Liquid ejecting head and liquid ejecting device

Abstract

The present invention provides a liquid jet head and a liquid jet device capable of reducing the warping caused by the heat of the components constituting the liquid jet head. The liquid jet head comprises: a plurality of head chips, which are five or more and are arranged in a staggered manner along a first direction; a supporting component, which supports the plurality of head chips, the plurality of head chips being arranged to have an overlapping region in which a part of the nozzle forming region of one of the adjacent head chips overlaps a part of the nozzle forming region of the other head chip when viewed in a second direction orthogonal to the first direction, the plurality of overlapping regions including a first overlapping region and a second overlapping region, the second overlapping region being farther in the first direction than the first overlapping region relative to the center position in the first direction of all the nozzle forming regions constituted by all the nozzle forming regions of the plurality of head chips, and the second overlapping region being larger than the first overlapping region in the first direction.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there has been proposed a liquid ejecting apparatus including a liquid ejecting head for ejecting liquid such as ink onto a medium such as printing paper.

[0003] The liquid jet head described in Patent Document 1 includes a plurality of head units (corresponding to head chips) arranged in a staggered pattern, a fixing plate, and a housing member (corresponding to a frame portion). The plurality of head units are accommodated and supported in a space formed by the fixing plate and the frame portion.

[0004] In the liquid ejecting head described in the patent document, adjacent head chips among a plurality of head chips have overlapping regions that overlap each other. In the document, a plurality of head chips are arranged in a staggered manner, and there are five or more overlapping regions.

[0005] When more than five head chips are arranged in a staggered manner in a predetermined direction as in this document, the liquid jet head becomes elongated in the predetermined direction. In addition, since the head chip arranged on the central side in the predetermined direction is adjacent to the four head chips, the temperature of the central side of the liquid jet head becomes higher than that of the end side due to the heat generated by the five or more head chips. As a result, a temperature difference is generated in the liquid jet head, which may cause the components constituting the liquid jet head to warp.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2016-489 Summary of the invention

[0007] A liquid jet head involved in one embodiment of the present invention comprises: a plurality of head chips, which are five or more and are arranged in a staggered manner along a first direction; a supporting member, which supports the plurality of head chips, the plurality of head chips being arranged to have an overlapping area in which a portion of a nozzle forming area of ​​one of the adjacent head chips overlaps a portion of a nozzle forming area of ​​the other head chip when viewed in a second direction orthogonal to the first direction, the plurality of overlapping areas including a first overlapping area and a second overlapping area, the second overlapping area being farther in the first direction than the first overlapping area relative to a center position in the first direction of all nozzle forming areas constituted by all nozzle forming areas of the plurality of head chips, and the second overlapping area is larger than the first overlapping area in the first direction.

[0008] A liquid ejecting device according to one aspect of the present disclosure includes: a liquid ejecting head that ejects liquid onto a medium; and a transport unit that transports the medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram showing a configuration example of the liquid ejecting device according to the first embodiment.

[0010] Figure 2 for Figure 1 A perspective exploded view of the liquid ejection head shown.

[0011] Figure 3 for Figure 2 Cross-sectional view along line aa in FIG.

[0012] Figure 4 It is a top view of the liquid ejecting head according to the first embodiment.

[0013] Figure 5 for Figure 4 AA line section view in.

[0014] Figure 6 This is a schematic diagram of the bottom surface of the liquid ejecting head according to the first embodiment.

[0015] Figure 7 It is a bottom view of the liquid ejecting head according to the first embodiment.

[0016] Figure 8 It is a bottom view of the liquid ejecting head of the comparative example.

[0017] Fig. 9 This is a diagram showing the overlapping number of nozzles that eject ink droplets in the first overlapping region.

[0018] Fig.10 This is a diagram showing the overlapping number of nozzles that eject ink droplets in the second overlapping region.

[0019] Fig.11 It is a bottom view of the liquid ejecting head of the first modified example.

[0020] Fig.12 It is a bottom view of the liquid ejecting head of the second modified example. DETAILED DESCRIPTION

[0021] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, the dimensions and scales of each part are appropriately different from the actual ones, and there are also parts that are shown in a schematic manner for easy understanding. In addition, as long as there is no record of specifically limiting the present disclosure in the following description, the scope of the present disclosure is not limited to these methods.

[0022] In addition, in the following description, the X-axis, Y-axis and Z-axis that intersect each other are appropriately used for implementation. In addition, a direction along the X-axis is called the X1 direction, and the direction opposite to the X1 direction is called the X2 direction. Similarly, the directions opposite to each other along the Y-axis are called the Y1 direction and the Y2 direction. In addition, the directions opposite to each other along the Z-axis are called the Z1 direction and the Z2 direction. The Y1 direction or the Y2 direction is an example of a "first direction", and the X1 direction or the X2 direction is an example of a "second direction". In the following, the situation of observing from the Z1 direction or the Z2 direction is referred to as "planar observation".

[0023] Typically, the Z axis is a vertical axis, and the Z1 direction is equivalent to the downward direction in the vertical direction. However, the Z axis may not be a vertical axis. In addition, although the X axis, the Y axis, and the Z axis are typically orthogonal to each other, they are not limited to this, and for example, they can intersect at an angle within a range of 80° or more and 100° or less.

[0024] 1. First Implementation

[0025] 1-1. Schematic Structure of Liquid Ejecting Device 100

[0026] Figure 1 1 is a schematic diagram showing a configuration example of a liquid ejecting device 100 according to the first embodiment. The liquid ejecting device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, onto a medium M in the form of droplets. The medium M is typically printing paper. In addition, the medium M is not limited to printing paper, and may be a printing object of any material such as a resin film or cloth.

[0027] like Figure 1 As shown, the liquid ejecting apparatus 100 includes a liquid container 10 , a control unit 20 , a transport unit 50 , and a liquid ejecting head 30 .

[0028] The liquid container 10 is a container for storing ink. Specific forms of the liquid container 10 include, for example, a cartridge that can be attached to and detached from the liquid ejecting device 100, a bag-shaped ink bag formed of a flexible film, and an ink tank that can replenish ink. The type of ink stored in the liquid container 10 is not particularly limited and is arbitrary.

[0029] The control unit 20 controls the operation of each element of the liquid ejection device 100. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0030] The conveying unit 50 conveys the medium M in the direction DM under the control of the control unit 20. The direction DM in this embodiment is the X1 direction. Figure 1 In the example shown, the conveying unit 50 includes a conveying roller that is elongated along the Y axis and a motor that rotates the conveying roller. In addition, the conveying unit 50 is not limited to a structure using a conveying roller, and for example, a structure using a roller or an endless belt that conveys the medium M while being adsorbed to the outer peripheral surface by electrostatic force or the like may also be used.

[0031] The liquid ejection head 30 ejects the ink supplied from the liquid container 10 from each of the plurality of nozzles N onto the medium M in the Z2 direction under the control of the control unit 20. The liquid ejection head 30 is a line head that is elongated in the direction of extension of the Y axis. The liquid ejection head 30 has a plurality of head chips 3 that are arranged so that the plurality of nozzles N are distributed over the entire range of the medium M in the direction along the Y axis. The ejection of the ink from the liquid ejection head 30 is performed in parallel with the conveyance of the medium M by the conveyance unit 50, thereby forming an image composed of the ink on the surface of the medium M.

[0032] The number and arrangement of the head chips 3 of the liquid jet head 30 are not limited to Figure 1 The examples shown are arbitrary. In addition, when the liquid ejecting head 30 is configured to circulate ink, the liquid ejecting head 30 may be connected to the liquid container 10 via a circulation mechanism for circulating the ink in the liquid ejecting head 30 .

[0033] The liquid ejection device 100 includes a liquid ejection head 30 that ejects ink onto a medium M, and a transport unit 50 that transports the medium M. Although described later, the liquid ejection head 30 makes the temperature difference in the liquid ejection head 30 uniform, thereby reducing the possibility of warping of the components constituting the liquid ejection head 30. Therefore, according to the liquid ejection device 100 including the liquid ejection head 30, it is possible to suppress a reduction in printing quality.

[0034] 1-2. Overall structure of the head chip 3

[0035] Figure 2 for, Figure 1 The head chip 3 is shown in a perspective exploded view. Figure 3 for, Figure 2 Cross-sectional view along line aa in FIG. Figure 3 The cross section shown in FIG. 1 is a cross section parallel to the XZ plane. The Z axis is an axis along the ejection direction of the ink of the liquid ejecting head 30 .

[0036] As Figure 2 As illustrated, the head chip 3 has a plurality of nozzles N arranged along the Y axis. The plurality of nozzles N are divided into a nozzle column La and a nozzle column Lb which are spaced apart from each other and arranged side by side along the X axis. The nozzle column La and the nozzle column Lb are respectively a collection of a plurality of nozzles N arranged in a straight line along the Y axis. The liquid ejection head 30 is a structure in which the elements associated with each nozzle N of the nozzle column La and the elements associated with each nozzle N of the nozzle column Lb are arranged in a roughly plane-symmetrical manner. In the following description, the elements corresponding to the nozzle column La are described in detail, and the description of the elements corresponding to the nozzle column Lb is appropriately omitted. In addition, in the following description, when the nozzle column La and the nozzle column Lb are not distinguished, they are marked as the nozzle column L.

[0037] As Figure 2 as well as Figure 3 As illustrated, the head chip 3 includes a communication plate 31 , a pressure chamber substrate 32 , a vibration plate 33 , a nozzle plate 37 , a vibration absorber 38 , a plurality of driving elements 34 , a sealing substrate 35 , a housing 36 , and a wiring substrate 40 .

[0038] The connecting plate 31, the pressure chamber substrate 32, the vibration plate 33, the nozzle plate 37 and the vibration absorber 38 are respectively long plate-shaped members along the Y axis. The pressure chamber substrate 32 and the housing 36 are provided on the surface of the connecting plate 31 in the Z2 direction. The nozzle plate 37 and the vibration absorber 38 are provided on the surface of the connecting plate 31 in the Z1 direction. For example, the components are fixed to each other by an adhesive.

[0039] The nozzle plate 37 is a plate-shaped member formed with a plurality of nozzles N. Each of the plurality of nozzles N is a circular through hole for ejecting ink. For example, the nozzle plate 37 is manufactured by processing a single crystal substrate of silicon (Si) using semiconductor manufacturing techniques such as photolithography and etching.

[0040] In the connecting plate 31, a plurality of narrowed portions 312, a plurality of connecting flow channels 314, a connecting space Ra and a common flow channel Rb are formed. The narrowed portion 312 and the connecting flow channel 314 are respectively through holes extending in the Z1 direction and formed for each nozzle N. The connecting flow channel 314 overlaps with the nozzle N when viewed in a plan view. The connecting space Ra is an opening formed in a long strip along the Y axis. The connecting space Ra extends along the Y axis. The common flow channel Rb is connected to the connecting space Ra and overlaps with the connecting space Ra when viewed in a plan view. The common flow channel Rb extends along the Y axis. The common flow channel Rb is connected to the plurality of narrowed portions 312. In addition, the connecting space Ra connects the common flow channel Rb and the external flow channel of the head chip 3 via the space Rc and the supply port 361 described later.

[0041] A plurality of pressure chambers C1 are formed in the pressure chamber substrate 32. The pressure chamber C1 is a space located between the connecting plate 31 and the vibration plate 33 and formed by the wall surface 320 of the pressure chamber substrate 32. The pressure chamber C1 is formed for each nozzle N. The pressure chamber C1 is a long strip-shaped space extending in the X1 direction. A plurality of pressure chambers C1 are arranged along the Y axis. At one end of the pressure chamber C1 in the X1 direction, the nozzle N is connected via the connecting flow channel 314. At the other end of the pressure chamber C1 in the X1 direction, the narrowing portion 312 is connected. The narrowing portion 312 has a smaller cross-sectional area than the pressure chamber C1. In addition, an independent flow channel for each nozzle N is formed by the pressure chamber C1, the nozzle N, the connecting flow channel 314, and the narrowing portion 312.

[0042] The communication plate 31 and the pressure chamber substrate 32 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate, for example.

[0043] On the upper part of the pressure chamber C1, there is arranged a vibration plate 33 that can be elastically deformed. The vibration plate 33 is stacked on the pressure chamber substrate 32 and is in contact with the surface of the pressure chamber substrate 32 opposite to the connecting plate 31. The vibration plate 33 is a plate-like component that is formed into a long rectangular shape along the Y axis when viewed in a plan view. The thickness direction of the vibration plate 33 is parallel to the Z1 direction. The pressure chamber C1 is connected to the connecting flow channel 314 and the narrowing portion 312. Therefore, the pressure chamber C1 is connected to the nozzle N via the connecting flow channel 314, and is connected to the connecting space Ra via the narrowing portion 312. In addition, although in Figure 2 In the figure, the pressure chamber substrate 32 and the vibration plate 33 are shown as different substrates for the convenience of explanation, but they are actually plates stacked on one silicon substrate.

[0044] A driving element 34 is formed for each pressure chamber C1 on the surface of the vibration plate 33 on the opposite side to the pressure chamber C1. The driving element 34 is a piezoelectric element that is long and along the X-axis when viewed in a plan view. The driving element 34 includes, for example, a pair of electrodes and a piezoelectric body sandwiched by the pair of electrodes. In addition, the driving element 34 may also be an electrothermal conversion element that generates heat energy.

[0045] The housing 36 is a shell for storing ink supplied to the plurality of pressure chambers C1, and is formed, for example, by injection molding of a resin material. In the housing 36, a space Rc and a supply port 361 are formed. The supply port 361 is a pipe for supplying ink from the liquid container 10, and is connected to the space Rc. The space Rc of the housing 36 is connected to the connecting space Ra of the connecting plate 31. The connecting space Ra, the common flow channel Rb, and the space Rc constitute a common space R shared by the plurality of nozzles N. The common space R functions as a liquid storage chamber for storing ink supplied to the plurality of pressure chambers C1. The ink stored in the common space R is branched into each of the narrowed portions 312, and is supplied and filled in parallel to the plurality of pressure chambers C1.

[0046] The vibration absorbing body 38 is a flexible film constituting the wall surface of the communicating space Ra, and absorbs the pressure fluctuation of the ink in the common space R. The vibration absorbing body 38 is, for example, a laminate of a resin film resistant to ink, a SUS (stainless steel) member having spring properties to hold the resin film, and a fixing plate to protect the resin film and the SUS member. By providing the vibration absorbing body 38, the natural vibration frequency of the flow path from the nozzle N through the pressure chamber C1 to the narrowing portion 312 is stabilized regardless of the driven nozzle N.

[0047] The frame 56 is bonded to the surface of the vibration absorbing body 38 facing the Z1 direction by adhesive or the like. The frame 56 is a frame-shaped member along the outer periphery of the vibration absorbing body 38. The frame 56 is made of, for example, a metal material. As shown by the double-dashed line in the figure, a fixing plate 532 described later is bonded to the surface of the frame 56 facing the Z1 direction by adhesive or the like.

[0048] The sealing substrate 35 is a structure that protects the plurality of driving elements 34 and reinforces the mechanical strength of the pressure chamber substrate 32 and the vibration plate 33, and is fixed to the surface of the vibration plate 33 by, for example, an adhesive. The plurality of driving elements 34 are accommodated inside the recess formed on the opposite surface of the sealing substrate 35 and the vibration plate 33. In addition, the wiring substrate 40 is inserted into the through hole 362 of the housing 36 and the through hole 353 of the sealing substrate 35. The wiring substrate 40 is bonded to the surface of the vibration plate 33. The wiring substrate 40 is a package component formed with a plurality of wirings for electrically connecting the control unit 20 and the head chip 3. The wiring substrate 40 includes a driver IC 41. The driver IC 41 is a circuit including a switch element that selects whether to supply the driving signal Com to the driving element 34. As the wiring substrate 40, for example, TCP (Tape Carrier Package) or FPC (Flexible Printed Circuit) can be used. A driving signal and a reference voltage for driving the driving element 34 are supplied from the wiring substrate 40 to each driving element 34. Although not shown in the figure, at least a portion of the driving IC 41 is located inside a through hole (not shown) formed in the flow channel structure 52 and the frame portion 531 through which the wiring substrate 40 is inserted.

[0049] In addition, if Figure 5 As shown, the liquid ejecting head 30 has a relay substrate 70 that is elongated in the Y1 direction and electrically connects a plurality of wiring substrates 40. A connector 71 is provided on the relay substrate 70, and the control unit 20 and the relay substrate 70 are electrically connected via a wiring member (not shown) through the connector 71.

[0050] In the head chip 3 involved, when the driving element 34 contracts due to power-on, the vibration plate 33 is bent and flexed in the direction in which the volume of the pressure chamber C1 decreases, so that the pressure in the pressure chamber C1 rises and ink droplets are ejected from the nozzle N. At this time, the pressure is also transmitted from the pressure chamber C1 toward the narrowing portion 312, so that the ink also flows through the narrowing portion 312 to the common flow channel Rb. After the ink is ejected, the driving element 34 returns to its original position. At this time, the ink from the nozzle N to the common flow channel Rb also vibrates. Then, while the meniscus of the nozzle N is restored, ink is supplied from the narrowing portion 312. Through the above series of actions, the ink is ejected from the nozzle N.

[0051] 1-3. Liquid ejecting head 30

[0052] Figure 4 2 is a plan view of the liquid jet head 30 according to the first embodiment. Figure 5 for, Figure 4 AA line section view in. Figure 6 FIG. 2 is a schematic diagram of the bottom surface of the liquid jet head 30 according to the first embodiment. Figure 4 , Figure 5 as well as Figure 6 , a liquid ejecting head 30 having head chips 3 - 1 to 3 - 7 is schematically shown. The head chips 3 - 1 to 3 - 7 are respectively the aforementioned head chips 3 . Hereinafter, there are cases where the head chips 3 - 1 to 3 - 7 are respectively referred to as head chips 3 .

[0053] The liquid ejecting head 30 includes head chips 3 - 1 to 3 - 7 , a flow channel structure 52 , and a supporting member 53 .

[0054] The head chips 3-1 to 3-7 are arranged in a staggered manner along the Y2 direction when viewed in the direction of the Z axis. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged in a row in the Y2 direction in this order. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged so that their positions are aligned with each other in the direction along the X axis. In addition, the head chips 3-2, 3-4, and 3-6 are arranged in a row in the Y2 direction in this order. The head chips 3-2, 3-4, and 3-6 are arranged so that their positions are aligned with each other in the direction along the X axis at positions closer to the X2 direction than the head chips 3-1, 3-3, 3-5, and 3-7.

[0055] The flow channel structure 52 is a structure having a flow channel Pa for supplying ink from the liquid container 10 to the plurality of head chips 3. The flow channel structure 52 is made of, for example, a resin material or a metal material. A plurality of tubes 52d are provided in the flow channel structure 52. The plurality of tubes 52d protrude from the flow channel structure 52 in the Z1 direction.

[0056] The flow channel Pa has a common flow channel Pa1, a plurality of branched flow channels Pa2, and a plurality of openings HL. The common flow channel Pa1 and the plurality of branched flow channels Pa2 are formed in the flow channel structure 52. The plurality of openings HL are formed in a one-to-one manner in the plurality of tube portions 52d.

[0057] The common flow channel Pa1 is a flow channel commonly provided in a plurality of head chips 3. Specifically, the common flow channel Pa1 is composed of flow channels commonly provided in the head chips 3-1, 3-3, 3-5, and 3-7, and flow channels commonly provided in the head chips 3-2, 3-4, and 3-6. These flow channels extend in the direction along the Y axis, and both ends of each flow channel are connected to the opening HL facing the Z2 direction. Ink from the liquid container 10 is introduced into the opening HL.

[0058] The plurality of branched flow paths Pa2 are provided for each supply port 361 of the head chips 3 - 1 to 3 - 7 . The plurality of branched flow paths Pa2 are communicated with the corresponding supply ports 361 , respectively.

[0059] The support member 53 is a member that directly and collectively supports the plurality of head chips 3. The support member 53 is disposed on the surface of the flow channel structure 52 that faces the Z1 direction and is connected to the flow channel structure 52. The support member 53 includes a frame portion 531 and a fixing plate 532.

[0060] The frame 531 has a plurality of recesses 53a for accommodating a plurality of head chips 3. The plurality of recesses 53a are depressions provided on the surface of the frame 531 facing the Z1 direction. In addition, the plurality of recesses 53a may be provided for each head chip 3 or for each group of two or more head chips 3. For example, the plurality of recesses 53a are formed by dividing one recess into a plurality of recesses.

[0061] The fixing plate 532 is disposed on the surface of the frame 531 facing the Z1 direction and connected to the frame 531. The fixing plate 532 is a plate-shaped member for fixing the plurality of head chips 3. The head chips 3 are stored in the storage space defined by the fixing plate 532 and the recessed portion 53a of the frame 531.

[0062] A plurality of exposure openings 53b are provided on the fixing plate 532 for exposing the nozzle plates 37 of each head chip 3 to the outside of the liquid ejecting head 30. Each exposure opening 53b is a hole formed on the fixing plate 532. The plurality of exposure openings 53b are independently provided for each head chip 3. Each exposure opening 53b exposes a plurality of nozzles of the nozzle plates 37 of each head chip 3. The surface of the fixing plate 532 of the liquid ejecting head 30 facing the Z1 direction and the nozzle plates 37 exposed from the exposure openings 53b together constitute an ejection surface FN. Figure 3 As shown in the figure, in this embodiment, the exposure opening 53b is formed so as to overlap with the plurality of nozzles N of the nozzle plate 37. When a part of the fixing plate 532 is viewed in the Z1 direction, it overlaps with the outer peripheral portion of the nozzle plate 37. In addition, the exposure opening 53b may overlap with the entire area of ​​the nozzle plate 37 when viewed in a plan view. That is, the entire nozzle plate 37 may be exposed from the exposure opening 53b.

[0063] The support member 53 is made of, for example, a metal material such as stainless steel, titanium, or a magnesium alloy, or a resin material. In addition, although the fixing plate 532 and the frame 531 are made of different components, they may be integrally formed. In addition, a part of the support member 53 may also be integrally formed with the flow channel structure 52. For example, the frame 531 may also be integrally formed with the flow channel structure 52.

[0064] 1-4. Overlapping area of ​​head chip 3

[0065] Figure 7 2 is a bottom view of the liquid jet head 30 according to the first embodiment.

[0066] like Figure 7 As shown in FIG. 1 , the ejection surface FN of the liquid ejection head 30 includes all nozzle forming areas S30 formed by all nozzle forming areas S3 of the plurality of head chips 3. The nozzle forming area S3 is an area from the nozzle N arranged at one end of the plurality of nozzles N formed on one head chip 3 in the Y1 direction to the nozzle N arranged at the other end. Figure 7 In the figure, the nozzle N is omitted, and the nozzle forming area S3 is shown. In addition, the entire nozzle forming area S30 is an area from the end of the nozzle forming area S3 of the head chip 3-1 in the Y1 direction to the end of the nozzle forming area S3 of the head chip 3-7 in the Y2 direction. In addition, in the present embodiment, the size of each nozzle forming area S3 of the plurality of head chips 3, that is, the length along the Y axis is substantially the same as each other. In addition, the so-called substantially the same means that the difference between the two is less than 1% when the size of the nozzle forming area S3 of one head chip 3 is 100%.

[0067] As described above, the plurality of head chips 3 are arranged in a staggered manner along the Y1 direction, and five or more head chips 3 are provided. In the illustrated example, seven head chips 3 are provided. Furthermore, the plurality of head chips 3 are arranged so that a portion of the nozzle forming area S3 of one of the adjacent head chips 3 and a portion of the nozzle forming area S3 of the other head chip 3 have an overlapping overlap area A when viewed in the X1 direction. Therefore, there is an overlapping area A between adjacent head chips 3. Therefore, the plurality of head chips 3 include a plurality of overlapping areas A. In addition, the Y1 direction and the X1 direction are directions parallel to the nozzle forming area S3, and directions perpendicular to the Z1 direction which is the ejection direction of the ink.

[0068] The plurality of overlapping regions A include a first overlapping region A1 , a second overlapping region A2 , a third overlapping region A3 , a fourth overlapping region A4 , a fifth overlapping region A5 , and a sixth overlapping region A6 .

[0069] The first overlapping region A1 is an overlapping region A where a portion of the nozzle forming region S3 of the head chip 3-4 overlaps a portion of the nozzle forming region S3 of the head chip 3-5 when viewed in the X1 direction. The first overlapping region A1 is closest to the center position O1 among the plurality of overlapping regions A. The center position O1 is the center position of all the nozzle forming regions S30 in the Y1 direction.

[0070] The second overlapping area A2 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-6 overlaps a part of the nozzle forming area S3 of the head chip 3-7 when viewed in the X1 direction. The second overlapping area A2 is farther away from the first overlapping area A1 relative to the center position O1. In the present embodiment, the second overlapping area A2 is arranged in the Y2 direction relative to the first overlapping area A1. In addition, the second overlapping area A2 is located closest to the Y2 direction among the multiple overlapping areas A in the Y1 direction. In addition, the size of the second overlapping area A2, that is, the length in the direction along the Y axis, is greater than the size of the first overlapping area A1, that is, the length in the direction along the Y axis.

[0071] The third overlapping area A3 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-1 overlaps a part of the nozzle forming area S3 of the head chip 3-2 when viewed in the X1 direction. The third overlapping area A3 is farther away from the first overlapping area A1 relative to the center position O1. In the present embodiment, the third overlapping area A3 is arranged in the Y1 direction relative to the first overlapping area A1. In addition, the third overlapping area A3 is located closest to the Y1 direction among the multiple overlapping areas A. In addition, the size of the third overlapping area A3, that is, the length in the direction along the Y axis, is greater than the size of the first overlapping area A1. The size of the third overlapping area A3 is approximately the same as the size of the second overlapping area A2. In addition, the so-called approximately the same means that the difference between the two is less than 1% when the size of the nozzle forming area S3 of one head chip 3 is set to 100%.

[0072] The fourth overlapping area A4 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-4 overlaps a part of the nozzle forming area S3 of the head chip 3-3 when viewed in the X1 direction. The fourth overlapping area A4 is arranged with the center position O1 sandwiched between the first overlapping area A1. In this embodiment, the distance between the fourth overlapping area A4 and the center position O1 is substantially the same as the distance between the first overlapping area A1 and the center position O1. Therefore, similarly to the first overlapping area A1, the fourth overlapping area A4 is the overlapping area A closest to the center position O1 among the plurality of overlapping areas A. In addition, the size of the fourth overlapping area A4, that is, the length in the direction along the Y axis, is substantially the same as the size of the first overlapping area A1.

[0073] The fifth overlapping area A5 is an overlapping area A where a part of the nozzle forming area S3 of the head chip 3-5 overlaps a part of the nozzle forming area S3 of the head chip 3-6 when viewed in the X1 direction. The fifth overlapping area A5 is farther away from the first overlapping area A1 relative to the center position O1. In the present embodiment, the fifth overlapping area A5 is arranged in the Y2 direction relative to the first overlapping area A1. The fifth overlapping area A5 is arranged between the first overlapping area A1 and the second overlapping area A2 in the Y1 direction. In addition, the size of the fifth overlapping area A5, that is, the length in the direction along the Y axis, is substantially the same as the size of the first overlapping area A1.

[0074] The sixth overlapping area A6 is an overlapping area A where a portion of the nozzle forming area S3 of the head chip 3-2 overlaps a portion of the nozzle forming area S3 of the head chip 3-3 when viewed in the X1 direction. The sixth overlapping area A6 is farther away from the fourth overlapping area A4 relative to the center position O1. In the present embodiment, the sixth overlapping area A6 is arranged in the Y1 direction relative to the fourth overlapping area A4. The sixth overlapping area A6 is arranged between the fourth overlapping area A4 and the third overlapping area A3 in the Y1 direction. In addition, the size of the sixth overlapping area A6, that is, the length in the direction along the Y axis, is substantially the same as the size of the fourth overlapping area A4.

[0075] In addition, the fourth overlap region A4, the third overlap region A3 and the sixth overlap region A6 may be understood as the first overlap region A1, the second overlap region A2 and the fifth overlap region A5. In addition, the number of the head chips 3 may be 5 or more, and may be 6 or 8 or more.

[0076] Furthermore, in each overlapping region A, several nozzles N belonging to the nozzle forming region S3 of one of the two adjacent head chips 3 and several nozzles N belonging to the nozzle forming region S3 of the other head chip 3 overlap for each nozzle column L when viewed in the X1 direction.

[0077] In addition, each head chip 3 includes a non-overlapping area B in the nozzle forming area S3 that does not overlap with the nozzle forming area S3 of other adjacent head chips 3 when viewed in the X1 direction. The non-overlapping area B is an area different from the overlapping area A. The non-overlapping area B includes a plurality of non-overlapping areas B1, B2, B3, B4, B5, B6, and B7.

[0078] The non-overlapping region B1 is a region different from the first overlapping region A1 and the fourth overlapping region A4 in the nozzle forming region S3 of the head chip 3-4. The non-overlapping region B1 is a region remaining after removing the first overlapping region A1 and the fourth overlapping region A4 from the nozzle forming region S3 of the head chip 3-4. In the present embodiment, the size of the non-overlapping region B1, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming region S3 of the head chip 3-4. The size of the non-overlapping region B1 is larger than the sizes of the first overlapping region A1 and the fourth overlapping region A4.

[0079] The non-overlapping region B2 is a region different from the first overlapping region A1 and the fifth overlapping region A5 in the nozzle forming region S3 of the head chip 3-5. The non-overlapping region B2 is a region remaining after removing the first overlapping region A1 and the fifth overlapping region A5 from the nozzle forming region S3 of the head chip 3-5. In the present embodiment, the size of the non-overlapping region B2, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming region S3 of the head chip 3-5. The size of the non-overlapping region B2 is larger than the sizes of the first overlapping region A1 and the fifth overlapping region A5.

[0080] The non-overlapping area B3 is an area different from the second overlapping area A2 and the fifth overlapping area A5 in the nozzle forming area S3 of the head chip 3-6. The non-overlapping area B3 is an area remaining after removing the second overlapping area A2 and the fifth overlapping area A5 from the nozzle forming area S3 of the head chip 3-6. In the present embodiment, the size of the non-overlapping area B3, that is, the length along the Y-axis direction is more than half the size of the nozzle forming area S3 of the head chip 3-6. The size of the non-overlapping area B3 is larger than the sizes of the second overlapping area A2 and the fifth overlapping area A5.

[0081] The non-overlapping area B4 is an area different from the second overlapping area A2 in the nozzle forming area S3 of the head chip 3-7. The non-overlapping area B4 is an area remaining after removing the second overlapping area A2 from the nozzle forming area S3 of the head chip 3-7. In this embodiment, the size of the non-overlapping area B4, that is, the length along the Y-axis direction is more than half the size of the nozzle forming area S3 of the head chip 3-7. The size of the non-overlapping area B4 is larger than the size of the second overlapping area A2.

[0082] The non-overlapping area B5 is an area different from the fourth overlapping area A4 and the sixth overlapping area A6 in the nozzle forming area S3 of the head chip 3-3. The non-overlapping area B5 is an area remaining after removing the fourth overlapping area A4 and the sixth overlapping area A6 from the nozzle forming area S3 of the head chip 3-3. In the present embodiment, the size of the non-overlapping area B5, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming area S3 of the head chip 3-3. The size of the non-overlapping area B5 is larger than the sizes of the fourth overlapping area A4 and the sixth overlapping area A6.

[0083] The non-overlapping area B6 is an area different from the third overlapping area A3 and the sixth overlapping area A6 in the nozzle forming area S3 of the head chip 3-2. The non-overlapping area B6 is an area remaining after removing the third overlapping area A3 and the sixth overlapping area A6 from the nozzle forming area S3 of the head chip 3-2. In the present embodiment, the size of the non-overlapping area B6, that is, the length in the direction along the Y axis is more than half the size of the nozzle forming area S3 of the head chip 3-2. The size of the non-overlapping area B6 is larger than the sizes of the third overlapping area A3 and the sixth overlapping area A6.

[0084] The non-overlapping area B7 is an area different from the third overlapping area A3 in the nozzle forming area S3 of the head chip 3-1. The non-overlapping area B7 is an area remaining after removing the third overlapping area A3 from the nozzle forming area S3 of the head chip 3-1. In this embodiment, the size of the non-overlapping area B7, that is, the length along the Y-axis direction is more than half the size of the nozzle forming area S3 of the head chip 3-1. The size of the non-overlapping area B7 is larger than the size of the third overlapping area A3.

[0085] As described above, in the Y1 direction, the second overlap area A2 is larger than the first overlap area A1. By satisfying the above relationship, the temperature difference in the entire nozzle forming area S30 can be reduced compared to the case where the relationship is not satisfied. Therefore, the influence of warping of the components constituting the liquid ejecting head 30 can be alleviated.

[0086] As described above, each of the plurality of head chips 3 includes a wiring substrate 40 including a driver IC 41 connected to the driving element 34 for ejecting liquid. The driver IC 41 of the wiring substrate 40 is a heat source of the head chip 3 .

[0087] The larger the size of the overlapping region A, that is, the length in the direction along the Y axis, the higher the heat in the overlapping region A. In other words, the larger the overlap amount of the overlapping region A, the higher the temperature in the overlapping region A.

[0088] For example, the head chip 3-4 near the center position O1 is adjacent to the other four head chips 3-2, 3-3, 3-5, and 3-6. On the other hand, the head chips 3-1 and 3-7 closest to the two ends of the entire nozzle formation area S30 in the Y1 direction are adjacent to only two other head chips 3. The closer to the center position O1 of the entire nozzle formation area S30, the more difficult it is to dissipate the heat of the head chip 3, and the closer to the two ends, the easier it is to dissipate the heat of the head chip 3.

[0089] Furthermore, the head chip 3 near the center position O1 generally requires more ink ejection times from the nozzle N for image formation than the head chip 3 far from the center position O1. That is, the driver IC 41 of the head chip 3 near the center position O1 is more likely to generate heat than the driver IC 41 of the head chip 3 far from the center position O1.

[0090] Therefore, by setting the second overlapping area A2 arranged on the side of the head chip 3 that is easy to dissipate heat as an area with a larger overlap amount that is easy to become high temperature compared with the first overlapping area A1, it is possible to achieve uniform temperature in the entire nozzle forming area S30. Therefore, the possibility of warping of the components that are elongated in the direction along the Y axis, such as the frame 531 or the fixed plate 532, that constitute the liquid injection head 30 can be reduced. Therefore, it is possible to suppress the reduction in printing quality caused by warping on the components of the liquid injection head 30. By the way, if the fixed plate 532 is to be thinned in order to shorten the distance between the medium M and the injection surface FN to improve the printing quality, in order to ensure rigidity, it is preferably formed of metal to form the fixed plate 532, and it is preferably formed inexpensively by forming the frame 531 having a complex shape with resin by injection molding. That is, in the case where the fixing plate 532 is made of metal and the frame portion 531 is made of resin, although one side is prone to warping relative to the other side due to the large difference in their linear expansion coefficients, the warping can be effectively alleviated by setting the second overlapping area A2, which is arranged on the side of the head chip 3 that is easy to dissipate heat, as compared with the first overlapping area A1, as in the present embodiment.

[0091] Figure 8 FIG. 3 is a bottom view of a liquid ejecting head 30x of a comparative example. Figure 8 As shown in FIG. 1 , in the conventional liquid ejecting head 30x, the sizes of the plurality of overlapping regions A are substantially the same. In the liquid ejecting head 30x involved, the temperature near the center position O1 of the entire nozzle forming region S30 is likely to rise compared to the temperature at both ends. Therefore, for example, warping may occur on the fixing plate 532, and as a result, the printing quality may be reduced.

[0092] In addition, in this embodiment, if Figure 7 As shown, the second overlapping region A2 is the overlapping region A disposed closest to the end in the Y1 direction among the plurality of overlapping regions A. In this case, by making the second overlapping region A2 larger than the first overlapping region A1, the temperature difference in the entire nozzle forming region S30 is significantly reduced.

[0093] The first overlapping region A1 is the overlapping region A closest to the center position O1 in the Y1 direction among the plurality of overlapping regions A. In this case, by making the second overlapping region A2 larger than the first overlapping region A1, the effect of reducing the temperature difference in the entire nozzle forming region S30 is significantly exerted.

[0094] In particular, in the present embodiment, the second overlapping region A2 is the overlapping region A disposed closest to the end in the Y1 direction among the plurality of overlapping regions A, and the first overlapping region A1 is the overlapping region A closest to the center position O1 in the Y1 direction among the plurality of overlapping regions A. By configuring the first overlapping region A1 and the second overlapping region A2 as described above, the effect of reducing the temperature difference in the entire nozzle forming region S30 is significantly exerted.

[0095] In addition, it is preferred that in the Y1 direction, the size of the second overlapping area A2, i.e., the length in the direction along the Y axis, is at least twice the average size of the plurality of overlapping areas A, i.e., the length in the direction along the Y axis. If the size of the second overlapping area A2 is less than twice the average size of the plurality of overlapping areas A, the effect of reducing the temperature difference in the entire nozzle forming area S30 is weakened compared to a case where the size is at least twice.

[0096] From another point of view, it is preferred that the number of nozzles belonging to the second overlapping area A2 is more than twice the average number of nozzles belonging to the plurality of overlapping areas A. For example, consider the case where the number of nozzles in the first overlapping area A1, the fourth overlapping area A4, the fifth overlapping area A5, and the sixth overlapping area A6 is 9, and the number of nozzles in the second overlapping area A2 and the third overlapping area A3 is 64. In this case, the average number of nozzles belonging to the plurality of overlapping areas A is about 27. Therefore, twice the average is about 54. By making the number of nozzles belonging to the second overlapping area A2 more than twice the average number of nozzles, the second overlapping area A2, which is arranged on the side of the head chip 3 that is easy to dissipate heat, can be set to a region with a larger overlap amount that is easy to become high temperature compared to a case where the number is less than twice. Therefore, it is easy to reduce the temperature difference within the entire nozzle forming area S30.

[0097] In addition, the size of the second overlapping region A2 may be smaller than twice the average size of the plurality of overlapping regions A. In addition, the number of nozzles belonging to the second overlapping region A2 may be smaller than twice the average number of nozzles belonging to the plurality of overlapping regions A.

[0098] Preferably, in the Y1 direction, the size of the first overlapping region A1 is less than half the average size of the plurality of overlapping regions A. By making the size of the first overlapping region A1 less than half the average size of the plurality of overlapping regions A, it is easier to achieve a longer line head than when the size exceeds half.

[0099] From another point of view, it is preferable that the number of nozzles belonging to the first overlap area A1 is less than half the average number of nozzles belonging to the plurality of overlap areas A. For example, consider the following case, that is, the number of nozzles in the first overlap area A1, the fourth overlap area A4, the fifth overlap area A5, and the sixth overlap area A6 is 9, and the number of nozzles in the second overlap area A2 and the third overlap area A3 is 64. In this case, the average number of nozzles belonging to the plurality of overlap areas A is about 27. Therefore, half of the average is about 14. By making the number of nozzles belonging to the first overlap area A1 less than half the average number of nozzles belonging to the plurality of overlap areas A, it is easier to achieve a longer line head than in the case where the number of nozzles exceeds half.

[0100] In particular, it is preferred that, in the Y1 direction, the size of the second overlapping area A2 is more than twice the average size of the plurality of overlapping areas A, and, in the Y1 direction, the size of the first overlapping area A1 is less than half the average size of the plurality of overlapping areas A. By satisfying these relationships, it is easier to exert the effect produced by the second overlapping area A2 being larger than the first overlapping area A1 than in the case where these relationships are not satisfied. Therefore, it is possible to achieve uniformity of temperature in all nozzle forming areas S30, and to suppress the occurrence of warping of components of the liquid ejecting head 30. In addition, the liquid ejecting head 30 can be appropriately used as a line head.

[0101] In addition, the size of the first overlapping region A1 may exceed half the average size of the plurality of overlapping regions A. In addition, the number of nozzles belonging to the first overlapping region A1 may exceed half the average number of nozzles belonging to the plurality of overlapping regions A.

[0102] Preferably, in the Y1 direction, the size of the second overlapping area A2 is more than 5 times the size of the first overlapping area A1. If the size of the second overlapping area A2 is more than 5 times the size of the first overlapping area A1, the temperature difference near the center position O1 and near the end of the entire nozzle forming area S30 can be appropriately reduced compared to the case where it is less than 5 times. Therefore, it is possible to suppress the situation where the parts of the liquid injection head 30 are warped due to a part of the entire nozzle forming area S30 becoming high temperature. The size of the second overlapping area A2 can also be more than 7 times the size of the first overlapping area A1. In addition, the size of the second overlapping area A2 can also be less than 5 times the size of the first overlapping area A1.

[0103] In addition, the plurality of overlapping regions A include a third overlapping region A3 in addition to the second overlapping region A2. Furthermore, in the Y1 direction, the size of the second overlapping region A2 is substantially the same as the size of the third overlapping region A3. By providing the third overlapping region A3, the heat generated at both ends of the entire nozzle forming region S30 can be evenly dispersed.

[0104] In addition, the so-called substantially the same size means that the difference between the two is less than 1% when the size of the nozzle formation area of ​​one head chip in the first direction is set to 100%. For the so-called substantially the same size, for example, the so-called substantially the same size means that when the number of nozzles included in the nozzle formation area S3 of one head chip 3 in the first direction is 400 nozzles, it is 1% thereof, that is, less than four nozzles.

[0105] In addition, the plurality of overlapping regions A include a fourth overlapping region A4. In the Y1 direction, the size of the fourth overlapping region A4 is substantially the same as that of the first overlapping region A1. By providing the fourth overlapping region A4, the temperature distribution of the center position O1 near the center position O1 is uniformed. Therefore, the thermal imbalance of the center position O1 in the entire nozzle forming region S30 is reduced.

[0106] In the Y1 direction, the total size of the plurality of overlapping regions A is smaller than the size of the nozzle forming region S3 of one head chip 3. By making the total size smaller than the size of the nozzle forming region S3, it is possible to avoid the situation where the number of nozzles included in the overlapping region A is too large compared to the case where the total size is larger, and the liquid jet head 30 can be appropriately used as a line head. In addition, the total size may also be larger than the size of one nozzle forming region S3.

[0107] Fig. 9 2 is a diagram showing the number of overlaps of nozzles that eject ink droplets in the first overlap area A1. Fig.10, which is a graph showing the number of overlaps of nozzles for ejecting ink droplets in the second overlap region A2. Fig. 9 as well as Fig.10 , the nozzle array La included in each head chip 3 is representatively shown.

[0108] The number of nozzles is different between the first overlapping area A1 and the second overlapping area A2. However, the overlapping number of nozzles used for ejecting ink droplets may be set equal.

[0109] exist Fig. 9 In the example shown, seven nozzles in the nozzle array La of the head chip 3-4 belong to the first overlapping area A1, and seven nozzles in the nozzle array La of the head chip 3-5 belong to the first overlapping area A1. Three nozzles N9 and two nozzles N8 of the seven nozzles N are nozzles N used for ejecting ink droplets. In the first overlapping area A1, the three nozzles N9 of the head chip 3-4 and the three nozzles N9 of the head chip 3-5 overlap when viewed in the X1 direction.

[0110] Therefore, the number of nozzles belonging to the first overlapping area A1 is 7 in one nozzle row La. On the other hand, in the first overlapping area A1, the number of nozzles used for ejecting ink droplets is 3 in one nozzle row La.

[0111] exist Fig.10 In the example shown, 17 nozzles in the nozzle array La of the head chip 3-6 belong to the second overlapping area A2, and 17 nozzles in the nozzle array La of the head chip 3-7 belong to the second overlapping area A2. Three nozzles N9 and seven nozzles N8 among the 17 nozzles N are nozzles N used for ejecting ink droplets. In the second overlapping area A2, the three nozzles N9 of the head chip 3-6 and the three nozzles N9 of the head chip 3-7 overlap when viewed in the X1 direction.

[0112] Therefore, the number of nozzles belonging to the second overlapping area A2 in one nozzle row La is 17. On the other hand, in the second overlapping area A2, the overlapping number of nozzles used for ejecting ink droplets in one nozzle row La is three.

[0113] In the first overlapping area A1 and the second overlapping area A2, the overlapping numbers of the nozzles used for ejecting ink droplets are the same. By setting the overlapping numbers involved to be equal in each overlapping area A, even when the second overlapping area A2 is larger than the first overlapping area A1 in the Y1 direction, the difference in the overlapping state of ink droplets ejected between the head chips 3 can be reduced.

[0114] 2. Modifications

[0115] The above-described various embodiments can be modified in various ways. Specific modified embodiments that can be applied to the above-described various embodiments are illustrated below. Two or more embodiments arbitrarily selected from the following examples can be appropriately combined within the scope of non-contradiction.

[0116] 2-1. First Modification

[0117] Fig.11 FIG. 2 is a bottom view of a liquid ejecting head 30A according to a first modified example. Fig.11 In the liquid jet head 30A of the first variant shown, in the Y1 direction, the size of the fifth overlapping area A5 is larger than the first overlapping area A1 and smaller than the second overlapping area A2. That is, the sizes of the first overlapping area A1, the fifth overlapping area A5, and the second overlapping area A2 increase in sequence. Therefore, the size of the overlapping area A gradually increases in the Y1 direction toward the end of the entire nozzle forming area S30. According to the variant involved, compared with the aforementioned embodiment, the portion of the overlapping area A in the head chip 3 that is prone to high temperature is dispersed in stages. Therefore, the thermal imbalance in the entire nozzle forming area S30 can be further reduced. In addition, the same is true for the third overlapping area A3, the fourth overlapping area A4, and the sixth overlapping area A6. In the Y1 direction, the sixth overlapping area A6 is smaller than the third overlapping area A3 and larger than the fourth overlapping area A4.

[0118] 2-2. Second Modification

[0119] Fig.12 2 is a bottom view of a liquid ejecting head 30B according to a second modification. Fig.12 The liquid ejecting head 30B of the second modified example shown in FIG. 1 has six head chips 3. The number of head chips 3 of the liquid ejecting head 30B is an even number. Fig.12 In the example of , the head chip 3-1 is omitted. Fig.12 In the example of FIG. 1 , the third overlapping area A3 is an overlapping area A where a portion of the nozzle forming area S3 of the head chip 3-2 overlaps a portion of the nozzle forming area S3 of the head chip 3-3 when viewed in the X1 direction. In addition, the center position O1 is located in the first overlapping area A1 in the Y1 direction. Even according to the modification example involved, the thermal imbalance in the entire nozzle forming area S30 can be reduced.

[0120] 2-3. Other Modifications

[0121] Although the head chip 3 is not configured to circulate ink, the head chip 3 may be a circulation type head having a so-called circulation flow path.

[0122] In addition to equipment dedicated to printing, "liquid ejection devices" can also be used in various devices such as fax machines and copiers. The use of liquid ejection devices is not limited to printing. For example, a liquid ejection device that ejects a solution of a color material can be used as a manufacturing device for forming a color filter of a display device such as a liquid crystal display panel. In addition, a liquid ejection device that ejects a solution of a conductive material can be used as a manufacturing device for forming wiring or electrodes of a wiring substrate. In addition, a liquid ejection device that ejects a solution of an organic substance related to a living body can be used as a manufacturing device for manufacturing a biochip, for example.

[0123] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the aforementioned embodiments. In addition, the configuration of each part of the present invention can be replaced with an arbitrary configuration that exhibits the same functions as the aforementioned embodiments, and an arbitrary configuration can be added.

[0124] Explanation of symbols

[0125] 3…head chip, 30…liquid ejection head, 34…driving element, 37…nozzle plate, 40…wiring substrate, 41…driving IC, 100…liquid ejection device, 312…narrowing portion, 314…connecting flow channel, 320…wall surface, A…overlapping area, A1…first overlapping area, A2…second overlapping area, A3…third overlapping area, A4…fourth overlapping area, A5…fifth overlapping area, A6…sixth overlapping area, B…non-overlapping area, L…nozzle array, M…medium, N…nozzle, O1…center position, S3…nozzle forming area, S30…all nozzle forming areas.

Claims

1. A liquid ejecting head, characterized in that: have: A plurality of head chips, which are five or more and are arranged in a staggered manner along a first direction; a supporting member for supporting the plurality of head chips, The plurality of head chips are arranged to have an overlapping region in which a portion of a nozzle forming region of one of the adjacent head chips overlaps a portion of a nozzle forming region of another head chip when viewed in a second direction orthogonal to the first direction. The plurality of overlapping regions include a first overlapping region and a second overlapping region, the second overlapping region being farther in the first direction than the first overlapping region with respect to a center position in the first direction of all nozzle forming regions formed by all nozzle forming regions of the plurality of head chips, In the first direction, the second overlapping area is larger than the first overlapping area.

2. The liquid ejecting head according to claim 1, wherein: The second overlapping region is an overlapping region disposed closest to an end portion among the plurality of overlapping regions in the first direction.

3. The liquid ejecting head according to claim 1, wherein: The first overlapping region is, in the first direction, an overlapping region that is closest to the center position among the plurality of overlapping regions.

4. The liquid ejecting head according to claim 1, wherein: The first overlapping region is, in the first direction, an overlapping region of the plurality of overlapping regions that is closest to the center position. The second overlapping region is an overlapping region disposed closest to an end portion among the plurality of overlapping regions in the first direction.

5. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the second overlapping area is more than twice the average size of the plurality of overlapping areas.

6. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the first overlapping area is less than half of an average size of the plurality of overlapping areas.

7. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the second overlapping area is more than twice the average size of the plurality of overlapping areas, In the first direction, the size of the first overlapping area is less than half of an average size of the plurality of overlapping areas.

8. The liquid ejecting head according to claim 1, wherein: In the first direction, the size of the second overlapping area is more than 5 times the size of the first overlapping area.

9. The liquid ejecting head according to claim 1, wherein: The plurality of head chips respectively have a driving IC connected to a driving element for ejecting liquid.

10. The liquid ejecting head according to claim 2, wherein: The plurality of overlapping regions include a third overlapping region different from the second overlapping region, The third overlapping region is an overlapping region disposed closest to the end of the plurality of overlapping regions in the first direction. In the first direction, the size of the second overlapping area is substantially the same as that of the third overlapping area.

11. The liquid ejecting head according to claim 3, wherein: The plurality of overlapping regions include a fourth overlapping region different from the first overlapping region, The fourth overlapping region is an overlapping region other than the overlapping regions arranged at both ends among the plurality of overlapping regions in the first direction. In the first direction, a size of the fourth overlapping area is substantially the same as a size of the first overlapping area.

12. The liquid ejecting head according to claim 1, wherein The plurality of overlapping regions include a fifth overlapping region arranged between the first overlapping region and the second overlapping region in the first direction, In the first direction, the size of the fifth overlapping area is larger than that of the first overlapping area, and smaller than that of the second overlapping area.

13. The liquid ejecting head according to claim 1, wherein: In the first direction, a total size of the plurality of overlapping regions is smaller than a size of the nozzle forming region of the head chip.

14. A liquid ejection device, characterized in that: have: A liquid ejecting head according to any one of claims 1 to 13 for ejecting liquid onto a medium; A conveying unit conveys the medium.

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