Simulation test method and system for advanced packaging design

Abstract

The present application relates to a simulation test method and system for advanced packaging design. The method includes: obtaining a three-dimensional geometric model of a packaging structure to be tested, performing multi-level meshing processing on the three-dimensional geometric model based on the packaging level of the packaging structure to be tested, and obtaining a packaging simulation model corresponding to the packaging structure to be tested, wherein the packaging structure to be tested is a device structure obtained based on the advanced packaging design; performing multi-physical field simulation test processing on the packaging simulation model under preset physical field simulation boundary conditions, and obtaining response data sets output by the packaging simulation model according to different physical field simulation boundary conditions; generating simulation test results corresponding to the packaging structure to be tested according to the correlation between the response data sets corresponding to different physical field simulation boundary conditions and the packaging level of the packaging structure to be tested. The use of this method can improve the simulation test efficiency and simulation test accuracy of the packaging structure obtained based on the advanced packaging design.

Description

Technical Field

[0001] The present application relates to the field of simulation testing technology, and in particular to a simulation testing method and system for advanced packaging design. Background Art

[0002] In the field of simulation testing technology, it involves performing simulation testing on a packaging structure, thereby achieving performance evaluation and optimization of the packaging structure under the action of a physical field.

[0003] In the related simulation test methods, the input data and output data of the simulation test are processed based on the overall packaging structure, which makes it difficult to obtain simulation test results based on the internal special structural adaptability of the packaging structure, thereby reducing the simulation test efficiency and simulation test accuracy of the packaging structure. Summary of the invention

[0004] Based on this, it is necessary to provide a simulation test method, system, computer equipment and computer-readable storage medium for advanced packaging design to address the above-mentioned technical problems, so as to improve the simulation test efficiency and simulation test accuracy of the packaging structure obtained based on the advanced packaging design.

[0005] In a first aspect, the present application provides a simulation test method for advanced packaging design, comprising:

[0006] Acquire a three-dimensional geometric model of a package structure to be tested, perform multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested, and obtain a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on an advanced package design;

[0007] Performing multi-physical field simulation test processing on the package simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions, wherein the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions, and electrical boundary conditions;

[0008] According to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the packaging structure to be tested, a simulation test result corresponding to the packaging structure to be tested is generated.

[0009] In a second aspect, the present application also provides a simulation test system for advanced packaging design, including:

[0010] An acquisition module is used to acquire a three-dimensional geometric model of a package structure to be tested, and to perform multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested to obtain a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on an advanced package design;

[0011] A test module, used to perform multi-physical field simulation test processing on the package simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions, wherein the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions and electrical boundary conditions;

[0012] The generation module is used to generate simulation test results corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package levels of the package structure to be tested.

[0013] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the above steps when executing the computer program.

[0014] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the above steps when executed by a processor.

[0015] The above-mentioned simulation test method, system, computer device and computer-readable storage medium for advanced packaging design firstly perform multi-level meshing processing on the three-dimensional geometric model according to the packaging level of the packaging structure to be tested to obtain a packaging simulation model, so that the packaging simulation model can accurately reflect the hierarchical characteristics of the packaging structure to be tested; secondly, perform multi-physical field simulation test processing on the packaging simulation model according to multiple physical field simulation boundary conditions, so as to obtain a response data set of the packaging structure to be tested in multiple dimensions under the action of different physical fields such as thermal, mechanical, and electrical fields; thirdly, according to the correlation between the response data sets of different physical field simulation boundary conditions and the packaging level, adaptively generate simulation test results of the packaging structure to be tested to eliminate the influence of the physical characteristics of different packaging levels on the simulation test results; based on this, by accurately modeling the packaging structure to be tested based on the advanced packaging design, multi-dimensional physical field simulation testing and effective simulation test result evaluation, the test efficiency and test accuracy of the packaging structure are improved, and a comprehensive and effective decision-making basis is provided for the structural optimization and reliability analysis of the advanced packaging design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic flow chart of a simulation test method for advanced packaging design in one embodiment;

[0018] Figure 2 A structural block diagram of a simulation test system for advanced packaging design in one embodiment. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0020] In one embodiment, Figure 1 As shown, a simulation test method for advanced packaging design is provided. This embodiment uses the method applied to a server as an example. It can be understood that the method can also be applied to a terminal, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps S101 to S103.

[0021] Step S101, obtaining a three-dimensional geometric model of the package structure to be tested, performing multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested, and obtaining a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on advanced package design.

[0022] Among them, the package structure to be tested refers to the package structure that needs to undergo physical simulation testing, which is based on advanced package design; advanced package design refers to the packaging technology used to improve package integration, heat dissipation and electrical performance, such as 2.5D packaging, 3D stacked packaging, fan-out packaging and other new packaging technologies.

[0023] Among them, the three-dimensional geometric model represents the three-dimensional spatial morphological description of the package structure to be tested, which is used to accurately represent the size, shape and internal layout of the package structure to be tested, such as a detailed geometric model of components such as chips, solder balls, and package substrates established by CAD tools.

[0024] The packaging level of the package structure to be tested represents the hierarchical relationship composed of different functional parts inside the package structure to be tested, such as the chip layer, interconnect layer, substrate layer and package shell layer in the package structure.

[0025] The package simulation model refers to a computational model for simulation based on a three-dimensional geometric model and mesh division, and is used to analyze the performance of the package structure to be tested in a multi-physical field simulation test.

[0026] Exemplarily, after determining the package structure to be tested, detailed geometric information such as the size, shape and internal layout of the package structure to be tested can be extracted from the design database or modeling software, and a three-dimensional geometric model of the package structure to be tested is constructed based on the detailed geometric information of the package structure to be tested; further, based on multiple packaging levels such as the chip layer, interconnect layer, substrate layer and package shell layer of the package structure to be tested, the three-dimensional geometric model is subjected to multi-level meshing processing, that is, through an adaptive meshing algorithm, the mesh density used for meshing is determined according to the geometric complexity and local characteristics of each packaging level. For example, in a stress concentration area in a certain packaging level, a finer mesh density can be set to improve the accuracy of the simulation results, while in an area where the stress changes more slowly in a certain packaging level, a coarser mesh density can be set to reduce the amount of calculation; finally, based on each packaging level, the three-dimensional geometric model is subjected to multi-level meshing, and a packaging simulation model that can meet the performance requirements of each packaging level is obtained. The packaging simulation model can not only reflect the detailed characteristics of the package structure to be tested, but also adapt to the subsequent multi-physical field simulation test requirements.

[0027] Step S102, performing multi-physical field simulation test processing on the packaging simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the packaging simulation model according to different physical field simulation boundary conditions, wherein the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions and electrical boundary conditions.

[0028] Among them, the physical field simulation boundary conditions refer to the constraints imposed during the simulation test to simulate the actual working environment, such as applying a fixed temperature distribution or heat flux density during the thermal simulation test, applying an external load or fixed support during the mechanical simulation test, and applying an electric potential or current boundary during the electrical simulation test.

[0029] Among them, thermal boundary conditions represent temperature constraints that define the thermal conduction, convection or radiation behavior of the package structure to be tested; mechanical boundary conditions represent force constraints that define the package structure to be tested in terms of mechanical load or internal and external pressure; electrical boundary conditions represent electrical constraints that define the package structure to be tested in terms of electric potential, current distribution or electromagnetic characteristics.

[0030] Among them, the response data set represents the set of numerical calculation results obtained by the packaging simulation model under different physical field simulation boundary conditions, that is, the performance parameters that reflect the performance of the package structure to be tested during the simulation test process, such as the temperature distribution diagram output during the thermal simulation test process, the stress distribution data output during the mechanical simulation test process, and the current density and signal integrity parameters output during the electrical simulation test process.

[0031] Exemplarily, based on thermal boundary conditions, in combination with factors such as operating temperature range, heat flux density distribution, heat dissipation path and thermal conductivity coefficient, a thermal simulation test is performed on the packaging simulation model to obtain a response data set output by the packaging simulation model according to the thermal boundary conditions, such as thermal performance parameters such as thermal distribution, thermal stress or heat dissipation of the package structure to be tested under different temperature environments; based on mechanical boundary conditions, in combination with factors such as externally applied mechanical loads, residual stresses inside the package, environmental vibration shock and thermal expansion stress, a mechanical simulation test is performed on the packaging simulation model to obtain a response data set output by the packaging simulation model according to the mechanical boundary conditions, such as mechanical performance parameters such as stress, strain and deformation of the package structure to be tested under different mechanical actions such as external pressure, thermal expansion, vibration shock, etc.; based on electrical boundary conditions, in combination with factors such as signal integrity, power integrity and electromagnetic interference, an electrical simulation test is performed on the packaging simulation model to obtain a response data set output by the packaging simulation model according to the electrical boundary conditions, such as electrical performance parameters such as electric field, magnetic field and current distribution of the package structure to be tested under conditions such as electrical signal transmission, power supply or electromagnetic interference.

[0032] Step S103 , generating a simulation test result corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package levels of the package structure to be tested.

[0033] The simulation test results represent the final performance analysis conclusions of the package structure to be tested, which are used to evaluate the thermal, mechanical and electrical performances of the package structure to be tested in an actual working environment, and provide a basis for optimizing the design or reliability verification.

[0034] Exemplarily, since the packaging structure to be tested is composed of multiple packaging levels, and the physical properties of different packaging levels have different effects on the simulation test results, independent data analysis can be performed on each response data set based on different packaging levels to determine the quantitative or qualitative relationship between each response data set and the simulation test results, thereby obtaining the simulation test results of the packaging structure to be tested that uniformly correspond to each response data set based on different packaging levels based on the quantitative or qualitative relationship.

[0035] For example, based on the influence of the local thermal stress conditions of different packaging levels on the material reliability, feature analysis and extraction are performed on the response data sets corresponding to the thermal boundary conditions to obtain feature data that can reflect the degree of influence of the local thermal stress conditions of different packaging levels on the material reliability; based on the influence of the local stress distribution conditions of different packaging levels on the material reliability, feature analysis and extraction are performed on the response data sets corresponding to the mechanical boundary conditions to obtain feature data that can reflect the degree of influence of the local stress conditions of different packaging levels on the material reliability; based on the influence of the local electric field distribution conditions of different packaging levels on the material reliability, feature analysis and extraction are performed on the response data sets corresponding to the electrical boundary conditions to obtain feature data that can reflect the degree of influence of the local electric field conditions of different packaging levels on the material reliability. Based on this, according to the feature data extracted from each response data set, the quantitative or qualitative relationship between each response data set and the simulation test results is determined at the level of the degree of influence on the material reliability, so as to obtain the simulation test results at the level of the degree of influence on the material reliability.

[0036] In the simulation test method of the above-mentioned advanced packaging design, first, the three-dimensional geometric model is subjected to multi-level meshing processing according to the packaging level of the packaging structure to be tested to obtain a packaging simulation model, so that the packaging simulation model can accurately reflect the hierarchical characteristics of the packaging structure to be tested; secondly, the packaging simulation model is subjected to multi-physical field simulation test processing according to multiple physical field simulation boundary conditions, so as to obtain a response data set of the packaging structure to be tested in multiple dimensions under the action of different physical fields such as thermal, mechanical, and electrical fields; thirdly, according to the correlation between the response data sets of different physical field simulation boundary conditions and the packaging level, the simulation test results of the packaging structure to be tested are adaptively generated to eliminate the influence of the physical characteristics of different packaging levels on the simulation test results; based on this, by accurately modeling the packaging structure to be tested based on the advanced packaging design, multi-dimensional physical field simulation testing and effective simulation test result evaluation, the test efficiency and test accuracy of the packaging structure are improved, and a comprehensive and effective decision-making basis is provided for the structural optimization and reliability analysis of the advanced packaging design.

[0037] In an exemplary embodiment, multi-level meshing is performed on the three-dimensional geometric model based on the packaging level of the package structure to be tested to obtain a package simulation model corresponding to the package structure to be tested, including steps S201 to S202.

[0038] Step S201 , obtaining geometric features of each packaging level of the package structure to be tested, performing multi-level meshing processing on the three-dimensional geometric model based on the geometric features of each packaging level, and obtaining network units corresponding to each packaging level.

[0039] The geometric features of each packaging level represent geometric information such as shape, size, boundary, thickness, and material composition of each packaging level in the packaging structure to be tested.

[0040] Among them, the network units corresponding to each packaging level respectively indicate that during the physical simulation test, the three-dimensional geometric model of the packaging structure to be tested is discretized into a finite number of grid units according to each packaging level to serve as the minimum calculation unit of the physical simulation test.

[0041] Exemplarily, geometric features such as shape, size, boundary, thickness, and material composition of each packaging level of the packaging structure to be tested can be extracted from the design database or modeling software, and the three-dimensional geometric model can be subjected to multi-level meshing processing based on the geometric features of each packaging level to ensure that the network units corresponding to each packaging level obtained by division can accurately describe the geometric features of the corresponding packaging level while ensuring the simulation accuracy.

[0042] For example, in the chip layer, since the chip layer requires high-precision signal transmission analysis in electrical simulation testing, a high-density, regular grid division method is required to accurately describe the current path and electric field distribution; secondly, it is necessary to ensure that the grid can be encrypted in areas with high local heat flux density or stress concentration, such as setting finer grids in high-power density logic areas, solder ball connection areas, etc., and setting coarser grids in uniform areas of the silicon substrate.

[0043] For another example, in the interconnect layer, the grid density is increased in the signal transmission path area to ensure the accuracy of the electrical simulation calculation, and a coarser grid is set in the insulating medium area to ensure the overall calculation stability while reducing the calculation cost. In the via area, due to the strong electromagnetic field changes, a local encrypted grid is set to improve the accuracy of the electrical simulation calculation.

[0044] For another example, in the substrate layer, the metal wiring part uses a denser grid to ensure the accuracy of the signal integrity calculation, while the dielectric layer uses a coarser grid to reduce the calculation burden; furthermore, the pad area plays an important role in thermal simulation testing and mechanical simulation testing because it carries the signal input / output of the chip layer. Therefore, local grid encryption is required in the pad and surrounding areas to ensure the accuracy of thermal simulation and mechanical simulation.

[0045] For another example, in the package shell layer, since the geometric features of the package shell layer are relatively regular and its main functions are heat dissipation and structural support, the mesh division can be relatively rough; secondly, in the contact area between the package shell and the substrate, due to the existence of a heat conduction boundary, the mesh needs to be appropriately refined to accurately simulate the heat flow transfer; thirdly, the mesh division of the package shell layer needs to take into account areas where structural stress is concentrated, such as package corners, solder ball connection areas, etc., to ensure that the local mesh density is high enough.

[0046] Step S202 , performing data coupling processing on the network units corresponding to each packaging level to obtain a packaging simulation model corresponding to the packaging structure to be tested.

[0047] For example, since there are interactions between the various packaging levels of the packaging structure to be tested, such as electrical signal coupling between the chip layer and the interconnection layer, and heat conduction and stress transfer between the chip layer and the packaging shell layer, when constructing a packaging simulation model, the data transfer relationship between the various packaging levels needs to be considered to ensure that the grid units of different packaging levels can achieve effective coupling.

[0048] Among them, the process of data coupling usually includes geometric alignment, grid node matching, boundary condition coordination and other processes, which connect and effectively couple the grid units of different packaging levels to ensure that the grid units of different packaging levels can share data and maintain continuity during the calculation process; among them, geometric alignment is used to correctly connect the grid units of different packaging levels in space to avoid misalignment or discontinuity problems during calculation, such as coordinate transformation or rotation of grid units; grid node matching is used to match the nodes of grid units on the interface of adjacent packaging levels to ensure the correctness of data exchange, such as direct matching of grid nodes on both sides of the interface when the network density on both sides of the interface is the same, and interpolation matching of coarse grid nodes when the network density on both sides of the interface is different; boundary condition coordination is used to ensure that the physical parameters of different packaging levels can remain continuous at the interface to avoid physical inconsistency or singularity in numerical calculation, such as setting the heat transfer coefficient on the boundary surface to ensure the reasonable flow of heat, setting coupling constraints on the mechanical contact surface to avoid unreasonable deformation jumps between packaging levels, etc.

[0049] In this embodiment, on the one hand, multi-level grid division processing is performed on the three-dimensional geometric model according to the geometric characteristics of each packaging level to obtain network units corresponding to each packaging level, so that the grid density of different packaging levels can match their respective structural complexity and physical characteristics, thereby improving the simulation accuracy and optimizing the calculation efficiency; on the other hand, data coupling processing is performed on the network units corresponding to each packaging level to obtain a packaging simulation model, thereby ensuring that the grid units at different packaging levels can maintain data continuity and calculation stability during the multi-physical field simulation test.

[0050] In an exemplary embodiment, a multi-physical field simulation test is performed on a packaging simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the packaging simulation model according to different physical field simulation boundary conditions, including steps S301 to S303.

[0051] Step S301 : acquiring test data sets corresponding to respective physical field simulation boundary conditions based on the target physical field environment of the package structure to be tested.

[0052] The target physical field environment represents the working environment of the package structure to be tested, which may represent the actual working environment in which the package structure to be tested is currently located, or may represent the expected working environment in which the package structure to be tested is specified.

[0053] Among them, the test data set represents the actual measurement data obtained according to the target physical field environment, which directly reflects the key physical quantities of the package structure to be tested in the working environment.

[0054] Exemplarily, based on the target physical field environment in which the package structure to be tested is located, the physical conditions faced by the package structure to be tested in the actual usage scenario are determined, and test data sets corresponding to each physical field simulation boundary condition are obtained according to these physical conditions; wherein the test data sets related to the target physical field environment can be obtained through experimental measurements, sensor measurements or historical data.

[0055] Step S302 : Based on the statistical characteristics of each test data set, each test data set is subjected to data conversion processing to obtain input data sets corresponding to each physical field simulation boundary condition.

[0056] Among them, the statistical characteristics of the test data set represent the data distribution characteristics of the test data set, such as data range, mean, standard deviation, discreteness, volatility, change trend and probability distribution, which are used to describe the data change rules of the test data set over space or time.

[0057] The input data set refers to a data set that is obtained after data conversion processing of the test data set and that meets the format and requirements of the simulation calculation, and can be directly used for multi-physics field simulation calculations.

[0058] Exemplarily, according to the statistical characteristics of each test data set, each test data set is subjected to data conversion processing, such as data format conversion, normalization, interpolation calculation, noise filtering and other data preprocessing operations, to obtain input data sets corresponding to each physical field simulation boundary condition. For example: in thermal simulation testing, if a certain data in the test data set is given in the form of discrete temperature points, and the thermal simulation calculation requires a continuous temperature field distribution, it is necessary to use an interpolation method to convert the discrete data into a continuous temperature field to ensure the smoothness and accuracy of the simulation input data; in mechanical simulation testing, if the test data sets come from different experimental equipment and there are differences in data units and distribution forms, it is necessary to use normalization or standardization to convert the data in the test data set into an input format that meets the requirements of the simulation calculation to ensure data consistency; in electrical simulation testing, if it is determined based on the statistical characteristics of the test data set that the test data set contains noise or errors, it is necessary to use a filtering algorithm to denoise the data in the test data set to avoid introducing additional errors during the simulation calculation process.

[0059] Step S303 , inputting each input data set into the packaging simulation model for multi-physical field simulation test processing, and obtaining response data sets outputted by the packaging simulation model according to different physical field simulation boundary conditions.

[0060] Exemplarily, each input data set is input into the packaging simulation model to perform multi-physics field simulation test processing. In this process, the packaging simulation model acts as a computing subject, and performs data solution processing on each input data set and each physical field simulation boundary condition through numerical calculation methods such as finite element analysis, finite difference method or finite volume method. This is a process of multi-physics field simulation test processing based on the packaging simulation model, thereby obtaining the real physical response of the packaging structure to be tested in the target physical field environment simulated by the packaging simulation model.

[0061] In this embodiment, on the one hand, according to the target physical field environment of the package structure to be tested, the test data sets corresponding to the simulation boundary conditions of each physical field are obtained, so as to ensure that the simulation input data can accurately reflect the actual working state of the package structure to be tested and improve the reliability of the simulation results; on the other hand, according to the statistical characteristics of each test data set, the test data set is subjected to data conversion processing to obtain an input data set suitable for simulation calculation, so as to ensure that the simulation input data meets the simulation calculation requirements; on the other hand, each input data set is input into the package simulation model for multi-physical field simulation test processing, so as to obtain effective simulation results by simulating the real physical response of the package structure to be tested under the action of different physical fields through numerical solution.

[0062] In an exemplary embodiment, based on the target physical field environment of the package structure to be tested, test data sets corresponding to the respective physical field simulation boundary conditions are obtained, including steps S401 to S403.

[0063] Step S401 : based on the heat distribution condition in the target physical field environment, temperature measurement data corresponding to the thermal boundary condition is obtained, and the temperature measurement data is used as a test data set corresponding to the thermal boundary condition.

[0064] Among them, the thermal distribution condition refers to the temperature distribution and heat transfer conditions in the target physical field environment where the package structure to be tested is located; the temperature measurement data refers to the temperature data related to the target physical field environment measured by temperature sensors, infrared thermal imagers, thermocouples and other equipment, such as temperature value, temperature gradient, heat flux density, etc.

[0065] Exemplarily, first, determine the temperature conditions of the target physical field environment, for example, determine whether the target physical field environment is working in a high temperature, high humidity, air-cooled or liquid-cooled environment; secondly, based on the determined temperature conditions of the target physical field environment, further determine the spatial thermal distribution of the target physical field environment, for example, in a natural convection environment, whether the ambient temperature is uniform, or whether there is a local heat accumulation area that affects the heat dissipation of the package, etc. Furthermore, the temperature distribution of the target physical field environment at different time points can be measured by a thermocouple array or an infrared thermal imager to determine the temporal thermal distribution of the target physical field environment. Finally, by analyzing the above data, the thermal distribution status of the target physical field environment can be accurately determined, so as to obtain relevant temperature measurement data in combination with the thermal distribution status of the target physical field environment.

[0066] Step S402 : based on the mechanical stress distribution in the target physical field environment, obtaining stress measurement data corresponding to the mechanical boundary condition, and using the stress measurement data as a test data set corresponding to the mechanical boundary condition.

[0067] Among them, the mechanical stress distribution condition represents the stress distribution caused by factors such as temperature changes and mechanical vibrations in the target physical field environment where the package structure to be tested is located; the stress measurement data represents the stress data related to the target physical field environment measured by methods such as photoelastic experiments, strain gauge measurements, and digital image correlation methods, such as stress, strain, and deformation.

[0068] Exemplarily, first, determine the stress source in the target physical field environment, for example, whether it is in an environment with strong mechanical vibration (such as automotive electronics), whether it is affected by gravity or other structural stress (such as distortion or stress concentration during PCB installation), etc.; secondly, based on the determined stress source of the target physical field environment, measure the distribution of mechanical stress in the target physical field environment, for example, in a high-frequency vibration environment, measure the acceleration distribution at different positions through a vibration sensor to evaluate the possible dynamic mechanical stress, and in a static pressure environment, analyze the distribution of stress in the target physical field environment through a pressure sensor or photoelastic testing method. Finally, through the analysis of the above data, the distribution of mechanical stress in the target physical field environment can be accurately determined, so as to obtain relevant stress measurement data in combination with the distribution of mechanical stress in the target physical field environment.

[0069] Step S403, based on the electromagnetic field distribution in the target physical field environment, electrical measurement data corresponding to the electrical boundary condition is acquired, and the electrical measurement data is used as a test data set corresponding to the electrical boundary condition.

[0070] Among them, the electromagnetic field distribution status refers to the electrical distribution conditions such as electric field distribution, magnetic field distribution, current density distribution, etc. in the target physical field environment where the package structure to be tested is located; the electrical measurement data refers to the electrical data related to the target physical field environment measured by equipment such as vector network analyzer, time domain reflectometer, oscilloscope, etc., such as current, electric field, electromagnetic interference data, etc.

[0071] Exemplarily, first, determine the electromagnetic environment in the target physical field environment, for example, whether it is in a high electromagnetic noise environment (such as near radio frequency communication equipment), whether there is a high-power current source (such as a high-frequency DC / DC converter) or a strong magnetic field interference source (such as a motor, inductor), etc.; secondly, based on the determined electromagnetic environment of the target physical field environment, measure the electromagnetic field distribution in the target physical field environment, such as using a vector network analyzer to measure the electromagnetic field strength distribution at different locations, or using a near-field scanning device to analyze the changes in the electric field and magnetic field in the area where the package structure to be tested is located; furthermore, the electromagnetic interference level at a specific operating frequency can be measured to evaluate the possible impact of the target physical field environment on the signal integrity and power integrity of the package structure to be tested. Finally, by analyzing the above data, the electromagnetic field distribution in the target physical field environment can be accurately determined, so as to obtain relevant electrical measurement data in combination with the electromagnetic field distribution in the target physical field environment.

[0072] In this embodiment, on the one hand, based on the heat distribution condition in the target physical field environment, temperature measurement data corresponding to the thermal boundary conditions are obtained, thereby ensuring that the temperature test data can accurately reflect the actual thermal influence of the environment in which the package structure to be tested is located; on the other hand, based on the mechanical stress distribution condition in the target physical field environment, stress measurement data corresponding to the mechanical boundary conditions are obtained, thereby ensuring that the stress test data can accurately reflect the actual mechanical force influence of the environment in which the package structure to be tested is located; on the other hand, based on the electromagnetic field distribution condition in the target physical field environment, electrical measurement data corresponding to the electrical boundary conditions are obtained, thereby ensuring that the electrical test data can accurately reflect the actual electrical influence of the environment in which the package structure to be tested is located.

[0073] In an exemplary embodiment, each input data set is input into the packaging simulation model for multi-physical field simulation test processing to obtain response data sets output by the packaging simulation model according to different physical field simulation boundary conditions, including steps S501 to S503.

[0074] Step S501 : determining target packaging levels that are matched with respective physical field simulation boundary conditions based on a structural mapping relationship between each packaging level of the package structure to be tested and each target packaging level of the package simulation model.

[0075] Among them, each target packaging level of the packaging simulation model represents the structural level divided in the packaging simulation model, and each target packaging level corresponds to a specific physical part in the packaging structure to be tested, such as a chip layer, an interconnect layer, a substrate layer, a packaging shell layer, etc.

[0076] Exemplarily, when constructing a packaging simulation model, each target packaging level of the packaging simulation model is constructed in advance according to each packaging level of the packaging structure to be tested, so that the packaging simulation model has hierarchical characteristics consistent with the actual packaging structure to be tested; furthermore, through the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, combined with the characteristics of the packaging level under different physical fields, the physical field simulation boundary conditions are matched with the specific target packaging level. For example: in the thermal simulation test, the power consumption distribution of the chip layer, the heat conduction of the solder ball area of ​​the interconnect layer, and the heat dissipation capacity of the substrate layer are analyzed in detail. Therefore, the thermal boundary conditions should mainly match these target packaging levels; in the mechanical simulation test, the thermal expansion effect inside the packaging structure to be tested, the material interface stress distribution, and the deformation of the packaging structure to be tested under the action of external force are analyzed in detail. Therefore, the mechanical boundary conditions mainly match the interconnect layer and the packaging shell layer; in the electrical simulation test, the signal integrity and power integrity are analyzed in detail. Therefore, the electrical boundary conditions mainly match the chip layer, the interconnect layer, and the substrate layer.

[0077] Step S502, obtaining the simulation calculation domain of each target packaging level, performing boundary adaptation processing on the simulation calculation domain of the matching target packaging level through each physical field simulation boundary condition, and obtaining the target simulation calculation domain corresponding to each target packaging level.

[0078] Among them, the simulation calculation domain of each target packaging level represents the calculation area used by each target packaging level in the simulation solution process in the packaging simulation model; the target simulation calculation domain represents the simulation calculation domain after the physical field simulation boundary condition adaptation processing to adapt to the input data sets of different physical field simulations.

[0079] Exemplarily, first, based on the physical characteristics of each packaging level, such as the geometric shape, material properties and physical boundary conditions, a basic framework of the simulation calculation domain of each target packaging level is established, so that it can not only accurately characterize the physical characteristics of the packaging level of the packaging structure to be tested, but also meet the limitations of computing resources. For example: in thermal simulation testing, the simulation calculation domain of the chip layer needs to be finely divided to accurately simulate the heat conduction path, while the simulation calculation domain of the packaging shell layer can be appropriately simplified to reduce the amount of calculation; in mechanical simulation testing, the interface area of ​​the packaging level needs to be finely divided to accurately simulate the interface stress distribution, while the area away from stress concentration can be appropriately simplified; in electrical simulation testing, the target packaging level involving signal transmission paths and power supply networks needs to be finely divided to ensure signal integrity and the accuracy of electromagnetic interference calculations.

[0080] Exemplarily, after the basic framework of the simulation calculation domain is constructed, the simulation calculation domain is subjected to boundary adaptation processing to obtain the target simulation calculation domain, so as to ensure that the physical field simulation boundary conditions can be correctly applied to the target simulation calculation domain of the matching target packaging level, that is, the boundary conditions of the simulation calculation domain can be consistent with the actual physical field environment, and ensure the continuity of data transmission during the simulation process, for example: in the thermal simulation test, based on the thermal boundary conditions, the heat flow boundary is applied to the simulation calculation domains of the chip layer, the interconnection layer, and the substrate layer to obtain the corresponding target simulation calculation domain, so that the heat energy can be accurately simulated to be transferred along the actual heat dissipation path; in the mechanical simulation test, based on the mechanical boundary conditions, fixed constraints or external impact loads are applied to the simulation calculation domains of the interconnection layer and the package shell layer to obtain the corresponding target simulation calculation domain, so that the stress distribution under the actual working conditions can be accurately simulated; in the electrical simulation test, based on the electrical boundary conditions, the DC voltage boundary, the high-frequency signal input threshold, the far-field radiation boundary, etc. are applied to the simulation calculation domains of the chip layer, the interconnection layer, and the substrate layer to obtain the corresponding target simulation calculation domain, so that the current distribution path, signal propagation path, external electromagnetic environment influence, etc. inside the package can be accurately simulated.

[0081] Step S503, input each input data set into the target simulation calculation domain corresponding to the matched target packaging level in the packaging simulation model for multi-physical field simulation test processing, and obtain response data sets output by each target packaging level of the packaging simulation model according to the matched input data set, and each target packaging level is matched to at least one input data set.

[0082] Exemplarily, in multi-physics simulation test processing, the target simulation calculation domain corresponding to each target packaging level in the packaging simulation model solves the input data set through numerical calculation methods such as finite element analysis, finite difference method or finite volume method to obtain response data sets output by each target packaging level according to the matching input data set. For example: in thermal simulation testing, the temperature distribution, heat flux density, heat dissipation and other thermal performance parameters inside the package structure to be tested are calculated based on the input power consumption data through the target simulation calculation domain of the matching target packaging level; in mechanical simulation testing, the stress distribution, deformation and other mechanical performance parameters of the package structure to be tested under different load conditions are calculated based on the input stress data through the target simulation calculation domain of the matching target packaging level; in electrical simulation testing, the electrical performance parameters such as signal integrity, power integrity, and electromagnetic interference characteristics are calculated based on the input electrical data through the target simulation calculation domain of the matching target packaging level.

[0083] In this embodiment, first, according to the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, the target packaging levels that are matched by each physical field simulation boundary condition are determined, so as to ensure that the simulation calculations of different physical fields can accurately act on the matching packaging level; secondly, the simulation calculation domain of the matching target packaging level is boundary adapted through each physical field simulation boundary condition to obtain the target simulation calculation domain, so as to optimize the calculation domain structure to meet the simulation solution requirements so as to improve the simulation accuracy and calculation stability; thirdly, each input data set is input into the target simulation calculation domain corresponding to the matching target packaging level in the packaging simulation model for multi-physical field simulation test processing, so as to achieve accurate and targeted processing of the input data set at the level of the target packaging level and the target simulation calculation domain, thereby improving the reliability of the simulation test results.

[0084] In an exemplary embodiment, the method further includes steps S601 to S603.

[0085] Step S601, based on the matching degree between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, structural mapping is performed between the matching packaging levels and the target packaging levels to obtain an initial structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model.

[0086] Exemplarily, when constructing a packaging simulation model, each target packaging level of the packaging simulation model is constructed in advance according to each packaging level of the packaging structure to be tested, so that the packaging simulation model has structural characteristics consistent with the actual packaging structure to be tested, thereby performing a preliminary mapping of the packaging levels with matching structural characteristics with the target packaging levels, and obtaining an initial structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model.

[0087] Step S602 , based on the physical field characteristics and material property characteristics of each packaging level of the package structure to be tested, the initial structure mapping relationship corresponding to each packaging level is corrected in a single level dimension to obtain a first structure mapping relationship corresponding to each packaging level.

[0088] Among them, the physical field characteristics represent the response characteristics of the packaging layer under the action of different physical fields, including thermal, mechanical, electrical and other response characteristics; the material property characteristics represent the inherent characteristics of the constituent materials of the packaging layer under the action of different physical fields, including thermal, mechanical, electrical and other material parameters, such as thermal conductivity, mechanical strength, dielectric constant, etc.

[0089] Exemplarily, after the initial structural mapping relationship is established, the initial structural mapping relationship between the packaging level and the target packaging level is corrected in combination with the material property characteristics such as thermal conductivity, mechanical strength, dielectric constant, etc. of each packaging level and the physical field characteristics corresponding to each material data characteristic, so as to make it more accurate in the physical field simulation calculation process. For example: in a thermal simulation test, if the thermal conductivity of the material of a certain packaging level to be tested is much higher than that of the corresponding target packaging level, it is necessary to introduce a correction factor in the initial structural mapping relationship to correct the numerical mapping ratio of the corresponding physical field characteristics and material property characteristics between the packaging level to be tested and the target packaging level, so as to obtain a first structural mapping relationship, so that the heat transfer path of the target packaging level is more in line with the actual situation; in a mechanical simulation test, if there is a large difference between the mechanical properties of a certain packaging level to be tested and the corresponding target packaging level, it is necessary to introduce a correction factor in the initial structural mapping relationship to correct the numerical mapping ratio of the corresponding physical field characteristics and material property characteristics between the packaging level to be tested and the target packaging level, so as to obtain a first structural mapping relationship, so that the target packaging level can accurately reflect the influence of material properties in stress calculation.

[0090] Step S603, based on the inter-layer connection characteristics of each packaging level, the first structure mapping relationship corresponding to each packaging level is corrected in terms of the overall hierarchical dimension to obtain the second structure mapping relationship corresponding to each packaging level, and the second structure mapping relationship is used as the structure mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model.

[0091] Among them, the interlayer connection characteristics represent the physical connection mode between the packaging levels, including the layer coupling relationship in terms of thermal, mechanical, electrical and other aspects, such as the interface characteristics of solder balls, adhesive layers, metal interconnects, etc.

[0092] Exemplarily, after the first structural mapping relationship is corrected, the first structural mapping relationship between the packaging level and the target packaging level is further corrected in combination with the interlayer connection characteristics between each packaging level to eliminate the influence of the complex interlayer coupling relationship on the simulation test. For example: in the thermal simulation test, the solder ball area in the interconnect layer connects the chip layer and the substrate layer to form the main heat conduction path. It is necessary to introduce a correction factor in the first structural mapping relationship to correct the numerical mapping ratio of the corresponding interlayer connection characteristics between the above-mentioned packaging level to be tested and the target packaging level to obtain a second structural mapping relationship, thereby ensuring that the thermal conductivity of the real packaging structure can be correctly reflected in each target packaging level of the packaging simulation model; in the mechanical simulation test, the interface stress between the packaging levels is closely related to the material bonding strength. It is necessary to introduce a correction factor in the first structural mapping relationship to correct the numerical mapping ratio of the corresponding interlayer connection characteristics between the packaging level to be tested and the target packaging level to obtain a second structural mapping relationship, thereby ensuring that the stress transfer path of the real packaging structure can be correctly reflected in each target packaging level of the packaging simulation model.

[0093] In this embodiment, first, based on the matching degree between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, the packaging levels and the target packaging levels are preliminarily mapped, so as to efficiently form an initial structural mapping relationship at the structural level; secondly, based on the physical field characteristics and material property characteristics of each packaging level, each initial structural mapping relationship is efficiently corrected in a single level dimension to obtain a first structural mapping relationship; further, based on the interlayer connection characteristics of each packaging level, each first structural mapping relationship is efficiently corrected in the overall level dimension to accurately obtain the final structural mapping relationship between each packaging level and each target packaging level, based on which, the structural mapping relationship corresponding to all packaging levels can reflect both the characteristics of a single packaging level and the connection relationship between packaging levels.

[0094] In an exemplary embodiment, according to the association between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the packaging structure to be tested, a simulation test result corresponding to the packaging structure to be tested is generated, including steps S701 to S703.

[0095] Step S701 , according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the package structure to be tested, the response data respectively associated with each packaging level are determined in each response data set.

[0096] Exemplarily, since a multi-physics field simulation test will output response data sets of multiple physical fields, each response data set contains response information of multiple packaging levels under the action of a specific physical field. Therefore, it is necessary to determine the response data associated with each packaging level in each response data set. For example, in a thermal simulation test, the response data set corresponding to the thermal boundary conditions includes response data such as temperature distribution, heat flux density, thermal resistance, etc. corresponding to multiple packaging levels. According to the association between the response data set corresponding to the thermal boundary conditions and the packaging level, that is, according to the packaging level simulated by the corresponding physical field in the thermal simulation test, the specific packaging level associated with each response data in the response data set is determined to determine which response data belongs to the chip layer, interconnect layer, packaging substrate layer or packaging shell layer.

[0097] Step S702, according to the characteristic timing relationship between the physical field characteristics of each packaging level and the associated response data, the physical response characteristics corresponding to each response data are extracted from each response data. The physical field characteristics of each packaging level and the physical response characteristics in the associated response data are characteristic information having a characteristic timing relationship.

[0098] Among them, the physical field characteristics of the packaging level represent the response characteristics of the packaging level under the action of different physical fields; and the physical response characteristics of the response data represent the key feature information extracted from the response data, which can reflect the dynamic change law of the associated packaging level under the action of different physical fields.

[0099] Exemplarily, since the response data of each packaging level of the packaging structure to be tested under the action of multiple physical fields usually changes in a time series, it means that there is a specific time dependence between the physical field characteristics of different packaging levels and the response data. Therefore, the physical response characteristics can be extracted from each response data according to the characteristic time series relationship between the physical field characteristics of each packaging level and the associated response data. For example: in mechanical simulation, the stress and deformation of the packaging level under temperature cycle or mechanical load usually change nonlinearly. Based on the characteristic time series relationship between the above-mentioned physical field characteristics of the packaging level and the corresponding response data, the peak stress, stress distribution gradient and deformation change with time are extracted from the corresponding response data to obtain the key characteristic information that can reflect the dynamic change law of the packaging level under the action of the corresponding physical field.

[0100] Step S703, based on the physical response characteristics corresponding to each response data, a physical field characteristic data set corresponding to each packaging level of the package structure to be tested is obtained, and the physical field characteristic data set is used as a simulation test result corresponding to the package structure to be tested.

[0101] Among them, the physical field characteristic data set represents a unified data set formed after the physical response characteristics are normalized, integrated, and statistically analyzed, which is used to characterize the comprehensive characteristics of the entire package structure to be tested under the action of multiple physical fields.

[0102] Exemplarily, since multi-physics field simulation involves different physical response characteristics corresponding to multiple packaging levels, in the process of generating the final simulation test results, it is necessary to uniformly process the physical response characteristics of different packaging levels to form a complete physical field feature data set, for example: in thermal simulation testing, it is necessary to combine the physical response characteristics such as steady-state temperature, heat flow path, thermal resistance calculation results, etc. corresponding to each packaging level expressed at the feature level in order to evaluate the overall heat dissipation performance; in mechanical simulation testing, it is necessary to combine the physical response characteristics such as stress distribution, thermal expansion deformation, etc. corresponding to each packaging level expressed at the feature level in order to evaluate the overall mechanical performance; in electrical simulation testing, it is necessary to combine the physical response characteristics such as signal integrity, power integrity and electromagnetic interference, etc. corresponding to each packaging level expressed at the feature level in order to evaluate the overall electrical performance. Furthermore, the above-mentioned combined physical response characteristics are further integrated to obtain a unified physical field feature data set corresponding to each packaging level under the action of different physical fields, so as to express the simulation test results at the feature level.

[0103] In the present embodiment, firstly, according to the correlation relationship between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the packaging structure to be tested, the response data respectively associated with each packaging level is determined, thereby ensuring that the output data of the simulation calculation can be accurately mapped to the specific packaging level, thereby improving the accuracy of data attribution; secondly, according to the characteristic timing relationship between the physical field characteristics of each packaging level and the associated response data, the physical response characteristics corresponding to the response data are extracted to reflect the dynamic characteristics that change over time, thereby improving the integrity and validity of the simulation data; furthermore, based on the physical response characteristics corresponding to each response data set, the physical field characteristic data set uniformly corresponding to each packaging level of the packaging structure to be tested is obtained, thereby expressing the simulation test results at the characteristic level, thereby improving the precision and analyzability of the simulation test results.

[0104] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0105] Based on the same inventive concept, the embodiment of the present application also provides a simulation test system for advanced packaging design for implementing the simulation test method for advanced packaging design involved above. The implementation scheme for solving the problem provided by the system is similar to the implementation scheme recorded in the above method, so the specific limitations in the simulation test system embodiments of one or more advanced packaging designs provided below can refer to the limitations of the simulation test method for advanced packaging design above, and will not be repeated here.

[0106] In an exemplary embodiment, Figure 2 As shown, a simulation test system for advanced packaging design is provided, including: an acquisition module 201, a test module 202 and a generation module 203, wherein:

[0107] An acquisition module 201 is used to acquire a three-dimensional geometric model of a package structure to be tested, and to perform multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested, so as to obtain a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on an advanced package design;

[0108] The test module 202 is used to perform multi-physical field simulation test processing on the package simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions, where the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions, and electrical boundary conditions;

[0109] The generating module 203 is used to generate a simulation test result corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package levels of the package structure to be tested.

[0110] In an exemplary embodiment, the acquisition module 201 is also used to: obtain the geometric features of each packaging level of the packaging structure to be tested, perform multi-level meshing processing on the three-dimensional geometric model based on the geometric features of each packaging level, and obtain network units corresponding to each packaging level; perform data coupling processing on the network units corresponding to each packaging level, and obtain a packaging simulation model corresponding to the packaging structure to be tested.

[0111] In an exemplary embodiment, the test module 202 is also used to: obtain test data sets corresponding to each physical field simulation boundary condition based on the target physical field environment of the package structure to be tested; perform data conversion processing on each test data set based on the statistical characteristics of each test data set to obtain input data sets corresponding to each physical field simulation boundary condition; input each input data set into the package simulation model for multi-physical field simulation test processing to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions.

[0112] In an exemplary embodiment, the test module 202 is also used to: obtain temperature measurement data corresponding to the thermal boundary conditions based on the thermal distribution conditions in the target physical field environment, and use the temperature measurement data as a test data set corresponding to the thermal boundary conditions; obtain stress measurement data corresponding to the mechanical boundary conditions based on the mechanical stress distribution conditions in the target physical field environment, and use the stress measurement data as a test data set corresponding to the mechanical boundary conditions; obtain electrical measurement data corresponding to the electrical boundary conditions based on the electromagnetic field distribution conditions in the target physical field environment, and use the electrical measurement data as a test data set corresponding to the electrical boundary conditions.

[0113] In an exemplary embodiment, the test module 202 is also used to: determine the target packaging levels that are matched by each physical field simulation boundary condition based on the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model; obtain the simulation calculation domain of each target packaging level, and perform boundary adaptation processing on the simulation calculation domain of the matched target packaging level through each physical field simulation boundary condition to obtain the target simulation calculation domain corresponding to each target packaging level; input each input data set into the target simulation calculation domain corresponding to the matched target packaging level in the packaging simulation model for multi-physical field simulation test processing to obtain the response data sets output by each target packaging level of the packaging simulation model according to the matched input data set, and each target packaging level is matched to at least one input data set.

[0114] In an exemplary embodiment, the test module 202 is also used to: based on the matching degree between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, structurally map the matched packaging levels with the target packaging levels to obtain the initial structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model; based on the physical field characteristics and material property characteristics of each packaging level of the packaging structure to be tested, perform single-level dimension correction on the initial structural mapping relationship corresponding to each packaging level to obtain the first structural mapping relationship corresponding to each packaging level; based on the inter-layer connection characteristics of each packaging level, perform overall-level dimension correction on the first structural mapping relationship corresponding to each packaging level to obtain the second structural mapping relationship corresponding to each packaging level, and use the second structural mapping relationship as the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model.

[0115] In an exemplary embodiment, the generation module 203 is also used to: determine the response data associated with each packaging level in each response data set according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the packaging structure to be tested; extract the physical response features corresponding to each response data from each response data according to the characteristic timing relationship between the physical field characteristics of each packaging level and the associated response data, and the physical response features in the physical field characteristics of each packaging level and the associated response data are feature information with a characteristic timing relationship; based on the physical response features corresponding to each response data, obtain the physical field feature data set uniformly corresponding to each packaging level of the packaging structure to be tested, and use the physical field feature data set as the simulation test result corresponding to the packaging structure to be tested.

[0116] Each module in the simulation test system of the advanced packaging design can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to each module.

[0117] In an exemplary embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in any of the above embodiments when executing the computer program.

[0118] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in any of the above embodiments are implemented.

[0119] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0120] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A simulation test method for advanced packaging design, characterized in that: The method comprises: Acquire a three-dimensional geometric model of a package structure to be tested, perform multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested, and obtain a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on an advanced package design; Performing multi-physical field simulation test processing on the package simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions, wherein the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions, and electrical boundary conditions; Generate a simulation test result corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package level of the package structure to be tested; The multi-physical field simulation test processing is performed on the package simulation model under the preset physical field simulation boundary conditions to obtain the response data sets output by the package simulation model according to different physical field simulation boundary conditions, including: Based on the target physical field environment of the package structure to be tested, the test data sets corresponding to the respective physical field simulation boundary conditions are obtained; based on the statistical characteristics of each test data set, each test data set is subjected to data conversion processing to obtain input data sets corresponding to the respective physical field simulation boundary conditions; each input data set is input into the package simulation model for multi-physical field simulation test processing to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions; The step of inputting each input data set into the package simulation model for multi-physical field simulation test processing to obtain response data sets outputted by the package simulation model according to different physical field simulation boundary conditions includes: Based on the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, determine the target packaging levels that are matched by each physical field simulation boundary condition; obtain the simulation calculation domain of each target packaging level, and perform boundary adaptation processing on the simulation calculation domain of the matched target packaging level through each physical field simulation boundary condition to obtain the target simulation calculation domain corresponding to each target packaging level; input each input data set into the target simulation calculation domain corresponding to the matched target packaging level in the packaging simulation model for multi-physical field simulation test processing to obtain the response data set output by each target packaging level of the packaging simulation model according to the matched input data set, and each target packaging level is matched to at least one input data set.

2. The method according to claim 1, characterized in that The performing multi-level meshing processing on the three-dimensional geometric model based on the packaging level of the package structure to be tested to obtain a packaging simulation model corresponding to the package structure to be tested includes: Acquire geometric features of each packaging level of the packaging structure to be tested, perform multi-level meshing processing on the three-dimensional geometric model based on the geometric features of each packaging level, and obtain network units corresponding to each packaging level; Data coupling processing is performed on the network units corresponding to each packaging level to obtain a packaging simulation model corresponding to the packaging structure to be tested.

3. The method according to claim 1, characterized in that The step of obtaining test data sets corresponding to respective physical field simulation boundary conditions based on the target physical field environment of the package structure to be tested includes: Based on the heat distribution condition in the target physical field environment, obtaining temperature measurement data corresponding to the thermal boundary condition, and using the temperature measurement data as a test data set corresponding to the thermal boundary condition; Based on the mechanical stress distribution in the target physical field environment, obtaining stress measurement data corresponding to the mechanical boundary condition, and using the stress measurement data as a test data set corresponding to the mechanical boundary condition; Based on the electromagnetic field distribution status in the target physical field environment, electrical measurement data corresponding to the electrical boundary condition is acquired, and the electrical measurement data is used as a test data set corresponding to the electrical boundary condition.

4. The method according to claim 1, characterized in that: The method further comprises: Based on the matching degree between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model, structural mapping is performed between the matched packaging level and the target packaging level to obtain an initial structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model; Based on the physical field characteristics and material property characteristics of each packaging level of the package structure to be tested, the initial structure mapping relationship corresponding to each packaging level is corrected in a single-level dimension to obtain a first structure mapping relationship corresponding to each packaging level; Based on the inter-layer connection characteristics of each packaging level, the first structural mapping relationship corresponding to each packaging level is corrected in the overall hierarchical dimension to obtain the second structural mapping relationship corresponding to each packaging level, and the second structural mapping relationship is used as the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model.

5. The method according to claim 1, characterized in that The generating of the simulation test result corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package levels of the package structure to be tested comprises: According to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the packaging levels of the packaging structure to be tested, determining the response data associated with each packaging level in each response data set; According to the characteristic time series relationship between the physical field characteristics of each packaging level and the associated response data, the physical response characteristics corresponding to each response data are extracted from each response data, and the physical field characteristics of each packaging level and the physical response characteristics in the associated response data are characteristic information having a characteristic time series relationship; Based on the physical response characteristics corresponding to each response data, a physical field characteristic data set uniformly corresponding to each packaging level of the package structure to be tested is obtained, and the physical field characteristic data set is used as the simulation test result corresponding to the package structure to be tested.

6. A simulation test system for advanced packaging design, characterized in that: The system comprises: An acquisition module is used to acquire a three-dimensional geometric model of a package structure to be tested, and to perform multi-level meshing processing on the three-dimensional geometric model based on the package level of the package structure to be tested to obtain a package simulation model corresponding to the package structure to be tested, wherein the package structure to be tested is a device structure obtained based on an advanced package design; A test module, used to perform multi-physical field simulation test processing on the package simulation model under preset physical field simulation boundary conditions to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions, wherein the physical field simulation boundary conditions include thermal boundary conditions, mechanical boundary conditions and electrical boundary conditions; A generating module, used for generating a simulation test result corresponding to the package structure to be tested according to the association relationship between the response data sets corresponding to different physical field simulation boundary conditions and the package levels of the package structure to be tested; The test module is also used to: obtain test data sets corresponding to each physical field simulation boundary condition based on the target physical field environment of the package structure to be tested; perform data conversion processing on each test data set based on the statistical characteristics of each test data set to obtain input data sets corresponding to each physical field simulation boundary condition; input each input data set into the package simulation model for multi-physical field simulation test processing to obtain response data sets output by the package simulation model according to different physical field simulation boundary conditions; The test module is also used to: determine the target packaging levels that are matched by each physical field simulation boundary condition based on the structural mapping relationship between each packaging level of the packaging structure to be tested and each target packaging level of the packaging simulation model; obtain the simulation calculation domain of each target packaging level, and perform boundary adaptation processing on the simulation calculation domain of the matched target packaging level through each physical field simulation boundary condition to obtain the target simulation calculation domain corresponding to each target packaging level; input each input data set into the target simulation calculation domain corresponding to the matched target packaging level in the packaging simulation model for multi-physical field simulation test processing to obtain the response data sets output by each target packaging level of the packaging simulation model according to the matched input data set, and each target packaging level is matched to at least one input data set.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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