Biochip

Abstract

A biochip comprises a circuit substrate, a packaging material layer and an upper substrate. A conductive pad is arranged on the circuit substrate. The packaging material layer is arranged on the circuit substrate. The packaging material layer defines a through hole, wherein a vertical projection of the through hole on the circuit substrate covers the conductive pad. The upper substrate comprises a first conductive layer. A first opening is arranged on the upper substrate, and the first conductive layer is exposed from the first opening. The vertical projection of the first opening on the circuit substrate overlaps the vertical projection of the through hole on the circuit substrate.

Description

Technical Field

[0001] The invention relates to a biochip. Background Art

[0002] Biochips are miniaturized devices that can be used to perform biological reactions or analyses. They are a very important technology in biotechnology. Specifically, biochips can be used to screen drugs, pathogens, blood, tissues, plants, etc., perform biochemical or enzyme reactions, and analyze the composition of organisms.

[0003] The biochip may include a circuit substrate and an upper substrate, and the electric field formed therebetween may drive the biomaterial to be tested. In a conventional biochip, the conductive glue used to electrically connect the circuit substrate and the upper substrate is usually dispensed on the circuit substrate first, and then the circuit substrate and the upper substrate are combined. However, the distance between the circuit substrate and the upper substrate of the biochip is quite large, and the size of the conductive glue formed by the above dispensing method is difficult to control, which may affect the stability of the above electrical connection. Summary of the invention

[0004] The object of the present invention is to provide a biochip, wherein the conductive adhesive used to electrically connect the circuit substrate and the upper substrate has a sufficient height and an appropriate width, and the manufacturing yield of the biochip is high.

[0005] According to one embodiment of the present invention, a biochip is provided, comprising a circuit substrate, a packaging material layer and an upper substrate. A conductive pad is provided on the circuit substrate. The packaging material layer is disposed on the circuit substrate. The packaging material layer defines a through hole, wherein a vertical projection of the through hole on the circuit substrate covers the conductive pad. The upper substrate comprises a first conductive layer. A first opening is provided on the upper substrate, and the first conductive layer is exposed from the first opening. The vertical projection of the first opening on the circuit substrate overlaps the vertical projection of the through hole on the circuit substrate.

[0006] Based on the above, the biochip provided by the present invention is configured with a packaging material layer and a through hole defined by the packaging material layer. The size of the conductive glue filled in the through hole is easy to control and can have a sufficient height and an appropriate width to ensure the electrical connection between the circuit substrate and the upper substrate, and the manufacturing yield of the biochip is high.

[0007] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram showing a method for manufacturing a biochip according to a comparative example.

[0009] Figure 2A schematic diagram showing a method for manufacturing a biochip according to an embodiment of the present invention.

[0010] Figure 3A A schematic plan view of a biochip according to an embodiment of the present invention is shown, Figure 3B Show Figure 3A Schematic diagram of a partial cross section of a biowafer along line BB', Figure 3C Show Figure 3A Schematic diagram of the configuration of some components in a biochip.

[0011] FIG. 4A to FIG. 4C A partial schematic diagram of a biochip according to an embodiment of the present invention is shown.

[0012] Figure 5 A partial schematic diagram of a biochip according to an embodiment of the present invention is shown.

[0013] The reference numerals are as follows:

[0014] 100, 200: Biochip

[0015] 101, 201: Circuit board

[0016] 102, 202: Upper substrate

[0017] 103, 203: packaging material layer

[0018] 104: Conductive adhesive

[0019] 202H, JO: Open hole

[0020] 203H:Through hole

[0021] 301: Conductive layer

[0022] 302: Conductive adhesive

[0023] 302T: Top surface

[0024] 303, 304: base

[0025] 501: Protective layer

[0026] AG: Air Gap

[0027] BL: Buffer layer

[0028] CL: Control electrode layer

[0029] GI: Gate Insulation Layer

[0030] H1, H2: Hydrophobic layer

[0031] IB: Ion Barrier Layer

[0032] M1: First metal layer

[0033] M2: Second metal layer

[0034] M1P: Conductive pad

[0035] POL: Active Layer

[0036] S / D: Source / Drain

[0037] TA: Biomaterial Testing Area DETAILED DESCRIPTION

[0038] Reference Figure 1 , which shows a schematic diagram of a biochip manufacturing method according to a comparative example. The biochip manufacturing method of this comparative example includes configuring a packaging material layer 103 and a conductive adhesive 104 on a circuit substrate 101, and then combining the circuit substrate 101 with an upper substrate 102 to form a biochip 100. In this comparative example, the spacing between the circuit substrate 101 and the upper substrate 102 of the biochip 100 is approximately 100 microns to 200 microns. Compared to the spacing between the upper and lower substrates of a liquid crystal display (approximately 5 microns to 10 microns), the spacing between the circuit substrate 101 and the upper substrate 102 of the biochip 100 is quite large, making it difficult to pass Figure 1 The biowafer manufacturing method shown produces a conductive paste 104 having a moderate height and a small width, and it is difficult to control the size of the conductive paste 104.

[0039] Reference Figure 2 , which shows a schematic diagram of a biochip manufacturing method according to an embodiment of the present invention. The biochip manufacturing method of this embodiment includes configuring a packaging material layer 203 on a circuit substrate 201 to form a plurality of through holes 203H; configuring a plurality of openings 202H on an upper substrate 202, and then combining the circuit substrate 201 with the upper substrate 202, wherein the plurality of openings 202H correspond to the plurality of through holes 203H respectively; and injecting a conductive glue 302 into the corresponding plurality of through holes 203H through the plurality of openings 202H to form a biochip 200. In this embodiment, the packaging material layer 203 may include a sealant, a frame sealant, a packaging glue, and the like, and the conductive glue 302 may be, for example, a silver glue, and the spacing between the circuit substrate 201 and the upper substrate 202 of the biochip 200 is approximately 100 microns to 200 microns. By configuring the packaging material layer 203 and the plurality of through holes 203H defined by the packaging material layer 203, the conductive glue 302 filled in the plurality of through holes 203H may have a sufficient height and an appropriate width.

[0040] In order to fully illustrate the various embodiments of the present invention, other embodiments of the present invention will be described below. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

[0041] Reference Figure 3A , Figure 3B as well as Figure 3C , Figure 3A A schematic plan view of a biochip according to an embodiment of the present invention is shown, Figure 3B Show Figure 3A Schematic diagram of a partial cross section of a biowafer along line BB', Figure 3C Show Figure 3A Schematic diagram of the configuration of some components in a biochip.

[0042] The biochip 200 of this embodiment includes a circuit substrate 201, a packaging material layer 203, and an upper substrate 202. A conductive pad M1P is disposed on the circuit substrate 201. The packaging material layer 203 is disposed on the circuit substrate 201 and defines a through hole 203H. The upper substrate 202 includes a conductive layer 301. An opening 202H is disposed on the upper substrate 202, and the conductive layer 301 is exposed from the opening 202H.

[0043] Reference Figure 3B as well as Figure 3C ,in Figure 3C It can be considered as a top perspective view from the opening 202H toward the circuit substrate 201. The vertical projection of the through hole 203H on the circuit substrate 201 covers the conductive pad M1P. The vertical projection of the opening 202H on the circuit substrate 201 overlaps the vertical projection of the through hole 203H on the circuit substrate 201. Figure 3C In the embodiment, the vertical projection of the opening 202H on the circuit substrate 201 completely falls within the vertical projection of the through hole 203H on the circuit substrate 201, but the present invention is not limited thereto. In some embodiments, the vertical projection of the opening 202H partially overlaps with the vertical projection of the through hole 203H.

[0044] In this embodiment, the conductive glue 302 is injected into the through hole 203H through the opening 202H, and a portion of the conductive glue 302 is located in the opening 202H and contacts the conductive layer 301, thereby electrically connecting the circuit substrate 201 and the upper substrate 202. In addition, since the conductive glue 302 is injected into the through hole 203H defined by the packaging material layer 203 after the packaging material layer 203 is configured, an air gap AG may be provided between the conductive glue 302 and the packaging material layer 203, such as Figure 3B shown.

[0045] Please refer to FIG. 4A to FIG. 4C , which respectively show partial schematic diagrams of a biochip according to an embodiment of the present invention. Figure 4A In the illustrated embodiment, the conductive adhesive 302 contacts the conductive layer 301, and the top surface 302T of the conductive adhesive 302 is higher than the top surface of the conductive layer 301 and away from the circuit substrate 201. Figure 4B In the illustrated embodiment, the conductive adhesive 302 contacts the conductive layer 301, and the top surface 302T of the conductive adhesive 302 is coplanar with the top surface of the conductive layer 301 away from the circuit substrate 201. Figure 4C In the illustrated embodiment, the conductive adhesive 302 contacts the conductive layer 301 , and a top surface 302T of the conductive adhesive 302 is lower than a top surface of the conductive layer 301 away from the circuit substrate 201 .

[0046] Re-reference Figure 3A as well as Figure 3B , the biochip 200 includes a biomaterial testing area TA, wherein the upper substrate 202 is configured with an opening JO in the biomaterial testing area TA, and the opening 202H for injecting the conductive glue 302 is configured outside the biomaterial testing area TA. The biomaterial tested by the biochip 200 can be injected into the biomaterial testing area TA through the opening JO. In some embodiments, in order to facilitate the user to observe the biomaterial in the biomaterial testing area TA, the conductive layer 301 is configured as a transparent conductive layer, such as ITO and IZO, but not limited thereto.

[0047] The circuit substrate 201 of the biochip 200 includes a hydrophobic layer H1, and the upper substrate 202 includes a hydrophobic layer H2. The distance between the hydrophobic layer H1 and the hydrophobic layer H2 is greater than or equal to 100 microns. Compared with the spacing between the upper and lower substrates of a liquid crystal display (approximately 5 microns to 10 microns), the spacing between the hydrophobic layer H1 and the hydrophobic layer H2 is quite large. By configuring the packaging material layer 203 and the through hole 203H defined by the packaging material layer 203, the size of the conductive glue 302 filled in the through hole 203H is easy to control, and can have a sufficient height and an appropriate width, ensuring the electrical connection between the circuit substrate 201 and the upper substrate 202, thereby improving the yield of the biochip 200.

[0048] Reference Figure 5 , which shows a partial schematic diagram of a biochip according to an embodiment of the present invention. This embodiment is different from the previous embodiment in that the biochip 200 may further include a protective layer 501. The protective layer 501 may, for example, include a waterproof glue. The protective layer 501 is disposed in the opening 202H and is located on the top surface 302T of the conductive glue 302 away from the circuit substrate 201, so that the conductive glue 302 can be isolated from air and moisture.

[0049] In summary, the biochip provided by the present invention is configured with a packaging material layer and a through hole defined by the packaging material layer. The size of the conductive glue filled in the through hole is easy to control and can have a sufficient height and an appropriate width to ensure the electrical connection between the circuit substrate and the upper substrate, and the manufacturing yield of the biochip is high.

Claims

1. A biochip, comprising: A circuit substrate having a conductive pad disposed thereon; a packaging material layer, disposed on the circuit substrate, the packaging material layer defining a through hole, wherein a vertical projection of the through hole on the circuit substrate covers the conductive pad; as well as The upper substrate comprises a first conductive layer, wherein a first opening is arranged on the upper substrate, the first conductive layer is exposed from the first opening, and a vertical projection of the first opening on the circuit substrate overlaps the vertical projection of the through hole on the circuit substrate.

2. The biochip as described in claim 1 further includes a second conductive layer, which is disposed in the through hole and the first opening, and the second conductive layer contacts the first conductive layer. 3 . The biochip of claim 2 , wherein a top surface of the second conductive layer away from the circuit substrate is higher than a top surface of the first conductive layer away from the circuit substrate. 4 . The biochip of claim 2 , wherein a top surface of the second conductive layer away from the circuit substrate is coplanar with a top surface of the first conductive layer away from the circuit substrate. 5 . The biochip of claim 2 , wherein a top surface of the second conductive layer away from the circuit substrate is lower than a top surface of the first conductive layer away from the circuit substrate.

6. The biochip of claim 2, wherein an air gap is provided between the second conductive layer and the packaging material layer. 7 . The biochip as claimed in claim 1 , further comprising a biomaterial testing area, wherein the upper substrate is configured with a second opening in the biomaterial testing area, and the first opening is configured outside the biomaterial testing area.

8. The biochip of claim 7, wherein the circuit substrate is provided with a first hydrophobic layer in the biomaterial testing area, the upper substrate is provided with a second hydrophobic layer in the biomaterial testing area, and the distance between the first hydrophobic layer and the second hydrophobic layer is greater than or equal to 100 microns.

9. The biochip of claim 1, wherein the first conductive layer is a transparent conductive layer.

10. The biochip as claimed in claim 2, further comprising a protection layer, which is disposed in the first opening and located on a top surface of the second conductive layer away from the circuit substrate.

11. The biochip of claim 1, wherein a vertical projection of the first opening on the circuit substrate completely falls within the vertical projection of the through hole on the circuit substrate.

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