may be coupled to the various layers of the display stackup in another manner.

[0059] In some examples, each of the layers of the display stack can be attached or deposited on a separate substrate, which can be laminated or bonded to each other. The display stack can also include other layers for improving the structural or optical performance of the display 104, including, for example, polarizer sheets, color masks, etc. In addition, the display stack can include a touch sensor layer and / or a force sensor layer for receiving input on the cover sheet 108 of the electronic device 100.

[0060] In many cases, the electronic device 100 may also include a processor, memory, a power source and / or battery, a network connection, sensors, input / output ports, acoustic components, tactile components, digital circuits and / or analog circuits for performing and / or coordinating tasks of the electronic device 100, as described herein. For simplicity of illustration, Figure 1A The electronic device 100 depicted in the Figure does not include many of these components, each of which may be partially and / or completely included within the housing 102. The electronic device 100 may also include one or more input components, such as an input component 106. In some examples, the input component 106 may include a physical button, such as a power button or a sleep / wake button. In addition or alternatively, the input component 106 may detect touch input or near-touch input. In some examples, the input component 106 may have additional functionality and may, for example, include a biometric input component 106.

[0061] Figure 1B A close-up cross-sectional front view of the electronic device 100 is shown with the display 104 and the cover sheet 108 removed. In some examples, the housing 102 may be formed by a frame 110 and a back plate 112. The frame 110 may extend around the perimeter of the housing 102 and form one or more flat surfaces or linear surfaces 114 (e.g., the side walls of the housing 102) and one or more curved surfaces 116 (e.g., the corners of the housing 102). The one or more linear surfaces 114 may extend between the curved surfaces 116. A coupler 118 may be disposed adjacent to the linear surfaces 116 and interconnect the frame 110 to the back plate 112. In other words, the coupler 118 may engage the frame 110 and the back plate 112 to interlock or secure the frame 110 to the back plate 112. During a drop event (e.g., a user of the electronic device 100 drops the device 100 onto the ground or other surface), the coupler 118 may limit or prevent the linear surfaces 116 of the frame 110 from bending or otherwise separating from the back plate 112. The coupler 118 may include a rigid material, such as a natural or synthetic plastic. For example, the coupler 118 may be machined, molded, cast, or otherwise formed from polyethylene, polypropylene, nylon, polytetrafluoroethylene, thermoplastics, combinations thereof, or any other polymer. In examples, the coupler 118 may be made of any material or combination of materials including metals, ceramics, and polymers.

[0062] Figure 1C A cross-sectional perspective view of the electronic device 100 is shown. The coupler 118 may include a first protrusion 120A and a second protrusion 120B. The first protrusion 120A may engage the frame 110, for example, at a recess 122 formed in the frame 110. The recess 122 may extend into the frame 110 at an acute angle A1 relative to the sidewall or linear surface 114 of the frame 110. For example, the recess 122 may extend into the frame 110 at a 45-degree angle relative to the linear surface 114. The second protrusion 120B may engage the back plate 112, for example, at a recess 124 formed in the back plate 112. The recess 124 may extend into the back plate 112 perpendicular to the outer surface 126 of the back plate 112. The coupler 118 may be attached to the housing 102 by any interlocking mechanism, such as one or more fasteners, interference fits, adhesives, or combinations thereof.

[0063] In some examples, the first and second protrusions 120A, 120B of the coupler 118 may be inserted into the corresponding recesses 122, 124 simultaneously. Figure 1CAs shown, the second protrusion 120B can be shaped so that the second protrusion 120B can be inserted into the second recess 124 at a certain angle. In other words, the coupler 118 can be shaped to slide into the first and second recesses 122, 124 while the frame 110 and the back plate 112 are attached together to facilitate assembly of the electronic device 100. For example, the frame 110 and the back plate 112 can be interconnected before attaching the coupler 118 to the housing 102. Therefore, the first and second protrusions 120A, 120B can be inserted into the corresponding first and second recesses 122, 124 at a certain angle (e.g., an angle of about 45 degrees between the linear surface 114 and the outer surface 126).

[0064] In some examples, one or more antennas (not shown) within the electronic device 100 may receive and / or transmit data in the form of electromagnetic waves having a specific frequency and amplitude. The coupler 118 may be made of a material having a dielectric constant that enables optimal antenna performance. For example, the coupler 118 may be made of a rigid polymer that does not provide a conductive path for the current induced on the portion of the housing 102 that contacts the coupler 118 (e.g., the frame 110 and the back plate 112). In an example, the coupler 118 may be made of a material having a dielectric constant of at least 2ε at 1 MHz. In some examples, the dielectric 128 may be disposed between a portion of the frame 110 and the back plate 112. The dielectric 128 may electrically isolate one or more portions of the housing 102 to enable wireless communication via one or more antennas. The dielectric 128 may extend between the first protrusion and the second protrusion 120A, 120B, so that at least a portion of the dielectric is disposed between the first protrusion and the second protrusion 120A, 120B.

[0065] Figure 2A A close-up cross-sectional front view of the housing 202 of the electronic device 200 with the display and cover glass removed is shown. The housing 202 may be substantially similar to the housing 102 and may include some or all of the features of the housing. For example, the housing 202 may include a frame 210 and a back plate 212. The frame 210 and the back plate 212 may be at least partially interconnected by a first coupler 218A and a second coupler 218B. The first coupler 218A may be disposed near the curved surface 216 of the frame 210. The second coupler 218B may be disposed near the linear surface 214 of the frame 210. During a fall event (e.g., a user of the electronic device 200 drops the device 200 onto the ground or other surface), the coupler 218A may limit or prevent the curved surface 214 of the frame 210 from deforming toward the back plate 212. During a fall event, the coupler 218B may limit or prevent the linear surface 216 of the frame 210 from bending and limit or prevent separation from the back plate 212.

[0066] Figure 2B Shown by Figure 2A 2B-2B. The coupler 218A may be interlocked or otherwise engaged with the back plate 212. For example, Figure 2B As shown in , the coupler 218A may include a protruding portion 220 disposed within a recessed portion 222 of the back plate 212. The protruding portion 220 may be attached to the recessed portion 222 by an adhesive 230 such as an adhesive tape or a liquid adhesive. In some examples, a dielectric 228 may be disposed between a portion of the frame 210 and the back plate 212. The dielectric 228 may electrically isolate one or more portions of the housing 202 to enable wireless communication via one or more antennas. For example, the dielectric 228 may be formed of or include a substantially non-conductive material or an electrically insulating material so that a portion of the housing 202 (e.g., a portion of the frame 210) may be electrically isolated to act as an antenna for the electronic device 200.

[0067] Figure 2C Shown by Figure 2A 2C-2C. The coupler 218B may be interlocked or otherwise engaged with the back plate 212 and the frame 210. For example, similar to the coupler 218A, the coupler 218B may include a protrusion 220 disposed within a recess 222 of the back plate 212. The protrusion 220 may be attached within the recess 222 by an adhesive such as an adhesive tape or a liquid adhesive. The coupler 218B may be attached to the frame 210 by one or more fasteners 232. The fasteners 232 may engage the frame 210, for example, by threading engagement with the frame 210 to interlock the coupler 218B with the frame 210.

[0068] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding pressure-sensitive adhesive tapes with various material properties, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Figure 3A Figure 3B Various examples of electronic devices are described that include components, such as pressure-sensitive adhesive tapes, having various features in various arrangements.

[0069] Figure 3AA cross-sectional view of an electronic device 300 including a housing or case 302 is shown. The electronic device 300 may be substantially similar to the electronic devices 100, 200 and include one or more of the features or components of the electronic devices. The case 302 may include curved portions 304A-304D (e.g., corners) and linear portions 306 (e.g., sidewalls). In some examples, a cover glass (not shown) may be attached to the case 302 using a pressure-sensitive adhesive (PSA) tape to securely hold the cover glass to the case 302. For example, a first PSA tape 308 may be disposed between the cover glass and the case 302 at curved portions 304A, 304C, and a second PSA tape 310 may be disposed between the cover glass and the case 302 at curved portions 304B, 304D and linear portions 306. In some examples, one or more sections 312A-312I of the perimeter of the case 302 may be free of the second PSA tape 310. For example, the housing 302 may define a slot or cutout at the sections 312A-312I that are devoid of the second PSA strip 310. The slot or cutout may be formed to accommodate an antenna window, an input component (e.g., a volume button), a communication port, a combination thereof, or any other feature or component of the electronic device 300.

[0070] The first PSA tape 308 may have one or more material properties or characteristics that are different from the second PSA tape 310. For example, the dynamic shear strength of the first PSA tape 308 may be greater than the dynamic shear strength of the second PSA tape 310. The dynamic shear strength of the first PSA tape 308 may be 2 to 15 times greater than the dynamic shear strength of the second PSA tape 310. The dynamic shear strength of the first PSA tape 308 may be between 1500 N.mm and 10000 N.mm, while the dynamic shear strength of the second PSA tape may be between 100 N.mm and 1000 N.mm.

[0071] In addition or alternatively, other material properties or characteristics of the first PSA tape 308 may be different from material properties or characteristics of the second PSA tape 310, such as activation pressure, static modulus, tensile strength, adhesion, combinations thereof, or any other material properties or characteristics. Attaching the cover glass to the housing 302 using PSA tapes having one or more different material properties may be advantageous, for example, in preventing movement or displacement of the cover glass relative to the housing 302 during a drop event. For example, greater dynamic shear strength may better hold the cover glass to the housing 302, such that during a drop event, particularly a drop event where the ground contacts the electronic device 300 at one of the curved portions 304A, 304B, the cover glass deflects less relative to the housing 302. Less deflection of the cover glass may reduce the likelihood that the cover glass will contact the housing 302 (or another surface) and break or crack due to the impact.

[0072] Figure 3B A cross-sectional view of an electronic device 300 is shown including a first PSA tape 308, a second PSA tape 310, and a third PSA tape 314 disposed on a housing 302. The third PSA tape 314 may have one or more material properties or characteristics that are different from the material properties or characteristics of the first and second PSA tapes 308, 310. For example, the third PSA tape 312 may have a dynamic shear strength that is different from the dynamic shear strength of the first and second PSA tapes 308, 310. In addition or alternatively, the third PSA tape 312 may have other material properties or characteristics that are different from the material properties or characteristics of the first and / or second PSA tapes 308, 310, such as activation pressure, static modulus, tensile strength, adhesion, combinations thereof, or any other material properties or characteristics.

[0073] Any number or types of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding one or more elements of a biased flexible trace, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. FIG. 4A to FIG. 4C Various examples of electronic devices are described that include components, such as biasing elements, in various arrangements with various features.

[0074] Figure 4A A cross-sectional side view of an electronic device 400 is shown. The electronic device 400 may be substantially similar to the electronic devices 100, 200, 300, and may include some or all of the features of the electronic devices. The electronic device 400 may include a housing 402 and a cover glass 404 attached to the housing 402. The housing 402 and the cover glass 404 may define an internal volume within the electronic device 400. A plurality of electronic components may be disposed within the internal volume of the electronic device 400. For example, a processor 406 and a display module 408 may be disposed within the housing 402. The electronic device 400 may include one or more flexible traces that electrically connect a plurality of electronic components within the electronic device 400. The processor 406 and the display module 408 may be electrically coupled via a flexible trace 410 extending within the internal volume of the electronic device 400. More specifically, the flexible trace 410 may have a first end 412A electrically coupled to an electrical contact of the processor 406 and a second end 412B electrically coupled to an electrical contact of the display module 408. Although the flexible trace 410 is Figure 4A4 is shown as electrically connecting the processor 406 to the display module 408 , but the electronic device 400 may include additional or alternative flexible traces that electrically couple other electronic components of the electronic device 400 .

[0075] The distance D between the corresponding electrical contacts may vary, such as based on tolerances of the electronic components of the electronic device 400. For example, the size and shape of each electronic component may vary so that the distance D varies from one electronic device 400 to another. The length of the flexible trace 410 may be longer than the distance D. However, in an electronic device having a relatively short distance D, the flexible trace 410 may be too long. If the length of the flexible trace 410 is too long relative to the distance D, the flexible trace 410 may contact other electronic components within the electronic device 400 and damage or interfere with the operation of the contacted electronic components.

[0076] In some examples, such as Figure 4B and Figure 4C As shown, the biasing element 414 may contact the flexible trace 410 between the first and second ends 412A, 412B to place the flexible trace 410 under tension, thereby inhibiting or limiting the flexible trace 410 from making unwanted contact with electronic components of the electronic device 400. For example, the biasing element 414 may be disposed between the flexible trace 410 and the display module 408, and bias a portion of the flexible trace 410 away from the display module 408. The biasing element 414 may include any material or structure capable of biasing the flexible trace 410 to place the electrical trace 410 under tension. In some examples, the biasing element 414 may be a spring or elastomeric material, such as a compressible foam, capable of exerting a force on the flexible trace 410. The biasing element 414 may be adhered or attached anywhere along the distance D to contact the flexible trace 410. For example, as Figure 4B and Figure 4C As shown, the biasing element 414 can be attached to the display module 408 by a pressure sensitive adhesive tape 416 or other adhesive. Alternatively or in addition, the biasing element 414 can be attached to the electronic component by an adhesive, fasteners, or welds.

[0077] Figure 4B An example of an electronic device 400 is shown having a relatively short distance D such that the biasing element 414 may occupy the additional length of the flexible trace 410 to limit the additional length of the flexible trace 410 from contacting other electronic components within the electronic device 400 . Figure 4C An example of an electronic device 400 is shown that has a relatively long distance D so that the flexible trace 410 does not have unnecessary length and compress the biasing element 414 .

[0078] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding materials that block backlight sources, may be applied not only to the specific examples discussed herein, but to any number of examples in any combination. Figure 5A and Figure 5B Various examples of electronic devices are described that include components having various features, such as opaque materials, in various arrangements.

[0079] Figure 5A A close-up front view of an electronic device 500 including a housing 502, a support structure 504, a display 506, and an array of sensors 508A-508D is shown. The electronic device 500 may be substantially similar to the electronic devices 100, 200, 300, 400 and may include some or all of the electronic device features described. The array of sensors 508A-508D may include one or more sensors, such as a microphone, an ambient light sensor, one or more cameras, an infrared sensor, a combination thereof, or any other sensor. The support structure 504 may include one or more slots 510A-510E that provide a path for electrical traces or wires to extend from a processor (not shown) to each sensor within the array of sensors 508A-508D.

[0080] When the backlight of display 506 is illuminated, the emitted light may highlight or otherwise make one or more of slots 510A-510E visible to a user through the cover glass (not shown). Figure 5B As shown, light blocking material or opaque material 512 can be disposed over one or more of slots 510A-510E to prevent light emitted by display 506 from making slots 510A-510E visible to a user. In some examples, opaque material 512 can be a light blocking tape adhered over support structure 504.

[0081] Any number or types of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding printed circuit boards and support structures, may be applied not only to the specific examples discussed herein, but to any number of examples in any combination. Figure 6Various examples of electronic devices are described that include components, such as rigid printed circuit boards and support structures, in various arrangements having various features.

[0082] Figure 6 A close-up cross-sectional side view of a display module 600 is shown, which includes a support structure 602, a printed circuit board (PCB) 604, electronic components 606, 608, an optical film 610, and transparent layers 612, 614. The optical film 610 may be disposed between the PCB 604 and the transparent layer 612. In some examples, the PCB 604 may include an LED array that emits light through the optical film 610 and the transparent layers 612, 614. The electronic components 606, 608 may be electrically coupled to the PCB 604 and provide electrical signals to the LED array. The PCB 604 may provide structural rigidity or support for the display module 600. For example, the PCB 604 may have sufficient rigidity to provide structural support so that the display module 600 does not require a rigid substrate or base, which would increase the thickness of the display module 600 and necessarily increase the overall thickness of the electronic device.

[0083] The support structure 602 can be attached to the PCB 604 and the transparent layer 612 to hold the components of the display module 600 in a fixed position relative to each other. The support structure 602 can be attached to the PCB 604 and the transparent layer 612 using one or more fasteners, welds, adhesives, or a combination thereof. For example, the support structure 602 can be attached to the PCB 604 and the transparent layer 612 via a pressure-sensitive adhesive tape 616. In some examples, the pressure-sensitive adhesive tape 616 can be attached to a shielding layer 618 of the PCB 604 to electrically shield and ground the PCB 604. The shielding layer 618 can be a conductive tape adhered to one or more surfaces of the PCB 604.

[0084] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding support structures for display modules, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Fig. 7A and Figure 7B Various examples of electronic devices are described that include components having various features in various arrangements, such as support structures for display modules.

[0085] Fig. 7A and Figure 7BA display module 700 is shown having optical films 702A-702C supported by a support structure 704. The support structure 704 may form a first inlet 706 and a second inlet 708 separated by an intermediate wall 710. The intermediate wall 710 may provide additional rigidity to the support structure 704. The intermediate wall 710 may also separate the first inlet 706 and the second inlet 708 so that the first inlet 706 may have a first depth D1 and a first thickness T1 that are independent of the second depth D2 and the second thickness T2 of the second inlet 708. In some examples, the first depth D1 may be greater than the second depth D2. Alternatively, the first depth D1 of the first inlet 706 may be less than or equal to the second depth D2 of the second inlet 708. The greater depth may provide additional surface area within the first inlet 706 for adhering one of the optical films 702A-702C within the first inlet 706. For example, as Figure 7B As shown, a pressure sensitive adhesive tape 712 may adhere the optical film 702B within the first inlet 706 .

[0086] In some examples, the first and second inlets 706, 708 can each receive one or more of the optical films 702A-702C. Figure 7B As shown, the first inlet 706 can receive the optical film 702A and the optical film 702B, while the second inlet 708 can receive the optical films 702A, 702B, and 702C. One or both of the first inlet 706 and the second inlet 708 can receive the optical films 702A-702C that are not disposed in the other inlet. For example, a portion of the optical film 702C can be disposed in the second inlet 708 but not in the first inlet 706, such as Figure 7B Therefore, the first thickness T1 of the first inlet 706 may be different from the second thickness T2 of the second inlet 708. For example, the second thickness T2 of the second inlet 708 may be greater than the first thickness T1 of the first inlet 706. Alternatively, the first thickness T1 of the first inlet 706 may be greater than or equal to the second thickness T2 of the second inlet 708.

[0087] Any number or type of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding modified support structures, may be applied not only to the specific examples discussed herein, but to any number of examples in any combination. Figure 8 Various examples of electronic devices are described that include components having various features in various arrangements, such as modified support structures.

[0088] Figure 8 A close-up front view of an electronic device 800 including a housing 802, a support structure 804, and an array of sensors 806A-806E is shown. The electronic device 800 may be substantially similar to the electronic devices 100, 200, 300, 400, 500 and may include some or all of the features of the electronic devices. The array of sensors 806A-806E may include one or more sensors, such as a microphone, an ambient light sensor, one or more cameras, an infrared sensor, a combination thereof, or any other sensor. One or more of the sensors 806A-806E may be disposed in one or more recessed portions 808A, 808B formed in the support structure 804. For example, as Figure 8 As shown, sensor 806B may be disposed within recess 808A, and sensor 806D may be disposed within recess 808B. Alternatively or in addition, one or more edges 810 of support structure 804 may be chamfered, rounded, stepped, or formed to accommodate flexible traces 812 extending into one or more sensors within the array of sensors 806A-806E. In some examples, support structure 804 may include a chamfer or rounded shape along the entire length of edge 810. In some examples, support structure 804 may include a chamfer or rounded shape at different sections of edge 810. For example, edge 810 adjacent to recess 808A may be chamfered or rounded to accommodate flexible trace 812.

[0089] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding a display module including an optical film and a support structure, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Fig. 9 Various examples of electronic devices are described that include components having various features in various arrangements, such as a display module having an optical film and a support structure.

[0090] Fig. 9 A close-up cross-sectional side view of a display module 900 is shown having a support structure 902, a PCB 904, an optical film 906, and transparent layers 908, 910. In some examples, the support structure 902 can be attached between the transparent layer 908 and the PCB 904. For example, the support structure 902 can be adhered between the transparent layer 908 and the PCB 904 by one or more layers of pressure sensitive adhesive tape 914.

[0091] As previously referenced Figure 6As described above, PCB 904 can provide structural rigidity or support for display module 900. For example, PCB 904 can have sufficient rigidity to provide structural support so that display module 900 does not require a rigid substrate or base, which would increase the thickness of display module 900 and necessarily increase the overall thickness of the electronic device. In some examples, shielding layer 916 can be adhered to PCB 904 to electrically shield PCB 904 and ground it. Shielding layer 916 can be a conductive tape adhered to one or more surfaces of PCB 904.

[0092] In some examples, one or more of the optical films 906 may be staggered, notched, or cut so that the base 918 of the support structure 902 may be wider to increase the available surface area to which the PSA tape 914 may adhere. For example, the optical films 906A and 906B may be staggered, notched, or cut so that the protrusions 920 of the base 918 may extend toward the optical films 906 and define a larger surface area of ​​the support structure 902 to which the PSA tape 914 may be applied. Fig. 9 Only optical films 906A and 906B are shown as being staggered, notched, or cut, but in other examples, additional or alternative optical films 906 may be staggered, notched, or cut.

[0093] Any number or types of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding printed circuit boards with spacers, may be applied not only to the specific examples discussed herein, but to any number of examples in any combination. Fig. 10A and Fig. 10B Various examples of electronic devices are described that include components, such as printed circuit boards, having various features in various arrangements.

[0094] Fig. 10A 1 shows a cross-sectional front view of the display module 1000. More specifically, Fig. 10AA side of a display module 1000 is shown, which includes a PCB 1002 electrically coupled to an array of LEDs 1004. The PCB 1002 may include an electronic component 1006 that provides electrical signals to other components of the display module 1000. For example, the electronic component 1006 may be a driver that provides power and / or signals to the array of LEDs 1004 to generate display graphics for the electronic device. During a fall event, other components within the electronic device may be displaced and physically contact the PCB 1002 and / or the electronic component 1006 disposed on the PCB 1002. Such physical contact may damage the electronic component 1006, damage electrical traces within the PCB 1002, or otherwise render portions of the PCB 1002 inoperable. One or more spacers 1008A, 1008B may be disposed on an unoccupied portion of the PCB 10002 (i.e., an area on the surface of the PCB 1002 that is not occupied by the electronic component 1006). One or more spacers 1008A, 1008B may limit or reduce physical contact between the PCB 1002 and other components of the electronic device.

[0095] Fig. 10B A detailed view of display module 1000 is shown. In some examples, one or more spacers 1008A may include a material or material properties that are different from spacers 1008B. For example, spacer 1008A may be made of glass reinforced epoxy, while spacer 1008B may be injection molded polycarbonate plastic. In addition or alternatively, spacers 1008A, 1008B may include polymers, metals, ceramics, or combinations thereof. Each of spacers 1008A, 1008B may be attached to PCB 1002, for example, by an adhesive, a fastener, a weld, a welding process, or a combination thereof. In some examples, each of spacers 1008B may have a unique shape and size to fit in an area of ​​PCB 1002 that does not have electronic components 1006.

[0096] Any number or types of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding flexible traces and stiffeners, may be applied not only to the specific examples discussed herein, but to any number of examples in any combination. Fig.11 Various examples of electronic devices are described that include components having various features, such as flexible traces and stiffeners, in various arrangements.

[0097] Fig.11A close-up cross-sectional side view of a display module 1100 electrically coupled to a processor 1102 via a flexible trace 1104 is shown. In some examples, the flexible trace 1104 can extend around the display module 1100 and couple to an electronic component 1106 (e.g., a processor, a circuit board, a field programmable gate array (FPGA), a logic board, a device driver, or another type of electronic component) of the display module 1100. At least a portion of the flexible trace 1104 can be covered by a cover layer 1108. The cover layer 1108 can adhere to the flexible trace 1104 and shield or otherwise protect the flexible trace 1104 from engaging other components within the electronic device.

[0098] In some examples, the stiffener 1110 may be disposed between a segment of the flexible trace 1104 and a segment of the cover layer 1108. The stiffener 1110 may force the flexible trace 1104 to bend around the display module 1100 so that the flexible trace 1104 may be disposed closer to the display module 1100. For example, the stiffener 1110 may be adhered to the flexible trace 1104 to bend the flexible trace 1104 to form angles A1, A2. The segment of the flexible trace 1104 adhered to the stiffener 1110 may remain flat so that the segment of the flexible trace 1104 may be positioned closer to the display module 1100. Otherwise, the flexible trace 1104 may extend further from the display module 1100 and contact another electronic component or housing of the electronic device.

[0099] Any number or types of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding display modules with various material properties and characteristics, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Fig. 12A and Fig. 12B Various examples of electronic devices are described that include components, such as display modules, having various features in various arrangements.

[0100] Fig. 12A A rear perspective view of a display module 1200 is shown having a surface 1202 at least partially covered by one or more layers 1204A-1204E. Fig. 12BA partially exploded view of layers 1204A-1204E covering a portion of surface 1202 is shown. Although each of layers 1204A-1204E is shown as being disposed in a particular order at a particular location relative to surface 1202, some of layers 1204A-1204E may be omitted, rearranged, or positioned at other locations relative to surface 1202. For example, in some examples, layer 1204E may cover all or a majority of surface 1202. Layer 1204A may be a polyester tape that shields, protects, waterproofs, or otherwise acts as a barrier between display module 1200 and other components within the electronic device. Layer 1204B may include an elastic material that cushions or relieves display module 1200 during a fall event or other action of displacing other components of an electronic device into display module 1200 or displacing the display module into other components of an electronic device. Layer 1204C may be a double-sided pressure-sensitive adhesive tape. Layer 1204D may be a stiffener or semi-rigid member that distributes concentrated impacts at display module 1200 over a larger area of ​​layer 1204D to reduce or prevent damage to display module 1200. Layer 1204E may be a conductive material such as a conductive pressure-sensitive adhesive tape that grounds display module 1200 and / or shields the display module from electromagnetic waves emitted by other electronic components of the electronic device.

[0101] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding wireless communications and antennas, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. FIG. 13A to FIG. 13C Various examples of electronic devices are described that include components having various features in various arrangements, such as millimeter wave antenna systems.

[0102] Fig.13AA cross-sectional rear view of an electronic device 1300 including a housing or casing 1302 is shown. The electronic device 1300 may be substantially similar to the electronic devices 100, 200, 300, 400, 500, 800 described herein, and may include some or all of the features of the electronic devices described herein. In some examples, the electronic device 1300 may include an antenna for communicating via a millimeter wave spectrum. For example, the electronic device 1300 may include a first millimeter wave antenna 1304, a second millimeter wave antenna 1306, and a third millimeter wave antenna 1308. Compared to antennas of other spectrums, millimeter wave antennas may be more directional and more susceptible to attenuation due to occlusion. For example, with respect to attenuation, if a user places his or her hand on a millimeter wave antenna, communication through the antenna may suffer a stop or stop completely. With respect to directionality, if the millimeter wave antenna is pointed away from a cellular tower by more than a certain angle, the antenna may stop being able to communicate effectively with the cellular tower. To mitigate these effects, the electronic device 1300 may include multiple millimeter wave antennas (e.g., first millimeter wave antenna, second millimeter wave antenna, and third millimeter wave antenna 1304, 1306, 1308), strategically positioned to enable wireless communication in multiple different positions, locations, and orientations. In some examples, the first millimeter wave antenna 1304 may be oriented within the housing 1302 as a rear transmit antenna. In other words, the first millimeter wave antenna 1304 may primarily transmit and receive electromagnetic signals in a direction perpendicular to the rear surface of the device. For example, the first millimeter wave antenna 1304 may transmit and receive electromagnetic signals through an RF transparent material or window formed within the rear surface of the housing 1302. In some examples, the second millimeter wave antenna 1306 may be oriented within the housing 1302 as a front transmit antenna. In other words, the second millimeter wave antenna 1306 may primarily transmit and receive electromagnetic signals in a direction perpendicular to the front surface or cover glass (not shown) of the electronic device 1300. In some examples, the third millimeter wave antenna 1308 may be oriented within the housing 1302 as a side-firing antenna. In other words, the third millimeter wave antenna 1308 can transmit and receive electromagnetic signals primarily in a direction perpendicular to the side surface or side wall of the housing 1302 of the electronic device 1300. It should be understood that a directional millimeter wave antenna need not be oriented directly toward another antenna in order to communicate, but can tolerate slight misalignment (e.g., + / - 15 degrees, + / - 30 degrees, or another value).

[0103] In some examples, at least one of the first millimeter wave antenna, the second millimeter wave antenna, and the third millimeter wave antenna 1304, 1306, 1308 includes an element configured to communicate via a 5G wireless protocol. 5G communication can be implemented using a variety of different communication protocols. For example, 5G communication can use a communication protocol that utilizes a frequency band below 6 GHz (also referred to as a sub-6 GHz spectrum). As another example, 5G communication can use a communication protocol that utilizes a frequency band above 24 GHz (also referred to as a millimeter wave spectrum). In addition, the specific frequency band of any given 5G implementation may be different from other specific implementations. For example, different wireless communication providers may use different frequency bands in the millimeter wave spectrum (for example, one provider may use a frequency of about 28 GHz to implement a 5G communication network, while another provider may use a frequency of about 39 GHz to implement it). As described herein, a specific antenna group implemented in the electronic device 1300 (for example, a first millimeter wave antenna, a second millimeter wave antenna, and a third millimeter wave antenna 1304, 1306, 1308) may be configured to allow communication via one or more of the frequency bands that implement 5G communication.

[0104] One or more control signals, one or more power signals, one or more frequency signals, and a ground may be provided to each of the first, second, and third millimeter wave antennas 1304, 1306, 1308. For example, the first millimeter wave antenna 1304 may be electrically coupled to the first flexible trace 1310. The first flexible trace 1310 may provide the first millimeter wave antenna 1304 with a power signal, a control signal, and a frequency signal. A frequency signal (e.g., two intermediate frequency signals in the range of about 5 GHz to about 15 GHz) may be generated at an intermediate frequency source 1312 and carried to the first flexible trace 1310 by a first pair of coaxial cables 1314. For example, the frequency signal may be two intermediate frequency signals of about 10 GHz. The first flexible trace 1310 may be grounded, for example, by a fastener or other conductive communication with the housing 1302.

[0105] In some examples, the second millimeter wave antenna 1306 can be electrically coupled to the second flexible trace 1316. The second flexible trace 1316 can provide power signals, control signals, and frequency signals to the second millimeter wave antenna 1306. The frequency signals (e.g., two intermediate frequency signals of approximately 10 GHz) can be generated at the intermediate frequency source 1312 and carried to the second flexible trace 1316 by the second pair of coaxial cables 1318. The second flexible trace 1316 can be grounded, for example, by a fastener or other conductive communication with the housing 1302.

[0106] In some examples, the third millimeter wave antenna 1308 can be electrically coupled to the third flexible trace 1320. The third flexible trace 1320 can provide power signals, control signals, and frequency signals to the third millimeter wave antenna 1308. The frequency signals (e.g., two intermediate frequency signals of approximately 10 GHz) can be generated at the intermediate frequency source 1312 and carried to the third flexible trace 1320 by the third pair of coaxial cables 1322. The third flexible trace 1320 can be grounded, for example, by a fastener or other conductive communication with the housing 1302.

[0107] Signals with relatively high frequencies required to satisfactorily operate the millimeter wave antenna may suffer from a loss in signal strength when transmitted from a signal source or generator (e.g., intermediate frequency source 1312) to the millimeter wave antenna. In fact, the greater the distance between the signal source and the antenna, the greater the loss in signal strength over the distance. In some examples, the first pair of coaxial cables, the second pair of coaxial cables, and the third pair of coaxial cables 1314, 1318, 1322 may each be shielded and sized to limit the loss of intermediate frequency signals when the signals are transmitted from the intermediate frequency source 1312 to each corresponding millimeter wave antenna 1304, 1306, 1308. For example, the material, diameter, shielding, and wiring of each pair of the paired coaxial cables 1314, 1318, 1322 may be selected to limit or reduce the loss of signal strength per millimeter experienced by the intermediate frequency transmitted through each coaxial cable.

[0108] Additionally or alternatively, each pair of coaxial cables 1314, 1318, 1322 may be electrically coupled to a corresponding flexible trace near or adjacent to its corresponding millimeter wave antenna 1304, 1306, 1308 to mitigate signal strength losses that occur when an intermediate frequency (IF) signal is propagated through the flexible traces (e.g., flexible traces 1310, 1316, 1320). In other words, each of the pair of coaxial cables 1314, 1318, 1322 may be electrically coupled to the corresponding flexible trace at a location on the flexible trace where the flexible trace is only required to carry the IF signal a relatively short distance. For example, the location at which a coaxial cable in a pair of coaxial cables 1314 on the first flexible trace 1310 is electrically coupled to the flexible trace 1310 may be about 15 mm, between about 15 mm and about 10 mm, between about 10 mm and about 5 mm, or less than 5 mm from the millimeter wave antenna 1304. Thus, the signal strength loss between the intermediate frequency source 1312 and each respective millimeter wave antenna 1304, 1306, 1308 may be approximately 7 dB, between 15 dB and 10 dB, between 10 dB and 5 dB, or less than 5 dB.

[0109] In some examples, each pair of coaxial cables 1314, 1318, 1322 can have a respective length (e.g., the distance between span 1312 and the respective flexible trace 1310, 1316, 1320) that is greater than the respective length through which each of the flexible traces 1310, 1316, 1320 must propagate to reach the antenna (e.g., the millimeter wave antennas 1304, 1306, 1308). For example, the length of each coaxial cable in the first pair of coaxial cables 1314 can be at least 5 times the length through which the IF signal must propagate within the first flexible trace 1310 to reach the first millimeter wave antenna 1304. In some examples, the length of each coaxial cable in the first pair of coaxial cables 1314 can be at least 10 times the length through which the IF signal must propagate to reach the first millimeter wave antenna 1304 within the first flexible trace 1310. Additionally or alternatively, the length of each coaxial cable in the second pair of coaxial cables 1318 may be at least 5 times the length within the second flexible trace 1316 that the IF signal must propagate to reach the second millimeter wave antenna 1306. In some examples, the length of each coaxial cable in the second pair of coaxial cables 1318 may be at least 10 times the length within the second flexible trace 1316 that the IF signal must propagate to reach the second millimeter wave antenna 1306. Additionally or alternatively, the length of each coaxial cable in the third pair of coaxial cables 1322 may be at least 5 times the length within the third flexible trace 1320 that the IF signal must propagate to reach the third millimeter wave antenna 1308. In some examples, the length of each coaxial cable in the third pair of coaxial cables 1322 may be at least 10 times the length within the third flexible trace 1320 that the IF signal must propagate to reach the third millimeter wave antenna 1308.

[0110] Fig. 13B A second millimeter wave antenna 1306 of the electronic device 1300 is shown electrically coupled to an intermediate frequency source 1312 via a second pair of coaxial cables 1318 and a second flexible trace 1316. In some examples, power signals, ground paths, and control signals can be provided to the second millimeter wave antenna 1306 via different electrical traces formed within the second flexible trace 1316. In some examples, the second flexible trace 1316 can cause more loss in the intermediate frequency than the second pair of coaxial cables 1318. Therefore, the second pair of coaxial cables 1318 can be electrically coupled to the second flexible trace 1316 proximate to the second millimeter wave antenna 1306 to reduce the distance the intermediate frequency needs to travel through the second flexible trace 1316.

[0111] Fig. 13CA second millimeter wave antenna 1306 of the electronic device 1300 is shown electrically coupled to the intermediate frequency source 1312 via a second pair of coaxial cables 1318 and a second flexible trace 1316. In some examples, the second flexible trace 1316 can additionally or alternatively be electrically coupled to another component of the electronic device 1300. For example, the second flexible trace 1316 can provide power and control signals to an input component 1324 such as a button, sensor, switch, or other component capable of receiving input from a user of the electronic device 1300.

[0112] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding electrically grounding a display module, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Figures 14 to 16D Various examples of electronic devices are described that include components having various features, such as ground elements and ground layers, in various arrangements.

[0113] Fig.14 A cross-sectional side view of an electronic device 1400 including a housing 1402 is shown. The electronic device 1400 may be substantially similar to the electronic devices 100, 200, 300, 400, 500, 800, 1300, and may include some or all of the features of the electronic devices. The housing 1402 may be substantially similar to the housing 102, and may include some or all of the features of the housing. For example, the housing 1402 may include a frame 1404 and a back plate 1406. In some examples, the housing 1402 may include a dielectric 1408 disposed between at least a portion of the frame 1404 and the back plate 1406. The dielectric 1408 may electrically isolate one or more portions of the housing 1402 to enable wireless communication via one or more antennas. For example, the dielectric 1408 may be formed of or include a substantially non-conductive material or an electrically insulating material so that a portion of the housing 1402 (e.g., a portion of the frame 1404) may be electrically isolated to act as an antenna for the electronic device 1400.

[0114] The electronic device 1400 may include a display module 1410 that is at least partially disposed within the housing 1402. In some examples, the display module 1410 may be electrically grounded to the back plate 1406 via a grounding element 1412 that is biased to contact a lower or bottom surface of the display module 1410. The grounding element 1412 may be attached to the back plate 1406 or the frame 1404 so that a current induced on the display module 1410 by an antenna (not shown) may be grounded from the display module 1410 to the back plate 1406 or the frame 1404. In some examples, the current density at the contact point between the display module 1410 and the grounding element 1412 may generate noise due to passive intermodulation (PIM) and / or another effect of relatively high current density at the contact point between the display module 1410 and the grounding element 1412. The noise may adversely affect the operation of one or more antennas of the electronic device 1400. In order to reduce or eliminate noise that may cause adverse effects, a conductive layer 1414 may be disposed between the display module 1410 and the ground element 1412 .

[0115] In some examples, the conductive layer 1414 may include a metal such as copper, gold, silver, nickel, a combination thereof, or another conductive metal. For example, the conductive layer 1414 may include a foil or a woven fabric that has been electroplated with gold. A more robust material (e.g., a thicker material, a more durable material, etc.) may be advantageous in withstanding the deteriorating effects of the current density and force applied to the conductive layer 1414 by the grounding element 1412. The conductive layer 1414 may be adhered or otherwise attached to the display module 1410. The conductive layer 1414 may be attached to at least a portion of the surface of the display module 1410 that faces the backplane 1406 or the frame 1404.

[0116] Fig.15AA partial cross-sectional rear view of an electronic device 1500 including a cover glass 1502 and a display module 1504 disposed adjacent to the cover glass 1502 is shown. The electronic device 1500 may be substantially similar to the electronic devices 100, 200, 300, 400, 500, 800, 1300, 1400, and may include some or all of the features of the electronic devices. When one or more antennas 1506, 1508 generate electromagnetic waves (e.g., transmit), the electromagnetic waves may induce currents on the display module 1504, which may adversely affect the performance of the one or more antennas 1506, 1508. In some examples, a first ground layer 1510 may be disposed on the display module 1504 near the first antenna 1506. In addition or alternatively, a second ground layer 1512 may be disposed on the display module 1504 near the second antenna 1508. In some examples, the first and second ground layers 1510, 1512 may be at least partially disposed over the flexible electrical traces such that the flexible electrical traces are disposed between the rear surface 1514 of the display module 1504 and the first and / or second ground layers 1510, 1512. In other examples, one or more flexible electrical traces may be disposed over one or both of the ground layers 1510, 1512 such that at least one of the first and second ground layers 1510, 1512 is disposed between the flexible traces and the rear surface 1514. The first and second ground layers 1510, 1512 may include conductive materials that electrically ground the display module 1504 to a housing or case (not shown) to reduce or eliminate currents induced on the display module 1504 by operating the first and / or second antennas 1506, 1508. For example, the first and second ground layers 1510, 1512 may be conductive tapes adhered to the display module 1504.

[0117] In some examples, the first ground layer 1510 can be at least partially disposed over multiple surfaces of the display module 1504. For example, Fig. 15B As shown, the first ground layer 1510 may at least partially cover the rear surface 1514 and one or more side surfaces 1516 of the display module 1504. In addition or alternatively, the second ground layer 1508 may at least partially cover the rear surface 1514 and one or more side surfaces 1516 of the display module 1504. In some examples, at least one of the rear surface 1514 or the side surfaces 1516 may be orthogonal or non-parallel to each other. For example, the rear surface 1514 may be perpendicular or orthogonal to one or both of the side surfaces 1516. In some examples, each of the side surfaces 1516 may be perpendicular or orthogonal to each other. One or more of the side surfaces 1516 covered by the first ground layer 1510 and / or the second ground layer 1512 may face a portion of the first antenna and / or the second antenna 1506, 1508.

[0118] In some examples, the first ground layer 1510 may form a first tab 1518 that is adhered or otherwise attached to the housing (not shown). For example, the first tab 1518 may be disposed between the housing and the cover glass 1502. The first ground layer 1510 may form additional tabs, such as a second tab 1520 that is adhered or otherwise attached to the housing (not shown). For example, the second tab 1520 may be disposed between the housing and the cover glass 1502. The first and second tabs 1518, 1520 may be disposed on opposite ends of the first antenna 1506 to contact the housing at two different locations on the housing. In other words, the first and second tabs 1518, 1520 may contact the housing (not shown) at respective locations that are spaced apart or otherwise separated by a distance. In some examples, the distance may be greater than or equal to the length of the first antenna 1506.

[0119] In some examples, the second ground layer 1512 may form a third tab 1522 that is adhered or otherwise attached to the housing (not shown). For example, the third tab 1522 may be disposed between the housing and the cover glass 1502. The second ground layer 1512 may form additional tabs, such as a fourth tab 1524 that is adhered or otherwise attached to the housing (not shown). For example, the fourth tab 1524 may be disposed between the housing and the cover glass 1502. The third and fourth tabs 1522, 1524 may be disposed on opposite ends of the second antenna 1508 to contact the housing at two different locations on the housing. In other words, the third and fourth tabs 1522, 1524 may contact the housing (not shown) at respective locations that are spaced apart or otherwise separated by a distance. In some examples, the distance may be greater than or equal to the length of the second antenna 1508.

[0120] Fig.16A A close-up cross-sectional side view of an electronic device 1600 including a housing 1602 is shown. The housing 1602 may be substantially similar to the housings 102, 1402, and may include some or all of the features of the housings. For example, the housing 1602 may include a frame 1604 and a backplate 1606. In some examples, the housing 1602 may include a dielectric 1608 disposed between at least a portion of the frame 1604 and the backplate 1606. The dielectric 1608 may electrically isolate one or more portions of the housing 1602 to enable wireless communication via one or more antennas (not shown). For example, the dielectric 1608 may be formed of or include a substantially non-conductive material or an electrically insulating material so that a portion of the housing 1602 (e.g., a portion of the frame 1604) may be electrically isolated to act as an antenna for the electronic device 1600.

[0121] The electronic device 1600 may include a display module 1610 that is at least partially disposed within the housing 1602 and adjacent to the cover glass 1612. In some examples, the display module 1610 may be electrically grounded to the backplane 1606 via one or more grounding layers 1614. The one or more grounding layers 1614 may be substantially similar to some or all of the features of the grounding layers 1510, 1512 and may include some or all of the features of the grounding layers. For example, the grounding layer 1614 may include a conductive material that electrically grounds the display module 1610 to the housing 1602 or case to reduce or eliminate current induced on the display module 1610 by operating the first antenna and / or the second antenna (not shown). In some examples, the grounding layer 1614 may be a conductive tape adhered to one or more surfaces defined by the display module 1610.

[0122] The grounding layer 1614 may include a tab 1616 that is adhered or attached to the housing 1602 (e.g., the frame 1604). In some examples, the tab 1616 may be disposed between the frame 1604 and the cover glass 1612. When the tab 1616 is directly or indirectly attached to the cover glass (e.g., via a pressure sensitive adhesive (PSA) tape 1618), a drop event may cause the cover glass 1612 to deflect away from the frame 1604 and tear or pull the tab 1616 away from the frame 1604 to compromise the electrical ground established by the tab 1616 and the frame 1604. In some examples, such as Fig. 16B As shown, one or more intermediate materials or separation layers 1620A and / or 1620B may be applied between the tab 1616 and the PSA tape 1618. The first separation layer 1620A may be adhered to the PSA tape 1618, but otherwise not adhered to the second separation layer 1620B. The second separation layer 1620B may be adhered to the tab 1616 so that the tab 1616 remains attached to the frame 1604 when the cover glass 1612 is displaced away from the frame 1604. In other words, when the cover glass 1612 is displaced relative to the frame 1604, the first and second separation layers 1620A, 1620B may form a gap G. Although the separation layers 1620A, 1620B are shown as being substantially disposed between the PSA tape 1618 and the tab 1616, the separation layers 1620A, 1620B may extend further along the tab 1616. For example, as shown in FIG. Fig. 16C As shown, in some examples, each of the spacer layers 1620A, 1620B can extend along the tab 1616 toward the display module 1610 and limit contact between the tab 1616 and the cover glass 1612. In some examples, a coating or cover layer 1621 can be disposed over the ground layer 1614. Although Fig.16A , Fig. 16B and Fig. 16CThe example shown includes two separation layers (eg, first and second separation layers 1620A, 1620B), other examples may include more (eg, three or more) or fewer (eg, a single separation layer) separation layers.

[0123] Fig.16D A close-up perspective view of an electronic device 1600 including a ground layer 1614 is shown. In some examples, the ground layer 1614 can include features that allow the ground layer 1614 to move or flex relative to the display module 1610 and / or the housing 1602. For example, the ground layer 1614 can form one or more protrusions that enable the tab 1616 to remain attached to the frame 1604 when the display module 1610 is displaced or moved. In some examples, the ground layer 1614 can form a first protrusion 1622, a second protrusion 1624, and a third protrusion 1626. A first thinned section 1628 of the ground layer 1614 can be formed between the first and second protrusions 1622, 1624. A second thinned section 1630 of the ground layer 1614 can be formed between the second and third protrusions 1624, 1626. The first and second thinned sections 1628, 1630 are movable relative to the display module 1610 to enable the display module 1610 to move relative to the frame 1604 while maintaining contact between the tab 1616 and the frame 1604 (i.e., without compromising the electrical ground provided by the contact between the tab 1616 and the frame 1604). In other words, at least one of the first, second, and third protrusions 1622, 1624, 1626 is deformable to allow the display module 1610 to move relative to the frame 1604 while maintaining contact between the protrusion 1616 and the frame.

[0124] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0125] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0126] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0127] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then the user may be reminded again just before the personal information data is accessed by the application.

[0128] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0129] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0130] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that specific details are not required in order to practice the embodiments. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. A portable electronic device, comprising: A housing, the housing comprising: a frame at least partially defining an interior volume, the frame forming a first recess on an interior surface of the frame; and a back plate at least partially defining the interior volume, the back plate forming a second recess on an inner surface of the back plate; and a coupler disposed entirely within the interior volume and interconnecting the frame with the backplane, the coupler comprising: engaging a portion of the first recessed portion of the frame; and a protrusion positioned within and interlocked with the second recess of the back plate; wherein: the portion is a first protrusion adhered to the first recessed portion of the frame; the first recessed portion extends into the frame at an acute angle relative to the side wall of the frame; and The protrusion extends perpendicularly to the outer surface of the back plate into the second recess.

2. The portable electronic device according to claim 1, wherein: The coupler comprises a rigid polymer; and The coupler has a dielectric constant of at least 2ε at 1 MHz.

3. The portable electronic device according to claim 1, wherein: The protrusion is a second protrusion adhered in the second recessed portion of the back plate.

4. The portable electronic device according to claim 1, wherein: The housing comprises: a first curved surface; and A second curved surface is interconnected by a linear surface of the housing, the coupler interconnecting the frame and the back plate adjacent the linear surface. 5 . The portable electronic device of claim 1 , further comprising a dielectric member extending at least partially between the frame and the back plate.

6. The portable electronic device according to claim 5, wherein: The dielectric member is at least partially disposed between the portion of the coupler and the protrusion.

7. The portable electronic device according to claim 1, further comprising: Display module; A cover glass, wherein the cover glass is disposed above the display module; a first pressure-sensitive adhesive tape coupling a corner of the cover glass to the housing; and A second pressure-sensitive adhesive tape couples the cover glass to the linear portion of the housing, the first pressure-sensitive adhesive tape having a material property different from the material property of the second pressure-sensitive adhesive tape.

8. The portable electronic device of claim 1 further comprising a fastener attaching the coupler to the frame.

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