Host cooling structure and vehicle multimedia host

Abstract

The present invention discloses a host heat dissipation structure, including a heat sink group, a heat dissipation fan carried on the heat sink group, and two spring hooks, each of the heat sinks is arranged along a plane perpendicular to the front-to-back direction, the side walls of the left and right opposite sides of each heat sink are respectively provided with engaging holes penetrating the heat sink along the front-to-back direction, all the engaging holes on the same side respectively form an engaging channel, the upper surface or side surface of the heat dissipation fan is provided with positioning holes corresponding to the two ends of the spring hook, the middle of the spring hook is engaged in the engaging channel, the two ends bypass the front and rear opposite sides of the heat sink group and are engaged in the engaging holes, and provide downward and outward elastic forces to the heat dissipation fan, so that the heat dissipation fan is elastically positioned on the heat sink group. Compared with the prior art, the present invention has a simple structure, convenient assembly, and high stability after assembly. The present invention also discloses a vehicle-mounted multimedia host.

Description

Technical Field

[0001] The invention relates to a heat dissipation structure of a host machine, and in particular to the installation of a heat dissipation fan in the heat dissipation structure. Background Art

[0002] Due to the increasing complexity of vehicle electronics, a vehicle requires dozens or even hundreds of ECUs for control. The intricate interweaving of so many ECUs not only brings about very complex wiring harness design, but also very mixed logic control. The traditional distributed architecture can no longer meet the growing computing needs.

[0003] With the development of automotive electronics in recent years, especially the use of high-performance MCU in automotive electronics. Automotive electronics and electrical appliances have mainly formed a functional "domain" architecture, that is, the Domain architecture. The typical vehicle electronic and electrical architecture is divided into five main domains: powertrain, chassis control, body control, ADAS, and entertainment system. Each domain has a main high-performance ECU (this is the Domain Controller), which is responsible for processing and forwarding functions within the domain. Low-speed buses are generally used within the domain, and high-speed buses or the more commonly used automotive Ethernet interconnection are used between domains.

[0004] Compared with traditional controllers, this type of domain controller requires more high-power ICs and interfaces. As the automotive industry is rapidly developing towards multifunctional smart cockpits, the mainstream platform is a high-power platform, which requires higher host heat dissipation performance, better compatibility, and smaller volume and weight. Therefore, a heat dissipation device is generally installed on the heat dissipation housing of the domain controller host.

[0005] With reference to Chinese patent CN2860012Y, the existing heat dissipation device includes a cooling fan, a cooling fin module, a fixed frame and a matching frame, wherein the fixed frame is sleeved on the cooling fin module, the matching frame is pivotally mounted on the fixed frame and can be buckled together, and the cooling fan is screwed to the fixed frame. Although this solution allows the cooling fan to be installed above the cooling fin module, the structure is relatively complicated, and the fixed frame is outside the cooling fin module, which is inconvenient to assemble and has poor connection stability. The cooling fin module is easily deformed due to the sleeve connection. Moreover, since the cooling fan is screwed to the matching frame, when the cooling fan vibrates during operation, the fixing screws are easily loosened, resulting in the cooling fan being loosely separated from the matching frame, the matching frame and the fixed frame, and the fixed frame and the cooling fins, affecting the operation of the cooling device and easily generating noise due to vibration and collision.

[0006] To this end, in Chinese patent CN201178543Y, a heat dissipation device with a vibration absorption structure is disclosed, including a heat sink formed by a plurality of heat sinks, two or more shock-absorbing connectors and a fan. One end of the shock-absorbing connector is plugged and fixed to the heat sink body, and the other end protrudes out to form a connecting column. The fan is fixed on the connecting column through a connecting hole provided thereon. The shock-absorbing connector is made of rubber or silicone material. Although it can effectively prevent the fan from vibrating, the assembly of the shock-absorbing connector and the fan is inconvenient. Since the shock-absorbing connector is a columnar integrated flexible material, it is not stable enough, and after long-term use, the fan is easily partially separated from the shock-absorbing connector. It is still difficult to avoid the collision between the fan and the heat sink during operation, and the problem of high noise cannot be completely solved. Furthermore, since the shock-absorbing connector is only engaged with part of the heat sink, the heat sink is easily deformed when used for a long time.

[0007] Therefore, there is an urgent need for a heat dissipation device for a host computer that can solve the above problems. Summary of the invention

[0008] The purpose of the present invention is to provide a host heat dissipation structure and a vehicle-mounted multimedia host. The host heat dissipation structure has a simple structure, is easy to assemble, has high stability after assembly, and a fan and its installed components are not easily separated due to long-term use.

[0009] The heat dissipation device is a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a heat dissipation device, a

[0010] Compared with the prior art, the heat dissipation fan of the present invention is elastically hooked on the heat dissipation fin group by two spring hooks, which not only avoids the separation of the heat dissipation fan and the heat dissipation fin group caused by the rigid connection between the heat dissipation fan and the heat dissipation fin group, but also is easy to assemble and has high stability. When the heat dissipation fan vibrates, a certain activity space is provided for the vibration of the heat dissipation fan, and the heat dissipation fan can be effectively prevented from being separated from the heat dissipation fin group. Furthermore, the middle of the spring hook is engaged with the engagement hole of each heat dissipation fin, so that all heat dissipation fins are subjected to balanced force, and after long-term use, the heat dissipation fin group will not be deformed due to the vibration of the heat dissipation fan.

[0011] Preferably, the spring hook includes an engaging main part engaged with the engaging channel, an elastic part formed by bending and extending upward at both ends of the engaging main part, and a positioning part extending from the end of the elastic part toward the positioning hole. The engaging main part of each spring hook is respectively engaged in the corresponding left or right engaging channel, and the two positioning parts of each spring hook are engaged in the corresponding positioning hole.

[0012] Preferably, the elastic portion is located at the front and rear sides of the two heat sink assemblies, and the spring hook is formed by bending or folding a strip or columnar member.

[0013] Preferably, the positioning holes are formed at four corners of the upper surface of the heat dissipation fan, and the positioning portions are inserted into the positioning holes from top to bottom.

[0014] Preferably, a first buffer gasket is provided around the positioning hole on the upper surface of the heat dissipation fan, a second buffer gasket is provided on the lower surface of the heat dissipation fan opposite to the first buffer gasket, and the second buffer gasket is sandwiched between the heat dissipation fan and the heat sink.

[0015] Preferably, each of the heat sinks is provided with a plug-in structure on its four sides, and the plug-in structure is provided with mutually engaging components on the front and rear sides, so that the plug-in structure of the latter heat sink can be plugged and engaged and positioned in the plug-in structure of the former heat sink.

[0016] The heat dissipation device is a novel method of making a heat dissipation device for dissipating heat, and a method of making the heat dissipation device a heat dissipation device for dissipating heat is used to dissipate heat.

[0017] Specifically, the host heat dissipation structure also includes a strip welding plate, and a plurality of plug-in structures are arranged on the lower side of the heat sink. Several heat sinks are plugged together through the plug-in structures so that the corresponding plug-in plates are spliced ​​together to form a fixing belt, and the strip welding plate is correspondingly welded to the fixing belt on the lower side of the heat sink group.

[0018] Preferably, the host heat dissipation structure also includes a heat dissipation block and a heat pipe fixed to the lower side of the heat dissipation fin group, the heat pipe transversely penetrates all the heat dissipation fin groups along the front-to-back direction, a plurality of heat absorption through holes through which the heat pipes penetrate are formed between the heat dissipation block and the heat dissipation fin group, a plurality of heat dissipation through holes through which the heat pipes penetrate are arranged in the middle of the heat dissipation fins of the heat dissipation fin group, and the heat pipe includes a heat absorption section installed in the heat absorption through hole, a heat dissipation section installed in the heat dissipation through hole, and a bending section connecting the heat absorption section and the heat dissipation section.

[0019] Specifically, the front and rear sides of the heat sink group and the positions corresponding to the bending sections are provided with air-avoiding grooves for the bending sections to be embedded.

[0020] The present invention also discloses a vehicle-mounted multimedia host, comprising a heat dissipation shell, a host heat dissipation structure fixedly installed on the outside of the heat dissipation shell, and a circuit board installed in the heat dissipation shell, wherein the circuit board has a high-power chip, and the host heat dissipation structure is the above-mentioned host heat dissipation structure.

[0021] Preferably, the host heat dissipation structure also includes a heat dissipation block fixed to the lower side of the heat sink group, and a through hole for the chip to pass through is opened at a position corresponding to the heat dissipation block of the heat dissipation shell, and the heat dissipation block passes through the through hole and is in thermal contact with the high-power chip.

[0022] Specifically, a plurality of heat dissipation fins and a main heat dissipation area surrounded by the heat dissipation fins are protruding from the upper surface of the heat dissipation housing, and the host heat dissipation structure has one or more and is installed in the main heat dissipation area.

[0023] Specifically, a first fixing frame and a second fixing frame are fixed to two opposite outer sides of the heat dissipation shell in the first direction, and a third fixing frame is provided on the first side of the heat dissipation shell in the second direction perpendicular to the first direction, the first fixing frame includes a first fixing portion fixed to the side edge of the heat dissipation shell, a first fixing sheet formed by bending and extending one of the upper edge and the lower edge of the first fixing portion outward, a second fixing sheet formed by bending and extending the other of the upper edge and the lower edge of the first fixing portion outward, and a third fixing sheet formed by bending and extending the second fixing sheet away from the heat dissipation shell; the second fixing frame includes a second fixing portion fixed to the side edge of the heat dissipation shell, a first fixing sheet formed by bending and extending the other of the upper edge and the lower edge of the second fixing portion outward, and a third fixing sheet formed by bending and extending the second fixing sheet away from the heat dissipation shell. A fourth fixing plate formed after extension, a fixed cantilever formed by bending and extending the other of the upper edge and the lower edge of the second fixing part while bending and extending downward, a fifth fixing plate formed by bending and extending the other of the upper edge and the lower edge of the second fixing part inward, the third fixing frame includes a third fixing part fixed to the heat dissipation shell and a sixth fixing plate formed by bending outward and delaying the upper edge or the lower edge of the third fixing part, the first fixing plate, the second fixing plate, the third fixing plate, the fourth fixing plate, the fifth fixing plate, the sixth fixing plate and the ends of the fixed cantilever are respectively formed with one or more fixing holes, and the fixing holes of the second fixing plate and the fifth fixing plate protrude from the second side of the heat dissipation shell in the second direction opposite to the first side.

[0024] Specifically, the vehicle-mounted multimedia host also includes a lower shell that is installed in cooperation with the heat dissipation shell to form an installation cavity for accommodating the fixing plate. The circuit board is provided with a fixing hole for fixing with the lower shell. The circuit board is provided with a stress buffer hole around the fixing hole that partially surrounds the fixing hole. The lower shell and the fixing hole are provided with a fixing boss protruding inwardly. The fixing boss contacts the area around the fixing hole and contacts and closes the stress buffer hole. The fixing boss is provided with a mounting hole that cooperates with the fixing hole.

[0025] Preferably, the vehicle-mounted multimedia host also includes an antenna circuit board, and the upper surface of the heat dissipation shell is recessed with an antenna mounting cavity, and the antenna circuit board is installed in an inverted manner on the upper cavity wall of the antenna mounting cavity so that the circuit part of the antenna circuit board is located in the antenna mounting cavity. The antenna mounting cavity is a rectangular cavity, and the top of its cavity wall is stepped. The antenna circuit board is carried on a low step on the inner side of the top of the stepped cavity wall and is wrapped by a high step on the outer side of the top of the cavity wall, and among the four stepped cavity walls, two opposite cavity walls have notches at the high steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a three-dimensional diagram of the vehicle-mounted multimedia host of the present invention at one angle.

[0027] Figure 2 It is a three-dimensional diagram of the vehicle-mounted multimedia host of the present invention from another angle.

[0028] Figure 3 It is an exploded view of the vehicle-mounted multimedia host of the present invention.

[0029] Figure 4 It is a cross-sectional view of the vehicle-mounted multimedia host of the present invention.

[0030] Figure 5 It is a three-dimensional diagram of the host heat dissipation structure of the present invention at one angle.

[0031] Figure 6 It is a three-dimensional diagram of the host heat dissipation structure of the present invention from another angle.

[0032] Figure 7 It is an exploded view of the host heat dissipation structure of the present invention.

[0033] Figure 8 It is a structural diagram of the heat sink of the present invention.

[0034] Fig. 9 It is a structural diagram of the spring hook of the present invention.

[0035] Fig.10 It is a side view of the host heat dissipation structure of the present invention.

[0036] Fig.11 It is a partially exploded and enlarged view of the vehicle-mounted multimedia host of the present invention.

[0037] Fig.12 The present invention Figure 1 A partial enlarged view of . DETAILED DESCRIPTION

[0038] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0039] refer to Figures 1 to 4 The present invention discloses a vehicle-mounted multimedia host 1, comprising a heat dissipation housing 51, a lower housing 53, a host heat dissipation structure 100 fixedly mounted on the heat dissipation housing 51, and a circuit board 52 mounted in the heat dissipation housing 51, wherein the circuit board 52 has a high-power chip 521. The heat dissipation housing 51 and the lower housing 53 are mounted together to form a receiving cavity, and the circuit board 52 is mounted in the receiving cavity.

[0040] refer to Figure 2 and Figure 3The upper surface of the heat dissipation housing 51 is provided with a plurality of heat dissipation fins 512 and a main heat dissipation area surrounded by the heat dissipation fins 512. The host heat dissipation structure 100 has two and is installed in the main heat dissipation area. Of course, the host heat dissipation structure 100 can also have one, three, four, etc.

[0041] refer to Figures 1 to 3 A fan cover 18 is also installed on the heat dissipation shell 51 and covers the outside of the host heat dissipation structure 100.

[0042] refer to Figures 4 to 7 The host heat dissipation structure 100 includes a heat sink group 10 composed of a plurality of heat sinks 11 arranged side by side, a heat dissipation fan 20 and a heat pipe 30 carried on the heat sink group 10, each of the heat sinks 11 is arranged along a plane perpendicular to the front-to-back direction, a heat dissipation channel is formed between adjacent heat sinks 11, an outlet of the heat dissipation fan 20 is opposite to the heat dissipation channel, and the heat pipe 30 transversely penetrates all the heat sinks 11 along the front-to-back direction.

[0043] refer to Figure 4 and Figure 7 The left and right opposite sides of each heat sink 11 are respectively provided with a snap-in hole 13 penetrating the heat sink 11 in the front-to-back direction, the snap-in holes 13 on the left side wall of all the heat sink 11 form a snap-in channel 14, and the snap-in holes 13 on the right side wall of all the heat sink 11 form a snap-in channel 14, and the four corners of the heat sink fan 20 are provided with positioning holes 21. The host heat dissipation structure 100 also includes two spring hooks 40, the middle of the spring hooks 40 is engaged in the engaging channel 14, and the two ends bypass the front and rear opposite sides of the heat sink group 10 and are engaged in the snap-in holes 13, and provide downward and outward elastic force to the heat sink fan 20, so that the heat sink fan 20 is elastically positioned on the heat sink group 10.

[0044] That is to say, the middle of the spring hook 40 spans the front and rear sides of the heat sink group 10 and is hung on the locking channel 14, and the two ends are hooked in the locking hole 13. The locking channel 14 is used to position the middle of the spring hook 40 and pull the two ends. The cooling fan 20 is pulled downward and in opposite lateral directions through the two spring hooks 40 on the left and right sides, so that the cooling fan 20 is elastically locked and positioned on the heat sink group 10, which is convenient to assemble. The cooling fan 20 and the heat sink group 10 are connected together by the spring hook 40, and will not be irreversibly separated due to long-term use, and the stability is high.

[0045] The spring hook 40 is an elastic member made of a rigid material. Of course, the spring hook 40 can also be made of other materials.

[0046] refer to Figure 7 and Fig. 9The spring hook 40 includes a main engaging portion 41 engaged in one of the engaging channels 14, an elastic portion 42 formed by bending and extending the two ends of the main engaging portion 41 upward, and a positioning portion 43 extending from the end of the elastic portion 42 toward the positioning hole 21. The main engaging portion 41 of each spring hook 40 is respectively engaged in the corresponding left or right engaging channel 14, and the two positioning portions 43 of each spring hook 40 are engaged in the positioning hole 21 on the corresponding side. The elastic portion 42 provides downward and outward elastic force to the positioning portion 43, so that the cooling fan 20 is elastically positioned on the heat sink 11 group.

[0047] The elastic part 42 is located at the front and rear sides of the two heat sinks 11, and the spring hook 40 is formed by bending or curving a strip or column. The elastic part 42 is formed by connecting a plurality of straight sections in sequence at a certain angle.

[0048] refer to Figures 4 to 7 The positioning holes 21 are opened at the four corners of the upper surface of the cooling fan 20, and the positioning parts 43 are inserted into the positioning holes 21 from top to bottom. Of course, the positioning holes 21 can also be located on the front and rear side walls of the cooling fan 20 near the left and right side walls.

[0049] refer to Figure 6 and Figure 7 The host heat dissipation structure 100 includes a heat dissipation block 34 fixed to the lower side of the heat sink group 10. Figure 4 The heat dissipation housing 51 is provided with a through hole 511 for the chip to pass through at a position corresponding to the heat dissipation block 34, so that the heat dissipation block 34 passes through the through hole 511 and directly contacts the high-power chip 521 with heat. In this embodiment, the heat dissipation block 34 is a copper block, the heat sink assembly 10 is an aluminum material component, and the heat sink 11 is an aluminum sheet.

[0050] refer to Figure 4 and Figure 7 The heat pipe 30 runs through all the heat sink groups 10 in the front-to-back direction, a plurality of heat-absorbing through holes 301 through which the heat supply pipe 30 runs are formed between the heat sink block 34 and the heat sink group 11, a plurality of heat-dissipating through holes 302 through which the heat supply pipe 30 runs are arranged in the middle of the heat sink 11 of the heat sink group 11, and the heat pipe 30 includes a heat-absorbing section 31 installed in the heat-absorbing through hole 301, a heat-dissipating section 32 installed in the heat-dissipating through hole 302, and a bending section 33 connecting the heat-absorbing section 31 and the heat-dissipating section 32. The heat sink block 34 is a copper block, and of course it can also be other materials with high heat dissipation efficiency. The heat-dissipating through hole 302 expands outward to form a solder paste hole 303.

[0051] refer to Figure 4 and Figure 7The cooling fan 20 is provided with a first buffer gasket 22 around the positioning hole 21 on its upper surface, and the cooling fan 20 is provided with a second buffer gasket 23 opposite to the first buffer gasket 22 on the lower surface. The second buffer gasket 23 is sandwiched between the cooling fan 20 and the heat sink 11. This solution can effectively avoid the noise caused by the vibration of the cooling fan.

[0052] refer to Figure 6 and Figure 8 Each of the four sides of the heat sink 11 is provided with a plug-in structure 15, and the plug-in structure 15 is provided with mutually engaging components on the front and rear sides, so that the plug-in structure 15 of the latter heat sink is plugged and engaged and positioned in the plug-in structure 15 of the former heat sink.

[0053] refer to Figure 6 and Figure 8 The plug-in structure 15 includes a plug-in sheet 151 formed by bending and extending the heat sink 11 forward, a plug-in slot 152 formed on the rear side of the plug-in sheet 151, and a snap-in protrusion 153 protruding from the side of the heat sink 11 and corresponding to the position of the plug-in slot 152. A snap-in protrusion 154 is formed on the front side of the plug-in sheet 151. The plug-in slot 152 includes a main snap-in slot 1521 located in the rear half and snap-in with the snap-in protrusion 154, and a main snap-in slot 1521 located in the rear half and snap-in with the snap-in protrusion 153. The engaging tongue 154 of the rear heat sink 11 is inserted into the main engaging groove 1521 of the front heat sink 11 along the front-to-back direction and contacts the engaging protrusion 153. The auxiliary engaging groove 1522 of the front heat sink 11 is engaged with the engaging protrusion 153 of the rear heat sink 11, so that the engaging groove of each intermediate heat sink 11 is engaged between the engaging protrusions 153 of the front and rear engaging pieces, and several heat sinks 11 are engaged and positioned together in sequence.

[0054] refer to Figure 6 and Figure 7 The host heat dissipation structure 100 also includes a strip welding piece 16. A plurality of plug-in structures 15 are provided on the lower side of the heat sink 11. Several heat sinks 11 are plugged together through the plug-in structures 15 so that several plug-in pieces 151 are spliced ​​together to form a fixing belt 17. There are multiple strip welding pieces 16 and they are welded correspondingly to the fixing belt 17.

[0055] refer to Figure 7 and Figure 3The strip welding sheet 16 is provided with a fixing hole 161, and the heat dissipation shell 51 is provided with a through hole 513 corresponding to the fixing hole 161. The fixing piece passes through the through hole 513 and the fixing hole 161 in sequence from the lower surface of the heat dissipation shell 51 and is fixedly connected to the fixing hole 161, so as to fix the strip welding sheet 16 to the heat dissipation shell 51, wherein the fixing hole 161 can be a screw hole, and the fixing piece can be a screw, or can be a fixing component fixed by other fixing methods.

[0056] refer to Figure 6 and Figure 7 The front and rear sides of the heat sink 11 group and the positions corresponding to the bending sections are provided with avoidance grooves 110 for the bending sections 33 to be embedded in, so that the entire host heat dissipation structure 100 is small in size and convenient for the arrangement of multiple host heat dissipation structures 100.

[0057] refer to Figure 1 and Figure 2 The first fixing frame 61 and the second fixing frame 62 are fixed to two opposite outer sides of the heat dissipation housing 51 in the first direction. The first side of the heat dissipation housing 51 in the second direction perpendicular to the first direction is also provided with a third fixing frame 63. The first fixing frame 61 includes a first fixing portion 611 fixed to the side of the heat dissipation housing 51, a first fixing sheet 612 formed by bending and extending one of the upper edge and the lower edge of the first fixing portion 611 outward, a second fixing sheet 613 formed by bending and extending the other of the upper edge and the lower edge of the first fixing portion 611 outward, and an L-shaped third fixing sheet 614 formed by bending and extending the second fixing sheet 613 away from the heat dissipation housing 51; the second fixing frame 62 includes a second fixing portion 621 fixed to the side of the heat dissipation housing 51, a first fixing sheet 612 formed by bending and extending one of the upper edge and the lower edge of the second fixing portion 621 outward, and a third fixing sheet 614 formed by bending and extending the second fixing sheet 613 away from the heat dissipation housing 51. a fourth fixing plate 622, a fixed cantilever 623 formed by the upper edge and the lower edge of the second fixing portion 621, one of which is bent outward and extended while being bent downward, a fifth fixing plate 624 formed by the upper edge and the lower edge of the second fixing portion 621, one of which is bent inward and extended, the third fixing frame 63 includes a third fixing portion 631 fixed to the heat dissipation shell 51 and a sixth fixing plate 632 formed by bending outward or delaying the upper edge or the lower edge of the third fixing portion 631, and one or more fixing holes 64 are respectively formed at the ends of the first fixing plate 612, the second fixing plate 613, the third fixing plate 614, the fourth fixing plate 622, the fifth fixing plate 624, the sixth fixing plate 632 and the fixed cantilever 623, and the fixing holes of the second fixing plate 613 and the fifth fixing plate 624 protrude from the second side of the heat dissipation shell 51 in the second direction opposite to the first side.

[0058] refer to Figure 3 and Fig.11 The circuit board 52 is provided with a fixing hole 523 for fixing with the lower shell 53, and the circuit board 52 is provided with a stress buffer hole 522 around the fixing hole 523 and partially surrounds the fixing hole 523. The lower shell 53 and the fixing hole 523 are provided with a fixing boss 531 protruding inwardly, and the fixing boss 531 contacts the area around the fixing hole 523 and contacts and closes the stress buffer hole 522. The fixing boss 531 is penetrated by a mounting hole 532 that cooperates with the fixing hole, wherein the fixing boss 531 is protruding from the upper shell surface of the lower shell 53 and recessed in the lower shell surface of the card shell 53.

[0059] refer to Figure 2 and Fig.12 The vehicle-mounted multimedia host 1 further includes an antenna circuit board 54. The upper surface of the heat dissipation housing 51 is concavely provided with an antenna installation cavity 55. The antenna circuit board 54 is mounted upside down on the upper cavity wall of the antenna installation cavity 55, so that the circuit part of the antenna circuit board 54 is located in the antenna installation cavity 55. The antenna installation cavity 55 is a rectangular cavity, and the top of the cavity wall is stepped. The antenna circuit board 54 is carried on the low step inside the top of the stepped cavity wall and is wrapped by the high step outside the top of the cavity wall. Among the four stepped cavity walls, the high steps of two opposite cavity walls have a notch 56. In this embodiment, the high steps of the two long cavity walls have a notch 56.

[0060] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A host heat dissipation structure, comprising a heat sink group consisting of a plurality of heat sinks arranged side by side, and a heat dissipation fan carried on the heat sink group, wherein each heat sink is arranged along a plane perpendicular to the front-rear direction, a heat dissipation channel is formed between adjacent heat sinks, and an outlet of the heat dissipation fan is opposite to the heat dissipation channel, characterized in that: It also includes two spring hooks, and the side walls on the left and right opposite sides of each heat sink are respectively provided with a locking hole that penetrates the heat sink along the front-to-back direction, and all the locking holes on the same side respectively form a locking channel, and the upper surface or side surface of the heat dissipation fan is provided with positioning holes corresponding to the two ends of the spring hooks, the middle of the spring hook is engaged in the locking channel, and the two ends bypass the front and rear opposite sides of the heat sink group and are engaged in the locking holes, and provide downward and outward elastic force to the heat dissipation fan, so that the heat dissipation fan is elastically positioned on the heat sink group.

2. The host heat dissipation structure according to claim 1, characterized in that: The spring hook includes a main engaging portion engaged with the engaging channel, an elastic portion formed by bending and extending upward at both ends of the main engaging portion, and a positioning portion extending from the end of the elastic portion toward the positioning hole. The main engaging portion of each spring hook is respectively engaged in the corresponding left or right engaging channel, and the two positioning portions of each spring hook are engaged in the corresponding positioning hole.

3. The host heat dissipation structure according to claim 2, characterized in that: The elastic part is located at the front and rear sides of the two heat sink groups, and the spring hook is formed by bending or curving a strip or columnar part.

4. The host heat dissipation structure according to claim 2, characterized in that: The positioning holes are formed at four corners of the upper surface of the heat dissipation fan, and the positioning parts are inserted into the positioning holes from top to bottom.

5. The host heat dissipation structure according to claim 1, characterized in that: A first buffer gasket is arranged around the positioning hole on the upper surface of the heat dissipation fan, and a second buffer gasket is arranged on the lower surface of the heat dissipation fan opposite to the first buffer gasket, and the second buffer gasket is sandwiched between the heat dissipation fan and the heat sink.

6. The host heat dissipation structure according to claim 1, characterized in that: The four sides of each heat sink are respectively provided with plug-in structures, and the plug-in structures are provided with mutually engaging clamping components on the front and rear sides, so that the plug-in structure of the latter heat sink is plugged and clamped and positioned in the plug-in structure of the former heat sink.

7. The host heat dissipation structure according to claim 6, characterized in that: The plug-in structure comprises a plug-in piece formed by the heat sink being bent and extended forward, a locking tongue convexly arranged on the front side of the plug-in piece, a plug-in slot concavely arranged on the rear side of the plug-in piece, and a locking protrusion convexly arranged on the corresponding side edge of the heat sink and located in the plug-in slot. The plug-in slot comprises a main locking groove located in the rear half and engaged with the locking tongue, and a secondary locking groove located in the rear half and engaged with the locking protrusion. The locking tongue of the rear heat sink is plugged into the main locking groove of the front heat sink along the front-to-back direction and contacts the locking protrusion, and the secondary locking groove of the front heat sink is locked with the locking protrusion of the rear heat sink, so that the locking groove of each of the middle heat sinks is locked between the locking protrusions of the front and rear locking pieces, and a plurality of the heat sinks are sequentially locked and positioned together.

8. The host heat dissipation structure according to claim 6, characterized in that: It also includes a strip welding plate, and a plurality of plug-in structures are arranged on the lower side of the heat sink. Several heat sinks are plugged together through the plug-in structures so that the corresponding plug-in plates are spliced ​​together to form a fixing belt, and the strip welding plate is correspondingly welded to the fixing belt on the lower side of the heat sink group.

9. The host heat dissipation structure according to claim 1, characterized in that: The host heat dissipation structure also includes a heat dissipation block and a heat pipe fixed to the lower side of the heat dissipation fin group, the heat pipe transversely penetrates all the heat dissipation fin groups along the front-to-back direction, a plurality of heat absorption through holes through which the heat supply pipes penetrate are formed between the heat dissipation block and the heat dissipation fin group, a plurality of heat dissipation through holes through which the heat supply pipes penetrate are arranged in the middle of the heat dissipation fins of the heat dissipation fin group, the heat pipe includes a heat absorption section installed in the heat absorption through hole, a heat dissipation section installed in the heat dissipation through hole, and a bending section connecting the heat absorption section and the heat dissipation section.

10. The host heat dissipation structure according to claim 9, characterized in that: The front and rear sides of the heat sink group and positions corresponding to the bending sections are provided with avoidance grooves for the bending sections to be embedded.

11. A vehicle-mounted multimedia host, characterized in that: It comprises a heat dissipation shell, a host heat dissipation structure fixedly installed on the outside of the heat dissipation shell, and a circuit board installed in the heat dissipation shell, wherein the circuit board has a high-power chip, and the host heat dissipation structure is the host heat dissipation structure as described in any one of claims 1-10.

12. The vehicle-mounted multimedia host according to claim 11, characterized in that: The host heat dissipation structure also includes a heat dissipation block fixed to the lower side of the heat sink group, and a through hole for the chip to pass through is opened at a position corresponding to the heat dissipation block of the heat dissipation housing. The heat dissipation block passes through the through hole and is in thermal contact with the high-power chip.

13. The vehicle-mounted multimedia host according to claim 12, characterized in that: A first fixing frame and a second fixing frame are also fixed to two opposite outer sides of the heat dissipation shell in the first direction, and a third fixing frame is also arranged on the first side of the heat dissipation shell in the second direction perpendicular to the first direction, the first fixing frame comprises a first fixing portion fixed to the side edge of the heat dissipation shell, a first fixing sheet formed by bending and extending one of the upper edge and the lower edge of the first fixing portion outward, a second fixing sheet formed by bending and extending the other of the upper edge and the lower edge of the first fixing portion outward, and a third fixing sheet formed by bending and extending the second fixing sheet away from the heat dissipation shell; the second fixing frame comprises a second fixing portion fixed to the side edge of the heat dissipation shell, a first fixing sheet formed by bending and extending one of the upper edge and the lower edge of the second fixing portion outward, and a third fixing sheet formed by bending and extending the second fixing sheet away from the heat dissipation shell. The fourth fixing plate formed after the delay, the fixed cantilever formed by the upper edge and the lower edge of the second fixing part being bent outward and extended while being bent downward, the fifth fixing plate formed by the upper edge and the lower edge of the second fixing part being bent inward and extended, the third fixing frame comprising a third fixing part fixed to the heat dissipation shell and a sixth fixing plate formed by bending outward or the lower edge of the third fixing part, the first fixing plate, the second fixing plate, the third fixing plate, the fourth fixing plate, the fifth fixing plate, the sixth fixing plate and the ends of the fixed cantilever are respectively formed with one or more fixing holes, and the fixing holes of the second fixing plate and the fifth fixing plate protrude from the second side of the heat dissipation shell in the second direction opposite to the first side.

14. The vehicle-mounted multimedia host according to claim 11, characterized in that: It also includes a lower shell that is installed in cooperation with the heat dissipation shell to form an installation cavity for accommodating the fixing plate, the circuit board is provided with a fixing hole for fixing with the lower shell, the circuit board is provided with a stress buffer hole around the fixing hole that partially surrounds the fixing hole, the lower shell and the fixing hole are provided with a fixing boss protruding inwardly, the fixing boss abuts against the area around the fixing hole and abuts against and closes the stress buffer hole, and the fixing boss is provided with a mounting hole that cooperates with the fixing hole.

15. The vehicle-mounted multimedia host according to claim 11, characterized in that: It also includes an antenna circuit board. The upper surface of the heat dissipation shell is recessed with an antenna installation cavity. The antenna circuit board is installed upside down on the upper cavity wall of the antenna installation cavity so that the circuit part of the antenna circuit board is located in the antenna installation cavity. The antenna installation cavity is a rectangular cavity, and the top of its cavity wall is stepped. The antenna circuit board is carried on the low step on the inner side of the top of the stepped cavity wall and is wrapped by the high step on the outer side of the top of the cavity wall. Among the four stepped cavity walls, two opposite cavity walls have notches at the high steps.

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