A method for integrally molding a ball head of a lamp panel
Through the integrated inverted ball head of the lamp board, the problem of uneven light mixing of multi-primary color powder-free lighting lamp beads and the difficulty of demolding of microstructure ball heads is solved, and the uniformity of light mixing and waterproofing effect is improved.
Patent Information
- Application Number
- CN202411974794.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-01
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing multi-primary color powder-free lighting beads have uneven light mixing, resulting in color separation problems. The microstructured ball heads molded through hard molds are difficult to release, and the waterproofing effect is insufficient.
The ball head of the lamp plate is used to process the ball head hard iron mold and iron box through CNC machine tool, and prepare food-grade silicone and ball head glue. The silicone mold obtained by the mold is embedded with a thin plate or wire mesh to form a second hemispherical ball head with a microstructure, and a glue waterproof layer is prepared on the surface of the lamp plate and the lamp beads.
It realizes easy demolding of the microstructured ball head on the lamp bead, improves light mixing uniformity, and significantly improves the waterproof effect of the LED lamp.
Smart Images
Figure CN119734381A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of multi-primary color LED lamps, and in particular to a method for integrally molding a ball head of a lamp panel. Background Art
[0002] Powder-free lighting is increasingly recognized by people because of its controllable light quality and ability to meet the needs of different lighting venues. However, multi-primary color powder-free lighting has always been a problem that has plagued powder-free lighting because it is made of multiple primary color chip lamp beads, and the uneven mixing of light leads to color separation. After a large number of experiments, it has been proved that making microstructures on the ball head of the lamp bead, making some convex or concave points, can effectively improve the effect of light mixing and make the light mixing more uniform.
[0003] At present, the ball head of the microstructure is obtained by injection molding. Injection molding requires the male mold and the female mold to be squeezed against each other to squeeze out the air in the glue; therefore, both the male mold and the female mold need to adopt a hard mold made of hard material; however, in the process of obtaining the ball head of the microstructure by injection molding of the hard mold, the ball head of the microstructure has an uneven surface and will adhere to the mold, so that the ball head cannot be removed from the mold, and the ball head of the microstructure is difficult to demold; in addition, for lamps used outdoors, the light board is generally waterproofed by setting a waterproof ring between the lens and the light board. Although the method of setting a waterproof ring has a certain waterproof effect, it may still be insufficient in some extreme environments. Summary of the invention
[0004] The purpose of the present invention is to improve and innovate the shortcomings and problems existing in the background technology, and provide a method for integrally molding a ball head of a lamp panel, which specifically includes the following steps: Make hard iron molds for ball heads and iron boxes for casting; Formulated with food grade silicone; Pour the prepared food-grade silicone into the iron box where the ball head hard iron mold has been placed in advance. After the glue is completely solidified, demould the silicone mold from the ball head hard iron mold and the iron box. Prepare the glue for the inverted ball head; Pour the prepared inverted ball head glue into the silicone mold, and put the lamp board with the lamp beads attached to the mold into it; after the inverted ball head glue is completely solidified, curl the silicone mold to separate the silicone mold and the lamp board; wherein, a second hemispherical ball head with a microstructure on the surface is formed on the lamp bead, and a glue waterproof layer is formed on the surface of the lamp board and the lamp bead; The ball head hard iron mold comprises a base corresponding to the surface of the lamp panel, a pedestal corresponding to the lamp bead, and a first hemispherical ball head with a microstructure on the surface.
[0005] A further solution is that the prepared inverted ball head glue is poured into the silicone mold, and the lamp board with the lamp beads attached to be inverted is placed therein; after the inverted ball head glue is completely solidified, the silicone mold is curled to separate the silicone mold and the lamp board. Specifically, the steps include: Pour an appropriate amount of ball head glue into the silicone mold; after the glue is leveled, put in the lamp board with the lamp beads to be molded; Put the silicone mold with the light board into the vacuum machine for vacuuming; Put the vacuumed silicone mold into the oven and bake it at low temperature first and then at high temperature; Take out the silicone mold after the glue has dried, and demould it after natural cooling; when demoulding, lay the back of the light board flat and curl the silicone mold to separate the silicone mold and the light board.
[0006] A further solution is that after the prepared food-grade silica gel is poured into the iron box in which the ball head hard iron mold is placed in advance, the following steps are included: A thin aluminum plate or wire mesh is placed in the food-grade silicone. The thin aluminum plate or wire mesh is used as a reinforcing rib to control the height of the thin aluminum plate or wire mesh after sinking to be 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head.
[0007] A further solution is that the height position of the thin aluminum plate or wire mesh after the controlled sinking is 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and specifically includes: Pre-arrange support columns at the four corners of the iron box, control the top of the support column to be 2-2.5mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and the support column is used to support the reinforcing ribs; Leave the food-grade silicone at room temperature for 4-6 hours to wait for the glue to dry, so that the A glue and B glue of the food-grade silicone can fully react.
[0008] A further solution is that the height position of the thin aluminum plate or wire mesh after the controlled sinking is 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and specifically includes: Put the iron box containing food-grade silica gel solution into the oven and bake it at a low temperature of 60-80℃.
[0009] A further solution is that the step of demoulding the silicone mold from the ball head hard iron mold and the iron box specifically includes: The support columns are arranged to be detachably installed at the four corners of the iron box. After the food-grade silicone solution solidifies, the support columns are removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box.
[0010] A further solution is that the support column is arranged to be detachably installed at the four corners of the iron box, and after the food-grade silicone solution solidifies, the support column is removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box. Specifically includes: The support column is arranged to be threadedly connected to the bottom wall of the iron box; After the food-grade silicone solution solidifies, first drive the support column to move upward to push up the four corners of the silicone mold, so that the four corners of the upper surface of the silicone mold are tilted upward and extend out of the iron box; insert the screwdriver into the bottom end of the edge of the silicone mold; Then drive the support column downward to remove the support column from the iron box; use a screwdriver to tilt one side of the silicone mold out of the iron box, and then demold the silicone mold from the ball head hard iron mold and the iron box.
[0011] A further solution is that the support column is arranged to be detachably installed at the four corners of the iron box, and after the food-grade silicone solution solidifies, the support column is removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box. Specifically includes: The outer surface of the support column is threadedly connected to the threaded sleeve, the upper end of the threaded sleeve is rotatably connected to the bearing seat, the bearing seat is installed on the bottom wall of the iron box, and the motor drives the threaded sleeve to rotate through the transmission mechanism; The motor drives the top ends of the support columns to move upward at the same time, so that the support columns simultaneously push up the silicone mold, thereby causing the four corners of the upper surface of the silicone mold to tilt upward and extend out of the iron box; insert a screwdriver into the bottom end of the edge of the silicone mold; The motor is controlled to rotate in the opposite direction to drive the top of the support column to move downward to the bottom of the iron box. A screwdriver is used to lift one side of the silicone mold out of the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box.
[0012] A further solution is that the preparation of food-grade silica gel specifically includes: Prepare food-grade silica gel A and B in a ratio of 1:1 by weight, fully stir A and B, and after stirring evenly, put them into a vacuum machine for vacuum degassing.
[0013] A further solution is that the preparation of the inverted ball head glue specifically includes: Select LED encapsulation glue as the glue for the inverted ball head. The A glue and B glue of the LED encapsulation glue are prepared at a weight ratio of 1:10. The A glue and B glue of the LED encapsulation glue are fully stirred. After stirring evenly, put them into a vacuum machine for vacuum degassing.
[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides a method for integrally molding a ball head of a lamp panel, the present invention firstly obtains a hard iron mold and an iron box of the ball head by CNC machine tools, the hard iron mold of the ball head comprises a first hemispherical ball head with a microstructure on the surface, then the defoamed food-grade silicone is poured into the iron box in which the hard iron mold of the ball head is placed in advance, and a silicone mold is obtained by molding; then a proper amount of glue for molding the ball head is poured into the silicone mold; after waiting for the glue to flow flat, the lamp panel with lamp beads attached to be molded is placed, a glue waterproof layer will be formed on the surface of the lamp panel and the lamp beads obtained by molding, and at the same time, a second hemispherical ball head with a microstructure will be formed at the position corresponding to the LED chip on the lamp bead; Since the silicone mold is made of soft material, compared with the prior art that the lamp board uses a hard mold for injection molding to obtain a second hemispherical ball head with a microstructure on the surface, which is inconvenient to separate the ball head from the hard mold, the second hemispherical ball head with a microstructure of the present invention can be easily demolded; in addition, a thin aluminum plate or wire mesh is embedded in the silicone mold obtained by inverting the mold, and the thin aluminum plate or wire mesh can increase the strength of the bottom of the silicone mold. Therefore, under the pressure of the lamp board, the hemispherical groove on the silicone mold is not easy to deform into an elliptical shape, so that a second hemispherical ball head with a microstructure on the surface can be formed on the lamp bead. The outer surface of the second hemispherical ball head with a microstructure is uneven, which is conducive to the uniform mixing of the light emitted by the multi-primary color chip on the lamp bead. Moreover, the present invention fully covers the surface of the lamp board with glue while inverting the ball head, and does not require an additional process to prepare a glue waterproof layer. Compared with the prior art that waterproofs the lens and the lamp board through a waterproof ring, the present invention prepares a layer of glue waterproof layer on the surface of the lamp board and the lamp bead, which can significantly improve the waterproof effect of the LED lamp. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0016] Figure 1 A schematic flow chart of a method for integrally molding a ball head of a lamp panel provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of an iron box and a ball head hard iron mold provided by an embodiment of the present invention; Figure 3 A schematic diagram of the structure of a silicone mold provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a lamp panel after the ball head is molded according to an embodiment of the present invention; Figure 5 Schematic diagram of the structure of the iron box and the detachable support column provided in the embodiment of the present invention Figure 1 ; Figure 6 Schematic diagram of the structure of the iron box and the detachable support column provided in the embodiment of the present invention Figure 2 ; Figure 7 The embodiment of the present invention provides Figure 6 Schematic diagram of the local enlarged structure at point A in the middle.
[0017] Figure numerals: 1. lamp board; 2. lamp bead; 3. second hemispherical ball head; 4. hard iron mold for ball head; 41. base; 42. pedestal; 43. first hemispherical ball head; 5. iron box; 51. support column; 52. mounting block; 53. motor; 54. first bevel gear; 55. second bevel gear; 56. third bevel gear; 57. fourth bevel gear; 58. threaded sleeve; 59. bearing seat; 6. silicone mold; 61. rectangular groove; 62. hemispherical groove. DETAILED DESCRIPTION
[0018] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0020] See also Figure 1 The present invention provides a method for integrally molding a ball head of a lamp panel, which specifically comprises the following steps: Step S1, making a hard iron mold for a ball head and an iron box for molding; For details, please refer to Figure 2-Figure 4 First, according to the size of the lamp board 1 and the lamp beads 2 on the lamp board 1, a ball head hard iron mold 4 is obtained by CNC machine tool processing; when designing the ball head hard iron mold 4, the ball head hard iron mold 4 should include a base 41 corresponding to the surface of the lamp board 1, a base 42 corresponding to the lamp beads 2, a first hemispherical ball head 43, and grooves corresponding to the positioning holes and threading holes. Among them, the base 42 corresponding to the lamp beads 2 is arranged on the base 41, and the first hemispherical ball head 43 is arranged on the base 42. The surface of the first hemispherical ball head 43 has a microstructure, so that the surface of the first hemispherical ball head 43 is uneven, and the microstructure is not shown in the figure; the ball head hard iron mold 4 is made of hard material, which can be iron or steel.
[0021] The ball head hard iron mold 4 is placed in the iron box 5 to facilitate the preparation of the silicone mold 6, and glue needs to be poured on the silicone mold 6 later to mold the second hemispherical ball head 3 on the lamp board 1; therefore, after the ball head hard iron mold 4 is placed in the iron box 5, the outer walls of the ball head hard iron mold 4 should maintain a certain distance from the inner walls of the iron box 5 so that the silicone mold 6 forms a closed enclosure structure; preferably, the distance between the outer walls of the ball head hard iron mold 4 and the inner walls of the iron box 5 is set to 10 mm.
[0022] It should be noted that the spacing between the outer walls of the ball head hard iron mold 4 and the inner walls of the iron box 5 can be the same or different, but it is necessary to ensure that the silicone mold 6 obtained by reverse molding can form a closed enclosure structure.
[0023] Step S2, preparing food grade silica gel; Specifically, glue A and glue B of food-grade silicone are prepared at a weight ratio of 1:1, and the amount used is determined according to the required amount of the inverted silicone mold 6. Glue A and glue B are fully stirred, and after stirring evenly, they are put into a vacuum machine for vacuum degassing, and the vacuum time is 120S.
[0024] It should be noted that food-grade silicone is composed of two parts, A glue and B glue, which are prepared in a 1:1 weight ratio. Component A is silicone and component B is the curing agent.
[0025] Step S3, pour the prepared food-grade silicone into the iron box in which the ball head hard iron mold is placed in advance, and after the glue is completely solidified, demould the silicone mold from the ball head hard iron mold and the iron box; Specifically, the defoamed food-grade silicone is poured into the iron box 5 in which the ball head hard iron mold 4 is placed in advance. The liquid level of the food-grade silicone is 4-6 mm higher than the top of the first hemispherical ball head 43 corresponding to the ball head hard iron mold 4. Then, the present invention places a thin aluminum plate or wire mesh in the food-grade silicone solution. The thin aluminum plate or wire mesh is used as a reinforcement rib, and the thickness of the thin aluminum plate or wire mesh is preferably 0.3-0.4 mm. After the food-grade silicone solution solidifies, the height position of the sunken thin aluminum plate or wire mesh is 2-2.5 mm higher than the top of the first hemispherical ball head 43 corresponding to the ball head hard iron mold 4.
[0026] like Figure 3 As shown, the silicone mold 6 obtained by inverting has a rectangular groove 61 corresponding to the lamp bead 2, and the rectangular groove 61 is provided with a hemispherical groove 62 corresponding to the first hemispherical ball head 43 and the second hemispherical ball head 3 and a protrusion corresponding to the positioning hole and the threading hole.
[0027] It should be noted that, in order to prevent the thin aluminum plate or wire mesh from contacting the top of the first hemispherical ball head 43 corresponding to the ball head hard iron mold 4 after sinking, the present invention can pre-arrange support columns 51 at the four corners of the iron box 5, and the top of the support column 51 is 2-2.5mm higher than the top of the first hemispherical ball head 43 corresponding to the ball head hard iron mold 4; if the support columns 51 are pre-arranged at the four corners of the iron box 5, the food-grade silicone can be left at room temperature for 4-6 hours to wait for the glue to dry. The food-grade silicone standing at room temperature is conducive to the full reaction of the A glue and the B glue of the food-grade silicone, which is beneficial to improving the molding quality of the silicone mold 6; if the present invention does not pre-arrange support columns 51 at the four corners of the iron box 5, the iron box 5 filled with food-grade silicone solution can be baked at a low temperature of 60℃-90℃ to shorten the time taken for the glue to dry, thereby preventing the thin aluminum plate or wire mesh from sinking too much.
[0028] Preferably, in order to prevent the support column 51 from affecting the silicone mold 6 from separating from the iron box 5 and the ball-head hard iron mold 4, the present invention arranges the support column 51 to be detachably installed at the four corners of the iron box 5. After the food-grade silicone solution solidifies, the support column 51 can be removed from the iron box 5 first, and then the silicone mold 6 can be demolded from the ball-head hard iron mold 4 and the iron box 5.
[0029] In some embodiments, Figure 5 As shown, the support column 51 can be configured to be threadedly connected to the bottom wall of the iron box 5, and a mounting block 52 is provided at a corresponding position on the lower surface of the iron box 5. The outer surface of the bottom end of the support column 51 is provided with scale lines, and the height of the support column 51 can be conveniently adjusted through the scale lines to adjust the relative height between the thin aluminum plate or wire mesh and the ball head hard iron mold 4; an adjustment knob is provided at the bottom end of the support column 51, and the support column 51 can be conveniently rotated by adjusting the knob, thereby facilitating the adjustment of the relative position of the top end of the support column 51 and the silicone mold 6. In this embodiment, after the food-grade silicone solution solidifies, the support column 51 is first driven to move upward to push up the four corners of the silicone mold 6, so that the four corners of the upper surface of the silicone mold 6 are tilted and extend out of the iron box 5; it is convenient to insert a screwdriver into the bottom end of the edge of the silicone mold 6, and the bottom end of the edge of the silicone mold 6 is the end of the silicone mold 6 close to the bottom wall of the iron box 5; because it is difficult to make the silicone mold 6 separate from the ball-head hard iron mold 4 by pushing up the silicone mold 6 through the support column 51, the present invention rotates the support column 51 in the opposite direction at this time, drives the support column 51 to move downward to remove the support column 51 from the iron box 5; thereby, it is convenient to use a screwdriver to tilt one side of the silicone mold 6 out of the iron box 5, and then it is convenient to demold the silicone mold 6 from the ball-head hard iron mold 4 and the iron box 5.
[0030] In other embodiments, Figure 6 and Figure 7As shown, both sides of the lower surface of the iron box 5 are provided with motors 53, and the output end of the motor 53 is fixedly connected with a first bevel gear 54, and the first bevel gear 54 is simultaneously meshed and connected with two second bevel gears 55. The outer surface of the support column 51 is threadedly connected with a threaded sleeve 58, and an O-ring is provided between the outer surface of the support column 51 and the bottom wall of the iron box 5. The upper end of the threaded sleeve 58 is rotatably connected to a bearing seat 59, and the bearing seat 59 is installed on the bottom wall of the iron box 5. A fourth bevel gear 57 is installed on the outer surface of the threaded sleeve 58, and the fourth bevel gear 57 is meshed and connected with a third bevel gear 56, and the other end of the gear shaft of the third bevel gear 56 is connected to the second bevel gear 55, and the middle part of the gear shaft of the third bevel gear 56 is rotatably connected to the support plate of the bottom wall of the iron box 5. When the motor 53 drives the first bevel gear 54 to rotate, the transmission cooperation between the bevel gears will drive the threaded sleeve 58 to rotate, so that the support column 51 moves up and down. On the one hand, the heights of multiple support columns 51 can be adjusted at the same time, so that the support columns 51 can play the role of supporting the thin aluminum plate or the wire mesh, and the adjustment is more convenient; on the other hand, after the food-grade silicone solution solidifies, after starting the motor 53, the top of the support column 51 can be driven to move upward at the same time, so that the support column 51 can push the silicone mold 6 at the same time, and then the four corners of the upper surface of the silicone mold 6 can be tilted and extended out of the iron box 5; as mentioned above, it is convenient to insert a screwdriver into the bottom end of the edge of the silicone mold 6 at this time; then the motor 53 rotates in the opposite direction, driving the top of the support column 51 to move downward to the bottom end of the iron box 5, avoiding the support column 51 from affecting the demoulding of the silicone mold 6 from the ball head hard iron mold 4 and the iron box 5, and finally using a screwdriver to tilt one side of the silicone mold 6 out of the iron box 5, so as to facilitate the demoulding of the silicone mold 6 from the ball head hard iron mold 4 and the iron box 5.
[0031] Step S4, preparing the inverted ball head glue; Specifically, the present invention selects LED encapsulation glue as the glue for the inverted ball head, the glue A and glue B of the LED encapsulation glue are prepared at a weight ratio of 1:10, the model of the LED encapsulation glue is HW-6685-H, the glue A and glue B of the LED encapsulation glue are fully stirred, and after stirring evenly, they are put into a vacuum machine for vacuum degassing, and the vacuuming time is 120S.
[0032] Step S5, pour the prepared inverted ball head glue into the silicone mold, and put the lamp board with the lamp beads attached to the mold into it; after the inverted ball head glue is completely solidified, curl the silicone mold to separate the silicone mold and the lamp board; wherein a second hemispherical ball head with a microstructure is formed on the lamp bead, and a glue waterproof layer is formed on the surface of the lamp board and the lamp bead; Specifically, step S5 specifically includes the following steps: Step S51, pour an appropriate amount of inverted ball head glue into the silicone mold; after the glue is leveled, put the lamp board with the lamp beads attached to the mold into it; The present invention first pours a proper amount of inverted ball head glue into the silicone mold 6, waits for the glue to flow flat, and then puts in the lamp board 1 with the lamp beads 2 to be molded; wherein, a plurality of lamp beads 2 are evenly arranged on the lamp board 1, and the lamp beads 2 include a lamp bead bracket, an LED chip and a chip pin. The LED chip can be an LED chip of four primary colors of red, yellow, blue and green, and a circuit connected to the chip pin is arranged inside the lamp board 1. In the process of placing the lamp board 1, the lamp bead surface of the lamp board 1 faces the inverted ball head glue, and the lamp board 1 is placed at an inclined angle, gradually immersing the lamp board 1 completely into the inverted ball head glue, so as to facilitate the discharge of the air between the lamp board 1 and the upper surface of the inverted ball head glue. In addition, the positioning holes and threading holes on the lamp board 1 correspond to the protrusions on the silicone mold 6, the lamp beads 2 on the lamp board 1 correspond to the rectangular grooves 61 of the silicone mold 6, and the LED chips on the lamp beads 2 correspond to the hemispherical grooves 62.
[0033] It should be noted that after the lamp board 1 is completely immersed in the inverted ball head glue and sinks into place, a thin aluminum plate or wire mesh is pre-placed at the bottom of the silicone mold 6 as a reinforcement rib, thereby improving the strength of the silicone mold 6. Under the pressure of the lamp board 1, although the silicone mold 6 is made of soft material, the hemispherical groove 62 on the silicone mold 6 is not easily deformed into an elliptical groove, so that a second hemispherical ball head 3 with a microstructure can be formed on the lamp bead 2. The uneven surface of the second hemispherical ball head 3 with a microstructure is conducive to the uniform mixing of light emitted by the multi-primary color LED chip on the lamp bead 2.
[0034] Step S52, placing the silicone mold with the light board in place into a vacuum machine for vacuuming; Specifically, the silicone mold 6 with the light board 1 placed thereon is placed in a vacuum machine for vacuuming for 30 minutes. During the vacuuming process, air is precipitated from the gap between the light board 1 and the silicone mold 6 and from the gap between the positioning holes and threading holes on the light board 1 and the protrusions on the silicone mold 6. After the bubbles are precipitated, the mold head glue forms a waterproof glue layer with good waterproof effect. It should be noted that compared with the hard mold of the prior art, which squeezes out the air in the glue by squeezing the male mold and the female mold against each other, the present invention does not need to apply pressure to the silicone mold 6.
[0035] Step S53, placing the vacuumed silicone mold into an oven and baking it at a low temperature first and then at a higher temperature; Specifically, the vacuumed silicone mold 6 with the light board 1 is placed in an oven and baked at a low temperature of 80° C. for 30 minutes and then heated to 130° C. for two hours.
[0036] Step S54, take out the silicone mold after the glue is dried, and demould it after natural cooling; when demoulding, the back of the light board is laid flat, and the silicone mold is curled to separate the silicone mold and the light board.
[0037] It should be noted that, since the lamp board 1 and the silicone mold 6 are not tightly fitted, a glue waterproof layer will be formed on the surface of the lamp board 1 and the lamp bead 2 after the glue on the mold head dries. The thickness of the glue waterproof layer on the surface of the lamp board 1 is greater than 0.5mm, and the thickness of the glue waterproof layer on the surface of the lamp bead 2 is greater than 1mm; at the same time, a second hemispherical ball head 3 with a microstructure will be formed at the position corresponding to the LED chip on the lamp bead 2; compared with the prior art, the lens and the lamp board 1 are waterproofed by a waterproof ring, and the present invention prepares a glue waterproof layer on the surface of the lamp board 1 and the lamp bead 2, which can significantly improve the waterproof effect of the LED lamp; in addition, the present invention prepares a second hemispherical ball head 3 with a microstructure on the lamp bead 2 by the method of silicone mold 6 molding. Since the silicone mold 6 is made of soft material, compared with the prior art that the lamp board 1 adopts a hard mold injection molding to obtain the second hemispherical ball head 3 with a microstructure, but it is inconvenient to separate the ball head from the hard mold, the second hemispherical ball head 3 with a microstructure of the present invention can be easily demolded.
[0038] In summary, the present invention provides a method for integrally molding a ball head of a lamp board. The present invention first obtains a ball head hard iron mold 4 and an iron box 5 by CNC machine tools. The ball head hard iron mold 4 includes a first hemispherical ball head 43 with a microstructure. Then, the defoamed food-grade silicone is poured into the iron box 5 in which the ball head hard iron mold 4 is placed in advance, and a silicone mold 6 is obtained by molding; then, an appropriate amount of glue for molding the ball head is poured into the silicone mold 6; after waiting for the glue to flow smoothly, the lamp board 1 with the lamp beads 2 attached to it is placed in the mold, and a layer of glue waterproof layer will be formed on the surface of the lamp board 1 and the lamp beads 2 obtained by molding, and at the same time, a second hemispherical ball head 3 with a microstructure will be formed at the position corresponding to the LED chip on the lamp bead 2; because the silicone mold 6 is a soft material. Compared with the prior art lamp board 1 which uses a hard mold for injection molding to obtain a second hemispherical ball head 3 with a microstructure and is inconvenient to separate the ball head from the hard mold, the second hemispherical ball head 3 with a microstructure of the present invention can be easily demolded; in addition, a thin aluminum plate or wire mesh is embedded in the silicone mold 6 obtained by inverting the mold, and the thin aluminum plate or wire mesh can improve the strength of the bottom of the silicone mold 6. Therefore, under the pressure of the lamp board 1, the hemispherical groove 62 on the silicone mold 6 is not easy to deform into an elliptical shape, so that a second hemispherical ball head 3 with a microstructure can be formed on the lamp bead 2. The outer surface of the second hemispherical ball head 3 with a microstructure is uneven, which is conducive to the uniform mixing of the light emitted by the multi-primary color chip on the lamp bead 2. Moreover, the present invention fully covers the surface of the lamp board 1 with glue while inverting the ball head, and does not require an additional process to prepare a glue waterproof layer. Compared with the prior art that waterproofs the lens and the lamp board 1 through a waterproof ring, the present invention prepares a layer of glue waterproof layer on the surface of the lamp board 1 and the lamp bead 2, which can significantly improve the waterproof effect of the LED lamp.
[0039] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention. Parts not described in detail in this specification belong to the prior art known to those skilled in the art.
Claims
1. A method for integrally molding a ball head of a lamp panel, characterized in that: The specific steps include: Make hard iron molds for ball heads and iron boxes for casting; Formulated with food grade silicone; Pour the prepared food-grade silicone into the iron box where the ball head hard iron mold has been placed in advance. After the glue is completely solidified, demould the silicone mold from the ball head hard iron mold and the iron box. Prepare the glue for the inverted ball head; Pour the prepared inverted ball head glue into the silicone mold, and put the lamp board with the lamp beads attached to the mold into it; after the inverted ball head glue is completely solidified, curl the silicone mold to separate the silicone mold and the lamp board; wherein, a second hemispherical ball head with a microstructure on the surface is formed on the lamp bead, and a glue waterproof layer is formed on the surface of the lamp board and the lamp bead; The ball head hard iron mold comprises a base corresponding to the surface of the lamp panel, a pedestal corresponding to the lamp bead, and a first hemispherical ball head with a microstructure on the surface.
2. The method for integrally molding a ball head of a lamp panel according to claim 1, characterized in that: The prepared inverted ball head glue is poured into the silicone mold, and the lamp board with the lamp beads attached to the mold is placed in it; After the glue of the inverted ball head is completely solidified, curl the silicone mold to separate the silicone mold and the light board. The specific steps include: Pour an appropriate amount of ball head glue into the silicone mold; after the glue is leveled, put in the lamp board with the lamp beads to be molded; Put the silicone mold with the light board into the vacuum machine for vacuuming; Put the vacuumed silicone mold into the oven and bake it at low temperature first and then at high temperature; Take out the silicone mold after the glue has dried, and demould it after natural cooling; when demoulding, lay the back of the light board flat and curl the silicone mold to separate the silicone mold and the light board.
3. The method for integrally molding a ball head of a lamp panel according to claim 1, characterized in that: The step of pouring the prepared food-grade silica gel into the iron box in which the ball head hard iron mold is placed in advance comprises: A thin aluminum plate or wire mesh is placed in the food-grade silicone. The thin aluminum plate or wire mesh is used as a reinforcing rib to control the height of the thin aluminum plate or wire mesh after sinking to be 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head.
4. The method for integrally molding a ball head of a lamp panel according to claim 3, characterized in that: The height position of the thin aluminum plate or wire mesh after the controlled sinking is 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and specifically includes: Pre-arrange support columns at the four corners of the iron box, control the top of the support column to be 2-2.5mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and the support column is used to support the reinforcing ribs; Leave the food-grade silicone at room temperature for 4-6 hours to wait for the glue to dry, so that the A glue and B glue of the food-grade silicone can fully react.
5. The method for integrally molding a ball head of a lamp panel according to claim 3, characterized in that: The height position of the thin aluminum plate or wire mesh after the controlled sinking is 2-2.5 mm higher than the top of the first hemispherical ball head corresponding to the hard iron mold of the ball head, and specifically includes: Put the iron box containing food-grade silica gel solution into the oven and bake it at a low temperature of 60-80℃.
6. The method for integrally molding a ball head of a lamp panel according to claim 4, characterized in that: Demolding the silicone mold from the ball head hard iron mold and the iron box specifically includes: The support columns are arranged to be detachably installed at the four corners of the iron box. After the food-grade silicone solution solidifies, the support columns are removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box.
7. The method for integrally molding a ball head of a lamp panel according to claim 6, characterized in that: The supporting columns are arranged to be detachably mounted at the four corners of the iron box, and after the food-grade silicone solution solidifies, the supporting columns are removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box. Specifically, the steps include: The support column is arranged to be threadedly connected to the bottom wall of the iron box; After the food-grade silicone solution solidifies, first drive the support column to move upward to push up the four corners of the silicone mold, so that the four corners of the upper surface of the silicone mold are tilted upward and extend out of the iron box; insert the screwdriver into the bottom end of the edge of the silicone mold; Then drive the support column downward to remove the support column from the iron box; use a screwdriver to tilt one side of the silicone mold out of the iron box, and then demold the silicone mold from the ball head hard iron mold and the iron box.
8. The method for integrally molding a ball head of a lamp panel according to claim 6, characterized in that: The supporting columns are arranged to be detachably mounted at the four corners of the iron box, and after the food-grade silicone solution solidifies, the supporting columns are removed from the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box. Specifically, the steps include: The outer surface of the support column is threadedly connected to the threaded sleeve, the upper end of the threaded sleeve is rotatably connected to the bearing seat, the bearing seat is installed on the bottom wall of the iron box, and the motor drives the threaded sleeve to rotate through the transmission mechanism; The motor drives the top ends of the support columns to move upward at the same time, so that the support columns simultaneously push up the silicone mold, thereby causing the four corners of the upper surface of the silicone mold to tilt upward and extend out of the iron box; insert a screwdriver into the bottom end of the edge of the silicone mold; The motor is controlled to rotate in the opposite direction to drive the top of the support column to move downward to the bottom of the iron box. A screwdriver is used to lift one side of the silicone mold out of the iron box, and then the silicone mold is demolded from the ball head hard iron mold and the iron box.
9. The method for integrally molding a ball head of a lamp panel according to claim 1, characterized in that: The prepared food grade silica gel specifically comprises: Prepare food-grade silica gel A and B in a ratio of 1:1 by weight, fully stir A and B, and after stirring evenly, put them into a vacuum machine for vacuum degassing.
10. The method for integrally molding a ball head of a lamp panel according to claim 1, characterized in that: The preparation of the inverted ball head glue specifically includes: Select LED encapsulation glue as the glue for the inverted ball head. The A glue and B glue of the LED encapsulation glue are prepared at a weight ratio of 1:
10. The A glue and B glue of the LED encapsulation glue are fully stirred. After stirring evenly, put them into a vacuum machine for vacuum degassing.