Electroplating capacity management method and device, electronic equipment and storage medium

Abstract

The invention provides an electroplating capacity management method, and relates to the technical field of capacity management. Comprising the steps that the running speed V, the plating plate area S and the plating plate length L of electroplating equipment are obtained; according to the plating plate area S, the plating plate length L and the running speed V, monthly productivity data W are obtained through a preset calculation formula. According to the electroplating capacity management method, the monthly capacity is calculated according to the equipment running speed and the plating plate area and length through a general calculation formula, the calculation efficiency and accuracy are greatly improved, the capacity is accurately estimated, powerful data support is provided for production management and decision making, and efficient operation and competition of enterprises are assisted.

Description

Technical Field

[0001] The present invention relates to the technical field of capacity management, and in particular to an electroplating capacity management method, device, electronic equipment and storage medium. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] There is no good calculation method for electroplating capacity at present. Generally, the capacity of the equipment is calculated based on actual measurements. For different specifications and production requirements, actual measurements must be made, which is time-consuming, labor-intensive and has large errors. Therefore, the present invention proposes an electroplating capacity management method to at least partially solve the problems that may exist in the prior art. Summary of the invention

[0004] The object of the present invention is to provide an electroplating capacity management method and device, which can propose solutions to the deficiencies of the prior art and at least partially solve the problems that may exist in the prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: A method for managing electroplating capacity, comprising: Obtain the operating speed V, plated plate area S, and plated plate length L of the electroplating equipment; According to the plate area S, plate length L and running speed V, the monthly production capacity data W is obtained by a preset calculation formula; wherein the formula is: W=V*60*22*24*S / 2L, where W is the monthly production capacity, V is the operating speed of the equipment in production, S is the plated area, and L is the length of the plated plate.

[0006] Optionally, obtaining the operating speed V, the plated plate area S, and the plated plate length L of the electroplating equipment includes: The operating speed V of the equipment, the plated area S, and the plated length L are determined based on the required electroplating layer thickness, current density, and reagent formula of the electroplating target.

[0007] Optionally, the monthly production capacity data W is obtained by a preset calculation formula according to the plate area S, the plate length L and the running speed V, including: According to the plate area S, plate length L and running speed V, the monthly production capacity data W is obtained by calculation through W=V*60*22*24*S / 2L. In the formula, W is the monthly production capacity, V is the operating speed of the equipment in production, S is the plated area, and L is the plated length.

[0008] Optionally, determining the operating speed V of the equipment according to the required electroplating layer thickness, current density and reagent formula of the electroplating target includes: Determine the reagent formula according to the required electroplating layer type, and determine the plating tank size including the plate area S, plate length L, current density A and deposition rate v according to the reagent formula; The operating speed V is determined according to the proportional relationship between the electroplating layer thickness C, the current density A and the deposition rate v. It should be noted that the operating speed V is also the conveying speed, which is the speed at which the electroplating target is conveyed by the conveyor belt in the electroplating tank.

[0009] Also disclosed is an electroplating capacity management device, comprising: The data sensing module is used to obtain the operating speed V, plated plate area S, and plated plate length L of the electroplating equipment; The data calculation module is used to obtain the monthly production capacity data W according to the plated plate area S, the plated plate length L and the operating speed V through a preset calculation formula.

[0010] Also disclosed is an electronic device, comprising: One or more processors; and one or more machine-readable media having instructions stored thereon, which, when executed by the one or more processors, cause the electronic device to perform an electroplating capacity management method.

[0011] Also disclosed is a computer-readable storage medium, which stores a computer program that enables a processor to execute the electroplating capacity management method.

[0012] The present invention has at least the following advantages or beneficial effects: By obtaining the operating speed V, plate area S, and plate length L of the electroplating equipment; according to the plate area S, plate length L, and the operating speed V, the monthly production capacity data W is obtained through a preset calculation formula. The electroplating capacity management method calculates the monthly production capacity based on the equipment operating speed, plate area, and length through a general calculation formula, greatly improving the calculation efficiency and accuracy, accurately estimating the production capacity, providing strong data support for production management and decision-making, and helping enterprises to operate and compete efficiently. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 A flow chart of the steps of an electroplating capacity management method provided by one embodiment of the present invention; Figure 2 A schematic diagram of the structure of an electroplating capacity management device provided by one embodiment of the present invention; Figure 3 It is a structural schematic diagram of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0015] In order to make the objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] It should be noted that in the present application, u" is milliinch, and its conversion to μm (micrometer) unit is 1u"=0.025μm.

[0017] Example 1 Please refer to Figure 1 As shown, a method for managing electroplating capacity is provided for this embodiment, including: S1, obtain the operating speed V, plate area S, and plate length L of the electroplating equipment; S2. According to the plate area S, plate length L and running speed V, the monthly production capacity data W is obtained by a preset calculation formula; wherein the formula is: W=V*60*22*24*S / 2L, where W is the monthly production capacity, V is the operating speed of the equipment in production, S is the plated area, and L is the length of the plated plate.

[0018] In this embodiment, the above-mentioned electroplating capacity management method solves the problem that the current traditional electroplating capacity calculation relies on actual measurement, and repeated operations are required for different specifications and production requirements; in the scheme of this application, a calculation formula W = V * 60 * 22 * ​​24 * S / 2L based on the operating speed V, plate area S, and plate length L of the electroplating equipment is used. By obtaining these basic parameters, there is no need to perform cumbersome actual measurements for different specifications and requirements, and the monthly capacity data W can be calculated directly by substituting them into the formula, which effectively simplifies the calculation process and reduces the error caused by measurement; by applying the formula to calculate the capacity, the calculation time is greatly shortened. When facing the production of plated plates of different specifications for different orders, enterprises can quickly obtain capacity data based on equipment parameters instead of spending a lot of time on actual measurements, thereby improving the efficiency of production planning.

[0019] Since the measurement error is reduced, the calculation results are more accurate. This helps enterprises to arrange production tasks and allocate resources more reasonably, avoid overproduction or underproduction due to inaccurate capacity estimation, reduce production costs, and improve enterprise benefits. Accurate capacity data provides a strong basis for the production management and decision-making of enterprises. Enterprise managers can formulate more scientific production plans, equipment maintenance plans, and personnel arrangement plans based on capacity data, improve the overall operation and management level of the enterprise, and enhance the competitiveness of the enterprise in the market.

[0020] Example 2 In this embodiment, a method for managing electroplating capacity is disclosed, wherein in step S1, the operating speed V, plate area S, and plate length L of the electroplating equipment are obtained, including: determining the operating speed V of the equipment based on the required electroplating layer thickness, current density, and reagent formula of the electroplating target.

[0021] Because the above capacity calculation formula grasps the main influencing factor of capacity - the operating speed V in equipment production, and this operating speed V is not set randomly, it must be based on the electroplating principle, the electroplating thickness of the product, the current density, and the formula of the solution. In addition, the above capacity calculation formula is combined with the structural design of the equipment plating tank to comprehensively generate the monthly capacity. It is simple, efficient and fast. The calculation is performed in the preparation stage before production to obtain capacity data, thereby improving the overall operation and management level of the enterprise.

[0022] Further, the operation speed V of the equipment is determined according to the required electroplating layer thickness, current density and reagent formula of the electroplating target, including: Determine the reagent formula according to the required electroplating layer type, and determine the plating tank size including the plating plate area S, the plating plate length L, the current density A and the deposition rate v according to the reagent formula; The operating speed V is determined based on the proportional relationship between the electroplating layer thickness C, the current density A and the deposition rate v. Specifically, the electroplating layer thickness C, the current density A, the deposition rate v and the operating speed V satisfy the following relationship: C=k*V*A*v, where k is a constant.

[0023] It should be noted that the operating speed V, also known as the conveying speed, is the speed at which the electroplating target is transported by the conveyor belt in the electroplating tank.

[0024] In this embodiment, as described in step S2 above, the monthly production capacity data W is obtained according to the plate area S, the plate length L and the operating speed V through a preset calculation formula, including: According to the plated area S, the plated length L and the operating speed V, the monthly production capacity data W is obtained by calculation through W=V*60*22*24*S / 2L, wherein in the formula, W is the monthly production capacity, V is the operating speed in equipment production, S is the plated area, and L is the plated length.

[0025] As an example, in the gold finger plating, nickel plating is first performed with a thickness of 150µ", and the gold plating thickness is 30µ". The required gold plating tank is 3m and the nickel plating tank is 4.2m. The electroplating is performed on a 24.5"*28.5" plate. The monthly production capacity is calculated by the following formula: W=1.2*60*22*24*0.4497 / 2*0.622=13742m² / month.

[0026] According to this application method, the production capacity of the equipment can be determined before production. Knowing the capacity, the order acceptance and production scale can be determined, which is beneficial to cost accounting. It can also determine the profit cycle and the investment scale.

[0027] Example 3 In this embodiment, based on the same concept, a electroplating capacity management device is also disclosed, including: Data sensing module 1, used to obtain the operating speed V, plated plate area S, and plated plate length L of the electroplating equipment; The data calculation module 2 is used to obtain the monthly production capacity data W according to the plated plate area S, the plated plate length L and the operating speed V through a preset calculation formula.

[0028] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0029] Reference Figure 3In an embodiment of the present invention, the present invention further provides a computer device. The above-mentioned computer device 12 is in the form of a general computing device. The components of the computer device 12 may include but are not limited to: one or more processors or processing units 16, a system memory 28, and a bus 18 connecting different system components (including the system memory 28 and the processing unit 16).

[0030] The bus 18 represents one or more of several types of bus 18 structures, including a memory bus 18 or memory controller, a peripheral bus 18, an accelerated graphics port, a processor, or a local bus 18 using any of a variety of bus 18 architectures. These architectures include, by way of example, but are not limited to, an Industry Standard Architecture (ISA) bus 18, a Micro Channel Architecture (MAC) bus 18, an Enhanced ISA bus 18, an Audio Video Electronics Standards Association (VESA) local bus 18, and a Peripheral Component Interconnect (PCI) bus 18.

[0031] The computer device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by the computer device 12, including volatile and non-volatile media, removable and non-removable media.

[0032] System memory 28 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 31 and / or cache memory 32. Computer device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 34 may be used to read and write to non-removable, non-volatile magnetic media (commonly referred to as a "hard drive"). Although Figure 3 Not shown, a disk drive for reading and writing to a removable non-volatile disk (such as a "floppy disk"), and an optical disk drive for reading and writing to a removable non-volatile optical disk (such as a CD-ROM, DVD-ROM or other optical medium) may be provided. In these cases, each drive may be connected to the bus 18 via one or more data medium interfaces. The memory may include at least one program product having a set (e.g., at least one) of program modules 42, which are configured to perform the functions of various embodiments of the present invention.

[0033] A program / utility 41 having a set (at least one) of program modules 42 may be stored in, for example, a memory, such program modules 42 including, but not limited to, an operating system, one or more application programs, other program modules 42, and program data, each of which or some combination may include an implementation of a network environment. The program modules 42 generally perform the functions and / or methods of the embodiments described herein.

[0034] The computer device 12 may also communicate with one or more external devices 14 (e.g., keyboard, pointing device, display 24, camera, etc.), may also communicate with one or more devices that enable a user to interact with the computer device 12, and / or communicate with any device that enables the computer device 12 to communicate with one or more other computing devices (e.g., network card, modem, etc.). Such communication may be performed through an input / output (I / O) interface 22. In addition, the computer device 12 may also communicate with one or more networks (e.g., local area network (LAN)), wide area network (WAN) and / or public network (e.g., Internet) through a network adapter 20. As shown, the network adapter 21 communicates with other modules of the computer device 12 through a bus 18. It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with the computer device 12, including but not limited to: microcode, device driver, redundant processing unit 16, external disk drive array, RAID system, tape drive, and data backup storage system 34, etc.

[0035] The processing unit 16 executes various functional applications and data processing by running the programs stored in the system memory 28, such as implementing the electroplating capacity management method provided in the embodiment of the present invention.

[0036] That is, when the processing unit 16 executes the above program, it realizes: obtaining the operating speed V, plate area S, and plate length L of the electroplating equipment; and obtaining the monthly production capacity data W through a preset calculation formula based on the plate area S, plate length L, and operating speed V.

[0037] In an embodiment of the present invention, the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the electroplating capacity management method provided in all embodiments of the present application.

[0038] That is, when the program is executed by the processor, the operating speed V, the plated area S, and the plated length L of the electroplating equipment are obtained; based on the plated area S, the plated length L and the operating speed V, the monthly production capacity data W is obtained through a preset calculation formula.

[0039] Any combination of one or more computer-readable media may be used. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, device or device.

[0040] Computer-readable signal media may include a data signal propagated in baseband or as part of a carrier wave, which carries a computer-readable program code. Such propagated data signals may take a variety of forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0041] Computer program code for performing the operation of the present invention may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, Python, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0042] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0043] It should be understood by those skilled in the art that the embodiments of the present invention can be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention can take the form of complete hardware embodiments, complete software embodiments, or embodiments combining software and hardware. Moreover, the embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0044] The embodiments of the present invention are described with reference to flowcharts and / or block diagrams of methods, terminal devices (systems) and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0045] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0046] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0047] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0048] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0049] The above is a detailed introduction to the electroplating capacity management method, device, electronic device and storage medium provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for managing electroplating capacity, characterized in that: include: Obtain the operating speed V, plated plate area S, and plated plate length L of the electroplating equipment; According to the plate area S, plate length L and running speed V, the monthly production capacity data W is obtained by a preset calculation formula; wherein the formula is: W=V*60*22*24*S / 2L, where W is the monthly production capacity, V is the operating speed of the equipment in production, S is the plated area, and L is the length of the plated.

2. The electroplating capacity management method according to claim 1, characterized in that: The step of obtaining the operating speed V, the plated plate area S, and the plated plate length L of the electroplating equipment includes: The operating speed V of the equipment, the plated area S, and the plated length L are determined based on the required electroplating layer thickness, current density, and reagent formula of the electroplating target.

3. The electroplating capacity management method according to claim 1, characterized in that: The monthly production capacity data W is obtained by a preset calculation formula according to the plate area S, the plate length L and the running speed V, including: According to the plate area S, plate length L and running speed V, the monthly production capacity data W is obtained by calculation through W=V*60*22*24*S / 2L. In the formula, W is the monthly production capacity, V is the operating speed of the equipment in production, S is the plated area, and L is the plated length.

4. The electroplating capacity management method according to claim 2, characterized in that: The operation speed V of the equipment is determined according to the required electroplating layer thickness, current density and reagent formula of the electroplating target, including: Determine the reagent formula according to the required electroplating layer type, and determine the plating tank size including the plating plate area S, the plating plate length L, the current density A and the deposition rate v according to the reagent formula; The operating speed V is determined according to the proportional relationship between the electroplating layer thickness C, the current density A and the deposition rate v. It should be noted that the operating speed V is also the conveying speed, which is the speed at which the electroplating target is conveyed by the conveyor belt in the electroplating tank.

5. An electroplating capacity management device, characterized in that: include: The data sensing module is used to obtain the operating speed V, plated plate area S, and plated plate length L of the electroplating equipment; The data calculation module is used to obtain the monthly production capacity data W according to the plated plate area S, the plated plate length L and the operating speed V through a preset calculation formula.

6. An electronic device, characterized in that: include: one or more processors; and one or more machine-readable media having instructions stored thereon, which, when executed by the one or more processors, enable the electronic device to perform the electroplating capacity management method as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that: The computer program stored therein enables the processor to execute the electroplating capacity management method as described in any one of claims 1 to 4.

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