Power electronic component packaging substrate

Abstract

The invention relates to a power electronic component packaging substrate, which comprises a multi-layer structure, a connecting layer, a first insulating layer, a second insulating layer, an upper connecting layer and a device layer, micro-channels are constructed among the layers, each channel is filled with metal or alloy which is kept in a liquid state at normal temperature, and periodic vibration is generated through a piezoelectric driving assembly, so that the power electronic component packaging substrate is formed. The liquid metal is driven to form directional convection in the channel, efficient heat dissipation is achieved, heat generated by the device layer is rapidly transmitted to the liquid metal through the high-thermal-conductivity insulating layer and then dissipated through the cooling fins, in addition, a self-detection and self-repairing system is further integrated, and in the working period of the packaging substrate, the heat dissipation efficiency is greatly improved. The system can monitor the signal transmission condition in the micro-channel in real time, when impact or vibration causes disconnection or deformation of liquid metal and signal transmission interruption, the self-inspection system can immediately start a repair program, and the opening and closing state of the communicating hole is adjusted by controlling the switch assembly to recover a signal conduction path.

Description

Technical Field

[0001] The present invention relates to a power electronic component packaging substrate, in particular to a power electronic component packaging substrate applied in the technical field of power electronic component packaging. Background Art

[0002] As a core technical component, the power electronic component packaging substrate plays multiple key roles in electrical interconnection, thermal management, mechanical support and protection, and the realization of three-dimensional integration and miniaturization. By precisely laying out conductive lines on the substrate, efficient and accurate electrical signal transmission within the component and between the component and the external circuit is ensured. By utilizing its good thermal conductivity and carefully designed heat dissipation structure, the heat generated by the power electronic components during operation can be effectively dissipated, maintaining the components in stable operation at an appropriate temperature and extending their service life. At the same time, the packaging substrate also provides the necessary mechanical strength and protection to resist external impact and environmental erosion, ensuring the integrity of the components.

[0003] The specification of Chinese invention patent CN113923936 discloses a power electronic module and a packaging substrate that enhance the heat dissipation effect through liquid cooling circulation and mechanical rotation mechanism. In this design, the coolant is in full contact with the packaging substrate through a complex heat conduction pipe system to improve the heat dissipation efficiency. At the same time, the rotating mechanism is used to drive the fan to increase air flow and enhance the heat dissipation effect. Although this design improves the heat dissipation performance to a certain extent, from the perspective of economy and practicality, it is highly complex and difficult to maintain. It does not provide an effective solution when facing the signal transmission problem inside the electronic components. It cannot better deal with the situation where the packaging substrate is subjected to physical impact or long-term work, such as the interruption of liquid cooling medium flow and signal transmission interruption, which may affect the long-term stability and reliability of the electronic components. Summary of the invention

[0004] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is to provide a power electronic component packaging substrate that integrates efficient heat dissipation and intelligent signal repair, aiming to simplify the heat dissipation system structure and reduce costs. At the same time, by introducing liquid metal as a heat dissipation and signal conduction medium, and combining piezoelectric drive technology and self-detection and self-repair mechanism, it can effectively deal with the heat conduction problems and signal transmission interruption problems in the heat dissipation process, thereby improving the overall performance and long-term working stability of the power electronic component packaging substrate.

[0005] In order to solve the above problems, the present invention provides a power electronic component packaging substrate, including a lower connection layer, a first insulating layer is fixedly connected to the top of the lower connection layer, a second insulating layer is fixedly connected to the top of the first insulating layer, an upper connection layer is fixedly connected to the top of the second insulating layer, a device layer is fixedly connected to the top of the upper connection layer, a sealing layer is fixedly connected to the top of the device layer, a plurality of microchannels are opened on the upper connection layer, and the microchannels are away from one end of the device layer and sequentially penetrate the second insulating layer, the first insulating layer and the lower connection layer, a plurality of lower cooling channels are opened between the lower connection layer and the first insulating layer, and a plurality of lower cooling channels are opened between the second insulating layer and the upper connection layer. A plurality of upper cooling channels, a lower connecting layer, a first insulating layer, a second insulating layer, an upper connecting layer and a device layer are fixedly connected to the outer ends of the shell, a cooling chamber is opened at one end of the shell close to the first insulating layer and the second insulating layer, a plurality of piezoelectric drive components are fixedly connected in the cooling chamber, a plurality of microchannels, a lower cooling channel and an upper cooling channel are all connected to the cooling chamber, and the connecting parts are all filled with liquid metal, a plurality of lower cooling channels are connected to a plurality of microchannels distributed along the axial direction of the lower cooling channel through connecting holes, a switch component is fixedly connected in the plurality of connecting holes, and the liquid metal is a metal or alloy that can remain liquid at room temperature.

[0006] In the above-mentioned power electronic component packaging substrate, the power electronic component packaging substrate adopts a multi-layer structure design, and constructs a stable and efficient heat dissipation and signal transmission system through the lower connection layer, the first insulating layer, the second insulating layer, the upper connection layer and the device layer. Microchannels, lower cooling channels, upper cooling channels and cooling chambers are arranged inside the packaging substrate, and are filled with metal or alloy (liquid metal) that remains liquid at room temperature. The liquid metal is driven to circulate with the help of a piezoelectric drive component to effectively absorb and quickly dissipate the heat generated by the device layer, thereby greatly improving the heat dissipation efficiency. At the same time, liquid metal, with its excellent electrical conductivity, realizes highly stable signal transmission between components through microchannels. In particular, the packaging substrate is equipped with a switch component, which can flexibly switch the flow path of liquid metal between microchannels and cooling channels, giving the substrate a self-repairing function. When a signal interruption occurs, the signal path can be quickly restored, thereby significantly enhancing the overall performance, reliability and service life of the packaging substrate.

[0007] As a further improvement of the present application, multiple piezoelectric drive components are evenly distributed around the lower connecting layer, and the multiple piezoelectric drive components divide the cooling chamber into multiple independent areas. The multiple piezoelectric drive components all include drive plates, and the multiple drive plates are provided with multiple conical holes.

[0008] As a further improvement of the present application, the ends of the multiple conical holes with smaller diameters are all arranged in a direction close to the driving plate, conical tubes are fixedly connected in the multiple conical holes, and the ends of the multiple conical tubes with smaller diameters are all arranged in a direction away from the driving plate, the multiple driving plates are all made of piezoelectric material, and the multiple driving plates are electrically connected to external equipment via wires.

[0009] As a further improvement of the present application, the switch assembly includes a deformation plate located in a plurality of connecting holes, and the bottom ends of the plurality of deformation plates along the axial direction of the lower cooling channel are fixedly connected to the same deformation control wire, and the plurality of deformation control wires all pass through the lower connection layer and are electrically connected to the external device.

[0010] As another improvement of the present application, multiple microchannels on the lower connection layer are fixedly connected to connection pillars at one end away from the first insulating layer. The multiple connection pillars are all made of high conductivity materials and are electrically connected to the external circuit.

[0011] As another improved supplement of the present application, the shell includes a top cover fixedly connected to the outer end of the upper connecting layer, the bottom end of the top cover is fixedly connected to a heat conducting plate, the bottom end of the heat conducting plate is fixedly connected to the top end of the lower connecting layer, and a plurality of heat sinks are fixedly connected to the top cover and the outer end of the heat conducting plate.

[0012] As another improved supplement to the present application, multiple microchannels are perpendicular to the top of the upper connecting layer and are evenly distributed on the upper connecting layer, multiple lower cooling channels and upper cooling channels are respectively located between the multiple microchannels, multiple lower cooling channels and upper cooling channels respectively penetrate the lower connecting layer and the first insulating layer and the second insulating layer and the upper connecting layer, multiple lower cooling channels and upper cooling channels are arranged parallel to the outer end of the lower connecting layer, the first insulating layer and the second insulating layer are both made of insulating materials with high thermal conductivity, and the multiple microchannels on the first insulating layer are arranged more densely than the multiple microchannels on the second insulating layer.

[0013] As another improvement of the present application, the following steps are included: S1, sealed package; Filling liquid metal into the microchannel, the lower cooling channel, the upper cooling channel and the cooling chamber; S2, piezoelectric driven convection cooling; When working, the piezoelectric drive component drives the liquid metal to circulate in the substrate. When the device layer is working, the heat generated by it is transferred to the liquid metal. During the flow of the liquid metal, the heat generated on the device layer is transferred to the outside for heat dissipation. S3, signal conduction detection; During use, if the substrate is damaged by impact or other means, causing the liquid metal in the microchannel to be unable to conduct signals, the substrate performs a self-check to detect the microchannel where the signal is interrupted; S4, signaling pathway self-repair; The connecting hole between the corresponding microchannel and the lower cooling channel is opened by the switch assembly, so that the liquid metal in the cooling chamber is replenished into the failed microchannel to restore signal transmission.

[0014] In summary, this application has the following beneficial effects: 1. Efficient heat dissipation: by designing microchannels, lower cooling channels, upper cooling channels and cooling chambers inside the packaging substrate, and filling them with metals or alloys (liquid metal) that remain liquid at room temperature, and using piezoelectric drive components to drive the liquid metal to circulate in the channels, directional convection heat dissipation is formed. The heat generated by the device layer can be quickly transferred to the liquid metal through the first insulating layer and the second insulating layer with high thermal conductivity, and discharged to the environment through the heat sink of the cooling chamber, thereby achieving efficient and uniform heat dissipation and improving the working stability and life of power electronic components.

[0015] 2. Integrated signal transmission and heat dissipation functions. The microchannel not only undertakes the heat dissipation task, but also has the signal conduction function. Liquid metal, due to its good electrical conductivity, can complete signal transmission while transmitting heat, realizing the dual function integration of heat dissipation and signal transmission.

[0016] 3. Self-detection and self-repair mechanism. The packaging substrate has its own signal conduction detection function. The signal transmission status in the microchannel is monitored in real time through the self-detection circuit or external detection equipment. It can quickly identify signal transmission interruptions caused by impact, vibration, etc. When a signal interruption is detected, the connecting hole is opened by controlling the switch component, and the liquid metal in the cooling chamber is used to replenish the faulty microchannel to achieve self-repair of the signal path, thereby improving the reliability and durability of the packaging substrate.

[0017] 4. Sealing and protection: liquid metal is filled by vacuum infusion or precision dripping process, and sealed by high-strength sealant, welding or mechanical locking to ensure that the packaging substrate has good airtightness and waterproofness, effectively prevent liquid metal leakage, and enhance the stability and durability of the packaging structure in complex environments.

[0018] 5. Compact structure and flexibility. The overall packaging substrate is compact and reasonably structured. The design of microchannels, cooling channels and cooling chambers fully considers the heat dissipation efficiency and the convenience of signal transmission. At the same time, the precise driving of liquid metal is achieved through piezoelectric drive components, and the switch components realize self-repair of faults, showing a high degree of flexibility and intelligence. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the overall structure diagram of this application; Figure 2 A top view of the present application; Figure 3It is the AA cross-sectional view of this application; Figure 4 It is the BB cross-sectional view of this application; Figure 5 It is the CC section view of this application; Figure 6 It is an enlarged view of point D of this application; Figure 7 This is an enlarged view of location E of this application; Figure 8 Partial explosion for this application Figure 1 ; Fig. 9 Partial explosion for this application Figure 2 ; Fig.10 This is a structural diagram of the piezoelectric drive assembly of the present application; Fig.11 It is an enlarged view of point F of this application; Fig.12 A front view of the piezoelectric drive assembly of the present application; Fig.13 This is the GG cross-sectional view of this application.

[0020] Description of the numbers in the figure: 1. Lower connection layer; 2. First insulating layer; 3. Second insulating layer; 4. Upper connection layer; 5. Device layer; 6. Sealing layer; 7. Microchannel; 8. Lower cooling channel; 9. Upper cooling channel; 10. Shell; 11. Cooling chamber; 12. Piezoelectric drive assembly; 13. Liquid metal; 14. Connecting hole; 15. Switch assembly; 16. Drive plate; 17. Conical hole; 18. Conical tube; 19. Deformable plate; 20. Deformation control line; 21. Connecting column; 22. Heat sink. DETAILED DESCRIPTION

[0021] Three implementation modes of the present application are described in detail below with reference to the accompanying drawings.

[0022] The first implementation method: Figure 1-Figure 13The present invention shows a power electronic component packaging substrate, comprising a lower connection layer 1, a first insulating layer 2 is fixedly connected to the top of the lower connection layer 1, a second insulating layer 3 is fixedly connected to the top of the first insulating layer 2, an upper connection layer 4 is fixedly connected to the top of the second insulating layer 3, a device layer 5 is fixedly connected to the top of the upper connection layer 4, a sealing layer 6 is fixedly connected to the top of the device layer 5, a plurality of microchannels 7 are provided on the upper connection layer 4, and an end of the microchannel 7 away from the device layer 5 sequentially penetrates the second insulating layer 3, the first insulating layer 2 and the lower connection layer 1, a plurality of lower cooling channels 8 are provided between the lower connection layer 1 and the first insulating layer 2, a plurality of upper cooling channels 9 are provided between the second insulating layer 3 and the upper connection layer 4, and a plurality of lower cooling channels 10 are provided between the lower connection layer 1 and the first insulating layer 2. The outer ends of layer 1, the first insulating layer 2, the second insulating layer 3, the upper connecting layer 4 and the device layer 5 are fixedly connected with a shell 10, and a cooling chamber 11 is opened at one end of the shell 10 close to the first insulating layer 2 and the second insulating layer 3. A plurality of piezoelectric drive components 12 are fixedly connected in the cooling chamber 11. A plurality of microchannels 7, a lower cooling channel 8, and an upper cooling channel 9 are all connected to the cooling chamber 11, and the connecting parts are filled with liquid metal 13. A plurality of lower cooling channels 8 are connected with a plurality of microchannels 7 distributed along the axial direction of the lower cooling channel 8 through connecting holes 14. Switch components 15 are fixedly connected in the plurality of connecting holes 14. The liquid metal 13 is a metal or alloy that can remain liquid at room temperature.

[0023] In the above-mentioned power electronic component packaging substrate, the power electronic component packaging substrate adopts a multi-layer structure design, and a stable and efficient heat dissipation and signal transmission system is constructed through the lower connection layer 1, the first insulating layer 2, the second insulating layer 3, the upper connection layer 4 and the device layer 5. The microchannel 7, the lower cooling channel 8, the upper cooling channel 9 and the cooling chamber 11 are arranged inside the packaging substrate, and are filled with metal or alloy liquid metal 13 that remains liquid at room temperature. The liquid metal 13 is driven to circulate by means of the piezoelectric drive component 12, effectively absorbing and quickly dissipating the heat generated by the device layer 5, thereby greatly improving the heat dissipation efficiency. At the same time, the liquid metal 13, with its excellent electrical conductivity, realizes highly stable signal transmission between components through the microchannel 7. In particular, the packaging substrate is equipped with a switch component 15, which can flexibly switch the flow path of the liquid metal 13 between the microchannel 7 and the cooling channel, giving the substrate a self-repairing function. When a signal interruption occurs, the signal path can be quickly restored, thereby significantly enhancing the overall performance, reliability and service life of the packaging substrate.

[0024] The lower connection layer 1 serves as the underlying structure of the packaging substrate, providing a stable connection with the external circuit board or other components. It is also part of the thermal management and signal conduction path. Its function is to support the entire packaging substrate and realize heat dissipation and / or signal transmission of internal devices through the lower cooling channel 8.

[0025] The first insulating layer 2 has good insulating properties and a certain thermal conductivity, and is used to isolate the lower connection layer 1 from the second insulating layer 3 to prevent current short circuit, while allowing heat to pass through to achieve effective heat conduction from the device layer 5 to the cooling channel.

[0026] The second insulating layer 3 is similar to the first insulating layer 2 and also plays the role of isolation and heat conduction. It is mainly located under the upper connecting layer 4 and combined with the upper cooling channel 9 to ensure that heat can be smoothly transferred from the upper connecting layer 4 to the cooling system.

[0027] The upper connection layer 4 serves as a transition between the device layer 5 and the lower structure. The microchannel 7 opened thereon is used to fill the liquid metal 13 to realize signal transmission and heat dissipation functions. At the same time, the upper connection layer 4 also undertakes the task of interconnecting with the external circuit.

[0028] The area where the power electronic components are placed in the device layer 5 transfers the heat generated during operation to the liquid metal 13 through thermal contact with the upper connection layer 4 and the lower connection layer 1, and realizes efficient heat dissipation through the circulation flow of the liquid metal 13.

[0029] The sealing layer 6 is located above the device layer 5 and plays a role in protecting the internal components and the liquid metal 13 from the external environment, thereby ensuring the sealing and reliability of the packaging substrate.

[0030] The microchannel 7 is filled with liquid metal 13, which is not only used to conduct heat from the device layer 5, but also has the function of signal transmission. By connecting with the lower cooling channel 8 and the upper cooling channel 9, the circulation flow of liquid metal 13 is realized to achieve efficient heat dissipation and stable signal transmission.

[0031] The lower cooling channel 8 is located between the lower connection layer 1 and the first insulating layer 2 , forming one of the channels for the liquid metal 13 to flow, and transferring heat from the device layer 5 to the cooling chamber 11 by cooperating with the connecting hole 14 of the microchannel 7 .

[0032] The upper cooling channel 9 is similar to the lower cooling channel 8 , and is located between the second insulating layer 3 and the upper connecting layer 4 , and together with the lower cooling channel 8 forms a heat dissipation path for the liquid metal 13 .

[0033] The shell 10 wraps the external structure of the package substrate to provide mechanical support and protection, and a cooling chamber 11 is provided inside to control the flow of the liquid metal 13 and enhance the heat dissipation effect.

[0034] The cooling chamber 11 is integrated inside the housing 10 and is used to collect and dissipate heat. The piezoelectric drive component 12 drives the liquid metal 13 to circulate and improve the heat dissipation efficiency.

[0035] The piezoelectric drive assembly 12 is installed in the cooling chamber 11 and generates vibrations through voltage drive, so that the liquid metal 13 forms a circulation flow in the microchannel 7, the lower cooling channel 8, and the upper cooling channel 9, thereby effectively taking away the heat generated by the device layer 5.

[0036] The liquid metal 13 is a metal or alloy that remains liquid at room temperature and is used to achieve efficient thermal management and signal conduction inside the packaging substrate. It has high thermal conductivity and good electrical conductivity.

[0037] The connecting hole 14 connects the lower cooling channel 8 and the microchannel 7, and controls the flow path of the liquid metal 13 through the switch component 15 to achieve the regulation of heat dissipation and signal transmission functions.

[0038] The switch assembly 15 is installed in the connecting hole 14, and is used to open or close the flow of liquid metal 13 between different channels when needed, ensuring that the signal path can be quickly repaired in the event of a fault, thereby enhancing the self-repair capability of the packaging substrate.

[0039] Through the circulation of liquid metal 13 and the driving of piezoelectric drive assembly 12, the heat generated by power electronic components can be quickly extracted and dissipated, the operating temperature of the components can be reduced, and the stability of the system can be improved. By utilizing the high electrical conductivity of liquid metal 13, efficient signal transmission between components can be achieved through microchannel 7. The flow path of liquid metal 13 between microchannel 7 and cooling channel can be flexibly switched through switch assembly 15. When signal interruption occurs, the signal path can be restored in time, thereby improving the reliability and service life of the packaging substrate.

[0040] The second implementation method: Figure 1-Figure 13 As shown, multiple piezoelectric drive components 12 are evenly distributed around the lower connecting layer 1, and the multiple piezoelectric drive components 12 divide the cooling chamber 11 into multiple independent areas. The multiple piezoelectric drive components 12 all include drive plates 16, and the multiple drive plates 16 are all provided with multiple conical holes 17.

[0041] The ends with smaller diameters of the multiple conical holes 17 are all arranged toward the direction close to the driving plate 16, the multiple conical holes 17 are all fixedly connected with conical tubes 18, and the ends with smaller diameters of the multiple conical tubes 18 are all arranged toward the direction away from the driving plate 16, the multiple driving plates 16 are all made of piezoelectric material, and the multiple driving plates 16 are all electrically connected to external equipment through wires.

[0042] The switch assembly 15 includes a deformation sheet 19 located in a plurality of connecting holes 14. The bottom ends of the plurality of deformation sheets 19 along the axial direction of the lower cooling channel 8 are fixedly connected to the same deformation control wire 20. The plurality of deformation control wires 20 all pass through the lower connection layer 1 and are electrically connected to external devices.

[0043] The ends of the multiple microchannels 7 on the lower connection layer 1 away from the first insulating layer 2 are fixedly connected to the connection pillars 21 . The multiple connection pillars 21 are all made of a material with high conductivity and are electrically connected to an external circuit.

[0044] The shell 10 includes a top cover fixedly connected to the outer end of the upper connecting layer 4, a heat conducting plate fixedly connected to the bottom end of the top cover, a bottom end of the heat conducting plate fixedly connected to the top end of the lower connecting layer 1, and a plurality of heat sinks 22 fixedly connected to the top cover and the outer ends of the heat conducting plate.

[0045] The multiple microchannels 7 are perpendicular to the top of the upper connecting layer 4 and are evenly distributed on the upper connecting layer 4. The multiple lower cooling channels 8 and the upper cooling channels 9 are respectively located between the multiple microchannels 7. The multiple lower cooling channels 8 and the upper cooling channels 9 respectively penetrate the lower connecting layer 1 and the first insulating layer 2 and the second insulating layer 3 and the upper connecting layer 4. The multiple lower cooling channels 8 and the upper cooling channels 9 are arranged parallel to the outer end of the lower connecting layer 1. The first insulating layer 2 and the second insulating layer 3 are both made of insulating materials with high thermal conductivity. The multiple microchannels 7 on the first insulating layer 2 are arranged more densely than the multiple microchannels 7 on the second insulating layer 3.

[0046] A plurality of piezoelectric drive components 12 are evenly distributed around the lower connection layer 1, dividing the cooling chamber 11 into a plurality of independent areas. These components are excited to vibrate through their respective drive plates 16. The drive plates 16 are made of piezoelectric material and can generate high-frequency vibrations when powered by external equipment. The structural design of a plurality of conical holes 17 and conical tubes 18 provided on the drive plates helps to generate a directional flow of liquid metal 13 during vibration, thereby forming a uniform and efficient convection heat dissipation effect inside the entire packaging substrate, which can accurately control the flow direction and speed of the liquid metal 13 and significantly improve the heat dissipation performance and efficiency.

[0047] The switch assembly 15 includes a deformation piece 19 and a deformation control line 20. When the signal path needs to be repaired, power is supplied to the deformation control line 20 through an external device to deform the deformation piece 19, thereby controlling the opening and closing state of the connecting hole 14, and then adjusting the flow path of the liquid metal 13 between the microchannel 7 and the cooling channel, thereby realizing self-repair of the signal path and improving the stability and reliability of the packaging substrate.

[0048] The connecting column 21 is fixed to one end of the plurality of microchannels 7 on the lower connecting layer 1 away from the first insulating layer 2 and is made of a high conductivity material, ensuring effective electrical connection between the inside of the packaging substrate and the external circuit, which is beneficial to efficient transmission and transfer of signals.

[0049] The shell 10 is composed of a top cover, a heat conducting plate and a heat sink 22. The heat conducting plate transfers the heat of the upper connecting layer 4 and the lower connecting layer 1 to the heat sink 22 through the top cover. The heat sink 22 increases the heat dissipation area, accelerates the heat dissipation to the external environment, helps to quickly dissipate the heat inside the packaging substrate, reduces the temperature of the components, and thus improves their working efficiency and service life.

[0050] The layout of the microchannel 7, the lower cooling channel 8 and the upper cooling channel 9, the microchannel 7 is evenly distributed perpendicular to the upper connection layer 4, the lower cooling channel 8 and the upper cooling channel 9 are respectively located on both sides of the microchannel 7, and run through the entire packaging substrate, and remain parallel to the outer end of the lower connection layer. The first insulating layer 2 and the second insulating layer 3 are made of insulating and highly thermally conductive materials, and the microchannels 7 on the first insulating layer are arranged more densely, ensuring the uniformity of heat distribution inside the packaging substrate. At the same time, it is convenient to connect the substrate with other circuits. Through the efficient flow of liquid metal 13 between the channels, both signal transmission and efficient heat dissipation are achieved, and the compactness and heat dissipation efficiency of the packaging structure are optimized.

[0051] The third implementation method: Figure 1-Figure 13 Shown, comprising the following steps; S1, sealed package; Filling the liquid metal 13 into the microchannel 7, the lower cooling channel 8, the upper cooling channel 9 and the cooling chamber 11; S2, piezoelectric driven convection cooling; When working, the piezoelectric drive component 12 drives the liquid metal 13 to circulate in the substrate. When the device layer 5 works, the heat generated by it is transferred to the liquid metal 13. During the flow process, the liquid metal 13 transfers the heat generated on the device layer 5 to the outside for heat dissipation. S3, signal conduction detection; During use, if the substrate is damaged by impact or the like, causing the liquid metal 13 in the microchannel 7 to be unable to conduct signals, the substrate performs a self-check to detect the microchannel 7 where the signal is interrupted; S4, signaling pathway self-repair; The connecting hole 14 between the corresponding microchannel 7 and the lower cooling channel 8 is opened by the switch assembly 15, so that the liquid metal 13 in the cooling chamber 11 is replenished into the failed microchannel 7 to restore signal transmission.

[0052] The sealed package is cleaned to ensure that there are no impurities and pollutants inside all the internal channels of the package substrate, including the microchannel 7, the lower cooling channel 8, the upper cooling channel 9 and the cooling chamber 11.

[0053] The selected metal or alloy liquid metal 13 that remains liquid at room temperature is injected into each internal channel of the packaging substrate by vacuum infusion or precision dripping process to ensure that the liquid metal 13 can be completely filled without bubbles.

[0054] After the liquid metal 13 is filled, the packaging substrate is tightly sealed by using high-strength sealant, welding or mechanical locking to ensure that the liquid metal 13 does not leak, while ensuring the airtightness and waterproofness of the packaging structure.

[0055] Piezoelectric drive convective heat dissipation, when the device layer 5 starts to work and generate heat, a voltage of specific frequency and amplitude is applied to the piezoelectric drive component 12 through an external device, so that the drive plate 16 of the piezoelectric drive component 12 generates periodic vibration.

[0056] The conical hole 17 on the driving plate 16 is designed in conjunction with the conical tube 18 so that the vibration waves are transmitted to the liquid metal 13 , driving the liquid metal 13 to form directional convection in the microchannel 7 , the lower cooling channel 8 , the upper cooling channel 9 and the cooling chamber 11 .

[0057] The heat generated by the device layer 5 is rapidly transferred to the liquid metal 13 through the first insulating layer 2 and the second insulating layer 3 with high thermal conductivity. As the liquid metal 13 circulates, the heat is carried to the cooling chamber 11 and discharged to the environment through the heat sink 22, achieving efficient heat dissipation.

[0058] Signal conduction detection: During operation, the package substrate regularly monitors the signal transmission status in each microchannel 7 through an internal integrated self-test circuit or an external test device.

[0059] When the substrate is subjected to unexpected conditions such as impact and vibration, which may cause the liquid metal 13 in the microchannel 7 to break or deform, thereby causing signal transmission interruption, the self-detection system can quickly identify the affected microchannel 7.

[0060] The signal path is self-repaired. Once the microchannel 7 with signal interruption is detected, the self-checking system immediately starts the signal path repair program and sends instructions to the corresponding switch component 15 through the control circuit.

[0061] After the switch assembly 15 receives the command, the deformable sheet 19 is deformed under the drive of the square variable control wire 20 below it, opening the connecting hole 14, replenishing the liquid metal 13 into the microchannel 7, and removing the signal transmission obstruction caused by the disconnection of the liquid metal 13.

[0062] The liquid metal 13 in the cooling chamber 11 flows into the opened connecting hole 14 under the action of the piezoelectric driving component 12, and then fills the faulty microchannel 7, reestablishes the signal conduction path, and restores normal signal transmission. After the repair is completed, the connecting hole 14 is closed to restore the original working state of the packaging substrate.

[0063] By strictly cleaning the microchannels 7, the lower cooling channel 8, the upper cooling channel 9 and the cooling chamber 11 inside the package substrate and filling the liquid metal 13 with vacuum infusion or precision dripping technology, it is ensured that there are no impurities and bubbles inside the package, thereby improving the purity of the package and the filling effect of the liquid metal 13.

[0064] The piezoelectric drive component 12 is precisely controlled by an external device, and the drive plate 16 generates periodic vibrations. Through the design of the tapered hole 17 and the tapered tube 18, the vibrations are effectively converted into directional convection of the liquid metal 13, thereby achieving efficient thermal management inside the packaging substrate.

[0065] The heat generated by the device layer 5 is rapidly transferred to the liquid metal 13 through the first insulating layer 2 and the second insulating layer 3 with high thermal conductivity. With the circulation of the liquid metal 13, the heat can be rapidly discharged from the cooling chamber 11 through the heat sink 22, thereby ensuring long-term stable operation and efficient heat dissipation of the power electronic components.

[0066] The built-in self-test circuit or external detection equipment monitors the signal transmission status in the microchannel 7 in real time. Even under adverse conditions such as impact and vibration, it can quickly identify the signal transmission interruption caused by the disconnection or deformation of the liquid metal 13, thereby improving the system's self-diagnosis capability and fault detection efficiency.

[0067] Once a signal interruption is detected, the self-check system can immediately trigger the signal path repair program by controlling the deformation piece 19 of the switch assembly 15 to deform under the drive of the deformation control line 20, temporarily opening the connecting hole 14, replenishing the liquid metal 13 into the faulty microchannel 7, and restoring signal transmission.

[0068] The entire repair process does not require human intervention. Under the action of the piezoelectric drive component 12, the liquid metal 13 automatically flows into the faulty microchannel 7, rebuilds the signal conduction path, and restores normal signal transmission. After the repair is completed, the connecting hole 14 is automatically closed and the packaging substrate returns to its original working state, thereby improving the self-healing ability and operational reliability of the system.

[0069] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A power electronic component packaging substrate, characterized in that: The invention comprises a lower connection layer (1), wherein the top of the lower connection layer (1) is fixedly connected to a first insulating layer (2), the top of the first insulating layer (2) is fixedly connected to a second insulating layer (3), the top of the second insulating layer (3) is fixedly connected to an upper connection layer (4), the top of the upper connection layer (4) is fixedly connected to a device layer (5), the top of the device layer (5) is fixedly connected to a sealing layer (6), a plurality of microchannels (7) are provided on the upper connection layer (4), the end of the microchannels (7) away from the device layer (5) passes through the second insulating layer (3), the first insulating layer (2) and the lower connection layer (1) in sequence, a plurality of lower cooling channels (8) are provided between the lower connection layer (1) and the first insulating layer (2), a plurality of upper cooling channels (9) are provided between the second insulating layer (3) and the upper connection layer (4), and the lower connection layer (1) is provided with a plurality of microchannels (7) disposed on the upper connection layer (4). The outer ends of the first insulating layer (2), the second insulating layer (3), the upper connecting layer (4) and the device layer (5) are fixedly connected to a shell (10); a cooling chamber (11) is provided at one end of the shell (10) close to the first insulating layer (2) and the second insulating layer (3); a plurality of piezoelectric drive components (12) are fixedly connected in the cooling chamber (11); the plurality of microchannels (7), the lower cooling channel (8) and the upper cooling channel (9) are all connected to the cooling chamber (11), and the connected parts are all filled with liquid metal (13); the plurality of lower cooling channels (8) are connected to the plurality of microchannels (7) distributed along the axial direction of the lower cooling channel (8) through connecting holes (14); the plurality of connecting holes (14) are fixedly connected to switch components (15); and the liquid metal (13) is a metal or alloy that can remain in liquid state at room temperature.

2. The power electronic component packaging substrate according to claim 1, characterized in that: The plurality of piezoelectric drive components (12) are evenly distributed around the lower connection layer (1), and the plurality of piezoelectric drive components (12) divide the cooling chamber (11) into a plurality of independent areas. The plurality of piezoelectric drive components (12) each include a drive sheet (16), and the plurality of drive sheets (16) each have a plurality of conical holes (17).

3. A power electronic component packaging substrate according to claim 2, characterized in that: The ends of the plurality of conical holes (17) with smaller diameters are all arranged in a direction close to the driving plate (16), the plurality of conical holes (17) are all fixedly connected with a conical tube (18), and the ends of the plurality of conical tubes (18) with smaller diameters are all arranged in a direction away from the driving plate (16), the plurality of driving plates (16) are all made of piezoelectric material, and the plurality of driving plates (16) are all electrically connected to an external device via a wire.

4. The power electronic component packaging substrate according to claim 1, characterized in that: The switch assembly (15) comprises a deformation sheet (19) located in a plurality of connecting holes (14), the bottom ends of the plurality of deformation sheets (19) along the axial direction of the lower cooling channel (8) are all fixedly connected to the same deformation control wire (20), and the plurality of deformation control wires (20) all penetrate the lower connection layer (1) and are electrically connected to external equipment.

5. The power electronic component packaging substrate according to claim 1, characterized in that: The multiple microchannels (7) on the lower connection layer (1) are all fixedly connected to a connection column (21) at one end away from the first insulating layer (2); the multiple connection columns (21) are all made of a material with high conductivity; and the multiple connection columns (21) are all electrically connected to an external circuit.

6. The power electronic component packaging substrate according to claim 1, characterized in that: The shell (10) comprises a top cover fixedly connected to the outer end of the upper connection layer (4), a heat conduction plate fixedly connected to the bottom end of the top cover, the bottom end of the heat conduction plate fixedly connected to the top end of the lower connection layer (1), and a plurality of heat sinks (22) fixedly connected to the top cover and the outer end of the heat conduction plate.

7. The power electronic component packaging substrate according to claim 1, characterized in that: The plurality of microchannels (7) are perpendicular to the top of the upper connection layer (4) and are evenly distributed on the upper connection layer (4); the plurality of lower cooling channels (8) and upper cooling channels (9) are respectively located between the plurality of microchannels (7); the plurality of lower cooling channels (8) and upper cooling channels (9) respectively penetrate the lower connection layer (1) and the first insulating layer (2) and the second insulating layer (3) and the upper connection layer (4); and the plurality of lower cooling channels (8) and upper cooling channels (9) are arranged parallel to the outer end of the lower connection layer (1).

8. The power electronic component packaging substrate according to claim 1, characterized in that: The first insulating layer (2) and the second insulating layer (3) are both made of insulating materials with high thermal conductivity, and the multiple microchannels (7) on the first insulating layer (2) are arranged more densely than the multiple microchannels (7) on the second insulating layer (3).

9. A power electronic component packaging substrate according to any one of claims 1 to 8, characterized in that: The steps include: S1, sealed package; Filling liquid metal (13) into the microchannel (7), the lower cooling channel (8), the upper cooling channel (9) and the cooling chamber (11); S2, piezoelectric driven convection cooling; When working, the piezoelectric drive component (12) drives the liquid metal (13) to circulate in the substrate. When the device layer (5) is working, the heat generated by it is transferred to the liquid metal (13). During the flow process, the liquid metal (13) transfers the heat generated on the device layer (5) to the outside for heat dissipation. S3, signal conduction detection; During use, if the substrate is damaged by impact or the like, causing the liquid metal (13) in the microchannel (7) to be unable to conduct signals, the substrate performs a self-check to detect the microchannel (7) where the signal is interrupted; S4, signaling pathway self-repair; The connecting hole (14) between the corresponding microchannel (7) and the lower cooling channel (8) is opened by means of a switch assembly (15), so that the liquid metal (13) in the cooling chamber (11) is replenished into the failed microchannel (7) to restore signal transmission.

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