Electronic devices

Abstract

The present application discloses an electronic device, which belongs to the technical field of electronic products. The electronic device comprises: a display screen, a frame and a back cover, wherein the frame is arranged between the display screen and the back cover, and the display screen and the back cover are enclosed to form a receiving cavity; a heat sink, wherein the heat sink is arranged in the receiving cavity, and a connecting portion is arranged at the edge of the heat sink; at least one spring sheet; wherein the connecting portion and the spring sheet are respectively provided with a first through hole and a second through hole, and the frame is provided with a positioning portion, wherein the positioning portion is passed through the first through hole and the second through hole and is fixedly connected to the heat sink.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] The vapor chamber (VC) is the main heat dissipation device of electronic devices. Its working principle is to evenly diffuse the heat generated by the heat source to the entire board surface, thereby effectively reducing the risk of local overheating. In order to increase the maximum heat dissipation area of ​​the vapor chamber and meet the antenna grounding requirements and RF grounding requirements, the vapor chamber is generally set on the motherboard of the electronic device in the form of a bracket and connected to the middle frame of the electronic device by spot welding or locking screws.

[0003] However, welding the heat spreader to the middle frame is prone to cold soldering, which can easily cause desoldering during use, affecting the stability of the antenna and video functions; while connecting the heat spreader to the middle frame by screwing requires a wider metal frame, which affects the internal structure layout of the electronic device. Therefore, how to use an extremely narrow frame to reliably connect the heat dissipation components is a technical problem that needs to be solved. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can achieve reliable connection with a heat dissipation component using an extremely narrow frame.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0007] A display screen, a frame and a back cover, wherein the frame is arranged between the display screen and the back cover, and the display screen and the back cover are enclosed to form a containing cavity;

[0008] A heat sink, the heat sink is disposed in the accommodating cavity, and a connecting portion is disposed at an edge of the heat sink;

[0009] at least one shrapnel;

[0010] The connecting portion and the elastic sheet are respectively provided with a first through hole and a second through hole, and the frame is provided with a positioning portion, which passes through the first through hole and the second through hole and is fixedly connected to the heat sink.

[0011] In an embodiment of the present application, the electronic device includes a display screen, a frame and a back cover, the frame is arranged between the display screen and the back cover, and the display screen and the back cover are enclosed to form a receiving cavity; the heat sink is arranged in the receiving cavity, and a connecting portion is arranged at the edge of the heat sink; further, at least one spring sheet is arranged, and a first through hole and a second through hole are arranged on the connecting portion and the spring sheet respectively, and a positioning portion is arranged on the frame; the positioning portion is passed through the first through hole and the second through hole, and when the positioning portion is melted and solidified, the frame and the heat sink are firmly connected. In this way, a reliable connection with the heat sink can be achieved using an extremely narrow frame. Compared with the connection method using locking screws and the spot welding method, the embodiment of the present application can reduce the space occupied by the connection to the frame, and the positioning portion can ensure a reliable connection between the heat sink and the frame after melting and solidification, avoiding the problem of virtual connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 An exploded schematic diagram showing an electronic device according to an embodiment of the present invention;

[0013] Figure 2 The embodiment of the present invention Figure 1 A local enlarged schematic diagram of the T in the middle;

[0014] Figure 3 A schematic diagram showing the installation state of the heat sink and the spring piece according to an embodiment of the present invention;

[0015] Figure 4 The embodiment of the present invention Figure 3 Sectional view along line C-C';

[0016] Figure 5 A schematic diagram showing the structure of a spring piece according to an embodiment of the present invention;

[0017] Figure 6 A schematic diagram showing the structure of a frame body according to an embodiment of the present invention;

[0018] Figure 7 A schematic diagram showing the installation state of the heat sink and the frame according to an embodiment of the present invention.

[0019] Description of reference numerals:

[0020] 1-display screen; 2-frame; 21-positioning part; 22-groove; 3-back cover; 4-heat sink; 41-connecting part; 410-deposition tank; a1-first through hole; a2-second through hole; 42-main body; 5-spring; 51-welding part; A-plane connecting part; B-elastic arm; b-elastic contact. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here. In addition, the "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the objects associated with each other are in an "or" relationship.

[0023] The control method provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0024] Please refer to Figures 1 to 7 , an embodiment of the present invention provides an electronic device, including:

[0025] Display screen 1, frame 2 and back cover 3, frame 2 is arranged between display screen 1 and back cover 3, display screen 1 and back cover 3 enclose to form a containing cavity;

[0026] A heat sink 4 is disposed in the accommodating cavity, and a connecting portion 41 is disposed at an edge of the heat sink 4;

[0027] At least one shrapnel 5;

[0028] The connecting portion 41 and the spring sheet 5 are respectively provided with a first through hole a1 and a second through hole a2 , and the frame body 2 is provided with a positioning portion 21 , which penetrates the first through hole a1 and the second through hole a2 and is fixedly connected to the heat sink 4 .

[0029] Optionally, the heat sink 4 is a heat balancing plate.

[0030] For example, Figure 1 and Figure 2In the structure of the embodiment of the present application, the aluminum motherboard bracket located on the motherboard in the traditional solution is eliminated, and the area where the motherboard bracket is set in the frame 2 is set as the middle through part, and the motherboard bracket is replaced with the heat sink 4, and the heat sink 4 covers the middle through part, and the heat sink 4 is used to assume the function of the motherboard bracket and the heat dissipation function. Furthermore, the second through hole a2 located on the spring sheet 5 and the first through hole a1 located on the connecting part 41 of the heat sink 4 are sequentially penetrated by the positioning part 21 on the frame 2, so that the spring sheet 5 is sandwiched between the connecting part 41 of the heat sink 4 and the frame 2. Under the clamping force applied by the heat sink 4 and the frame 2, the spring sheet 5 is in close contact with the metal part of the frame 2, avoiding the virtual connection problem between the spring sheet 5 and the frame 2.

[0031] In the above embodiment, the heat sink 4 is fixedly connected to the frame 2 by the positioning portion 21, so that a very narrow frame can be used to reliably connect the heat sink 4. Compared with the connection method using locking screws and spot welding in the traditional solution, the embodiment of the present application can reduce the space occupied by the connection of the heat sink 4 to the frame, avoiding the wide frame occupation. Moreover, after the positioning portion 21 is melted and solidified, it can ensure that the heat sink 4 and the frame 2 are reliably connected, avoiding the problem of virtual connection.

[0032] It can be understood that, since the connection of the heat sink 4 occupies less space on the frame, the embodiment of the present application can increase the installation space of the battery and improve the battery capacity.

[0033] In some embodiments, a plurality of welding portions 51 are disposed on the spring piece 5 , and the plurality of welding portions 51 are disposed around the second through hole a2 , and the spring piece 5 is welded to the connecting portion through the plurality of welding portions 51 .

[0034] For example, Figure 5 In the embodiment, a spot welding area is arranged around the second through hole a2 , and the spot welding area includes a plurality of welding portions 51 , and the spring piece 5 is welded to the connecting portion 41 via the plurality of welding portions 51 .

[0035] Optionally, the connection portion 41 of the heat sink 4 and the spring sheet 5 are made of the same metal material to increase welding reliability.

[0036] In some embodiments, Figure 2 and Figure 3 In the embodiment, the heat sink 4 further includes a main body portion 42 , and the connecting portion 41 is recessed relative to the main body portion 42 toward a side of the frame body 2 to form a deposition groove 410 .

[0037] Optionally, the main body 42 and the connecting portion 41 of the heat sink 4 are an integrated structure.

[0038] For example, Figure 3 and Figure 4In the embodiment, the convex surface of the deposition groove 410 provided on the connection portion 41 faces the frame body 2 , and the concave surface of the deposition groove 410 faces the back cover 3 .

[0039] Optionally, the width of the deposition groove 410 is less than or equal to 1.6 mm, and the length of the deposition groove 410 is less than or equal to 3 mm. In this way, the thickness of the whole frame can meet the design size of the deposition groove 410, avoiding the problem of affecting the battery capacity due to increasing the thickness of the frame 2.

[0040] In some embodiments, the positioning portion 21 is formed by hot-melting and solidifying a hot-melt component, and the positioning portion 21 is fixedly connected to the wall of the deposition tank 410 .

[0041] For example, Figure 2 In the figure, a first long through hole a1 is provided on the connection part 41 at the edge of the heat sink 4, a second through hole a2 of the same shape and size as the first through hole a1 is provided on the spring piece 5, and the positioning part 21 is formed by the hot melt after the hot melt is melted and solidified. Specifically, the hot melt first passes through the second through hole a2, and then passes through the first through hole a1, so that the top of the hot melt penetrates the surface of the deposition groove 410. After the heat sink 4 and the frame 2 are assembled, the top of the hot melt is heated and melted to a liquid state, and the liquid fluid is filled in the deposition groove 410. After condensation, it is deposited in the deposition groove 410 to form the positioning part 21, and the surface of the positioning part 21 is flush with the surface of the main body 42 of the heat sink 4. In this way, by providing the deposition groove 410, the hot melt can be melted after heating, and the melted hot melt can be deposited in the deposition groove 410 to avoid overflowing to the surface of the heat sink 4. Moreover, the melted hot melt forms a positioning portion 21, which can enhance the bonding force between the frame 2, the spring sheet 5 and the heat sink 4, thereby clamping the spring sheet 5 between the heat sink 4 and the frame 2, and avoiding virtual contact between the spring sheet 5 and the metal part on the frame 2.

[0042] In some embodiments, the spring 5 includes a planar connecting portion A and elastic arms B arranged on both sides of the planar connecting portion A, the elastic arms B extend toward the side where the frame 2 is located, and an elastic contact b is arranged on the elastic arm B, and the elastic contact b is electrically connected to the frame 2.

[0043] For example, Figure 5 In the figure, the second through hole a2 is opened on the planar connecting part A, and a plurality of welding parts 51 are arranged on the planar connecting part A. An elastic arm B is distributed on both sides of the planar connecting part A, and an elastic contact b is arranged on each elastic arm B. When the frame 2 and the heat sink 4 are in the installed state, the spring sheet 5 is clamped between the frame 2 and the heat sink 4, and the elastic contact b is electrically connected to the frame 2.

[0044] For example, Figure 3 and Figure 5In the embodiment, the spring sheet 5 is a strip-shaped metal sheet with an arc, and an elastic contact b is respectively arranged at both ends of the strip-shaped metal sheet in the length direction, and both ends of the strip-shaped metal sheet in the length direction are tilted toward one side of the frame 2, so that the spring sheet 5 is in a crescent-shaped bending state. That is, the concave surface of the spring sheet 5 faces the frame 2, and the convex surface of the spring sheet 5 faces the heat sink 4. In this way, when the frame 2 and the heat sink 4 are in the installed state, the frame 2 and the heat sink 4 apply a squeezing force to the spring sheet 5, and under the action of the rebound force at both ends of the spring sheet 5, the elastic contact b can be closely abutted against the metal part of the frame 2 to avoid a virtual connection.

[0045] In some embodiments, the elastic contact b is a metal protrusion disposed on the surface of the elastic arm B.

[0046] For example, Figure 5 In the embodiment, the elastic contact b is a spherical structure or an arc structure. Thus, the contact area between the spring 5 and the frame 2 can be adjusted by adjusting the spherical radius or arc length of the contact.

[0047] In some embodiments, a groove 22 is provided on a surface of the frame body 2 facing the elastic sheet 5 , at least a portion of the elastic arm B is located in the groove 22 , and the elastic contact b abuts against the bottom of the groove 22 .

[0048] In this embodiment, by providing the groove 22 , at least a portion of the elastic arm B can be located in the groove 22 , thereby improving the tightness of the connection between the heat sink 4 and the frame 2 .

[0049] In some embodiments, the number of the grooves 22 is two, and the two grooves 22 are symmetrically arranged on both sides of the positioning portion 21 .

[0050] For example, Figure 6 In the figure, a metal groove 22 is provided on both sides of the hot melt. In the process of gradually pressing the frame 2 and the heat sink 4, the elastic contact b slides in the groove 22 until the frame 2 and the heat sink 4 clamp the spring 5, and then melts the top of the hot melt. The melted hot melt forms a positioning part 21 to connect and fix the frame 2, the spring 5 and the heat sink 4.

[0051] In some embodiments, the frame 2 includes a plastic portion and a metal portion, and the plastic portion is embedded in the metal portion;

[0052] The hot melt component and the plastic part are an integrally formed structure.

[0053] like Figure 6 As shown, the hot melt component is a hot melt column arranged on the plastic area of ​​the frame 2, which is integrally formed with the plastic area of ​​the frame 2, and the size of the hot melt component is slightly smaller than the first through hole a1 and the second through hole a2, so that the hot melt component can pass through the first through hole a1 and the second through hole a2.

[0054] In some embodiments, the electronic device further comprises: an antenna module;

[0055] The spring piece 5 is made of metal, and the antenna module is electrically connected to the metal grounding area on the frame 2 via the spring piece 5 .

[0056] For example, Figure 7 As shown, the battery compartment is provided with a grounding position d1 of the antenna module, at the grounding position d1, a hot melt is provided on the frame 2, metal grooves 22 are provided on both sides of the hot melt, and a deposition groove 410 is provided on the connection part 41 of the heat sink 4. During the installation process, the hot melt is sequentially passed through the second through hole a2 provided on the spring sheet 5 and the first through hole a1 provided on the deposition groove 410, and after the hot melt is melted, a positioning part 21 is formed, and the frame 2, the spring sheet 5 and the heat sink 4 are firmly connected through the positioning part 21, so that the elastic contact b abuts against the bottom of the groove 22, realizing the return function of the antenna module.

[0057] In some embodiments, the electronic device further comprises: an antenna module;

[0058] The spring piece 5 is made of metal, and the radio frequency module is electrically connected to the metal grounding area on the frame 2 via the spring piece 5 .

[0059] For example, Figure 7 As shown, the battery compartment is provided with a grounding position d2 of the RF module, at the grounding position d2, a hot melt is provided on the frame 2, metal grooves 22 are provided on both sides of the hot melt, and a deposition groove 410 is provided on the connection portion 41 of the heat sink 4. During the installation process, the hot melt is sequentially passed through the second through hole a2 provided on the spring 5 and the first through hole a1 provided on the deposition groove 410, and after the hot melt is melted, a positioning portion 21 is formed, and the frame 2, the spring 5 and the heat sink 4 are firmly connected through the positioning portion 21, so that the elastic contact b abuts against the bottom of the groove 22, realizing the ground return function of the RF module.

[0060] In some embodiments, the electronic device further includes: a battery, which is accommodated in the accommodating cavity, and the orthographic projection of the battery on the plane where the heat sink 4 is located is located in the main body 42 of the heat sink 4 .

[0061] In this embodiment, the heat dissipation body of the heat dissipation element 4 covers the battery, so that the heat dissipation element 4 can be used to dissipate heat from the battery.

[0062] In some embodiments, the electronic device further comprises:

[0063] The heating element is accommodated in the accommodating cavity, and the orthographic projection of the heating element on the plane where the heat sink 4 is located is located in the main body 42 of the heat sink 4 .

[0064] Optionally, the heating element is arranged on the main board, and the heat dissipation of the heating element can be achieved by covering the heating element in the main body 42 of the heat sink 4 .

[0065] In some embodiments, the first area in the connecting portion is fixedly connected to the frame 2 by double-sided adhesive tape;

[0066] The first area is the area of ​​the connecting portion 41 except the second area, and the second area covers the orthographic projection of the elastic sheet 5 on the heat sink 4 .

[0067] In the above embodiment, except for the second area connected with the spring sheet 5 , the heat sink 4 and other chain connection areas of the frame 2 are insulated and connected by double-sided tape.

[0068] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0069] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0070] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A display screen, a frame and a back cover, wherein the frame is arranged between the display screen and the back cover, and the display screen and the back cover are enclosed to form a containing cavity; A heat sink, the heat sink is disposed in the accommodating cavity, and a connecting portion is disposed at an edge of the heat sink; at least one shrapnel; The connecting portion and the elastic sheet are respectively provided with a first through hole and a second through hole, and the frame is provided with a positioning portion, which passes through the first through hole and the second through hole and is fixedly connected to the heat sink.

2. The electronic device according to claim 1, characterized in that: The spring sheet is provided with a plurality of welding parts, the plurality of welding parts are arranged around the second through hole, and the spring sheet is welded to the connecting part through the plurality of welding parts.

3. The electronic device according to claim 1, characterized in that: The heat sink further includes a main body, and the connecting portion is recessed relative to the main body toward a side of the frame to form a deposition groove.

4. The electronic device according to claim 3, characterized in that: The positioning portion is formed by hot-melting and solidifying a hot-melt component, and the positioning portion is fixedly connected to a groove wall of the deposition groove.

5. The electronic device according to claim 1, characterized in that: The spring sheet includes a planar connecting portion and elastic arms arranged on both sides of the planar connecting portion, the elastic arms extend toward the side where the frame is located, and elastic contacts are arranged on the elastic arms, and the elastic contacts are electrically connected to the frame.

6. The electronic device according to claim 5, characterized in that: The elastic contact is a metal protrusion arranged on the surface of the elastic arm.

7. The electronic device according to claim 5, characterized in that: A groove is arranged on a surface of the frame body facing the elastic sheet. The elastic arm is at least partially located in the groove. The elastic contact abuts against the bottom of the groove.

8. The electronic device according to claim 7, characterized in that: The number of the grooves is two, and the two grooves are symmetrically arranged on both sides of the positioning portion.

9. The electronic device according to claim 1, characterized in that: The electronic device further comprises: an antenna module; Wherein, the spring piece is made of metal, and the antenna module is electrically connected to a metal grounding area on the frame through the spring piece.

10. The electronic device according to claim 1, characterized in that: The electronic device further comprises: a radio frequency module; Wherein, the spring piece is made of metal, and the radio frequency module is electrically connected to a metal grounding area on the frame through the spring piece.

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