Resource pooling system and resource pooling method

Abstract

A resource pooling system is provided. The resource pooling system comprises a plurality of resource pools, each resource pool comprises a plurality of resource modules used for processing data or a plurality of resource modules used for storing data, and each resource module comprises an electronic integrated circuit chip with a PCIe physical interface and at least one optical module, the PCIe physical interface of the electronic integrated circuit chip is electrically connected with the electric port of the at least one optical module, and the optical port of the at least one optical module is used as the optical port of the resource module; and a switch having an optical port interconnected with the optical port of each resource module in the plurality of resource pools, the switch being configured to select at least a portion of resource modules from the plurality of resource pools and to transmit signals with the at least a portion of resource modules. The at least one optical module converts a first electrical signal from the PCIe physical interface of the electronic integrated circuit chip into a first optical signal and provides the first optical signal to the switch. And the at least one optical module converts a second optical signal from the switch into a second electric signal, and provides the second electric signal to the corresponding electronic integrated circuit chip through the PCIe physical interface.

Description

Technical Field

[0001] The present disclosure relates to the fields of communication and computing, and in particular to a resource pooling system and a resource pooling method. Background Art

[0002] With the rapid development of artificial intelligence technology, in the existing computing systems, the architectural innovation and computing power improvement of a single computing node cannot meet the growing demand for large-scale computing power. Data centers generally need to deploy tens of thousands of computing devices, and the simple stacking and combination of multiple computing nodes often causes network congestion. In addition, the resource configuration of CPU, GPU, memory and other resources inside the data center server is relatively fixed, and the resource requirements of different computing tasks are different. This leads to the fact that once the hardware configuration of the data center is fixed, its utilization rate is relatively low most of the time because the computing power cannot be flexibly scheduled. A better approach is to integrate resources and allocate them to computing tasks in a flexible and efficient manner through refined management. This idea is usually called resource pooling.

[0003] However, the current data center infrastructure design is difficult to support high-performance resource pooling. Because the physical distance between large-scale distributed computing devices is relatively large, Ethernet-based data communication is usually used between data center cabinets.

[0004] In the basic architecture of Ethernet-based data communication, the PCIe electrical signal output by the computing chip of the computing device needs to be converted at the physical layer and protocol layer through the Ethernet card, so as to convert the PCIe electrical signal into an Ethernet electrical signal, and then provide the Ethernet electrical signal to the Ethernet optical module to achieve electrical-optical conversion. The Ethernet optical signal output by the Ethernet optical module can be further provided to the Ethernet optoelectronic switch or optical switch. Vice versa, for example, the Ethernet optical signal from the Ethernet optoelectronic switch or optical switch can be provided to the Ethernet optical module for optoelectronic conversion, and the Ethernet electrical signal obtained from the Ethernet optical module can be further converted by the protocol through the Ethernet card to obtain the PCIe electrical signal. The PCIe electrical signal can be further received by the computing chip of another computing device. In the above manner, data exchange between different computing devices can be achieved.

[0005] In the above architecture, for example, the signal output / input by the computing chip is a high-speed serial electrical signal based on the PCIe physical layer (for example, a 16-channel electrical signal, such as an electrical signal in the format of 16×32G NRZ or 16×64G PAM4), which needs to be converted through an Ethernet card at the physical layer and protocol layer to be converted with an Ethernet-based electrical signal (for example, a 4-channel electrical signal, such as a 4×112G PAM4 electrical signal).

[0006] Under this architecture, the transmission rate of each channel of Ethernet electrical signals (for example, 112G) is limited by the bandwidth of Ethernet data exchange and the high communication delay, so it is difficult for data centers to achieve near-linear large-scale computing power expansion. However, this system has a lot of room for improvement. Achieving a distributed computing power network requires efficient data parallelism and synchronization mechanisms. Summary of the invention

[0007] The present disclosure is made in view of the above problems. On the one hand, the present disclosure provides a resource pooling system, including: multiple resource pools, each of which includes multiple resource modules for processing data or multiple resource modules for storing data, each resource module includes an electronic integrated circuit chip with a PCIe physical interface and at least one optical module, and the PCIe physical interface of the electronic integrated circuit chip and the electrical port of the at least one optical module are electrically interconnected, and the optical port of the at least one optical module serves as the optical port of the resource module; and a switch having an optical port interconnected with the optical ports of each resource module in the multiple resource pools, the switch being configured to select at least part of the resource modules from the multiple resource pools and transmit signals with the at least part of the resource modules. The at least one optical module converts a first electrical signal from the PCIe physical interface of the electronic integrated circuit chip into a first optical signal and provides it to the switch, and the at least one optical module converts a second optical signal from the switch into a second electrical signal, and provides it to the corresponding electronic integrated circuit chip through the PCIe physical interface.

[0008] In some embodiments, the multiple resource pools include: a central processing resource pool, including multiple central processing modules, serving as the multiple resource modules for processing data, each central processing module including a CPU chip, serving as the electronic integrated circuit chip having a PCIe physical interface; and a volatile storage resource pool, including multiple volatile storage modules, serving as the multiple resource modules for storing data, each volatile storage module including a volatile storage control chip, serving as the electronic integrated circuit chip having a PCIe physical interface, and each volatile storage module also including a volatile storage unit.

[0009] In some embodiments, the multiple resource pools also include: an artificial intelligence computing resource pool, including multiple artificial intelligence computing modules, as the multiple resource modules for processing data, each artificial intelligence computing module including an artificial intelligence computing chip, as the electronic integrated circuit chip with a PCIe physical interface.

[0010] In some embodiments, the multiple resource pools also include: a non-volatile storage resource pool, including multiple non-volatile storage modules as the multiple resource modules for storing data, each non-volatile storage module includes a non-volatile storage control chip as the electronic integrated circuit chip with a PCIe physical interface, and each non-volatile storage module also includes a non-volatile storage unit.

[0011] In some embodiments, the artificial intelligence computing chip includes one or more of a graphics processing unit (GPU), a neural network processor (NPU), a tensor processing unit (TPU), an intelligent processing unit (IPU), and a deep learning processor (DPU).

[0012] In some embodiments, the switch is an electrical switch including a switch chip and a plurality of optical modules. The switch chip has a plurality of PCIe physical interfaces, the plurality of PCIe physical interfaces of the switch chip and the electrical ports of the plurality of optical modules are electrically interconnected, the optical ports of the plurality of optical modules serve as the optical ports of the electrical switch, the electrical switch selects at least some of the resource modules from the plurality of resource pools for link connection by switching conductive paths in the switch chip, and the electrical switch transmits electrical signals within the switch to transmit signals between at least some of the resource modules.

[0013] In some embodiments, the electrical switch transmits signals between at least some of the resource modules by performing the following operations: causing a first optical module among the multiple optical modules to convert the first optical signal from the first resource module into a third electrical signal and provide the signal to the switch chip; causing the switch chip to transmit the third electrical signal to a second optical module among the multiple optical modules through the conductive path; causing the second optical module to convert the third electrical signal into a second optical signal and provide the signal to a second resource module.

[0014] In some embodiments, the first optical module and the second optical module are the same optical module, and the second optical signal and the first optical signal are the same optical signal.

[0015] In some embodiments, the first optical module and the optical module in the first resource module are the same optical module; and the third electrical signal and the first electrical signal are the same electrical signal.

[0016] In some embodiments, the switch is an optical switch, which selects at least some of the resource modules from the plurality of resource pools for link connection by reconstructing optical paths, and wherein the optical switch transmits optical signals within itself to transmit signals between at least some of the resource modules.

[0017] In some embodiments, each optical module of the at least one optical module includes: a control signal conversion channel for performing photoelectric conversion or electro-optical conversion on the PCIe sideband control signal; and a data signal conversion channel for performing photoelectric conversion or electro-optical conversion on the PCIe data signal, wherein the signal transmitted between at least some of the resource modules includes the PCIe sideband control signal and the PCIe data signal.

[0018] In some embodiments, the first electrical signal and the second electrical signal are PCIe electrical signals based on a PCIe physical layer and a PCIe protocol layer or PCIe / CXL electrical signals based on a PCIe physical layer and a CXL protocol layer.

[0019] In some embodiments, the third electrical signal is a PCIe electrical signal based on a PCIe physical layer and a PCIe protocol layer or a PCIe / CXL electrical signal based on a PCIe physical layer and a CXL protocol layer.

[0020] Another aspect of the present disclosure also provides a method for performing resource pooling based on the resource pooling system as described above. The method comprises: selecting at least part of the resource modules from the multiple resource pools through the switch for link connection; transmitting PCIe sideband control signals between the part of the resource modules through the switch; and transmitting PCIe data signals between the part of the resource modules through the switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a resource pooling system according to an embodiment of the present disclosure is shown.

[0022] Figures 2A-2D A schematic diagram showing examples of various resource modules in a resource pooling system according to an embodiment of the present disclosure.

[0023] Figure 3 A cross-sectional view showing a packaging form of a resource module in a resource pooling system according to an embodiment of the present disclosure.

[0024] Figure 4 A schematic diagram of an optical module in a resource pooling system according to an embodiment of the present disclosure is shown.

[0025] Figure 5A-5B A schematic diagram showing an example of an optical module in a resource pooling system according to an embodiment of the present disclosure is shown.

[0026] Figure 6 A schematic diagram showing an example of an optical module in a resource pooling system according to an embodiment of the present disclosure is shown.

[0027] Figure 7A schematic diagram showing an example of a resource pooling system using an electrical switch according to an embodiment of the present disclosure is shown.

[0028] Figure 8 A schematic diagram showing an example of an electrical switch in a resource pooling system according to an embodiment of the present disclosure is shown.

[0029] Fig. 9 A schematic diagram showing an example of a resource pooling system using an optical switch according to an embodiment of the present disclosure is shown.

[0030] Fig.10 A flow chart of a resource pooling method according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0031] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure should not be interpreted as being limited to the embodiments described herein, but rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0032] It should be noted that the various parts or components described in the various embodiments of the present disclosure are merely illustrative. In some cases, some of the parts or components may be omitted, or replaced with other parts or components having the same or similar functions, or additional parts or components may be added.

[0033] In addition, the various parts or components that are separated or combined with each other in various embodiments of the present disclosure are only for the convenience of description, which does not mean that they are physically separated or combined with each other, nor does it mean that such separation or combination is necessary. Those skilled in the art can arbitrarily separate or combine the various parts or components according to actual needs.

[0034] Without departing from the inventive concept of the present disclosure, any modifications or combinations described above fall within the protection scope of the present disclosure.

[0035] PCIe (also known as Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard. Its original name was "3GIO" and was proposed by Intel in 2001. PCIe is a full-duplex bus that uses high-speed serial transmission and can support higher frequencies. In addition, PCIe belongs to high-speed serial point-to-point high-bandwidth transmission. The connected devices are allocated exclusive channel bandwidth and no longer share the bus bandwidth like the PCI bus.

[0036] PCIe has multiple specifications, including PCIe x1, PCIe x4, PCIe x8, PCIe x16, PCIe x32, where the number after x indicates the number of lanes in the PCIe slot. PCIe slots are backward compatible, for example, a PCIe x16 slot can be plugged with x8, x4, x1 cards, and the final operating mode is determined by the PCIe card. For example, if a PCIe x16 slot is plugged with a PCIe x4 card, it will eventually run in PCIe x4 mode.

[0037] PCIe has released multiple versions, including PCIe 1.0, PCIe 2.0, PCIe 3.0, PCIe 4.0, PCIe 5.0, and PCIe 6.0. The various versions are backward compatible, and any version of PCIe cards and motherboards can work in the lowest version mode. For example, if a PCIe 3.0 card is inserted into a PCIe 2.0 slot, it will eventually run at PCIe 2.0.

[0038] As mentioned above, in Ethernet-based data communications, high-speed serial electrical signals based on the PCIe physical layer that are input into or output from a computing chip need to be converted between the physical layer and the protocol layer via an Ethernet card, thereby causing communication delays and limiting transmission bandwidth.

[0039] In order to solve the above problems, the present disclosure proposes a resource pooling solution for directly transmitting PCIe high-speed signals without Ethernet protocol conversion, so as to reduce communication delays during resource scheduling and data communication.

[0040] Figure 1 A schematic diagram of a resource pooling system 1000 according to an embodiment of the present disclosure is shown.

[0041] like Figure 1 As shown, the resource pooling system 1000 includes a plurality of resource pools (eg, resource pools 1 , 2 , 3 , 4 ) and a switch 604 .

[0042] In this disclosure, the term "resource pool" refers to a collection of all resources available in a system, which may also be referred to as a "resource cluster" or "resource group". These resources may be computing resources, storage resources, or other types of resources. Typically, the resources gathered in a particular "resource pool" are of the same type.

[0043] For example, Figure 1 The resource pools 1, 2, 3, and 4 shown may represent four resource pools with different resource types.

[0044] Each resource pool usually includes multiple resource modules. For example, Figure 1The resource pool 1 shown has multiple resource modules 1100, the resource pool 2 has multiple resource modules 1200, the resource pool 3 has multiple resource modules 1300, and the resource pool 4 has multiple resource modules 1400. The multiple resource modules in each resource pool may be multiple resource modules for processing data, or may also be multiple resource modules for storing data.

[0045] Although corresponding resource modules (eg, resource modules 1100, 1200, 1300, and 1400) in different resource pools generally have different resource types, they have some commonalities in terms of data transmission.

[0046] In the present disclosure, each resource module in each resource pool includes an electronic integrated circuit chip with a PCIe physical interface and at least one optical module, and the optical port (i.e., optical input port and optical output port) of at least one optical module is used as the optical port of the resource module. The optical port of each resource module is connected to the optical port of the switch, so that signals can be transmitted between the resource module and the switch through optical interconnection.

[0047] For example, Figure 1 As shown, the resource module 1100 in resource pool 1 includes an electronic integrated circuit chip 600 and an optical module 100, the resource module 1200 in resource pool 2 includes an electronic integrated circuit chip 601 and an optical module 100, the resource module 1300 in resource pool 3 includes an electronic integrated circuit chip 602 and an optical module 100, and the resource module 1400 in resource pool 4 includes an electronic integrated circuit chip 603 and an optical module 100.

[0048] Although the electronic integrated circuit chips 600, 601, 602 and 603 may be of different types in terms of functions, the electronic integrated circuit chips 600, 601, 602 and 603 are all electronic integrated circuit chips having a PCIe physical interface, and the PCIe physical interfaces of the electronic integrated circuit chips 600, 601, 602 and 603 and the electrical ports of at least one optical module 100 are electrically interconnected.

[0049] Such a configuration enables at least one optical module 100 to convert an electrical signal from a PCIe physical interface of an electronic integrated circuit chip 600, 601, 602, or 603 into an optical signal, and to provide the optical signal to a switch 604. Similarly, at least one optical module 100 can convert an optical signal from a switch 604 into an electrical signal, and provide the electrical signal to a corresponding electronic integrated circuit chip 600, 601, 602, or 603 through a PCIe physical interface.

[0050] The switch 604 has a plurality of optical ports (not shown) interconnected with the optical ports of each resource module in the plurality of resource pools (as shown by the black arrows). In addition, the switch 604 is configured to select at least some resource modules from the plurality of resource pools and transmit signals with at least some resource modules, thereby realizing point-to-point communication between different resource modules.

[0051] It should be noted that, in order to simplify the description, Figure 1 For each module (e.g., resource module 1100, 1200, 1300, or 1400), only one electronic integrated circuit chip and one optical module are shown, but this is only for illustration and not limitation. In actual situations, each resource module may include more than one electronic integrated circuit chip or more than one optical module, and the relationship between the electronic integrated circuit chip and the optical module is not limited to a one-to-one relationship. For example, in some embodiments, one electronic integrated circuit chip may be interconnected with multiple optical modules, or multiple electronic integrated circuit chips may also be interconnected with multiple optical modules.

[0052] The following will be combined with the attached Figures 2A to 2D describe Figure 1 Embodiments of various resource modules in a resource pooling system.

[0053] For example, in some embodiments, Figure 1 The resource pooling system shown may include Figure 2A The central processing module 2100 shown in the figure is composed of a central processing resource pool to interpret instructions and process data. Figure 1 The resource pooling system shown may also include Figure 2B The volatile storage module 2200 shown constitutes a volatile storage resource pool to perform processing storage operations (eg, data caching).

[0054] For example, Figure 2A As shown, the central processing module 2100 may include a CPU chip 301, and a PCIe physical interface 302 is arranged on the CPU chip 301 for electrically interconnecting with the electrical port of the optical module 100. In this case, the CPU chip 301 included in the central processing module 2100 is as follows Figure 1 A specific example of an electronic integrated circuit chip 600, 601, 602, or 603 is shown.

[0055] exist Figure 2AIn the central processing module 2100, since the PCIe physical interface 302 on the CPU chip 301 is connected to the electrical input and output port of the optical module 100, the PCIe high-speed electrical signal and the PCIe sideband low-speed electrical signal from the PCIe physical interface 302 of the CPU chip 301 can be converted into an optical signal through the optical module 100. Among them, the PCIe physical interface 302 of the CPU chip 301 is used to convert the electrical signal generated inside the CPU chip 301 into a PCIe electrical signal (for example, a high-speed electrical signal and a sideband low-speed electrical signal as shown in the figure), and the PCIe electrical signal is transmitted to the driver in the optical module 100, so that the PCIe electrical signal is directly loaded into the optical wave through the driver to form an optical signal.

[0056] Alternatively, in the reverse direction, the CPU chip 301 may receive a PCIe electrical signal from the optical module 100 through the PCIe physical interface 302, the PCIe electrical signal being received by the optical module 100 from an external device (eg, Figure 1 The switch 604 shown receives the optical signal and then performs photoelectric conversion on the optical signal.

[0057] In some embodiments, the CPU chip 301 is packaged in a packaging substrate 400 , and the packaged CPU chip 301 and at least one optical module 100 are arranged in a PCB board 500 .

[0058] In this arrangement, by arranging the CPU chip 301 and the optical module 100 on the same PCB board, the CPU chip 301 can be arranged as close to the optical module 100 as possible, thereby reducing the length of the PCB wiring between the CPU chip 301 and the optical module 100, which is beneficial to improving signal integrity and reducing transmission delay.

[0059] Now go to Figure 2B , which illustrates an example of a volatile storage module 2200 that constitutes a volatile storage resource pool.

[0060] As multiple resource modules for temporarily storing data, the volatile storage module 2200 includes a volatile storage control chip 304 and at least one optical module 100. The volatile storage control chip 304 is provided with a PCIe physical interface 302 for electrically interconnecting with the electrical port of the optical module 100. In this case, the volatile storage control chip 304 included in the volatile storage module 2200 is as follows: Figure 1 A specific example of an electronic integrated circuit chip 600, 601, 602, or 603 is shown.

[0061] exist Figure 2BIn the volatile storage module 2200 shown, since the PCIe physical interface 302 on the volatile storage control chip 304 is connected to the electrical input and output port of the optical module 100, the PCIe high-speed electrical signal and the PCIe sideband low-speed electrical signal from the PCIe physical interface 302 of the volatile storage control chip 304 can be converted into an optical signal through the optical module 100. Among them, the PCIe physical interface 302 is used to convert the electrical signal generated inside the volatile storage control chip 304 into a PCIe electrical signal (for example, a high-speed electrical signal and a sideband low-speed electrical signal as shown in the figure), and the PCIe electrical signal is transmitted to the driver in the optical module 100, so that the PCIe electrical signal is directly loaded into the optical wave through the driver to form an optical signal.

[0062] Alternatively, in the reverse direction, the volatile storage control chip 304 may receive a PCIe electrical signal from the optical module 100 through the PCIe physical interface 302, the PCIe electrical signal being transmitted by the optical module 100 from an external device (eg, Figure 1 The switch 604 shown receives the optical signal and then performs photoelectric conversion on the optical signal.

[0063] In addition, if Figure 2B As shown, the volatile storage module 2200 also includes a series of volatile storage units 306, which are connected to the volatile storage control chip 304 through an interface 305 (e.g., a DDR interface, a “double data rate” interface) on the volatile storage control chip 304, so that the volatile storage control chip 304 can access the volatile storage units 306.

[0064] The volatile storage unit 306 may be, for example, a dual in-line (DIMM) memory stick. For example, the DIMM memory stick may be disposed on the PCB board 500 through a slot and connected to the interface 305 through a trace in the PCB board 500. In some embodiments, the DIMM memory stick may be a DRAM.

[0065] In some embodiments, the volatile memory control chip 304 is packaged in a packaging substrate 400 , and the packaged volatile memory control chip 304 , at least one optical module 100 , and a series of volatile memory units 306 are arranged in a PCB board 500 .

[0066] In this arrangement, by arranging the volatile storage control chip 304 and the optical module 100 on the same PBC board, the volatile storage control chip 304 can be arranged as close to the optical module 100 as possible, thereby reducing the length of the PCB wiring between the volatile storage control chip 304 and the optical module 100, which is beneficial to improving signal integrity and reducing transmission delay.

[0067] Combination of the above Figure 2A-2B The example in Figure 1 An example of a resource module in a basic resource pool in a resource pooling system is shown.

[0068] Optionally, in order to meet different computing task requirements, the resource pooling system proposed in the present disclosure may also include other resource pools composed of other resource modules, such as an artificial intelligence computing resource pool or a non-volatile storage resource pool.

[0069] In some embodiments, for example, when the system needs to process a large number of artificial intelligence tasks, in order to speed up the processing speed of the system, it is necessary to configure the following Figure 2C The artificial intelligence computing module 2300 shown is composed of an artificial intelligence computing resource pool.

[0070] For example, Figure 2C As shown, the artificial intelligence computing module 2300 may include an artificial intelligence computing chip 303 and at least one optical module 100. A PCIe physical interface 302 is arranged on the artificial intelligence computing chip 303 for electrically interconnecting with the electrical port of the optical module 100. In this case, the artificial intelligence computing chip 303 included in the artificial intelligence computing module 2300 is as follows Figure 1 A specific example of an electronic integrated circuit chip 600, 601, 602, or 603 is shown.

[0071] exist Figure 2C In the artificial intelligence computing module 2300, since the PCIe physical interface 302 on the artificial intelligence computing chip 303 is connected to the electrical input and output port of the optical module 100, the PCIe high-speed electrical signal and the PCIe sideband low-speed electrical signal from the PCIe physical interface 302 of the artificial intelligence computing chip 303 can be converted into an optical signal through the optical module 100. Among them, the PCIe physical interface 302 is used to convert the electrical signal generated inside the artificial intelligence computing chip 303 into a PCIe electrical signal (for example, a high-speed electrical signal and a sideband low-speed electrical signal as shown in the figure), and transmit the PCIe electrical signal to the driver in the optical module 100, so that the PCIe electrical signal is directly loaded into the optical wave through the driver to form an optical signal.

[0072] Alternatively, in the reverse direction, the artificial intelligence computing chip 303 can receive a PCIe electrical signal from the optical module 100 through the PCIe physical interface 302, and the PCIe electrical signal is transmitted by the optical module 100 from an external device (e.g., Figure 1 The switch 604 shown receives the optical signal and then performs photoelectric conversion on the optical signal.

[0073] In some embodiments, the artificial intelligence computing chip 303 is packaged in a packaging substrate 400 , and the packaged artificial intelligence computing chip 303 and at least one optical module 100 are arranged in a PCB board 500 .

[0074] In this arrangement, by arranging the artificial intelligence computing chip 303 and the optical module 100 on the same PCB board, the artificial intelligence computing chip 303 can be arranged as close to the optical module 100 as possible, thereby reducing the length of the PCB wiring between the artificial intelligence computing chip 303 and the optical module 100, which is beneficial to improving signal integrity and reducing transmission delay.

[0075] like Figure 2C The artificial intelligence computing chip 303 shown may also be called an XPU or an artificial intelligence accelerator, etc., or may be various AI training chips, including a graphics processing unit (GPU), a neural network processor (NPU), a tensor processing unit (TPU), an intelligent processing unit (IPU), and a deep learning processor (DPU). One or more.

[0076] In some computing scenarios with high storage requirements, Figure 1 The resource pooling system shown is configured with an additional non-volatile storage resource pool. Figure 2D An example of nonvolatile storage modules 2400 constituting a nonvolatile storage resource pool is shown.

[0077] As a resource module for long-term data storage, the non-volatile storage module 2400 includes a non-volatile storage control chip 307 and at least one optical module 100. The non-volatile storage control chip 307 is provided with a PCIe physical interface 302 for electrically interconnecting with the electrical port of the optical module 100. In this case, the non-volatile storage control chip 307 included in the non-volatile storage module 2400 is as follows: Figure 1 A specific example of an electronic integrated circuit chip 600, 601, 602, or 603 is shown.

[0078] exist Figure 2DIn the non-volatile storage module 2400, since the PCIe physical interface 302 on the non-volatile storage control chip 307 is connected to the electrical input and output port of the optical module 100, the PCIe high-speed electrical signal and the PCIe sideband low-speed electrical signal from the PCIe physical interface 302 of the non-volatile storage control chip 307 can be converted into an optical signal through the optical module 100. Among them, the PCIe physical interface 302 is used to convert the electrical signal generated inside the non-volatile storage control chip 307 into a PCIe electrical signal (for example, a high-speed electrical signal and a sideband low-speed electrical signal as shown in the figure), and transmit the PCIe electrical signal to the driver in the optical module 100, so that the PCIe electrical signal is directly loaded into the optical wave through the driver to form an optical signal.

[0079] Alternatively, in the reverse direction, the non-volatile storage control chip 307 may receive a PCIe electrical signal from the optical module 100 through the PCIe physical interface 302, the PCIe electrical signal being received by the optical module 100 from an external device (eg, Figure 1 The switch 604 shown receives the optical signal and then performs photoelectric conversion on the optical signal.

[0080] In addition, if Figure 2D As shown, the nonvolatile storage module 2400 also includes a series of nonvolatile storage units 309 (e.g., flash memory units). The nonvolatile storage units 309 are connected to the nonvolatile storage control chip 307 through an interface 308 (e.g., a flash memory interface) on the nonvolatile storage control chip 307, so that the nonvolatile storage control chip 307 can access the nonvolatile storage units 309.

[0081] In some embodiments, the nonvolatile storage control chip 307 is packaged in a packaging substrate 400 , and the packaged nonvolatile storage control chip 307 , at least one optical module 100 , and a series of nonvolatile storage units 309 are arranged in a PCB board 500 .

[0082] In this arrangement, by arranging the non-volatile storage control chip 307 and the optical module 100 on the same PCB board, the non-volatile storage control chip 307 can be arranged as close to the optical module 100 as possible, thereby reducing the length of the PCB wiring between the non-volatile storage control chip 307 and the optical module 100, which is beneficial to improving signal integrity and reducing transmission delay.

[0083] The above describes the embodiments of resource modules in various resource pools that can be arranged in the resource pooling system proposed in the present disclosure. Figures 2A-2DThe various resource modules described are merely exemplary and non-exhaustive, and resource pools consisting of various other types of resource modules may also be arranged in the following manner: Figure 1 The resources are shown in the pooled system for scheduling by switch 604.

[0084] In addition, it should be noted that, although the resource modules in each resource pool described in the above embodiments have the same resource type, they do not need to have completely identical configurations.

[0085] For example, as mentioned above, it is assumed that there are 8 central processing modules 2100 in the central processing resource pool. Although these 8 central processing modules have similar functions, they do not necessarily need to have the same resource configuration. For example, the first central processing module 2100 may have 1 CPU chip 301 and 1 optical module 100, the second central processing module 2100 may have 2 CPU chips 301 and 2 optical modules 100, and the third central processing module 2100 may have 4 CPU chips 301 and 8 optical modules 100, and so on.

[0086] Similarly, each resource module in each volatile storage resource pool, non-volatile storage resource pool or artificial intelligence computing resource pool may also have different resource configurations.

[0087] Optionally, for each resource pool, each resource module therein may also have a completely identical configuration, or some resource modules therein may have the same configuration, and the remaining resource modules may have different configurations. Any configuration is possible.

[0088] The above combined Figures 2A-2D When describing the embodiments of each resource module, the layout of the electronic integrated circuit chip (for example, the CPU chip 301, the volatile storage control chip 304, the artificial intelligence computing chip 303 or the non-volatile storage control chip 307) in each resource module and the optical module 100 together arranged in the PCB board is mentioned. Figure 3 A cross-sectional view showing a packaging form of a resource module in a resource pooling system according to an embodiment of the present disclosure.

[0089] exist Figure 3 In the embodiment, the functional chip 300 may represent any one of the aforementioned CPU chip 301, the volatile storage control chip 304, the artificial intelligence computing chip 303 or the non-volatile storage control chip 307. Figure 3 In the embodiment, the functional electronic integrated circuit chip 300 with the PCIe physical interface 302 is packaged on a packaging substrate 400 and arranged on a PCB board 500 as a whole, and the optical module 100 is also arranged on the PCB board 500.

[0090] The PCIe high-speed electrical signals and PCIe sideband low-speed electrical signals on the functional electronic integrated circuit chip 300 are transmitted to the edge of the onboard optical module 100 through the package substrate traces and the PCB traces 308, and then undergo electro-optical conversion through the components in the optical module 100, and then are transmitted via the optical fiber 200.

[0091] In addition, the function chip 300 can also receive a PCIe electrical signal from the optical module 100 through the PCIe physical interface 302. The PCIe electrical signal is received by the optical module 100 from an external device (eg, Figure 1 The switch 604 shown receives the optical signal and then performs photoelectric conversion on the optical signal.

[0092] Since the PCB trace 308 can be as short as possible and has low loss, the layout of the onboard optical module is conducive to ensuring that the optical transmission system has a good signal-to-noise ratio to meet the requirements of the PCIe protocol.

[0093] It should be noted that Figure 3 Only a schematic arrangement of the functional chip 300 (for example, the CPU chip 301, the volatile storage control chip 304, the artificial intelligence computing chip 303 or the non-volatile storage control chip 307 as described above) and the optical module 100 is shown, and is not intended to limit the present disclosure.

[0094] Optionally, other types of arrangements between the function chip 300 and the optical module 100 are also possible. For example, the function chip 300 and the optical module 100 can be co-packaged on the substrate 400, or the optical module 100 can be pluggably arranged at the edge of the PCB board 500 and then connected to the function chip by means of PCB traces or overhead cables.

[0095] In addition, it should be noted that Figure 3 The purpose is only to illustrate the layout and connection between the functional chip 300 and the optical module 100, and does not show the Figure 2B The interface 305 and the volatile storage unit 306 on the volatile storage control chip 304 are not shown. Figure 2D The interface 308 and the non-volatile storage unit 309 on the non-volatile storage control chip 307 are shown. These components can be arranged on the PCB board 500 in any suitable manner.

[0096] In order to more fully and comprehensively explain the present disclosure, Figures 4 to 6 The specific details of the optical module 100 involved in the aforementioned embodiments of the present disclosure are introduced.

[0097] Embodiments of the present disclosure provide an optical module that can be directly driven by an input PCIe electrical signal and can directly output a PCIe electrical signal.

[0098] In some embodiments, the input PCIe electrical signal may be a PCIe electrical signal output from a PCIe standard physical interface, and the output PCIe electrical signal may be directly fed to the PCIe standard physical interface and may be reversely protocol converted by the PCIe standard physical interface.

[0099] For simplicity, in the following, such an optical module that is directly driven by a PCIe electrical signal and can directly output a PCIe electrical signal is referred to as a PCIe optical module.

[0100] It should be noted that, in this article, the term "PCIe electrical signal" refers to an electrical signal that complies with the PCIe bus standard. For example, the PCIe electrical signal can be an electrical signal obtained by performing protocol conversion on the physical layer of the PCIe interface on the external electronic integrated circuit chip. In addition, for example, the "PCIe electrical signal" can include a high-speed differential electrical signal and a sideband low-speed electrical signal directly output from the PCIe physical interface of the external electronic integrated circuit chip.

[0101] Depending on the data transmission rate and modulation mode adopted by the system, the "PCIe electrical signal" may include, for example, a high-speed differential electrical signal in a 32G NRZ format, or may include, for example, a high-speed differential electrical signal in a 64G PAM4 format.

[0102] Various embodiments of the PCIe optical module will be described below with reference to the accompanying drawings.

[0103] Figure 4 A schematic diagram showing the overall configuration of an optical module 100 according to an embodiment of the present disclosure.

[0104] like Figure 4 As shown, the optical module 100 functionally includes an electrical input / output interface EI / O, an optical input / output interface OI / O, a light emitting unit 700 , a light receiving unit 800 , and a control unit 900 .

[0105] The optical transmission unit 700 may also be referred to as a TX unit, and is used to convert an input electrical signal 110 received from the electrical input / output interface EI / O into an output optical signal 120, that is, to perform electrical-to-optical conversion (also referred to as EO conversion).

[0106] The optical receiving unit 800 may also be referred to as an RX unit, and is used to convert the input optical signal 210 received from the optical input / output interface OI / O into an output electrical signal 220, that is, perform optical-to-electrical conversion (also referred to as OE conversion).

[0107] The control unit 900 may be any form of controller or microcontroller, and is used to control the optical emitting unit 700 to perform EO conversion from the input electrical signal 110 to the output optical signal 120. Similarly, the control unit 900 may also control the optical receiving unit 800 to perform OE conversion from the input optical signal 210 to the output electrical signal 220.

[0108] As mentioned above, the optical module proposed in the present disclosure can be directly driven by a PCIe electrical signal and can directly output a PCIe electrical signal, mainly by configuring the electrical input and output interface as described above to be directly connected to the PCIe interface in the output port of the functional electronic integrated circuit chip, and directly transmitting the received signal to the driver in the optical emission unit 700 of the optical module. That is, the optical module receives the signal from the PCIe interface in the output port of the functional electronic integrated circuit chip and directly transmits it to the driver of the optical module without protocol conversion or other processing.

[0109] That is to say, Figure 1 The input electrical signal 110 and the output electrical signal 220 shown are both PCIe electrical signals.

[0110] In this way, compared with the Ethernet optical module, the PCIe optical module proposed in the present invention does not need to set a retimer, and does not need to set an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC) to perform analog-to-digital and / or digital-to-analog conversion on the high-speed electrical signal, so that the PCIe optical module is completely transparent to the digital logic protocol and reduces system latency.

[0111] In some embodiments, in the direction of EO conversion, the input electrical signal 110 may be an electrical signal from an external device, for example, an electrical signal from any external computing device, storage device, communication device, etc. In addition, the electrical signal 220 output from the optical module 100 may be provided to the same external device.

[0112] For example, the external device may be a device having a PCIe physical interface and capable of receiving or sending PCIe electrical signals. In this case, the input electrical signal as described above may be input into the electrical input / output interface EI / O of the optical module 100 through the PCIe physical interface of the external device, thereby performing EO conversion.

[0113] In the embodiments of the present disclosure, the external device may refer to various electronic integrated circuit chips as described above, for example, the CPU chip 301, the volatile storage control chip 304, the artificial intelligence computing chip 303 or the non-volatile storage control chip 307 as described above. In addition, the external device may also refer to the Figure 8 The switch chip 310 is mentioned.

[0114] In this case, for example, if the electrical signal output by the PCIe physical interface of the external device is a PCIe electrical signal carrying "information A", when the optical module 100 receives the PCIe electrical signal carrying "information A", the optical emitting unit 700 in the optical module 100 will convert the PCIe electrical signal into a corresponding optical signal under the control of the control unit 900, and the optical signal will also carry the same "information A". This carrying of information is achieved by the modulation operation of light in the optical emitting unit 700. The specific implementation method of the modulation of light will be described in detail later.

[0115] Therefore, converting the received input electrical signal 110 into the output optical signal 120 as described above actually means loading the information carried by the input electrical signal 110 onto the output optical signal 120 in a modulated manner.

[0116] Accordingly, in the direction of OE conversion, the input optical signal 210 may also be an optical signal from an external device. In addition, the optical signal 120 output from the optical module 100 may also be provided to the same external device.

[0117] The external device can, for example, provide the input optical signal 210 to the optical module 100 through an optical fiber, and the input optical signal 210 can carry specific information (e.g., "information B"). In other words, the input optical signal 210 can carry "information B" through a certain modulation technology. The optical receiving unit 800 in the optical module 100 performs OE conversion on such an optical signal carrying "information B" to obtain an electrical signal carrying the same "information B". Such an output electrical signal can then be provided to the external computing device, storage device, communication device, etc. as described above.

[0118] The PCIe interface as described above (for example, the PCIe interface in the output port of the electronic integrated circuit chip) may include a PCIe interface that complies with various versions, including but not limited to a PCIe interface that complies with any one of the PCIe 1.0, PCIe 2.0, PCIe 3.0, PCIe 4.0, PCIe 5.0, and PCIe 6.0 as described above. Similarly, under the corresponding version, the PCIe interface of the optical module 100 as described above may also be any one of various specifications, including but not limited to PCIe x1, PCIe x4, PCIe x8, PCIe x16, and PCIe x32.

[0119] Therefore, the PCIe electrical signal described above may be any one of the electrical signals conforming to the above various PCIe versions and various specifications.

[0120] By providing a PCIe optical module that is directly driven by a PCIe electrical signal and can directly output a PCIe electrical signal as described above, such a PCIe optical module can be used to interconnect computing devices more simply when building an optical network, thereby avoiding the conversion of the physical layer and protocol layer from PCIe to Ethernet.

[0121] In addition, since the PCIe optical module proposed in the present disclosure directly receives PCIe electrical signals and directly outputs PCIe electrical signals, the operation of further performing digital-to-analog conversion and analog-to-digital conversion inside the optical module before and after the conversion is omitted. In other words, the PCIe optical module proposed in the present disclosure may not include traditional DAC components and ADC components, so that the photoelectric and electro-optical conversions can be performed more quickly, which can help to further reduce the delay of data transmission.

[0122] Therefore, the PCIe optical module proposed in the present disclosure can not only solve the bandwidth limitation problem and high latency problem in Ethernet solutions, but also simplify the hardware design.

[0123] Optionally, an electrical signal based on the CXL protocol may be used in the PCIe optical module as described above to further reduce data transmission delay.

[0124] The CXL (also known as "High-Speed ​​Computing Link") protocol is an emerging technical specification developed by the open industry standards organization of the CXL Alliance, which can support data center acceleration. Since CXL is based on the PCIe protocol (PCIE 5.0) and is fully compatible with PCIe standard slots, it can enable the device's memory or cache to be quickly accessed globally by all devices that support the CXL protocol. Therefore, the CXL protocol can be used to complete fast access to the device through the PCIe standard interface, resulting in higher data access efficiency and lower local data access latency. In this article, the electrical signal based on the physical layer of the PCIe standard interface (such as PCIe 5.0) and using the CXL protocol can also be referred to as a PCIe / CXL electrical signal.

[0125] In some embodiments, the input electrical signal and the output electrical signal as described above can be PCIe / CXL electrical signals based on the physical layer of the PCIe interface and the CXL protocol layer. By transmitting electrical signals based on the CXL protocol in the PCIe standard interface, it is beneficial to further accelerate data access and data exchange.

[0126] Figure 5A FIG. 1 shows a structural diagram of an example of an optical module 100 according to an embodiment of the present disclosure. It should be noted that: Figure 5A The optical module 100 shown can be viewed as Figure 5A A more detailed embodiment of the light module 100 is shown.

[0127] For example, Figure 4 The light emitting unit 700 shown in FIG. 1 may include Figure 5A The optical transmitter 701A and the driver 702 are shown. The driver 702 is used to drive the optical transmitter 701A to transmit an optical signal as the output optical signal 120.

[0128] In addition, if Figure 4 The light receiving unit 800 shown in FIG. 8 may include Figure 5A The optical detector 801 and the amplifier 802 are shown. The optical detector 801 can convert the detected input optical signal 210 into an electrical signal, and the amplifier 802 can further amplify the converted electrical signal and then output the amplified electrical signal as the output electrical signal 220.

[0129] Figure 5A The illustrated optical transmitter 701A may be a "directly modulated" optical transmitter, such as a directly modulated vertical cavity surface laser (VCSEL) or a distributed feedback (DFB) laser.

[0130] The so-called "direct modulation" means that the control unit 900 can control the electrical signal provided by the driver 702 to the optical transmitter 701A according to the input electrical signal 110, thereby controlling the intensity of the optical signal emitted by the optical transmitter 701A, without using other modulators to load or modulate the information in the electrical signal into the emitted optical signal.

[0131] For example, the control unit 900 can directly control the magnitude of the current provided by the driver 702 according to the amplitude of the logic levels "1" and "0" of the input electrical signal 110, so that the intensity of the light emitted by the light emitter 701A can be linearly or substantially linearly related to the amplitude of the input current.

[0132] Optionally, the optical transmitter in the optical module of the present disclosure may also be an "external modulation" optical transmitter. As the name implies, an "external modulation" optical transmitter means that the optical transmitter itself cannot modulate light, but needs to rely on external equipment to modulate light.

[0133] Figure 5B FIG. 1 is a structural diagram of another example of the optical module 100 according to an embodiment of the present disclosure. Figure 5B In the embodiment, the optical transmitter 701B is, for example, an externally modulated laser, and Figure 4 The light emitting unit 700 shown needs to additionally include a modulator 703 in addition to the driver 702 and the light emitter 701B.

[0134] In this case, the optical transmitter 701B is in a stable light-emitting state and emits light with a uniform intensity. The light emitted by the optical transmitter 701B is provided to the modulator 703. The control unit 900 can control the electrical signal input to the modulator 703 through the driver 702, thereby modulating the amplitude, phase and other characteristics of the light received from the optical transmitter 701B, so as to modulate the information carried in the input electrical signal 110 onto the light to form the output optical signal 120.

[0135] Typical examples of the modulator 703 include integrated photonic modulators based on silicon, indium phosphide, thin-film lithium niobate or polymer, and the structure may be a micro-ring modulator, a Mach-Zehnder modulator or an electro-absorption modulator.

[0136] For example, in the case where the modulator 703 is an electro-absorption modulator, the control unit 900 can control the switch of the modulator 703 through the driver 702 to make it absorb or not absorb light, thereby absorbing the light emitted by the optical transmitter 701B (for example, corresponding to the output logic "0"), or not absorbing the light emitted by the optical transmitter 701B (for example, corresponding to the output logic "1"). In this way, the intensity and phase of the final output light can be controlled, so that information can be modulated or loaded onto the output optical signal 120.

[0137] It should be noted that the modulation formats of the logic levels "1" and "0" of the input electrical signal 110 mentioned above are merely exemplary and not limiting. In practice, the input electrical signal 110 may have any suitable modulation format.

[0138] also, Figure 5A-5B The driver 702, the photodetector 801 and the amplifier 802 shown in FIG. 8 can be implemented using any suitable components in the art.

[0139] For example, the driver 702 can be implemented by a circuit composed of various electronic components such as transistors, resistors, capacitors, etc. For example, the light detector 801 can be various types of photodiodes with various sensitivities, such as photomultiplier tubes (PMTs), avalanche photodiodes (APDs), silicon photomultiplier tubes (SiPMs), etc. In addition, the amplifier 802 can be a traditional transimpedance amplifier (TIA), or various types of amplifiers based on similar principles or other principles, which will not be elaborated in detail here.

[0140] The above mainly combines Figure 5A-5B Various embodiments of the internal structure of the PCIe optical module are described. The input signal and the output signal of the PCIe optical module will be described in detail below.

[0141] In the field of optical transmission, the signals transmitted in the system can be roughly divided into two categories according to their functions, one is data signal and the other is control signal.

[0142] Data signal refers to the signal that carries the target information data to be transmitted, which can be an electrical signal or an optical signal. For example, the data electrical signal can represent the data information through the amplitude and timing of its level, while the data optical signal can represent the data information through the intensity, phase, frequency and other characteristics of the modulated light. Since the data signal contains a huge amount of information and changes very quickly, it is generally necessary to use high-speed differential signals for transmission.

[0143] A control signal generally refers to a signal that carries control information or system information, and can also be either an electrical signal or an optical signal. Compared with a data signal, a control signal carries less information and does not change very quickly in the time domain. Some low-speed sideband signals can be used to transmit control signals.

[0144] In this disclosure, as mentioned above FIG. 5A to FIG. 5B The input and output signals discussed include data signals, ie signals carrying target information data to be transmitted. Figure 6 A schematic diagram showing various signals in the optical module 100 according to an embodiment of the present disclosure.

[0145] For example, Figure 6 As shown, the input electrical signal input into the optical module 100 may include a first data electrical signal 110 - 1 , and the first data electrical signal 110 - 1 may be an electrical signal having multiple channels.

[0146] In this case, the optical transmission unit 700 needs to include a corresponding plurality of transmission channels for converting the first data electrical signal 110 - 1 into a first data optical signal 120 - 1 , wherein the first data optical signal 120 - 1 also has a corresponding plurality of channels.

[0147] For example, when the first data electrical signal 110-1 has 8 channels, the optical transmission unit 700 also needs to include 8 transmission channels to support EO conversion of the electrical signal in each channel of the first data electrical signal 110-1. After EO conversion, the first data optical signal 120-1 also has 8 channels of optical output.

[0148] For example, when the first data electrical signal 110-1 has 32 channels, the optical transmission unit 700 also needs to include 32 transmission channels to support EO conversion of the electrical signal in each channel of the first data electrical signal 110-1. After EO conversion, the first data optical signal 120-1 also has 32 channels of optical output.

[0149] It should be noted that the light emitting unit 700 includes a plurality of emission channels, which means that for the electrical signal of each channel in the first data electrical signal 110 - 1 , a corresponding driver+optical emitter needs to be arranged to perform EO conversion on the electrical signal of the channel.

[0150] For example, when the first data electrical signal 110-1 has 8 channels, 8 sets of drivers + optical transmitters are required to drive the 8 electrical signals. When the first data electrical signal 110-1 has 16 channels, 16 sets of drivers + optical transmitters are required to drive the 8 electrical signals, and so on.

[0151] In some examples, the optical transmitter in each driver+optical transmitter group may be any one of the direct modulation optical transmitter and the external modulation optical transmitter as described above. In addition, in the case where the optical transmitter in each driver+optical transmitter group is an external modulation optical transmitter, each transmission channel also needs to additionally include a corresponding modulator, for example, the modulator may be as described above with respect to Figure 5B One of the various modulators described.

[0152] Preferably, when the first data electrical signal 110-1 has multiple channels, the multiple transmission channels in the optical transmission unit 700 can be configured with the same driver + optical transmitter group, or driver + optical transmitter + modulator group, thereby simplifying the design and control of the PCIe optical module.

[0153] For example, when the first data electrical signal 110-1 has 8 channels, each of the 8 transmission channels in the optical transmission unit 700 has the same configuration. For example, each transmission channel may include the same driver, the same combination of direct modulation optical transmitters, or each transmission channel may include the same driver, the same combination of external modulation optical transmitters and the same modulator.

[0154] However, any other arrangement also falls within the scope of the present disclosure. For example, when the first data electrical signal 110-1 has 8 channels, a combination of a driver + a VCSEL direct modulation laser can be configured for channel 1, a combination of a driver + a DFB direct modulation laser can be configured for channel 2, and a combination of a driver + an external modulation laser + an electro-absorption modulator can be configured for channels 3 to 8.

[0155] The same is true in the light receiving direction. Figure 6 As shown, the input optical signal input to the optical module 100 may include a second data optical signal 210-1, the second data optical signal 210-1 may be an optical signal having multiple channels, and the optical receiving unit 800 also correspondingly includes multiple receiving channels for converting the second data optical signal 210-1 into a second data electrical signal 220-1 having multiple channels.

[0156] For example, when the second data optical signal 210-1 has 8 channels, the optical receiving unit 800 also needs to include 8 receiving channels to support OE conversion of the optical signal in each channel of the second data optical signal 210-1. After OE conversion, the second data electrical signal 220-1 also has 8 channels of electrical output.

[0157] For example, when the second data optical signal 210-1 has 32 channels, the optical receiving unit 800 also needs to include 32 receiving channels to support OE conversion of the optical signal in each channel of the second data optical signal 210-1. After OE conversion, the second data electrical signal 220-1 also has 32 channels of electrical output.

[0158] It should be noted that the optical receiving unit 800 includes multiple receiving channels, which means that for the optical signal of each channel in the second data optical signal 210 - 1 , a corresponding optical detector+amplifier needs to be arranged to perform OE conversion on the electrical signal of the channel.

[0159] For example, when the second data optical signal 210-1 has 8 channels, 8 sets of optical detectors + amplifiers are needed to receive 8 optical signals. When the second data optical signal 210-1 has 16 channels, 16 sets of optical detectors + amplifiers are needed to receive 16 optical signals, and so on.

[0160] In some examples, the optical receiver and amplifier in each optical detector+amplifier set may be any one of a photodiode and a transimpedance amplifier as described above.

[0161] Preferably, when the second data optical signal 210 - 1 has multiple channels, the multiple receiving channels in the optical receiving unit 800 may be configured with the same optical detector+amplifier group.

[0162] For example, when the second data optical signal 210 - 1 has 8 channels, each of the 8 receiving channels in the optical receiving unit 800 may have the same configuration, such as each receiving channel may include the same combination of a photodiode and a transimpedance amplifier.

[0163] However, different arrangements for each receiving channel also fall within the scope of the present disclosure.

[0164] The above about Figure 6 An example is shown in which the input and output of the PCIe optical module include multiple channels. It should be understood that in practical applications, the input and output of the PCIe optical module may also include a single channel.

[0165] In addition, the number of channels of the data signal in the EO direction may be equal to the number of channels of the data signal in the OE direction. Optionally, the number of channels of the data signal in the EO direction may not be equal to the number of channels of the data signal in the OE direction.

[0166] In addition, it should be noted that the ordinal numbers such as "first" and "second" mentioned above in the present disclosure are only for distinguishing some terms or components, and are not intended to limit the primary and secondary relationships of these terms or components, nor are they intended to limit the time order of these terms or components when performing operations.

[0167] For example, in the above embodiments, "first" is used to distinguish each signal in the EO switching direction, and "second" is used to distinguish each signal in the OE switching direction.

[0168] For example, the first data electrical signal and the first data optical signal described above represent electrical signals and optical signals in the EO conversion direction, respectively, and the second data electrical signal and the second data optical signal represent electrical signals and optical signals in the OE conversion direction, respectively.

[0169] For clarity, each embodiment described later will also follow this rule, that is, "first" is used to define each signal in the EO conversion direction, and "second" is used to define each signal in the OE conversion direction.

[0170] Typically, the multiple channels of the first data electrical signal and the second data electrical signal (110-1 and 220-1) described above correspond to different numbers of high-speed differential channels in PCIe of different specifications. For example, they may correspond to different numbers of differential channels in the aforementioned PCIe x1, PCIe x4, PCIe x8, PCIe x16, PCIe x32, and other specifications.

[0171] For example, the 16-channel first data electrical signal 110 - 1 may represent an electrical signal of a high-speed differential channel in a NRZ format of 16 x 32G, or an electrical signal of a high-speed differential channel in a PAM4 format of 16 x 64G.

[0172] The first data electrical signal and the second data electrical signal (110-1 and 220-1), and the first data optical signal and the second data optical signal (120-1 and 210-1) discussed above refer to data signals carrying target data information.

[0173] In some embodiments, in addition to the data signals of multiple channels, the input and output signals of the optical module may also include additional control signals, for example, Figure 6 The control signal is shown as the black bold arrow in the figure.

[0174] like Figure 6 As shown, for example, the input electrical signal of the optical module 100 may further include a first control electrical signal 110 - 2 input to the EI / O.

[0175] For example, the first control electrical signal 110 - 2 may carry first control information, and the optical transmission unit 700 may convert the first control electrical signal 110 - 2 into a first control optical signal 120 - 2 carrying the first control information.

[0176] In addition, similarly, the input optical signal of the optical module 100 may also include a second control optical signal 210 - 2 .

[0177] For example, the second control optical signal 210 - 2 may carry the second control information, and the optical receiving unit 800 may convert the second control optical signal 210 - 2 into a second control electrical signal 220 - 2 carrying the second control information.

[0178] Similar to the principles described above regarding the first data electrical signal and the second data electrical signal (110-1 and 220-1), and the first data optical signal and the second data optical signal (120-1 and 210-1), for the first control electrical signal 110-2, a special driver + optical emitter combination needs to be set in the optical emission unit 700 to perform EO conversion of the first control electrical signal 110-2, thereby outputting the first control optical signal 120-2.

[0179] Similarly, for the second control optical signal 210 - 2 , a special optical detector+amplifier combination needs to be provided in the optical receiving unit 800 for performing OE conversion of the second control optical signal 210 - 2 , thereby outputting a second control electrical signal 220 - 2 .

[0180] also, Figure 6 The description of the light emitting unit 700, the light receiving unit 800 and the control unit 900 in Figure 4 Similar. And Figure 6 The optical module 700 and the optical receiving unit 800 may have the above Figure 5A-5B The arbitrary configuration described above will not be repeated here.

[0181] It should be noted that, although the first control electrical signal 110-2, the first control optical signal 120-2, the second control optical signal 210-2 and the second control electrical signal 220-2 are described as a single channel above, this is only to simplify the description. In other embodiments, the above control signals may also have multiple channels, for example, 2, 3 or more channels, so as to achieve EO / OE conversion of more control signals.

[0182] In the case where the above control signal has multiple channels, each channel also needs to be arranged with a dedicated transmission channel or receiving channel. The configuration of the transmission channel or receiving channel discussed above for the data signal is also applicable to the control signal and will not be repeated here.

[0183] In some embodiments, the above data signal may be Figures 2A-2D The PCIe high-speed electrical signals for each resource module in the resource pooling system, and the above control signals can be as follows Figures 2A-2D The PCIe sideband low-speed electrical signal is described in relation to each resource module in the resource pooling system.

[0184] For example, the first control electrical signal 110-2 may be a PCIe sideband low-speed control electrical signal, and the first control optical signal 120-2 converted by EO may be a corresponding sideband low-speed control optical signal. The second control optical signal 210-2 may also be a sideband low-speed control optical signal, and the second control electrical signal 220-2 outputted by OE conversion may also be a PCIe sideband low-speed control electrical signal.

[0185] Various embodiments of the PCIe optical module are described above. As mentioned above, by providing a PCIe optical module that is directly driven by a PCIe electrical signal and can directly output a PCIe electrical signal as described above, when constructing a resource pooling system as described in the present disclosure, such a PCIe optical module can be used to interconnect resource modules more simply, thereby avoiding the conversion of the physical layer and protocol layer from PCIe to Ethernet.

[0186] In addition, since the PCIe optical module proposed in the present invention directly receives PCIe electrical signals and directly outputs PCIe electrical signals, the further digital-to-analog conversion and analog-to-digital conversion operations inside the optical module before and after the conversion are eliminated, so that the optoelectronic and electro-optical conversions can be performed more quickly, which can help to further reduce the delay in data transmission.

[0187] Combine the following Figures 7 to 9 To describe Figure 1 Various embodiments of the switch 604 in the resource pooling system 1000 are shown.

[0188] Figure 7 A schematic diagram showing an example of a resource pooling system including an electrical switch according to an embodiment of the present disclosure is shown. Fig. 9 A schematic diagram of a resource pooling system including an optical switch according to an embodiment of the present disclosure is shown.

[0189] like Figure 7 As shown, the switch in the resource pooling system of the present disclosure may be an electrical switch 606 including a switch chip 310 and a plurality of optical modules 100 .

[0190] Figure 8 Shows Figure 7 An example of a specific configuration of the electrical switch 606 in FIG. Figure 8 As shown, in the electrical switch 606, the switch chip 310 has multiple PCIe physical interfaces 302, and the multiple PCIe physical interfaces 302 of the switch chip 310 and the electrical ports of multiple optical modules 100 are electrically interconnected. In this case, the optical ports of the multiple optical modules (for example, the ports corresponding to the optical fibers 200) serve as the optical ports of the electrical switch 606.

[0191] The resource pooling system includes Figure 8 In the configuration of the electrical switch 606 shown, the electrical switch 606 can switch the conductive paths in the switch chip 310 to, for example, Figure 7 At least some resource modules are selected from the plurality of resource pools (eg, resource pools 1-4) for link connection. After the link connection is established, the electrical switch 606 transmits electrical signals therein, thereby transmitting signals between at least some resource modules.

[0192] Specifically, for example, Figure 7 or Figure 8 The illustrated electrical switch 606 may transmit signals between at least some of the resource modules by performing the following operations.

[0193] For example, returns Figure 7 If the resource module 2100 (e.g., central processing module) in resource pool 1 wants to communicate data with the resource module 2400 (e.g., non-volatile storage module) in resource pool 4 (e.g., perform storage / write operations on data A), the switch control chip (not shown) can be used to enable the electrical switch 606 to switch the conductive path in the switch chip 310, so that the conductive path inside the switch chip 310 enables the resource module 2100 in resource pool 1 and the resource module 2400 in resource pool 4 to communicate with each other.

[0194] The data A in the resource module 2100 is first sent from the PCIe physical interface of the electronic integrated circuit chip 600 (e.g., a CPU chip) to the optical module 100 in the resource module 2100. Then, the optical module 100 performs electrical-optical conversion on the data A to convert the data A in the form of an electrical signal into the data A in the form of an optical signal.

[0195] Next, the converted data A in optical signal form is fed to the corresponding optical module 100 of the electrical switch 606 through the optical fiber. The corresponding optical module 100 of the electrical switch 606 performs optical-electrical conversion on the data A in optical signal form to convert the data A in optical signal form into data A in electrical signal form.

[0196] Next, the data A in the form of an electrical signal is transmitted to the optical module 100 in the electrical switch 606 corresponding to the resource module 2400 through the previously established conductive path, and then the data A in the form of an electrical signal is converted from electrical to optical by the optical module 100 to obtain the data A in the form of an optical signal.

[0197] Next, data A in the form of an optical signal is provided to the corresponding optical module 100 in the resource module 2400 through the optical fiber for optical-to-electrical conversion, and the data A in the form of an electrical signal obtained by the conversion is provided to the electronic integrated circuit chip 603 in the resource module 2400 (for example, a non-volatile storage control unit) through the PCIe physical interface of the electronic integrated circuit chip 603 in the resource module 2400.

[0198] The resource module 2400 can then store the data A in the form of an electrical signal into a corresponding non-volatile storage unit (for example, Figure 2D The non-volatile storage unit 309 is shown in the figure, thereby completing the storage operation of data A.

[0199] The above example illustrates the example of data A transmission between resource module 2100 in resource pool 1 and resource module 2400 in resource pool 4. It should be noted that the reverse operation is also similar. For example, if resource module 2100 is a central processing resource module and resource module 2400 is a non-volatile storage module, resource module 2100 can also perform a data read operation on resource module 2400. In this case, for example, data B can be transmitted from resource module 2400 to resource module 2100 in a similar manner, and the optical-electrical / electrical-optical conversion process is similar to the above, and will not be repeated here.

[0200] The above describes an example of signal transmission between different resource modules by taking data storage / data reading operations as an example, which is merely exemplary.

[0201] In actual operation, signals can be transmitted between any two resource modules in any two resource pools according to specific needs. For example, the central processing resource module in the central processing resource pool can communicate with the volatile storage module in the volatile storage resource pool to use the non-volatile storage module as memory. For example, the central processing resource module in the central processing resource pool can communicate with the artificial intelligence computing module in the artificial intelligence computing resource pool to assist the central processing operation, thereby realizing the acceleration of large-scale computing.

[0202] In addition, the artificial intelligence computing module in the artificial intelligence computing resource pool can also communicate with the volatile storage module in the volatile storage resource pool separately to use the volatile storage module as memory for artificial intelligence computing. Optionally, the artificial intelligence computing module in the artificial intelligence computing resource pool can also communicate with the non-volatile storage module in the non-volatile storage resource pool separately to perform non-volatile storage of data.

[0203] In addition, the above communication about data A and data B is all transmitted through PCIe high-speed electrical signals. In some cases, PCIe sideband low-speed signals can also be transmitted between resource modules in different resource pools.

[0204] For example, before writing data A, the resource module 2100 in resource pool 1 may first transmit a write control signal to the resource module 2400 in resource pool 4 via a PCIe sideband low-speed signal, and then the resource module 2100 performs the transmission and writing operations of data A. For example, before reading data B, the resource module 2100 in resource pool 1 may first transmit a read control signal to the resource module 2400 in resource pool 4 via a PCIe sideband low-speed signal, and then the resource module 2400 performs the reading and transmission operations of data B.

[0205] The process of transmitting PCIe sideband low-speed signals between different resource modules in different resource pools is similar to the process of transmitting data A based on the above PCIe high-speed signal, and also undergoes two electrical-optical conversions and two optical-electrical conversions, which will not be repeated here.

[0206] In addition, about Figure 8 The individual optical modules 100 in the electrical switch 606 described are similar to the individual optical modules 100 previously described with respect to the resource modules in the individual resource pools. Figure 4-6 Any of the optical modules described can be configured Figure 8 An electrical switch 606 is shown.

[0207] In addition, if Figure 7 The switch chip 310 and the optical module 100 shown in the figure can also be connected with Figure 3 For example, the switch chip 310 with the PCIe physical interface 302 is packaged on the package substrate 400 , and is arranged on the PCB board 500 as a whole, and the optical module 100 is also arranged on the PCB board 500 .

[0208] In some embodiments, Figure 8The multiple optical modules 100 shown can be identical optical modules. In this case, for example, in the previous example, without considering loss or signal micro-deformation, the data A in the form of an optical signal received from the resource module 2100 and the data A in the form of an optical signal transmitted from the electrical switch 606 to the resource module 2400 can be the same optical signal.

[0209] Optionally, all optical modules 100 in each resource pool may also be completely identical optical modules, and may be identical to the optical modules 100 in the electrical switch 606. In this case, without considering loss or signal micro-deformation, the electrical signals in each electronic integrated circuit chip and the corresponding electrical signals in the electrical switch 606 may also be identical, and the optical signals input or output by each resource module and the corresponding optical signals input or output by the electrical switch 606 may also be identical.

[0210] Combination of the above Figures 7 and 8 An example of using an electrical switch 606 in a resource pooling system is described. When the electrical switch 606 is used in the resource pooling system, since the link connection mode does not need to be changed inside the electrical switch 606 and the topology of the resource pooling system does not need to be changed, only the conductive direction of the link needs to be controlled to achieve different configurations between different resources. Therefore, the delay of changing the data flow direction (i.e., changing the conductive path inside the electrical switch 606) can be achieved at the nanosecond level, and near real-time resource scheduling and configuration can also be achieved.

[0211] Based on the above advantages, it is very advantageous to perform fine-grained and small-flow signal transmission in the resource pooling system using the electrical switch 606, so that the flow direction of data packets can be frequently changed with extremely low latency, thereby achieving rapid data transmission.

[0212] In some other embodiments, an all-optical switch may also be used in the resource pooling system described in the present disclosure. Fig. 9 A schematic diagram of a resource pooling system including an optical switch 605 according to an embodiment of the present disclosure is shown.

[0213] In the case of using the optical switch 605, signal transmission between resource modules of different resource pools is achieved by transmitting optical signals. For example, the optical switch 605 reconstructs the optical path to Fig. 9 At least some resource modules are selected from the plurality of resource pools (eg, resource pools 1-4) for link connection. Then, the optical switch 605 transmits optical signals within the optical switch 605 to transmit signals between at least some resource modules.

[0214] The optical switch 605 can rearrange the optical path switching bandwidth transmission path therein to achieve fully reconfigurable full interconnection between resource modules of each resource pool.

[0215] For example, the optical switch 605 can control the optical path based on different physical principles, including piezoelectric, micro-electromechanical, electro-optical, etc. The optical switch 605 can be composed of a series of free-space optical components or a series of integrated optical components.

[0216] Specifically, for example, Fig. 9 The optical switch shown may transmit signals between at least some of the resource modules by performing the following operations.

[0217] For example, if the resource module 2100 (e.g., a central processing module) in resource pool 1 wants to communicate with the resource module 2400 (e.g., a non-volatile storage module) in resource pool 4 (e.g., perform storage / write operations on data A), the optical switch 605 can re-arrange the internal optical path so that the optical switch 605 can provide optical path links for the resource module 2100 in resource pool 1 and the resource module 2400 in resource pool 4.

[0218] The data A in the resource module 2100 is first sent from the PCIe physical interface of the electronic integrated circuit chip 600 (e.g., a CPU chip) to the optical module 100 in the resource module 2100. Then, the optical module 100 performs electrical-optical conversion on the data A to convert the data A in the form of an electrical signal into the data A in the form of an optical signal.

[0219] Next, the converted data A in the form of an optical signal is fed to the corresponding optical port of the optical switch 605 through the optical fiber. The optical switch 605 provides the data A in the form of an optical signal to the corresponding optical module 100 in the resource module 2400 through the arranged optical path link through the optical fiber for optical-electrical conversion, and the converted data A in the form of an electrical signal is provided to the electronic integrated circuit chip 603 (for example, a non-volatile storage control unit) in the resource module 2400 through the PCIe physical interface of the electronic integrated circuit chip 603 in the resource module 2400.

[0220] The resource module 2400 can then store the data A in the form of an electrical signal into a corresponding non-volatile storage unit (for example, Figure 2D The non-volatile storage unit 309 is shown in the figure, thereby completing the storage operation of data A.

[0221] The above example illustrates the example of data A transmission between resource module 2100 in resource pool 1 and resource module 2400 in resource pool 4. It should be noted that the reverse operation is also similar. For example, if resource module 2100 is a central processing resource module and resource module 2400 is a non-volatile storage module, resource module 2100 can also perform a data read operation on the resource module. In this case, for example, data B can be transmitted from resource module 2400 to resource module 2100 in a similar manner, and the optical-electrical / electrical-optical conversion process is similar to the above, and will not be repeated here.

[0222] In addition, according to specific needs, signals can be transmitted between any two resource modules in any two resource pools. In some cases, sideband low-speed signals can also be transmitted between resource modules in different resource pools. Figures 7 to 8 The example described in is similar and will not be repeated here.

[0223] Combination of the above Fig. 9 An example of using an optical switch 605 in a resource pooling system is described. In the process of transmitting signals, the signal transmission is completed in the optical switch 605 without optical-electrical / electrical-optical conversion. Compared with the electrical switching described previously, the all-optical switching can eliminate the energy consumption and delay of one optical-electrical / electrical-optical conversion, and is not affected by the modulation rate and modulation format of the data, thereby achieving more flexible data transmission.

[0224] In addition, since the optical switch usually generates millisecond-level delays in the process of optical path arrangement when reconstructing the resource pool, this configuration can preferably be applied to situations where frequent changes in the topology structure are not required.

[0225] For example, in a scenario where the topology is fixed and a large amount of data needs to be transmitted, a resource pooling system using optical switches will have obvious advantages. It can transmit huge amounts of data with low latency, such as for neural network training and other operations.

[0226] Combination of the above Figures 1 to 9 Various embodiments of the resource pooling system proposed in the present disclosure are described. Since an electronic integrated circuit chip with a PCIe physical interface and an optical module directly driven by a PCIe electrical signal are used in each resource module of each resource pool, when constructing the resource pooling system as described in the present disclosure, the resource modules can be interconnected more simply, thereby avoiding the conversion of the physical layer and protocol layer from PCIe to Ethernet, thereby reducing the delay of signal transmission and achieving faster resource pooling operation.

[0227] Based on the resource pooling system as described above, the present disclosure also provides a method for performing resource pooling. Fig.10A flow chart of a resource pooling method according to an embodiment of the present disclosure is shown.

[0228] like Fig.10 As shown, the proposed resource pooling method includes: step 1010, selecting at least part of the resource modules from multiple resource pools through the switch for link connection; step 1020, transmitting PCIe sideband control signals between some resource modules through the switch; and step 1030, transmitting PCIe data signals between some resource modules through the switch.

[0229] The link connection in step 1010 can be used as described above with respect to Figures 7 to 9 The switch in any embodiment of the present invention is implemented. For example, by configuring Figure 7-8 The conductive paths in the switch chip 310 of the electrical switch 606 in the embodiment of the present invention are used to select at least part of the resource modules from the plurality of resource pools for link connection. Fig. 9 The optical switch shown re-arranges the optical paths to realize the link connection between at least some resource modules.

[0230] The PCIe sideband control signal in step 1020 can be various control signals, such as a read / write control signal, a handshake signal, a confirmation signal, etc. Transmission method and combination of PCIe sideband control signals Figures 7 to 9 The signal transmission method described in any embodiment is similar.

[0231] In addition, the PCIe data signal in step 1030 can be various high-speed data signals, for example, high-speed data signals for reading / writing storage units, various high-speed data signals for interaction between the CPU and artificial intelligence computing chips, etc.

[0232] The above about Figures 1 to 9 The various operations and steps involved in the resource pooling system described above are also applicable to Fig.10 The methods described are those described unless otherwise stated or clearly inappropriate.

[0233] Various embodiments of the resource pooling system and resource pooling method in the embodiments of the present disclosure are described above. It should be noted that the various components or assemblies described in the various embodiments of the present disclosure are merely illustrative. In some cases, some of the components or assemblies may be omitted, or replaced with other components or assemblies having the same or similar functions, or additional components or assemblies may be added.

[0234] In addition, the various parts or components that are separated or combined with each other in various embodiments of the present disclosure are only for the convenience of description, which does not mean that they are physically separated or combined with each other, nor does it mean that such separation or combination is necessary. Those skilled in the art can arbitrarily separate or combine the various parts or components according to actual needs.

[0235] In the above description, the embodiments of the present disclosure have been described in conjunction with the accompanying drawings. It should be understood that the above embodiments are merely illustrative, and those skilled in the art should understand that the combination of the constituent elements and processes of the present embodiments can be modified in various ways, and such modifications also fall within the scope of the present disclosure.

Claims

1. A resource pooling system, comprising: A plurality of resource pools, wherein each resource pool comprises a plurality of resource modules for processing data or a plurality of resource modules for storing data, each resource module comprises an electronic integrated circuit chip having a PCIe physical interface and at least one optical module, and the PCIe physical interface of the electronic integrated circuit chip and the electrical port of the at least one optical module are electrically interconnected, and the optical port of the at least one optical module serves as the optical port of the resource module; as well as a switch having optical ports interconnected with optical ports of respective resource modules in the plurality of resource pools, the switch being configured to select at least some of the resource modules from the plurality of resource pools and transmit signals with the at least some of the resource modules, wherein the at least one optical module converts a first electrical signal from a PCIe physical interface of the electronic integrated circuit chip into a first optical signal and provides the first optical signal to the switch, and The at least one optical module converts the second optical signal from the switch into a second electrical signal, and provides the second electrical signal to the corresponding electronic integrated circuit chip through the PCIe physical interface.

2. The resource pooling system according to claim 1, wherein: The multiple resource pools include: A central processing resource pool, comprising a plurality of central processing modules as the plurality of resource modules for processing data, each central processing module comprising a CPU chip as the electronic integrated circuit chip with a PCIe physical interface; and The volatile storage resource pool includes multiple volatile storage modules as the multiple resource modules for storing data. Each volatile storage module includes a volatile storage control chip as the electronic integrated circuit chip with a PCIe physical interface. Each volatile storage module also includes a volatile storage unit.

3. The resource pooling system according to claim 2, wherein: The multiple resource pools also include: The artificial intelligence computing resource pool includes multiple artificial intelligence computing modules as the multiple resource modules for processing data, and each artificial intelligence computing module includes an artificial intelligence computing chip as the electronic integrated circuit chip with a PCIe physical interface.

4. The resource pooling system according to claim 2 or 3, wherein: The multiple resource pools also include: The non-volatile storage resource pool includes multiple non-volatile storage modules as the multiple resource modules for storing data, each non-volatile storage module includes a non-volatile storage control chip as the electronic integrated circuit chip with a PCIe physical interface, and each non-volatile storage module also includes a non-volatile storage unit.

5. The resource pooling system according to claim 3, The artificial intelligence computing chip includes one or more of a graphics processing unit (GPU), a neural network processing unit (NPU), a tensor processing unit (TPU), an intelligent processing unit (IPU), and a deep learning processing unit (DPU).

6. The resource pooling system according to claim 1, wherein the switch is an electrical switch including a switch chip and a plurality of optical modules, The switch chip has multiple PCIe physical interfaces. The multiple PCIe physical interfaces of the switch chip and the electrical ports of the multiple optical modules are electrically interconnected, respectively. The optical ports of the plurality of optical modules serve as the optical ports of the electrical switch, The electrical switch selects at least part of the resource modules from the plurality of resource pools for link connection by switching the conductive paths in the switch chip, and The electrical switch transmits electrical signals within the electrical switch to transmit signals between at least some of the resource modules.

7. The resource pooling system of claim 6, wherein the electrical switch transmits signals between the at least some resource modules by performing the following operations: enabling a first optical module among the plurality of optical modules to convert the first optical signal from the first resource module into a third electrical signal and provide the third electrical signal to the switch chip, enabling the switch chip to transmit the third electrical signal to a second optical module among the plurality of optical modules through the conductive path, The second optical module is enabled to convert the third electrical signal into the second optical signal and provide the second optical signal to the second resource module.

8. The resource pooling system according to claim 7, wherein: The first optical module and the second optical module are the same optical module, and The second optical signal and the first optical signal are the same optical signal.

9. The resource pooling system according to claim 8, wherein: The first optical module and the optical module in the first resource module are the same optical module; and The third electrical signal and the first electrical signal are the same electrical signal.

10. The resource pooling system according to claim 1, wherein the switch is an optical switch, The optical switch selects at least part of the resource modules from the plurality of resource pools for link connection by reconstructing the optical path, and The optical switch transmits optical signals therein to transmit signals between at least some of the resource modules.

11. The resource pooling system according to claim 1, wherein each of the at least one optical module comprises: A control signal conversion channel is used to perform photoelectric conversion or electro-optical conversion on the PCIe sideband control signal; as well as Data signal conversion channel, used for photoelectric conversion or electro-optical conversion of PCIe data signals. The signal transmitted between at least part of the resource modules includes the PCIe sideband control signal and the PCIe data signal.

12. The resource pooling system according to claim 1, wherein: The first electrical signal and the second electrical signal are PCIe electrical signals based on a PCIe physical layer and a PCIe protocol layer or PCIe / CXL electrical signals based on a PCIe physical layer and a CXL protocol layer.

13. The resource pooling system according to claim 7, wherein: The third electrical signal is a PCIe electrical signal based on a PCIe physical layer and a PCIe protocol layer or a PCIe / CXL electrical signal based on a PCIe physical layer and a CXL protocol layer.

14. A method for performing resource pooling based on the resource pooling system according to any one of claims 1 to 13, comprising: Selecting, by the switch, at least part of the resource modules from the plurality of resource pools for link connection; Transmitting a PCIe sideband control signal between the partial resource modules through the switch; as well as The PCIe data signal is transmitted between the partial resource modules through the switch.

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