Chip unloading device and unloading method thereof

Abstract

The application provides a chip feeding and discharging device and a feeding and discharging method thereof. A vision system arranged in a preset space is used to cover the working plane of a stacking module in the visual range, so as to transmit the visual information of the chips on the stacking module to a control unit for processing. The running stroke of a taking system covers the respective corresponding areas of the stacking module and the bonding module. The control unit is used to control the taking system to take the chips between the stacking module and the bonding module according to the visual information, so as to complete the corresponding processes respectively. The vision system is used to pre-align the chips. The vision system, the stacking system and the bonding system are associated with the whole machine coordinates in the preset space through the mechanical arm of the taking system. Real-time monitoring is realized. The loading is fast, the positioning accuracy is improved, and high-precision and high-yield chip transfer is realized. Meanwhile, the transfer of chips of different specifications can also be realized, which is not limited to specific specifications and has high applicability.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to chip loading and unloading devices and methods. Background Technology

[0002] With the development of high integration and high performance in semiconductors, bonding technology can interconnect chips with different process points at high density, enabling system-level integration with smaller size, higher performance and lower power consumption.

[0003] However, existing chip transfer technologies only target the gripping of chips of specific shapes and sizes, and cannot transfer chips to different positions during the transfer process. The chip positioning accuracy is relatively low, and the chip loading cannot be monitored in real time.

[0004] Therefore, a new solution for chip loading and unloading is needed. Summary of the Invention

[0005] In view of this, embodiments of this specification provide a chip loading / unloading device and a chip loading / unloading method thereof.

[0006] The embodiments in this specification provide the following technical solutions:

[0007] This specification provides an embodiment of a chip loading and unloading device, comprising:

[0008] A vision system, a material handling system, a material stacking module, a bonding module, and a control unit are respectively set up in the preset space;

[0009] The vision system is used to cover the working plane of the stacking module with its vision range in order to transmit the visual information of the chips on the stacking module to the control unit for processing;

[0010] The operating stroke of the material handling system covers the corresponding areas of the stacking module and the bonding module, respectively.

[0011] The control unit is used to control the material handling system to pick up and remove chips between the stacking module and the bonding module based on the visual information, so as to complete the corresponding processes respectively;

[0012] Prior to bonding, the chip is placed in the stacking module, and the vision system is used to capture the first position of the chip in the storage compartment so as to obtain the coordinates corresponding to the first position through the control unit.

[0013] The material handling system includes a robotic arm.

[0014] The material handling system is used to receive the coordinates of the first position, which are converted into the second position coordinates of the robot arm by the control unit, and to control the robot arm to pick up the chip and place it into the bonding module; wherein, the vision system, the stacking system and the bonding system are correlated in the whole machine coordinates in a preset space through the robot arm of the material handling system;

[0015] After bonding is completed, the robotic arm picks up the bonded chip from the bonding area and moves it to the stacking area;

[0016] The robotic arm sequentially grasps the first chip and the second chip, and places the first chip and the second chip in preset positions in the bonding area, with the outer contours of the first chip and the second chip aligned accordingly.

[0017] This specification also provides a chip loading / unloading method, using the chip loading / unloading device described in the above technical solution, the chip loading / unloading method comprising:

[0018] Before bonding, the chip is placed in the stacking module, and the vision system is used to capture the first position of the chip in the storage compartment so that the coordinates corresponding to the first position can be obtained through the control unit.

[0019] The material handling system receives the coordinates of the first position, which are converted into the second position coordinates of the robot arm by the control unit, and controls the robot arm to pick up the chip and place it into the bonding module; the vision system, the stacking system and the bonding system are interconnected in a preset space through the robot arm of the material handling system.

[0020] After bonding is completed, the robotic arm picks up the bonded chip from the bonding area and moves it to the stacking area;

[0021] The robotic arm sequentially grasps the first chip and the second chip, and places the first chip and the second chip in preset positions in the bonding area, with the outer contours of the first chip and the second chip aligned accordingly.

[0022] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0023] This specification's embodiments utilize a vision system to pre-align the chips before bonding, and employ a material handling system to achieve fully automated chip loading and unloading throughout the process. The chips are picked up and dropped between the material stacking module and the bonding module to complete the bonding process. Real-time monitoring is achieved, resulting in not only faster loading but also improved positioning accuracy, thus enabling high-precision, high-volume chip transfer. Furthermore, it can handle the transfer of chips of different specifications, not being limited to a specific size, and has high applicability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the chip loading and unloading device provided in the embodiments of this specification;

[0026] Figure 2 This is a schematic diagram of the structure of the vision system provided in the embodiments of this specification;

[0027] Figure 3 This is a schematic diagram of the material handling system provided in the embodiments of this specification;

[0028] Figure 4 This is a schematic diagram of the gripper provided in the embodiments of this specification;

[0029] Figure 5 This is a schematic diagram of the stacking module provided in the embodiments of this specification.

[0030] Among them, 1. Vision system, 11. Pre-alignment vision, 12. Precision alignment vision, 13. First fixed frame, 14. Second fixed frame, 2. Material handling system, 21. Base, 22. Four-axis robot, 23. Connecting frame, 24. Fixing ring, 25. Hollow motor, 26. Gripper, 261. Fixed seat, 262. Rotary joint, 263. Stud sleeve, 264. Suction nozzle, 3. Material stacking module, 31. Fixed column, 32. Limiting plate, 33. Storage box, 34. Pallet, 35. Limiting block, 4. Bonding module, 5. Workbench, 6. Pneumatic control unit. Detailed Implementation

[0031] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0032] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0034] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0036] The lack of a chip transfer device in the existing bonding process leads to the time-consuming and complex chip transfer process before bonding, resulting in low bonding accuracy and low bonding efficiency.

[0037] Existing chip transfer methods can only pick up and transfer chips of specific shapes and sizes, and cannot transfer chips at different positions during the transfer process. The relatively low chip positioning accuracy makes it unsuitable for chip transfer in bonding processes.

[0038] Based on this, the embodiments of this specification propose a new chip loading and unloading scheme: the vision range of the vision system is set to cover the working plane of the stacking module, the vision system is used to pre-align the chips on the stacking module, and the vision system, stacking module and bonding module are integrated into the whole machine through a pick-up system. The pick-up system realizes fully automated chip loading and unloading, that is, picking up and unloading chips between the stacking module and the bonding module to complete the bonding process. This realizes a highly efficient chip loading and unloading device.

[0039] The technical solutions provided by various embodiments of this application are described below with reference to the accompanying drawings. For example... Figure 1As shown in the embodiments of this specification, a chip loading and unloading device includes a vision system 1, a picking system 2, a stacking module 3, a bonding module 4, and a control unit (such as a pneumatic control unit 6). The control unit includes, but is not limited to, mechanical control, pneumatic control, electric control, and vacuum suction cup control. This specification uses a pneumatic control unit as an example for illustration.

[0040] A vision system 1, a material handling system 2, a material stacking module 3, a bonding module 4, and a control unit (such as a pneumatic control unit 6) are respectively set up in the chip manufacturing preset space.

[0041] The vision system 1 is used to cover the working plane of the stacking module 3 with its vision range, that is, to transmit the visual information of the chip on the stacking module 3 to the control unit for processing; the running stroke of the picking system 2 covers the corresponding areas of the stacking module 3 and the bonding module 4 respectively; the control unit is used to control the picking system 2 to pick up the chip between the stacking module 3 and the bonding module 4 according to the visual information, so as to complete the corresponding process respectively.

[0042] Specifically, before bonding, the chip is placed in the stacking module, and the vision system is used to capture the first position of the chip so as to obtain the coordinates corresponding to the first position through the control unit;

[0043] The material handling system includes a robotic arm. This system receives the first position coordinates, which are then converted into the robotic arm's second position coordinates by the control unit. The robotic arm then controls the robotic arm to pick up the chip and place it onto the bonding module based on these second position coordinates. By associating the coordinates of all modules and systems within the pre-defined space, the vision system pre-positions the chip before bonding, enabling fully automated chip loading from the stacking module to the bonding module. After bonding, the robotic arm, based on the fixed position within the bonding area, unloads the bonded chip from the bonding area to the stacking area, thus achieving a fully automated chip loading and unloading process.

[0044] It should be noted that the embodiments in this specification rationally arrange the vision system, material handling system, material stacking module, bonding module and control unit in a preset space, and use the robotic arm in the material handling system to associate the whole machine composed of the above modules / systems, thereby realizing the automatic loading and unloading of chips throughout the entire process.

[0045] The vision system can pre-determine the chip's gripping position, thus providing a basis for the robot arm's precise positioning. The vision system can not only pre-position chips on the stacking module, but also obtain relevant information such as chip type, thereby enabling the bonding of various chip types.

[0046] In some embodiments, the vision system is disposed above the stacking module, the optical axis of the camera in the vision system is located at the center of the stacking module, and the minimum distance from the camera to the stacking module is the working distance of the camera; the stacking module and the bonding module are disposed adjacent to each other; one side of the material handling system faces the same side of the stacking module and the bonding module, and the running stroke of the material handling system covers the areas corresponding to the stacking module and the bonding module respectively; a control unit is disposed on the other side of the material handling system.

[0047] The vision system 1 is positioned above the stacking module 3. The optical axis of the camera in the vision system 1 is located at the center of the stacking module 3, and the minimum distance from the camera to the stacking module 3 is the working distance of the camera, so that the visual range of the vision system 1 covers the working plane of the stacking module 3.

[0048] The stacking module 3 and the bonding module 4 are arranged adjacent to each other;

[0049] One side of the material handling system 2 faces the same side of the stacking module 3 and the bonding module 4, and the running stroke of the material handling system 2 covers the areas corresponding to the stacking module 3 and the bonding module 4 respectively.

[0050] The material handling system includes a robotic arm for picking up materials; a control unit is located on the other side of the material handling system.

[0051] The control unit 2 is used to control the material handling system to pick up chips between the stacking module and the bonding module based on the visual information transmitted from the vision system. For example, it controls the robot arm to pick up chips between the stacking module 3 and the bonding module 4 to complete the corresponding processes respectively.

[0052] Before bonding, the chip is placed in the storage compartment on the stacking module 3. The vision system 1 is used to capture the first position of the chip in the storage compartment so as to obtain the coordinates corresponding to the first position through the control unit.

[0053] The material handling system 2 is used to receive the coordinates corresponding to the first position, which are converted into the second position coordinates of the robot arm by the control unit. After the robot arm picks up the chip according to the second position coordinates, it returns to the waiting area. The material handling system 2 establishes a coordinate relationship between the entire machine consisting of the vision system 1, the stacking module, the bonding system, and the material handling system. That is, by converting the coordinates of each of the above modules / systems, the coordinates of the chip positioning can be converted into the position coordinates of the robot arm picking up the chip.

[0054] After bonding is completed, the robotic arm picks up the bonded chip from the bonding area and moves it to the stacking area;

[0055] The robotic arm sequentially grasps the first chip and the second chip, and places the first chip and the second chip in preset positions in the bonding area, with the outer contours of the first chip and the second chip aligned accordingly.

[0056] The embodiments in this specification achieve real-time monitoring, resulting in faster loading and improved positioning accuracy, thereby enabling high-precision and high-volume chip transfer. Furthermore, the chip loading and unloading device in these embodiments can transfer chips of different specifications, and is not limited to specific specifications, thus possessing high applicability.

[0057] In some embodiments, such as Figure 2 As shown, the vision system 1 includes a pre-alignment vision 11 and a fine alignment vision 12. The pre-alignment vision 11 and the fine alignment vision 12 are fixed by a first fixing bracket 13 and a second fixing bracket 14, respectively; the viewing window of the pre-alignment vision 11 is 5120mm × 5120mm; the viewing window of the fine alignment vision 12 is 50mm × 50mm.

[0058] The pre-alignment vision 11 includes a first camera and a first lens; the fine alignment vision includes a second camera and a second lens; wherein, the optical axis of the first camera is located at the center of the stacking module, and the minimum distance from the first camera to the stacking module is the working distance of the first camera; after the robot arm grasps the chip, the chip is moved from the visual range of the first lens to the visual range of the second lens, and the actual position of the chip is recalibrated to convert the first position coordinate of the chip into the second position coordinate of the robot arm, so that the robot arm can pick up the chip from the stacking module to the bonding module according to the second position coordinate.

[0059] The first mounting bracket is used to fix the first camera and the first lens, and the positions of the first camera and the first lens on the first mounting bracket are adjustable. That is, the pre-alignment vision uses a large field of view, such as 5120mm × 5120mm, and a large working distance camera to complete coarse positioning, which can meet the positioning needs of multiple chip groups. The fine alignment vision includes a second camera and a second lens, the viewing window of the second lens being 50mm × 50mm. The second mounting bracket fixes the second camera and the second lens, and the positions of the second camera and the second lens on the second mounting bracket are adjustable to accommodate different working distance adjustments. That is, the pre-alignment vision and the fine alignment vision are respectively adjusted and fixed on their respective mounting brackets to obtain the working distance and achieve the best visual effect.

[0060] Employing a high-precision dual-camera positioning system, the system first determines the gripping position and then precisely positions the chip. Combined with a high-precision four-axis robot, this improves both wafer loading and bonding accuracy. Specifically, after the robotic arm grasps the chip, it moves the chip within the viewing area of ​​the second camera and lens, recalibrating the chip's actual position and converting it to the robotic arm's relative coordinates, effectively improving loading accuracy. An ultra-wide working field of view, combined with network transmission technology, allows for real-time monitoring of the chip loading status.

[0061] In some embodiments, such as Figure 3As shown, the material handling system 2 also includes at least one four-axis robot 22. Each four-axis robot 22 includes four degrees of freedom (X / Y / Z / RZ) and a maximum working radius of 400mm. Utilizing the high precision, high speed, and high stability of the four-axis robot, and employing a large-stroke four-axis robot, it is possible to transfer the chip across regions, such as between the stacking module and the bonding module.

[0062] The four-axis robot is fixed to the base 21, which has high rigidity; a connecting frame 23 is provided on the four-axis robot, and the connecting frame 23 is fixed to the end of the Z-axis of the four-axis robot by a fixing ring 24;

[0063] The robotic arm includes a hollow motor 25 and a gripper 26; the hollow motor is fixed to the flange surface of the connecting frame by screws, the end of the hollow central shaft of the hollow motor 25 is threaded, and the gripper 26 is connected to the hollow motor 25 by threads.

[0064] The hollow motor 25 includes a closed-loop encoder to control the gripper 26 to pick up the chip, complete the cyclic process of the chip from the stacking module 3 to the bonding module 4 and from the bonding module 4 back to the stacking module 3, and complete the picking and placing of each group of chips.

[0065] In some embodiments, such as Figure 3 and Figure 4 As shown, the gripper 26 is symmetrically equipped with two sets of suction nozzles, such as an upper suction nozzle and a lower suction nozzle. The heights of the planes where the upper and lower suction nozzles are located are symmetrical with respect to the plane where the hollow motor axis is located, thereby improving the stability during the gripping process.

[0066] This specification describes an embodiment that utilizes a high-precision, high-speed four-axis robot combined with a rapid gripping system to achieve fast and stable chip gripping and transfer. It employs upper and lower suction nozzles to grip two types of chips, such as A and B, simultaneously feeding them to reduce chip transfer time and further improve efficiency.

[0067] The nozzle is made of relatively soft silicone material, which can be used at temperatures up to 250°C to avoid damage to the chip during the suction process.

[0068] In some embodiments, such as Figure 4 As shown, the gripper 26 includes a fixed base 261, a rotary joint 262, a stud sleeve 263, and a suction nozzle 264.

[0069] The mounting base has a three-sided structure, including an upper side, a lower side, and a front side; the front side is provided with a threaded hole corresponding to the thread of the hollow motor. The mounting base 261 has a three-sided cuboid structure with a threaded hole on the front side for threaded connection with the hollow motor 25, and a tightening screw is added to the outside of the mounting base. Figure 4 As shown in the example, the three-sided structure includes a three-sided cuboid structure. The structure and shape of the fixing base 261 can be specifically set according to the actual situation.

[0070] The upper and lower sides of the fixing base 261 are respectively provided with coaxial threaded holes so as to embed the stud sleeve 263 into at least one side of the upper and lower sides of the fixing base 261; for example, the stud sleeve 263 is embedded in the fixing base 261.

[0071] The rotary joint 262 and the suction nozzle 264 are respectively threaded to both sides of the stud sleeve 263. The rotary joint 262 and the suction nozzle 264 can be divided into upper and lower groups, and the installation method is the same as above. Specifically, one end of the rotary joint 262 is fixed to the front of the fixing base by threads, and the other end of the rotary joint 262 is threaded to the first end of the stud sleeve 263.

[0072] The second end of the stud sleeve 263 is connected to the suction nozzle 26 by a thread.

[0073] The 264 suction nozzle uses a small suction nozzle and, through precise adjustment of the control system, can pick up chips of different specifications and models.

[0074] To complement the vision system and improve the accuracy of chip grasping and positioning, some embodiments, such as Figure 5 As shown, the stacking module 3 includes a limiting plate 32, a storage frame 33, and a pallet 34;

[0075] The limiting plate 32 is fixed to the fixing column 31, and the fixing column 31 is fixed to the worktable by the base plate;

[0076] The limiting plate 32 includes two limiting blocks 35 placed opposite each other;

[0077] The storage box 33 is placed flat on the limiting plate 32 via the limiting block 35;

[0078] The storage frame 33 has four slots, and the tray 34 is evenly placed in the four slots of the storage frame. The tray 34 and the storage frame 33 are positioned by corner limiters to cooperate with the vision system to perform preliminary positioning of the chip.

[0079] The embodiment of this manual features a multi-slot, quick-loading chip storage module, which enables rapid loading and further improves productivity.

[0080] In some embodiments, a precision-adjustable pneumatic control unit is provided to improve the suction nozzle's ability to grasp chips of different specifications and models, such as controlling a small suction nozzle. Figure 1 In this configuration, the control unit is pneumatic control unit 6.

[0081] The pneumatic control unit 6 is used to control the suction nozzle 264 corresponding to the gripper 26 of the robotic arm. The air tube (not shown) of the pneumatic control unit is connected to the interface of the rotary joint 262 corresponding to the gripper after passing through the internal air tube of the four-axis robot 22, through the hollow shaft of the hollow motor 25 corresponding to the robotic arm.

[0082] Each pneumatic control unit includes a solenoid valve, a pressure reducing valve, a vacuum generator, a flow switch, and a gas tubing.

[0083] In some embodiments, to improve productivity, the pneumatic control unit 6 is divided into two pneumatic control units, which are used to control two sets of symmetrically arranged nozzles respectively.

[0084] The pneumatic control unit 6 is divided into two pneumatic control units, which control the upper and lower suction nozzles of the gripper 26 respectively, connected by an air pipe. The air pipe exits the pneumatic control unit, enters the internal air pipe of the four-axis robot 22, passes through the hollow shaft of the hollow motor 25, and connects to the interfaces of the upper / lower rotary joints 262 respectively. Each pneumatic control unit includes a solenoid valve, a pressure reducing valve, a vacuum generator, and a flow switch, all connected by an air pipe. A high-precision pneumatic control unit is used, employing a high-temperature resistant, soft, small suction nozzle to avoid structural damage to the chips. Separate control routes prevent interference with the position of other chips during the gripping process.

[0085] The 264 nozzle uses a small suction method and can pick up chips of different specifications and models through a precision-adjustable air control system.

[0086] In some embodiments, such as Figure 1 As shown, the vision system 1 is fixed to the column of the workbench 5 via an adapter plate, and the material handling system 2, the material stacking module 3, the bonding module 4 and the control unit (such as the pneumatic control unit 6) are respectively installed on the tabletop of the workbench 5 via corresponding base plate support frames.

[0087] Specifically, the vision system 1 is fixed to the column of the workbench 5 via an adapter plate. The material handling system 2, the material stacking module 3, the bonding module 4, the workbench 5, and the pneumatic control unit 6 are all mounted on the tabletop of the workbench 5 via corresponding base plate support frames.

[0088] The vision system 1 needs to completely cover the stacking module 3 within its field of vision, and the movement stroke of the material handling system 2 needs to completely cover the area where the stacking module 3 and the bonding module 4 are located. The pneumatic control unit 6 can precisely control the material handling process of the material handling system 2. Each module is designed relatively independently, simplifying the complexity of the structural design and avoiding the introduction of too many structural errors. However, they are interconnected and mutually compensate for each other during operation, with clear division of labor, improving efficiency and reducing errors.

[0089] Based on the above embodiments, an automatic wafer loading and unloading device for semiconductor bonding equipment is provided, which features high precision, high yield, strong controllability, high reliability, large stroke, and full automation.

[0090] In conjunction with the above embodiments, the chip loading and unloading device of this specification can also be applied to high-load, submicron-level precision worktables in various fields such as chemical, metallurgical, forging, testing, and pharmaceutical industries.

[0091] In conjunction with the above embodiments, this specification also provides a chip loading and unloading method: Before bonding, the chip is placed in a storage bin on a stacking module. A vision system is used to capture the first position of the chip in the storage bin, so as to obtain the coordinates corresponding to the first position through a control unit. A picking system is used to receive the coordinates corresponding to the first position converted into the second position coordinates of a robotic arm by the control unit, and to control the robotic arm to pick up the chip to a fixed area of ​​the bonding module, and then the robotic arm returns to the waiting area. The vision system, stacking module, bonding module, control unit, and picking system constitute a complete machine in a preset space. The robotic arm in the picking system enables the coordinates of the whole machine to be interconnected, that is, the conversion of the coordinates of each of the above modules / systems realizes the conversion of the chip positioning coordinates into the position coordinates of the robotic arm picking up the chip.

[0092] After bonding is completed, the robot arm picks up the bonded chip from the bonding area to the stacking area; the robot arm picks up the first chip and the second chip in sequence, and places the first chip and the second chip in the preset positions in the bonding area, with the outer contours of the first chip and the second chip corresponding.

[0093] Specifically, the chip is stored in a storage compartment on the stacking module 3. The vision system 1 captures the chip's exact location (e.g., X, Y, Z, R), and the detailed coordinates obtained by the control unit are sent to the picking system 2. After receiving the chip's location, the picking system 2 quickly converts it into the robot's position coordinates (e.g., X1, Y1, Z1, R1) and completes the chip picking. This step is to correlate the vision system, robot coordinates, and overall machine coordinates to improve the accuracy of chip positioning, facilitate accurate chip picking by the robot, and improve bonding precision.

[0094] After further chip grasping, a high-speed, high-precision, and highly stable four-axis robot places the grasped chip into a fixed area within the bonding module 4. The grasped chip can be placed within this fixed area. The robot then returns to the waiting area, indicating placement is complete. This step is to improve loading efficiency and increase yield. After bonding is complete, the robot quickly grasps the bonded chip and places it into the stacking area 3. This process constitutes a loop; repeating the above actions completes the picking and placing of the next set of chips.

[0095] In the above process, the chips bonded are a pair of chips of different specifications. The material handling system 2 needs to first pick up chip a, then pick up the corresponding chip b, place chip a in the bonding area 4 first, and then place the corresponding chip b, and ensure that the outer contours of chips a and b are completely aligned.

[0096] A dual-camera vision system is used. After the robot arm grasps the chip through the pre-aligned vision, it moves the chip into the field of view of the fine-aligned vision, and then recalibrates the actual position of the chip and converts it into the relative coordinates of the robot arm.

[0097] In some embodiments, the method further includes: there are at least two first chips or at least two second chips in the chips to be bonded; before bonding, pre-alignment detection is performed on each first chip and second chip using a vision system; and multiple robotic arms set in the material handling system are used to simultaneously batch-load the first chips / second chips.

[0098] Specifically, pre-aligning a batch of chips that need to be bonded before simultaneous loading can effectively improve bonding accuracy and yield. The entire process uses a vision system in conjunction with a four-axis robot to transfer the chips, achieving fully automated loading and unloading and avoiding manual intervention.

[0099] In summary, the chip loading / unloading device and method described in the embodiments of this specification have the following beneficial effects:

[0100] 1. High precision: It adopts a high-precision dual-camera positioning system, first giving the gripping position, and then accurately positioning it. Combined with a high-precision four-axis robot, it improves the accuracy of loading and bonding.

[0101] 2. Real-time monitoring: Adopting a dual-camera positioning system with an ultra-wide working field of view, combined with network transmission technology, it can observe the chip loading status in real time.

[0102] 3. High Productivity: Employing a high-precision, high-speed four-axis robot combined with a rapid gripping system enables fast and stable chip gripping and transfer. The upper and lower suction nozzles grip both A and B chips simultaneously, reducing chip transfer time and further improving efficiency.

[0103] 4. Long stroke: The use of a long stroke four-axis robot enables the chip to be transferred across regions.

[0104] 5. Fully automated: Combining a vision system, a robotic arm is used to transfer chips, requiring no human intervention at all, which improves efficiency and reduces the risk of human injury during machine operation.

[0105] 6. Quick loading: Multi-slot, quick-loading chip storage units further improve productivity.

[0106] 7. Reduce the possibility of chip damage: High-precision pneumatic control unit and high-temperature resistant soft nozzle are used to avoid structural damage to the chip.

[0107] 8. High applicability: It adopts a small suction nozzle and can grab chips of different specifications and models through precise adjustment of the air control system.

[0108] The same or similar parts between the various embodiments in this specification can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the product embodiments described later are relatively simple in description since they correspond to the methods, and relevant parts can be referred to the descriptions in the system embodiments.

[0109] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip loading and unloading device, characterized in that, include: A vision system, a material handling system, a material stacking module, a bonding module, and a control unit are respectively set up in the preset space; The vision system is used to cover the stacking module with its vision range in order to transmit the visual information of the chips on the stacking module to the control unit for processing; The operating stroke of the material handling system covers the corresponding areas of the stacking module and the bonding module, respectively. The control unit is used to control the material handling system to pick up and remove chips between the stacking module and the bonding module based on the visual information, so as to complete the corresponding processes respectively; Prior to bonding, the chip is placed in the stacking module, and the vision system is used to capture the first position of the chip so as to obtain the coordinates corresponding to the first position through the control unit. The material handling system includes a robotic arm. The material handling system is used to receive the coordinates of the first position, which are converted into the second position coordinates of the robot arm by the control unit, and to control the robot arm to pick up the chip to the bonding module according to the second position coordinates; wherein, the vision system, the material stacking system and the bonding system are correlated in the whole machine coordinates in a preset space through the robot arm of the material handling system; After bonding is completed, the robotic arm picks up the bonded chip from the bonding area and moves it to the stacking area; The robotic arm sequentially grasps the first chip and the second chip, and places the first chip and the second chip in preset positions in the bonding area, with the outer contours of the first chip and the second chip placed accordingly. The vision system includes: pre-alignment vision and fine alignment vision; The pre-alignment vision and the fine alignment vision are fixed using a first fixing frame and a second fixing frame, respectively. The pre-alignment vision includes a first camera and a first lens; the fine alignment vision includes a second camera and a second lens; the pre-alignment vision and the fine alignment vision are respectively adjusted to fixed positions on their respective fixed frames to obtain the working distance; The optical axis of the first camera is located at the center of the stacking module, and the minimum distance from the first camera to the stacking module is the working distance of the first camera. After the robotic arm grasps the chip, it moves the chip from the field of view of the first lens to the field of view of the second lens, and recalibrates the actual position of the chip to convert the coordinates of the chip's first position into the coordinates of the robotic arm's second position.

2. The chip loading and unloading device according to claim 1, characterized in that, The vision system is positioned above the stacking module. The optical axis of the camera in the vision system is located at the center of the stacking module, and the minimum distance from the camera to the stacking module is the working distance of the camera. The stacking module and the bonding module are arranged adjacent to each other; One side of the material handling system faces the same side of the stacking module and the bonding module, and the operating stroke of the material handling system covers the areas corresponding to the stacking module and the bonding module, respectively. A control unit is located on the other side of the material handling system.

3. The chip loading and unloading device according to claim 1, characterized in that, The material handling system also includes at least one four-axis robot, each four-axis robot having four degrees of freedom: X / Y / Z / RZ. The four-axis robot is fixed to the base; a connecting frame is provided on the four-axis robot, and the connecting frame is fixed to the end of the four-axis robot's Z-axis by a fixing ring; The robotic arm consists of a hollow motor and a gripper; the hollow motor is fixed to the flange face of the connecting frame by screws, and the end of the hollow central shaft of the hollow motor is threaded, and the gripper is connected to the hollow motor by the thread; The hollow motor includes a closed-loop encoder to control the gripper to pick up chips between the stacking module and the bonding module.

4. The chip loading and unloading device according to claim 3, characterized in that, The gripper is symmetrically equipped with two sets of suction nozzles, including an upper suction nozzle and a lower suction nozzle; the heights of the planes containing the upper and lower suction nozzles are symmetrical with respect to the plane containing the axis of the hollow motor. The suction nozzle is made of silicone material; Alternatively, the gripper may include: a fixed base, a rotary joint, a stud sleeve, and a suction nozzle; The mounting base has a three-sided structure, including an upper side, a lower side, and a front side; the front side is provided with a threaded hole corresponding to the thread of the hollow motor. The upper and lower sides of the fixing base are respectively provided with coaxial threaded holes so as to embed the stud sleeve into at least one side of the upper and lower sides of the fixing base; One end of the rotary joint is fixed to the front side by a thread, and the other end of the rotary joint is connected to the first end of the stud sleeve by a thread. The second end of the stud sleeve is connected to the suction nozzle via a thread; The three-sided structure includes a three-sided cuboid structure.

5. The chip loading and unloading device according to claim 1, characterized in that, The stacking module includes a limit plate, a storage frame, and a pallet; The limiting plate is fixed to the fixed column, and the fixed column is fixed to the worktable by the base plate; The limiting plate includes two limiting blocks placed opposite each other; The storage box is placed flat on the limit plate by a limit block; The storage frame has four slots, and the pallet is evenly placed in the four slots of the storage frame. The pallet and the storage frame are positioned by corner limiters.

6. The chip loading and unloading device according to claim 1, characterized in that, The control unit includes a pneumatic control unit, which is used to control the suction nozzle on the gripper. The air tube of the pneumatic control unit is connected to the interface of the rotary joint after passing through the internal air tube of the four-axis robot, through the hollow shaft of the hollow motor. Each pneumatic control unit includes a solenoid valve, a pressure reducing valve, a vacuum generator, a flow switch, and a gas tube; Alternatively, the air control unit can be divided into two air control units, each used to control two symmetrically arranged nozzles.

7. The chip loading and unloading device according to claim 1, characterized in that, The vision system is fixed to the column of the workbench via an adapter plate, and the material handling system, stacking module, bonding module and control unit are respectively installed on the tabletop of the workbench via corresponding base plate support frames.

8. A chip loading and unloading method, characterized in that, Using the chip loading / unloading apparatus as described in any one of claims 1-7, the chip loading / unloading method includes: Before bonding, the chip is placed in the stacking module, and the vision system is used to capture the first position of the chip in the storage compartment so that the coordinates corresponding to the first position can be obtained through the control unit. The material handling system receives the coordinates of the first position, which are converted into the second position coordinates of the robot arm by the control unit, and controls the robot arm to pick up the chip and place it into the bonding module; the vision system, the stacking system and the bonding system are interconnected in a preset space through the robot arm of the material handling system. After bonding is completed, the robotic arm picks up the bonded chip from the bonding area and moves it to the stacking area; The robotic arm sequentially grasps the first chip and the second chip, and places the first chip and the second chip in preset positions in the bonding area, with the outer contours of the first chip and the second chip aligned accordingly.

9. The chip loading and unloading method according to claim 8, characterized in that, Also includes: The chips to be bonded contain at least two first chips or at least two second chips. Before bonding, each first chip and second chip is pre-aligned using the vision system, and multiple robotic arms in the material handling system are used to simultaneously feed the first chip / second chip in batches.

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