Disc type micro-channel liquid cooling plate and heat dissipation module

Abstract

The invention relates to the technical field of liquid cooling, in particular to a disc type micro-channel liquid cooling plate and a heat dissipation module, the disc type micro-channel liquid cooling plate comprises a liquid cooling bottom plate, a plurality of spiral fins and a top cover, the plurality of spiral fins are arranged on the liquid cooling bottom plate at intervals to form a plurality of first flow channels for circulation of a cooling medium, and the top cover is connected to the liquid cooling bottom plate; the top cover is provided with a liquid injection port and a liquid outlet, the liquid injection port and the liquid outlet are communicated with the two ends of the first flow channel respectively, and a plurality of notches are formed in the radial direction of the spiral fins to form a plurality of second flow channels. Meanwhile, the first flow channels and the second flow channels are arranged on the liquid cooling bottom plate, so that the heat exchange area is increased, secondary flow can be generated, cooling media between the different first flow channels at the notches are promoted to be mixed, turbulent flow is enhanced, boundary layers at the notches of the first flow channels are damaged, the convective heat transfer coefficient is increased, and better heat dissipation efficiency is provided.

Description

Technical Field

[0001] The present invention relates to the field of liquid cooling technology, and in particular to a disc-type microchannel liquid cooling plate and a heat dissipation module. Background Art

[0002] As packaging technology advances, chip sizes are getting smaller and smaller, and their heat flux is getting higher and more concentrated, which makes it easier to generate high temperatures and hot spots. Therefore, cooling of electronic devices is a long-standing challenge in packaging design, which involves the selection of cooling methods and materials as well as the design of heat sinks. Compared with air, water has higher thermal conductivity and specific heat capacity, and forced convection liquid cooling using water can more effectively remove waste heat. In addition, liquid cooling does not use fans like active air cooling, so it generates very little noise. In addition, the high heat transfer coefficient and high surface-to-volume ratio enable microchannel heat sinks to dissipate large amounts of heat from electronic chips.

[0003] The current cold plate liquid cooling radiator usually has the fluid inlet and outlet set on the left and right. For example, the microchannel radiator designed by patent CN118890858A has several four-pointed star-shaped protrusion structures inside. The several expanding and contracting microchannels formed by the horizontal and vertical staggered arrangement increase the heat exchange area and improve the heat exchange performance. However, after investigation, it was found that most of the patented microchannel radiators are mainly for radiators with rectangular bases. For some devices (such as LEDs, etc.), the radiators with rectangular bases cannot fully exert the heat dissipation effect.

[0004] It should be noted that the information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes prior art already known to a person skilled in the art. Summary of the invention

[0005] In order to solve the technical problem that the conventional rectangular radiator cannot fully exert the heat dissipation effect, the present invention provides a disc-type microchannel liquid cooling plate, which comprises a liquid cooling bottom plate, a plurality of spiral fins and a top cover, wherein the plurality of spiral fins are arranged on the liquid cooling bottom plate at intervals to form a plurality of first flow channels for the circulation of cooling medium, the top cover is connected to the liquid cooling bottom plate, and a liquid injection port and a liquid outlet are provided on the top cover, and the liquid injection port and the liquid outlet are respectively connected to the two ends of the first flow channel; Wherein, a plurality of cutouts are arranged along the radial direction of the plurality of spiral fins to form a plurality of second flow channels.

[0006] Furthermore, the second flow channel is arc-shaped.

[0007] Furthermore, the curvature of the second flow channel is 70° to 90°.

[0008] Furthermore, the curvature of the second flow channel is 80° to 90°.

[0009] Furthermore, the liquid injection port is arranged at the center of the top cover, and the liquid outlet is close to the outer peripheral side of the top cover.

[0010] Furthermore, the disc-type microchannel liquid cooling plate further comprises a third flow channel, and the third flow channel is connected to the first flow channel, the second flow channel and the liquid outlet respectively.

[0011] Furthermore, the second flow channel is not directly connected to the liquid injection port.

[0012] Furthermore, the number of the spiral fins is 8 to 16.

[0013] Furthermore, the number of the second flow channels is 8 to 16.

[0014] Furthermore, the present invention also provides a heat dissipation module, comprising any one of the above-mentioned disc-type microchannel liquid cooling plates.

[0015] Based on the above, the disc-type microchannel liquid cooling plate and heat dissipation module provided by the present invention, compared with the prior art, adopt a disc-type liquid cooling base plate, which is more in line with the heat dissipation requirements of LED and other equipment. At the same time, a first flow channel and a second flow channel are arranged on the liquid cooling base plate, which not only increases the heat exchange area, but also can generate secondary flow, promote the mixing of cooling media between different first flow channels at the incision, enhance turbulence, thereby destroying the boundary layer at the incision of the first flow channel, improving the convection heat transfer coefficient, and providing better heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. The positional relationship described in the drawings in the following description is based on the direction of the components in the drawings unless otherwise specified.

[0017] Figure 1 A schematic diagram of the exploded structure of a disc-type microchannel liquid cooling plate provided in one embodiment of the present invention; Figure 2 A schematic structural diagram of a first flow channel and a second flow channel provided in one embodiment of the present invention.

[0018] Reference numerals: DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more. In addition, the term "including" and any variation thereof all mean "at least including".

[0021] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the exploded structure of a disc-type microchannel liquid cooling plate provided in one embodiment of the present invention; Figure 2 A schematic structural diagram of a first flow channel and a second flow channel provided in one embodiment of the present invention.

[0022] In order to solve the technical problem that the conventional rectangular heat sink cannot fully exert the heat dissipation effect, or to achieve at least one of the above advantages or other advantages, an embodiment of the present invention provides a disc-type microchannel liquid cooling plate. As shown in the figure, the disc-type microchannel liquid cooling plate includes a liquid cooling bottom plate 10, a top cover 20 and a plurality of spiral fins 30.

[0023] The liquid cooling bottom plate 10 is a disc-shaped plate, which is more suitable for the shape of LED and other equipment, and can give full play to the heat dissipation effect. The top cover 20 covers the liquid cooling bottom plate 10. The top cover 20 is provided with a liquid injection port 40 and a liquid outlet 50. The cooling medium can be injected into the liquid cooling bottom plate 10 through the liquid injection port 40 for heat exchange, and then flows out of the liquid cooling bottom plate 10 through the liquid outlet 50 to complete the heat dissipation cycle.

[0024] For the disc-type liquid-cooled base plate 10, the heat points of the electronic chip are usually concentrated in the middle part. Therefore, the liquid filling port 40 is set at the center of the top cover 20, and the liquid outlet 50 is close to the outer periphery of the top cover 20. That is, when the cooling medium is injected, the cooling medium first flows into the middle part where the heat is concentrated, and then flows to the periphery and flows out through the liquid outlet 50 to complete the heat dissipation cycle, which can make the overall temperature distribution of the liquid-cooled base plate 10 more uniform and avoid a large temperature difference.

[0025] A plurality of spiral fins 30 are arranged on the liquid cooling base plate 10 at intervals to form a plurality of first flow channels 60 for the cooling medium to flow. In a specific implementation, a plurality of spiral fins 30 are arranged on the liquid cooling base plate 10 at intervals to form a plurality of spiral first flow channels 60. The spiral fins 30 can increase the contact area between the liquid cooling base plate 10 and the cooling medium to improve the heat dissipation efficiency.

[0026] The two ends of the first flow channel 60 are respectively connected to the liquid injection port 40 and the liquid outlet 50. The cooling medium can be injected into the liquid cooling base plate 10 through the liquid injection port 40, and flow into different first flow channels 60 for heat exchange, and then flow out of the liquid cooling base plate 10 through the liquid outlet 50 to complete the heat dissipation cycle.

[0027] On the basis of the above, several cuts are provided along the radial direction of several spiral fins 30 to form several second flow channels 70. In specific implementation, cutting is performed along the radial direction of the spiral fins 30 to form several arc-shaped second flow channels 70. The second flow channel 70 is connected to the first flow channel 60. Taking two adjacent first flow channels 60 as an example, when the cooling medium flows through the intersection of the first flow channel 60 and the second flow channel 70, a secondary flow can be generated, which promotes the mixing and exchange of the cooling medium between different first flow channels 60, enhances the turbulence, thereby destroying the boundary layer of the cooling medium in the first flow channel 60, improving the convection heat transfer coefficient, and providing better heat dissipation efficiency.

[0028] Taking the overall liquid cooling base plate 10 as an example, the second flow channel 70 shortens the length of the first flow channel 60, which can significantly reduce the total pressure drop in the first flow channel 60, so that the pressure distribution of the cooling medium tends to be stable, reducing the pressure loss.

[0029] In some preferred embodiments, the curvature of the second flow channel 70 is 70° to 90°, so as to achieve a good balance among flow resistance, heat dissipation area and fluid flow state, thereby achieving the best heat dissipation effect.

[0030] On the basis of the above, the curvature of the second flow channel 70 is 80° to 90°. Further, the curvature of the second flow channel 70 is 85° to 90°, so that the flow resistance, heat dissipation area and fluid flow state are well balanced, thereby achieving the best heat dissipation effect.

[0031] In some preferred embodiments, the disc-type microchannel liquid cooling plate further comprises a third flow channel 80. The third flow channel 80 is respectively connected to the first flow channel 60, the second flow channel 70 and the liquid outlet 50. In specific implementation, the third flow channel 80 is located at the end of the spiral fin 30 away from the liquid injection port 40, that is, the spiral fin 30 is not in contact with the inner side wall of the liquid cooling base plate 10, so that the cooling medium can flow out of the first flow channel 60 and the second flow channel 70, and can flow into the third flow channel 80, and flow along the third flow channel 80 to the liquid outlet 50, and flow out of the liquid cooling base plate 10, completing the heat dissipation cycle.

[0032] Preferably, one end of one of the spiral fins 30 close to the liquid outlet 50 extends toward the side edge of the liquid outlet 50, so that the third flow channel 80 forms a one-way flow channel. When the cooling medium flows into the third flow channel 80, it can only flow around in a single direction, thereby achieving the technical effects of enhancing the uniformity of heat exchange, optimizing the internal pressure distribution of the cooling medium in the third flow channel 80, and promoting the mixing and turbulence of the cooling medium.

[0033] In some preferred embodiments, the second flow channel 70 is not directly connected to the injection port 40. Figure 2 As shown, when the cooling medium is injected from the injection port 40, the flow rate and pressure are relatively high. If the cooling medium flows directly into the second flow channel 70, it may cause a drastic pressure change, which is not conducive to forming a stable secondary flow and a good heat exchange environment.

[0034] Therefore, the second flow channel 70 is not directly connected to the injection port 40, that is, when the cooling medium is injected through the injection port 40, it cannot flow directly into the second flow channel 70, but first flows through the first flow channel 60, performs preliminary flow rate and pressure adjustment and buffering, and then flows into the second flow channel 70, which is conducive to the cooling medium to produce the expected secondary flow and mixing effect in the second flow channel 70. At the same time, it can guide the flow direction of the cooling medium, increase the heat exchange area and time between the cooling medium and the spiral fins 30, and avoid the cooling medium directly flowing into the third flow channel through the second flow channel 70, affecting the overall heat dissipation effect.

[0035] In some preferred embodiments, the number of spiral fins 30 is 8 to 16. The number of second flow channels 70 is 8 to 16. Of course, in specific implementation, the number of spiral fins 30 and the number of second flow channels 70 can be adjusted according to the diameter of the liquid cooling base plate 10, which will not be described in detail here.

[0036] In some preferred embodiments, the present invention further provides a heat dissipation module, comprising any one of the above-mentioned disc-type microchannel liquid cooling plates.

[0037] In order to fully reflect the excellence of the technical solution of the present invention, the present application provides the following samples 1-5 (in order to reduce the complexity of processing and avoid the influence of factors such as processing errors on the sample results, samples 1-5 use square workpieces and set second flow channels 70 with different curvatures on the workpiece), and the convective heat transfer coefficient, temperature difference, heat transfer rate and Nusselt number obtained from samples 1-5 are filled in Table 1: Table 1

[0038] Workpiece samples 1 - 5 with different curvatures of the second flow channel 70 were manufactured, and heat dissipation related parameters of each sample were investigated, including convection heat transfer coefficient, heat transfer rate, Nusselt number, temperature difference, etc.

[0039] Sample 1 The sample 1 was manufactured through the following specific workpiece preparation process.

[0040] In the processing step, a metal material (such as aluminum alloy) is processed into a workpiece body of a specific shape, and its dimensions are 100 mm in length, 50 mm in width, and 20 mm in height. Then a second flow channel 70 is processed on one side of the workpiece, and the angle of the second flow channel 70 is set to 60 degrees. The processing of the second flow channel 70 uses precision CNC processing equipment to ensure the accuracy of the cut and the surface roughness.

[0041] For sample 1, the thermal conductivity was investigated using a thermal conductivity tester in accordance with relevant standards (such as ASTM D5470), and the result showed that the thermal conductivity value was 180 W / (m·K). The results are shown in Table 1 (for workpieces obtained in the manufacturing process of other samples described later, the thermal conductivity measurement results are also shown in Table 1).

[0042] In the heat dissipation performance test process, firstly, the sample 1 is placed in the test area of ​​the wind tunnel experimental device, and a thermocouple is installed at a specific position on the surface of the sample (such as the center position and near the second flow channel 70), and the thermocouple is connected to the data acquisition system. The air flow rate in the wind tunnel device is set to 5m / s, and the ambient temperature is stabilized at 25°C. Then, the heating device is used to uniformly heat the sample 1 until the surface temperature of the sample reaches 75°C. The heating power and time at this time are recorded so as to calculate the parameters such as the heat capacity of the sample later.

[0043] Stop heating and start the data acquisition system to record the surface temperature of sample 1 over time and the air temperature data. During the data acquisition process, continue to observe the air flow in the wind tunnel device to ensure its stability. When the surface temperature of the sample drops to close to the ambient temperature (for example, 30°C), stop data acquisition. Save the collected data, perform preliminary data processing, and calculate the heat transfer rate q at this angle. According to Newton's cooling law q = hAΔT, the convective heat transfer coefficient h is inferred from the known heat dissipation area A (previously measured to be 0.01m²), the average temperature difference ΔT between the sample and the air (calculated based on the collected temperature data), and the measured heat transfer rate q. Then, the Nusselt number Nu is obtained based on specific experimental conditions and calculation formulas.

[0044] Sample 2 In the processing step, the metal material is processed into a workpiece body with the same shape and size as that of the sample 1, and then the second flow channel 70 is processed. The angle of the second flow channel 70 is set to 65 degrees. Other processing conditions are the same as those of the sample 1.

[0045] For sample 2, the same surface microstructure analysis, thermal conductivity test and heat dissipation performance test procedures as those of sample 1 were repeated, and the corresponding convective heat transfer coefficient, heat transfer rate, Nusselt number and temperature difference parameters were calculated, and the results were recorded.

[0046] Sample 3 In the processing step, the metal material is processed into a workpiece body with the same shape and size as that of the sample 1, and then the second flow channel 70 is processed. The angle of the second flow channel 70 is set to 80 degrees. Other processing conditions are the same as those of the sample 1.

[0047] For sample 3, the same surface microstructure analysis, thermal conductivity test and heat dissipation performance test procedures as those of sample 1 were repeated, and the corresponding convective heat transfer coefficient, heat transfer rate, Nusselt number and temperature difference parameters were calculated, and the results were recorded.

[0048] Sample 4 In the processing step, the metal material is processed into a workpiece body with the same shape and size as that of the sample 1, and then the second flow channel 70 is processed. The angle of the second flow channel 70 is set to 90 degrees. Other processing conditions are the same as those of the sample 1.

[0049] For sample 4, the same surface microstructure analysis, thermal conductivity test and heat dissipation performance test procedures as those of sample 1 were repeated, and the corresponding convective heat transfer coefficient, heat transfer rate, Nusselt number and temperature difference parameters were calculated, and the results were recorded.

[0050] Sample 5 In the processing step, the metal material is processed into a workpiece body having the same shape and size as that of the sample 1, and then the second flow channel 70 is processed. The angle of the second flow channel 70 is set to 95 degrees. Other processing conditions are the same as those of the sample 1.

[0051] For sample 5, the same surface microstructure analysis, thermal conductivity test and heat dissipation performance test procedures as those of sample 1 were repeated, and the corresponding convective heat transfer coefficient, heat transfer rate, Nusselt number and temperature difference parameters were calculated, and the results were recorded.

[0052] Convective heat transfer coefficient From the heat dissipation performance test data of samples 1 to 5, the calculated convection heat transfer coefficient (unit: W / (m²·K)) was extracted. The results are shown in Table 1.

[0053] Heat transfer rate Similarly, the calculated heat transfer rate (unit: W) was extracted from the heat dissipation performance test data of samples 1 to 5. The results are shown in Table 1.

[0054] Nusselt number The calculated Nusselt numbers were extracted from the heat dissipation performance test data of samples 1 to 5. The results are shown in Table 1.

[0055] Temperature difference From the heat dissipation performance test data of samples 1 to 5, the average temperature difference between the sample and the air during the heat dissipation process (unit: K) was extracted. The results are shown in Table 1.

[0056] evaluate The workpieces of samples 3 and 4, whose second flow channel 70 angles are in the range of 80-90 degrees, show significantly higher heat transfer rates and Nusselt numbers compared to the workpieces with the second flow channel 70 angles of 60 degrees (sample 1), 65 degrees (sample 2), and 95 degrees (sample 5). This indicates that the workpieces with the second flow channel 70 angles of 80-90 degrees have better heat dissipation performance.

[0057] In the workpieces of samples 1-5, as the angle of the second flow channel 70 changes, parameters such as the convective heat transfer coefficient, heat transfer rate, Nusselt number and temperature difference show a certain regular change, which further verifies that the angle of the second flow channel 70 has an important influence on the heat dissipation performance of the workpiece, and 80-90 degrees is the optimal angle range.

[0058] To sum up, compared with the prior art, the disc-type microchannel liquid cooling plate and heat dissipation module provided by the present invention adopt a disc-type liquid cooling base plate, which is more in line with the heat dissipation requirements of LED and other equipment. At the same time, the first flow channel and the second flow channel are arranged on the liquid cooling base plate, which not only increases the heat exchange area, but also can generate secondary flow, promote the mixing of cooling media between different first flow channels at the incision, enhance turbulence, thereby destroying the boundary layer at the incision of the first flow channel, improving the convection heat transfer coefficient, and providing better heat dissipation efficiency.

[0059] Although the terms such as spiral fins, cutouts, etc. are used more frequently in this article, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

[0060] In addition, those skilled in the art should understand that, although there are many problems in the prior art, each embodiment or technical solution of the present invention can be improved in only one or several aspects, without having to solve all the technical problems listed in the prior art or background technology at the same time. Those skilled in the art should understand that the content not mentioned in a claim should not be used as a limitation on the claim.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A disc-type microchannel liquid cooling plate, characterized in that: include Liquid cooling baseplate; A plurality of spiral fins, wherein the plurality of spiral fins are arranged on the liquid cooling bottom plate at intervals to form a plurality of first flow channels for the cooling medium to flow; A top cover, the top cover is connected to the liquid cooling bottom plate, the top cover is provided with a liquid injection port and a liquid outlet, the liquid injection port and the liquid outlet are respectively connected to two ends of the first flow channel; Wherein, a plurality of cutouts are arranged along the radial direction of the plurality of spiral fins to form a plurality of second flow channels.

2. The disc-type microchannel liquid cooling plate according to claim 1, characterized in that: The second flow channel is arc-shaped.

3. The disc-type microchannel liquid cooling plate according to claim 2, characterized in that: The arc of the second flow channel is 70° to 90°.

4. The disc-type microchannel liquid cooling plate according to claim 3, characterized in that: The arc of the second flow channel is 80° to 90°.

5. The disc-type microchannel liquid cooling plate according to claim 1, characterized in that: The liquid injection port is arranged at the center of the top cover, and the liquid outlet is close to the outer peripheral side of the top cover.

6. The disc-type microchannel liquid cooling plate according to claim 5, characterized in that: The disc-type microchannel liquid cooling plate further comprises a third flow channel, and the third flow channel is respectively connected to the first flow channel, the second flow channel and the liquid outlet.

7. The disc-type microchannel liquid cooling plate according to claim 1, characterized in that: The second flow channel is not directly connected to the liquid injection port.

8. The disc-type microchannel liquid cooling plate according to claim 1, characterized in that: The number of the spiral fins is 8 to 16.

9. The disc-type microchannel liquid cooling plate according to claim 1, characterized in that: The number of the second flow channels is 8 to 16.

10. A heat dissipation module, characterized in that: It comprises a disc-type microchannel liquid cooling plate as described in any one of claims 1 to 9.

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