Monitoring method and device for voltage rising and falling inductance testing device and storage medium

Abstract

The invention relates to the field of equipment monitoring, and discloses a monitoring method and equipment of voltage rising and falling inductance test equipment and a storage medium. The method comprises the following steps: receiving a temperature protection threshold value and an environment temperature threshold value set by a user; periodically receiving an environment temperature value of the temperature sensor; whether the environment temperature value is smaller than the environment temperature threshold value or not is judged; when the ambient temperature is smaller than the ambient temperature threshold value, driving information is sent to the Buck-Boost inductance module so as to drive the boost-buck inductance test equipment; recording the operation working temperature of the voltage rising and falling inductance test equipment; whether the operation working temperature is larger than the temperature protection threshold value or not is judged; when the temperature protection threshold value is exceeded, an abnormal shutdown instruction is sent to the boost-buck inductance test equipment; and when the temperature does not exceed the temperature protection threshold value, determining that the voltage rising and falling inductance test equipment meets the monitoring requirement. In the embodiment of the invention, the temperature sensor and the Buck-Boost inductance module are arranged to monitor the environment temperature and the equipment temperature, so that the temperature of the boost-buck inductance test equipment can be monitored by the boost-buck inductance test equipment.

Description

Technical Field

[0001] The present invention relates to the field of equipment monitoring, and in particular to a monitoring method, equipment and storage medium for a buck-boost inductor testing device. Background Art

[0002] Buck-Boost Inductor Test EquipmentA device that contains a Buck-Boost inductor is a DC-DC converter that converts an input voltage to an output voltage and can achieve both a step-up and step-down function. During the operation of a Buck-Boost inductor device, temperature has a significant impact on its performance and life. The inductor generates power losses when current flows through it. This part of the loss is caused by the DC resistance of the inductor, and the power loss causes the internal temperature of the inductor to rise. Excessive temperature may reduce the insulation of the coil, resulting in more core losses, which affects the performance and life of the inductor. The ripple current in the capacitor causes power losses, which causes the internal temperature of the capacitor to rise. Excessive temperature can severely shorten the expected life of the capacitor. Capacitors have a rated ripple current that depends on the ambient temperature, and this rating should not be exceeded.

[0003] Buck-Boost inductor equipment is widely used at present, but because the Buck-Boost inductor equipment works for a long time in a high temperature environment, the equipment system cannot monitor the over-temperature state of the Buck-Boost inductor test equipment itself. Therefore, in order to solve the problem that the Buck-Boost inductor test equipment cannot monitor its own temperature state and causes the equipment to overheat, a new technology is needed to solve the current problem. Summary of the invention

[0004] The main purpose of the present invention is to solve the technical problem that a buck-boost inductor testing device cannot monitor its own temperature state, resulting in an over-temperature condition of the device.

[0005] A first aspect of the present invention provides a monitoring method for a buck-boost inductor test device, wherein the buck-boost inductor test device comprises: a temperature sensor and a Buck-Boost inductor module, wherein the temperature sensor and the Buck-Boost inductor module are electrically connected, and the monitoring method for the buck-boost inductor test device comprises:

[0006] Receive the temperature protection threshold and ambient temperature threshold set by the user;

[0007] Regularly receiving the ambient temperature value of the temperature sensor;

[0008] Determining whether the ambient temperature value is less than the ambient temperature threshold;

[0009] When the temperature is less than the ambient temperature threshold, driving information is sent to the Buck-Boost inductor module to drive the buck-boost inductor test device;

[0010] Recording the operating temperature of the buck-boost inductor test equipment;

[0011] Determining whether the operating temperature is greater than the temperature protection threshold;

[0012] When the temperature exceeds the protection threshold, an abnormal shutdown command is sent to the buck-boost inductor test device;

[0013] When the temperature protection threshold is not exceeded, it is confirmed that the buck-boost inductor test equipment meets the monitoring requirements.

[0014] Optionally, in a first implementation of the first aspect of the present invention, the Buck-Boost inductor module includes: a Buck driving module, a Buck inductor module, a Boost inductor module, and a Boost driving module, one end of the Buck driving module is connected to one end of the Buck inductor module, the other end of the Buck driving module is connected to one end of the Boost driving module, the other end of the Buck inductor module is connected to one end of the Boost inductor module, and the other end of the Boost inductor module is connected to the other end of the Boost driving module, and the sending of driving information to the Buck-Boost inductor module to drive the buck-boost inductor test device includes:

[0015] Sending driving information to the Buck driving module and the Boost driving module, the Buck driving module converts the driving information into a Buck driving signal and transmits it to the Buck inductor module;

[0016] The Buck inductor module converts the Buck driving signal into a Boost driving signal and transmits it to the Boost inductor module;

[0017] The Boost inductor module converts the Boost drive signal into a Boost feedback signal and transmits it to the Boost drive module;

[0018] The Boost driving module converts the Boost feedback signal and the driving information into a Buck adjustment signal and transmits the signal to the Buck driving module;

[0019] The Buck driving module generates a new Buck driving signal based on the Buck adjustment signal and transmits it to the Buck inductor module to achieve driving and adjusting the power of the buck-boost inductor testing device.

[0020] Optionally, in a second implementation of the first aspect of the present invention, the sending driving information to the Buck driving module and the Boost driving module includes:

[0021] Sending the Buck boost value, the first output voltage duty cycle, and the first operating frequency to the Buck driving module;

[0022] The Boost voltage value, the second output voltage duty cycle, and the second operating frequency are sent to the Boost driving module.

[0023] Optionally, in a third implementation of the first aspect of the present invention, the boost-boost inductor test device further includes: a power supply module, the power supply module is connected to the Boost drive module, and the Buck drive module generates a new Buck drive signal based on the Buck adjustment signal and transmits it to the Buck inductor module, including:

[0024] Receiving the Buck adjustment signal and generating a power compensation signal;

[0025] The power compensation signal is sent to the power supply module, and the power supply module transmits a compensation voltage corresponding to the power compensation signal to the Buck drive module based on the power compensation signal;

[0026] The Buck driving module generates a new Buck driving signal based on the compensation voltage and the Buck adjustment signal, and transmits the new Buck driving signal to the Buck inductor module.

[0027] Optionally, in a fourth implementation manner of the first aspect of the present invention, the inductance parameters of the Buck inductor module and the Boost inductor module are the same.

[0028] Optionally, in a fifth implementation of the first aspect of the present invention, recording the operating temperature of the buck-boost inductor testing device includes:

[0029] Collecting the operating temperature of the Buck-Boost inductor module by the temperature sensor;

[0030] The operating temperature of the Buck-Boost inductor module is recorded as the operating temperature of the buck-boost inductor test device.

[0031] Optionally, in a sixth implementation of the first aspect of the present invention, the sending of an abnormal shutdown instruction to the buck-boost inductor testing device includes:

[0032] Send an abnormal shutdown instruction to the Buck-Boost inductor module.

[0033] Optionally, in a seventh implementation of the first aspect of the present invention, the buck-boost inductor testing equipment includes: an air cooling module or a water cooling module, and the Buck-Boost inductor module is connected to the air cooling module or the water cooling module.

[0034] A second aspect of the present invention provides a monitoring device for a buck-boost inductor testing device, comprising: a memory and at least one processor, wherein instructions are stored in the memory, and the memory and the at least one processor are interconnected via lines; the at least one processor calls the instructions in the memory so that the monitoring device for the buck-boost inductor testing device executes the above-mentioned monitoring method for the buck-boost inductor testing device.

[0035] A third aspect of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores instructions, which, when executed on a computer, enable the computer to execute the above-mentioned monitoring method for the buck-boost inductor testing device.

[0036] In the embodiment of the present invention, the temperature sensor collects the internal temperature of the device and the external environment temperature, and first performs a temperature threshold analysis of the external environment temperature to determine whether the environmental state of the buck-boost inductor test device meets the set environmental temperature threshold. When the environmental state of the buck-boost inductor test device meets the device environmental temperature threshold, it is further determined whether the buck-boost inductor test device meets the operating temperature. When the operating temperature and the environmental temperature of the buck-boost inductor test device meet the requirements, it is determined that the buck-boost inductor test device meets the temperature monitoring state, thereby realizing the temperature monitoring of the buck-boost inductor test device itself, and solving the technical problem that the buck-boost inductor test device cannot monitor its own temperature state, resulting in the over-temperature of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of an embodiment of a monitoring method for a buck-boost inductor testing device according to an embodiment of the present invention;

[0038] Figure 2 A schematic diagram of a module configuration embodiment of a buck-boost inductor testing device for a monitoring method of a buck-boost inductor testing device in an embodiment of the present invention;

[0039] Figure 3 A schematic diagram of a specific embodiment of step 104 of the monitoring method of the buck-boost inductor testing device in an embodiment of the present invention;

[0040] Figure 4 A schematic diagram of a specific embodiment of step 1045 of the monitoring method of the buck-boost inductor testing device in an embodiment of the present invention;

[0041] Figure 5Schematic diagram of an embodiment of a monitoring device for a buck-boost inductor testing device in an embodiment of the present invention. DETAILED DESCRIPTION

[0042] The embodiments of the present invention provide a monitoring method, a device and a storage medium for a buck-boost inductor testing device.

[0043] The embodiments disclosed in the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments disclosed in the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments disclosed in the present invention are only for exemplary purposes and are not intended to limit the scope of protection disclosed in the present invention.

[0044] In the description of the embodiments disclosed in the present invention, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may also be included below.

[0045] For ease of understanding, the specific process of the embodiment of the present invention is described below. Figure 1 An embodiment of a monitoring method for a buck-boost inductor test device in an embodiment of the present invention, the buck-boost inductor test device comprises: a temperature sensor and a Buck-Boost inductor module, the temperature sensor and the Buck-Boost inductor module are electrically connected, and the monitoring method for the buck-boost inductor test device comprises:

[0046] 101. Receive a temperature protection threshold and an ambient temperature threshold set by a user;

[0047] In this embodiment, the Buck-Boost circuit is a DC-DC converter that can increase or decrease the input voltage while keeping the output voltage the same polarity as the input voltage. The Buck-Boost circuit controls the output voltage by controlling the switching time of a power switch (such as a MOSFET). When the switch is turned on, energy is added to the inductor; when the switch is closed, the inductor transfers the stored energy to the output capacitor and the load. The user can set the ambient temperature threshold of the buck-boost inductor test device before turning on the device, such as 60 degrees. The device can be started below 60 degrees, and the device temperature is continuously monitored. If the device temperature is below 90 degrees, the device is considered to be operating normally. If it exceeds 90 degrees, the buck-boost inductor test device is considered to be in an overheated state and needs to be shut down for physical cooling.

[0048] 102. Regularly receive the ambient temperature value of the temperature sensor;

[0049] In this embodiment, the external environment temperature collected by the temperature sensor is received at a regular interval to obtain the ambient temperature value for monitoring the external environment.

[0050] 103. Determine whether the ambient temperature value is less than the ambient temperature threshold;

[0051] In this embodiment, the collected external ambient temperature value is 40 degrees, and it is determined that the ambient temperature value of 40 degrees is less than the ambient temperature threshold of 60 degrees, and it is considered that the ambient temperature meets the device startup standard.

[0052] 104. When the temperature is less than the ambient temperature threshold, drive information is sent to the Buck-Boost inductor module to drive the buck-boost inductor test device;

[0053] In this example, see Figure 2 , Figure 2 This is a schematic diagram of a module configuration embodiment of a buck-boost inductor test device of a monitoring method for a buck-boost inductor test device in an embodiment of the present invention. The execution subject of this method is Figure 2 The main control module 207 is connected to the temperature sensor 201 and the Buck-Boost inductor module, and the driving information is sent to the Buck-Boost inductor module. The Buck-Boost inductor module drives the cooling system of the buck-boost inductor test equipment to perform cooling processing, thereby achieving the effect of driving the buck-boost inductor test equipment.

[0054] For details, please refer to Figure 3 , Figure 3 The present invention is a schematic diagram of a specific embodiment of step 104 of the monitoring method of the buck-boost inductor test device in the embodiment of the present invention. The Buck-Boost inductor module includes: a Buck driving module 205, a Buck inductor module 202, a Boost inductor module 203, and a Boost driving module 204. One end of the Buck driving module 205 is connected to one end of the Buck inductor module 202, and the other end of the Buck driving module 205 is connected to one end of the Boost driving module 204. The other end of the Buck inductor module 202 is connected to one end of the Boost inductor module 203, and the other end of the Boost inductor module 203 is connected to the other end of the Boost driving module 204. The following specific implementation methods are included in step 104:

[0055] 1041. Send driving information to the Buck driving module and the Boost driving module. The Buck driving module converts the driving information into a Buck driving signal and transmits it to the Buck inductor module.

[0056] 1042. The Buck inductor module converts the Buck driving signal into a Boost driving signal and transmits the signal to the Boost inductor module;

[0057] 1043. The Boost inductor module converts the Boost driving signal into a Boost feedback signal and transmits it to the Boost driving module;

[0058] 1044. The Boost driving module converts the Boost feedback signal and the driving information into a Buck adjustment signal and transmits the signal to the Buck driving module;

[0059] 1045. The Buck driving module generates a new Buck driving signal based on the Buck adjustment signal and transmits the new Buck driving signal to the Buck inductor module, so as to drive and adjust the power of the buck-boost inductor testing device.

[0060] In steps 1041-1045, the communication connection of the main control module 207 is connected to the Buck drive module 205 and the Boost drive module 204. The main control module 207 sends the driving information to the Buck drive module 205 and the Boost drive module 204. The driving information is converted into a Buck drive signal in the Buck drive module 205, and the Buck drive signal is transmitted to the Buck inductor module 202. The Buck inductor module 202 converts the Buck drive signal into a Boost drive signal, and transmits the Boost drive signal to the Boost inductor module 203. When the voltage, frequency and other conditions of the Boost inductor module 203 and the Buck drive module 205 are confirmed to be unchanged, the working current in operation continuously changes the current output according to the alternating current demand, and after N cycles, the test task is completed. During the cycle, the Boost inductor module 203 converts the Boost drive signal into a Boost feedback signal and transmits it to the Boost drive module 204. The Boost drive module 204 converts the Boost feedback signal and the drive information into a Buck adjustment signal and transmits it to the Buck drive module 205. The Buck drive module 205 generates a new Buck drive signal based on the Buck adjustment signal and transmits it to the Buck inductor module 202, thereby driving and adjusting the power of the buck-boost inductor test equipment.

[0061] Specifically, the step 1041 of “sending driving information to the Buck driving module and the Boost driving module” includes the following specific implementations:

[0062] 10411. Sending a Buck boost value, a first output voltage duty cycle, and a first operating frequency to the Buck driving module;

[0063] 10412. Send the Boost voltage value, the second output voltage duty cycle, and the second operating frequency to the Boost driving module.

[0064] In steps 10411-10412, the Buck boost value Vin1, the first operating frequency f1, and the first voltage duty cycle D1 need to be set for the Buck inductor module drive in the Buck driving module 205. The first voltage duty cycle D1 = Buck boost value Vin1 / Buck output voltage Vout, and the Buck output voltage Vout = Buck boost value Vin1 / first voltage duty cycle D1 is derived. In the Buck inductor resistance R1 = 2πf1L1, where L1 is the reactance of the Buck inductor itself.

[0065] When the Buck boost value Vin1, the first operating frequency f1, and the first voltage duty cycle D1 are determined, it can be known that the current I1 of the Buck driving module 205 = (Buck boost value Vin1-Buck output voltage Vout) / inductor resistance R1 = (Vin1-Vin1 / D1) / 2πf1L1, and there is a uniquely determined current.

[0066] In the Boost driving module 205, the Boost boost value Vin2, the second output voltage duty cycle D2, and the second operating frequency f2 need to be set for the Boost inductor drive. The second voltage duty cycle D2 = 1-(Boost boost value Vin2 / Boost output voltage Vout2), and the Boost output voltage Vout2 = Boost boost value Vin2 / (1-second voltage duty cycle D2) is derived. In the Boost inductor resistance R2 = 2πf2L2, where L2 is the reactance of the Boost inductor itself.

[0067] When the Boost voltage value Vin2, the second output voltage duty cycle D2, and the second operating frequency f2 are determined, it can be known that the current I2 of the Boost driving module 204 = (Boost voltage value Vin2-Boost output voltage Vout2) / inductor resistance R2 = (Vin2-Vin2 / D2) / 2πf2L2, and there is a uniquely determined current.

[0068] It is necessary to explain the keyboard description of the buck-boost inductor test equipment:

[0069] Basic parameters: F0-23=2FE-01=0 (for CAN communication).

[0070] The host computer starts the DC power supply and the device keyboard works normally. When the host computer does not control the BUCK:

[0071] 1. First set the output voltage value of the step-down device A5-00 = 350V. (For example, when the bus voltage is 750V, the output voltage is set to 350V)

[0072] 2. Set the carrier frequency of BUCK and BOOST: A1-00 = 10K (if the frequency is set to 11K)

[0073] 3. Start the step-down device BUCK and check the current output voltage value displayed by U0-08. When U0-08 = A5-00, the host computer can be controlled to start the step-up device BOOST for testing.

[0074] 4. Control the host computer to start the boost equipment test.

[0075] When the host computer controls the BUCK: just follow the computer operation process to perform the corresponding actions.

[0076] Parameter data query: query BUCK voltage U0-08, query BOOST voltage U0-02, query carrier frequency A1-00.

[0077] For details, please refer to Figure 4 , Figure 4 1045 is a schematic diagram of a specific embodiment of the monitoring method of the boost-boost inductor test device in the embodiment of the present invention. The boost-boost inductor test device further includes: a power supply module 206, and the power supply module 206 is connected to the Boost drive module 204. The following specific implementation methods are included in step 1045:

[0078] 10451. Receive the Buck adjustment signal and generate a power compensation signal;

[0079] 10452. Send the power compensation signal to the power supply module, and the power supply module transmits a compensation voltage corresponding to the power compensation signal to the Buck drive module based on the power compensation signal;

[0080] 10453. The Buck driving module generates a new Buck driving signal based on the compensation voltage and the Buck adjustment signal, and transmits the new Buck driving signal to the Buck inductor module.

[0081] In steps 10451-10453, the Buck adjustment signal transmitted from the Buck driving module 205 to the main control module 207 is received, the compensation power value required by the Buck driving module 205 is calculated based on the Buck adjustment signal, and the power compensation signal is generated based on the compensation power value. The power compensation signal is sent to the power supply module 207, and the power supply module 207 transmits the compensation voltage corresponding to the power compensation signal to the Buck driving module 205 based on the power compensation signal.

[0082] Finally, a new Buck driving signal is generated based on the compensation voltage and the Buck adjustment signal of the Buck driving module 205 and transmitted to the Buck inductor module 202 to compensate for energy loss and energy adjustment during the cyclic transmission process.

[0083] In one embodiment, the inductance parameters of the Buck inductor module and the Boost inductor module are the same, that is, the inductive reactance L1 of the Buck inductor module is equal to the inductive reactance L2 of the Boost inductor module.

[0084] 105. Record the operating temperature of the buck-boost inductor test device;

[0085] In this embodiment, the operating temperature of the buck-boost inductor testing device during operation is recorded.

[0086] Specifically, step 105 includes the following specific implementation methods:

[0087] 1051. Collecting the operating temperature of the Buck-Boost inductor module through the temperature sensor;

[0088] 1052. Record the operating temperature of the Buck-Boost inductor module as the operating temperature of the buck-boost inductor testing device.

[0089] In steps 1051 - 1052 , the operating temperatures of the Buck inductor module 202 and the Boost inductor module 203 in the Buck-Boost inductor module are collected by the temperature sensor 201 , and the operating temperatures are transmitted to the main control module 207 .

[0090] The operating temperature of the Buck-Boost inductor module is then recorded as the operating temperature of the buck-boost inductor test equipment.

[0091] Specifically, the buck-boost inductor testing device includes: an air cooling module or a water cooling module 208 , and the Buck-Boost inductor module is connected to the air cooling module or the water cooling module 208 .

[0092] Buck-Boost inductor module driven air-cooled or water-cooled physical device to achieve cooling effect.

[0093] 106. Determine whether the operating temperature is greater than the temperature protection threshold;

[0094] In this embodiment, it is analyzed whether the monitored operating temperature, such as 50 degrees, is greater than a preset temperature protection threshold, such as 90 degrees.

[0095] 107. When the temperature exceeds the temperature protection threshold, an abnormal shutdown command is sent to the buck-boost inductor test device;

[0096] In this embodiment, if the operating temperature exceeds a preset temperature protection threshold, an abnormal shutdown instruction needs to be sent to the buck-boost inductor testing device, and the buck-boost inductor testing device performs temperature reduction control.

[0097] Specifically, step 107 includes the following specific implementation methods:

[0098] 1071. Send an abnormal shutdown instruction to the Buck-Boost inductor module.

[0099] In step 1071, the main control module 207 transmits the abnormal shutdown instruction to the Boost drive module 204 and the Buck drive module 205 in the Buck-Boost inductor module to shut down the control of the cooling system.

[0100] 108. When the temperature protection threshold is not exceeded, it is confirmed that the step-up / step-down inductor test equipment meets the monitoring requirements.

[0101] In this embodiment, if the operating temperature of the buck-boost inductor testing device does not exceed the temperature protection threshold, it is confirmed that the buck-boost inductor testing device meets the monitoring requirements.

[0102] In the embodiment of the present invention, the temperature sensor collects the internal temperature of the device and the external environment temperature, and first performs a temperature threshold analysis of the external environment temperature to determine whether the environmental state of the buck-boost inductor test device meets the set environmental temperature threshold. When the environmental state of the buck-boost inductor test device meets the device environmental temperature threshold, it is further determined whether the buck-boost inductor test device meets the operating temperature. When the operating temperature and the environmental temperature of the buck-boost inductor test device meet the requirements, it is determined that the buck-boost inductor test device meets the temperature monitoring state, thereby realizing the temperature monitoring of the buck-boost inductor test device itself, and solving the technical problem that the buck-boost inductor test device cannot monitor its own temperature state, resulting in the over-temperature of the device.

[0103] Figure 51 is a schematic diagram of the structure of a monitoring device for a buck-boost inductor test device provided by an embodiment of the present invention. The monitoring device 500 for the buck-boost inductor test device may have relatively large differences due to different configurations or performances, and may include one or more processors (central processing units, CPU) 510 (for example, one or more processors) and a memory 520, and one or more storage media 530 (for example, one or more mass storage devices) storing application programs 533 or data 532. Among them, the memory 520 and the storage medium 530 may be short-term storage or permanent storage. The program stored in the storage medium 530 may include one or more modules (not shown in the figure), and each module may include a series of instruction operations in the monitoring device 500 for the buck-boost inductor test device. Furthermore, the processor 510 may be configured to communicate with the storage medium 530 to execute a series of instruction operations in the storage medium 530 on the monitoring device 500 for the buck-boost inductor test device.

[0104] The monitoring device 500 based on the buck-boost inductor test device may also include one or more power supplies 540, one or more wired or wireless network interfaces 550, one or more input and output interfaces 560, and / or one or more operating systems 531, such as Windows Serve, Mac OS X, Unix, Linux, FreeBSD, etc. Those skilled in the art will appreciate that Figure 5 The structure of the monitoring device for the buck-boost inductor testing device shown does not constitute a limitation on the monitoring device based on the buck-boost inductor testing device, and may include more or less components than shown in the figure, or a combination of certain components, or a different arrangement of components.

[0105] The present invention also provides a computer-readable storage medium, which may be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. Instructions are stored in the computer-readable storage medium. When the instructions are executed on a computer, the computer executes the steps of the monitoring method of the buck-boost inductor testing device.

[0106] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0107] In addition, although each operation is described in a specific order, this should be understood as requiring such operation to be performed in the specific order shown or in a sequential order, or requiring that all illustrated operations should be performed to obtain desired results. Under certain circumstances, multitasking and parallel processing may be advantageous. Similarly, although some specific implementation details are included in the above discussion, these should not be interpreted as limiting the scope of the present disclosure. Some features described in the context of a separate embodiment can also be implemented in a single implementation in combination. On the contrary, the various features described in the context of a single implementation can also be implemented in multiple implementations individually or in any suitable sub-combination mode.

[0108] Although the subject matter has been described in language specific to structural features and / or methodological logical actions, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. On the contrary, the specific features and actions described above are merely example forms of implementing the claims.

Claims

1. A monitoring method for a buck-boost inductor test device, characterized in that: The buck-boost inductor test device comprises: a temperature sensor and a Buck-Boost inductor module, wherein the temperature sensor is electrically connected to the Buck-Boost inductor module, and the monitoring method of the buck-boost inductor test device comprises: Receive the temperature protection threshold and ambient temperature threshold set by the user; Regularly receiving the ambient temperature value of the temperature sensor; Determining whether the ambient temperature value is less than the ambient temperature threshold; When the temperature is less than the ambient temperature threshold, driving information is sent to the Buck-Boost inductor module to drive the buck-boost inductor test device; Recording the operating temperature of the buck-boost inductor test equipment; Determining whether the operating temperature is greater than the temperature protection threshold; When the temperature exceeds the protection threshold, an abnormal shutdown command is sent to the buck-boost inductor test device; When the temperature protection threshold is not exceeded, it is confirmed that the buck-boost inductor test equipment meets the monitoring requirements.

2. The monitoring method of the buck-boost inductor test equipment according to claim 1, characterized in that: The Buck-Boost inductor module includes: a Buck driving module, a Buck inductor module, a Boost inductor module, and a Boost driving module. One end of the Buck driving module is connected to one end of the Buck inductor module, and the other end of the Buck driving module is connected to one end of the Boost driving module. The other end of the Buck inductor module is connected to one end of the Boost inductor module, and the other end of the Boost inductor module is connected to the other end of the Boost driving module. The sending of driving information to the Buck-Boost inductor module to drive the buck-boost inductor test device includes: Sending driving information to the Buck driving module and the Boost driving module, the Buck driving module converts the driving information into a Buck driving signal and transmits it to the Buck inductor module; The Buck inductor module converts the Buck driving signal into a Boost driving signal and transmits it to the Boost inductor module; The Boost inductor module converts the Boost drive signal into a Boost feedback signal and transmits it to the Boost drive module; The Boost driving module converts the Boost feedback signal and the driving information into a Buck adjustment signal and transmits the signal to the Buck driving module; The Buck driving module generates a new Buck driving signal based on the Buck adjustment signal and transmits it to the Buck inductor module to achieve driving and adjusting the power of the buck-boost inductor testing device.

3. The monitoring method of the buck-boost inductor testing device according to claim 2, characterized in that: The sending of driving information to the Buck driving module and the Boost driving module includes: Sending the Buck boost value, the first output voltage duty cycle, and the first operating frequency to the Buck driving module; The Boost voltage value, the second output voltage duty cycle, and the second operating frequency are sent to the Boost driving module.

4. The monitoring method of the buck-boost inductor test equipment according to claim 2, characterized in that: The buck-boost inductor test device further includes: a power supply module, the power supply module is connected to the Boost drive module, and the Buck drive module generates a new Buck drive signal based on the Buck adjustment signal and transmits it to the Buck inductor module, including: Receiving the Buck adjustment signal and generating a power compensation signal; The power compensation signal is sent to the power supply module, and the power supply module transmits a compensation voltage corresponding to the power compensation signal to the Buck drive module based on the power compensation signal; The Buck driving module generates a new Buck driving signal based on the compensation voltage and the Buck adjustment signal, and transmits the new Buck driving signal to the Buck inductor module.

5. The monitoring method of the buck-boost inductor testing device according to any one of claims 2 to 4, characterized in that: The inductance parameters of the Buck inductor module and the Boost inductor module are the same.

6. The monitoring method of the buck-boost inductor test equipment according to claim 1, characterized in that: The recording of the operating temperature of the buck-boost inductor test device comprises: Collecting the operating temperature of the Buck-Boost inductor module by the temperature sensor; The operating temperature of the Buck-Boost inductor module is recorded as the operating temperature of the buck-boost inductor test device.

7. The monitoring method of the buck-boost inductor testing device according to claim 1, characterized in that: The sending of an abnormal shutdown instruction to the buck-boost inductor testing device comprises: Send an abnormal shutdown instruction to the Buck-Boost inductor module.

8. The monitoring method of the buck-boost inductor test equipment according to claim 1, characterized in that: The buck-boost inductor testing device comprises: an air cooling module or a water cooling module, and the Buck-Boost inductor module is connected to the air cooling module or the water cooling module.

9. A monitoring device for a buck-boost inductor test device, characterized in that: The monitoring device of the buck-boost inductor test device comprises: a memory and at least one processor, the memory stores instructions, and the memory and the at least one processor are interconnected via a line; The at least one processor calls the instructions in the memory to enable the monitoring device of the buck-boost inductor testing device to execute the monitoring method of the buck-boost inductor testing device as described in any one of claims 1-8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the monitoring method of the buck-boost inductor testing device according to any one of claims 1 to 8 is implemented.

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