Functional packaging structure of power semiconductor

Abstract

The invention provides a functional packaging structure of a power semiconductor, which comprises an epoxy resin packaging shell, a power semiconductor assembly, a packaging contact, a pin seat, a plurality of pins, a packaging fixing structure, a pin fixing structure and a heat dissipation structure, and is characterized in that the power semiconductor assembly is arranged in the epoxy resin packaging shell; the packaging contacts are uniformly arranged on the epoxy resin packaging shell respectively, and each packaging contact comprises an inner pin and a tin soldering point; the epoxy resin packaging shell is sleeved with the pin base, the pins are arranged on the two sides of the pin base in an inserted mode respectively, and connecting grooves are formed in the pins. The packaging fixing structures are arranged on the two sides of the pin base respectively. The pin fixing structures are arranged on the two sides of the pin base respectively. And the heat dissipation structure is arranged on the epoxy resin packaging shell. According to the functional packaging structure of the power semiconductor, the pins can be adjusted and replaced according to requirements so as to cope with different interfaces, meanwhile, it is guaranteed that the pins are not damaged in the packaging process, and normal use of the power semiconductor is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductor packaging, and in particular to a functional packaging structure of a power semiconductor. Background Art

[0002] Power semiconductor packaging is an important link in semiconductor technology. It mainly plays the role of protecting chips, providing electrical and mechanical connections, and ensuring device stability and reliability.

[0003] During the epoxy resin packaging process of conventional power semiconductors, the pins are directly welded to the contacts of the power semiconductors. After packaging, the shape of the pins is fixed and may not be able to cope with different interfaces. In addition, the pins may be deformed, crushed, or broken during the packaging process, which directly leads to poor electrical connections of the power semiconductor devices, resulting in open circuits or short circuits. In the event of a break, the power semiconductor may not work properly. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the purpose of the present invention is to propose a functional packaging structure for power semiconductors, which can adjust and replace pins according to needs to cope with different interfaces, while ensuring that the pins will not be damaged during the packaging process, thereby ensuring the normal use of the power semiconductors.

[0006] To achieve the above-mentioned purpose, the present invention proposes a functional packaging structure of a power semiconductor, comprising an epoxy resin packaging shell, a power semiconductor component, multiple groups of packaging contacts, a pin seat, multiple pins, four groups of packaging fixing structures, two groups of pin fixing structures and a heat dissipation structure, wherein the power semiconductor component is arranged in the epoxy resin packaging shell; the two groups of packaging contacts are respectively and evenly arranged on the epoxy resin packaging shell, the packaging contacts include inner pins and tin soldering points, wherein the inner pins are arranged on the power semiconductor component and are electrically connected thereto, and the bottom ends of the inner pins extend to the ring The outer bottom of the epoxy resin packaging shell, the tin soldering point is arranged at the bottom of the epoxy resin packaging shell and is electrically connected to the bottom end of the inner pin; the pin seat is sleeved on the epoxy resin packaging shell, and a plurality of the pins are respectively inserted and arranged on both sides of the pin seat, and the pins are provided with connecting grooves, and the tin soldering point is located in the connecting groove; four groups of the packaging fixing structures are respectively arranged on both sides of the pin seat; two groups of the pin fixing structures are respectively arranged on both sides of the pin seat; the heat dissipation structure is arranged on the epoxy resin packaging shell and is located on the top of the power semiconductor component.

[0007] According to the functional packaging structure of the power semiconductor of the present invention, the pins can be adjusted and replaced according to needs to cope with different interfaces, while ensuring that the pins will not be damaged during the packaging process, thereby ensuring the normal use of the power semiconductor.

[0008] In addition, the functional packaging structure of the power semiconductor proposed in the application may also have the following additional technical features:

[0009] In one embodiment of the present application, the power semiconductor component includes a base plate and a power semiconductor chip, the base plate is arranged in the epoxy resin packaging shell, the power semiconductor chip is arranged on the top of the base plate, the inner pins are plugged into the base plate, and the inner pins are electrically connected to the power semiconductor chip.

[0010] In one embodiment of the present application, the packaging fixing structure includes a locking block, a control board and a first spring telescopic rod, wherein the locking block is inserted into the epoxy resin packaging shell, a control cavity is opened on the pin seat, the control board is arranged in the control cavity and is connected to the locking block, the top of the control board extends to the outside of the pin seat, and the first spring telescopic rod is arranged on the other side of the control board and is located in the control cavity.

[0011] In one embodiment of the present application, the pin fixing structure includes two groups of external pressure fixing structures and a reinforcement structure, wherein the two groups of external pressure fixing structures are respectively arranged on both sides of the pin seat and are connected to the pin in abutment with each other, and the reinforcement structure is arranged on the pin seat, and the reinforcement structure is connected to the external pressure fixing structure.

[0012] In one embodiment of the present application, the external pressure-fixing structure includes a pressure plate and a fixing hole, wherein the pressure plate is rotatably arranged on one side of the pin seat, the fixing hole is opened on the pin seat, and one end of the pressure plate is inserted into the fixing hole.

[0013] In one embodiment of the present application, the reinforcement structure includes a baffle, two locking heads, two second spring telescopic rods and a pressing block, wherein the baffle is arranged in the fixing hole, the two locking heads are respectively arranged on one side of the baffle and plugged into the corresponding pressure plate, the two second spring telescopic rods are respectively arranged on the other side of the baffle, and the pressing block is arranged on the baffle, and one side of the pressing block extends to the outside of the pin seat.

[0014] In one embodiment of the present application, the heat dissipation structure includes a thermally conductive gasket, a heat dissipation plate and a heat dissipation hole, the thermally conductive gasket is arranged on the top of the power semiconductor chip, the heat dissipation plate is arranged on the top of the thermally conductive gasket, the top of the heat dissipation plate extends to the outside of the epoxy resin packaging shell, and the heat dissipation hole is opened on the heat dissipation plate.

[0015] Compared with the prior art, the beneficial effects of this application are:

[0016] The pins can be adjusted and replaced as needed to cope with different interfaces, while ensuring that the pins will not be damaged during the packaging process to ensure the normal use of power semiconductors.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 A schematic structural diagram of a functional packaging structure of a power semiconductor according to an embodiment of the present invention;

[0020] Figure 2 A cross-sectional view of a functional packaging structure of a power semiconductor according to an embodiment of the present invention;

[0021] Figure 3 A top cross-sectional view of a functional packaging structure of a power semiconductor according to an embodiment of the present invention;

[0022] Figure 4 is an enlarged cross-sectional view of a package contact according to an embodiment of the present invention;

[0023] Figure 5 It is an enlarged top cross-sectional view of a pin fixing structure according to an embodiment of the present invention.

[0024] As shown in the figure: 1. Epoxy resin packaging shell; 2. Power semiconductor component; 21. Base plate; 22. Power semiconductor chip; 3. Package contact; 31. Inner pin; 32. Tin soldering point; 4. Pin seat; 5. Pin; 51. Connection groove; 6. Package fixing structure; 61. Lock block; 62. Control board; 63. First spring telescopic rod; 7. Pin fixing structure; 71. External pressing structure; 711. Pressing plate; 712. Fixing hole; 72. Reinforcement structure; 721. Baffle; 722. Locking head; 723. Second spring telescopic rod; 724. Pressing block; 8. Heat dissipation structure; 81. Thermal conductive gasket; 82. Heat dissipation plate; 83. Heat dissipation hole. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0026] The functional packaging structure of a power semiconductor according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0027] like Figure 1-Figure 5 As shown, the functional packaging structure of the power semiconductor of the embodiment of the present invention includes an epoxy resin packaging shell 1, a power semiconductor component 2, multiple groups of packaging contacts 3, a pin seat 4, multiple pins 5, four groups of packaging fixing structures 6, two groups of pin fixing structures 7 and a heat dissipation structure 8.

[0028] The power semiconductor component 2 is arranged in the epoxy resin packaging shell 1 .

[0029] It should be noted that the epoxy resin packaging shell 1 is formed by epoxy resin injection molding to encapsulate the power semiconductor component 2, thereby providing protection for the internal power semiconductor component 2 to prevent external physical damage, chemical corrosion, electrical interference, etc.

[0030] The two groups of packaging contacts 3 are evenly arranged on the epoxy resin packaging shell 1 , and the packaging contacts 3 include inner pins 31 and soldering points 32 .

[0031] Among them, the inner pin 31 is arranged on the power semiconductor component 2 and is electrically connected thereto, the bottom end of the inner pin 31 extends to the outer bottom of the epoxy resin packaging shell 1, and the solder point 32 is arranged at the bottom of the epoxy resin packaging shell 1 and is electrically connected to the bottom end of the inner pin 31.

[0032] It should be noted that the inner pin 31 is used to connect the contacts on the power semiconductor component 2, introduce the contacts on the power semiconductor component 2 into the outside of the epoxy resin packaging shell 1, and connect to the external interface after the pin 5 is connected. The soldering point 32 has conductive properties, wraps the bottom of the inner pin 31, protects the inner pin 31, and reduces its wear. Even if the soldering point 32 is worn, it is convenient to directly replenish it from the outside of the epoxy resin packaging shell 1.

[0033] The contact points of the power semiconductor component 2 are directly led out to the outside of the epoxy resin packaging shell 1 by means of the inner pins 31 and the soldering points 32, and then the pins 5 are connected, so that the epoxy resin packaging shell 1 will not affect the pins 5 during the packaging process, thus avoiding damage to the pins 5, and also facilitating replacement of the pins 5 when they are damaged.

[0034] The pin holder 4 is sleeved on the epoxy resin packaging shell 1 , and a plurality of pins 5 are respectively inserted and arranged on both sides of the pin holder 4 . The pins 5 are provided with connection grooves 51 , and the soldering points 32 are located in the connection grooves 51 .

[0035] It should be noted that the epoxy resin packaging shell 1 is directly plugged into the pin seat 4 and fixed, and the pins 5 are also movably plugged into both sides of the pin seat 4. Due to the movable connection, it is convenient to replace pins 5 of different shapes later, and damaged pins 5 can also be replaced.

[0036] The pin 5 is provided with a connection groove 51 which can be connected to the soldering point 32 to ensure that the power semiconductor component 2 can be electrically connected to the pin 5 so that the power semiconductor component 2 can operate normally.

[0037] Among them, four groups of packaging fixing structures 6 are respectively arranged on two sides of the pin seat 4 .

[0038] It can be understood that the packaging fixing structure 6 allows the pin seat 4 to be engaged on the epoxy resin packaging shell 1, thereby ensuring the stability of the connection between the epoxy resin packaging shell 1 and the pin seat 4, and also ensuring the stable connection between the solder point 32 and the pin 5, avoiding the separation of the above two during use, resulting in the component not being able to operate normally.

[0039] The two groups of pin fixing structures 7 are respectively arranged on two sides of the pin seat 4 .

[0040] It should be noted that the pin fixing structure 7 can reinforce the multiple pins 5 on both sides of the pin seat 4 at the same time, which can prevent the pins 5 from falling off during use. This structure is also convenient for removing and replacing the pins 5.

[0041] The heat dissipation structure 8 is disposed on the epoxy resin packaging shell 1 and is located on the top of the power semiconductor component 2 .

[0042] It is understandable that the heat dissipation structure 8 disposed on the power semiconductor component 2 can extend to the outside of the epoxy resin packaging shell 1 to enhance the heat dissipation capability of the power semiconductor component 2 .

[0043] The power semiconductor assembly 2 includes a base plate 21 and a power semiconductor chip 22 .

[0044] The base plate 21 is disposed in the epoxy resin packaging shell 1 , the power semiconductor chip 22 is disposed on the top of the base plate 21 , the inner pins 31 are plugged into the base plate 21 , and the inner pins 31 are electrically connected to the power semiconductor chip 22 .

[0045] It should be noted that the base plate 21 can support the power semiconductor chip 22 on the top. The power semiconductor chip 22 can be electrically connected to the inner pin 31 through a lead assembly to ensure that the power semiconductor chip 22 is electrically connected to the external pin 5. The inner pin 31 is arranged on the base plate 21 for reinforcement to improve the structural stability.

[0046] Specifically, during the packaging process, the relevant staff connects the contacts on the power semiconductor chip 22 to the corresponding inner pins 31 through leads, places the power semiconductor chip 22 on the top of the base plate 21, and sets the heat dissipation structure 8 on the top of the power semiconductor chip 22. The above components are packaged by epoxy resin injection molding to form an epoxy resin packaging shell 1 for covering and protection, and the bottom of the inner pin 31 is outside the epoxy resin packaging shell 1.

[0047] The bottom area of ​​the inner pin 31 is soldered to form a soldering point 32, the pin holder 4 and the pin 5 are installed in the epoxy resin packaging shell 1, the pin 5 is reinforced by the pin fixing structure 7, the pin 5 is connected to the soldering point 32 by means of the connecting groove 51, and the pin holder 4 is firmly fixed on the epoxy resin packaging shell 1 by the packaging fixing structure 6, and the power semiconductor chip 22 can be used normally.

[0048] When the pin 5 is damaged or needs to be replaced, the package fixing structure 6 and the pin fixing structure 7 are released, the pin 5 is pulled out and replaced, and after the replacement is completed, it can be fixed again by the package fixing structure 6 and the pin fixing structure 7.

[0049] In one embodiment of the present invention, Figure 2 and Figure 4 As shown, the package fixing structure 6 includes a locking block 61 , a control board 62 and a first spring telescopic rod 63 .

[0050] Among them, the locking block 61 is inserted into the epoxy resin packaging shell 1, a control cavity is opened on the pin seat 4, a control board 62 is arranged in the control cavity and is connected to the locking block 61, the top of the control board 62 extends to the outside of the pin seat 4, and the first spring telescopic rod 63 is arranged on the other side of the control board 62 and is located in the control cavity.

[0051] It should be noted that a sliding hole can be opened at the top of the control cavity to ensure the mobility of the control board 62. The first spring telescopic rod 63 can be composed of a spring and a telescopic rod. The spring provides a reaction force, and the telescopic rod ensures connection and elasticity. This structure ensures the mobility of the control board 62 and the locking block 61 inside the control cavity. The spring supports and engages the locking block 61 on the epoxy resin packaging shell 1 to achieve fixation. The control board 62 can be moved from the outside to suppress the spring reaction force and release the connection between the locking block 61 and the epoxy resin packaging shell 1.

[0052] Specifically, when the relevant staff connects and disassembles the pin seat 4 and the epoxy resin packaging shell 1, they can control the locking block 61 by turning the control board 62. When disassembling, the control board 62 is turned to release the connection between the locking block 61 and the epoxy resin packaging shell 1, and the disassembly can be carried out. When installing, the control board 62 is turned to allow the epoxy resin packaging shell 1 to enter the pin seat 4 more easily, and the control board 62 is released. The reaction force provided by the first spring telescopic rod 63 is used to engage and fix the locking block 61.

[0053] In one embodiment of the present invention, Figure 1 , Figure 3 and Figure 5 As shown, the pin fixing structure 7 includes two groups of external compression structures 71 and a reinforcement structure 72 .

[0054] The two groups of external compression structures 71 are respectively arranged on both sides of the pin holder 4 and are connected with the pins 5 . The reinforcement structure 72 is arranged on the pin holder 4 and is connected with the external compression structure 71 .

[0055] It should be noted that the external pressing structure 71 presses the pins 5 on both sides of the pin seat 4 to fix the pins 5, and the reinforcement structure 72 controls the external pressing structure 71 to ensure the stability of the external pressing structure 71 when fixing the pins 5.

[0056] In order to clearly explain the above embodiment, in one embodiment of the present application, Figure 5 As shown, the external pressing structure 71 includes a pressing plate 711 and a fixing hole 712 .

[0057] The pressing plate 711 is rotatably disposed on one side of the pin holder 4 , a fixing hole 712 is provided on the pin holder 4 , and one end of the pressing plate 711 is inserted into the fixing hole 712 .

[0058] It should be noted that the pressure plate 711 can be a U-shaped structure, one end of which is rotatably connected to the pin seat 4, and the pin 5 is pressed and fixed on the pin seat 4 by rotation for reinforcement, while the other end is snapped into the fixing hole 712 to complete the fixation of the pressure plate 711.

[0059] In order to clearly explain the above embodiment, in one embodiment of the present application, Figure 1 , Figure 3 and Figure 5 As shown, the reinforcement structure 72 includes a baffle 721 , two lock heads 722 , two second spring telescopic rods 723 and a pressing block 724 .

[0060] Among them, the baffle 721 is set in the fixing hole 712, the two lock heads 722 are respectively set on one side of the baffle 721 and inserted into the corresponding pressure plate 711, the two second spring telescopic rods 723 are respectively set on the other side of the baffle 721, and the pressing block 724 is set on the baffle 721, and one side of the pressing block 724 extends to the outside of the pin seat 4.

[0061] It should be noted that the structure of the second spring telescopic rod 723 is consistent with that of the first spring telescopic rod 63, and is composed of a spring and a telescopic rod. The baffle 721 connected by the spring pushes the lock head 722 to allow the lock head 722 to be inserted into the pressure plate 711 to fix it, thereby ensuring that the pressure plate 711 will not separate from the fixing hole 712.

[0062] The set pressing block 724 extends to the outside of the pin seat 4. The internal baffle 721 can be controlled by externally controlling the pressing block 724, thereby controlling the connection between the lock head 722 and the pressure plate 711, which is convenient for the subsequent release of the fixation of the pressure plate 711 to the pin 5.

[0063] Specifically, the relevant staff rotates the pressure plate 711 to press and fix the pin 5, the pressure plate 711 enters the fixing hole 712, and presses the pressing block 724 to ensure that the pressure plate 711 enters the fixing hole 712 smoothly. At this time, the pressing block 724 is released, and the reaction force of the second spring telescopic rod 723 pushes the control lock 722 to be inserted into the pressure plate 711 to complete the fixation. When it is necessary to release the fixation of the pressure plate 711 to the pin 5, it is only necessary to press the pressing block 724 to release the fixation of the pressure plate 711 and then rotate it to open it, and disassemble and replace the pin 5.

[0064] In one embodiment of the present invention, Figure 1 and Figure 2 As shown, the heat dissipation structure 8 includes a thermally conductive pad 81 , a heat dissipation plate 82 and heat dissipation holes 83 .

[0065] The thermal pad 81 is disposed on the top of the power semiconductor chip 22 , the heat sink 82 is disposed on the top of the thermal pad 81 , the top of the heat sink 82 extends to the outside of the epoxy resin packaging shell 1 , and the heat dissipation holes 83 are opened on the heat sink 82 .

[0066] It should be noted that the thermally conductive gasket 81 connects the power semiconductor chip 22 and the heat sink 82 to conduct the heat on the power semiconductor chip 22. The top of the heat sink 82 can extend to the outside of the epoxy resin packaging shell 1 to contact with the external air for heat dissipation. The heat dissipation holes 83 are opened to increase the contact area with the air, further improving the heat dissipation capacity.

[0067] Specifically, when packaging the power semiconductor component 2, the relevant staff needs to install the thermal gasket 81 and the heat sink 82 in advance, and then perform epoxy resin injection molding packaging, while making the top of the heat sink 82 and the heat dissipation hole 83 located outside the epoxy resin packaging shell 1 to ensure the heat dissipation effect.

[0068] In summary, the pins can be adjusted and replaced according to needs to cope with different interfaces, while ensuring that the pins will not be damaged during the packaging process, thereby ensuring the normal use of power semiconductors.

[0069] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0071] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A functional packaging structure of a power semiconductor, characterized in that: It includes an epoxy resin packaging shell, a power semiconductor component, multiple groups of packaging contacts, a pin seat, multiple pins, four groups of packaging fixing structures, two groups of pin fixing structures and a heat dissipation structure, wherein: The power semiconductor component is arranged in the epoxy resin packaging shell; The two groups of packaging contacts are respectively and evenly arranged on the epoxy resin packaging shell, and the packaging contacts include inner pins and tin soldering points, wherein the inner pins are arranged on the power semiconductor component and electrically connected thereto, the bottom ends of the inner pins extend to the outer bottom of the epoxy resin packaging shell, and the tin soldering points are arranged at the bottom of the epoxy resin packaging shell and electrically connected to the bottom ends of the inner pins; The pin seat is sleeved on the epoxy resin packaging shell, and the plurality of pins are respectively inserted and arranged on both sides of the pin seat. The pins are provided with connection grooves, and the soldering points are located in the connection grooves; The four groups of package fixing structures are respectively arranged on both sides of the pin seat; The two groups of pin fixing structures are respectively arranged on both sides of the pin seat; The heat dissipation structure is arranged on the epoxy resin packaging shell and is located on the top of the power semiconductor component.

2. The functional packaging structure of a power semiconductor according to claim 1, characterized in that: The power semiconductor component includes a base plate and a power semiconductor chip, the base plate is arranged in the epoxy resin packaging shell, the power semiconductor chip is arranged on the top of the base plate, the inner pins are plugged into the base plate, and the inner pins are electrically connected to the power semiconductor chip.

3. The functional packaging structure of a power semiconductor according to claim 1, characterized in that: The packaging fixing structure includes a locking block, a control board and a first spring telescopic rod, wherein the locking block is plugged into the epoxy resin packaging shell, a control cavity is opened on the pin seat, the control board is arranged in the control cavity and connected to the locking block, the top of the control board extends to the outside of the pin seat, and the first spring telescopic rod is arranged on the other side of the control board and is located in the control cavity.

4. The functional packaging structure of a power semiconductor according to claim 1, characterized in that: The pin fixing structure includes two groups of external pressure fixing structures and a reinforcement structure, wherein the two groups of external pressure fixing structures are respectively arranged on both sides of the pin seat and are connected to the pins in abutment with each other, and the reinforcement structure is arranged on the pin seat and is connected to the external pressure fixing structure.

5. The functional packaging structure of power semiconductor according to claim 4, characterized in that: The external pressure fixing structure includes a pressure plate and a fixing hole, wherein the pressure plate is rotatably arranged on one side of the pin seat, the fixing hole is opened on the pin seat, and one end of the pressure plate is inserted into the fixing hole.

6. The functional packaging structure of power semiconductor according to claim 5, characterized in that: The reinforcement structure includes a baffle, two locking heads, two second spring telescopic rods and a pressing block, wherein the baffle is arranged in the fixing hole, the two locking heads are respectively arranged on one side of the baffle and plugged into the corresponding pressing plate, the two second spring telescopic rods are respectively arranged on the other side of the baffle, the pressing block is arranged on the baffle, and one side of the pressing block extends to the outside of the pin seat.

7. The functional packaging structure of a power semiconductor according to claim 2, characterized in that: The heat dissipation structure includes a thermally conductive gasket, a heat dissipation plate and a heat dissipation hole. The thermally conductive gasket is arranged on the top of the power semiconductor chip, the heat dissipation plate is arranged on the top of the thermally conductive gasket, the top of the heat dissipation plate extends to the outside of the epoxy resin packaging shell, and the heat dissipation hole is opened on the heat dissipation plate.

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