A UV heat dual curing screen adhesive

Abstract

The invention discloses a UV heat dual-curing screen adhesive, which is composed of the following materials in proportion by weight: 25-40 parts of carboxylated hydrogenated epoxy acrylate UV resin; 0-30 parts of carboxylated bisphenol S epoxy acrylate; 15-30 parts of alicyclic epoxy-vinyl bifunctional resin; 0-50 parts of hyperbranched structure-containing S polyester acrylate; 1-10 parts of photoinitiator; 0.5-5 parts of auxiliary agent. The adhesive of the present invention is cross-linked by UV ultraviolet radiation, and the part of the shadow area that is not exposed to ultraviolet light is heated and cured, which can effectively bond components, and its viscosity is 20000-30000mpa.s. After UV irradiation, it is assisted by thermal curing at 150℃ for 1-2h, which can achieve complete bonding, and the bonding strength of the glass screen is ≥10MPa, and the refractive index is ≥1.6. It effectively solves the problem that in the bonding process of electronic screens and components, due to its irregular shape, some local areas are shadow areas and cannot effectively receive ultraviolet rays, resulting in the inability of traditional UV adhesives to achieve curing, and has a good market prospect.

Description

Technical Field

[0001] The invention relates to the technical field of adhesives, in particular to a UV heat dual-curing screen adhesive. Background Art

[0002] With the continuous development of science and technology, especially artificial intelligence, the application scenarios of electronic screens are increasing, and the requirements for the bonding of electronic screens and components are also increasing. With the continuous enhancement of environmental awareness in the whole society, the adhesives used for bonding these electronic screens and components have gradually abandoned traditional solvent-based adhesives. UV light curing technology has gradually become the mainstream trend in the industry due to its green and environmental protection, solvent-free, no VOC emissions, high curing efficiency, low energy consumption, and high production efficiency.

[0003] Deficiencies of existing technology: Traditional moisture-curing polyurethane hot melt adhesives have the following disadvantages during use: However, during the bonding process of electronic screens and components, due to their irregular shapes, some local areas are shadow areas that cannot effectively receive ultraviolet rays, resulting in the inability of traditional UV glue to cure. Summary of the invention

[0004] The purpose of the present invention is to provide a UV heat dual curing screen adhesive to solve the problems raised in the above background technology.

[0005] A UV heat dual curing screen adhesive, composed of the following materials in proportion by weight: 25-40 parts of carboxylated hydrogenated epoxy acrylate UV resin; Carboxylated bisphenol S epoxy acrylate 0-30 parts; 15 to 30 parts of alicyclic epoxy-vinyl bifunctional resin; The hyperbranched structure contains 0 to 50 parts of S polyester acrylate; 1-10 parts of photoinitiator; The auxiliary agent is 0.5-5 parts, and the carboxylated hydrogenated epoxy acrylate UV resin is prepared in the following manner: Carboxyl acrylate monomer and hydrogenated epoxy resin are subjected to a ring-opening reaction to obtain epoxy acrylate, and the obtained epoxy acrylate is further subjected to a ring-opening reaction with an acid anhydride to obtain a carboxyl hydrogenated epoxy acrylate UV resin; The carboxylated bisphenol S epoxy acrylate has a molecular weight of 2000 to 6000 g / mol, an acid value of 40 to 100 mgKOH / g, and a refractive index of 1.61 to 1.7. The carboxylated bisphenol S epoxy acrylate is prepared by the following method: Carboxyl acrylate monomer is subjected to a ring-opening reaction with bisphenol S epoxy resin to obtain epoxy acrylate, and the prepared epoxy acrylate is further subjected to a ring-opening reaction with an acid anhydride to obtain carboxylated bisphenol S epoxy acrylate.

[0006] As a further improvement of the present invention, the carboxyl acrylate monomer is prepared by ring-opening reaction of hydroxyethyl (propyl) (meth)acrylate and acid anhydride, the hydroxyethyl (propyl) (meth)acrylate includes any one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate, and the acid anhydride includes any one or more of maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, glutaric anhydride, methylhexahydrophthalic anhydride and succinic anhydride.

[0007] As a further improvement of the present invention, the epoxy equivalent of the hydrogenated epoxy resin is 180-250 g / Eq, the epoxy equivalent of the bisphenol S epoxy resin is 160-350 g / mol, and the softening point is 60-180°C.

[0008] As a further improvement of the present invention, the alicyclic epoxy-vinyl bifunctional resin is prepared from a polyacrylic resin, an alicyclic epoxy monomer and glycidyl methacrylate, wherein the alicyclic epoxy monomer includes any one or more of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate and bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate.

[0009] As a further improvement of the present invention, the hyperbranched structure S-containing polyester acrylate has a room temperature viscosity of 500-800 mpa.s (25°C), an acid value of 2-10 mgKOH / g, a functionality of 6-12, a molecular weight of 6000-10000 g / mol, and a refractive index of 1.61-1.7. The molecular weight can be expressed in terms of molar mass.

[0010] As a further improvement of the present invention, the photoinitiator includes any one or more of an acylphosphine oxide photoinitiator, an acetophenone photoinitiator, a thioxanthone photoinitiator, a benzophenone photoinitiator, an aminoacetophenone photoinitiator, a tertiary amine photoinitiator, a benzoin photoinitiator, anthraquinone photoinitiator, a diphenyltitanium cyclopentane photoinitiator, an acridine photoinitiator, and a triarylimidazole dimer photoinitiator.

[0011] As a further improvement of the present invention, the acylphosphine oxide photoinitiator includes any one or more of acylphosphine oxide photoinitiators such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphonate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, acylphosphine oxide, trimethylbenzoyl diethyl phosphate, trimethylbenzoyldiphenylphosphine oxide, and bisbenzoylphenylphosphine oxide; The acetophenone photoinitiator includes any one or more of acetophenone photoinitiators such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; The thioxanthone photoinitiator includes any one or more of thioxanthone photoinitiators such as 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, and 2-isopropylthioxanthone; The benzophenone photoinitiator includes any one or more of benzophenone photoinitiators such as benzophenone, 4-methylbenzophenone, 4,4-bis(diethylamino)benzophenone (Michler's ketone), and 4,4-bis(dimethylamino)benzophenone; The aminoacetophenone photoinitiator includes any one or more of aminoacetophenone photoinitiators such as 2-hydroxy-2-methyl-1-phenylpropanone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and N,N-dimethylaminoacetophenone; The tertiary amine photoinitiator includes any one or more of tertiary amine photoinitiators such as triethylamine, triethanolamine, and camphorquinone; The benzoin photoinitiator includes any one or more of benzoin, benzoin methyl ether, benzoin dimethyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin n-butyl ether, benzoin alkyl ether, etc.; The anthraquinone photoinitiator includes any one or more of anthraquinone photoinitiators such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, and 1-chloroanthraquinone; The diphenyl titanocene photoinitiator includes any one or more of diphenyl titanocene photoinitiators such as fluorinated diphenyl titanocene and bis(pentafluorophenyl) titanocene; The acridine photoinitiator includes any one or more of acridine photoinitiators such as 9-phenylacridine and 1,7-bis(9-acridinyl)heptane; The triaryl imidazole dimer photoinitiator includes any one or more of triaryl imidazole dimer photoinitiators such as 2,2,4,4-tetrakis(2-chlorophenyl)-5,5-di(3,4-dimethoxyphenyl)diimidazole and 2,2,5-tris(2-chlorophenyl)-4-(3,4-dimethylphenyl)-4,5-diphenyldiimidazole.

[0012] As a further improvement of the present invention, the auxiliary agent includes any one or more of a stabilizer, a leveling agent, a defoamer, an anti-cratering agent, an adhesion promoter, a surface lubricant, an anti-sagging agent, and an inhibitor; The stabilizer may be N′, N-diphenyl-p-phenylenediamine; The leveling agent may be BYK-330 leveling agent; The defoamer may be BYK-333; The anti-cratering agent may be BYK-345; The adhesion promoter may be a conventional phosphate ester; The surface lubricant may be RS-72A; The anti-sagging agent may be BYK-336; The polymerization inhibitor may be p-hydroxyanisole.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The carboxylated hydrogenated epoxy acrylate UV resin in the present invention provides carboxyl heat-curing cross-linking points and vinyl UV-curing cross-linking points for the glue, and at the same time improves the hardness, strength, boiling resistance and temperature resistance of the glue; Carboxylated bisphenol S epoxy acrylate provides carboxyl heat-curing cross-linking points and vinyl UV-curing cross-linking points for the glue, while providing high refractive index and strength, boiling resistance and temperature resistance; The alicyclic epoxy-vinyl bifunctional resin provides the adhesive with epoxy group heat-curing cross-linking points and vinyl UV-curing cross-linking points, while providing good weather resistance and temperature resistance; Hyperbranched S-containing polyester acrylate has the characteristics of low viscosity and high functionality, providing the adhesive with high refractive index, faster curing speed and convenient construction with low viscosity. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] The present invention provides the following technical solution: a UV thermal dual-curing screen adhesive, which is composed of the following materials in proportion by weight: 30 parts of carboxylated hydrogenated epoxy acrylate UV resin; 15 parts of carboxylated bisphenol S epoxy acrylate; 25 parts of alicyclic epoxy-vinyl bifunctional resin; 37 parts of hyperbranched structure S-containing polyester acrylate; 8 parts of photoinitiator; and 3.6 parts of auxiliary agent.

[0016] The carboxylated hydrogenated epoxy acrylate UV resin is prepared by the following method: a carboxylated acrylate monomer is subjected to a ring-opening reaction with a hydrogenated epoxy resin to obtain epoxy acrylate, and the prepared epoxy acrylate is subjected to a ring-opening reaction with an acid anhydride to obtain a carboxylated hydrogenated epoxy acrylate UV resin, wherein the carboxylated bisphenol S epoxy acrylate has a molecular weight of 2000 to 6000 g / mol, an acid value of 40 to 100 mgKOH / g, and a refractive index of 1.61 to 1.7.

[0017] The carboxylated bisphenol S epoxy acrylate is prepared by the following method: a carboxylated acrylate monomer is subjected to a ring-opening reaction with a bisphenol S epoxy resin to obtain epoxy acrylate, and the prepared epoxy acrylate is subjected to a ring-opening reaction with an acid anhydride to obtain the carboxylated bisphenol S epoxy acrylate.

[0018] The carboxyl acrylate monomer is prepared by ring-opening reaction of hydroxyethyl (propyl) (meth)acrylate and acid anhydride. Hydroxyethyl (propyl) (meth)acrylate includes any one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate. The acid anhydride includes any one or more of maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, glutaric anhydride, methylhexahydrophthalic anhydride and succinic anhydride.

[0019] The epoxy equivalent of hydrogenated epoxy resin is 180-250 g / Eq, the epoxy equivalent of bisphenol S epoxy resin is 160-350 g / mol, and the softening point is 60-180°C.

[0020] The alicyclic epoxy-vinyl bifunctional resin is prepared from polyacrylic resin, alicyclic epoxy monomer and glycidyl methacrylate, wherein the alicyclic epoxy monomer includes any one or more of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate and bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate.

[0021] The hyperbranched structure S-containing polyester acrylate has a room temperature viscosity of 500-800 mpa.s (25°C), an acid value of 2-10 mgKOH / g, a functionality of 6-12, a molecular weight of 6000-10000 g / mol, and a refractive index of 1.61-1.7. The molecular weight can be expressed in terms of molar mass.

[0022] The photoinitiator includes any one or more of acylphosphine oxide photoinitiators, acetophenone photoinitiators, thioxanthone photoinitiators, benzophenone photoinitiators, aminoacetophenone photoinitiators, tertiary amine photoinitiators, benzoin photoinitiators, anthraquinone photoinitiators, diphenyltitanocene photoinitiators, acridine photoinitiators, and triarylimidazole dimer photoinitiators.

[0023] The acylphosphine oxide photoinitiator includes any one or more of acylphosphine oxide photoinitiators such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphonate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, acylphosphine oxide, trimethylbenzoyl diethyl phosphate, trimethylbenzoyldiphenylphosphine oxide, and bisbenzoylphenylphosphine oxide; The acetophenone photoinitiator includes any one or more of acetophenone photoinitiators such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; The thioxanthone photoinitiator includes any one or more of thioxanthone photoinitiators such as 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, and 2-isopropylthioxanthone; Benzophenone photoinitiators include any one or more of benzophenone photoinitiators such as benzophenone, 4-methylbenzophenone, 4,4-bis(diethylamino)benzophenone (Michler's ketone), and 4,4-bis(dimethylamino)benzophenone; The aminoacetophenone photoinitiator includes any one or more of the aminoacetophenone photoinitiators such as 2-hydroxy-2-methyl-1-phenylpropanone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and N,N-dimethylaminoacetophenone; The tertiary amine photoinitiator includes any one or more of tertiary amine photoinitiators such as triethylamine, triethanolamine, and camphorquinone; The benzoin photoinitiator includes any one or more of benzoin, benzoin methyl ether, benzoin dimethyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin n-butyl ether, benzoin alkyl ether, etc.; The anthraquinone photoinitiator includes any one or more of anthraquinone photoinitiators such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, and 1-chloroanthraquinone; The diphenyl titanocene photoinitiator includes any one or more of diphenyl titanocene photoinitiators such as fluorinated diphenyl titanocene and bis(pentafluorophenyl) titanocene; The acridine photoinitiator includes any one or more of 9-phenylacridine, 1,7-bis(9-acridinyl)heptane and the like; The triaryl imidazole dimer photoinitiator includes any one or more of the triaryl imidazole dimer photoinitiators such as 2,2,4,4-tetrakis(2-chlorophenyl)-5,5-di(3,4-dimethoxyphenyl)diimidazole and 2,2,5-tris(2-chlorophenyl)-4-(3,4-dimethylphenyl)-4,5-diphenyldiimidazole.

[0024] As a further improvement of the present invention, the additives include any one or more of stabilizers, leveling agents, defoamers, anti-cratering agents, adhesion promoters, surface lubricants, anti-sagging agents, and inhibitors; Wherein: the stabilizer can be N', N-diphenyl-p-phenylenediamine; the leveling agent is BYK-330 leveling agent; the defoaming agent is BYK-333; the anti-cratering agent is BYK-345; the adhesion promoter can be a conventional phosphate ester; the surface slip agent is RS-72A; the anti-sagging agent is BYK-336; and the inhibitor is p-hydroxyanisole.

[0025] The adhesive liquid of the adhesive in this embodiment and the existing adhesive were selected and divided into 50 parts, named A group and B group, and the bonding strength was tested (the bonding objects were glass and glass), and the following table was obtained: Table 1 As shown in Table 1, the crosslinking is first performed by UV ultraviolet radiation, and the shadow area that is not exposed to ultraviolet light is heated and cured, which can effectively bond the components, and the refractive index reaches above 1.6. The carboxylated hydrogenated epoxy acrylate UV resin of the present invention provides carboxyl heat-curing crosslinking points and vinyl UV-curing crosslinking points for the glue, and at the same time improves the hardness, strength, boiling resistance and temperature resistance of the glue. The carboxylated bisphenol S epoxy acrylate provides carboxyl heat-curing crosslinking points and vinyl UV-curing crosslinking points for the glue, and at the same time provides high refractive index, strength, boiling resistance and temperature resistance. The alicyclic epoxy-vinyl bifunctional resin provides the glue with epoxy group thermal curing cross-linking points and vinyl UV curing cross-linking points, while providing good weather resistance and temperature resistance. The hyperbranched structure S-containing polyester acrylate has the characteristics of low viscosity and high functionality, providing the glue with high refractive index, faster curing speed and low viscosity for construction convenience. It effectively solves the problem of irregular shape of electronic screens and components, resulting in some local areas being shadow areas that cannot effectively receive ultraviolet rays, resulting in the inability of traditional UV glue to cure. It has good market prospects.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A UV heat dual curing screen adhesive, characterized by: Composed of the following materials by weight: 25-40 parts of carboxylated hydrogenated epoxy acrylate UV resin; Carboxylated bisphenol S epoxy acrylate 0-30 parts; 15 to 30 parts of alicyclic epoxy-vinyl bifunctional resin; The hyperbranched structure contains 0 to 50 parts of S polyester acrylate; 1-10 parts of photoinitiator; The auxiliary agent is 0.5-5 parts, and the carboxylated hydrogenated epoxy acrylate UV resin is prepared in the following manner: Carboxyl acrylate monomer and hydrogenated epoxy resin are subjected to a ring-opening reaction to obtain epoxy acrylate, and the obtained epoxy acrylate is further subjected to a ring-opening reaction with an acid anhydride to obtain a carboxyl hydrogenated epoxy acrylate UV resin; The carboxylated bisphenol S epoxy acrylate has a molecular weight of 2000 to 6000 g / mol, an acid value of 40 to 100 mgKOH / g, and a refractive index of 1.61 to 1.

7. The carboxylated bisphenol S epoxy acrylate is prepared in the following manner: Carboxyl acrylate monomer is subjected to a ring-opening reaction with bisphenol S epoxy resin to obtain epoxy acrylate, and the prepared epoxy acrylate is further subjected to a ring-opening reaction with an acid anhydride to obtain carboxylated bisphenol S epoxy acrylate.

2. The UV heat dual curing screen adhesive according to claim 1, characterized in that: The carboxyl acrylate monomer is prepared by ring-opening reaction of hydroxyethyl (propyl) (meth)acrylate and acid anhydride, wherein the hydroxyethyl (propyl) (meth)acrylate includes any one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate and hydroxypropyl methacrylate, and the acid anhydride includes any one or more of maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, glutaric anhydride, methylhexahydrophthalic anhydride and succinic anhydride.

3. The UV heat dual curing screen adhesive according to claim 2, characterized in that: The epoxy equivalent of the hydrogenated epoxy resin is 180-250 g / Eq, the epoxy equivalent of the bisphenol S epoxy resin is 160-350 g / mol, and the softening point is 60-180°C.

4. The UV heat dual curing screen adhesive according to claim 1, characterized in that: The alicyclic epoxy-vinyl bifunctional resin is prepared from polyacrylic resin, alicyclic epoxy monomer and glycidyl methacrylate, wherein the alicyclic epoxy monomer includes any one or more of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexylcarboxylate and bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate.

5. The UV heat dual curing screen adhesive according to claim 1, characterized in that: The hyperbranched structure S-containing polyester acrylate has a room temperature viscosity of 500-800 mpa.s (25°C), an acid value of 2-10 mgKOH / g, a functionality of 6-12, a molecular weight of 6000-10000 g / mol, and a refractive index of 1.61-1.

7. Molecular weight can be expressed in terms of molar mass.

6. The UV heat dual curing screen adhesive according to claim 1, characterized in that: The photoinitiator includes any one or more of acylphosphine oxide photoinitiators, acetophenone photoinitiators, thioxanthone photoinitiators, benzophenone photoinitiators, aminoacetophenone photoinitiators, tertiary amine photoinitiators, benzoin photoinitiators, anthraquinone photoinitiators, diphenyltitanium cyclopentane photoinitiators, acridine photoinitiators, and triarylimidazole dimer photoinitiators.

7. The UV heat dual curing screen adhesive according to claim 6, characterized in that: The acylphosphine oxide photoinitiator includes any one or more of acylphosphine oxide photoinitiators such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphonate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, acylphosphine oxide, trimethylbenzoyl diethyl phosphate, trimethylbenzoyldiphenylphosphine oxide, and bisbenzoylphenylphosphine oxide; The acetophenone photoinitiator includes any one or more of acetophenone photoinitiators such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; The thioxanthone photoinitiator includes any one or more of thioxanthone photoinitiators such as 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, and 2-isopropylthioxanthone; The benzophenone photoinitiator includes any one or more of benzophenone photoinitiators such as benzophenone, 4-methylbenzophenone, 4,4-bis(diethylamino)benzophenone (Michler's ketone), and 4,4-bis(dimethylamino)benzophenone; The aminoacetophenone photoinitiator includes any one or more of aminoacetophenone photoinitiators such as 2-hydroxy-2-methyl-1-phenylpropanone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, and N,N-dimethylaminoacetophenone; The tertiary amine photoinitiator includes any one or more of tertiary amine photoinitiators such as triethylamine, triethanolamine, and camphorquinone; The benzoin photoinitiator includes any one or more of benzoin, benzoin methyl ether, benzoin dimethyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin n-butyl ether, benzoin alkyl ether, etc.; The anthraquinone photoinitiator includes any one or more of anthraquinone photoinitiators such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, and 1-chloroanthraquinone; The diphenyl titanocene photoinitiator includes any one or more of diphenyl titanocene photoinitiators such as fluorinated diphenyl titanocene and bis(pentafluorophenyl) titanocene; The acridine photoinitiator includes any one or more of acridine photoinitiators such as 9-phenylacridine and 1,7-bis(9-acridinyl)heptane; The triaryl imidazole dimer photoinitiator includes any one or more of triaryl imidazole dimer photoinitiators such as 2,2,4,4-tetrakis(2-chlorophenyl)-5,5-di(3,4-dimethoxyphenyl)diimidazole and 2,2,5-tris(2-chlorophenyl)-4-(3,4-dimethylphenyl)-4,5-diphenyldiimidazole.

8. The UV heat dual curing screen adhesive according to claim 1, characterized in that: The auxiliary agent includes any one or more of a stabilizer, a leveling agent, a defoamer, an anti-cratering agent, an adhesion promoter, a surface lubricant, an anti-sagging agent, and an inhibitor; The stabilizer may be N′, N-diphenyl-p-phenylenediamine; The leveling agent may be BYK-330 leveling agent; The defoamer may be BYK-333; The anti-cratering agent may be BYK-345; The adhesion promoter may be a conventional phosphate ester; The surface lubricant may be RS-72A; The anti-sagging agent may be BYK-336; The polymerization inhibitor may be p-hydroxyanisole.

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