Sensor quality inspection method, device, system and storage medium

Abstract

The present application relates to the field of sensor technology, and discloses a sensor quality inspection method, device, system and storage medium, which are used to realize flexible quality inspection of wireless sensors using a repeater and a host computer to adapt to different testing requirements. The sensor quality inspection method includes: presenting the sensor status data reported by the repeater through the host computer; when there are defective products in the current test batch, selecting a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state; and determining whether the target sensor is a good product or a defective product based on whether the sensor state displayed in the host computer follows the change of the first target measure scheme.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a sensor quality inspection method, device, system and storage medium. Background Art

[0002] In modern industrial and life applications, sensors based on wireless radio frequency technology are widely used to monitor various parameters, such as temperature, humidity, etc. In order to ensure product quality, multiple quality inspection links need to be set up in the production process to screen out defective products such as short data broadcast distance and abnormal data collection, so as to prevent defective products from being circulated to the next link.

[0003] Based on different market demands, products usually include semi-finished products and finished products. Semi-finished products are usually sent to downstream manufacturers in the form of circuit boards to facilitate assembly, integration or secondary development by downstream manufacturers. However, the RF solutions used by some wireless sensors cannot be recognized by general devices such as tablets and mobile phones. For example, sensors using 433MHz RF solutions can only be tested by dedicated quality inspection equipment, which is expensive and large in size. Traditional sensor quality inspection methods have high requirements for test environment construction and low flexibility, making it difficult to adapt to different test needs. Summary of the invention

[0004] The present application provides a sensor quality inspection method, device, system and storage medium for implementing flexible quality inspection using a repeater and a host computer to meet different testing requirements.

[0005] The first aspect of the present application provides a sensor quality inspection method, including: presenting sensor status data reported by a repeater through a host computer; when there are defective products in a current test batch, selecting a target sensor from the current test batch to execute a first target measure scheme for changing the sensor status; and determining whether the target sensor is a good product or a defective product based on whether the sensor status displayed in the host computer follows the changes of the first target measure scheme.

[0006] The second aspect of the present application provides a sensor quality inspection device, including: a display module, used to present sensor status data reported by a repeater through a host computer; a processing module, used to select a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state when there are defective products in the current test batch; a screening module, used to determine whether the target sensor is a good product or a defective product based on whether the sensor state displayed in the host computer follows the changes of the first target measure scheme.

[0007] The third aspect of the present application provides a sensor quality inspection system, comprising: a memory and at least one processor, wherein the memory stores instructions; the at least one processor calls the instructions in the memory so that the sensor quality inspection system executes the above-mentioned sensor quality inspection method.

[0008] A fourth aspect of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores instructions, which, when executed on a computer, enable the computer to execute the above-mentioned sensor quality inspection method.

[0009] In the technical solution provided by the present application, the status data of each sensor reported by the repeater is presented intuitively by the host computer, and the quality inspector can observe the sensor status of the quality inspection in real time, quickly locate the defective products, and improve the efficiency of quality inspection. Compared with the dedicated quality inspection equipment, the host computer of the present application is a general device, and the repeater is one of the sensor component products. After the test is completed, the repeater used for the test can be directly sold as a product, which greatly reduces the equipment cost and the requirements for building the test environment, and saves the cost of the manufacturing link. According to whether the sensor state displayed as a defective product in the host computer follows the change of the first target measure scheme, the defective products can be effectively screened out in multiple processes. The defective products in the semi-finished probe and the finished probe are avoided, thereby reducing the waste of materials and the loss of working hours, and improving production efficiency and product quality. It is not only suitable for the quality inspection of finished sensors, but also suitable for the testing of semi-finished circuit boards, which can meet the needs of different markets and production links, and improve the flexibility and applicability of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the first embodiment of the sensor quality inspection method in this application;

[0011] Figure 2 This is a schematic diagram of a second embodiment of the sensor quality inspection method in this application;

[0012] Figure 3 A schematic diagram of the structure of the temperature measurement component in this application;

[0013] Figure 4 A schematic diagram of a structural frame of the repeater of the present application;

[0014] Figure 5 This is a schematic diagram of a third embodiment of the sensor quality inspection method in this application;

[0015] Figure 6 A schematic diagram of an embodiment of a sensor quality inspection device in the present application;

[0016] Figure 7 It is a schematic diagram of another embodiment of the sensor quality inspection device in the present application;

[0017] Figure 8 A schematic diagram of an embodiment of a sensor quality inspection system in the present application. DETAILED DESCRIPTION

[0018] The present application provides a sensor quality inspection method, device, system and storage medium, which are used to solve the technical problems that traditional sensor quality inspection methods have high requirements for test environment construction, low flexibility, and difficulty in adapting to different test requirements.

[0019] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" or "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0020] For ease of understanding, the specific process of this embodiment is described below. Figure 1 , an embodiment of the sensor quality inspection method in the present application includes:

[0021] 101. The sensor status data reported by the repeater is presented through the host computer.

[0022] The host computer of this embodiment is a general device such as a mobile phone or a tablet. The host computer includes a display and a controller. The display is used to visualize the sensor status data reported by the repeater; the controller is used to execute the sensor quality inspection method of this application.

[0023] The host computer of this embodiment can only display the sensor status data corresponding to the good products in the current test batch; it can also display all the sensor status data in the current test batch, that is, the host computer presents both the sensor status data corresponding to the good products and the sensor status data corresponding to the defective products.

[0024] Among them, the display scheme that only displays good products can make a preliminary judgment on the initial sensor status data reported by the repeater through the upper computer, so as to selectively present the sensor status data of some sensors in the current test batch; while the display scheme that displays good and defective products directly presents the sensor status data of all sensors reported by the repeater.

[0025] This embodiment provides a repeater, including a first communication unit and a second communication unit, and the sensor to be tested includes a third communication unit.

[0026] The first communication unit is communicatively connected to the third communication unit, the repeater receives the sensor status data through the first communication unit, the second communication unit is communicatively connected to the host computer, and the repeater forwards the sensor status data to the host computer through the second communication unit.

[0027] The first communication unit and the third communication unit are set to use a wireless radio frequency solution to achieve communication connection. The radio frequency solution used by some wireless sensors cannot be recognized by general devices such as tablets and mobile phones. For example, sensors using a 433MHz radio frequency solution, this embodiment uses a repeater to forward sensor status data. The second communication unit of the repeater uses Bluetooth, low-power Bluetooth and USB to communicate with the host computer, and forwards the sensor status data to the host computer for inspection.

[0028] The sensor of this embodiment can be any sensor such as a temperature sensor, a humidity sensor, a gas concentration sensor, a pressure sensor, etc., which transmits the measured environmental parameters through wireless radio frequency technology. This embodiment does not impose any specific restrictions on the type of sensor and the specific number of acquisition units.

[0029] Among them, the sensor status data may include the collected measured environmental parameters and sensor working parameters; the measured environmental parameters are environmental parameters collected by the sensor. For example, if the sensor is a food temperature probe, the measured environmental parameters are temperature, and the sensor working parameters are parameter information of the sensor itself, such as charging status, power-on status, sleep status, battery power, battery voltage, charging time, charging stop time, etc.

[0030] Specifically, the quality inspection program is started in the host computer and the repeater is connected. The sensors to be tested in the current test batch are taken out of the shielding box. The host computer sends a command to let the repeater find the sensors to be tested. The repeater reports the status data of each sensor in the current test batch and presents it on the display of the host computer.

[0031] Each test batch may include one or more sensors to be tested, that is, the quality inspection method of this embodiment is performed on one or more sensors to be tested at the same time.

[0032] 102. When there are defective products in the current test batch, select a target sensor from the current test batch to execute a first target measure plan for changing the sensor state.

[0033] Optionally, when there are defective products in the current test batch, a target sensor is selected from the current test batch to execute a first target measure scheme for changing the sensor state, wherein the first target measure scheme includes at least one target measure.

[0034] The above-mentioned target measures are used to indicate operations for changing the state of the sensor, including operations such as charging state change measures and environmental parameter change measures.

[0035] The charging state change measure is used to indicate an operation of changing the charging state of the sensor, such as placing the sensor into the charging compartment, taking the sensor out of the charging compartment, and alternately placing and taking the sensor out according to a certain rule.

[0036] Among them, the environmental parameter change measures are used to indicate the operation of changing the environmental parameters collected by the sensor. For example, for the food temperature probe, the environmental parameter change measures are the environmental temperature change measures, including but not limited to heating operations and / or cooling operations. It can also be based on a certain temperature change rate, set a corresponding target temperature, and control the temperature to show a certain regular change operation, etc.

[0037] It is understandable that the host computer can confirm whether there are defective products in the current test batch based on the sensor status data reported by the repeater. The user needs to further perform steps 102-103 to accurately screen out defective products to prevent them from flowing into the next process.

[0038] 103. Determine whether the target sensor is a good product or a defective product according to whether the sensor state displayed in the upper computer follows the change of the first target measure plan.

[0039] In this embodiment, whether the sensor state follows the judgment method can be determined by whether the sensor state displayed on the host computer is consistent with the implementation process changes of the first target measure plan; it can also be directly determined by whether the sensor state displayed on the host computer has the target state characteristics corresponding to the first target measure plan.

[0040] It can be understood that, according to the display scheme adopted by the host computer, a corresponding screening scheme can be selected to accurately screen out defective products in the current test batch: for the display scheme in which the host computer only presents good products, if the displayed sensor state changes, it can be said that the target sensor executing the target measure is a good product. If the displayed sensor state does not change, it means that the target sensor executing the target measure is a defective product; and for the display scheme in which the host computer presents good and defective products, screening can be performed according to the marks of each sensor in the host computer, as follows:

[0041] Exemplarily, the host computer only presents sensor status data corresponding to good products. The above-mentioned determination of whether the target sensor is a good product or a defective product based on whether the sensor status displayed in the host computer changes with the first target measure scheme includes: if the sensor status displayed in the host computer changes with the first target measure scheme, then the target sensor is determined to be a good product; otherwise, the target sensor is determined to be a defective product.

[0042] Exemplarily, the host computer presents all sensor status data, and the above-mentioned determining whether the target sensor is good or defective according to whether the sensor status displayed in the host computer follows the change of the first target measure scheme includes: determining that the sensor whose sensor status follows the change of the first target measure scheme is marked as good or defective in the host computer; if it is marked as good, determining that the target sensor is good; if it is marked as defective, determining that the target sensor is defective.

[0043] Exemplarily, the host computer presents all sensor status data, and the above-mentioned determination of whether the target sensor is a good product or a bad product based on whether the sensor status displayed in the host computer follows the change of the first target measure scheme includes: if the sensor status displayed as a bad product in the host computer follows the change of the first target measure scheme, then the sensor to be tested that executes the first target measure scheme is determined to be a bad product; otherwise, it is determined to be a good product. In this embodiment, the sensor status displayed as a bad product by the host computer follows the change of the first target measure scheme, which can accurately and quickly determine whether the target sensor that executes the target measure is a bad product.

[0044] It should be further explained that defective sensors may have various anomalies, such as one or more types of anomalies such as too short data broadcast distance, abnormal environmental parameter collection or abnormal charging. If quality inspection is performed based on the sensor status displayed as a defective product, the first target measure solution should be determined based on the type of abnormality checked to avoid the sensor status from failing to follow the target measure changes due to the abnormality of the defective product itself. That is, if screening is performed based on the sensor status of the defective product displayed by the host computer, the first target measure solution is determined based on the type of abnormality checked, that is, the target measure type in the first target measure solution must be different from the type of abnormality checked. However, if quality inspection is performed based on the sensor status displayed as a good product, the type of target measure in the first target measure solution is not limited. For example, the first target measure solution can include environmental parameter change measures and / or charging status change measures.

[0045] The following are two examples of quality inspection using sensor status marked as defective:

[0046] For example, when troubleshooting charging anomalies, the ambient temperature change measure is selected as the first target measure for quality inspection, and defective products can be screened out according to the sensor status displayed as defective products and the ambient temperature change measure changes.

[0047] For another example, when troubleshooting environmental parameter collection anomalies, the charging state change measure is selected as the first target measure scheme for quality inspection, and defective products can be screened out according to the sensor state displayed as defective products and the charging state change measure changes.

[0048] When quality inspection is performed based on the status of the sensor displayed as a good product, it is only necessary to determine whether the sensor status corresponding to the good product displayed in the host computer is consistent with the first target measure plan to determine whether the target sensor is a good product.

[0049] Exemplarily, the host computer presents all sensor status data, and the above-mentioned determination of whether the target sensor is good or defective according to whether the sensor status displayed in the host computer follows the change of the first target measure scheme includes: if the sensor status displayed as good in the host computer follows the change of the first target measure scheme, then the sensor to be tested that executes the first target measure scheme is determined to be good; otherwise, it is determined to be defective.

[0050] It should be further explained that for sensors that use solutions that cannot be directly recognized by general devices such as tablets and mobile phones, such as sensors using 433MHz radio frequency solutions, the repeater is part of the product. After the test is completed, the repeater used for testing can be upgraded over the air through Bluetooth, USB, etc. based on Over-The-Air (OTA) technology, and directly converted into a product for sale, saving the cost of the manufacturing process. If large-scale rapid testing is required, the method provided in this application can also be implemented in a dedicated test device to perform simultaneous testing of multiple devices, which can be applied to various testing needs.

[0051] In this embodiment, the sensor state is intuitively presented by the host computer, and the quality inspector can observe the sensor state of the quality inspection in real time through the host computer, quickly locate defective products, and improve the quality inspection efficiency. Compared with special quality inspection equipment, the host computer of this embodiment is a general device, and the repeater is one of the sensor component products. After the test is completed, the repeater used for the test can be directly sold as a product, which greatly reduces the equipment cost and the requirements for setting up the test environment, and saves the cost of the manufacturing link. According to whether the sensor state displayed in the host computer follows the change of the first target measure plan, it is determined whether the target sensor is a good product or a defective product. It can effectively screen out defective products in semi-finished probes and finished probes in multiple processes, avoiding defective products from flowing into the next process, thereby reducing material waste and time loss, and improving production efficiency and product quality. It is not only suitable for the quality inspection of finished sensors, but also suitable for the testing of semi-finished circuit boards, which can meet the needs of different markets and production links, and improve the flexibility and applicability of the test.

[0052] See also Figure 2 , the second embodiment of the sensor quality inspection method in this application is described:

[0053] 201. Execute a second target measure plan for sensors to be tested in a current test batch.

[0054] It can be understood that the second target measure scheme is used to indicate at least one target measure taken when performing preliminary quality inspection on all sensors to be tested in the current test batch, while the first target measure scheme is used to indicate at least one target measure taken when performing precise quality inspection on the target sensor.

[0055] In this embodiment, the current test batch is firstly tested through the second target measure scheme, that is, steps 201-203 to quickly confirm whether there are defective products at present. When there are no defective products in the current test batch, the next batch can be directly tested; when there are defective products in the current test batch, the target sensor is tested again through the first target measure scheme, that is, steps 204-208 to accurately screen out all defective products.

[0056] The first target measure scheme and the second target measure scheme may be the same or different in at least one target measure adopted by the first target measure scheme and the second target measure scheme according to the display scheme selected by the host computer. Specifically, for the scheme in which the host computer only displays good products, or the host computer displays good products and defective products, but performs quality inspection based on the sensor status displayed as good products, the first target measure scheme and the second target measure scheme may be the same or different; and for the host computer displays good products and defective products, but performs quality inspection based on the sensor status displayed as defective products, the first target measure scheme and the second target measure scheme are different, wherein the second target measure scheme sets the target measures by testing one or more abnormal types, while the first target measure scheme selects different target measures according to the abnormal types checked, such as the second target measure scheme checks for abnormal environmental parameter collection and takes environmental temperature change measures, and when there is abnormal environmental parameter collection in the current test batch, the first target measure scheme is set as charging change measures to filter out defective products with abnormal environmental parameter collection.

[0057] In this embodiment, the second target measure scheme can be set to a target measure that is relatively simple to execute on the current test batch and can perform quality inspection on all sensors at one time, such as an environmental parameter change measure that can achieve a change in the sensor state parameters of the entire batch, while the first target measure scheme can be set to execute more complex and targeted target measures on the target sensors, such as a charging state change measure that can improve the specificity of the target state characteristics, and formulate a target measure strategy with richer feature dimensions to achieve simultaneous quality inspection of multiple target sensors.

[0058] Exemplarily, charging state change measures are executed for the sensors to be tested in the current test batch, and the state data of each sensor is reported through the repeater.

[0059] Exemplarily, environmental parameter change measures are performed on the sensors to be tested in the current test batch, and the status data of each sensor is reported through the repeater. This embodiment performs preliminary quality inspection of all sensors in the current test batch through environmental parameter change measures, and its operation is relatively simple.

[0060] Exemplarily, charging state change measures and environmental parameter change measures are executed on the sensors to be tested in the current test batch, and the state data of each sensor is reported through the repeater.

[0061] 202. Determine whether there are defective products in the current test batch according to the second target measure plan and the status data of each sensor.

[0062] Specifically, it is determined whether the state data of each sensor in the current test batch all have the target state characteristics corresponding to the second target measure solution; if so, it is determined that the current test batch is all good products; if not, it is determined that there are defective products in the current test batch.

[0063] Among them, the target state characteristics corresponding to the second target measure scheme correspond to at least one target measure selected by it, for example, if the second target measure scheme is a charging state change measure, the sensor state corresponding to the good product should have the corresponding charging state change characteristics; if the second target measure scheme is an environmental parameter change measure, the sensor state corresponding to the good product should have the corresponding environmental parameter change characteristics; if the second target measure scheme is a charging state change measure and an environmental parameter change measure, the sensor state corresponding to the good product should have the corresponding charging state change characteristics and environmental parameter change characteristics. And the order of occurrence, duration, and change rules of each state characteristic in the above target state characteristics all correspond one-to-one to the target measures executed in the second target measure scheme.

[0064] Exemplarily, the second target measure is an environmental parameter change measure, and it is determined whether the measured environmental parameters in the state data of each sensor in the current test batch are within the deviation threshold range of the environmental parameter change measure; if so, it is determined that the current test batch is good, otherwise it is determined that there are defective products in the current test batch. This embodiment realizes batch quality inspection through environmental parameter change measures, thereby improving the efficiency of preliminary quality inspection.

[0065] Optionally, before judging whether the status data of each sensor in the current test batch has the target status characteristics of the second target measure scheme, it also includes: judging whether all the sensors to be tested in the current test batch are reported; if all the sensors to be tested have been reported, then continue to judge whether they have the target status characteristics of the second target measure scheme; if all the sensors to be tested have not been reported, it is determined that there are defective products in the current test batch. In this embodiment, the upper computer judges whether the number of sensors reported is consistent with the number of sensors in the current test batch. If they are not consistent, it can be determined that there are defective sensors in the current test batch that have abnormal connection with the repeater or have not reported the sensor status to the repeater. For this abnormality, quality inspection is performed based on the sensor status displayed as good products to screen out all good products, and the remaining ones are confirmed to be defective products to ensure the reliability of quality inspection.

[0066] 203. The status data of each sensor of the current test batch reported by the repeater is presented through the host computer.

[0067] In actual applications, when the host computer performs preliminary quality inspection on all sensors in the current test batch, it can display only good products or display both good and bad products. Steps 203-208 are described using the example of displaying both good and bad products on the host computer.

[0068] Specifically, all sensors of the current test batch reported by the repeater are presented through the host computer, and the host computer can mark good products and defective products in the current test batch according to the second target measure solution.

[0069] 204. When there are defective products in the current test batch, a target number of sensors to be tested in the current test batch are determined as target sensors.

[0070] Specifically, when there are defective products in the current test batch, a target number of target sensors are arbitrarily selected in the current test batch to perform subsequent accurate screening of defective products.

[0071] The above-mentioned target number can be a preset fixed value, or the target number can be determined according to the sensors to be tested in each test batch, or the target number can be determined according to the number of marked defective products, etc. The target number can be one, two or more, and this embodiment does not impose any specific restrictions.

[0072] 205. Execute the same or different first target measure schemes on each target sensor to obtain target state characteristics corresponding to each target sensor.

[0073] In this embodiment, the type of target measure in the first target measure solution is different from the type of abnormality to be checked, and the first target measure solution includes at least one target measure.

[0074] In this embodiment, the target measures include but are not limited to charging state change measures and environmental parameter change measures, wherein the charging state change measures can change the charging state of the target sensor, and the environmental parameter change measures can change the environmental parameters collected by the target sensor.

[0075] It can be understood that when quality inspection is performed on a target number of target sensors, a different targeted target measure scheme can be set for each sensor to be tested to achieve simultaneous quality inspection of multiple sensors to be tested; or the same target measure scheme can be executed on the target number of sensors to be tested to simplify the operation, and when defective products are determined to be present among the target number of target sensors, the defective products can be further determined.

[0076] Optionally, the same first target measure solution is executed on each target sensor to obtain target state characteristics corresponding to each target sensor, and the target state characteristics corresponding to each target sensor are the same. This embodiment can reduce the complexity of target measure operations for multiple target sensors by executing the same measure on a target number of target sensors.

[0077] Exemplarily, two target sensors are selected to execute the same environmental parameter change measure, and target state characteristics corresponding to each target sensor are obtained, and the environmental parameter change characteristics corresponding to each target sensor are the same.

[0078] Optionally, a different first target measure scheme is executed on each target sensor to obtain a target state feature corresponding to each target sensor, and the target state feature corresponding to each target sensor is different.

[0079] The above-mentioned different first target measure schemes can be a target measure in which multiple measure parameters are set, such as setting multiple environmental parameters to achieve simultaneous quality inspection of multiple sensors to be tested; it can also be a combination of multiple target measures, such as selecting two target sensors, which are called the first sensor and the second sensor for easy distinction; executing charging state change measures on the first sensor and environmental parameter change measures on the second sensor; it can also be any combination of the first target measure scheme and at least one measure parameter to further enhance the richness of the target measure scheme.

[0080] Exemplarily, the first sensor is charged for a first preset time to obtain a first charging time characteristic; the second sensor is charged for a second preset time to obtain a second charging time characteristic.

[0081] 206. Determine whether the sensor state displayed as a defective product has a target state feature corresponding to the first target measure solution.

[0082] In this embodiment, the target state characteristics are used to indicate the change characteristics of the sensor state data. The target state characteristics corresponding to the first target measure scheme correspond to at least one target measure type, measure parameters, execution sequence, measure duration, and measure change law taken in the first target measure scheme.

[0083] In this embodiment, the target state characteristics corresponding to the first target measure scheme include at least one charging state change characteristic and / or at least one environmental parameter change characteristic, wherein the charging state change characteristics include but are not limited to charging measure parameter characteristics, charging measure duration characteristics, and charging measure change law characteristics; the environmental parameter change characteristics include but are not limited to environmental parameter characteristics, environmental parameter change law characteristics, and environmental change measure duration characteristics; the target state characteristics may also include any combination of the start and end times of the above characteristics, the order of occurrence of the above characteristics, and the like.

[0084] 207. If not, the target sensor is determined to be a good product.

[0085] If the sensor state displayed as a defective product does not show the target state characteristics corresponding to the first target measure solution, that is, the sensor state displayed as a defective product does not change with the first target measure solution, it is determined that there are no defective products in the target sensor currently executing the first target measure solution.

[0086] Optionally, after determining the target sensor as a good product in the above-mentioned if-not condition, the process further includes: determining whether there are still defective products in the current test batch; if so, returning to the above-mentioned step 204 .

[0087] 208. If so, the target sensor is determined to be a defective product.

[0088] If the sensor state displayed as a defective product shows the target state feature corresponding to the first target measure solution, that is, the sensor state displayed as a defective product changes with the first target measure solution, it is determined that there is a defective product in the target sensor currently executing the first target measure solution.

[0089] Continuing with the example of executing different charging state change measures on each target sensor in the previous step 205, it is determined whether the sensor state displayed as a defective product in the upper computer shows the first charging time characteristic and / or the second charging time characteristic; if the first charging time characteristic appears, the first sensor is determined as a defective product; if the second charging time characteristic appears, the second sensor is determined as a defective product; if the first charging time characteristic and the second charging time characteristic appear, both the first sensor and the second sensor are determined as defective products; if neither of them appears, return to step 204 until it is determined that there are no defective products in the current test batch.

[0090] After the target sensor is determined as a defective product in the above-mentioned "if yes", the method further includes: when there are still defective products in the current test batch, reselecting the target sensor to execute the first target measure solution and testing until all defective products in the current test batch are determined.

[0091] In this embodiment, the second target measure scheme is first executed on the current batch to determine whether there are defective products in the current test batch. When there are no defective products in the current test batch, the quality inspection of the next batch can be quickly entered, thereby improving the speed of batch quality inspection. The host computer intuitively presents all sensor status data reported by the repeater, and the quality inspector can observe the sensor state change process of good or defective products in the quality inspection process in real time, quickly locate defective products, and improve the efficiency of quality inspection. When there are defective products in the current test batch, the first target measure scheme is executed on each selected target sensor, and the defective products are screened by whether the sensor state marked as defective products in the host computer has the target state characteristics. The defective products in the semi-finished probes and finished probes can be effectively screened out in multiple processes, thereby avoiding the flow of defective products into the next process, thereby reducing material waste and time loss, and improving production efficiency and product quality. Compared with special quality inspection equipment, the host computer of this embodiment is a general-purpose device, and the repeater is one of the sensor component products. After the test is completed, the repeater used for testing can be directly sold as a product, which greatly reduces the equipment cost and the requirements for setting up the test environment, and saves the cost of the manufacturing link. The sensor quality inspection method of this embodiment is not only applicable to the quality inspection of finished sensors, but also to the testing of semi-finished circuit boards. It can meet the needs of different markets and production links and improve the flexibility and applicability of the test.

[0092] During the cooking process, monitoring the temperature inside the food is particularly important for determining whether the food has reached the target maturity temperature. Usually, the food temperature probe of the temperature measurement component is inserted into the food, and the temperature data collected by the food temperature probe is transmitted to the terminal based on wireless radio frequency technology. However, the radio frequency scheme used by some wireless food temperature probes cannot be recognized by general devices such as tablets and mobile phones. For example, the food temperature probe using the 433MHz radio frequency scheme usually uses a temperature measurement component composed of a food temperature probe and a repeater as a temperature measurement product. Therefore, in order to realize flexible quality inspection of semi-finished and finished food temperature probes, the third embodiment of the sensor quality inspection method of this application is described by taking the temperature measurement component as an example.

[0093] See also Figure 3 A temperature measuring component is provided. The temperature measuring component 300 of this embodiment includes a repeater 31 and a food temperature probe 32. The repeater 31 is provided with at least one charging compartment, such as Figure 3 The repeater 31 is provided with a charging compartment 311 , and the food temperature probe 32 can be charged by being placed in the charging compartment 311 .

[0094] Repeater 31 can forward the received probe data to the host computer via radio frequency, see Figure 4 A structural block diagram of a repeater is shown, the repeater comprises an output charging unit 401 and a first communication unit 402, the output charging unit 401 is used to charge the food temperature probe, and the first communication unit 402 is used to receive probe status data.

[0095] The above-mentioned repeater also includes a repeater control unit 403, such as a microcontroller unit (MCU) and a second communication unit 404. The repeater control unit 403 is electrically connected to the output charging unit 401, the first communication unit 402 and the second communication unit 404 respectively to realize the repeater control. The second communication unit 404 is communicated with the host computer for reporting the food temperature probe status data, wherein the host computer can be a mobile phone, a computer, a tablet computer, etc.

[0096] The repeater control unit 403 can obtain the food temperature probe status data through the first communication unit, and forward it to the terminal through the second communication unit 404 to realize the forwarding function of the repeater.

[0097] The above-mentioned repeater control unit 403 can obtain the output charging data when the output charging unit 401 charges the power storage unit through the detection unit, and compare it with the food temperature probe status data obtained by the first communication unit 402 to achieve matching between the food temperature probe and the repeater, wherein the output charging data can be the charging voltage, charging current, charging amount, charging time, charging stop time, etc.

[0098] In this embodiment, the food temperature probe includes a collection unit, a third communication unit and a power storage unit. The power storage unit supplies power to the collection unit and the third communication unit respectively. The collection unit is used to collect the current measured environmental parameters; the third communication unit uses wireless radio frequency technology to broadcast the food temperature probe status data to the outside.

[0099] The food temperature probe of this embodiment is internally provided with a battery, a temperature sensor, a circuit board and a wireless transmitter, wherein the temperature sensor is used to measure the temperature of food, the battery is used to power the circuit board, and the wireless transmitter is used to broadcast the temperature signal measured by the temperature sensor in the form of a wireless signal.

[0100] A probe control unit is arranged on the circuit board, and the probe control unit includes a detection circuit to detect current battery status data. The wireless transmitter includes a third communication unit connected to the circuit board, and an antenna connected to the radio frequency circuit, and the antenna is used to transmit the probe status data.

[0101] The battery is a power storage unit such as a rechargeable supercapacitor or a rechargeable lithium battery, and is charged through charging contacts arranged on the battery; when the food temperature probe is placed in the charging compartment of the repeater, the charging contacts of the battery are electrically connected to the charging contacts in the charging compartment.

[0102] The temperature sensor may include one, two or more, for example, two temperature acquisition units are arranged according to the axis direction of the probe, wherein the first temperature sensor is used to acquire the internal temperature of the food, and the second temperature sensor is used to acquire the internal temperature of the cooking vessel, such as the internal temperature of the oven.

[0103] The probe is a rechargeable temperature detection device that contains two temperature detection sensors, which detect the temperature of the top and bottom of the probe respectively, and transmit the temperature data to other devices through radio frequency signals. During the test, good and bad products can be identified by changing the temperature of each temperature sensor of the probe or changing the charging status.

[0104] Refer to the following Figure 5 The third embodiment of the sensor quality inspection method of the present application is described as follows:

[0105] 501. Perform environmental temperature change measures on the food temperature probes of the current test batch, and report the status data of each probe through the repeater.

[0106] It can be understood that whether the temperature collection in the temperature measurement component is abnormal is a key quality inspection procedure. In this embodiment, the second target measure scheme is set as an ambient temperature change measure to determine whether there is a food temperature probe with abnormal temperature collection in the current test batch.

[0107] In this embodiment, the environmental temperature change measure is used to indicate the operation of changing the environmental temperature of the food temperature probe, such as raising the temperature to the target temperature, lowering the temperature to the target temperature, and controlling the temperature change according to a certain rule.

[0108] Optionally, the food temperature probe of the current test batch is heated to the target temperature to obtain the temperature change characteristics, control the repeater to find the probe, and report the status data of each probe through the repeater.

[0109] Optionally, the food temperature probe of the current test batch is cooled to the target temperature, the temperature change characteristics are obtained, the repeater is controlled to find the probe, and the status data of each probe is reported through the repeater.

[0110] Optionally, the ambient temperature of the food temperature probes of the current test batch is controlled to change according to the target temperature change law, the temperature change characteristics are obtained, the repeater is controlled to find the probes, and the status data of each probe is reported through the repeater.

[0111] Specifically, the current test batch is placed in a temperature control device, and any one of the above-mentioned environmental temperature change measures is performed by adjusting the temperature of the temperature control device.

[0112] 502. Determine whether there are defective products in the current test batch.

[0113] Specifically, determine whether there is a probe state without temperature change characteristics in the probe status data reported in the current test batch, that is, determine whether the reported probe status data presents one or more characteristics such as the ambient temperature, change pattern, and change duration corresponding to the ambient temperature measure.

[0114] Optionally, it is determined based on the status data of each probe reported by the repeater whether the actually measured ambient temperature in the status data of each probe is within a deviation threshold range of the target temperature.

[0115] For example, assuming the target temperature is 40°C and the deviation threshold is 1°C, the receiving repeater determines whether there are bad probes with temperatures below 39°C or above 41°C in the probe status data found by the repeater.

[0116] It can be understood that the above steps 501-502 can be presented on the display of the host computer to facilitate observation of the preliminary quality inspection process; the judgment can also be performed directly in the background of the host computer, that is, only the preliminary quality inspection results are displayed in the host computer: if there are no defective products in the current test batch, the prompt information such as the current test batch passed is directly displayed, and step 503 is executed; if there are defective products in the current test batch, the host computer can only display good products; it can also display good products and defective products to facilitate viewing the actual situation of the defective products; it can also display good products and some defective products according to certain rules, such as displaying all good probes (that is, 39°C-41°C) and defective probes above 35°C.

[0117] 503. If not, control the repeater to stop discovering the probe.

[0118] Specifically, if each probe status data has a temperature change characteristic, that is, the measured ambient temperature in each probe status data is within the deviation threshold range of the target temperature, it is determined that the current test batch is good, and the control repeater stops discovering probes.

[0119] Optionally, determine whether to conduct a temperature probe quality inspection of the next batch of food. If so, re-execute the above step 501; if not, end.

[0120] 504. If yes, then select a target food temperature probe to execute a charging state change measure to obtain a charging state change characteristic.

[0121] It can be understood that there are food temperature probes with abnormal temperature collection in the current test batch. Since the environmental temperature change measure is usually to place all the probes in the current test batch in a constant temperature device, even if the host computer shows that there are defective products with temperature collection, it is still necessary to further distinguish between good and defective products. Therefore, this embodiment sets the first target measure scheme as the charging status change measure to screen out the defective probes with abnormal temperature collection.

[0122] Specifically, if there is at least one probe status data that does not have temperature change characteristics, that is, there is at least one measured ambient temperature in each probe status data that is not within the deviation threshold range of the target temperature, it is determined that there are defective products in the current test batch; a target food temperature probe is selected in the current test batch to execute charging status change measures.

[0123] In this embodiment, the charging status change measure is used to indicate an operation of changing the charging status of the food temperature probe, such as placing the probe into the charging compartment, taking the probe out of the charging compartment, and placing and taking the probe in alternatingly according to a certain rule.

[0124] In this embodiment, the charging state change feature is used to indicate the charging state change characteristics of the food temperature probe caused by the execution of the charging state change measure. The charging state change feature includes but is not limited to the charging measure parameter feature, the charging measure duration feature, the charging measure change rule feature, etc., such as charging voltage, charging duration, charging amount, charging rate, charging frequency, etc.

[0125] Optionally, a target food temperature probe is selected in the current test batch and placed in the charging compartment of the repeater. In this embodiment, by checking whether the information of the defective probe displayed in the host computer is in a charging state, it is possible to quickly confirm whether the target food temperature probe is defective. Compared with changing the ambient temperature, the test results can be obtained more quickly through hardware.

[0126] Optionally, the target food temperature probe is charged and stopped alternately, and the charging state and the stop charging state are encoded to obtain a charging state change coding sequence; the charging state change coding sequence is determined as the charging state change feature. In this embodiment, the charging state change coding sequence is used as the charging state change feature. As the number of selected target food probes increases and the matching accuracy requirements increase, more complex charging state change coding sequences can be formulated for each target food probe for simultaneous quality inspection. This has high flexibility and can be applied to large-scale simultaneous quality inspection requirements in workshops.

[0127] It is understandable that in this embodiment, multiple target food temperature probes may be selected to execute different charging state change measures to achieve simultaneous quality inspection, and the charging state change measure strategy may be a combination of any one or more of the above operations.

[0128] Optionally, each food temperature probe is charged according to a different charging time, and the charging time corresponding to each food temperature probe is determined as a charging state change feature. For example, charging for 500ms, 1000ms, 1500ms, and 2000ms is performed respectively to achieve simultaneous quality inspection of four food temperature probes. This embodiment achieves batch quality inspection through multiple measure parameters of a charging measure, thereby ensuring quality inspection speed and accuracy.

[0129] It can be understood that the present embodiment can also perform charging state change measures and / or ambient temperature change measures on the selected target food temperature probe to identify defective products. The food temperature probe of the present embodiment may include multiple temperature sensors arranged along the axial direction. The execution of ambient temperature change measures on the food temperature probe can achieve the goal of setting different target temperatures for each temperature sensor through temperature isolation measures. The defective products can be identified by changing the charging state of the food temperature probe, the temperature of each temperature sensor on the probe, or even combining the changes of the three according to a certain rule. This embodiment will not be repeated here.

[0130] 505. Determine whether the target food temperature probe is a defective product.

[0131] Taking the display of defective products and good products in the host computer as an example, determine whether the state of the probe marked as a defective probe in the host computer has the characteristics of a charging state change, such as whether the state of the probe marked as a defective probe is in a charging state.

[0132] 506. If not, replace the probe and execute the above step 504.

[0133] Specifically, if the states of the probes marked as bad probes do not have the characteristics of charging state change, it is determined that the target food temperature probe is good, and the target food temperature probe is replaced in the above step 504.

[0134] 507. If yes, the target food temperature probe is determined to be a defective product and the above step 502 is executed.

[0135] Specifically, if the state of the probe marked as a defective probe has the characteristic of a charging state change, the target food temperature probe is determined to be a defective product, and it is determined whether there are still defective products in the current test batch. If so, the target food temperature probe is reselected and the above step 504 is executed; if not, it is determined whether to conduct quality inspection on the next batch of food temperature probes. If so, the above step 501 is re-executed, and if not, the process ends.

[0136] In this embodiment, the status data of each probe reported by the repeater is intuitively presented by the host computer, and the quality inspectors can observe the status of the quality inspection probes in real time, quickly locate defective products, and improve the quality inspection efficiency. The environmental temperature change measures are first performed on the food temperature probes of the current batch, and the comparison of all food temperature probes in the current batch can be achieved at the same time, so that it can be more intuitive and efficient to determine whether there are defective products in the current test batch. When there are no defective products in the current test batch, the quality inspection of the next batch can be quickly entered, thereby improving the batch quality inspection speed; when there are defective products in the current test batch, the charging status change measures are performed on each selected target food temperature probe, and the charging status change measures can more quickly determine whether the target food temperature probe is a defective product; defective products are screened by determining whether the state of the probes marked as defective products in the host computer shows the target state characteristics, which can effectively screen out defective products in semi-finished product probes and finished product probes in multiple processes, avoiding the flow of defective products into the next process, thereby reducing material waste and labor time loss, and improving production efficiency and product quality. Compared with dedicated quality inspection equipment, the host computer of this embodiment is a general-purpose device, and the repeater is one of the temperature measurement component products. After the test is completed, the repeater used for the test can be directly sold as a product, which greatly reduces the equipment cost and the requirements for setting up the test environment, and saves the cost of the manufacturing process. The sensor quality inspection method of this embodiment is not only applicable to the quality inspection of finished sensors, but also to the testing of semi-finished circuit boards. It can meet the needs of different markets and production links, and improves the flexibility and applicability of the test.

[0137] The sensor quality inspection method in this application is described above. The sensor quality inspection device in this application is described below. Figure 6 , an embodiment of the sensor quality inspection device in the present application includes:

[0138] Display module 601, used to present sensor status data reported by the repeater through the host computer;

[0139] Processing module 602, configured to select a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state when there are defective products in the current test batch;

[0140] The screening module 603 is used to determine whether the target sensor is a good product or a defective product according to whether the sensor state displayed in the upper computer follows the change of the first target measure solution.

[0141] In this embodiment, the host computer intuitively presents the status data of each sensor reported by the repeater, and the quality inspector can observe the sensor status of the quality inspection in real time, quickly locate defective products, and improve the efficiency of quality inspection. Compared with special quality inspection equipment, the host computer of this embodiment is a general-purpose device, and the repeater is one of the sensor component products. After the test is completed, the repeater used for the test can be directly sold as a product, which greatly reduces the equipment cost and the requirements for setting up the test environment, and saves the cost of the manufacturing link. According to whether the sensor status displayed as a defective product in the host computer follows the change of the first target measure plan, the defective products can be screened out effectively in multiple processes. Defective products in semi-finished probes and finished probes are avoided, thereby reducing material waste and time loss, and improving production efficiency and product quality. It is not only suitable for the quality inspection of finished sensors, but also suitable for the testing of semi-finished circuit boards, which can meet the needs of different markets and production links, and improve the flexibility and applicability of the test.

[0142] See also Figure 7 Another embodiment of the sensor quality inspection device in the present application includes:

[0143] Display module 601, used to present sensor status data reported by the repeater through the host computer;

[0144] Processing module 602, configured to select a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state when there are defective products in the current test batch;

[0145] The screening module 603 is used to determine whether the target sensor is a good product or a defective product according to whether the sensor state displayed in the upper computer follows the change of the first target measure solution.

[0146] Optionally, the processing module 602 includes:

[0147] A determination submodule 6021 is used to determine a target number of sensors to be tested in a current test batch as target sensors;

[0148] The processing submodule 6022 is used to execute the same or different first target measure schemes on each target sensor to obtain the target state characteristics corresponding to each target sensor.

[0149] Optionally, the processing submodule 6022 is specifically used to: if screening is performed according to the defective product sensor status displayed by the host computer, determine a first target measure scheme according to the type of abnormality checked, and the target measure taken by the first target measure scheme is different from the type of abnormality;

[0150] Otherwise, the environmental parameter change measure and / or the charge state change measure is determined as the first target measure scheme.

[0151] Optionally, the host computer displays all sensor status data of the current test batch, and the current test batch includes good products and defective products. The screening module 603 is specifically used to: determine whether the sensor status displayed as defective products in the host computer has the target status feature corresponding to the first target measure solution;

[0152] If not, the target sensor is determined to be good;

[0153] If so, the target sensor is determined to be defective.

[0154] Optionally, the processing module 602 is further configured to reselect a target sensor to execute the first target measure solution and conduct a test when there are still defective products in the current test batch, until all defective products in the current test batch are determined.

[0155] Optionally, the processing submodule 6022 is further configured to execute a second target measure scheme on the sensors to be tested in the current test batch;

[0156] The screening module 603 is further used to determine whether there are defective products in the current test batch according to the second target measure scheme and the status data of each sensor.

[0157] Optionally, the screening module 603 is also used to: determine whether the sensor states displayed in the host computer all show the target state characteristics corresponding to the second target measure solution; if so, determine that the current test batch is all good products; if not, determine that the current test batch has defective products.

[0158] In this embodiment, the second target measure scheme is first executed on the current batch to determine whether there are defective products in the current test batch. When there are no defective products in the current test batch, the quality inspection of the next batch can be quickly entered, thereby improving the speed of batch quality inspection. The host computer intuitively presents all sensor status data reported by the repeater, and the quality inspector can observe the sensor state change process of good or defective products in the quality inspection process in real time, quickly locate defective products, and improve the efficiency of quality inspection. When there are defective products in the current test batch, the first target measure scheme is executed on each selected target sensor, and the defective products are screened by whether the sensor state marked as defective products in the host computer has the target state characteristics. The defective products in the semi-finished probes and finished probes can be effectively screened out in multiple processes, thereby avoiding the flow of defective products into the next process, thereby reducing material waste and time loss, and improving production efficiency and product quality. Compared with special quality inspection equipment, the host computer of this embodiment is a general-purpose device, and the repeater is one of the sensor component products. After the test is completed, the repeater used for testing can be directly sold as a product, which greatly reduces the equipment cost and the requirements for setting up the test environment, and saves the cost of the manufacturing link. The sensor quality inspection method of this embodiment is not only applicable to the quality inspection of finished sensors, but also to the testing of semi-finished circuit boards. It can meet the needs of different markets and production links and improve the flexibility and applicability of the test.

[0159] above Figure 6 and Figure 7 The sensor quality inspection device in this embodiment is described in detail from the perspective of modular functional entities, and the sensor quality inspection system in this application is described in detail from the perspective of hardware processing.

[0160] See also Figure 8 As shown, the sensor quality inspection system includes a processor 800 and a memory 801 . The memory 801 stores machine executable instructions that can be executed by the processor 800 . The processor 800 executes the machine executable instructions to implement the above-mentioned sensor quality inspection method.

[0161] further, Figure 8 The sensor quality inspection system shown also includes a bus 802 and a communication interface 803 , and the processor 800 , the communication interface 803 and the memory 801 are connected via the bus 802 .

[0162] The memory 801 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), for example, at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 803 (which may be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. may be used. The bus 802 may be an ISA bus, a PCI bus, or an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 8 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0163] The processor 800 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 800. The above processor 800 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The disclosed methods, steps and logic block diagrams in the embodiments of the present disclosure can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be a conventional processor, etc. The steps of the method disclosed in conjunction with the embodiments of the present disclosure can be directly embodied as a hardware decoding processor to be executed, or a combination of hardware and software modules in the decoding processor can be executed. The software module can be located in a mature storage medium in the field such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 801 , and the processor 800 reads the information in the memory 801 and completes the method steps of the above-mentioned embodiment in combination with its hardware.

[0164] The present application also provides a computer-readable storage medium, which may be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. Instructions are stored in the computer-readable storage medium. When the instructions are executed on a computer, the computer executes the steps of the sensor quality inspection method.

[0165] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0166] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., and other media that can store program codes.

[0167] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A sensor quality inspection method, characterized in that: The sensor quality inspection method comprises: The sensor status data reported by the repeater is presented through the host computer; When there are defective products in the current test batch, selecting a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state; Whether the target sensor is a good product or a defective product is determined according to whether the sensor state displayed in the host computer follows the change of the first target measure solution.

2. The sensor quality inspection method according to claim 1, characterized in that: The step of selecting a target sensor from the current test batch to execute a first target measure scheme for changing the sensor state includes: Determine a target number of sensors to be tested in the current test batch as target sensors, wherein the target number is greater than one; The same or different first target measure schemes are executed on each of the target sensors to obtain target state characteristics corresponding to each of the target sensors.

3. The sensor quality inspection method according to claim 1, characterized in that: If the screening is performed based on the sensor status displayed as defective products by the host computer, a first target measure scheme is determined based on the type of abnormality checked, and the target measure taken by the first target measure scheme is different from the type of abnormality; Otherwise, the environmental parameter change measure and / or the charge state change measure is determined as the first target measure scheme.

4. The sensor quality inspection method according to claim 1, characterized in that: The host computer displays all sensor status data of the current test batch, and the current test batch includes good products and defective products; The determining whether the target sensor is a good product or a bad product according to whether the sensor state displayed in the host computer follows the change of the first target measure solution includes: Determine whether the sensor state displayed as defective product in the host computer has the target state feature corresponding to the first target measure solution; If not, determining the target sensor corresponding to the target state feature as a good product; If so, the target sensor corresponding to the target state feature is determined as a defective product.

5. The sensor quality inspection method according to claim 4, characterized in that: After the target sensor corresponding to the target state feature is determined as a defective product, the method further includes: When there are still defective products in the current test batch, a target sensor is reselected to execute the first target measure scheme and test until all defective products in the current test batch are determined.

6. The sensor quality inspection method according to any one of claims 1 to 5, characterized in that: Before presenting the sensor status data reported by the repeater through the host computer, the method further includes: executing a second target measure plan for the sensors to be tested in the current test batch; Determine whether there are defective products in the current test batch according to the second target measure scheme and the status data of each sensor.

7. The sensor quality inspection method according to claim 6, characterized in that: The determining whether there are defective products in the current test batch according to the second target measure scheme and the status data of each sensor includes: Determine whether the sensor states displayed in the host computer all show the target state characteristics corresponding to the second target measure solution; If so, it is determined that the current test batch is all good products; If not, it is determined that there are defective products in the current test batch.

8. A sensor quality inspection device, characterized in that: The sensor quality inspection device comprises: Display module, used to present the sensor status data reported by the repeater through the host computer; A processing module, configured to select a target sensor from the current test batch to execute a first target measure scheme for changing a sensor state when there are defective products in the current test batch; The screening module is used to determine whether the target sensor is a good product or a defective product according to whether the sensor state displayed in the host computer follows the change of the first target measure solution.

9. A sensor quality inspection system, characterized in that: The sensor quality inspection system comprises: a memory and at least one processor, wherein instructions are stored in the memory; The at least one processor calls the instructions in the memory to enable the sensor quality inspection system to execute the sensor quality inspection method according to any one of claims 1 to 7.

10. A computer-readable storage medium having instructions stored thereon, characterized in that: When the instruction is read and executed, the sensor quality inspection method according to any one of claims 1 to 7 is executed.

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