Epoxy molding compound and its preparation method and application

Abstract

The present invention relates to the technical field of epoxy molding compounds, and discloses an epoxy molding compound, a preparation method thereof, and an application thereof. The epoxy molding compound contains silica powder, epoxy resin, phenolic resin, release agent and additives. Among them, based on the total weight of the epoxy molding compound being 100% by weight, the content of the silica powder is 80 - 90% by weight, the content of the epoxy resin is 5 - 12% by weight, the content of the phenolic resin is 1 - 8% by weight, the content of the release agent is 0.1 - 0.5% by weight, and the content of the additives is 0.5 - 3% by weight; the silica powder is at least one of crystalline silica, fused silica and silica modified by a coupling agent, and the maximum particle size of the silica powder is 55 - 132 μm, and the particle size distribution of the silica powder is 70% < D90 < 90%. According to the technical solution of the present invention, by adjusting the content, type and proportion of the silica powder, epoxy resin, phenolic resin, release agent and additives, an epoxy molding compound with better fluidity and encapsulation processability can be obtained.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy molding materials, and in particular to an epoxy molding material and a preparation method and application thereof. Background Art

[0002] The combination of epoxy resin as the main resin and phenolic resin as the curing agent is the mainstream combination of electronic plastic packaging materials today. Epoxy resin and phenolic resin will be cured at high temperature under the action of curing accelerator, and produced into epoxy plastic packaging materials under the action of other additives. Epoxy plastic packaging materials have many excellent properties and have been widely used in the packaging field.

[0003] However, most of the current packaging fields are composed of a carrier, a single chip and a wire connection. This packaging process is simple, with low production efficiency and high cost. In order to realize the rapid development of plastic packaging circuits towards multi-functional, high-integration and miniaturization, the integration and functions of chips are increasing. The improvement of packaging technology has also brought great challenges to plastic packaging factories. The first problem is the appearance problems caused by the mismatch between the fluidity of epoxy plastic packaging materials and the packaging process, such as pores and leaks, which need to be solved urgently. Summary of the invention

[0004] The purpose of the present invention is to overcome the problems of the prior art that the fluidity of epoxy molding compound does not match the packaging process, resulting in the inability to discharge internal gas, the phenomenon of back-gassing and defects in appearance, and to provide an epoxy molding compound and its preparation method and application. The epoxy molding compound prepared according to the method described in the present invention can obtain an epoxy molding compound with better fluidity and packaging processability by adjusting the content, type and ratio of silicon powder, epoxy resin, phenolic resin, release agent and auxiliary agent.

[0005] In order to achieve the above-mentioned object, the present invention provides an epoxy molding compound on one hand, which contains silicon powder, epoxy resin, phenolic resin, a release agent and an auxiliary agent, wherein, based on the total weight of the epoxy molding compound as 100 weight%, the content of the silicon powder is 80-90 weight%, the content of the epoxy resin is 5-12 weight%, the content of the phenolic resin is 1-8 weight%, the content of the release agent is 0.1-0.5 weight%, and the content of the auxiliary agent is 0.5-3 weight%; the silicon powder is at least one of crystalline silicon dioxide, fused silicon dioxide and silicon dioxide modified by a coupling agent, and the maximum particle size of the silicon powder is 55-132 μm, and the particle size distribution of the silicon powder is 70% <D90<90%。

[0006] Preferably, based on the total weight of the epoxy molding compound as 100 weight %, the content of the silicon powder is 85-90 weight %, the content of the epoxy resin is 6-10 weight %, the content of the phenolic resin is 2-7 weight %, the content of the release agent is 0.1-0.4 weight %, and the content of the auxiliary agent is 1-3 weight %.

[0007] Preferably, the maximum particle size of the silicon powder is 60-75 μm, and the particle size distribution of the silicon powder is 74%. <D90<83%。

[0008] Preferably, the epoxy resin is at least one of biphenyl phenol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, o-cresol epoxy resin, multifunctional epoxy resin, bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0009] Preferably, the phenolic resin is at least one of a linear phenolic resin, a biphenyl phenolic resin, a naphthalene-containing phenolic resin, a phenol-aralkyl phenolic resin and a multifunctional phenolic resin.

[0010] Preferably, the release agent is at least one of oxidized polyethylene wax, stearic acid wax, polyhydroxy long-chain fatty acid wax and polyamide wax.

[0011] Preferably, the auxiliary agent is at least one of a promoter, a coupling agent, a tackifier, an ion capture agent, a low stress modifier and a colorant.

[0012] Preferably, the accelerator is at least one of triphenylphosphine, 2-methylimidazole, diazabicyclo, 2-phenyl-4-tetramethylimidazole and a coupling compound of triphenylphosphine oxide and p-benzoquinone.

[0013] Preferably, the coupling agent is triethoxysilane and / or N-phenyl-3-aminopropyltrimethoxysilane.

[0014] Preferably, the tackifier is at least one of triazole, 3-amino-1,2,4-triazole and nitrogen-containing phenolic resin.

[0015] Preferably, the ion capture agent is at least one of an anion capture agent, a cation capture agent and an anion-cation composite ion capture agent.

[0016] Preferably, the low stress modifier is polyether-modified polyorganosiloxane and / or epoxidized polybutadiene.

[0017] Preferably, the colorant is carbon black.

[0018] The second aspect of the present invention provides a method for preparing epoxy molding compound, characterized in that the method comprises: mixing silicon powder, epoxy resin, phenolic resin, release agent and auxiliary agent, kneading the obtained mixture, and then cooling, crushing and preforming in sequence.

[0019] Preferably, the mixing conditions include: temperature of 70-90° C. and time of 5-15 min.

[0020] The third aspect of the present invention provides the use of the above epoxy molding compound in a semiconductor packaging process.

[0021] According to the technical solution of the present invention, by adjusting the content, type and proportion of silicon powder, epoxy resin, phenolic resin, release agent and auxiliary agent, an epoxy molding compound with better fluidity and packaging processability can be obtained. DETAILED DESCRIPTION

[0022] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0023] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0024] The epoxy molding compound of the present invention contains silicon powder, epoxy resin, phenolic resin, a release agent and an auxiliary agent, wherein the content of the silicon powder is 80-90% by weight, the content of the epoxy resin is 5-12% by weight, the content of the phenolic resin is 1-8% by weight, the content of the release agent is 0.1-0.5% by weight, and the content of the auxiliary agent is 0.5-3% by weight; the silicon powder is at least one of crystalline silicon dioxide, fused silicon dioxide and silicon dioxide modified by a coupling agent, and the maximum particle size of the silicon powder is 55-132 μm, and the particle size distribution of the silicon powder is 70% <D90<90%。

[0025] In the epoxy molding compound described in the present invention, in a preferred case, based on the total weight of the epoxy molding compound as 100 weight %, the content of the silicon powder is 85-90 weight %, the content of the epoxy resin is 6-10 weight %, the content of the phenolic resin is 2-7 weight %, the content of the release agent is 0.1-0.4 weight %, and the content of the auxiliary agent is 1-3 weight %.

[0026] In the epoxy molding compound of the present invention, the maximum particle size of the silica powder can be 60 - 75 μm, preferably 65 - 72 μm, and more preferably 68 - 70 μm. When the maximum particle size of the silica powder is within the above - preferred range, the epoxy molding compound has better fluidity and encapsulation processability.

[0027] In the epoxy molding compound of the present invention, in a preferred case, the particle size distribution of the silica powder is 74% < D90 < 83%. In a more preferred case, the particle size distribution of the silica powder is 76% < D90 < 80%.

[0028] According to the epoxy molding compound of the present invention, in some embodiments, the silica powder is fused silica with a maximum particle size of 60 - 75 μm. The fused silica can be purchased from Jiangsu Lianrui New Materials Co., Ltd., with the product number NQ101.

[0029] According to the epoxy molding compound of the present invention, in some other embodiments, the silica powder is silica modified by a coupling agent with a maximum particle size of 60 - 75 μm. The silica modified by the coupling agent can be purchased from Jiangsu Lianrui New Materials Co., Ltd., with the product number DQ2150.

[0030] According to the epoxy molding compound of the present invention, in some other embodiments, the silica powder is crystalline silica with a maximum particle size of 60 - 75 μm. The crystalline silica can be purchased from Jiangsu Lianrui New Materials Co., Ltd., with the product number DF - 1220M.

[0031] According to the epoxy molding compound of the present invention, in some other embodiments, the silica powder is fused silica with a maximum particle size of 60 - 75 μm. The fused silica can be purchased from Jiangsu Lianrui New Materials Co., Ltd., with the product number NQ1350D.

[0032] According to the epoxy molding compound of the present invention, in some other embodiments, the silica powder is fused silica with a maximum particle size of 60 - 75 μm. The fused silica can be purchased from Jiangsu Lianrui New Materials Co., Ltd., with the product number NQ1360D.

[0033] In the epoxy molding compound of the present invention, the epoxy resin can be at least one of biphenyl phenol type epoxy resin, naphthalene-containing epoxy resin, dicyclopentadiene type epoxy resin, o-cresol epoxy resin, multifunctional epoxy resin, bisphenol A type epoxy resin and bisphenol F type epoxy resin. In the most preferred embodiment, the epoxy resin is a combination of biphenyl phenol type epoxy resin and o-cresol epoxy resin, and the weight ratio of the biphenyl phenol type epoxy resin to the o-cresol epoxy resin is (3-7): 1, preferably (4-6): 1. In a specific embodiment, the biphenyl phenol type epoxy resin can be purchased from Shengquan Chemical Manufacturing Co., Ltd., with a brand name of SQXN323; the o-cresol epoxy resin can be purchased from Shengquan Chemical Manufacturing Co., Ltd., with a brand name of SQCN700-1,3.

[0034] In the epoxy molding compound of the present invention, the phenolic resin can be at least one of linear phenolic resin, biphenyl phenolic resin, naphthalene-containing phenolic resin, phenol-aralkyl phenolic resin and multifunctional phenolic resin. In the most preferred embodiment, the phenolic resin is phenol-aralkyl phenolic resin. In a specific embodiment, the phenolic resin is XYLOK phenolic resin, which can be purchased from Meiwa Industry Co., Ltd. with the trade name MEH7800-4S.

[0035] In the epoxy molding compound of the present invention, the release agent may be at least one of oxidized polyethylene wax, stearic acid wax, polyhydroxy long-chain fatty acid wax and polyamide wax. In the most preferred embodiment, the release agent is polyhydroxy long-chain fatty acid wax. In a specific embodiment, the release agent is a combination of Clariant E wax and Clariant S wax, and the weight ratio of the Clariant E wax to the Clariant S wax is 1:(0.5-2), preferably 1:(0.8-1.5). The Clariant E wax can be purchased from Klein Chemical Co., Ltd., Germany, with the brand name LICOWAX EFL; the Clariant S wax can be purchased from Klein Chemical Co., Ltd., Germany, with the brand name LICOWAX SGR.

[0036] In the epoxy molding compound of the present invention, the auxiliary agent may be at least one of a promoter, a coupling agent, a tackifier, an ion trap, a low stress modifier and a colorant. In the most preferred embodiment, the auxiliary agent is a combination of a promoter, a coupling agent, a tackifier, an ion trap, a low stress modifier and a colorant, and the mass ratio of the promoter, the coupling agent, the tackifier, the ion trap, the low stress modifier and the colorant may be 1: (0.1-1): (0.05-0.3): (0.1-0.8): (0.2-1): (0.1-1), more preferably 1: (0.5-0.8): (0.1-0.2): (0.2-0.5): (0.5-0.8): (0.3-0.8).

[0037] In the epoxy molding compound of the present invention, the accelerator can be at least one of triphenylphosphine, 2-methylimidazole, diazabicyclo, 2-phenyl-4-tetramethylimidazole and a coupling compound of triphenylphosphine oxide and p-benzoquinone. In the most preferred embodiment, the accelerator is triphenylphosphine. In a specific embodiment, the triphenylphosphine can be purchased from Hangzhou Ruike Chemical Co., Ltd., and the brand is TPP.

[0038] In the epoxy molding compound of the present invention, the coupling agent can be triethoxysilane and / or N-phenyl-3-aminopropyltrimethoxysilane. In the most preferred embodiment, the coupling agent is a combination of triethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane, and the weight ratio of the triethoxysilane to the N-phenyl-3-aminopropyltrimethoxysilane is 1:(0.5-2), preferably 1:(0.8-1.5). In a specific embodiment, the triethoxysilane can be purchased from Shandong Huanzheng Chemical Co., Ltd., with the brand name KH560; the N-phenyl-3-aminopropyltrimethoxysilane can be purchased from Andy Light Technology Co., Ltd., with the brand name KBM-573.

[0039] In the epoxy molding compound of the present invention, the tackifier can be at least one of triazole, 3-amino-1,2,4-triazole and nitrogen-containing phenolic resin. In the most preferred embodiment, the tackifier is triazole. In a specific embodiment, the triazole is purchased from Wuhan Kanos Technology Co., Ltd.

[0040] In the epoxy molding compound of the present invention, the ion capture agent can be at least one of an anion capture agent, a cation capture agent and a yin-yang composite ion capture agent. In the most preferred embodiment, the ion capture agent is a yin-yang composite ion capture agent. In a specific embodiment, the ion capture agent is hydrotalcite. The hydrotalcite can be purchased from Kyowa Chemical Industry Co., Ltd. of Japan, and the brand is DHT-4C.

[0041] In the epoxy molding compound of the present invention, the low stress modifier can be polyether-modified polyorganosiloxane and / or epoxidized polybutadiene. In the most preferred embodiment, the low stress modifier is polyether-modified polyorganosiloxane. In a specific embodiment, the polyether-modified polyorganosiloxane can be purchased from Shanghai Youli International Trading Co., Ltd., with the brand name of Silaesycoat-6811.

[0042] In the epoxy molding compound of the present invention, in a preferred case, the colorant is carbon black. In a specific embodiment, the carbon black can be purchased from Mitsubishi Corporation of Japan, with the brand name CARBON BLACK 5.

[0043] The preparation method of the above-mentioned epoxy molding compound may include: mixing epoxy resin, phenolic resin, release agent and auxiliary agent to obtain a mixed material, then kneading, and then cooling, crushing and preforming in sequence. The cooling process may include: placing the mixed epoxy molding compound on a sample rack to cool naturally. The crushing process may include: crushing the cooled epoxy molding compound on a double-roll mill. The preforming process may include: pressing the crushed epoxy molding compound into a cake on a preforming machine.

[0044] In the method of the present invention, preferably, the mixing conditions include: temperature of 70-90°C, time of 5-15 min. More preferably, the mixing conditions include: temperature of 72-85°C, time of 6-13 min. The mixing process can be implemented in various conventional mixing equipment in the art.

[0045] In a specific embodiment, the mixing device may be an open mixer. The working conditions of the open mixer may include: the temperature of the main roller is 70-80°C, and the temperature of the auxiliary roller is 80-90°C. In a more preferred case, the working conditions of the open mixer include: the temperature of the main roller is 72-76°C, and the temperature of the auxiliary roller is 82-88°C.

[0046] The invention also provides application of the epoxy molding compound in semiconductor packaging materials.

[0047] The following examples further illustrate the epoxy molding compound and its preparation method and application of the present invention. The examples are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes, but the protection scope of the present invention is not limited to the following examples.

[0048] The experimental methods in the following examples, unless otherwise specified, are all conventional methods in the art. The experimental materials used in the following examples, unless otherwise specified, are all commercially available.

[0049] In the following examples and comparative examples, the epoxy molding compound was tested according to the following method:

[0050] Fluidity test: Take 30g sample and use resin transfer injection molding machine to make sample with the help of metal mold. There are two flow channels with different thicknesses in the metal mold. Use vernier caliper to measure the flow length of the two flow channels of plastic encapsulation material with different thicknesses, and then calculate the ratio of the two.

[0051] Appearance inspection: Use plastic packaging material to seal the product, and then place the sealed product under an optical microscope to check whether there are problems such as air holes or poor filling.

[0052] Example 1

[0053] (1) 6.55 g of epoxy resin (5.56 g of biphenyl phenol type epoxy resin (brand name SQXN323, purchased from Shengquan Chemical Manufacturing Co., Ltd.) and 1.00 g of o-cresol epoxy resin (brand name SQNC700-1.3, purchased from Shengquan Chemical Manufacturing Co., Ltd.)), 3.00 g of phenolic resin (brand name MEH7800-4S, purchased from Meiwa Industry Co., Ltd.), 0.30 g of mold release agent (0.15 g of Clariant E wax (brand name LICOWAX EFL, purchased from Klein Chemical Co., Ltd., Germany) and 0.15 g of Clariant S wax (brand name LICOWAX SGR, purchased from Klein Chemical Co., Ltd., Germany), 0.07g of triazole (thickener), 88.0g of silica (brand number NQ1350D, purchased from Jiangsu Lianrui New Materials Co., Ltd.), 0.70g of triphenylphosphine (accelerator), 0.38g of coupling agent (0.19g of triethoxysilane and 0.19g of N-phenyl-3-aminopropyltrimethoxysilane), 0.20g of hydrotalcite (ion capture agent), 0.40g of polyether modified polyorganosiloxane (low stress modifier) ​​and 0.40g of carbon black (colorant) are mixed in a pulverizer to obtain a mixture.

[0054] (2) The mixture obtained in step (1) is added to an open mixer for mixing. The temperature of the main roller is 75° C. and the temperature of the auxiliary roller is 85° C. After mixing for 9 minutes, the rollers are removed, and then naturally cooled, crushed, and preformed in sequence to obtain the epoxy molding compound A1 of the present invention.

[0055] The epoxy molding compound A1 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A1 is 1.64, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0056] Example 2

[0057] (1) 6.58 g of epoxy resin (5.61 g of biphenyl phenol type epoxy resin (brand name SQXN323, purchased from Shengquan Chemical Manufacturing Co., Ltd.) and 0.97 g of o-cresol epoxy resin (brand name SQNC700-1.3, purchased from Shengquan Chemical Manufacturing Co., Ltd.)), 2.95 g of phenolic resin (brand name MEH7800-4S, purchased from Meiwa Industry Co., Ltd.), 0.32 g of release agent (0.16 g of Clariant E wax (brand name LICOWAX EFL, purchased from Klein Chemical Co., Ltd., Germany) and 0.16 g of Clariant S wax (brand name LICOWAX SGR, purchased from Klein Chemical Co., Ltd., Germany), 0.14g of triazole (thickener), 89.5g of silica (brand number NQ1350D, purchased from Jiangsu Lianrui New Materials Co., Ltd.), 0.7g of triphenylphosphine (accelerator), 0.35g of coupling agent (0.15g of triethoxysilane and 0.16g of N-phenyl-3-aminopropyltrimethoxysilane), 0.14g of hydrotalcite (ion capture agent), 0.56g of polyether modified polyorganosiloxane (low stress modifier) ​​and 0.21g of carbon black (colorant) were mixed in a pulverizer to obtain a mixture.

[0058] (2) The mixture obtained in step (1) is added to an open mixer for mixing, with the main roller temperature being 75° C. and the auxiliary roller temperature being 85° C. After mixing for 9 minutes, the rollers are lowered, and then naturally cooled, crushed, and preformed in sequence to obtain the epoxy molding compound A2 of the present invention.

[0059] The epoxy molding compound A2 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A2 is 1.66, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0060] Example 3

[0061] (1) 6.60 g of epoxy resin (5.58 g of biphenyl phenol type epoxy resin (brand name SQXN323, purchased from Shengquan Chemical Manufacturing Co., Ltd.) and 1.02 g of o-cresol epoxy resin (brand name SQNC700-1.3, purchased from Shengquan Chemical Manufacturing Co., Ltd.)), 3.02 g of phenolic resin (brand name MEH7800-4S, purchased from Meiwa Industry Co., Ltd.), 0.31 g of release agent (0.14 g of Clariant E wax (brand name LICOWAX EFL, purchased from Klein Chemical Co., Ltd., Germany) and 0.17 g of Clariant S wax (brand name LICOWAX SGR, purchased from Klein Chemical Co., Ltd., Germany), 0.08g of triazole (thickener), 87.4g of silica (brand number NQ1350D, purchased from Jiangsu Lianrui New Materials Co., Ltd.), 0.7g of triphenylphosphine (accelerator), 0.56g of coupling agent (0.27g of triethoxysilane and 0.29g of N-phenyl-3-aminopropyltrimethoxysilane), 0.35g of hydrotalcite (ion capture agent), 0.35g of polyether modified polyorganosiloxane (low stress modifier) ​​and 0.56g of carbon black (colorant) were mixed in a pulverizer to obtain a mixture.

[0062] (2) The mixture obtained in step (1) is added to an open mixer for mixing, with the main roller temperature being 75° C. and the auxiliary roller temperature being 85° C. After mixing for 9 minutes, the rollers are removed, and then naturally cooled, crushed, and preformed in sequence to obtain the epoxy molding compound A3 of the present invention.

[0063] The epoxy molding compound A3 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A3 is 1.67, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0064] Example 4

[0065] The epoxy molding compound was prepared according to the method of Example 1, except that the brand of silicon powder was NQ1360D (purchased from Jiangsu Lianrui New Materials Co., Ltd.), and the epoxy molding compound A4 of the present invention was obtained by mixing.

[0066] The epoxy molding compound A4 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A4 is 1.65, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0067] Example 5

[0068] The epoxy molding compound was prepared according to the method of Example 1, except that the silicon powder was a mixture of 44 g of silicon powder with the brand NQ1360D (purchased from Jiangsu Lianrui New Materials Co., Ltd.) and 44 g of silicon powder with the brand NQ101 (purchased from Jiangsu Lianrui New Materials Co., Ltd.), and the epoxy molding compound A5 of the present invention was obtained by mixing.

[0069] The epoxy molding compound A5 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A5 is 1.70, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0070] Example 6

[0071] The epoxy molding compound was prepared according to the method of Example 1, except that the silicon powder was a mixture of 44 g of silicon powder with the brand NQ1360D (purchased from Jiangsu Lianrui New Materials Co., Ltd.) and 44 g of silicon powder with the brand DQ2150 (purchased from Jiangsu Lianrui New Materials Co., Ltd.), and the epoxy molding compound A6 of the present invention was obtained by mixing.

[0072] The epoxy molding compound A6 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A6 is 1.68, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0073] Example 7

[0074] The epoxy molding compound was prepared according to the method of Example 1, except that the silicon powder was a mixture of 66 g of silicon powder with the brand NQ1360D (purchased from Jiangsu Lianrui New Materials Co., Ltd.) and 22 g of silicon powder with the brand DF-1220M (purchased from Jiangsu Lianrui New Materials Co., Ltd.), and the epoxy molding compound A7 of the present invention was obtained by mixing.

[0075] The epoxy molding compound A7 was subjected to a fluidity test and an appearance inspection, and the results are as follows: the fluidity ratio of the epoxy molding compound A7 is 1.72, and the appearance of the encapsulated product is good, without air holes, leaks, etc.

[0076] Comparative Example 1

[0077] The epoxy molding compound was prepared according to the method of Example 1, except that the grade of silicon powder was NQ1800A (maximum particle size was 180 μm), and epoxy molding compound D1 was obtained by mixing.

[0078] The epoxy molding compound D1 was subjected to a fluidity test and an appearance inspection, and the results were as follows: the fluidity ratio of the epoxy molding compound D1 was 1.80, and the appearance of the encapsulated product showed air holes, leaks, and the like.

[0079] Comparative Example 2

[0080] The epoxy molding compound was prepared according to the method of Example 1, except that the content and proportion of each component were adjusted as follows: 7.00 g of epoxy resin (5.50 g of biphenyl phenol type epoxy resin (brand name SQXN323, purchased from Shengquan Chemical Manufacturing Co., Ltd.) and 1.50 g of o-cresol epoxy resin (brand name SQNC700-1.3, purchased from Shengquan Chemical Manufacturing Co., Ltd.)), 3.00 g of phenolic resin (brand name MEH7800-4S, purchased from Meiwa Industry Co., Ltd.), 0.3 g of release agent (0.15 g of Clariant E wax (brand name LICOWAX EFL, purchased from Klein Chemical Co., Ltd., Germany) and 0.15g Clariant S wax (brand name LICOWAXSGR, purchased from Klein Chemical Co., Ltd., Germany)), 0.1g triazole (tackifier), 45.0g silica (brand name NQ1350D, purchased from Jiangsu Lianrui New Materials Co., Ltd.), 1.0g triphenylphosphine (accelerator), 0.50g coupling agent (0.25g triethoxysilane and 0.25g N-phenyl-3-aminopropyltrimethoxysilane), 0.35g hydrotalcite (ion capture agent), 0.35g polyether modified polysiloxane (low stress modifier) ​​and 0.60g carbon black (colorant) were mixed to obtain epoxy molding compound D2.

[0081] The epoxy molding compound D2 was subjected to a fluidity test and an appearance inspection, and the results were as follows: the fluidity ratio of the epoxy molding compound D2 was 1.84, and the appearance of the encapsulated product showed air holes, leaks, and the like.

[0082] The fluidity and apparent parameters of the molding compounds of the above-mentioned embodiments and comparative examples are shown in Table 1.

[0083] Table 1

[0084] serial number Liquidity Ratio Test results Example 1 1.64 Appearance qualified Example 2 1.66 Appearance qualified Example 3 1.67 Appearance qualified Example 4 1.65 Appearance qualified Example 5 1.70 Appearance qualified Example 6 1.68 Appearance qualified Example 7 1.72 Appearance qualified Comparative Example 1 1.80 Pores, leaks, etc. Comparative Example 2 1.84 Pores, leaks, etc.

[0085] It can be seen from the results in Table 1 that the epoxy molding compound prepared by the method described in the present invention has excellent fluidity and packaging processability, and is not prone to air holes, leaks, etc. during the semiconductor material packaging process.

[0086] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that: The epoxy molding compound contains silicon powder, epoxy resin, phenolic resin, a mold release agent and an auxiliary agent, wherein, based on the total weight of the epoxy molding compound being 100 weight percent, the content of the silicon powder is 80-90 weight percent, the content of the epoxy resin is 5-12 weight percent, the content of the phenolic resin is 1-8 weight percent, the content of the mold release agent is 0.1-0.5 weight percent, and the content of the auxiliary agent is 0.5-3 weight percent; the silicon powder is at least one of crystalline silicon dioxide, fused silicon dioxide and silicon dioxide modified by a coupling agent, and the maximum particle size of the silicon powder is 55-132 μm, and the particle size distribution of the silicon powder is 70% <D90<90%。 2. The epoxy molding compound according to claim 1, characterized in that: Based on the total weight of the epoxy molding compound being 100 weight percent, the content of the silicon powder is 85-90 weight percent, the content of the epoxy resin is 6-10 weight percent, the content of the phenolic resin is 2-7 weight percent, the content of the release agent is 0.1-0.4 weight percent, and the content of the auxiliary agent is 1-3 weight percent.

3. The epoxy molding compound according to claim 1 or 2, characterized in that: The maximum particle size of the silicon powder is 60-75 μm, and the particle size distribution of the silicon powder is 74%. <D90<83%。 4. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The epoxy resin is at least one of biphenyl phenol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, o-cresol epoxy resin, multifunctional epoxy resin, bisphenol A type epoxy resin and bisphenol F type epoxy resin.

5. The epoxy molding compound according to any one of claims 1 to 4, characterized in that: The phenolic resin is at least one of linear phenolic resin, biphenyl phenolic resin, naphthalene-containing phenolic resin, phenol-aralkyl phenolic resin and multifunctional phenolic resin.

6. The epoxy molding compound according to any one of claims 1 to 5, characterized in that: The release agent is at least one of oxidized polyethylene wax, stearic acid wax, polyhydroxy long-chain fatty acid wax and polyamide wax.

7. The epoxy molding compound according to any one of claims 1 to 6, characterized in that: The auxiliary agent is at least one of a promoter, a coupling agent, a tackifier, an ion capture agent, a low stress modifier and a colorant; Preferably, the accelerator is at least one of triphenylphosphine, 2-methylimidazole, diazabicyclo, 2-phenyl-4-tetramethylimidazole and a coupling compound of triphenylphosphine oxide and p-benzoquinone; Preferably, the coupling agent is triethoxysilane and / or N-phenyl-3-aminopropyltrimethoxysilane; Preferably, the tackifier is at least one of triazole, 3-amino-1,2,4-triazole and nitrogen-containing phenolic resin; Preferably, the ion capture agent is at least one of an anion capture agent, a cation capture agent and an anion-cation composite ion capture agent; Preferably, the low stress modifier is polyether-modified polyorganosiloxane and / or epoxidized polybutadiene; Preferably, the colorant is carbon black.

8. A method for preparing the epoxy molding compound according to any one of claims 1 to 7, characterized in that: The method comprises: mixing silicon powder, epoxy resin, phenolic resin, a release agent and an auxiliary agent, kneading the obtained mixture, and then sequentially cooling, crushing and preforming.

9. The method according to claim 8, characterized in that The mixing conditions include: temperature of 70-90° C. and time of 5-15 min.

10. Use of the epoxy molding compound according to any one of claims 1 to 7 in a semiconductor packaging process.