A radio communication system employing a Ku-band continuous wave power amplifier

Abstract

This application relates to a radio communication system employing a Ku-band continuous wave power amplifier, belonging to the technical field of radio communication systems. The radio communication system includes a transmitter and a receiver. The transmitter includes an information input module, a first signal processing module, a modulator module, a power amplifier module, and a transmitting antenna. The power amplifier module includes a driver amplifier, a power divider, a waveguide combiner, and several final-stage power amplifiers. The driver amplifier is electrically connected to the modulator module and the power divider. Each of the final-stage power amplifiers is electrically connected to the power divider and the waveguide combiner. The output of the waveguide combiner is electrically connected to the transmitting antenna. This application reduces the possibility of power amplifier module burnout while ensuring normal operation of the power amplifier module, thereby ensuring the normal use of the radio communication system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radio communication systems, and in particular to a radio communication system employing a Ku-band continuous wave power amplifier. BACKGROUND

[0002] A radio communication system is a system for transmitting and communicating information through radio waves. Radio communication systems use radio technology to convert sound, data, images, and other information into electromagnetic waves, transmit them in space, and convert the electromagnetic waves back into recognizable information through receiving devices. Currently, among commonly used radio waves, the Ku band (12-18 GHz) is one of the preferred frequency bands for modern communication systems due to its high frequency and wide bandwidth, and the Ku band is widely used in satellite communication, digital broadcasting, cable and satellite television, and satellite mobile communication.

[0003] Currently, a common radio communication system mainly includes a transmitter, a channel, and a receiver. The transmitter is mainly used to convert information to be transmitted (such as sound, images, data, etc.) into radio wave signals and transmit them through a corresponding antenna. The channel is the medium for signal transmission, generally air, allowing radio waves to propagate between the transmitter and the receiver. The receiver is mainly used to receive radio wave signals from the transmitter and restore them to the original information.

[0004] In order to increase the signal coverage range of the transmitter, a power amplifier (abbreviated as PA) is generally added at the end of the transmitter. The PA receives low-power radio frequency signals from the transmitter and amplifies and converts them into high-power radio frequency signals, which are then transmitted. This can improve the signal coverage range of the transmitter, enhance the signal penetration ability, and improve the stability of signal transmission.

[0005] With the development of radio communication technology, the requirements for the signal coverage range of the transmitter are becoming higher and higher. In order to increase the signal coverage range of the transmitter, the existing PA is usually multi-stage. The multi-stage PA is connected in series, so that the output power of the signal can be increased. However, since the output power of the multi-stage PA is increasing, the last stage of the PA is easily burned out, which makes the transmitter unable to transmit signals or the signal coverage range cannot meet the requirements, and thus the radio communication system is interrupted. SUMMARY

[0006] The present application provides a radio communication system employing a Ku-band continuous wave power amplifier, which aims to improve the power amplifier module, reduce the possibility of burning out the power amplifier module under the condition of ensuring the normal operation of the power amplifier module, and thus ensure the normal use of the radio communication system.

[0007] The radio communication system employing the Ku-band continuous wave power amplifier provided in the application employs the following technical solutions:

[0008] The radio communication system employing the Ku-band continuous wave power amplifier comprises a transmitter and a receiver, the transmitter is used for sending radio signals, and the receiver is used for receiving radio signals; the transmitter comprises an information input module, a first signal processing module, a modulator module, a power amplifier module and a transmitting antenna, the information input module, the first signal processing module, the modulator module, the power amplifier module and the transmitting antenna are electrically connected in sequence, and the transmitting antenna is used for sending radio signals; the power amplifier module comprises a driving amplifier, a power divider, a waveguide combiner and a plurality of final-stage power amplifiers, the input end of the driving amplifier is electrically connected with the output end of the modulator module, the output end of the driving amplifier is electrically connected with the input end of the power divider, the input ends of the plurality of final-stage power amplifiers are electrically connected with the output end of the power divider, the output ends of the plurality of final-stage power amplifiers are electrically connected with the input end of the waveguide combiner, and the output end of the waveguide combiner is electrically connected with the transmitting antenna.

[0009] By employing the above technical solutions, firstly, the cooperation of the transmitter and the receiver realizes the sending and receiving of radio signals, and further realizes the function of the radio communication system.

[0010] Secondly, in the transmitter, the information input module receives the information input by the user, after the preliminary processing of the first signal processing module, the signal is sent into the modulator module for modulation to adapt to the requirements of wireless transmission. The modulated signal enters the power amplifier module for amplification to increase the transmission distance and strength of the signal. The amplified signal is input into the transmitting antenna, and is emitted through the transmitting antenna. The receiver captures the signal through the receiving antenna, and after the noise reduction, demodulation and signal processing, the signal is restored to the original information for the user to use.

[0011] And the cooperation of the driving amplifier, the power divider, the waveguide combiner and the plurality of final-stage power amplifiers in the power amplifier module, when the signal is input into the power amplifier module, the driving amplifier preliminarily amplifies the signal, then the power divider divides the signal into multiple paths, each path of the signal is further amplified by a final-stage power amplifier, finally the waveguide combiner combines the multiple paths of the signal into one path, and delivers the combined signal to the transmitting antenna.

[0012] The power amplifier module uniformly distributes the signal to the multiple final power amplifiers through the power distributor, which can reduce the signal power burden of each final power amplifier, and further reduce the possibility of burning and damaging the final power amplifier. This can reduce the possibility of burning the power amplifier module under the condition of ensuring the normal operation of the power amplifier module, and further ensure the normal use of the radio communication system.

[0013] Optionally, the power amplifier module further comprises a power supply and a controller, and the drive amplifier, the power distributor, the waveguide combiner and the multiple final power amplifiers are electrically connected with the power supply and the controller.

[0014] By adopting the above technical solution, the introduction of the power supply provides stable power supply for the power amplifier module, and further ensures the normal operation of the drive amplifier, the power distributor, the waveguide combiner and the final power amplifier in the power amplifier module. The addition of the controller enables the power amplifier module to have intelligent control function, and the controller can accurately control the power amplifier module in terms of switching on and off, working mode switching, frequency adjustment and power adjustment according to the external control signal or the preset control strategy. Therefore, the introduction of the power supply and the controller not only improves the power stability and intelligent control level of the power amplifier module, but also improves the integration and maintainability of the radio communication system, and further enhances the performance and practicability of the radio communication system.

[0015] Optionally, the power amplifier module comprises a power amplifier main body, the power amplifier main body comprises a shell, and a radio frequency input port, a waveguide output port, a power supply interface and a control interface are arranged on the shell; the drive amplifier, the power distributor, the waveguide combiner and the multiple final power amplifiers are located in the shell, and the radio frequency input port is electrically connected with the input end of the drive amplifier, and the output end of the waveguide combiner is electrically connected with the waveguide output port; the drive amplifier, the power distributor, the waveguide combiner and the multiple final power amplifiers are electrically connected with the power supply interface and the control interface; the power supply is electrically connected with the power supply interface, the controller is electrically connected with the control interface, the output end of the modulator module is electrically connected with the radio frequency input port, and the input end of the transmitting antenna is electrically connected with the waveguide output port.

[0016] By adopting the above technical solution, the power amplifier main body integrates the drive amplifier, the power distributor, the waveguide combiner and the multiple final power amplifiers in the shell through the setting of the shell, forming a complete modular unit. This modular design makes the connection and arrangement of the drive amplifier, the power distributor, the waveguide combiner and the multiple final power amplifiers more compact and stable, reducing external interference and signal loss.

[0017] The shell is provided with a radio frequency input port, a waveguide output port, a power supply interface and a control interface, the radio frequency input port, the waveguide output port, the power supply interface and the control interface are arranged to facilitate quick connection and disassembly of the power amplifier main body with the power supply, the controller, the modulator module and the transmitting antenna, thereby facilitating quick replacement of a new power amplifier main body when the power amplifier main body is damaged or the amplification power is insufficient.

[0018] Optionally, the shell comprises a closed top plate, a heat dissipation bottom plate and a support plate ring, the closed top plate and the heat dissipation bottom plate are arranged in parallel and spaced apart, the support plate ring is located between the heat dissipation bottom plate and the support plate ring, the heat dissipation bottom plate and the closed top plate are detachably connected with the support plate ring, and an installation space is formed between the closed top plate, the heat dissipation bottom plate and the support plate ring; the radio frequency input port, the waveguide output port, the power supply interface and the control interface are arranged on the support plate ring; the drive amplifier, the power divider, the waveguide combiner and the plurality of final-stage power amplifiers are located in the installation space, and the plurality of final-stage power amplifiers are arranged on the heat dissipation bottom plate.

[0019] By adopting the above technical scheme, the shell forms a closed installation space through the cooperation of the closed top plate, the support ring plate and the heat dissipation bottom plate. The closed structure of the shell can effectively shield external electromagnetic interference, protect the normal operation of the drive amplifier, the power divider, the waveguide combiner and the plurality of final-stage power amplifiers inside the shell, and also prevent internal signal leakage, thereby improving the electromagnetic compatibility of the power amplifier main body. This is particularly important for Ku-band high-frequency signals, because high-frequency signals are more sensitive to electromagnetic interference and signal loss. The shielding and protection of the shell can significantly improve the quality and transmission effect of the signals.

[0020] The design of the heat dissipation bottom plate provides a good heat dissipation basis for the final-stage power amplifiers. Since the final-stage power amplifiers generate a large amount of heat during operation, the heat dissipation bottom plate can effectively conduct and dissipate the heat, preventing the internal temperature of the power amplifier main body from being too high and affecting the performance and service life of the power amplifier main body.

[0021] Optionally, the plurality of final-stage power amplifiers are arranged in a matrix, and adjacent two final-stage power amplifiers are arranged in a spaced apart manner.

[0022] By adopting the above technical scheme, since the plurality of final-stage power dividers are arranged in a matrix and adjacent two final-stage power dividers are arranged in a spaced apart manner, there is sufficient heat dissipation space between adjacent two final-stage power dividers, thereby facilitating the conduction of heat inside the shell to the outside through the heat dissipation bottom plate. This can further improve the heat dissipation effect of the power amplifier main body.

[0023] Optionally, the heat dissipation bottom plate is provided with an active heat dissipation mechanism, the active heat dissipation mechanism comprises a mounting plate, a heat conduction plate and a plurality of heat dissipation fins, the mounting plate is arranged on the side of the heat dissipation bottom plate away from the support plate ring, the heat conduction plate is arranged on the mounting plate, and the heat conduction plate is attached to the heat dissipation bottom plate; the side wall of the mounting plate is provided with a heat dissipation groove, and a plurality of heat dissipation fins are arranged in the heat dissipation groove, the heat dissipation fins are connected with the heat conduction plate, a plurality of heat dissipation fins are arranged in parallel and are spaced apart, and a heat dissipation air duct is formed between adjacent two heat dissipation fins, and the length direction of the heat dissipation air duct is arranged along the depth direction of the heat dissipation groove.

[0024] By adopting the above technical scheme, first, the active heat dissipation mechanism is arranged through the cooperation of the mounting plate, the heat conduction plate and the plurality of heat dissipation fins, the heat conduction plate is closely attached to the heat dissipation bottom plate, the heat on the heat dissipation bottom plate can be quickly conducted to the heat conduction plate, and the heat on the heat conduction plate can be quickly conducted to the heat dissipation fins through the connection of the heat dissipation fins and the heat conduction plate. The cooperation of the heat conduction plate and the plurality of heat dissipation fins can increase the heat dissipation area of the heat dissipation bottom plate, so that the heat can be quickly dissipated to the heat dissipation groove. Secondly, since the heat dissipation air duct is formed between adjacent two heat dissipation fins, and the length direction of the heat dissipation air duct is arranged along the depth direction of the heat dissipation groove, the heat in the heat dissipation air duct can flow to the outside of the heat dissipation groove along with the air, thereby ensuring the heat dissipation efficiency of the heat dissipation bottom plate.

[0025] Optionally, the mounting plate is provided with a fan group on opposite sides, and the two fan groups are arranged in the depth direction of the heat dissipation groove and between the heat dissipation groove.

[0026] By adopting the above technical scheme, the cooperation of the two fan groups can accelerate the airflow speed in the heat dissipation groove, thereby improving the heat dissipation efficiency of the heat dissipation bottom plate.

[0027] Optionally, the fan group comprises a plurality of heat dissipation fans, the heat dissipation fans are arranged one by one corresponding to the heat dissipation air duct, and the heat dissipation fans are arranged opposite to the corresponding heat dissipation air duct.

[0028] By adopting the above technical scheme, since the plurality of heat dissipation fans in each fan group are arranged one by one corresponding to the heat dissipation air duct, the airflow speed in the heat dissipation groove can be further increased, thereby further improving the heat dissipation efficiency of the heat dissipation bottom plate.

[0029] Optionally, the heat-conducting plate is provided with two vent hole groups, the two vent hole groups are arranged at intervals along the depth direction of the heat dissipation groove, the plurality of heat dissipation fins are located between the two vent hole groups, the two vent hole groups are located between the two fan groups, the vent hole group communicates the heat dissipation groove and the mounting space; the heat dissipation fin comprises a plurality of heat dissipation plates, the plurality of heat dissipation plates are arranged in sequence along the depth direction of the heat dissipation groove, the heat dissipation plate is rotatably connected with the heat-conducting plate, the mounting plate is provided with a switching driving element, all the heat dissipation plates are connected with the switching driving element, and the switching driving element is used to drive the heat dissipation plate to rotate.

[0030] By adopting the above technical scheme, since the heat dissipation fin comprises a plurality of heat dissipation plates, each heat dissipation plate is rotatably connected with the heat-conducting plate, and the switching driving element is arranged, so that all the heat dissipation plates can rotate, which enables the heat dissipation plate to switch to two different states.

[0031] The first state is that the plurality of heat dissipation plates are parallel to the depth direction of the heat dissipation groove, at this time, the plurality of heat dissipation plates arranged in sequence along the depth direction of the heat dissipation groove form a heat dissipation fin.

[0032] The second state is that the plurality of heat dissipation plates are perpendicular to the depth direction of the heat dissipation groove, at this time, the plurality of heat dissipation plates close the heat dissipation groove.

[0033] When the plurality of heat dissipation plates are in the first state, the airflow blown by the fan group passes through the heat dissipation groove, which can prevent gas from entering the shell.

[0034] When the plurality of heat dissipation plates are in the second state, the airflow blown by the fan group is blocked by the plurality of heat dissipation plates in the heat dissipation groove, then the airflow passes through the vent hole group from the heat dissipation groove into the mounting space, and then the airflow reenters the heat dissipation groove from the other vent hole group, which enables the airflow to pass through the mounting space, thereby improving the heat dissipation effect.

[0035] Under the cooperation of the switching driving element and the vent hole group, the power amplifier main body has two different heat dissipation modes, which enables the power amplifier main body to freely select the heat dissipation mode according to the actual situation.

[0036] Optionally, the vent hole group comprises a first hole and a second hole, the first hole is arranged on the heat-conducting plate, the second hole is arranged on the heat dissipation bottom plate, and the first hole communicates with the second hole; the heat-conducting plate is provided with two sliding plates, the sliding plate is arranged in one-to-one correspondence with the vent hole group, the sliding plate is slidably connected with the heat-conducting plate, the sliding plate is connected with the switching driving element, when the switching driving element drives the heat dissipation plate to rotate, the switching driving element drives the sliding plate to slide synchronously; the sliding plate is provided with a through hole, and the switching driving element is used to drive the sliding plate to slide to the through hole to communicate with or stagger with the first hole.

[0037] By adopting the technical scheme, firstly, the ventilation hole group ensures the communication of the heat dissipation groove and the installation space through the cooperation of the first hole and the second hole. Secondly, the setting of the sliding plate, under the driving of the switching driving element, when the switching driving element drives the heat dissipation plate to rotate to the second state, the through hole on the sliding plate is in communication with the first hole and the second hole, at this time, the airflow can pass through the installation space. Further, when the switching driving element drives the heat dissipation plate to rotate to the first state, the through hole on the sliding plate is misaligned with the first hole, at this time, the airflow cannot enter the installation space. Therefore, this can automatically open or close the installation space according to the state of the heat dissipation plate, and further ensure that the installation space is in a closed state when the airflow does not need to enter the installation space.

[0038] In summary, the present application includes at least one of the following beneficial technical effects:

[0039] 1. The power amplifier module of the present application uniformly distributes the signal to multiple final power amplifiers through the power distributor, which can reduce the signal power burden borne by each final power amplifier, thereby reducing the possibility of damage to the final power amplifier. This can reduce the possibility of damage to the power amplifier module under the condition of ensuring the normal operation of the power amplifier module, thereby ensuring the normal use of the radio communication system.

[0040] 2. The power amplifier body of the present application integrates the drive amplifier, the power distributor, the waveguide combiner, and the plurality of final power amplifiers in the shell to form a complete modular unit. This modular design makes the connection and arrangement of the drive amplifier, the power distributor, the waveguide combiner, and the plurality of final power amplifiers more compact and stable, reducing external interference and signal loss.

[0041] 3. The present application improves the heat dissipation performance of the power amplifier body through the position setting of the plurality of final power amplifiers in the shell.

[0042] 4. The present application cooperates the heat dissipation plate, the switching driving element, the ventilation hole group, and the sliding plate to enable the power amplifier body to select two different heat dissipation modes according to the actual situation. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 is a signal transmission schematic diagram in the radio communication system of embodiment 1 of the present application.

[0044] Figure 2 is a schematic diagram of the overall structure of the power amplifier module of embodiment 1 of the present application.

[0045] Figure 3 is a signal transmission schematic diagram of the power amplifier body of embodiment 1 of the present application.

[0046] Figure 4Fig. 1 is a schematic diagram of the overall structure of a power amplifier body according to an embodiment of the present application.

[0047] Figure 5 Fig. 2 is a schematic diagram of the internal structure of a power amplifier cup according to an embodiment of the present application.

[0048] Figure 6 Fig. 3 is a schematic diagram of the overall structure of a final-stage power amplifier according to an embodiment of the present application.

[0049] Figure 7 Fig. 4 is a schematic diagram of the overall structure of a waveguide combiner according to an embodiment of the present application.

[0050] Figure 8 Fig. 5 is a schematic diagram of the overall structure of a power amplifier body and an active heat dissipation mechanism according to an embodiment of the present application.

[0051] Figure 9 Fig. 6 is an exploded schematic diagram of an active heat dissipation mechanism according to an embodiment of the present application.

[0052] Figure 10 Fig. 7 is a sectional schematic diagram of an active heat dissipation mechanism according to an embodiment of the present application.

[0053] Figure 11 Fig. 8 is a schematic diagram of the overall structure of a switching drive and a plurality of heat dissipation fins according to an embodiment of the present application.

[0054] In the figure, 100, transmitter; 101, information input module; 102, first signal processing module; 103, modulator module; 104, power amplifier module; 105, transmitting antenna; 200, receiver; 201, receiving antenna; 202, noise reduction module; 203, demodulator module; 204, second signal processing module; 205, information display module; 1, power supply; 2, controller; 3, power amplifier main body; 31, shell; 311, closed top plate; 312, support plate ring; 313, heat dissipation bottom plate; 32, radio frequency input port; 33, waveguide output port; 34, power supply interface; 35, control interface; 36, drive amplifier; 37, power divider; 38, final power amplifier; 381, radio frequency input port; 382, first waveguide output port; 39, waveguide combiner; 391, second waveguide output port; 392, waveguide input port; 4, active heat dissipation mechanism; 41, mounting plate; 411, mounting groove; 412, heat dissipation groove; 42, heat conduction plate; 43, heat dissipation fin; 431, heat dissipation air duct; 432, heat dissipation plate; 433, rotating shaft; 44, fan group; 441, mounting bracket; 442, heat dissipation fan; 45, ventilation hole group; 451, first hole; 452, second hole; 46, switching drive; 461, drive rod group; 4611, rotating rod; 462, linkage rod; 463, connecting rod; 464, drive push rod; 47, protection plate; 471, space; 48, sliding plate; 481, through hole; 482, connecting plate; 483, moving groove. DETAILED DESCRIPTION

[0055] The following description will be made in conjunction with the accompanying drawings. Figure 1 - The accompanying drawings Figure 11 The present application will be further described in detail.

[0056] Embodiment 1: A wireless communication system using Ku-band continuous wave power amplifier, referring to Figure 1 , comprising a transmitter 100 and a receiver 200, the transmitter 100 comprising an information input module 101, a first signal processing module 102, a modulator module 103, a power amplifier module 104 and a transmitting antenna 105, the information input module 101, the first signal processing module 102, the modulator module 103, the power amplifier module 104 and the transmitting antenna 105 are electrically connected in sequence. The receiver 200 comprises a receiving antenna 201, a noise reduction module 202, a demodulator module 203, a second signal processing module 204 and an information display module 205, the receiving antenna 201, the noise reduction module 202, the demodulator module 203, the second signal processing module 204 and the information display module 205 are electrically connected in sequence. And, the transmitting antenna 105 and the receiving antenna 201 communicate through radio.

[0057] In the cooperation of the transmitter 100 and the receiver 200, in the transmitter 100, a user inputs information into the information input module 101, the information input module 101 generates a signal according to the information and inputs the signal into the first signal processing module 102; the first signal processing module 102 preliminarily processes the signal to ensure that the quality and format of the signal meet the requirements; the processed signal is sent to the modulator module 103, the modulator module 103 modulates the signal into a frequency and form suitable for wireless transmission; the modulated signal is amplified by the power amplifier module 104 to increase the transmission distance and strength of the signal; the amplified signal is transmitted by the transmitting antenna 105. In the receiver 200, the receiving antenna 201 captures the radio signal emitted by the transmitting antenna 105; then the signal is sent to the noise reduction module 202 to reduce noise interference and improve the clarity of the signal; the noise-reduced signal enters the demodulator module 203, and the demodulator module 203 demodulates the signal; the demodulated signal is further processed by the second signal processing module 204 to ensure the integrity and accuracy of the signal; the processed signal is transmitted to the information display module 205, and the information display module 205 converts the signal into audio or video or picture for the user to view and use.

[0058] With reference to Figure 2 , the power amplifier module 104 includes a power supply 1, a controller 2 and a power amplifier body 3, the power supply 1, the controller 2, the modulator module 103 and the transmitting antenna 105 are electrically connected with the power amplifier body 3.

[0059] With reference to Figure 2 and Figure 3 , the power amplifier body 3 includes a drive amplifier 36, a power divider 37, a waveguide combiner 39 and a plurality of final power amplifiers 38, the output end of the modulator module 103 is electrically connected with the input end of the drive amplifier 36, and the output end of the drive amplifier 36 is electrically connected with the input end of the power divider 37. A plurality of output ends are arranged on the power divider 37, the output ends of the power divider 37 are arranged one by one corresponding to the final power amplifiers 38, and the output ends of the power divider 37 are electrically connected with the input ends of the corresponding final power amplifiers 38. A plurality of input ends are arranged on the waveguide combiner 39, the input ends of the waveguide combiner 39 are arranged one by one corresponding to the final power amplifiers 38, and the input ends of the waveguide combiner 39 are electrically connected with the output ends of the corresponding final power amplifiers 38. The output end of the waveguide combiner 39 is electrically connected with the input end of the transmitting antenna 105.

[0060] When the power amplifier module 104 is working, the modulator module 103 inputs the signal to the drive amplifier 36, the drive amplifier 36 preliminarily amplifies the signal and inputs the signal to the power divider 37; the power divider 37 divides the signal into several equal-amplitude in-phase power division signals and inputs the signals to several final power amplifiers 38 through several output ends of the power divider 37; the final power amplifiers 38 amplify the signals again and input the signals to the waveguide combiner 39; the waveguide combiner 39 combines several paths of signals and outputs the combined signal to the transmitting antenna 105.

[0061] With reference to Figure 3 and Figure 4 , the power amplifier main body 3 comprises a shell 31, the shell 31 is provided with a radio frequency input port 32, a waveguide output port 33, a power supply interface 34 and a control interface 35, the drive amplifier 36, the power divider 37, the waveguide combiner 39 and the several final power amplifiers 38 are located in the shell 31. The radio frequency input port 32 is electrically connected with the input end of the drive amplifier 36, and the output end of the waveguide combiner 39 is electrically connected with the waveguide output port 33.

[0062] With reference to Figure 2 and Figure 4 , the output end of the modulator module 103 is electrically connected with the radio frequency input port 32, and the input end of the transmitting antenna 105 is electrically connected with the waveguide output port 33.

[0063] With reference to Figure 2 and Figure 4 , the drive amplifier 36, the power divider 37, the waveguide combiner 39 and the several final power amplifiers 38 are electrically connected with the power supply interface 34, and the power supply 1 is electrically connected with the power supply interface 34. The drive amplifier 36, the power divider 37, the waveguide combiner 39 and the several final power amplifiers 38 are electrically connected with the control interface 35, and the controller 2 is electrically connected with the control interface 35. The power supply 1 supplies power for the power amplifier main body 3, and the controller 2 controls the power amplifier main body 3 according to the external control signal to control the switching on and off, the working mode switching, the frequency adjustment and the power adjustment.

[0064] With reference to Figure 4 , the shell 31 comprises a closed top plate 311, a heat dissipation bottom plate 313 and a support plate ring 312, the closed top plate 311 is vertically and spacedly arranged above the heat dissipation bottom plate 313, the closed top plate 311 and the heat dissipation bottom plate 313 are arranged in parallel, the support plate ring 312 is located between the closed top plate 311 and the heat dissipation bottom plate 313, the upper end of the support plate ring 312 is detachably connected with the closed top plate 311, the lower end of the support plate ring 312 is detachably connected with the heat dissipation bottom plate 313, and the mounting space is formed between the support plate ring 312, the heat dissipation bottom plate 313 and the closed top plate 311. In this embodiment, the closed top plate 311, the heat dissipation bottom plate 313 and the support plate ring 312 are connected through bolts.

[0065] With reference to Figure 4 , the radio frequency input port 32, the waveguide output port 33, the power supply interface 34 and the control interface 35 are all arranged on the outer sidewall of the support plate ring 312.

[0066] With reference to Figure 4 and Figure 5 , the drive amplifier 36, the power divider 37, the waveguide combiner 39 and the plurality of final power amplifiers 38 are all located in the mounting space. The drive amplifier 36, the power divider 37 and the plurality of final power amplifiers 38 are all arranged on the heat dissipation bottom plate 313, and the waveguide combiner 39 is located above the final power amplifiers 38.

[0067] With reference to Figure 5 , the final power amplifiers 38 are arranged in a matrix, and adjacent two final power amplifiers 38 are arranged at intervals. Since the plurality of final power amplifiers 38 are arranged in a matrix on the heat dissipation bottom plate 313, the heat dissipation effect of the final power amplifiers 38 can be improved.

[0068] The final power amplifiers 38 are detachably connected with the heat dissipation bottom plate 313 and the waveguide combiner 39. In the embodiment, the final power amplifiers 38 are connected with the heat dissipation bottom plate 313 and the waveguide combiner 39 by sintering or gold wire bonding or other micro-assembly methods.

[0069] With reference to Figure 5 and Figure 6 , the final power amplifiers 38 are provided with a radio frequency input port 381 and a first waveguide output port 382. The radio frequency input port 381 is arranged on the sidewall of the final power amplifier 38, and the radio frequency input port 381 is electrically connected with the power divider 37 through a cable. The first waveguide output port 382 is arranged on the upper side of the final power amplifier 38.

[0070] With reference to Figure 6 and Figure 7 , the waveguide combiner 39 is provided with a second waveguide output port 391 and a plurality of waveguide input ports 392. The second waveguide output port 391 is located on the sidewall of the waveguide combiner 39, and the second waveguide output port 391 is in communication with the waveguide output port 33. The waveguide input port 392 is located on the lower side of the waveguide combiner 39, and the waveguide input port 392 is arranged in one-to-one correspondence with the first waveguide output port 382. The waveguide input port 392 and the corresponding first waveguide output port 382 are in communication in the vertical direction.

[0071] With reference to Figure 6 and Figure 7 , due to the arrangement of the waveguide input port 392 on the waveguide combiner 39 and the arrangement of the first waveguide output port 382 of the final power amplifier 38, the waveguide combiner 39 and the final power amplifier 38 can be directly communicated, which can realize the miniaturization of the power amplifier module 104.

[0072] In this embodiment, the output power of the single final power amplifier 38 is not less than 50W, and the power output by the waveguide combiner 39 can reach 150W.

[0073] The implementation principle of the embodiment of the present application is as follows: when performing radio communication, the signal is input into the driver amplifier 36 when passing through the power amplifier module 104 in the transmitter 100, the driver amplifier 36 preliminarily amplifies the signal, and then inputs the preliminarily amplified signal into the power divider 37; the power divider 37 divides the signal into four equal-amplitude in-phase (same amplitude and phase) power division signals, and inputs the power division signals into the four final power amplifiers 38 through four output ends; the final power amplifiers 38 amplify the corresponding signals, and input the amplified signals into the waveguide combiner 39; the waveguide combiner 39 combines the four signals, and outputs the combined signal.

[0074] Embodiment 2: A radio communication system using a Ku-band continuous wave power amplifier, referring to Figure 8 The difference between the present embodiment and embodiment 1 is that the active heat dissipation mechanism 4 is further arranged on the heat dissipation bottom plate 313, and the active heat dissipation mechanism 4 comprises a mounting plate 41, which is arranged on the lower side of the heat dissipation bottom plate 313 and detachably connected with the heat dissipation bottom plate 313.

[0075] Referring to Figure 9 and Figure 10 The active heat dissipation mechanism 4 further comprises a heat conduction plate 42, and a mounting groove 411 is formed on the upper side of the mounting plate 41, the heat conduction plate 42 is insertedly matched with the mounting groove 411, and the upper side of the heat conduction plate 42 is attached with the heat dissipation bottom plate 313. A heat dissipation groove 412 is formed on one side of the mounting plate 41 in the width direction and penetrates through the mounting plate 41, and the heat dissipation groove 412 is in communication with the mounting groove 411.

[0076] The heat conduction plate 42 can quickly conduct the heat on the heat dissipation bottom plate 313 into the heat dissipation groove 412, thereby achieving rapid heat dissipation.

[0077] Referring to Figure 9 and Figure 10 The active heat dissipation mechanism 4 further comprises a plurality of heat dissipation fins 43, the plurality of heat dissipation fins 43 are located in the heat dissipation groove 412, the length direction of the heat dissipation fins 43 is arranged along the width direction of the mounting plate 41, the plurality of heat dissipation fins 43 are sequentially and spacedly arranged along the length direction of the mounting plate 41, and the upper side of the heat dissipation fins 43 is connected with the heat conduction plate 42. Heat dissipation air ducts 431 are formed between the inner wall of the heat dissipation groove 412 and the adjacent heat dissipation fins 43 and between the adjacent two heat dissipation fins 43. In the present embodiment, the heat conduction plate 42 and the heat dissipation fins 43 are made of copper or aluminum or other materials with good heat conduction performance.

[0078] The cooperation of the heat-conducting plate 42 and the plurality of heat-dissipating fins 43 can increase the heat-dissipating area, thereby improving the heat-dissipating effect.

[0079] With reference to Figure 8 and Figure 10 , the fan group 44 is arranged on one side of the mounting plate 41 in the width direction, and the fan group 44 comprises a mounting frame 441, and a plurality of heat-dissipating fans 442 are arranged in the mounting frame 441, and the plurality of heat-dissipating fans 442 are arranged in sequence and at intervals along the length direction of the mounting plate 41. The heat-dissipating fans 442 are arranged in one-to-one correspondence with the heat-dissipating air ducts 431, and the heat-dissipating air ducts 431 are arranged opposite to the corresponding heat-dissipating fans 442.

[0080] When it is necessary to improve the heat-dissipating efficiency, the heat-dissipating fans 442 are started, and at this time, the heat-dissipating fans 442 can increase the flow speed of the gas in the heat-dissipating air ducts 431, thereby improving the heat-dissipating efficiency.

[0081] In this embodiment, with reference to Figure 9 and Figure 10 , the fan group 44 is provided with two, and the two fan groups 44 are arranged on both sides of the mounting plate 41 in the width direction, and the two fan groups 44 are arranged opposite to each other along the width direction of the mounting plate 41, which can further improve the heat-dissipating efficiency.

[0082] With reference to Figure 9 and Figure 10 , the heat-dissipating fins 43 comprise a plurality of heat-dissipating plates 432, and a rotating shaft 433 is arranged in the middle of the heat-dissipating plate 432, the rotating shaft 433 is arranged vertically, the upper end of the rotating shaft 433 is rotationally connected with the heat-conducting plate 42, and the lower end is rotationally connected with the inner side wall of the heat-dissipating groove 412 corresponding. The mounting plate 41 is provided with a switching driving member 46, and the plurality of rotating shafts 433 are connected with the switching driving member 46. The heat-conducting plate 42 is provided with two vent hole groups 45, and the two vent hole groups 45 are arranged at intervals along the width direction of the mounting plate 41, and the plurality of heat-dissipating plates 432 are arranged between the two vent hole groups 45, and the vent hole group 45 communicates the heat-dissipating groove 412 and the mounting space.

[0083] When the fan group 44 is working, the switching driving member 46 drives the plurality of rotating shafts 433 to rotate, so that each heat-dissipating plate 432 rotates by ninety degrees, at this time, the airflow blown by the fan group 44 will be blown into the shell 31 from the vent hole group 45, and then the airflow is blown out of the shell 31 from the other vent hole group 45, which can improve the heat-dissipating effect of the power amplifier main body 3.

[0084] In this embodiment, with reference to Figure 9 and Figure 10 , the mounting plate 41 is provided with a protection plate 47 on the lower side, and the protection plate 47 is detachably connected with the mounting plate 41, and the side of the protection plate 47 facing the mounting plate 41 is provided with a space 471, and the switching driving member 46 is arranged in the mounting space.

[0085] With reference to Figure 10 and Figure 11 , the switching driving member 46 comprises a driving push rod 464, a connecting rod 463, a plurality of linkage rods 462 and a plurality of driving rod groups 461.

[0086] With reference to Figure 10 and Figure 11 , the plurality of driving rod groups 461 are sequentially and spacedly arranged along the width direction of the mounting plate 41, and the driving rod groups 461 are arranged one-to-one with the heat dissipation plates 432 in the heat dissipation fins 43. The driving rod group 461 comprises a plurality of rotating rods 4611, and the plurality of rotating rods 4611 are sequentially and spacedly arranged along the length direction of the mounting plate 41, and the rotating rods 4611 are arranged one-to-one with the rotating shafts 433, and one end of the rotating shaft 433 is connected with the middle part of the corresponding rotating rod 4611.

[0087] With reference to Figure 10 and Figure 11 , the length direction of the linkage rod 462 is arranged along the length direction of the mounting plate 41, and the plurality of linkage rods 462 are sequentially and spacedly arranged along the width direction of the mounting plate 41. The linkage rod 462 is arranged one-to-one with the driving rod group 461, and the linkage rod 462 is rotationally connected with one end of the plurality of rotating rods 4611 in the corresponding driving rod group 461.

[0088] With reference to Figure 10 and Figure 11 , the length direction of the connecting rod 463 is arranged along the width direction of the mounting plate 41, and the plurality of linkage rods 462 are located on one side of the connecting rod 463 along the width direction, and one end of the linkage rod 462 is slidingly connected with the connecting rod 463 along the width direction of the linkage rod 462.

[0089] With reference to Figure 11 , the driving push rod 464 is located on the side of the connecting rod 463 away from the linkage rod 462, and the driving end of the driving push rod 464 is connected with the connecting rod 463. In this embodiment, the driving push rod 464 is an electric push rod.

[0090] With reference to Figure 11 , under the cooperation of the driving push rod 464, the connecting rod 463, the plurality of linkage rods 462 and the plurality of driving rod groups 461, when the driving push rod 464 drives the connecting rod 463 to move along the width direction of the connecting rod 463, the connecting rod 463 can drive the plurality of linkage rods 462 to move along the length direction of the linkage rods 462, and the linkage rods 462 can drive the plurality of rotating rods 4611 in the corresponding driving rod group 461 to rotate, and then drive the corresponding plurality of heat dissipation plates 432 to rotate, which can drive all the heat dissipation plates 432 to rotate synchronously.

[0091] With reference to Figure 10 and Figure 11When the plurality of heat dissipation plates 432 are parallel to one side of the mounting plate 41 in the length direction, the plurality of heat dissipation plates 432 arranged in sequence along the width direction of the mounting plate 41 form the heat dissipation fins 43.

[0092] When the plurality of heat dissipation plates 432 are parallel to one side of the mounting plate 41 in the width direction, the plurality of heat dissipation plates 432 arranged in sequence along the length direction of the mounting plate 41 form the closed plate, which closes the heat dissipation groove 412 in the depth direction of the heat dissipation groove 412.

[0093] In the embodiment, referring to Figure 9 and Figure 10 , the vent hole group 45 includes a plurality of first holes 451 and a plurality of second holes 452, the first holes 451 are formed through the heat dissipation bottom plate 313, the second holes 452 are formed in the heat conduction plate 42, the plurality of first holes 451 are arranged in sequence and spaced apart in the length direction of the mounting plate 41, the first holes 451 are arranged one-to-one with the second holes 452, and the first holes 451 communicate with the corresponding second holes 452. The cooperation of the first holes 451 and the second holes 452 enables the heat dissipation groove 412 to communicate with the mounting space.

[0094] Referring to Figure 10 and Figure 11 , the heat conduction plate 42 is provided with two sliding plates 48 arranged on the lower side of the heat conduction plate 42, the sliding plates 48 are arranged one-to-one with the vent hole group 45, the length direction of the sliding plates 48 is arranged along the length direction of the mounting plate 41, and the sliding plates 48 are slidingly connected with the heat conduction plate 42 along the length direction of the sliding plates 48.

[0095] Referring to Figure 10 and Figure 11 , a moving groove 483 is formed in the mounting plate 41, the moving groove 483 is formed in the groove bottom of the mounting groove 411, and the moving groove 483 communicates with the accommodation space 471. A connecting plate 482 is arranged between the sliding plate 48 and the connecting rod 463, the connecting plate 482 is located in the moving groove 483, the upper side of the connecting plate 482 is connected with the sliding plate 48, the lower side of the connecting plate 482 is connected with the connecting rod 463, and the connecting plate 482 is slidingly connected with the inner side wall of the moving groove 483 along the length direction of the mounting plate 41. When the connecting rod 463 is driven to move by the driving push rod 464, the sliding plate 48 moves synchronously under the action of the connecting plate 482.

[0096] Referring to Figure 10 and Figure 11 , a plurality of through holes 481 are formed in the sliding plate 48, the through holes 481 are arranged one-to-one with the corresponding second holes 452 in the vent hole group 45, and the through holes 481 are staggered with the corresponding second holes 452.

[0097] When the switching driving member 46 drives the plurality of heat dissipation plates 432 to be parallel to the side wall of the mounting plate 41 in the width direction, the through holes 481 communicate with the corresponding second holes 452.

[0098] The implementation principle of the embodiment of the present application is that under the driving of the switching driving member 46, the power amplifier main body 3 has the following two heat dissipation modes:

[0099] The first mode is that all the heat dissipation plates 432 are arranged in parallel with the length direction side wall of the mounting plate 41, at this time, corresponding heat dissipation fins 43 are formed by the heat dissipation plates 432, and heat dissipation air ducts 431 are formed between two adjacent heat dissipation fins 43, at this time, under the working of the fan group 44, the flow rate of the airflow in the heat dissipation air ducts 431 is accelerated, and the heat dissipation speed is accelerated.

[0100] The second mode is that all the heat dissipation plates 432 are arranged in parallel with the width direction side wall of the mounting plate 41, at this time, corresponding closed plates are formed by the heat dissipation plates 432, the closed plates close the heat dissipation grooves 412, and the mounting space is communicated with the heat dissipation grooves 412, under the working of the fan group 44, the airflow enters the mounting space from one vent hole group 45, and finally is discharged from another vent hole group 45, which can improve the heat dissipation efficiency of the power amplifier main body 3.

[0101] The embodiments of the specific embodiment are the preferred embodiments of the present application, and are not limited to the protection scope of the present application, wherein the same parts are indicated by the same reference numerals. Therefore, equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A radio communication system employing a Ku-band continuous wave power amplifier, characterized in that, include: A transmitter (100) and a receiver (200), the transmitter (100) being used to transmit radio signals and the receiver (200) being used to receive radio signals; The transmitter (100) includes an information input module (101), a first signal processing module (102), a modulator module (103), a power amplifier module (104), and a transmitting antenna (105). The information input module (101), the first signal processing module (102), the modulator module (103), the power amplifier module (104), and the transmitting antenna (105) are electrically connected in sequence. The transmitting antenna (105) is used to transmit radio signals. The power amplifier module (104) includes a driver amplifier (36), a power divider (37), a waveguide combiner (39), and several final stage power amplifiers (38). The input terminal of the driver amplifier (36) is electrically connected to the output terminal of the modulator module (103), the output terminal of the driver amplifier (36) is electrically connected to the input terminal of the power divider (37), the input terminals of several final stage power amplifiers (38) are all electrically connected to the output terminal of the power divider (37), the output terminals of several final stage power amplifiers (38) are all electrically connected to the input terminal of the waveguide combiner (39), and the output terminal of the waveguide combiner (39) is electrically connected to the transmitting antenna (105). The power amplifier module (104) includes a power amplifier body (3), and the power amplifier body (3) includes a housing (31). The outer casing (31) includes a closed top plate (311), a heat dissipation bottom plate (313), and a support plate ring (312). The closed top plate (311) and the heat dissipation bottom plate (313) are arranged parallel to each other and spaced apart. The support plate ring (312) is located between the heat dissipation bottom plate (313) and the support plate ring (312). The heat dissipation bottom plate (313) and the closed top plate (311) are detachably connected to the support plate ring (312). An installation space is formed between the closed top plate (311), the heat dissipation bottom plate (313), and the support plate ring (312). The drive amplifier (36), power divider (37), waveguide combiner (39) and several final stage power amplifiers (38) are all located in the installation space, and several of the final stage power amplifiers (38) are all mounted on the heat dissipation base plate (313). The waveguide combiner (39) is located above the final stage power amplifier (38). The final stage power amplifier (38) can be detachably connected to the heat sink (313) and the waveguide combiner (39). An active heat dissipation mechanism (4) is provided on the heat dissipation base plate (313). The active heat dissipation mechanism (4) includes a mounting plate (41), a heat-conducting plate (42), and a plurality of heat dissipation fins (43). The mounting plate (41) is located on the side of the heat dissipation base plate (313) away from the support plate ring (312). The heat-conducting plate (42) is located on the mounting plate (41) and is in contact with the heat dissipation base plate (313). The mounting plate (41) and the heat dissipation base plate (313) are detachably connected; The mounting plate (41) has a heat dissipation groove (412) through its side wall. A plurality of heat dissipation fins (43) are located in the heat dissipation groove (412). The heat dissipation fins (43) are connected to the heat conduction plate (42). The plurality of heat dissipation fins (43) are arranged in parallel and spaced apart. A heat dissipation air duct (431) is formed between two adjacent heat dissipation fins (43). The length direction of the heat dissipation air duct (431) is arranged along the depth direction of the heat dissipation groove (412). The mounting plate (41) is provided with fan groups (44) on both sides. The two fan groups (44) are spaced apart along the depth direction of the heat dissipation groove (412), and the heat dissipation groove (412) is located between the two fan groups (44). The heat-conducting plate (42) is provided with two ventilation hole groups (45), the two ventilation hole groups (45) are spaced apart along the depth direction of the heat dissipation groove (412), a plurality of heat dissipation fins (43) are located between the two ventilation hole groups (45), the two ventilation hole groups (45) are located between the two fan groups (44), and the ventilation hole groups (45) connect the heat dissipation groove (412) and the installation space; The heat dissipation fins (43) include a plurality of heat dissipation plates (432), which are arranged sequentially along the depth direction of the heat dissipation groove (412). The heat dissipation plates (432) are rotatably connected to the heat conduction plate (42). A switching drive (46) is provided on the mounting plate (41). All the heat dissipation plates (432) are connected to the switching drive (46), and the switching drive (46) is used to drive the heat dissipation plates (432) to rotate. When several heat sinks (432) rotate to a depth direction parallel to the heat sink (412), the heat dissipation air duct (431) is formed between two adjacent heat sinks (43). When several heat sinks (432) rotate to a depth direction perpendicular to the heat sink (412), several heat sink fins (43) close the heat sink (412), and the installation space communicates with the heat sink (412). Under the operation of the fan group (44), the airflow enters the installation space from one ventilation hole group (45) and finally exits the installation space from another ventilation hole group (45).

2. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 1, characterized in that, The power amplifier module (104) also includes a power supply (1) and a controller (2), wherein the drive amplifier (36), power divider (37), waveguide combiner (39) and several final stage power amplifiers (38) are electrically connected to the power supply (1) and the controller (2).

3. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 2, characterized in that, The housing (31) is provided with an RF input port (32), a waveguide output port (33), a power interface (34) and a control interface (35), and the RF input port (32) is electrically connected to the input terminal of the driver amplifier (36), and the output terminal of the waveguide combiner (39) is electrically connected to the waveguide output port (33). The drive amplifier (36), power divider (37), waveguide combiner (39) and several final stage power amplifiers (38) are all electrically connected to the power interface (34) and the control interface (35). The power supply (1) is electrically connected to the power interface (34), the controller (2) is electrically connected to the control interface (35), the output of the modulator module (103) is electrically connected to the radio frequency input port (32), and the input of the transmitting antenna (105) is electrically connected to the waveguide output port (33).

4. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 3, characterized in that, The radio frequency input port (32), waveguide output port (33), power interface (34) and control interface (35) are all located on the support plate ring (312).

5. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 1, characterized in that, Several of the final stage power amplifiers (38) are arranged in a matrix, and adjacent final stage power amplifiers (38) are spaced apart.

6. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 1, characterized in that, The fan assembly (44) includes a plurality of cooling fans (442), each of which is arranged in a one-to-one correspondence with a cooling duct (431), and the cooling fans (442) are positioned directly opposite each other to the corresponding cooling duct (431).

7. A radio communication system employing a Ku-band continuous wave power amplifier according to claim 1, characterized in that, The ventilation hole group (45) includes a first hole (451) and a second hole (452). The first hole (451) is formed on the heat dissipation base plate (313), and the second hole (452) is formed on the heat conduction plate (42). The first hole (451) and the second hole (452) are connected. Two sliding plates (48) are provided on the heat-conducting plate (42). The sliding plates (48) are arranged one-to-one with the ventilation hole group (45). The sliding plates (48) are slidably connected to the heat-conducting plate (42). The sliding plates (48) are connected to the switching drive (46). When the switching drive (46) drives the heat sink (432) to rotate, the switching drive (46) drives the sliding plates (48) to slide synchronously. The slide plate (48) has a through hole (481), and the switching drive (46) is used to drive the slide plate (48) to slide until the through hole (481) is connected to or offset from the first hole (451).

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