Analysis Method of Thermoelectric Devices Considering Thermo-Elastoplastic Mechanical Properties of Thermoelectric Materials

Abstract

The present invention proposes a method for analyzing thermoelectric devices considering the temperature-dependent elastoplastic mechanical properties of thermoelectric materials. First, through performance experiments, the true temperature-dependent mechanical property curves of thermoelectric materials within a set temperature range are obtained, and a temperature-dependent damage model of thermoelectric materials is fitted. Then, a thermoelectric device model is established in finite element software, and the material properties of each component are defined. The bearing performance of the hot arm component is simulated to obtain the stress-strain response simulation curve. By comparing the stress-strain response simulation curve with the true temperature-dependent mechanical property curve, it is judged whether the finite element simulation process is accurate. The thermal field boundary conditions and load boundary conditions of each component of the thermoelectric device are set, the design parameters are adjusted, and the bearing performance and damage analysis of the adjusted thermoelectric device are carried out to select the thermoelectric device configuration with the best performance. The present invention considers the true mechanical response of thermoelectric materials in a high-temperature and high-load service environment and realizes the structural optimization design of thermoelectric devices.

Description

Technical Field

[0001] The present invention relates to the field of performance analysis and structural design of thermoelectric devices, and particularly to an analysis method for thermoelectric devices considering the thermo-elastoplastic mechanical properties of thermoelectric materials at varying temperatures. Background Art

[0002] With the prominent problems of fossil energy shortage and environmental pollution, the diversification and efficient multi-stage utilization of energy have become important technical ways to systematically solve energy and environmental problems. As a green energy technology, thermoelectric conversion technology has received extensive attention from the industrial and academic circles.

[0003] Thermoelectric power generation technology utilizes the Seebeck effect of materials to convert thermal energy into electrical energy under the action of a temperature difference gradient. However, when serving in a large temperature difference environment, thermoelectric devices are extremely prone to damage to the hot arm materials, resulting in a reduction in the load-bearing capacity and performance degradation of the devices. Currently, the research on thermoelectric materials mainly focuses on improving their thermoelectric power generation performance indicators, while the research considering the mechanical properties (such as thermal expansion coefficient, elastic modulus) of thermoelectric materials at high temperatures is relatively less. This makes the existing thermoelectric device design methods can only assume thermoelectric materials as a linear elastic model for analysis and optimization, and it is difficult to accurately evaluate and predict their actual load-bearing and failure behaviors in high-temperature and high-pressure service environments. Summary of the Invention

[0004] To overcome the problems existing in the prior art, the present invention proposes an analysis method for thermoelectric devices considering the thermo-elastoplastic mechanical properties of thermoelectric materials at varying temperatures. Combining the special requirements of thermoelectric devices in high-temperature and high-load service environments, fully considering the varying temperature mechanical properties of thermoelectric materials, an analysis model of thermoelectric devices with simulated service behaviors is established to improve the service stability of thermoelectric devices and promote the engineering application of thermoelectric devices.

[0005] The technical solution of the present invention is as follows:

[0006] An analysis method for thermoelectric devices considering the thermo-elastoplastic mechanical properties of thermoelectric materials at varying temperatures, comprising the following steps:

[0007] Step 1: Through performance experimental tests, obtain the true varying temperature mechanical property curve of the thermoelectric material to be studied within a set temperature range;

[0008] Step 2: Using the true varying temperature mechanical property curve of the thermoelectric material to be studied obtained in Step 1, fit to obtain the varying temperature damage model of the thermoelectric material to be studied;

[0009] Step 3: Establish or import a thermoelectric device model to be analyzed in finite element software;

[0010] Step 4: Define the material properties of each component in the thermoelectric device model in the finite element software. The material used for the hot arm component is the thermoelectric material to be studied in Step 1, and the material properties of the thermoelectric material to be studied are defined by the variable temperature damage model obtained in Step 2;

[0011] Step 5: In the finite element software, perform a bearing performance simulation on the hot arm component in the thermoelectric device model, and judge the failure of each unit of the hot arm component to obtain the stress-strain response simulation curves of the hot arm component at several temperatures within the set temperature range;

[0012] Step 6: Compare the stress-strain response simulation curves obtained in Step 5 with the true variable temperature mechanical property curves at the same temperature in Step 1 to obtain the curve differences at each temperature. If the curve differences at all temperatures are less than the set requirements, it is considered that the finite element simulation process in Steps 2 to 5 is accurate; otherwise, return to Step 2 to re-establish the variable temperature damage model;

[0013] Step 7: According to the actual service temperature range of the thermoelectric device, set the thermal field boundary conditions of each component of the thermoelectric device in the finite element software, and set the load boundary conditions of each component of the thermoelectric device according to the structural constraints;

[0014] Step 8: In the finite element software, divide the meshes of the remaining components in the thermoelectric device model and assign mesh element properties;

[0015] Step 9: In the finite element software, adjust the design parameters of each component in the thermoelectric device model, perform a bearing performance and damage analysis on the adjusted thermoelectric device, and select the thermoelectric device configuration with the best performance.

[0016] Further, in Step 1, the mechanical properties include bending property, shear property, compression property or tensile property.

[0017] Further, the variable temperature damage model is:

[0018]

[0019] where is the stress, is the strain, is the damage evolution factor, is the initial elastic modulus of the thermoelectric material to be studied.

[0020] Further, the damage evolution factor is:

[0021]

[0022] where , and are intermediate variables, specifically:

[0023] , ,

[0024] represents the compressive strength of the thermoelectric material to be studied, is the corresponding strain value, is the fitting coefficient describing the stress-strain curve, is the correction coefficient.

[0025] Furthermore, in step 6, the curve difference is measured by the statistic of the stress difference corresponding to the same strain; at a certain temperature, calculate the average value of the stress differences corresponding to the same strain within the entire strain range, and then take the average value of all temperature corresponding average values. If the average value is less than the set threshold, it is considered that the finite element simulation process in steps 2 to 5 is accurate.

[0026] Furthermore, in step 9, the best performance means that when the equivalent structure bearing capacity meets the requirements, the cross-sectional area of the hot arm in the direction perpendicular to the high and low temperature directions is the largest; the equivalent structure bearing capacity is the structural bearing performance per unit area of the cross-section of the hot arm in the direction perpendicular to the high and low temperature directions.

[0027] Furthermore, the equivalent structure bearing capacity is calculated according to the formula

[0028]

[0029] where is the cross-sectional area of the hot arm after chamfering in the direction perpendicular to the high and low temperature directions, is the absolute structural bearing capacity of the corresponding thermoelectric device, is the area of the cross-section of the hot arm after chamfering the cross-section perpendicular to the high and low temperature directions into the inscribed circle of the initial prismatic hot arm cross-section.

[0030] Furthermore, in step 9, the initial design of the hot arm component is a prismatic hot arm structure, and the design parameter is the four-edge chamfering parameter of the prismatic hot arm. By analyzing the bearing performance and damage of the thermoelectric device under different chamfering radii, the optimal hot arm chamfer configuration is selected.

[0031] The present invention has the following beneficial effects:

[0032] (1) Through coupling experiment tests, theoretical analysis, and numerical analysis, the present invention realizes the actual service performance test and evaluation of thermoelectric application technology at the material level and device level, and further conducts structural optimization design of thermoelectric devices, breaking the limitations of the previous design and analysis of thermoelectric devices that only targeted the linear elastic model.

[0033] (2) It realizes the construction of a device model and structural optimization design based on the true temperature-dependent elastoplastic mechanical properties of thermoelectric materials, enabling this analysis method to evaluate the load-bearing and failure modes of thermoelectric devices in high-temperature and high-load service environments and giving suggestions for structural optimization design.

[0034] (3) Evaluate the load-bearing and damage performance of thermoelectric devices in a wide temperature gradient service environment, and then select the thermoelectric device with the best load-bearing performance to improve the design efficiency, thereby enhancing the service reliability and stability of thermoelectric devices and promoting the engineering application of thermoelectric conversion technology.

[0035] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present invention. Description of the Drawings

[0036] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0037] Figure 1 is a flowchart of the analysis method for thermoelectric devices considering the temperature-dependent elastoplastic mechanical properties of thermoelectric materials involved in the present invention.

[0038] Figure 2 is a temperature-dependent mechanical property test chart of a typical thermoelectric material system in the middle and high temperature regions of the present invention.

[0039] Figure 3 is a comparison chart of simulation and test of the temperature-dependent mechanical properties of thermoelectric materials at different temperatures in the present invention.

[0040] Figure 4 is a geometric model of a typical π-type thermoelectric device.

[0041] Wherein: 1. Insulating ceramic plate; 2. Electrode; 3. Thermal arm.

[0042] Figure 5 is the strength calculation result obtained by the present invention for carrying out different chamfer optimization designs on a typical thermoelectric device.

[0043] Figure 6This is a simulation diagram of the damage of the hot arm obtained by the present invention through different chamfer optimization designs of typical thermoelectric devices. The corresponding chamfer radii r of (a) to (e) are (r = 0 mm, 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm) respectively. Detailed implementation manners

[0044] The embodiments of the present invention will be described in detail below. The embodiments are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

[0045] Thermoelectric energy conversion devices are based on the Seebeck effect and directly convert the temperature gradient between the hot and cold ends into electrical energy output through semiconductor thermoelectric materials. In engineering application scenarios, in a typical working temperature field, the internal hot arm of a thermoelectric module not only bears the action of a high-gradient temperature field, but also due to the temperature-dependent non-linear mechanical response of the material, the force-thermal coupling constitutive relationship shows significant non-linear characteristics. Existing analysis models of thermoelectric devices based on the linear elastic constitutive hypothesis are difficult to accurately characterize the interaction mechanism between the elastic-plastic deformation of the material and the evolution of thermal stress under high temperature difference conditions, resulting in theoretical deviations in the assessment of the structural integrity of the device. To address this key technical bottleneck, the present invention proposes an analysis method for thermoelectric devices considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials. First, the complete mechanical response of the temperature change of the "hot arm material", the core component in the thermoelectric device, is considered, and then a corresponding device analysis model is established to carry out the bearing and damage analysis of the typical device structure; finally, the physical parameters and variable parameters of the device structure are optimized to improve the load-bearing capacity of the device structure. The present invention provides, for the first time, a theoretical and simulation analysis basis for the design of temperature difference devices in the actual service environment, and provides suggestions and guidance for their structural optimization design, thereby improving the reliability and stability of thermoelectric devices in the actual temperature difference service environment.

[0046] Since there are many thermoelectric material systems, in this embodiment, ZrNiSn-based half-Heusler materials are selected as typical thermoelectric materials. The mechanical properties of this material change from linear elasticity to non-linear plasticity as the temperature increases, and its complexity covers common temperature-dependent linear elastic and temperature-dependent plastic models. Therefore, it is representative to select this thermoelectric material for case discussion.

[0047] Figure 1 The following is a schematic flow chart of an analysis method for thermoelectric devices considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials provided in this embodiment, which specifically includes the following steps:

[0048] Step 1: Through performance experimental tests, obtain the true temperature-dependent mechanical property curve of the thermoelectric material to be studied within a set temperature range. The mechanical property curve is a stress-strain response curve. The set temperature range covers the service temperature range of the thermoelectric material to be studied. The mechanical properties include bending properties, shear properties, compression properties or tensile properties.

[0049] In this embodiment, a ZrNiSn-based half-Heusler material is selected as a typical thermoelectric material. According to its typical service temperature and load-bearing environment, a variable-temperature compression experiment is carried out from 300 K to 1100 K to obtain the variable-temperature compression response of this thermoelectric material in a wide-temperature service environment, as Figure 2 shown.

[0050] Step 2: Using the true variable-temperature mechanical property curve of the thermoelectric material to be studied obtained in Step 1 within the set temperature range, a variable-temperature damage model of the thermoelectric material to be studied is fitted to quantitatively describe the stress-strain response of the thermoelectric material to be studied at different temperatures.

[0051] In this embodiment, the variable-temperature damage model is:

[0052]

[0053] where is the stress, is the strain, is the damage evolution factor, is the initial elastic modulus of the thermoelectric material to be studied.

[0054] According to the variable-temperature compression mechanical response of the ZrNiSn-based half-Heusler material measured in Step 1, its stress-strain curve at medium and low temperatures (300, 500, 700 K) is a linear elastic response, and the stress-strain relationship at high temperatures (900 and 1100 K) is a non-linear elastoplastic response, experiencing an elastic stage, a hardening stage, and a softening stage. Therefore, the damage evolution factor in the variable-temperature damage model is:

[0055]

[0056] where , and are intermediate variables, specifically:

[0057] , ,

[0058] represents the compressive strength of the thermoelectric material to be studied, is the corresponding strain value, is the fitting coefficient describing the stress-strain curve, is the correction coefficient. In this embodiment, when T = 900 K, 0.155, 1.063. When T = 1100 K, 0.102, 1.093

[0059] Step 3: Establish or import a thermoelectric device model to be analyzed in finite element software.

[0060] In this embodiment, Abaqus finite element analysis software is selected to establish a prismatic hot arm (4mm×4mm×8mm), copper electrode plates, and insulating ceramic plates respectively, and assemble them into a complete thermoelectric device model.

[0061] Step 4: Define the material properties of each component in the thermoelectric device model in finite element software. The material used for the hot arm component is the thermoelectric material to be studied in Step 1. The material properties of the thermoelectric material to be studied are defined by the variable temperature damage model obtained in Step 2 and embedded in the finite element software. For example, the variable temperature damage model is embedded into Abaqus finite element analysis software through a user-defined subroutine.

[0062] Step 5: In finite element software, perform a bearing performance simulation on the hot arm component in the thermoelectric device model, and judge the failure of each unit of the hot arm component to obtain the stress-strain response simulation curves of the hot arm component at several temperatures within the set temperature range.

[0063] The failure criterion selected in this embodiment is the maximum principal stress criterion, that is, when the principal stress of the thermoelectric material during loading reaches the corresponding bearing strength, the material fails and its material properties are reduced.

[0064] Step 6: Compare the stress-strain response simulation curves obtained in Step 5 with the true variable temperature mechanical property curves at the same temperature in Step 1 to obtain the curve differences at each temperature. If the curve differences at all temperatures are less than the set requirements, it is considered that the finite element simulation process in Steps 2 to 5 is accurate; otherwise, return to Step 2 to re-establish the variable temperature damage model.

[0065] In this embodiment, the curve difference is measured by the statistic of the stress difference corresponding to the same strain. For example, at a certain temperature, calculate the average value of the stress differences corresponding to the same strain within the entire strain range, and then take the average value of the average values corresponding to all temperatures. If the average value is less than the set threshold, it is considered that the finite element simulation process in Steps 2 to 5 is accurate. Figure 3 The stress-strain response curves of the prismatic hot arm under uniaxial compression at different measurement temperatures are given and compared with the true variable temperature mechanical property curves (i.e., the experimental measurement results) at the same temperature. It can be seen that the two are in good agreement, indicating that the finite element simulation process in Steps 2 to 5 is accurate, and the established variable temperature damage model can be further used for subsequent simulation analysis and optimization.

[0066] Step 7: According to the actual service temperature range of the thermoelectric device, set the thermal field boundary conditions of each component of the thermoelectric device in the finite element software, and set the load boundary conditions of each component of the thermoelectric device according to the structural constraints.

[0067] In this embodiment, as Figure 4 shown is the finite element analysis model of a typical π-type thermoelectric device. The hot arms (4 mm × 4 mm × 8 mm) are made of the aforementioned half-Heusler thermoelectric material, the electrodes are made of copper material, and the insulating ceramic plates are made of alumina ceramic material. The service temperature of the cold end of the thermoelectric device is 550 K, the service temperature of the hot end is 1050 K, and the structural constraint is that the cold end of the thermoelectric device is fixed and a compressive load is applied to the hot end.

[0068] Step 8: In the finite element software, divide the grids of the remaining components in the thermoelectric device model and assign the grid element attributes, such as the sequential or direct coupling of thermal-mechanical analysis elements, thermal-electric analysis elements, and other multi-field element types.

[0069] In Step 5, the bearing performance simulation of the hot arm component has been carried out. Here, the remaining components, including the insulating ceramic plates and electrodes, are meshed with a mesh size of 0.15 mm, and the grid element attributes are assigned.

[0070] Step 9: In the finite element software, adjust the design parameters of each component in the thermoelectric device model, analyze the bearing performance and damage evolution of the adjusted thermoelectric device, and optimize the thermoelectric device configuration with the best performance. For example, the design parameters can be the physical properties of the material, such as modulus, strength, thermal expansion coefficient, Poisson's ratio, thermal conductivity, conductivity, etc., or the geometric parameters of the components. The bearing performance can be shear bearing strength, tensile bearing strength, compressive bearing strength, structural bearing toughness, etc.

[0071] In the present invention, the performance of the thermoelectric device is considered to include structural bearing performance and thermoelectric conversion performance. Generally speaking, without considering cost and structural weight, the larger the cross-sectional area of the hot arm perpendicular to the high and low temperature directions, the better the structural bearing performance and thermoelectric conversion performance. However, in engineering practice, cost and structural weight constraints need to be considered. Therefore, the present invention uses the structural bearing performance per unit area of the cross-section of the hot arm perpendicular to the high and low temperature directions as the judgment basis, which is called the equivalent structural bearing capacity.

[0072] Then the best performance means that when the equivalent structural bearing capacity meets the requirements, the cross-sectional area of the hot arm perpendicular to the high and low temperature directions is the largest, so as to achieve the best thermoelectric efficiency. The high and low temperature directions are the connection directions of the cold and hot ends of the hot arm component.

[0073] In this embodiment, while keeping other parameters of the thermoelectric device model unchanged, the design parameter to be adjusted is the chamfer parameter of the prismatic hot arm. The chamfer radii are taken as r = 0 mm, 0.5 mm, 1.0 mm, 1.5 mm, and 2.0 mm respectively. By analyzing the load-bearing performance and damage of the thermoelectric device under different chamfer radii, the optimal chamfer configuration of the hot arm is selected.

[0074] The calculation results of the mechanical properties of the thermoelectric device and the damage diagram of the hot arm under different chamfer radii are respectively as Figure 5 and Figure 6 shown. It can be found from the Figure 5 black broken line that as the chamfer radius of the hot arm increases, the absolute structural load-bearing capacity of the thermoelectric device decreases. This is because as the chamfer increases, the absolute area borne by the hot arm decreases. However, as the chamfer radius increases, the equivalent structural load-bearing capacity of the thermoelectric device initially increases. When the chamfer radius of the hot arm is between 1.5 mm and 2.0 mm, the change in the equivalent structural load-bearing capacity is not significant. And it can be found from Figure 6 that as the chamfer size of the hot arm increases, the damage of the hot arm gradually decreases. When the chamfer radius is between 1.5 mm and 2.0 mm, the damage of the hot arm is less. The cross-sectional area of the hot arm structure with a chamfer radius of 1.5 mm is larger in the direction perpendicular to the high and low temperatures. Therefore, the hot arm structure with a chamfer radius of 1.5 mm is selected as the final optimized structure.

[0075] In this embodiment, the structural load test is the uniaxial compression performance. Therefore, the structural load-bearing capacity is the cross-sectional compression strength, and the equivalent structural load-bearing capacity is calculated according to the formula

[0076]

[0077] where is the cross-sectional area of the hot arm after chamfering in the direction perpendicular to the high and low temperatures, is the corresponding absolute structural load-bearing capacity of the thermoelectric device, and is the area of the cross-section of the hot arm after chamfering into the inscribed circle of the initial prismatic hot arm cross-section in the direction perpendicular to the high and low temperatures.

[0078] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention without departing from the principles and purposes of the present invention.

Claims

1. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials, characterized by: The following steps are involved: Step 1: Through performance experimental testing, obtain the real temperature-dependent mechanical performance curve of the thermoelectric material to be studied within the set temperature range; Step 2: Using the real temperature-dependent mechanical property curve of the thermoelectric material to be studied within a set temperature range obtained in step 1, a temperature-dependent damage model of the thermoelectric material to be studied is obtained by fitting; Step 3: Create or import the thermoelectric device model to be analyzed in the finite element software; Step 4: defining the material properties of each component in the thermoelectric device model in finite element software, wherein the material of the hot arm component is the thermoelectric material to be studied in step 1, and the material properties of the thermoelectric material to be studied are defined by the variable temperature damage model obtained in step 2; Step 5: In finite element software, the load-bearing performance of the hot arm component in the thermoelectric device model is simulated, and failure judgment is performed on each unit of the hot arm component to obtain the stress-strain response simulation curve of the hot arm component at several temperatures within the set temperature range; Step 6: Compare the stress-strain response simulation curve obtained in step 5 with the actual variable temperature mechanical property curve at the same temperature in step 1 to obtain the curve difference at each temperature. If the curve difference at all temperatures is less than the set requirement, it is considered that the finite element simulation process in step 2 to step 4 is accurate, otherwise return to step 2 and re-establish the variable temperature damage model; Step 7: According to the actual service temperature range of the thermoelectric device, set the thermal field boundary conditions of each component of the thermoelectric device in the finite element software, and according to the structural constraints, set the load boundary conditions of each component of the thermoelectric device; Step 8: In the finite element software, mesh the remaining components in the thermoelectric device model and assign mesh unit attributes; Step 9: In the finite element software, the design parameters of each component in the thermoelectric device model are adjusted, the load-bearing performance and damage analysis of the adjusted thermoelectric device are performed, and the thermoelectric device configuration with the best performance is selected.

2. According to claim 1, a thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials is characterized by: In step 1, the mechanical properties include bending properties, shear properties, compression properties or tensile properties.

3. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials according to claim 1 or 2, characterized in that: The variable temperature damage model is: in is stress, For strain, is the damage evolution factor, is the initial elastic modulus of the thermoelectric material to be studied.

4. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials according to claim 3, characterized in that: The damage evolution factor for: in , and is an intermediate variable, specifically: ， ， represents the compressive strength of the thermoelectric material to be studied, for The corresponding strain value is is the fitting coefficient describing the stress-strain curve, is the correction factor.

5. The thermoelectric device analysis method according to claim 1, wherein the thermoelectric material temperature-dependent elastic-plastic mechanical properties are considered, characterized in that: In step 6, the curve difference is measured by the statistic of the stress difference corresponding to the same strain; at a certain temperature, the average value of the stress difference corresponding to the same strain in the entire strain range is calculated, and then the average value of the average values ​​corresponding to all temperatures is taken. If the average value is less than the set threshold, it is considered that the finite element simulation process in steps 2 to 4 is accurate.

6. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials according to claim 1, characterized in that: In step 9, the optimal performance means that when the equivalent structural bearing capacity meets the requirements, the cross-sectional area of ​​the hot arm perpendicular to the high and low temperature directions is the largest; the equivalent structural bearing capacity is the structural bearing performance per unit area of ​​the cross section of the hot arm perpendicular to the high and low temperature directions.

7. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials according to claim 6, characterized in that: Equivalent structural load capacity According to the formula Calculated, where It is the cross-sectional area of ​​the hot arm after chamfering perpendicular to the high and low temperature directions. For the corresponding The absolute structural load-bearing capacity of It is the area of ​​the hot arm after the cross section perpendicular to the high and low temperature directions is chamfered into the inscribed circle of the initial prismatic hot arm cross section.

8. A thermoelectric device analysis method considering the temperature-dependent elastic-plastic mechanical properties of thermoelectric materials according to claim 6, characterized in that: In step 9, the heat arm component is initially designed as a prismatic heat arm structure, and the design parameters are the four-edge chamfer parameters of the prismatic heat arm. The optimal heat arm chamfer configuration is selected by analyzing the load-bearing performance and damage of the thermoelectric device under different chamfer radii.

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