Full-automatic testing equipment for rotating disc type semiconductor

Abstract

The invention relates to the technical field of semiconductor testing, in particular to full-automatic testing equipment for a rotating disc type semiconductor, which comprises a rack, and a feeding module is mounted on one side of the surface of the rack; a rotary carrying mechanism is connected to the surface of the rack and located on one side of the feeding module. A conventional detection mechanism used for detecting the wafer chips is arranged on the surface of the rack and located on the outer side of the rotary carrying mechanism. A control panel module is arranged on the surface of the rack; and an alternate flying shuttle module and a gyroscope testing mechanism are arranged on one side of the rotary carrying mechanism. According to the invention, the automation degree is improved, and the testing function of the wafer chip is realized in a rotating disc manner, so that the equipment is more compact, the occupied area is reduced, the movement rhythm among stations is increased, and the working efficiency is improved; and by arranging the gyroscope testing mechanism and the alternate flying shuttle module, the wafer chip can be detected more quickly and conveniently.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor testing, in particular to a fully automatic testing device for turntable semiconductors. Background Art

[0002] A semiconductor refers to a material with controllable conductivity, ranging from an insulator to a conductor. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., while a wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. The wafer chip needs to be tested during the production process.

[0003] At present, the existing wafer chips are tested in a translational manner, which will result in a more dispersed structure and a larger occupied area, thus making the movement rhythm between the various workstations slower and reducing work efficiency; and the existing wafer chips rarely have gyroscope testing, which brings great trouble to people's use. Summary of the invention

[0004] The purpose of the present invention is to provide a fully automatic test equipment for turntable semiconductors to solve the problems mentioned in the above background technology that the existing wafer chips use translation during testing, the work efficiency is low, and gyroscope testing is rarely set.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a fully automatic testing equipment for turntable semiconductors, comprising a frame, a feeding module is installed on one side of the frame surface, and the feeding module is used for loading wafer chips; a rotating conveying mechanism is connected to the frame surface and located on one side of the feeding module; a conventional detection mechanism for detecting wafer chips is arranged on the frame surface and located on the outside of the rotating conveying mechanism; a control panel module is arranged on the surface of the frame, and the control panel module is used for controlling the equipment; an alternating shuttle module and a gyroscope testing mechanism are arranged on one side of the rotating conveying mechanism, and a three-axis conveying mechanism is installed at one end of the frame away from the rotating conveying mechanism, and the three-axis conveying mechanism is used to transport the wafer chips loaded by the alternating shuttle module to the gyroscope testing mechanism for detection, and can transport the wafer chips detected by the gyroscope testing mechanism to the alternating shuttle module for unloading; a taping machine receiving module is installed at one end of the frame.

[0006] Preferably, the rotary transport mechanism includes a DD motor, a turntable and a suction cup module, the DD motor is fixed to the surface of the frame, and a turntable is installed at the output end of the DD motor, and twenty-four suction cup modules for adsorbing wafer chips are installed at the edge of the turntable surface.

[0007] Preferably, the conventional detection mechanism is composed of a correction module, a steering module, a visual camera module, a bottom camera 5S detection module and a defective material box, and the visual camera module, the bottom camera 5S detection module and the defective material box are fixed to the surface of the frame.

[0008] Preferably, a correction module and a steering module are respectively provided on the surface of the frame and on both sides of the visual camera module. The two correction modules and the steering module are used for performing two correction and steering operations on the wafer chip products.

[0009] Preferably, the alternating shuttle module includes a loading module and an unloading module, and the loading module and the unloading module are symmetrically arranged on one side of the rotating conveying mechanism. The loading module is used for loading wafer chips, and the unloading module is used for unloading wafer chips after detection.

[0010] Preferably, the loading module and the unloading module are both composed of a frame, a translation motor, a carrier A, a carrier B, a cam lifting module and a cam guide groove. The frame is fixed to the surface of the frame, and the translation motor is installed on the surface of the frame.

[0011] Preferably, cam lifting modules are fixed at both ends of the synchronous belt of the translation motor, cam guide grooves are opened on both inner side walls of the frame, and the cam of the cam lifting module is located inside the cam guide groove to realize up and down movement, and carriers A and B are respectively fixed on the surfaces of the two cam lifting modules.

[0012] Preferably, the gyroscope testing mechanism includes a bracket, a Y-axis frame, a Y-axis flip motor, an X-axis flip motor, an X-axis frame, a test carrier and a side pressure cylinder, the bracket is fixed to the surface of the frame, and the Y-axis frame is rotatably connected to the inner wall of the bracket, the surface of the bracket is fixed to the Y-axis flip motor, and the output end of the Y-axis flip motor is fixed to the surface of the Y-axis frame.

[0013] Preferably, an X-axis flip motor is installed on the surface of the Y-axis frame, and a rotatable X-axis frame is installed between the output end of the X-axis flip motor and the Y-axis frame; a test carrier for testing wafer chips is fixedly connected to the surface of the X-axis frame, and a side pressure cylinder is installed on one side of the top of the test carrier, which is used to press down the wafer chips.

[0014] Preferably, the three-axis transport mechanism includes a three-axis module and a cylinder clamp, the three-axis module is fixedly connected to the surface of the frame, and the sliding end of the three-axis module is equipped with a cylinder clamp, which is used for transporting wafer chips; the control panel module is composed of a control panel bracket and a display screen, the control panel bracket is fixedly connected to the surface of the frame, and display screens are installed on both sides of the top of the control panel bracket.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the fully automatic test equipment for the turntable type semiconductor is provided with a feeding module, a rotary transport mechanism, a conventional detection mechanism, an alternating shuttle module, a gyroscope test mechanism and a taping machine receiving module; during implementation, the wafer chip is fed to the rotary transport mechanism through the feeding module, and then tested by the conventional detection mechanism and the gyroscope test mechanism, and the wafer chip is transported by the alternating shuttle module and the three-axis transport mechanism during the gyroscope test mechanism, and the receiving is completed by the taping machine receiving module after the test. The present invention improves the degree of automation, realizes the test function of the wafer chip by using the turntable type, makes the equipment more compact, thereby reducing the occupied area, increases the movement rhythm between each station, and improves the work efficiency; and by providing the gyroscope test mechanism and the alternating shuttle module, the wafer chip is tested more quickly and conveniently. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0018] Figure 3 It is a schematic diagram of the structure of the partial separation state of the present invention;

[0019] Figure 4 It is a schematic diagram of the obliquely enlarged structure of the present invention;

[0020] Figure 5 It is a schematic diagram of the enlarged structure of the alternating shuttle module of the present invention;

[0021] Figure 6 It is a schematic diagram of the enlarged structure of the gyroscope testing mechanism of the present invention;

[0022] Figure 7 It is an enlarged structural schematic diagram of the three-axis transport mechanism of the present invention.

[0023] In the figure: 1, frame; 2, feeding module; 3, rotating transport mechanism; 31, DD motor; 32, turntable; 33, suction cup module; 4, conventional detection mechanism; 41, correction module; 42, steering module; 43, visual camera module; 44, bottom camera 5S detection module; 45, defective material box; 5, alternating shuttle module; 51, loading module; 52, unloading module; 501, frame; 502, translation motor; 503, carrier A; 5 04. Carrier B; 505. Cam lifting module; 506. Cam guide groove; 6. Gyroscope test mechanism; 61. Bracket; 62. Y-axis frame; 63. Y-axis flip motor; 64. X-axis flip motor; 65. X-axis frame; 66. Test carrier; 67. Side pressure cylinder; 7. Three-axis transport mechanism; 71. Three-axis module; 72. Cylinder clamp; 8. Control panel module; 81. Control panel bracket; 82. Display screen; 9. Taping machine receiving module. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] The structure of a fully automatic test device for a turntable semiconductor provided by the present invention is as follows: Figure 1 as well as Figure 4 As shown, it includes a frame 1, and a feeding module 2 is installed on one side of the surface of the frame 1. The feeding module 2 is used for loading wafer chips; a rotating conveying mechanism 3 is connected to the surface of the frame 1 and located on one side of the feeding module 2. The rotating conveying mechanism 3 includes a DD motor 31, a turntable 32 and a suction cup module 33. The DD motor 31 is fixedly connected to the surface of the frame 1, and a turntable 32 is installed at the output end of the DD motor 31, and twenty-four suction cup modules 33 for adsorbing wafer chips are installed at the edge position of the surface of the turntable 32.

[0026] During implementation, the wafer chip is loaded onto the suction cup module 33 through the feeding module 2, and then the DD motor 31 drives the turntable 32 to rotate, so that the wafer chip sucked by the suction cup module 33 moves.

[0027] Furthermore, if Figure 3 as well as Figure 4 As shown, a conventional detection mechanism 4 for detecting wafer chips is arranged on the surface of the frame 1 and located on the outside of the rotating conveying mechanism 3. The conventional detection mechanism 4 is composed of a correction module 41, a steering module 42, a visual camera module 43, a bottom camera 5S detection module 44 and a defective product box 45. The visual camera module 43, the bottom camera 5S detection module 44 and the defective product box 45 are fixedly connected to the surface of the frame 1. A correction module 41 and a steering module 42 are respectively arranged on the surface of the frame 1 and located on both sides of the visual camera module 43. The two correction modules 41 and the steering module 42 are used for two correction and steering operations on the wafer chip products.

[0028] During implementation, product correction, product steering and photo inspection are performed through the correction module 41 , the steering module 42 and the visual camera module 43 ; then 5S inspection is performed through the bottom camera 5S inspection module 44 , and defective products are unloaded through the defective product material box 45 .

[0029] Furthermore, if Figure 2 as well as Figure 5 As shown, an alternating shuttle module 5 and a gyroscope testing mechanism 6 are arranged on one side of the rotating transport mechanism 3. The alternating shuttle module 5 includes a loading module 51 and a unloading module 52. The loading module 51 and the unloading module 52 are symmetrically arranged on one side of the rotating transport mechanism 3. The loading module 51 is used for loading wafer chips, and the unloading module 52 is used for unloading wafer chips after detection. The loading module 51 and the unloading module 52 are both composed of a frame 501, a translation motor 502, a carrier A503, a carrier B504, and a cam. The frame 501 is fixedly connected to the surface of the frame 1, and a translation motor 502 is installed on the surface of the frame 501. Cam lifting modules 505 are fixed on both ends of the synchronous belt of the translation motor 502. Cam guide grooves 506 are opened on both inner side walls of the frame 501, and the cam of the cam lifting module 505 is located inside the cam guide groove 506 to realize up and down movement. Carriers A503 and B504 are fixed on the surfaces of the two cam lifting modules 505 respectively.

[0030] During implementation, the wafer chip is pressed by the side pressure cylinder 67, and then the Y-axis flip motor 63 drives the Y-axis frame 62 to perform Y-axis flip, and then the X-axis flip motor 64 drives the X-axis frame 65 to perform X-axis flip, and the test is carried out by the test carrier 66. After the test, it is transported to the unloading module 52 by the three-axis transport mechanism 7, and then enters the suction cup module 33 from the unloading module 52 and is adsorbed by it.

[0031] Furthermore, if Figure 3 as well as Figure 6As shown, the gyroscope testing mechanism 6 includes a bracket 61, a Y-axis frame 62, a Y-axis flip motor 63, an X-axis flip motor 64, an X-axis frame 65, a test carrier 66 and a side pressure cylinder 67. The bracket 61 is fixedly connected to the surface of the frame 1, and the Y-axis frame 62 is rotatably connected to the inner wall of the bracket 61. The Y-axis flip motor 63 is fixedly connected to the surface of the bracket 61, and the output end of the Y-axis flip motor 63 is fixedly connected to the surface of the Y-axis frame 62. The X-axis flip motor 64 is installed on the surface of the Y-axis frame 62, and a rotatable X-axis frame 65 is installed between the output end of the X-axis flip motor 64 and the Y-axis frame 62; the surface of the X-axis frame 65 is fixedly connected to a test carrier 66 for testing wafer chips, and a side pressure cylinder 67 is installed on one side of the top of the test carrier 66, and the side pressure cylinder 67 is used to press down the wafer chips.

[0032] During implementation, the wafer chip continues to move to the loading module 51 and enters the carrier A503 or the carrier B504. The cam lifting module 505 is driven to move by the translation motor 502, so that the carrier A503 or the carrier B504 drives the wafer chip to move.

[0033] Furthermore, if Figure 4 as well as Figure 7 As shown, a three-axis transport mechanism 7 is installed at one end of the frame 1 away from the rotating transport mechanism 3. The three-axis transport mechanism 7 is used to transport the wafer chips loaded by the alternating shuttle module 5 to the gyroscope testing mechanism 6 for testing, and can transport the wafer chips tested by the gyroscope testing mechanism 6 to the alternating shuttle module 5 for unloading. The three-axis transport mechanism 7 includes a three-axis module 71 and a cylinder clamp 72. The three-axis module 71 is fixedly connected to the surface of the frame 1, and the sliding end of the three-axis module 71 is installed with a cylinder clamp 72, and the cylinder clamp 72 is used for transporting wafer chips; a control panel module 8 is provided on the surface of the frame 1, and the control panel module 8 is used for controlling the equipment. The control panel module 8 consists of a control panel bracket 81 and a display screen 82. The control panel bracket 81 is fixedly connected to the surface of the frame 1, and display screens 82 are installed on both sides of the top of the control panel bracket 81; a tape receiving module 9 is installed at one end of the frame 1.

[0034] During implementation, the three-axis module 71 drives the cylinder clamp 72 to move, and the cylinder clamp 72 clamps the wafer chip and places it on the test carrier 66 .

[0035] Working principle: When in use, the wafer chip is first loaded onto the suction cup module 33 through the feeding module 2, and then the DD motor 31 drives the turntable 32 to rotate, so that the wafer chip adsorbed by the suction cup module 33 moves, and moves through the correction module 41, the steering module 42 and the visual camera module 43 in turn for product correction, product steering and camera detection. After the detection, the wafer chip continues to move to the loading module 51 and enters the carrier A503 or carrier B504, and the cam lifting module 505 is driven to move by the translation motor 502, so that the carrier A503 or carrier B504 drives the wafer chip to move.

[0036] Then, the three-axis module 71 drives the cylinder clamp 72 to move, and the cylinder clamp 72 clamps the wafer chip and places it on the test carrier 66. After placement, the wafer chip is pressed by the side pressure cylinder 67, and then the Y-axis flip motor 63 drives the Y-axis frame 62 to flip the Y-axis, and then the X-axis flip motor 64 drives the X-axis frame 65 to flip the X-axis, and the test carrier 66 is used to realize detection. After detection, it is transported to the unloading module 52 by the three-axis transport mechanism 7, and then enters the suction cup module 33 from the unloading module 52 and is adsorbed by it.

[0037] Afterwards, the DD motor 31 drives the turntable 32 to continue moving, and the product correction and product steering are carried out through another correction module 41 and a steering module 42. Then, a 5S inspection is carried out through the bottom camera 5S inspection module 44. Defective products are unloaded through the defective product box 45, and good products are sealed and received through the tape machine receiving module 9, and finally the fully automatic testing of the wafer chip is completed.

[0038] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A fully automatic test device for a turntable semiconductor, comprising a frame (1), characterized in that: A feeding module (2) is installed on one side of the surface of the frame (1), and the feeding module (2) is used for loading wafer chips; a rotating transport mechanism (3) is connected to the surface of the frame (1) and located on one side of the feeding module (2); a conventional detection mechanism (4) for detecting wafer chips is arranged on the surface of the frame (1) and located on the outside of the rotating transport mechanism (3); a control panel module (8) is arranged on the surface of the frame (1), and the control panel module (8) is used for controlling the equipment; An alternating shuttle module (5) and a gyroscope testing mechanism (6) are arranged on one side of the transport mechanism (3); a three-axis transport mechanism (7) is installed at one end of the frame (1) away from the rotary transport mechanism (3); the three-axis transport mechanism (7) is used to transport the wafer chips loaded by the alternating shuttle module (5) to the gyroscope testing mechanism (6) for testing, and can transport the wafer chips tested by the gyroscope testing mechanism (6) to the alternating shuttle module (5) for unloading; and a tape receiving module (9) is installed at one end of the frame (1).

2. The fully automatic test equipment for a turntable semiconductor according to claim 1, characterized in that: The rotary transport mechanism (3) comprises a DD motor (31), a turntable (32) and a suction cup module (33); the DD motor (31) is fixedly connected to the surface of the frame (1); the turntable (32) is installed at the output end of the DD motor (31); and twenty-four suction cup modules (33) for adsorbing wafer chips are installed at the edge of the surface of the turntable (32).

3. The fully automatic test equipment for a turntable semiconductor according to claim 1, characterized in that: The conventional detection mechanism (4) is composed of a correction module (41), a steering module (42), a visual camera module (43), a bottom camera 5S detection module (44) and a defective material box (45); the visual camera module (43), the bottom camera 5S detection module (44) and the defective material box (45) are fixedly connected to the surface of the frame (1).

4. The fully automatic test equipment for a turntable semiconductor according to claim 3, characterized in that: A correction module (41) and a steering module (42) are respectively arranged on the surface of the frame (1) and located on both sides of the visual camera module (43); the two correction modules (41) and the steering module (42) are used for performing two correction and steering operations on the wafer chip product.

5. The fully automatic test equipment for a turntable semiconductor according to claim 1, characterized in that: The alternating shuttle module (5) comprises a loading module (51) and a unloading module (52), wherein the loading module (51) and the unloading module (52) are symmetrically arranged on one side of the rotating transport mechanism (3), wherein the loading module (51) is used for loading wafer chips, and the unloading module (52) is used for unloading wafer chips after detection.

6. The fully automatic test equipment for a turntable semiconductor according to claim 5, characterized in that: The loading module (51) and the unloading module (52) are both composed of a frame (501), a translation motor (502), a carrier A (503), a carrier B (504), a cam lifting module (505) and a cam guide groove (506); the frame (501) is fixed to the surface of the frame (1), and the translation motor (502) is installed on the surface of the frame (501).

7. The fully automatic test equipment for a turntable semiconductor according to claim 6, characterized in that: Cam lifting modules (505) are fixed at both ends of the synchronous belt of the translation motor (502), cam guide grooves (506) are opened on both inner side walls of the frame (501), and the cam of the cam lifting module (505) is located inside the cam guide groove (506) to achieve up and down movement, and carriers A (503) and carriers B (504) are respectively fixed on the surfaces of the two cam lifting modules (505).

8. The fully automatic test equipment for a turntable semiconductor according to claim 1, characterized in that: The gyroscope testing mechanism (6) comprises a bracket (61), a Y-axis frame (62), a Y-axis flip motor (63), an X-axis flip motor (64), an X-axis frame (65), a testing vehicle (66) and a side pressure cylinder (67); the bracket (61) is fixedly connected to the surface of the frame (1), and the Y-axis frame (62) is rotatably connected to the inner wall of the bracket (61); the surface of the bracket (61) is fixedly connected to the Y-axis flip motor (63), and the output end of the Y-axis flip motor (63) is fixedly connected to the surface of the Y-axis frame (62).

9. The fully automatic test equipment for a turntable semiconductor according to claim 8, characterized in that: An X-axis flip motor (64) is installed on the surface of the Y-axis frame (62), and a rotatable X-axis frame (65) is installed between the output end of the X-axis flip motor (64) and the Y-axis frame (62); a test carrier (66) for testing wafer chips is fixedly connected to the surface of the X-axis frame (65), and a side pressure cylinder (67) is installed on one side of the top of the test carrier (66), and the side pressure cylinder (67) is used for pressing down the wafer chips.

10. The fully automatic test equipment for a turntable semiconductor according to claim 1, characterized in that: The three-axis transport mechanism (7) comprises a three-axis module (71) and a cylinder clamp (72); the three-axis module (71) is fixedly connected to the surface of the frame (1), and the sliding end of the three-axis module (71) is equipped with a cylinder clamp (72), and the cylinder clamp (72) is used for transporting wafer chips; the control panel module (8) consists of a control panel bracket (81) and a display screen (82); the control panel bracket (81) is fixedly connected to the surface of the frame (1), and the display screens (82) are installed on both sides of the top of the control panel bracket (81).

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