System-in-package structure, manufacturing method thereof and electronic equipment

Abstract

The invention provides a system-in-package structure, a manufacturing method thereof and electronic equipment. The system-in-package structure comprises a substrate; the electronic element is arranged on the surface of the substrate, and the top surface and at least part of the side surface of the electronic element form a heat dissipation surface; the heat dissipation layer is attached to the heat dissipation surface; the packaging body is arranged on the surface of the substrate and is used for packaging the electronic element; the heat dissipation layer is attached to the heat dissipation surface of the electronic component, heat generated by the electronic component can be effectively conducted to the heat dissipation layer, the heat dissipation effect of the electronic component is improved, and the performance exertion stability of the electronic component is guaranteed.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor packaging technology. Specifically, the present application relates to a system-level packaging structure and a manufacturing method thereof and an electronic device. Background Art

[0002] System In a Package (SiP) has become a key component for realizing high-performance and highly integrated electronic products.

[0003] However, after the chip in the SiP is plastic-sealed, due to its compact structure and dense internal components, the heat dissipation effect of the chip relying on traditional heat dissipation methods is poor, limiting the performance of the chip. Summary of the invention

[0004] An object of the embodiments of the present application is to provide a system-level packaging structure and a manufacturing method thereof and a new technical solution for electronic equipment.

[0005] According to a first aspect of an embodiment of the present application, a system-level packaging structure is provided, including:

[0006] substrate;

[0007] An electronic component, wherein the electronic component is disposed on a surface of the substrate, and a top surface and at least a portion of a side surface of the electronic component form a heat dissipation surface;

[0008] A heat dissipation layer, the heat dissipation layer being attached to the heat dissipation surface;

[0009] A packaging body is arranged on the surface of the substrate and is used to package the electronic component.

[0010] Optionally, the heat dissipation layer is a sputtered metal layer.

[0011] Optionally, the heat dissipation layer has a thickness of 3-20 μm.

[0012] Optionally, the height of the packaging body is lower than the height of the electronic component, and the heat dissipation layer covers the heat dissipation surface and the packaging body.

[0013] Optionally, the height of the packaging body is higher than the height of the electronic component, and the heat dissipation layer covers the heat dissipation surface and the packaging body.

[0014] According to a second aspect of an embodiment of the present application, a method for manufacturing a system-level package structure is provided, which is applied to the system-level package structure described in the first aspect, and the system-level package structure includes:

[0015] Disposing electronic components on a surface of the substrate;

[0016] Encapsulating the electronic components and exposing the heat dissipation surface;

[0017] The heat dissipation layer is attached to the heat dissipation surface.

[0018] Optionally, packaging the electronic component and exposing the heat dissipation surface comprises:

[0019] Covering electronic components in a system-level package structure with a thin film;

[0020] Encapsulating the electronic component, wherein the height of the encapsulation body is lower than the height of the electronic component;

[0021] The film on the heat dissipation surface is removed.

[0022] Optionally, packaging the electronic component and exposing the heat dissipation surface comprises:

[0023] Encapsulating the electronic component, wherein the height of the encapsulation body is higher than the height of the electronic component;

[0024] The packaging body on the heat dissipation surface is removed by laser ablation.

[0025] Optionally, attaching the heat dissipation layer to the heat dissipation surface comprises:

[0026] At least a portion of the heat dissipation layer is formed on the heat dissipation surface by sputtering.

[0027] According to a third aspect of an embodiment of the present application, an electronic device is provided, wherein the electronic device includes the system-level packaging structure described in the first aspect.

[0028] A technical effect of this application is:

[0029] An embodiment of the present application provides a system-level packaging structure, which includes a substrate; an electronic component, which is arranged on the surface of the substrate, and the top surface and at least part of the side surface of the electronic component form a heat dissipation surface; a heat dissipation layer, which is attached to the heat dissipation surface; a packaging body, which is arranged on the surface of the substrate and is used to package the electronic component; the heat dissipation layer is attached to the heat dissipation surface of the electronic component, and can effectively conduct the heat generated by the electronic component to the heat dissipation layer, thereby improving the heat dissipation effect of the electronic component and ensuring the stability of the performance of the electronic component.

[0030] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0032] Figure 1A schematic diagram of a system-level packaging structure provided by an embodiment of the present application;

[0033] Figure 2 A schematic diagram of another system-level packaging structure provided by an embodiment of the present application;

[0034] Figure 3 A packaging flow chart of a system-level packaging structure provided by one embodiment of the present application;

[0035] Figure 4 A packaging flow chart of another system-level packaging structure provided for one embodiment of the present application.

[0036] Among them: 1. substrate; 2. electronic components; 3. heat dissipation layer; 4. packaging body. DETAILED DESCRIPTION

[0037] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0038] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0039] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0043] System-in-Package (SiP) is a trend of high-density integrated packaging of devices, which can be widely used in module system integrated chips such as central processing units, storage, communications, power management and charging in electronic products.

[0044] Reference Figure 1 and Figure 2 , an embodiment of the present application provides a system-level package structure, the system-level package structure comprising:

[0045] substrate1;

[0046] The electronic component 2 is arranged on the surface of the substrate 1, and the top surface and at least part of the side surface of the electronic component 2 form a heat dissipation surface;

[0047] The heat dissipation layer 3 is attached to the heat dissipation surface;

[0048] The packaging body 4 is disposed on the surface of the substrate 1 and is used to package the electronic component 2 .

[0049] In this embodiment, the system-level package structure includes one or more electronic components 2, and the substrate 1 provides physical support for the electronic components 2, which can ensure the stability of the electronic components 2 during manufacturing and use. In addition, circuits are designed inside the substrate 1, which can conduct the electrical signals inside the electronic components 2 to the external circuits and provide the necessary power for the electronic components 2.

[0050] See also Figure 1 The electronic component 2 is arranged on at least one side surface of the substrate 1. For example, the electronic component 2 is only arranged on the upper surface of the substrate 1, or the electronic component 2 is only arranged on the lower surface of the substrate 1, or the electronic component 2 can be arranged on both the upper surface and the lower surface of the substrate 1; the electronic component 2 may include a processing chip, and the processing chip can execute instructions such as data processing, logical operations and control operations, thereby ensuring the computing power and response speed of the system-level packaging structure.

[0051] The electronic component 2 is prone to generate heat when executing the above instructions, especially when performing high-speed calculations with large processing volume. The top surface and at least part of the side surfaces of the electronic component 2 can form a heat dissipation surface to dissipate the heat generated by the electronic component 2 to the outside.

[0052] In this embodiment, the electronic component 2 is arranged on the surface of the substrate 1, and the top surface of the electronic component 2 can be a side surface of the electronic component 2 away from the substrate 1, and the heat generated by the electronic component 2 can be dissipated from the side of the electronic component 2 away from the substrate 1; at the same time, the side surface of the electronic component 2 can be a surface on the electronic component 2 adjacent to the top surface, and the area of ​​the heat dissipation surface is increased by the top surface and side surface of the electronic component 2, thereby improving the heat dissipation efficiency of the electronic component 2.

[0053] It is worth noting that the heat dissipation surface in the embodiment of the present application may include all side surfaces of the electronic component 2, that is, the heat dissipation surface is formed by the top surface and all side surfaces of the electronic component 2, thereby increasing the area on the electronic component 2 for heat dissipation; or, the heat dissipation surface may include a portion of the side surfaces of the electronic component 2, and the remaining portion of the side surfaces of the electronic component 2 may be packaged by the packaging body 4, thereby ensuring that the electronic component 2 dissipates heat in a timely manner and achieving stable installation of the electronic component 2 on the substrate 1.

[0054] In this embodiment, see Figure 1 and Figure 2 , the heat dissipation layer 3 is attached to the heat dissipation surface of the electronic component 2, which can more effectively conduct the heat generated by the electronic component 2 to the heat dissipation layer 3, and the heat dissipation layer 3 and the electronic component 2 can be tightly attached, such as by setting the heat dissipation layer 3 on the heat dissipation surface of the electronic component 2 by sputtering or chemical deposition, so as to reduce the obstacles to heat transfer from the electronic component 2 to the heat dissipation layer 3, so that the heat generated by the electronic component 2 can be dissipated more quickly through the heat dissipation layer 3 to the air outside the system-level packaging structure, thereby improving the heat dissipation efficiency of the system-level packaging structure.

[0055] In some embodiments, the heat dissipation layer 3 may be a metal layer, which is attached to the top surface and at least part of the side surface of the electronic component 2, thereby increasing the contact area between the electronic component 2 and the metal layer, making the heat dissipation of the electronic component 2 more uniform, and at the same time, the metal layer can form an electromagnetic shield for the electronic component 2 to prevent external electromagnetic waves from interfering with the electronic component 2. During the signal transmission process of the electronic component 2, the metal layer can shield the external electromagnetic interference, thereby improving the quality and reliability of the signal transmission of the electronic component 2.

[0056] In one embodiment, when the packaging body 4 encapsulates the electronic component 2, the portion of the top of the system-level packaging structure that is exposed to the outside includes the top surface of the packaging body 4 and the heat dissipation surface of the electronic component 2, and the heat dissipation layer 3 can only be attached to the heat dissipation surface of the electronic component 2. On the basis of ensuring the heat dissipation of the electronic component 2, the setting area of ​​the heat dissipation layer 3 is reduced.

[0057] In another embodiment, see Figure 1 and Figure 2 When the packaging body 4 encapsulates the electronic component 2, the heat dissipation layer 3 can be attached to the top surface of the packaging body 4 and the heat dissipation surface of the electronic component 2. On the basis of ensuring the heat dissipation of the electronic component 2, the shielding effect of the heat dissipation layer 3 made of metal material on the electronic component 2 is enhanced.

[0058] In one embodiment, components other than the electronic component 2 may be disposed on the surface of the substrate 1. The heat generated by the components is relatively low, for example, the heat generated by the components is less than the heat generated by the electronic component 2. The components may be directly packaged in the package body 4, that is, there is no need to set a heat dissipation layer 3 on the components, thereby simplifying the structure of the system-level packaging structure.

[0059] The system-level packaging structure provided in the embodiment of the present application includes a substrate 1; an electronic component 2, which is arranged on the surface of the substrate 1, and the top surface and at least part of the side surface of the electronic component 2 form a heat dissipation surface; a heat dissipation layer 3, which is attached to the heat dissipation surface; a packaging body 4, which is arranged on the surface of the substrate 1 and is used to encapsulate the electronic component 2; the heat dissipation layer 3 is attached to the heat dissipation surface of the electronic component 2, and can effectively conduct the heat generated by the electronic component 2 to the heat dissipation layer 3, thereby improving the heat dissipation effect of the electronic component 2 and ensuring the stability of the performance of the electronic component 2.

[0060] In one embodiment, the heat dissipation layer 3 is a sputtered metal layer, for example, the heat dissipation layer 3 is a stainless steel layer, a copper layer or an aluminum alloy layer.

[0061] In this embodiment, the metal plating has high thermal conductivity and can quickly conduct away the heat generated by the electronic component 2, thereby maintaining the normal operating temperature of the electronic component 2; and the metal layer can form an electromagnetic shield for the electronic component 2 to prevent external electromagnetic waves from interfering with the electronic component 2.

[0062] In addition, the metal layer formed by sputtering technology can be tightly combined with the heat dissipation surface of the electronic component 2. For example, the bonding force between the metal layer and the heat dissipation surface of the electronic component 2 can reach 10-200MPa, so that the metal layer is evenly covered on the heat dissipation surface of the electronic component 2, ensuring that the heat generated by the electronic component 2 can be effectively conducted in multiple directions, further improving the efficiency of heat transfer of the electronic component 2.

[0063] In one embodiment, the thickness of the heat dissipation layer 3 is 3-20 μm.

[0064] In this embodiment, the thickness of the heat dissipation layer 3 is controlled within the range of 3-20 μm, for example, the thickness of the heat dissipation layer 3 is set to 5 μm, 8 μm, 10 μm, 13 μm or 18 μm, so that the heat dissipation layer 3 can effectively conduct the heat generated by the electronic component 2, and at the same time, the thermal resistance will not be increased due to the excessive thickness of the heat dissipation layer 3, so that the electronic component 2 responds to temperature changes more quickly, thereby improving the heat dissipation efficiency of the electronic component 2.

[0065] In a specific embodiment, the thickness of the heat dissipation layer 3 is 6 μm, so as to balance the heat dissipation efficiency and material thickness of the heat dissipation layer 3 , and achieve lightweight system-level packaging structure while ensuring the heat dissipation effect of the heat dissipation layer 3 .

[0066] In some embodiments, see Figure 1 and Figure 3 The height of the package body 4 is lower than the height of the electronic component 2 , and the heat dissipation layer 3 covers the heat dissipation surface and the package body 4 .

[0067] In this embodiment, the electronic component 2 may be packaged using a FAM mold (film assisted molding) process, which facilitates exposing the heat dissipation surface of the electronic component 2 while ensuring the packaging effect of the electronic component 2 .

[0068] Specifically, the implementation process of the FAM mold process can be as follows: after the electronic component 2 is set on the surface of the substrate 1, a thin film is covered on the upper surface of the electronic component 2 and the electronic component 2 is embedded in the thin film, and then the electronic component 2 is plastic-sealed by the packaging body 4. Since the thin film blocks the electronic component 2, it can be avoided that the packaging body 4 completely wraps the electronic component 2. Finally, the thin film is removed to expose the heat dissipation surface of the electronic component 2, so that after the system-level packaging structure is cut into single products, the heat dissipation layer 3 can be sputtered on the heat dissipation surface of the electronic component 2.

[0069] In this embodiment, the upper surface and a portion of the side surface of the electronic component 2 are in contact with the heat dissipation layer 3, and the heat dissipation layer 3 covers the heat dissipation surface and the packaging body 4. While achieving large-area heat dissipation of the electronic component 2, the sputtered heat dissipation layer 3 has an electrostatic shielding effect on the electronic component 2, thereby reducing the interference of external electromagnetic waves on the electronic component 2.

[0070] In some embodiments, see Figure 2 and Figure 4 The height of the package body 4 is higher than the height of the electronic component 2 , and the heat dissipation layer 3 covers the heat dissipation surface and the package body 4 .

[0071] In this embodiment, the electronic component 2 may be packaged using a conventional system-level packaging structure packaging process, and the packaging effect of the electronic component 2 is ensured by setting the height of the packaging body 4 to be higher than the height of the electronic component 2 .

[0072] Laser ablation is then used to remove the packaging body 4 on the upper surface and side surfaces of the electronic component 2, exposing the heat dissipation surface of the electronic component 2, so that the heat dissipation layer 3 can be sputtered on the heat dissipation surface of the electronic component 2 after the system-level packaging structure is cut into single products.

[0073] In some embodiments, see Figure 3 The present application embodiment provides a method for manufacturing a system-level package structure, which is applied to the above-mentioned system-level package structure and specifically includes:

[0074] S101, disposing electronic components on the surface of the substrate;

[0075] S102, encapsulating the electronic components and exposing the heat dissipation surface;

[0076] S103, attaching at least a portion of the heat dissipation layer to the heat dissipation surface.

[0077] In the above embodiment, step S101 sets one or more electronic components on the surface of the substrate, which can ensure the accuracy of the position of the electronic components on the substrate, simplify the wiring inside the system-level packaging structure through the reasonable layout of the electronic components, reduce the complexity of the system-level packaging structure, and also help the heat dissipation of the electronic components.

[0078] In step S102, the electronic components packaged by the packaging body are more stable and can maintain normal working conditions under changing environmental conditions; at the same time, exposing the heat dissipation surface can ensure that heat is effectively transferred from the electronic components to the heat dissipation layer, thereby maintaining the normal working temperature of the system-level packaging structure.

[0079] In step S103, a heat dissipation layer may be provided only on the heat dissipation surface, or a heat dissipation layer may be provided on both the heat dissipation surface and the surface of the packaging body. The provision of the heat dissipation layer enables heat to be effectively transferred from the electronic components to the heat dissipation layer, and dissipated to the external environment through the heat dissipation layer, thereby reducing the overall temperature of the system-level packaging structure and improving the heat dissipation efficiency of the electronic components 2 in the system-level packaging structure.

[0080] In one embodiment, packaging the electronic components and exposing the heat dissipation surface includes:

[0081] S1021, covering an electronic component of a system-level package structure with a thin film;

[0082] S1022, encapsulating the electronic component, wherein the height of the encapsulation body is lower than the height of the electronic component;

[0083] S1023, remove the film on the heat dissipation surface.

[0084] In the above embodiment, step S1021 covers the top and side surfaces of the electronic components in the system-level packaging structure with a thin film, so that the electronic components can be isolated and protected by the thin film, thereby preventing the package from directly covering the electronic components.

[0085] When packaging the electronic components in step S1022, by setting the height of the packaging body lower than the height of the electronic components, the heat dissipation surface of the electronic components can be exposed, thereby facilitating the effective dissipation of heat from the electronic components. Moreover, the height of the packaging body is lower than the height of the electronic components, which helps to reduce the overall volume of the system-level packaging structure and achieve compactness of the system-level packaging structure.

[0086] In step S1023, after the electronic component is packaged, the film on the heat dissipation surface is removed to ensure direct contact between the heat dissipation surface of the electronic component and the heat dissipation layer 3, so that the heat conduction path of the electronic component is smoother, thereby improving the stability and reliability of the system-level packaging structure.

[0087] In some embodiments, see Figure 4 The present application embodiment provides a method for manufacturing a system-level package structure, which is applied to the above-mentioned system-level package structure and specifically includes:

[0088] S201, disposing electronic components on the surface of the substrate;

[0089] S202, encapsulating the electronic component, wherein the height of the encapsulation body is higher than the height of the electronic component;

[0090] S203, removing the package on the heat dissipation surface by laser ablation;

[0091] S204, attaching at least a portion of the heat dissipation layer to the heat dissipation surface.

[0092] In this embodiment, Laser ablation is used to remove the packaging body on the upper surface and side surfaces of the electronic component, which can accurately remove the packaging body and expose the heat dissipation surface of the electronic component while avoiding damage to the electronic component. In addition, after the system-level packaging structure is cut into single products, a heat dissipation layer is set on the heat dissipation surface of the electronic component, or a heat dissipation layer is set on the heat dissipation surface of the electronic component and the surface of the packaging body, which can effectively transfer the heat generated by the electronic component and improve the heat dissipation performance of the electronic component.

[0093] In one embodiment, attaching the heat dissipation layer to the heat dissipation surface includes:

[0094] At least a portion of the heat dissipation layer is formed on the heat dissipation surface by sputtering.

[0095] In this embodiment, the heat dissipation layer can be sputtered on the heat dissipation surface of the electronic component, or the heat dissipation layer can be sputtered on the heat dissipation surface of the electronic component and the surface of the package body. The metal layer formed by the sputtering technology can be tightly combined with the heat dissipation surface of the electronic component, so that the metal layer is evenly covered on the heat dissipation surface of the electronic component, ensuring that the heat generated by the electronic component can be effectively conducted in multiple directions, further improving the efficiency of heat transfer of the electronic component.

[0096] An embodiment of the present application provides an electronic device, which includes the above-mentioned system-level packaging structure.

[0097] In this embodiment, the above-mentioned system-level packaging structure is applied to an electronic device, and the heat dissipation layer 3 is attached to the heat dissipation surface of the electronic component 2, which can effectively conduct the heat generated by the electronic component 2 to the heat dissipation layer 3, thereby improving the heat dissipation effect of the electronic component 2 and ensuring the stability of the performance of the electronic device.

[0098] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A system-level packaging structure, characterized in that: include: base(1); An electronic component (2), the electronic component (2) being arranged on a surface of the substrate (1), the top surface and at least a portion of the side surfaces of the electronic component (2) forming a heat dissipation surface; A heat dissipation layer (3), the heat dissipation layer (3) being attached to the heat dissipation surface; A packaging body (4), the packaging body (4) is arranged on the surface of the substrate (1) and is used to package the electronic component (2).

2. The system-level packaging structure according to claim 1, characterized in that: The heat dissipation layer (3) is a sputtered metal layer.

3. The system-level packaging structure according to claim 1 or 2, characterized in that: The heat dissipation layer (3) has a thickness of 3-20 μm.

4. The system-level packaging structure according to claim 1 or 2, characterized in that: The height of the packaging body (4) is lower than the height of the electronic component (2), and the heat dissipation layer (3) covers the heat dissipation surface and the packaging body (4).

5. The system-level packaging structure according to claim 1 or 2, characterized in that: The height of the packaging body (4) is higher than the height of the electronic component (2), and the heat dissipation layer (3) covers the heat dissipation surface and the packaging body (4).

6. A method for manufacturing a system-level packaging structure, applied to the system-level packaging structure according to any one of claims 1 to 5, characterized in that: include: Disposing electronic components on the surface of the substrate; Encapsulating the electronic components and exposing the heat dissipation surface; The heat dissipation layer is attached to the heat dissipation surface.

7. The manufacturing method according to claim 6, characterized in that: The step of packaging the electronic components and exposing the heat dissipation surface comprises: Covering electronic components in a system-level package structure with a thin film; Encapsulating the electronic component, wherein the height of the encapsulation body is lower than the height of the electronic component; The film on the heat dissipation surface is removed.

8. The manufacturing method according to claim 6, characterized in that: The step of packaging the electronic components and exposing the heat dissipation surface comprises: Encapsulating the electronic component, wherein the height of the encapsulation body is higher than the height of the electronic component; The packaging body on the heat dissipation surface is removed by laser ablation.

9. The production method according to any one of claims 6 to 8, characterized in that: The step of attaching the heat dissipation layer to the heat dissipation surface comprises: At least a portion of the heat dissipation layer is formed on the heat dissipation surface by sputtering.

10. An electronic device, characterized in that: The system-level packaging structure comprises the system-level packaging structure as described in any one of claims 1 to 5.

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