Variable speed drive logic board

Abstract

The present disclosure provides a heat exchanger for heating, ventilation, air conditioning and refrigeration (HVACamp; a variable speed drive (VSD) logic board for a VSD of a variable speed drive (R, R) system includes: a printed circuit board; a sensor integrated with the printed circuit board, where the sensor is configured to detect the HVACamp; r is an organic compound in air within a housing of the system and transmits data indicative of a concentration of the organic compound in the air within the housing; and a controller integrated with the printed circuit board, where the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the housing based on the data, and adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

Description

Background Art

[0001] This section is intended to introduce the reader to various aspects of the technology that may be related to various aspects of the present disclosure described below. This discussion is considered to be helpful in providing the reader with background information to facilitate a better understanding of various aspects of the present disclosure. Therefore, it should be understood that these statements will be read in light of this, rather than as an admission of the prior art.

[0002] A chiller system or vapor compression system utilizes a working fluid (e.g., a refrigerant) that changes phases between vapor, liquid, and combinations thereof in response to different temperatures and pressures within the components exposed to the chiller system. The chiller system may place the working fluid in a heat exchange relationship with a conditioning fluid (e.g., water), and may deliver the conditioning fluid to a conditioning device and / or a regulated environment served by the chiller system. In general, a chiller system includes a vapor compression circuit that is configured to circulate the working fluid through various components, such as one or more heat exchangers. For example, the vapor compression circuit may include a first heat exchanger configured to place the working fluid in a first heat exchange relationship with the conditioning fluid and a second heat exchanger configured to place the working fluid in a second heat exchange relationship with another fluid (such as a cooling fluid). The vapor compression circuit may also include a compressor that is configured to circulate the working fluid through the vapor compression circuit. In some chiller systems, a variable speed drive (VSD) may power a motor to drive the compressor. Unfortunately, existing variable speed drives are susceptible to various operational interruptions and other inefficiencies. Therefore, it may be desirable to monitor the operating conditions of electrical components, such as a VSD, during operation of a chiller system. Summary of the invention

[0003] The following describes an overview of certain embodiments disclosed herein. It should be understood that these aspects are presented only to provide the reader with a brief overview of these specific embodiments, and these aspects are not intended to limit the scope of the present disclosure. In fact, the present disclosure may cover various aspects that may not be described below.

[0004] In one embodiment, a variable speed drive (VSD) for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes a logic board configured to control operation of the VSD, wherein the logic board includes a printed circuit board. The logic board also includes a sensing system integrated with the printed circuit board, wherein the sensing system includes a sensor configured to acquire data indicative of an environmental parameter value within an enclosure of the VSD, and the logic board further includes a controller integrated with the printed circuit board, wherein the controller is configured to receive data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

[0005] In another embodiment, a variable speed drive (VSD) logic board for a VSD of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes: a printed circuit board; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect organic compounds in air within an enclosure of the HVAC&R system and transmit data indicating a concentration of the organic compounds in the air within the enclosure; and a controller integrated with the printed circuit board, wherein the controller is configured to: receive data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to a determination of the occurrence of the thermal event.

[0006] In another embodiment, a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system includes an enclosure and a variable speed drive (VSD) disposed within the enclosure, wherein the VSD is configured to operate a motor of the HVAC&R system at a variable speed, and the VSD includes a converter, a DC link, and an inverter. The HVAC&R system also includes a VSD logic board disposed within the enclosure. The VSD logic board is configured to control operation of the VSD, and the VSD logic board includes: a printed circuit board; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect carbon monoxide in the air within the enclosure and transmit data indicating a concentration of carbon monoxide in the air within the enclosure; and a controller integrated with the printed circuit board, wherein the controller is configured to: receive data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to a determination of the occurrence of the thermal event.

[0007] Various improvements of the above-mentioned features associated with various aspects of the present disclosure may exist. Additional features may also be incorporated into these different aspects. These improvements and additional features may exist alone or in any combination. For example, various features associated with one or more illustrated embodiments discussed below may be incorporated into any of the above-mentioned aspects of the present disclosure alone or in any combination. The brief overview presented above is intended only to familiarize the reader with certain aspects and contexts of the embodiments of the present disclosure, without limiting the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Various aspects of the present disclosure may be better understood after reading the following detailed description and referring to the drawings, in which:

[0009] Figure 1 is a perspective view of a building utilizing an embodiment of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system in a commercial environment according to one aspect of the present disclosure;

[0010] Figure 2 is a perspective view of an embodiment of a vapor compression system according to one aspect of the present disclosure;

[0011] Figure 3 According to one aspect of the present disclosure Figure 2 A schematic diagram of an embodiment of a vapor compression system;

[0012] Figure 4 According to one aspect of the present disclosure Figure 2 A schematic diagram of an embodiment of a vapor compression system;

[0013] Figure 5 is a schematic diagram of an embodiment of a portion of an HVAC&R system according to one aspect of the present disclosure, illustrating a variable speed drive (VSD) that may be utilized with a vapor compression system; and

[0014] Figure 6 is a schematic diagram of an embodiment of a logic board that may be utilized with a VSD in a vapor compression system according to one aspect of the present disclosure. DETAILED DESCRIPTION

[0015] One or more specific embodiments will be described below. In order to provide a concise description of these embodiments, not all features of the actual implementation scheme are described in the specification. It should be understood that in the development of any such actual implementation, as in any engineering or design project, a large number of implementation-specific decisions must be made to achieve the developer's specific goals, such as complying with system-related and business-related constraints, which may vary from implementation to implementation. In addition, it should be understood that such development work may be complex and time-consuming, but is no more than a routine task of design, manufacturing, and production for ordinary technicians who benefit from this disclosure.

[0016] When introducing elements of various embodiments of the present disclosure, the articles "a," "an," and "the" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements in addition to the listed elements. Additionally, it should be understood that references to "one embodiment" or "an embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

[0017] As used herein, the terms "approximately," "substantially," "substantially," and the like are intended to convey that the value of the property being described may be within a relatively small range of that property value, as understood by one skilled in the art. For example, when a property value is described as being "approximately" equal to (or, for example, "substantially similar to") a given value, this is intended to convey that the property value may be within + / -5%, within + / -4%, within + / -3%, within + / -2%, within + / -1%, or even closer of the given value. Similarly, when a given feature is described as being "substantially parallel" to another feature, "substantially perpendicular" to another feature, and the like, this is intended to convey that the given feature is within + / -5%, within + / -4%, within + / -3%, within + / -2%, within + / -1%, or even closer of the described property, such as being parallel to another feature, being perpendicular to another feature, and the like. Mathematical terms, such as "parallel" and "perpendicular," should not be strictly interpreted in a strict mathematical sense, but rather should be interpreted as one of ordinary skill in the art would interpret such terms. For example, one of ordinary skill in the art will understand that two lines that are generally parallel to each other are largely parallel, but may have slight deviations from being completely parallel.

[0018] Heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems can be implemented to thermally condition a space within a building, residence, or other suitable structure. For example, an HVAC&R system can include a vapor compression system (e.g., a vapor compression loop) that transfers thermal energy between a working fluid (e.g., a heat transfer fluid, such as a refrigerant) and a fluid to be conditioned (such as water, air, or another suitable fluid). The vapor compression system can include one or more heat exchangers, such as a condenser and an evaporator, that are fluidly coupled to each other via a working fluid loop (e.g., one or more conduits). The vapor compression system can also include a compressor that is configured to circulate a working fluid through the working fluid loop and is thereby capable of transferring thermal energy between the condenser and the evaporator and fluids directed through the condenser and the evaporator, respectively.

[0019] In many cases, the compressor of the HVAC&R system can be driven by an electric motor. The electric motor can be communicatively coupled to a control system, which can include a variable speed drive (VSD). The control system can operate and control the electric motor so that the electric motor drives the compressor at a desired speed (e.g., a variable speed, a selected speed among a plurality of speeds). In some cases, the control system can further adjust the speed of the electric motor and the compressor during operation of the HVAC&R system. For example, the power output of the electric motor can be selected (by the control system) based on the capacity (e.g., cooling demand) of the HVAC&R system.

[0020] A control system (e.g., a VSD) may include a variety of components configured to enable the compressor to operate at variable speeds and, therefore, enable the HVAC&R system to operate at different operating capacities. For example, a VSD may include components configured to regulate and control the current that passes through the VSD and reaches the motor. The VSD may include a rectifier, a DC link (e.g., a DC bus), an inverter, capacitors, diodes, a control board, a control panel, a logic board, an insulated gate bipolar transistor (IGBT), an inductor, a transformer, relays, fuses, etc. In practice, the components of the VSD may be electrically coupled to each other via wiring to enable current to flow therethrough.

[0021] As mentioned above, the VSD may include a logic board (e.g., a printed circuit board [PCB]) that is configured to monitor and / or control certain operating parameters of the VSD. For example, the logic board may monitor the magnitude of current and / or voltage drawn by or supplied to the VSD, the magnitude of current and / or voltage output by the VSD (e.g., to a motor), the magnitude of current flowing through a direct current (DC) bus of the VSD, and / or any other suitable operating parameter of the VSD. Indeed, the logic board of the VSD may enable, monitor, and / or control many operations, functions, and / or parameters of the VSD.

[0022] Unfortunately, existing VSDs and / or components thereof may be susceptible to degradation and / or operational disruption. For example, one or more components of a VSD may degrade at the end of the useful life of the component. In certain examples, one or more components of a VSD may not operate properly due to, for example, supply and / or manufacturing quality irregularities. Therefore, it may be desirable to monitor the operating state or condition of electrical components of a control system (e.g., a VSD) during operation of an HVAC&R system.

[0023] Thus, embodiments of the present disclosure relate to a sensing system (e.g., a monitoring system) that is configured to monitor the operating state or condition of one or more electrical components of an HVAC&R system (e.g., a chiller system). In particular, the present embodiments include a logic board for a VSD and a sensing system integrated with the logic board. The sensing system may include one or more sensors and / or one or more sensing circuits that are integrated as components of a logic board (e.g., a PCB). It should be understood that the logic board of the VSD can be mounted within a housing configured to contain the VSD and associated components. Thus, the sensing system is configured to more easily detect and monitor one or more environmental parameters within the housing, such as parameters corresponding to the quality and / or composition of air contained or residing within the housing.

[0024] The sensing system may also generate and provide feedback indicative of an environmental parameter. A controller (e.g., processing circuitry) of the logic board may be electrically and / or communicatively coupled to the sensing system and may be configured to receive feedback from the sensing system. As discussed in detail herein, the controller is configured to determine and monitor an operating state or condition of one or more electrical components (e.g., a VSD component) disposed within the housing based on feedback received from the sensing system. Additionally, the controller may adjust the operation of the HVAC&R system based on feedback received from the sensing system (e.g., based on the operating state or condition of the one or more electrical components).

[0025] Now turning to the diagram, Figure 1 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 in a building 12 for a typical commercial environment. The HVAC&R system 10 may include a vapor compression system 14 (e.g., a chiller, a vapor compression loop) that generates and supplies a chilled liquid that can be used to cool the building 12. The HVAC&R system 10 may also include a boiler 16 for supplying warm liquid to heat the building 12 and an air distribution system that circulates air through the building 12. The air distribution system may include an air return duct 18, an air supply duct 20, and / or an air handler 22. In some embodiments, the air handler 22 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by a conduit 24. Depending on the operating mode of the HVAC&R system 10, the heat exchanger in the air handler 22 may receive heated liquid from the boiler 16 or cooled liquid from the vapor compression system 14. The HVAC&R system 10 is illustrated with separate air handlers on each floor of the building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 22 and / or other components that may be shared between floors.

[0026] Figure 2 and Figure 3 An embodiment of a vapor compression system 14 is shown that may be used in the HVAC&R system 10. The vapor compression system 14 may circulate a working fluid through a working fluid circuit that begins with a compressor 32. The working fluid circuit may also include a condenser 34, an expansion valve or device 36, and a liquid cooler or evaporator 38. The vapor compression system 14 may further include a control panel 40 having an analog-to-digital (A / D) converter 42, a microprocessor 44, a nonvolatile memory 46, and / or an interface board 48.

[0027] Some examples of fluids that can be used as working fluids in the vapor compression system 14 are hydrofluorocarbon (HFC) based refrigerants, for example, R-410A, R-407, R-134a, R-1234ze, R1233zd, hydrofluoroolefins (HFO), "natural" refrigerants such as ammonia (NH3), R-717, carbon dioxide (CO2), R-744 or hydrocarbon-based refrigerants, water vapor, or any other suitable working fluid. In some embodiments, the vapor compression system 14 can be configured to effectively utilize a working fluid having a standard boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere of pressure, also referred to as a low-pressure working fluid relative to a medium-pressure working fluid (such as R-134a). As used herein, "standard boiling point" can refer to a boiling point temperature measured at one atmosphere of pressure.

[0028] In some embodiments, the vapor compression system 14 may use one or more of a variable speed drive (VSD) 52, a motor 50, a compressor 32, a condenser 34, an expansion valve or device 36, and / or an evaporator 38. The motor 50 may drive the compressor 32 and may be powered by the variable speed drive (VSD) 52. The VSD 52 receives AC power having a specific fixed pipeline voltage and a fixed pipeline frequency from an alternating current (AC) power source and provides power having a variable voltage and frequency to the motor 50. In other embodiments, the motor 50 may be powered directly by an AC or direct current (DC) power source. The motor 50 may include any type of motor that may be powered by a VSD or directly by an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.

[0029] Compressor 32 compresses the working fluid vapor and delivers the vapor to condenser 34 through an exhaust passage. In some embodiments, compressor 32 may be a centrifugal compressor. The working fluid vapor delivered to condenser 34 by compressor 32 may transfer heat to a cooling fluid (e.g., water or air) in condenser 34. As a result of the heat transfer with the cooling fluid, the working fluid vapor may condense into a working fluid liquid in condenser 34. The liquid working fluid from condenser 34 may flow to evaporator 38 through expansion device 36. Figure 3 In the illustrated embodiment of , the condenser 34 is water cooled and includes a tube bundle 54 connected to a cooling tower 56 that supplies a cooling fluid to the condenser 34 .

[0030] The liquid working fluid delivered to the evaporator 38 may absorb heat from the conditioning fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid working fluid in the evaporator 38 may undergo a phase change from liquid working fluid to working fluid vapor. Figure 3As shown in the illustrated embodiment of FIG. 5 , the evaporator 38 may include a tube bundle 58 having a supply line 60S and a return line 60R connected to a cooling load 62. A conditioning fluid (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) for the evaporator 38 enters the evaporator 38 via the return line 60R and exits the evaporator 38 via the supply line 60S. The evaporator 38 may reduce the temperature of the conditioning fluid in the tube bundle 58 via heat transfer with the working fluid. The tube bundle 58 in the evaporator 38 may include a plurality of tubes and / or a plurality of tube bundles. In any case, the vapor working fluid exits the evaporator 38 and returns to the compressor 32 through the suction line to complete the cycle.

[0031] Figure 4 is a schematic diagram of vapor compression system 14 in which intermediate loop 64 is coupled between condenser 34 and expansion device 36. Intermediate loop 64 may have an inlet line 68 directly fluidly connected to condenser 34. In other embodiments, inlet line 68 may be indirectly fluidly coupled to condenser 34. Figure 4 As shown in the illustrated embodiment of FIG. 1 , the inlet line 68 includes a first expansion device 66 positioned upstream of an intermediate vessel 70 that is incorporated into the vapor compression system 14 described above to provide efficient operation. In some embodiments, the intermediate vessel 70 may be a flash tank (e.g., a flash intercooler, an economizer). In other embodiments, the intermediate vessel 70 may be configured as a heat exchanger or a "surface economizer." Figure 4 In the illustrated embodiment of , the intermediate vessel 70 is used as a flash tank, and the first expansion device 66 is configured to reduce (e.g., expand) the pressure of the liquid working fluid received from the condenser 34. During the expansion process, a portion of the liquid may evaporate, and thus the intermediate vessel 70 may be used to separate the vapor from the liquid received from the first expansion device 66.

[0032] In addition, the intermediate container 70 can provide further expansion of the liquid working fluid due to the pressure drop experienced by the liquid working fluid when entering the intermediate container 70 (e.g., due to the rapid increase in volume experienced when entering the intermediate container 70). The vapor in the intermediate container 70 can be sucked in by the compressor 32 through the suction line 74 of the compressor 32. For example, the compressor 32 can include a single compressor stage that is configured to receive vapor from the evaporator 38 and vapor from the intermediate container 70 and pressurize it to a specific pressure. In other embodiments, the vapor in the intermediate container 70 can be sucked into an intermediate stage (e.g., not a suction stage) of the compressor 32. Due to the expansion in the expansion device 66 and / or the intermediate container 70, the enthalpy of the liquid collected in the intermediate container 70 can be lower than the enthalpy of the liquid working fluid leaving the condenser 34. The liquid from the intermediate container 70 can then flow through the second expansion device 36 along the pipeline 72 to the evaporator 38.

[0033] It should be understood that any of the features described herein may be combined with the vapor compression system 14 or any other suitable HVAC&R system. For example, the present technology may be combined with any HVAC&R system having an economizer (such as the intermediate container 70) and a compressor (such as the compressor 32). The following discussion describes the present technology in combination with an embodiment of an HVAC&R system having one compressor 32. However, it should be noted that the systems and methods described herein may be combined with other embodiments of the HVAC&R system 10.

[0034] The present disclosure relates to a logic board of a variable speed drive (VSD), such as the VSD 52 discussed above. In particular, the logic board includes an integrated sensing system that is generally configured to sense, detect, and / or otherwise monitor an operating condition or state of one or more components (e.g., electrical components) of the VSD 52 and / or the HVAC&R system 10. The sensing system integrated with the logic board of the VSD 52 is configured to enable more rapid detection of degradation, degradation, and / or other operating irregularities in the VSD 52 and / or its components. Thus, the present embodiments can mitigate progressive degradation and / or extended operational interruptions of the HVAC&R system 10.

[0035] Considering the foregoing, Figure 5 1 is a schematic diagram of a portion of one embodiment of an HVAC&R system 10, showing an embodiment of a VSD 52 (e.g., a VSD system) and a logic board 100 (e.g., a VSD logic board) of the VSD 52, which is configured to monitor and / or control the operation of the VSD 52. It should be understood that, for example, the VSD 52 and the logic board 100 may be configured to control Figures 1 to 4The motor 50 of the vapor compression system 14 of the embodiment of the present invention. An alternating current (AC) power source 102 can supply AC power to the VSD 52, which in turn supplies AC power to the motor 50. The AC power source 102 can provide three-phase, fixed voltage, and fixed frequency AC power from an AC grid or distribution system to the VSD 52. For example, the AC power source 102 can provide a first phase of AC power, a second phase of AC power, and a third phase of AC power through a first receiving line 104, a second receiving line 106, and a third receiving line 108, respectively.

[0036] In some applications, the AC power may be supplied directly from the electric utility or from one or more substations between the electric utility and the AC power source 102. In some embodiments, the AC power source 102 may supply a three-phase AC voltage or pipeline voltage of up to 15 kilovolts (kV) at a pipeline frequency between 50 hertz (Hz) and 60 Hz to the VSD 52, depending on the corresponding AC power source 102. However, in other embodiments, the AC power source 102 may provide any suitable fixed pipeline voltage or fixed pipeline frequency to the VSD 52, depending on the configuration of the AC power source 102. In addition, a particular site (e.g., the installation location of the HVAC&R system 10) may have multiple AC power sources that may meet different pipeline voltage and pipeline frequency requirements.

[0037] The VSD 52 directs the AC power from the AC power source 102 to the motor 50 at a desired voltage and a desired frequency. In certain embodiments, the VSD 52 may provide AC power to the motor 50 that has a higher voltage and frequency or a lower voltage and frequency than the fixed voltage and fixed frequency AC power received from the AC power source 102. For example, the VSD 52 may include three internal sections (e.g., stages, blocks, modules): a converter 110 (e.g., a rectifier), a direct current (DC) link 112, and an inverter 114. The converter 110 may convert a fixed line frequency and / or a fixed line voltage from the AC power source 102 into DC power. The DC link 112 may filter the DC power from the converter 110 and / or store energy via components such as capacitors 116 and / or inductors. The inverter 114 may convert the DC power from the DC link 112 into a variable frequency, variable voltage AC power (e.g., three-phase AC power) for supply to the motor 50. For example, the inverter 114 may provide a first phase of AC power, a second phase of AC power, and a third phase of AC power to the electric machine 50 through a first output line 118 , a second output line 120 , and a third output line 122 , respectively.

[0038] In some embodiments, the converter 110 may be a pulse width modulation (PWM) boost converter or rectifier having insulated gate bipolar transistors (IGBTs) to provide a boosted DC voltage to the DC link 112 and to generate a substantially RMS output voltage from the VSD 52 that is greater than a fixed nominal substantially RMS input voltage of the VSD 52. Similarly, the inverter 114 may be a PWM type inverter having IGBTs and / or other suitable transistors (e.g., switches). Additionally or alternatively, the converter 110 may include a diode bridge, such as diode modules and / or silicon controlled rectifier (SCR) modules arranged in a bridge configuration. Furthermore, in some embodiments, the VSD 52 may also incorporate a diode bridge in addition to the VSD 52. Figure 5 Components other than those shown in the figure are required to provide the appropriate output voltage and frequency to the motor 50, such as circuit breakers, power buses, additional capacitors, filters, resistors, power supplies, fuses, control boards, relays, etc.

[0039] In some embodiments, the motor 50 may be an induction motor configured to be driven at a variable speed. The induction motor may have any suitable pole arrangement, including two poles, four poles, six poles, or any suitable number of poles. The induction motor is configured to drive a load, such as the compressor 32 of the vapor compression system 14. In other embodiments, the motor 50 may be any suitable motor that drives the compressor 32 and / or another suitable device.

[0040] In some embodiments, the logic board 100 may be communicatively coupled to the VSD 52 via a wiring harness 124 (e.g., a wiring harness) or a plurality of wiring harnesses. The wiring harness 124 may include a plurality of wires (e.g., copper wires, optical fibers) capable of transmitting data and / or signals between the VSD 52 and the logic board 100. It should be understood that the logic board 100 may be considered a component of the VSD 52, or may be considered a component of a control system 128 (e.g., an HVAC&R system 10) having the VSD 52. In some embodiments, the logic board 100 may monitor and / or control various operating parameters of the power provided to the VSD 52 by the AC power source 102, such as the frequency and / or voltage of the power supplied to the VSD 52 and / or the amount of current drawn by the VSD 52. The logic board 100 may also be communicatively coupled (e.g., via the wiring harness 124) to other components (e.g., of the control system 128, of the HVAC&R system 10), such as the control panel 40 and / or other controllers, control boards, and / or control panels. For example, the logic board 100 may control the operation of components of the VSD 52 (eg, the converter 110 , the inverter 114 ) based on commands received from the control panel 40 (such as run commands, speed commands, etc.).

[0041] The logic board 100 may also be communicatively coupled (e.g., via the wiring harness 124) to an input sensing unit 130 (e.g., an input current transformer), which may be disposed on, around, or near each of the first receiving line 104, the second receiving line 106, and / or the third receiving line 108. In particular, a first input sensing unit 132 disposed on the first receiving line 104 may monitor a first phase of AC power flowing through the first receiving line 104. For example, the first input sensing unit 132 may include a voltage transformer, a current transformer, or another suitable device or sensor configured to measure a parameter of the first phase of AC power (such as a frequency of the first phase of AC power, a voltage value of the first phase of AC power, and / or a current value of the first phase of AC power). The first input sensing unit 132 may output a signal (e.g., an analog signal, an electrical waveform) proportional to the parameter value of the first phase of AC power monitored by the first input sensing unit 132. For example, in an embodiment where the first input sensing unit 132 is configured to monitor the frequency of the first phase of the AC power supplied to the VSD 52, the first input sensing unit 132 may output an electrical waveform having a frequency corresponding to (e.g., substantially equal to) the frequency of the first phase of the AC power. Similarly, the second input sensing unit 134 disposed on the second receiving line 106 may monitor a parameter (e.g., frequency, voltage, and / or current) of the second phase of the AC power flowing through the second receiving line 106, and the third input sensing unit 136 disposed on the third receiving line 108 may monitor a parameter (e.g., frequency, voltage, and / or current) of the third phase of the AC power flowing through the third receiving line 108.

[0042] The logic board 100 may additionally or alternatively monitor parameters of the power supplied by the VSD 52 to the motor 50. For example, the output sensing unit 140 (e.g., an output current transformer) may include a first output sensing unit 142, a second output sensing unit 144, and a third output sensing unit 146 disposed on, around, or near the first output line 118, the second output line 120, and the third output line 122, respectively. Thus, the first output sensing unit 142, the second output sensing unit 144, and the third output sensing unit 146 may monitor the first phase, the second phase, and the third phase of the AC power flowing through the first output line 118, the second output line 120, and the third output line 122, respectively. That is, the first output sensing unit 142, the second output sensing unit 144, and the third output sensing unit 146 may include a voltage transformer, a current transformer, and / or other suitable devices or sensors configured to measure the respective frequencies, voltage values, and / or current values ​​of the first phase, the second phase, and the third phase of the AC power. Similar to input sense units 130 discussed above, output sense units 140 may each be communicatively coupled to one or more signal sense circuits 138 of adaptive logic board 100 via wiring harness 124 .

[0043] As mentioned above, in accordance with the present technology, the logic board 100 of the VSD 52 also includes a sensing system 150 (e.g., a monitoring system, a sensing and monitoring system) integrated with the logic board 100. The sensing system 150 is configured to monitor an operating condition or state of one or more electrical components 152 of the HVAC&R system 10. For example, the one or more components 152 may include the VSD 52 and / or components of the VSD 52. For clarity, as used herein, "electrical components 152" may refer to and / or include digital components (e.g., microprocessors, application specific integrated circuits [ASICs], field programmable gate arrays [FPGAs]), analog components (e.g., wires, resistors, capacitors, inductors, diodes, transistors), electromechanical components (e.g., solenoids, actuators), power components (e.g., power supplies, inverters, circuit breakers, power buses, etc.), and / or other components of the HVAC&R system 10 that utilize and / or operate with electrical current. In fact, the electrical components 152 may include any or all of the components of the VSD 52 (e.g., VSD system) discussed herein. In addition, the electrical components 152 may also include wiring 154 that extends between the VSD 52 and other electrical components 152 and electrically couples the VSD to these other electrical components, electrically couples the components of the VSD 52 to each other, etc. The wiring 154 may include receiving lines 104, 108, and 108, and output lines 118, 120, and 122. That is, the wiring 154 may be configured to transmit power from one component to another. In some embodiments, the sensing system 150 may receive a power supply from the AC power source 102, from another component of the HVAC&R system 10 (e.g., the VSD 52), and / or from a separate power source (e.g., a battery).

[0044] The sensing system 150 integrated with the logic board 100 of the VSD 52 is configured to enable improved (e.g., faster) detection of one or more environmental parameters associated with the VSD 52, components of the VSD 52, and / or other components of the HVAC&R system 10 (e.g., electrical components 152). To this end, the logic board 100 can be disposed within an enclosure 156 (e.g., a housing, an electrical enclosure) of the HVAC&R system 10 that is configured to contain the VSD 52, the control system 128, and / or other electrical components 152 of the HVAC&R system 10. For example, in some embodiments, the control panel 40 of the HVAC&R system 10 can be disposed within the enclosure 156. In the mounted configuration, the logic board 100 can be mounted to a panel (e.g., a wall panel, a door panel) of the enclosure 156 and / or can be spaced apart from the converter 110, the DC link 112, the inverter 114, and / or other electrical components 152 within the enclosure 156. The logic board 100 may additionally or alternatively be disposed within the housing 156 adjacent or proximate to other components of the VSD 52 , such as electrical components 152 (eg, wiring 154 ) of the VSD 52 .

[0045] When the logic board 100 and the sensing system 150 integrated therewith are installed in the housing 156, the sensing system 150 is configured to monitor one or more environmental parameters within the interior 158 of the housing 156. As used herein, an "environmental parameter" may include, for example, the concentration (e.g., in parts per million [ppm]) of a compound (e.g., an organic compound, a non-organic compound, carbon, carbon monoxide) that may be dispersed in the air within the housing 156. As a non-limiting example, such a compound may include carbon monoxide. Additionally or alternatively, an "environmental parameter" may include the concentration of particulate matter (e.g., carbon particles) that may be suspended in the air within the housing 156. By integrating the sensing system 150 with the logic board 100 of the VSD 52, the present embodiment enables more rapid detection of environmental parameters within the interior 158 of the housing 156, as well as more rapid implementation of remedial measures that may be implemented in response to the detection of the sensing system 150 (e.g., detection of an environmental parameter that indicates an undesirable operating condition or state within the housing 156).

[0046] In some examples, certain electrical components 152 may suffer performance degradation over time. Indeed, the usable or designed life of some electrical components 152 may expire, and it may be desirable to perform maintenance and / or replacement of such electrical components 152 in order to maintain the desired operation of the HVAC&R system 10 and / or VSD 52. In some cases, performance degradation of the electrical components 152 and / or other variables (e.g., power quality, environmental factors such as humidity, supply and / or manufacturing irregularities, etc.) may cause the electrical components 152 to experience thermal events during operation of the HVAC&R system 10. As another example, incorrect and / or degraded electrical connections of the electrical components 152 and / or between these electrical components (e.g., loose and / or weak connections of the wiring 154) may cause thermal events. As used herein, a thermal event may indicate an operating condition or state of the electrical component 152 in which the temperature of the electrical component 152 exceeds the expected operating temperature range of the electrical component 152 (e.g., overheating of the electrical component 152 (such as the wiring 154)). As such, during a thermal event, the operating state of the electrical component 152 may deviate from an expected operating state of the electrical component 152 (eg, the temperature of the electrical component 152 may increase above an expected operating temperature of the electrical component 152 ).

[0047] In certain embodiments, the presence of certain compounds and / or particles (carbon monoxide) in the air within the enclosure 156 may indicate the potential occurrence and / or existence of a thermal event. That is, environmental parameters within the enclosure 156 may change before and / or during a thermal event. Therefore, the sensing system 150 integrated with the logic board 100 is configured to detect the presence of one or more compounds and / or particles within the air, which may more easily indicate a potential or existing thermal event. As described in further detail below, the sensing system 150 integrated with the logic board 100 may provide feedback indicating environmental parameters (e.g., potential or existing thermal events) to a controller of the logic board 100, and the logic board 100 may utilize the feedback to evaluate the operating condition or state of the electrical components 152 and / or the VSD 52. In some cases, the logic board 100 may perform or implement a control action or response to the evaluation of the operating condition or state of the electrical components 152 and / or the VSD 52. In fact, due to the integration of the sensing system 150 with the logic board 100, remedial, corrective and / or compensatory control functions (e.g., in response to a potential or existing thermal event) can also be performed more quickly (e.g., via the logic board 100), which can reduce and / or mitigate potential and / or further degradation of the electrical components 152.

[0048] Figure 6is a schematic diagram of an embodiment of a logic board 100 that may be incorporated with the VSD 52. As discussed above, the logic board 100 includes the sensing system 150 integrated with the logic board 100. For example, the logic board 100 may be a printed circuit board (PCB) 180, and the sensing system 150 (e.g., components of the sensing system 150) may be integrated (e.g., mounted, welded, soldered, attached) with the PCB 180 as a component or system of the logic board 100.

[0049] As shown in the illustrated embodiment, the logic board 100 may include various components configured to implement the functionality of the logic board 100 described herein. For example, the logic board 100 may include a controller 182 (e.g., an automation controller, a programmable logic controller [PLC]) integrated with (e.g., disposed on) the PCB 180. The controller 182 may include a processing circuit system 184, and the processing circuit system 184 may include one or more microprocessors, one or more "general purpose" microprocessors, one or more special purpose microprocessors, one or more application specific integrated circuits (ASICs), one or more reduced instruction set (RISC) processors, one or more field programmable gate arrays (FPGAs), one or more digital signal controllers (DSCs), one or more digital signal processors (DSPs), or any combination thereof. In some embodiments, the processing circuit system 184 includes an FPGA 186 that is configured to control the operation of the VSD 52 at an increased speed (e.g., without executing software or other executable code). For example, the FPGA 186 may be configured to suspend the operation of the VSD 52 in response to data and / or feedback provided by the sensing system 150 (e.g., indicating a potential or existing thermal event). In some embodiments, FPGA 186 may actuate (eg, trigger) a circuit breaker of VSD 52 to interrupt the supply of power from AC power source 102 to VSD 52 , thereby suspending operation of VSD 52 .

[0050] The logic board 100 (e.g., the controller 182) also includes a memory 188 disposed on the PCB 180. The memory 188 can store information such as instructions, control software, lookup tables, configuration data, other data, etc. The memory 188 can include volatile memory such as random access memory (RAM), and / or non-volatile memory such as read-only memory (ROM). Additionally or alternatively, the memory 188 can include flash memory, a hard drive, or any other suitable optical, magnetic, or solid-state storage medium, or a combination thereof. In some embodiments, the memory 188 is a tangible, non-transitory machine-readable medium that can store machine-readable instructions for execution by the processing circuit system 184. The memory 188 can store a variety of information and can be used for a variety of purposes. For example, the memory 188 can store processor-executable instructions including firmware or software for execution by the processing circuit system 184, such as instructions for controlling components of the VSD 52. In some embodiments, memory 188 may store operating parameter values ​​(e.g., threshold values, predetermined values) that processing circuit system 184 may compare with detected values ​​(e.g., data received by processing circuit system 184) of corresponding operating parameters of VSD 52 (such as voltage, current, temperature, etc.). The operating parameter values ​​stored on memory 188 may be associated with one or more hardware faults of VSD 52, and logic board 100 may be configured to suspend operation of VSD 52 based on a comparison of the detected operating parameter values ​​with the threshold operating parameter values ​​stored on memory 188.

[0051] The logic board 100 also includes other components that may be coupled to and / or integrated with the PCB 180, such as a communication circuit system 190, one or more input / output (I / O) ports 192, and one or more indicators 194. The communication circuit system 190 is configured to enable communication between the logic board 100 and other components of the HVAC&R system 10, such as components of the VSD 52 and / or control system 128. In some embodiments, the communication circuit system 190 may be configured to establish and enable communication between the logic board 100 and the control panel 40. Additionally or alternatively, the communication circuit system 190 may be configured to establish and enable communication between the logic board 100 and another control board or control panel of the VSD 52 or control system 128.

[0052] One or more I / O ports 192 are also configured to enable coupling (e.g., electrical coupling, communication coupling) between logic board 100 and other components or devices. For example, I / O ports 192 may be configured to enable electrical coupling between logic board 100 and one or more external sensors 196 (e.g., off-board sensors) and / or one or more external sensing circuits 198. In some embodiments, external sensors 196 and / or external sensing circuits 198 may include input sensing units 130 and / or output sensing units 140. As another example, external sensors 196 and / or external sensing circuits 198 may include one or more temperature sensors or sensing circuits configured to detect a heat sink of VSD 52, motor 50, air within housing 156, ambient temperature outside housing 156, temperature of converter 110, another suitable temperature, or any combination thereof. In fact, external sensors 196 and / or external sensing circuits 198 may be configured to detect any suitable operating parameters associated with the operation of VSD 52 (e.g., power supply operating parameters, current flow direction, etc.). In addition, I / O ports 192 may include ports or interfaces such as a universal serial bus (USB) port, a secure digital (SD) card slot (e.g., a microSD card slot), an RS-485 port, an Ethernet port, a control board interface port, an RS-232 interface port, another interface port, or any combination thereof.

[0053] The one or more indicators 194 may be configured to provide feedback, such as visual feedback and / or auditory feedback, to an operator or user of the HVAC&R system 10. For example, the one or more indicators 194 may be configured to provide feedback indicating the status, operating state, and / or other conditions of the VSD 52. In some embodiments, the one or more indicators 194 may include visual indicators, such as one or more light emitting diodes (LEDs).

[0054] As mentioned above, the logic board 100 also includes a sensing system 150 integrated with the logic board 100 (e.g., integrated with the PCB 180). According to the present technology, the sensing system 150 includes one or more sensors 200 integrated with and / or disposed on the logic board 100 (e.g., PCB 180). Additionally or alternatively, the sensing system 150 may include one or more sensing circuits 202 integrated with and / or disposed on the logic board 100 (e.g., PCB 180). The sensors 200 and / or sensing circuits 202 are configured to monitor one or more environmental parameters within the interior 158 of the housing 156 (e.g., VSD housing) and provide feedback indicative of the environmental parameters to the controller 182.

[0055] According to the present technology, the sensing system 150 includes a carbon monoxide (CO) sensor unit 204 (e.g., an organic compound sensor unit, a particulate sensor unit) as one of the sensors 200 and a CO sensing circuit 206 (e.g., a sensor support circuit, a sensing circuit) as one of the sensing circuits 202. The CO sensor unit 204 and the CO sensing circuit 206 may cooperatively define a CO sensor 208 (e.g., a sensor, an environmental parameter sensor, a sensor system) of the sensing system 150. As will be appreciated, carbon monoxide may be present in the interior 158 of the housing 156 before or during a thermal event. Thus, the CO sensor unit 204 is configured to detect a concentration of carbon monoxide within the interior 158. Although the present discussion describes the sensing system 150 as including a CO sensor 208 configured to detect carbon monoxide within the housing 156 to determine the presence of a potential and / or existing thermal event, it should be understood that other embodiments of the sensing system 150 may include sensors (e.g., sensor units, sensing circuits, etc.) configured to detect other organic compounds, elements, and / or particles (e.g., environmental parameters) that may indicate the likelihood and / or presence of a potential and / or existing thermal event. In fact, the CO sensor 208 may be any suitable sensor configured to detect any suitable operating parameters that indicate the presence of a potential and / or existing thermal event.

[0056] The CO sensor unit 204 may be an electrochemical sensor or device configured to detect the concentration of CO in the air within the interior 158 of the housing 156 and generate a current indicative of the CO concentration (e.g., via one or more chemical reactions within the CO sensor unit 204). The current generated by the CO sensor unit 204 is output to the CO sensing circuit 206 (e.g., sensor support circuitry, transimpedance amplifier circuitry), and the CO sensing circuit 206 is configured to convert the current into a voltage (e.g., a digital signal). Thereafter, the CO sensing circuit 206 may transmit the voltage to the processing circuit system 184 (e.g., the controller 182). In practice, the CO sensor 208 may be directly coupled (e.g., directly electrically coupled) to the processing circuit system 184. In other embodiments, the CO sensor 208 may be another type of sensor, such as a semiconductor sensor (e.g., a semiconductor CO sensor). Additionally, in addition to or in lieu of a voltage output, the CO sensor 208 (e.g., the CO sensing circuit 206) may be configured to output a current and / or a digital signal (e.g., a direct digital signal) to the processing circuit system 184.

[0057] The processing circuit system 184 may compare the voltage received from the CO sensor 208 (e.g., the CO sensing circuit 206) to one or more threshold values ​​that may be stored in the memory 188. The one or more threshold values ​​may be associated with one or more threshold concentrations of CO within the air that indicate a potential thermal event and / or an existing thermal event. The threshold values ​​may be adjusted, such as by a user (e.g., via user input). Additionally or alternatively, the processing circuit system 184 may be configured to adjust the one or more threshold values, such as based on operating conditions and / or parameters of the HVAC&R system 10, based on the elapsed life and / or operating time of equipment of the HVAC&R system 10, and / or based on the elapsed life and / or operating time of the CO sensor 208. In some embodiments, the processing circuit system 184 may determine the likelihood or occurrence of a thermal event in response to the CO sensor 208 indicating that the concentration of CO within the interior 158 exceeds a threshold value (e.g., a target amount or tolerance) at a particular time instance or for a predetermined time interval (e.g., 5 seconds). Additionally or alternatively, processing circuitry 184 may determine the likelihood or occurrence of a thermal event based on a rate of change of detected CO concentration indicated by feedback received from CO sensor 208 , such as a rate of change that exceeds a threshold rate of change stored in memory 188 .

[0058] In response to a determination that the CO concentration detected by the CO sensor 208 indicates a potential thermal event and / or an existing thermal event, the processing circuit system 184 may perform remedial and / or responsive control actions. For example, the processing circuit system 184 may initiate a shutdown (e.g., suspend operation) of the VSD 52 (e.g., the HVAC&R system 10) to suspend the flow of current therethrough (e.g., through the electrical components 152 of the VSD 52). As mentioned above, the processing circuit system 184 may include an FPGA 186, which may be configured to quickly initiate remedial and / or responsive control actions (e.g., shutdown of the VSD 52), such as without executing a software loop. In this manner, the present embodiments achieve an improved, faster control response to potential thermal events and / or existing thermal events, and may significantly mitigate and / or avoid further degradation and / or operational disruption that may result from thermal events.

[0059] In addition to initiating remedial and / or responsive control actions, controller 182 (e.g., processing circuitry 184) may also output an alarm indicating a detected CO concentration that may be associated with a thermal event. For example, processing circuitry 184 may cause actuation and / or activation of one of indicators 194 (e.g., a visual indicator), such as illumination (e.g., constant illumination, intermittent illumination) of an LED. In some embodiments, controller 182 and / or another component of logic board 100 (e.g., communication circuitry 190) may transmit an alarm (e.g., a signal) to control panel 40 (e.g., a user interface) and / or other components of HVAC&R system 10 for communicating the alarm to a user or operator. Additionally or alternatively, control system 128 may transmit the alarm to a device (e.g., a user device, an electronic device) remote from HVAC&R system 10, such as a mobile device, a building automation system, another suitable system or device, or any combination thereof.

[0060] In some applications, the sensitivity of the CO sensor 208 (e.g., the CO sensor unit 204) can vary, which can be expressed in nanoamperes per million (nA / ppm). For example, different embodiments of the CO sensor 208 can have different sensitivities to CO detected in the air. In addition, the sensitivity of the CO sensor 208 can vary based on the temperature of the CO sensor 208. In particular, the current output by the CO sensor unit 204 for a specific detected CO concentration can vary as the temperature of the CO sensor unit 204 changes. Therefore, the present embodiment includes a temperature sensor 210 of the sensing system 150 that is also integrated with the logic board 100. In some embodiments, the CO sensor unit 204 and the temperature sensor 210 can be placed adjacent to each other (e.g., next to each other) on the PCB 180. The temperature sensor 210 can be configured to detect the temperature of the CO sensor unit 204, the temperature of the PCB 180, and / or the ambient temperature around the logic board 100. The temperature sensor 210 can provide feedback indicating the detected temperature to the controller 182 (e.g., the processing circuit system). In some examples, processing circuitry 184 may be configured to assess the concentration of CO detected by CO sensor 208 based on the voltage received from CO sensing circuitry 206 and based on the temperature detected by temperature sensor 210. For example, processing circuitry 184 may reference data stored in memory 188 that correlates respective voltage values ​​and corresponding CO concentrations for various different detected temperature values. In some embodiments, processing circuitry 184 may be configured to adjust the voltage received from CO sensing circuitry 206 based on the temperature value detected by temperature sensor 210 so as to desirably assess the CO concentration within housing 156. To mitigate the effects of temperature on the sensitivity of CO sensor 208, CO sensor 208 (e.g., CO sensor unit 204) may be disposed on PCB 180 remotely and / or away from power circuitry, power supply, and / or other heat generating components of logic board 100. For example, in some embodiments, CO sensor 208 may be disposed on PCB 180 adjacent to one or more of I / O ports 192.

[0061] Additionally, in some applications, the CO sensor 208 (e.g., CO sensor unit 204) may be removed from the logic board 100 and replaced at the end of the useful life of the CO sensor 208. As mentioned above, a replacement of the CO sensor 208 (e.g., CO sensor unit 204) may have a different CO detection sensitivity. Thus, the controller 182 (e.g., processing circuitry 184) may be reprogrammed based on the sensitivity of the new CO sensor 208. For example, in some embodiments, updated thresholds (e.g., threshold voltage values, threshold CO concentration values) associated with potential thermal events and / or existing thermal events may be stored in the memory 188 for reference by the processing circuitry 184 during operation of the logic board 100 with a new CO sensor 208 (e.g., replacement CO sensor unit 204).

[0062] As discussed above, embodiments of the present disclosure may provide one or more technical effects that can be used to detect the occurrence of a thermal event within an enclosure of an HVAC&R system that may contain one or more electrical components. Specifically, the present embodiment includes a logic board for a VSD that includes an integrated sensing system configured to monitor environmental parameters within an enclosure (such as a VSD enclosure configured to accommodate a VSD and electrical components). The sensing system integrated with the VSD logic board is able to more quickly detect environmental parameters that may indicate potential and / or existing thermal events, such as carbon monoxide concentrations within the enclosure. In addition, the sensing system integrated with the logic board of the VSD is able to more quickly implement remedial and / or responsive control actions based on the possibility and / or determination of the presence of a thermal event. Therefore, the present embodiment is able to improve mitigation and avoid degradation of the VSD and electrical components within the enclosure that may otherwise occur due to a thermal event within the enclosure. The technical effects and technical problems in the specification are examples and are not limiting. It should be noted that the embodiments described in the specification may have other technical effects and may solve other technical problems.

[0063] Although only certain features and embodiments are shown and described, many modifications and changes may occur to those skilled in the art without materially departing from the novel teachings and advantages of the subject matter recited in the claims, such as changes in size, dimensions, structure, shape and proportion of various elements, parameter values ​​(such as temperature and pressure), mounting arrangements, use of materials, color, orientation, etc. The order or sequence of any process or method steps may be changed or re-sequenced according to alternative embodiments. Therefore, it should be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the present disclosure.

[0064] Furthermore, in an effort to provide a concise description of exemplary embodiments, not all features of an actual implementation may be described, such as those not relevant to the best mode currently contemplated or those not relevant to enablement. It should be appreciated that in the development of such actual implementations, as in any engineering or design project, many implementation-specific decisions may be made. Such development work may be complex and time consuming, but these are routine tasks of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

[0065] The techniques presented and claimed herein refer to and apply to substantial objects and specific examples of a practical nature that improve the art in a demonstrable manner and are therefore not abstract, intangible, or purely theoretical. In addition, if any claim appended to the end of this specification contains one or more elements that are expressed as "means for [performing] [the function] ..." or "steps for [performing] [the function] ...", it is expected that such elements will be interpreted in accordance with 35 U.S.C. 112(f). However, for any claim containing elements specified in any other manner, it is intended that such elements will not be interpreted in accordance with 35 U.S.C. 112(f).

Claims

1. A variable speed drive (VSD) for a heating, ventilation, air conditioning and refrigeration (HVAC&R) system, comprising: a logic board configured to control operation of the VSD, wherein the logic board comprises a printed circuit board; a sensing system integrated with the printed circuit board, wherein the sensing system includes a sensor configured to acquire data indicative of a value of an environmental parameter within an enclosure of the VSD; as well as A controller is integrated with the printed circuit board, wherein the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

2. The VSD of claim 1, wherein the data includes a concentration of carbon monoxide within the enclosure.

3. The VSD of claim 2, wherein the sensor comprises: a carbon monoxide sensor unit configured to detect the concentration of carbon monoxide within the housing and to generate a current indicative of the concentration of carbon monoxide; as well as A sensing circuit is configured to receive the current from the carbon monoxide sensor cell and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage to the controller. The VSD of claim 1 , wherein the controller is configured to suspend operation of the VSD in response to the determination of the occurrence of the thermal event. 5 . The VSD of claim 1 , wherein the controller is configured to actuate a visual indicator to output a visual indication indicating the occurrence of the thermal event.

6. The VSD of claim 5, wherein the visual indicator comprises a light emitting diode integrated with the printed circuit board.

7. The VSD of claim 1, wherein the sensor is a first sensor, the sensing system includes a second sensor, the second sensor is a temperature sensor, and the temperature sensor is disposed on the printed circuit board adjacent to the first sensor.

8. The VSD of claim 1 , wherein the controller is configured to determine the occurrence of the thermal event in response to a determination that the data from the sensor indicates that the environmental parameter value exceeds a threshold, the logic board includes a memory integrated with the printed circuit board, and the memory is configured to store the threshold.

9. The VSD of claim 1, wherein the controller comprises a field programmable gate array (FPGA), and the FPGA is configured to adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

10. A variable speed drive (VSD) logic board for a VSD of a heating, ventilation, air conditioning and refrigeration (HVAC&R) system, wherein the VSD logic board comprises: Printed circuit boards; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect organic compounds in air within an enclosure of the HVAC&R system and transmit data indicative of a concentration of the organic compounds in the air within the enclosure; as well as A controller is integrated with the printed circuit board, wherein the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

11. The VSD logic board of claim 10, wherein the sensor comprises: a sensor unit configured to detect the organic compound in the air within the housing and generate a current indicative of the concentration of the organic compound in the air; as well as A sensing circuit is configured to receive the current from the sensor unit and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage as the data to the controller.

12. The VSD logic board of claim 11, wherein the organic compound is carbon monoxide.

13. The VSD logic board of claim 11, wherein the sensing circuit is a transimpedance amplifier circuit.

14. The VSD logic board of claim 10, wherein the controller is configured to: comparing the data indicative of the concentration of the organic compound in the air to a threshold value stored in a memory of the VSD logic board; determining that the concentration of the organic compound in the air exceeds the threshold; determining said occurrence of said thermal event within said enclosure based on said determination that said concentration of said organic compound in said air exceeds said threshold value; as well as Operation of the VSD is suspended in response to the determination of the occurrence of the thermal event.

15. The VSD logic board of claim 14, wherein the controller is configured to control operation of a converter of the VSD, control operation of an inverter of the VSD, or both.

16. A heating, ventilation, air conditioning and refrigeration (HVAC&R) system comprising: shell; a variable speed drive (VSD) disposed within the housing, wherein the VSD is configured to operate a motor of the HVAC&R system at a variable speed and the VSD includes a converter, a DC link, and an inverter; as well as a VSD logic board disposed within the housing, wherein the VSD logic board is configured to control operation of the VSD, and the VSD logic board comprises: Printed circuit boards; a sensor integrated with the printed circuit board, wherein the sensor is configured to detect carbon monoxide in air within the enclosure and transmit data indicative of a concentration of the carbon monoxide in the air within the enclosure; and A controller is integrated with the printed circuit board, wherein the controller is configured to receive the data from the sensor, determine an occurrence of a thermal event within the enclosure based on the data, and adjust operation of the VSD in response to the determination of the occurrence of the thermal event.

17. The HVAC&R system of claim 16, wherein the controller is configured to suspend operation of the VSD in response to the determination of the occurrence of the thermal event.

18. The HVAC&R system of claim 16, wherein the sensor is electrically coupled directly to the controller.

19. The HVAC&R system of claim 16, wherein the sensor comprises: a sensor unit configured to detect the carbon monoxide within the housing and generate a current indicative of the concentration of carbon monoxide; as well as A sensing circuit is configured to receive the current from the sensor unit and convert the current into a voltage, wherein the sensing circuit is configured to transmit the voltage to the controller.

20. The HVAC&R system of claim 19, wherein the VSD logic board includes a temperature sensor integrated with the printed circuit board, and the temperature sensor is disposed adjacent to the sensor on the printed circuit board.

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