Display module and preparation method thereof

Abstract

The embodiment of the application discloses a display module and a preparation method thereof. Before bending the to-be-bent part, the side surface of the rigid substrate is covered by a first protective layer, and the back surface of the bent part is covered by a second protective layer, so as to reduce the risk of damage of the to-be-bent part by the rigid substrate. Secondly, the second protective layer covers the back surface of the to-be-bent part, thereby improving the supporting property of the flexible substrate of the to-be-bent part and reducing the risk of fracture of the wire of the to-be-bent part after bending. In addition, because the bonding force between the first protective layer and the side surface of the rigid substrate is large, the thickness of the first protective layer can be thinned, so as to reduce the bending width of the to-be-bent part, and further reduce the frame width of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and its manufacturing method. Background Technology

[0002] Currently, rigid organic light-emitting panels have relatively large bezels due to the rigid support in the bezel area. To solve the problem of excessively large bezels, the common approach is to cut away the glass substrate in the bezel area and then reduce the bezel width by bending it.

[0003] In the process of researching and practicing the prior art, the inventors of this application discovered that, after directly cutting the glass substrate, the cut surface of the glass substrate is uneven and has sharp protrusions. When bending the frame area, the flexible substrate layer is easily damaged by the glass substrate. When the bending degree is large, the flexible substrate has weak support and the wiring of the flexible substrate is easily broken. Summary of the Invention

[0004] This application provides a display module and its manufacturing method, which can reduce the bezel width while protecting the flexible substrate and reducing the risk of wiring breakage in the bent portion.

[0005] This application provides a method for manufacturing a display module, which includes:

[0006] An initial display module is provided, the initial display module including a display panel and a circuit board assembly, the display panel including a rigid substrate and a display body disposed on the rigid substrate, the display body including a display portion and a bendable portion disposed on at least one side of the display portion, and the circuit board assembly being connected to the side of the bendable portion of the display panel away from the display portion;

[0007] Peel off the portion to be bent and the rigid substrate;

[0008] Cut the rigid substrate corresponding to the portion to be bent, and remove the portion of the rigid substrate corresponding to the portion to be bent to expose the back side of the portion to be bent;

[0009] A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent. The bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent. The thickness of the first protective layer is less than the thickness of the second protective layer.

[0010] The portion to be bent is bent such that at least a portion of the circuit board assembly is located on the side of the rigid substrate away from the display body.

[0011] Optionally, in some embodiments of this application, after the step of cutting the rigid substrate and before the step of forming the first protective layer, the preparation method further includes:

[0012] A groove is cut into the side of the rigid substrate to form a recess, such that the first protective layer in a subsequent step covers the recess.

[0013] Optionally, in some embodiments of this application, the steps of forming the first protective layer and the second protective layer include the following steps:

[0014] A first adhesive layer is formed on the side of the rigid substrate, and a second adhesive layer is formed on the back of the portion to be bent, wherein the first adhesive layer and the second adhesive layer are connected.

[0015] Pre-curing the first adhesive layer and the second adhesive layer;

[0016] And, after the step of bending the portion to be bent, the following steps are included:

[0017] The first adhesive layer and the second adhesive layer are then cured to form the first protective layer and the second protective layer.

[0018] Optionally, in some embodiments of this application, before the step of bending the portion to be bent, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is the first thickness;

[0019] After the step of bending the portion to be bent, in the direction perpendicular to the side of the rigid substrate, the portion of the second adhesive layer facing the side of the rigid substrate at least partially overlaps and is connected to the first adhesive layer; in the direction perpendicular to the side of the rigid substrate, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is a second thickness, and the second thickness is less than the first thickness.

[0020] Optionally, in some embodiments of this application, the first adhesive layer and the second adhesive layer are made of the same material, and the first adhesive layer and the second adhesive layer are formed by a single spraying step.

[0021] Optionally, in some embodiments of this application, the first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

[0022] Optionally, in some embodiments of this application, the rigid substrate is laser-cut and the sides of the rigid substrate are grooved.

[0023] Optionally, in some embodiments of this application, one of the portions to be bent is connected to one side of the display portion, and the other portion to be bent is connected to the other side of the display portion;

[0024] The portion to be bent includes a flexible substrate, fan-out traces disposed on the flexible substrate, and bonding pads, wherein the fan-out traces are connected to the bonding pads; the circuit board assembly includes a flexible circuit board and a printed circuit board, wherein one end of the flexible circuit board is connected to the bonding pads, and the other end of the flexible circuit board is connected to the printed circuit board.

[0025] After the step of bending the portion to be bent, the portion to be bent is bent at a 90-degree angle, and the printed circuit board is located on the side of the rigid substrate away from the display body.

[0026] Accordingly, embodiments of this application also provide a display module, which includes

[0027] A display panel includes a rigid substrate and a display body. The display body includes a display portion and a bent portion. The display portion is disposed on the rigid substrate, and the bent portion is bent along the side of the rigid substrate.

[0028] A circuit board assembly is connected to the side of the bent portion away from the display portion, and at least a portion of the circuit board assembly is located on the side of the rigid substrate away from the display portion;

[0029] A first protective layer and a second protective layer, wherein the first protective layer covers the side of the rigid substrate and the second protective layer covers the back of the bent portion, the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the bent portion, and the thickness of the first protective layer is less than the thickness of the second protective layer.

[0030] Optionally, in some embodiments of this application, the rigid substrate has a groove on its side, and the first protective layer covers the groove.

[0031] Optionally, in some embodiments of this application, in a direction perpendicular to the side of the rigid substrate, the portion of the second protective layer facing the side of the rigid substrate at least partially overlaps with and is connected to the first protective layer.

[0032] Optionally, in some embodiments of this application, the first protective layer and the second protective layer are made of the same material.

[0033] Optionally, in some embodiments of this application, the first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

[0034] The method for manufacturing the display module in this application involves covering the side of the rigid substrate with a first protective layer and the back of the bent portion with a second protective layer before bending the portion to be bent. This reduces the risk of the bent portion being damaged by the rigid substrate. Furthermore, the second protective layer covering the back of the bent portion improves the support of the flexible substrate of the bent portion, reducing the risk of the traces of the bent portion breaking after bending. In addition, because the bonding force between the first protective layer and the side of the rigid substrate is large, the thickness of the first protective layer can be reduced to decrease the bending width of the bent portion, thereby reducing the bezel width of the display module. Attached Figure Description

[0035] Figure 1 This is a schematic flowchart of the method for manufacturing a display module provided in an embodiment of this application;

[0036] Figure 2 This is a schematic diagram of step B01 of the method for manufacturing a display module provided in this application embodiment;

[0037] Figure 3 This is a schematic diagram of step B02 of the method for manufacturing a display module provided in this application embodiment;

[0038] Figure 4 This is a schematic diagram of step B03 of the method for manufacturing a display module provided in the embodiments of this application;

[0039] Figure 5 This is a schematic diagram of step B03a of the method for preparing a display module provided in this application embodiment;

[0040] Figure 6 yes Figure 5 An enlarged schematic diagram of part A1 in the middle;

[0041] Figure 7 This is a schematic diagram of step B41 of the method for manufacturing a display module provided in this application embodiment;

[0042] Figure 8 yes Figure 7 Enlarged schematic diagram of section A2;

[0043] Figure 9 This is a schematic diagram of step B43 of the method for manufacturing a display module provided in this application embodiment;

[0044] Figure 10 This is a schematic diagram of step B05 of the method for manufacturing a display module provided in this application embodiment;

[0045] Figure 11 yes Figure 10 Enlarged diagram of section A3;

[0046] Figure 12This is a schematic diagram of the structure of the display module provided in the embodiment of this application. Detailed Implementation

[0047] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0048] This application provides a display module and its manufacturing method, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0049] This application provides a method for manufacturing a display module, which includes:

[0050] An initial display module is provided, the initial display module including a display panel and a circuit board assembly, the display panel including a rigid substrate and a display body disposed on the rigid substrate, the display body including a display portion and a bendable portion disposed on at least one side of the display portion, and the circuit board assembly being connected to the side of the bendable portion of the display panel away from the display portion;

[0051] Peel off the portion to be bent and the rigid substrate;

[0052] Cut the rigid substrate corresponding to the portion to be bent, and remove the portion of the rigid substrate corresponding to the portion to be bent to expose the back side of the portion to be bent;

[0053] A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent. The bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent. The thickness of the first protective layer is less than the thickness of the second protective layer.

[0054] The portion to be bent is bent such that at least a portion of the circuit board assembly is located on the side of the rigid substrate away from the display body.

[0055] The method for manufacturing the display module in this application involves covering the side of the rigid substrate with a first protective layer and the back of the bent portion with a second protective layer before bending the portion to be bent. This reduces the risk of the bent portion being damaged by the rigid substrate. Furthermore, the second protective layer covering the back of the bent portion improves the support of the flexible substrate of the bent portion, reducing the risk of the traces of the bent portion breaking after bending. In addition, because the bonding force between the first protective layer and the side of the rigid substrate is large, the thickness of the first protective layer can be reduced to decrease the bending width of the bent portion, thereby reducing the bezel width of the display module.

[0056] It should be noted that the bonding force between the film layers can be obtained through a peel test. The adhesion force of the film layers can also be obtained through a peel test. Since the peel test is a well-known method, it will not be elaborated upon here.

[0057] It should be understood that some steps in the display module of the embodiments of this application are not limited in order, as long as the manufacturing process of the display module is completed.

[0058] Please refer to Figures 1 to 11 , Figure 1 The diagram shown is a flowchart illustrating the manufacturing method of the display module according to an embodiment of this application.

[0059] This application provides a method for manufacturing a display module, which includes:

[0060] Step B01: An initial display module 1000 is provided. The initial display module 1000 includes a display panel 10 and a circuit board assembly 20. The display panel 10 includes a rigid substrate 11 and a display body 12 disposed on the rigid substrate 11. The display body 12 includes a display portion 121 and a bendable portion 122 disposed on at least one side of the display portion 121. The circuit board assembly 20 is connected to the side of the bendable portion 122 of the display panel 10 away from the display portion 121.

[0061] Step B02: Peel off the portion 122 to be bent and the rigid substrate 11.

[0062] Step B03: Cut the rigid substrate 11 corresponding to the portion 122 to be bent, and remove the portion of the rigid substrate 11 corresponding to the portion 122 to be bent, so as to expose the back side of the portion 122 to be bent.

[0063] In step B04, a first protective layer 31 is formed on the side of the rigid substrate 11 and a second protective layer 32 is formed on the back of the portion 122 to be bent. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the portion 122 to be bent, and the thickness h1 of the first protective layer 31 is less than the thickness h2 of the second protective layer 32.

[0064] Step B05: Bend the portion 122 to be bent so that at least a portion of the circuit board assembly 20 is located on the side of the rigid substrate 11 away from the display body 12.

[0065] The following section will describe in detail the preparation method of the display module according to the embodiments of this application.

[0066] Please refer to Figure 2 In step B01, an initial display module 1000 is provided. The initial display module 1000 includes a display panel 10 and a circuit board assembly 20. The display panel 10 includes a rigid substrate 11 and a display body 12 disposed on the rigid substrate 11. The display body 12 includes a display portion 121 and a bendable portion 122 disposed on at least one side of the display portion 121. The circuit board assembly 20 is connected to the side of the bendable portion 122 of the display panel 10 away from the display portion 121.

[0067] Optionally, the display panel 10 can be an organic light-emitting panel, a quantum dot light-emitting panel, a micro light-emitting diode panel, or a liquid crystal panel, etc. The following description uses an organic light-emitting panel as an example.

[0068] Optionally, the rigid substrate 11 may be a glass substrate or a rigid substrate made of other materials.

[0069] Optionally, there may be two bendable portions 122, one connected to one side of the display portion 121 and the other connected to the other side of the display portion 121. However, this is not a limitation; for example, there may be only one bendable portion 122. The number of bendable portions 122 may be determined according to the actual situation of the display panel 10 and is not limited here.

[0070] The portion 122 to be bent includes a flexible substrate 12a and fan-out traces and bonding pads 12c disposed on the flexible substrate 12a, with the fan-out traces connected to the bonding pads 12c.

[0071] The flexible substrate 12a extends from the portion to be bent 122 to the display portion 121. The display portion 121 is configured to display a screen.

[0072] Optionally, the circuit board assembly 20 includes a flexible circuit board 21 and a printed circuit board 22, with one end of the flexible circuit board 21 connected to the bonding pad 12c and the other end of the flexible circuit board 21 connected to the printed circuit board 22.

[0073] Optionally, in some embodiments, a driver chip 23 is also provided on the portion 122 to be bent.

[0074] Then proceed to step B02.

[0075] Please refer to Figure 3 Step B02: Peel off the portion to be bent 122 and the rigid substrate 11.

[0076] Optionally, the rigid substrate 11 of the portion 122 to be bent can be peeled off using laser scanning.

[0077] Then proceed to step B03.

[0078] Please refer to Figure 4 Step B03: Cut the rigid substrate 11 corresponding to the portion to be bent 122, and remove the portion of the rigid substrate 11 corresponding to the portion to be bent 122 to expose the back side of the portion to be bent 122.

[0079] Optionally, the rigid substrate 11 can be cut using laser or other means.

[0080] Then proceed to step B04.

[0081] In step B04, a first protective layer 31 is formed on the side of the rigid substrate 11 and a second protective layer 32 is formed on the back of the portion 122 to be bent. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the portion 122 to be bent, and the thickness h1 of the first protective layer 31 is less than the thickness h2 of the second protective layer 32.

[0082] In some embodiments, please refer to Figure 5 and Figure 6 The steps following step B03 and before step B04 include the following steps:

[0083] In step B03a, a groove is cut into the side of the rigid substrate 11 to form a recess 11a, so that the first protective layer 31 in the subsequent step covers the recess 11a.

[0084] Optionally, grooves may be made on the side of the rigid substrate 11 using laser or other means.

[0085] Optionally, the rigid substrate 11 is cut using a laser, and the sides of the rigid substrate 11 are grooved. The same laser equipment is used to continuously cut the rigid substrate 11 and perform the grooving on its sides to improve manufacturing efficiency.

[0086] Optionally, in some embodiments, a plurality of grooves 11a may be continuously formed on the side surface of the rigid substrate 11. The depth g1 of the grooves 11a into the rigid substrate 11 is less than or equal to 20 micrometers to avoid excessive strength of the rigid substrate 11. For example, the depth g1 of the grooves 11a can be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers, or 5 micrometers.

[0087] Optionally, in the thickness direction of the rigid substrate 11, the width g2 of the groove 11a is less than or equal to 20 micrometers to avoid excessive strength of the rigid substrate 11. For example, the width g2 of the groove 11a can be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers or 5 micrometers.

[0088] In some embodiments, a plurality of grooves 11a are spaced apart and uniformly arranged in the thickness direction of the rigid substrate 11 to improve the uniformity of the adhesion of the subsequent first protective layer.

[0089] In some embodiments, the spacing between the grooves 11a decreases from the side of the rigid substrate 11 away from the display portion 121 to the side closer to the display portion 121, so that the density of the grooves 11a closer to the display portion 121 is greater, and the adhesion of the subsequent first protective layer 31 is greater closer to the display portion 121. When the portion to be bent 122 is bent, the portion of the first protective layer 31 near the bending corner has greater adhesion to hold the portion to be bent 122, so as to maintain the stability of the shape of the portion to be bent 122 after bending.

[0090] In some embodiments, step B04, forming the first protective layer 31 and the second protective layer 32, includes the following steps:

[0091] Please refer to Figure 7 and Figure 8 In step B41, a first adhesive layer 311 is formed on the side of the rigid substrate 11, and a second adhesive layer 321 is formed on the back of the portion to be bent 122. The first adhesive layer 311 and the second adhesive layer 321 are connected, and the thickness h01 of the first adhesive layer 311 is less than the thickness h02 of the second adhesive layer 321.

[0092] Optionally, adhesive can be sprayed onto the side of the rigid substrate 11 and the back of the portion 122 to be bent.

[0093] Optionally, the first adhesive layer 311 can not only cover the uneven structures such as the pointed protrusions on the side of the rigid substrate 11, but also connect to the second adhesive layer 321 to stabilize the bending shape of the portion 122 to be bent.

[0094] The second adhesive layer 321 not only protects the part 122 to be bent, improves its support, and reduces the risk of the wiring breaking when bent, but also works in conjunction with the first adhesive layer 311 to stabilize the bending shape of the part 122 to be bent.

[0095] Optionally, in some embodiments of this application, the first adhesive layer 311 and the second adhesive layer 321 are made of the same material. The first adhesive layer 311 and the second adhesive layer 321 are formed in a single spraying step to improve preparation efficiency.

[0096] It should be noted that the groove 11a provided on the side of the rigid substrate 11 can improve the bonding force between the first adhesive layer 311 and the rigid substrate 11, thereby thinning the first adhesive layer 311 and reducing the bending width of the portion 122 to be bent.

[0097] Optionally, the thickness h01 of the first adhesive layer 311 is between 50 micrometers and 150 micrometers, for example, it can be 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers or 150 micrometers.

[0098] The thickness h02 of the second adhesive layer 321 is between 100 micrometers and 200 micrometers, for example, it can be 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, 150 micrometers, 160 micrometers, 170 micrometers, 180 micrometers, 190 micrometers or 200 micrometers.

[0099] Optionally, the second adhesive layer 321 covers the entire back side of the portion 122 to be bent. The first adhesive layer 311 covers at least a portion of the side of the rigid substrate 11, such as the first adhesive layer 311 covering the entire side of the rigid substrate 11; or, for example, the first adhesive layer 311 covers a portion of the side of the rigid substrate 11 near the display portion 121.

[0100] Then proceed to step B42.

[0101] Step B42: Pre-cure the first adhesive layer 311 and the second adhesive layer 321.

[0102] Optionally, when the first adhesive layer 311 and the second adhesive layer 321 can be UV-curable adhesives, UV pre-curing of the first adhesive layer 311 and the second adhesive layer 321 can be used. However, this is not limited to this. For example, when the first adhesive layer 311 and the second adhesive layer 321 can be thermosetting adhesives, heating can be used to pre-cur the first adhesive layer 311 and the second adhesive layer 321.

[0103] It is understandable that the pre-cured first adhesive layer 311 and second adhesive layer 321 give the first adhesive layer 311 and second adhesive layer 321 better adhesion and support, while also having a certain degree of flexibility and fluidity, thus improving the stability of the bending process.

[0104] Optionally, in some embodiments, the pre-curing degree of the first adhesive layer 311 is greater than that of the second adhesive layer 321. It is understood that a higher pre-curing degree of the first adhesive layer 311 can reduce excessive overflow of the first adhesive layer 311 during the bending process of the portion to be bent 122, resulting in an excessively thin thickness, thereby reducing the risk of the protrusions on the side of the rigid substrate 11 piercing the portion to be bent 122.

[0105] Then proceed to steps B05 and B43.

[0106] Please refer to Figure 9 In step B43, the first adhesive layer 311 and the second adhesive layer 321 are cured to form the first protective layer 31 and the second protective layer 32.

[0107] It should be noted that step B43 is performed after step B05, that is, after the step of bending the part 122 to be bent.

[0108] After the portion 122 to be bent is bent, the first adhesive layer 311 and the second adhesive layer 321 are then cured. Curing the first adhesive layer 311 and the second adhesive layer 321 after the bending shape of the portion 122 to be bent is determined utilizes the adhesion of the first adhesive layer 311 and the second adhesive layer 321 to maintain the bent shape of the portion 122, reducing the risk of peeling. Simultaneously, it provides better support for the portion 122 to be bent, reducing the risk of wiring breakage.

[0109] Please refer to Figure 10 and Figure 11 Step B05, bend the portion 122 to be bent so that at least a portion of the circuit board assembly 20 is located on the side of the rigid substrate 11 away from the display body 12.

[0110] It is understandable that, based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the degree of bending can be increased by fine-tuning, thereby achieving the effect of squeezing the first adhesive layer 311 and the second adhesive layer 321, so as to reduce the thickness of the connection between the two and further reduce the bending width.

[0111] Secondly, during the mutual compression of the first adhesive layer 311 and the second adhesive layer 321, the first adhesive layer 311 and the second adhesive layer 321 are integrally connected and flow into other spaces, thereby filling the inner space of the bent portion 122 after bending.

[0112] In some embodiments, since the first adhesive layer 311 covers a portion of the side of the rigid substrate 11 near the display portion 121, when the portion to be bent 122 is bent, the portion to be bent 122 and the second adhesive layer 321 will squeeze the first adhesive layer 311 after bending, causing the first adhesive layer 311 to flow in the direction away from the display portion 121 of the rigid substrate 11, reducing the risk of the first adhesive layer 311 overflowing the rigid substrate 11 during bending, and also saving the material of the first adhesive layer 311.

[0113] Optionally, in some embodiments of this application, before the step of bending the portion 122 to be bent, the sum of the thickness h01 of the first adhesive layer 311 and the thickness h02 of the second adhesive layer 321 is the first thickness.

[0114] After bending the portion 122 to be bent, in the direction perpendicular to the side of the rigid substrate 11, the portion of the second adhesive layer 321 facing the rigid substrate 11 at least partially overlaps with and is connected to the first adhesive layer 311. In the direction perpendicular to the side of the rigid substrate 11, the sum of the thickness h01 of the first adhesive layer 311 and the thickness h02 of the second adhesive layer 321 is a second thickness, which is less than the first thickness.

[0115] Understandably, based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the bending degree can be improved by fine-tuning. During this process, the first adhesive layer 311 and the second adhesive layer 321 are squeezed, causing some of the adhesive material of the first adhesive layer 311 and the second adhesive layer 321 to flow to the area with less force, which reduces the total thickness of the first adhesive layer 311 and the second adhesive layer 321, thereby reducing the bending width of the part 122 to be bent.

[0116] Optionally, after the step of bending the portion 122 to be bent, the portion 122 to be bent is bent at a 90-degree angle. The printed circuit board 22 is located on the side of the rigid substrate 11 away from the display body 12.

[0117] It is understandable that bending the portion 122 at a 90-degree angle can further reduce the bending width and thus the bezel width of the display module. The portion 122, after being bent, forms the bent section.

[0118] Optionally, in some embodiments of this application, the first protective layer 31 and the second protective layer 32 are made of different materials, and the adhesion of the first protective layer 31 is greater than that of the second protective layer 32.

[0119] It should be noted that, based on steps B41 to B43, the materials of the first adhesive layer 311 and the second adhesive layer 321 are different, and the first adhesive layer 311 and the second adhesive layer 321 are formed by two separate spraying steps. The viscosity of the first adhesive layer 311 is greater than that of the second adhesive layer 321, resulting in greater adhesion of the first adhesive layer 311 and improved bonding strength with the side surface of the rigid substrate 11. Therefore, the side surface of the rigid substrate 11 may not need to be grooved. In some embodiments, the side surface of the rigid substrate 11 is still grooved, which can further improve the bonding strength between the first adhesive layer 311 and the side surface of the rigid substrate 11, further achieving the effect of reducing the frame width.

[0120] Please refer to Figure 12 Accordingly, this application embodiment also provides a display module 100, which includes a display panel 10, a circuit board assembly 20, a first protective layer 31 and a second protective layer 32.

[0121] The display panel 10 includes a rigid substrate 11 and a display body 12. The display body 12 includes a display portion 121 and a bent portion 123. The display portion 121 is disposed on the rigid substrate 11, and the bent portion 123 is bent along the side of the rigid substrate 11. A circuit board assembly 20 is connected to the side of the bent portion 123 away from the display portion 121, and at least a portion of the circuit board assembly 20 is located on the side of the rigid substrate 11 away from the display portion 121.

[0122] A first protective layer 31 covers the side of the rigid substrate 11, and a second protective layer 32 covers the back of the bent portion 123. The bonding force between the first protective layer 31 and the rigid substrate 11 is greater than the bonding force between the second protective layer 32 and the bent portion 123, and the thickness of the first protective layer 31 is less than the thickness of the second protective layer 32.

[0123] The display module 100 of this application embodiment uses a first protective layer 31 to cover the side of the rigid substrate 11 and a second protective layer 32 to cover the back of the bent portion 123, so as to reduce the risk of the bent portion 123 being damaged by the rigid substrate 11. Secondly, the second protective layer 32 covering the back of the bent portion 123 improves the support of the flexible substrate of the bent portion 123 and reduces the risk of the wiring of the bent portion 123 breaking. In addition, since the bonding force between the first protective layer 31 and the side of the rigid substrate 11 is large, the thickness of the first protective layer 31 can be reduced to reduce the width of the bent portion 123, thereby reducing the bezel width of the display module 100.

[0124] It should be noted that the display module 100 of this application is formed by the manufacturing method of the display module of the above embodiment. The portion to be bent 122 becomes the bent portion 123 after bending.

[0125] In addition, compared to before cutting and bending the rigid substrate, the bezel width of the display module 100 in this embodiment can be reduced to 7 mm.

[0126] Optionally, the bent portion 123 includes a flexible substrate 12a and a fan-out trace and a bonding pad 12c disposed on the flexible substrate 12a, wherein the fan-out trace is connected to the bonding pad 12c.

[0127] Optionally, in some embodiments of this application, a groove 11a is formed on the side of the rigid substrate 11, and the first protective layer 31 covers the groove 11a.

[0128] Optionally, in some embodiments, a plurality of grooves 11a are formed on the side surface of the rigid substrate 11. The grooves 11a penetrate to a depth g1 of less than or equal to 20 micrometers into the rigid substrate 11 to avoid excessive strength of the rigid substrate 11. For example, the depth g1 of the grooves 11a can be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers, or 5 micrometers.

[0129] Optionally, in the thickness direction of the rigid substrate 11, the width g2 of the groove 11a is less than or equal to 20 micrometers to avoid excessive strength of the rigid substrate 11. For example, the width g2 of the groove 11a can be 20 micrometers, 19 micrometers, 18 micrometers, 17 micrometers, 16 micrometers, 15 micrometers, 14 micrometers, 13 micrometers, 12 micrometers, 10 micrometers, 9 micrometers, 8 micrometers, 7 micrometers, 6 micrometers or 5 micrometers.

[0130] In some embodiments, a plurality of grooves 11a are spaced apart and uniformly arranged in the thickness direction of the rigid substrate 11 to improve the uniformity of the adhesion of the subsequent first protective layer.

[0131] In some embodiments, the spacing between the grooves 11a decreases from the side of the rigid substrate 11 away from the display portion 121 to the side closer to the display portion 121, so that the density of the grooves 11a closer to the display portion 121 is greater, and the adhesion of the subsequent first protective layer 31 is greater closer to the display portion 121. When the portion to be bent 122 is bent, the portion of the first protective layer 31 near the bending corner has greater adhesion to hold the portion to be bent 122, so as to maintain the stability of the shape of the portion to be bent 122 after bending.

[0132] Optionally, in some embodiments of this application, in a direction perpendicular to the side of the rigid substrate 11, the portion of the second protective layer 32 facing the side of the rigid substrate 11 at least partially overlaps with and is connected to the first protective layer 31.

[0133] It is understandable that, based on the flexibility and fluidity of the first adhesive layer 311 and the second adhesive layer 321 after pre-curing, the bending degree can be improved by fine-tuning. During this process, the first adhesive layer 311 and the second adhesive layer 321 are squeezed and connected, so that in the direction perpendicular to the side of the rigid substrate 11, the portion of the second protective layer 32 facing the rigid substrate 11 at least partially overlaps and connects with the first protective layer 31.

[0134] The first protective layer 31 and the second protective layer 32 are connected at the inner ring of the bend, which can maintain the stability of the shape of the bend 123 while better supporting the bend 123 and reducing the risk of wire breakage.

[0135] Optionally, in some embodiments of this application, the first protective layer 31 and the second protective layer 32 are integrally connected and fill the inner space of the bent portion 123 near the display portion 121, so as to better maintain the shape of the bent portion 123 and support the bent portion 123.

[0136] Optionally, in some embodiments of this application, the first protective layer 31 and the second protective layer 32 are made of the same material, so that the first protective layer 31 and the second protective layer 32 are formed in a single spraying step to improve the preparation efficiency.

[0137] Optionally, in some embodiments of this application, the first protective layer 31 and the second protective layer 32 are made of different materials, and the adhesion of the first protective layer 31 is greater than that of the second protective layer 32.

[0138] It is understandable that by using different materials to form the first protective layer 31 and the second protective layer 32 with different adhesion, the bonding force between the first protective layer 31 and the rigid substrate 11 is greater, thereby reducing the thickness of the first protective layer 31.

[0139] The above provides a detailed description of a display module and its manufacturing method provided by the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a display module, characterized in that, include: An initial display module is provided, the initial display module including a display panel and a circuit board assembly, the display panel including a rigid substrate and a display body disposed on the rigid substrate, the display body including a display portion and a bendable portion disposed on at least one side of the display portion, and the circuit board assembly being connected to the side of the bendable portion of the display panel away from the display portion; Peel off the portion to be bent and the rigid substrate; Cut the rigid substrate corresponding to the portion to be bent, and remove the portion of the rigid substrate corresponding to the portion to be bent to expose the back side of the portion to be bent; A groove is formed on the side of the rigid substrate; A first protective layer is formed on the side of the rigid substrate and a second protective layer is formed on the back of the portion to be bent. The first protective layer covers the groove. The bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the portion to be bent. The thickness of the first protective layer is less than the thickness of the second protective layer. The portion to be bent is bent such that at least a portion of the circuit board assembly is located on the side of the rigid substrate away from the display body.

2. The preparation method according to claim 1, characterized in that, The steps of forming the first protective layer and the second protective layer include the following steps: A first adhesive layer is formed on the side of the rigid substrate, and a second adhesive layer is formed on the back of the portion to be bent, wherein the first adhesive layer and the second adhesive layer are connected. Pre-curing the first adhesive layer and the second adhesive layer; And, after the step of bending the portion to be bent, the following steps are included: The first adhesive layer and the second adhesive layer are then cured to form the first protective layer and the second protective layer.

3. The preparation method according to claim 2, characterized in that, Before the step of bending the portion to be bent, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is the first thickness; After the step of bending the portion to be bent, in the direction perpendicular to the side of the rigid substrate, the portion of the second adhesive layer facing the side of the rigid substrate at least partially overlaps and is connected to the first adhesive layer; in the direction perpendicular to the side of the rigid substrate, the sum of the thickness of the first adhesive layer and the thickness of the second adhesive layer is a second thickness, and the second thickness is less than the first thickness.

4. The preparation method according to claim 2, characterized in that, The first adhesive layer and the second adhesive layer are made of the same material, and the first adhesive layer and the second adhesive layer are formed by a single spraying step.

5. The preparation method according to any one of claims 1-2, characterized in that, The first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

6. The preparation method according to any one of claims 1-3, characterized in that, The rigid substrate is cut using laser cutting, and the sides of the rigid substrate are grooved.

7. The preparation method according to any one of claims 1-3, characterized in that, One of the portions to be bent is connected to one side of the display portion, and the other portion to be bent is connected to the other side of the display portion; The portion to be bent includes a flexible substrate, fan-out traces disposed on the flexible substrate, and bonding pads, wherein the fan-out traces are connected to the bonding pads; the circuit board assembly includes a flexible circuit board and a printed circuit board, wherein one end of the flexible circuit board is connected to the bonding pads, and the other end of the flexible circuit board is connected to the printed circuit board. After the step of bending the portion to be bent, the portion to be bent is bent at a 90-degree angle, and the printed circuit board is located on the side of the rigid substrate away from the display body.

8. A display module, characterized in that, include A display panel includes a rigid substrate and a display body. The display body includes a display portion and a bent portion. The display portion is disposed on the rigid substrate, and the bent portion is bent along the side of the rigid substrate. A circuit board assembly is connected to the side of the bent portion away from the display portion, and at least a portion of the circuit board assembly is located on the side of the rigid substrate away from the display portion; A first protective layer and a second protective layer, wherein the first protective layer covers the side of the rigid substrate and the second protective layer covers the back of the bent portion, a groove is formed on the side of the rigid substrate and the first protective layer covers the groove, the bonding force between the first protective layer and the rigid substrate is greater than the bonding force between the second protective layer and the bent portion, and the thickness of the first protective layer is less than the thickness of the second protective layer.

9. The display module according to claim 8, characterized in that, In a direction perpendicular to the side of the rigid substrate, the portion of the second protective layer facing the side of the rigid substrate at least partially overlaps with and is connected to the first protective layer.

10. The display module according to claim 9, characterized in that, The first protective layer and the second protective layer are made of the same material.

11. The display module according to any one of claims 8-9, characterized in that, The first protective layer and the second protective layer are made of different materials, and the adhesion of the first protective layer is greater than that of the second protective layer.

Images