Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel, a preparation method thereof, and a display device, which solve the problems of cracks and disconnections in the touch layer and color deviation of the display panel in the prior art. The display panel includes: a substrate; an encapsulation layer, the encapsulation layer is located on one side of the substrate; a first organic layer, the first organic layer is located on the surface of the encapsulation layer away from the substrate; a touch layer, the touch layer is located on the surface of the first organic layer away from the substrate; and a second organic layer, the second organic layer is located on the surface of the touch layer away from the substrate. Introducing the first organic layer and the second organic layer between the encapsulation layer and the touch layer, and on the surface of the touch layer away from the substrate, respectively, can effectively release the stress in the touch layer and effectively avoid problems such as cracks and disconnections in the touch layer; and the first organic layer and the second organic layer can effectively act as a flat layer, and the flatness effect is relatively excellent, which can effectively alleviate the problem of uneven surface caused by the encapsulation layer and can significantly improve the color deviation problem of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Display panels, especially flexible display panels, are prone to problems such as cracks and broken touch layers due to stress when folded; and the uneven encapsulation layer of the display panel can cause color deviation and other problems in the display panel, especially the display panel with a color filter on encapsulation layer (COE) structure. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, which solve the problems of cracks and disconnections in the touch layer and color deviation of the display panel in the prior art.

[0004] In a first aspect, the present application provides a display panel, the display panel comprising:

[0005] substrate;

[0006] A packaging layer, the packaging layer is located on one side of the substrate;

[0007] A first organic layer, the first organic layer is located on a surface of the encapsulation layer away from the substrate;

[0008] A touch layer, the touch layer is located on a surface of the first organic layer away from the substrate;

[0009] The second organic layer is located on a surface of the touch layer away from the substrate.

[0010] In one embodiment, the encapsulation layer includes a first inorganic layer, a third organic layer, and a second inorganic layer stacked in sequence, and the second inorganic layer is located on a side of the first inorganic layer away from the substrate;

[0011] Optionally, along the thickness direction of the substrate, the thickness of the third organic layer is less than or equal to 6 μm;

[0012] Optionally, along the thickness direction of the substrate, the thickness of the third organic layer is greater than or equal to 4 μm and less than or equal to 6 μm;

[0013] Optionally, along the thickness direction of the substrate, the thickness of the third organic layer is less than or equal to 5 μm.

[0014] In one embodiment, the touch layer includes a first conductive layer; or the touch layer includes a second conductive layer, a fourth organic layer and a third conductive layer stacked in sequence, and the second conductive layer is located on a side of the third conductive layer close to the substrate;

[0015] Optionally, the touch layer includes a self-capacitive touch layer or a mutual-capacitive touch layer.

[0016] In one embodiment, the display panel further includes: a third inorganic layer, and the third inorganic layer is located on a surface of the second organic layer away from the substrate.

[0017] In one embodiment, it further includes:

[0018] A black matrix, which is located on a side of the second organic layer away from the substrate, and has a plurality of openings;

[0019] A color resist unit, at least a portion of which is located in the opening;

[0020] Optionally, the display panel further includes: a fifth organic layer, the fifth organic layer is located on a surface of the black matrix away from the substrate and covers the color resist unit;

[0021] Optionally, the display panel further includes: a third inorganic layer, the third inorganic layer is located between the second organic layer and the black matrix, and the third inorganic layer is located between the second organic layer and the color resist unit.

[0022] In one embodiment, the display panel includes a display area and a non-display area, and the display panel further includes: a first retaining wall located in the non-display area,

[0023] Optionally, the first organic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area;

[0024] Optionally, the second organic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area;

[0025] Optionally, the encapsulation layer includes a first inorganic layer, a third organic layer, and a second inorganic layer stacked in sequence, and the second inorganic layer is located on a side of the first inorganic layer away from the substrate;

[0026] The first inorganic layer extends from the display area to the non-display area, covers the first retaining wall, and extends to a side of the first retaining wall away from the display area; and / or, the third organic layer extends from the display area to the non-display area, and the third organic layer is located on a side of the first retaining wall away from the display area and close to the display area; and / or, the second inorganic layer extends from the display area to the non-display area, covers the first retaining wall, and extends to a side of the first retaining wall away from the display area;

[0027] Optionally, on a side of the first retaining wall away from the display area, the second organic layer covers the first organic layer;

[0028] Optionally, the display panel further includes a third inorganic layer, which is located on a surface of the second organic layer away from the substrate; the third inorganic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area;

[0029] Optionally, on a side of the first retaining wall away from the display area, the third inorganic layer is in contact with the second inorganic layer and / or the first inorganic layer;

[0030] Optionally, the display panel further comprises: a second retaining wall located in the non-display area and located on a side of the first retaining wall away from the display area; the first organic layer is located on a side of the second retaining wall close to the display area; the second organic layer is located on a side of the second retaining wall close to the display area; the third inorganic layer is in contact with the second inorganic layer and / or the first inorganic layer on a side of the second retaining wall away from the display area; and / or the second inorganic layer is in contact with the first inorganic layer on a side of the second retaining wall away from the display area;

[0031] Optionally, the touch layer includes a second conductive layer, a fourth organic layer and a third conductive layer stacked in sequence, the second conductive layer is located on a side of the third conductive layer close to the substrate; the fourth organic layer extends from the display area to the non-display area, and extends to a side of the first barrier away from the display area;

[0032] Optionally, on a side of the first retaining wall away from the display area, the second organic layer covers the fourth organic layer, and / or the fourth organic layer covers the first organic layer;

[0033] Optionally, the fourth organic layer is located on a side of the second retaining wall close to the display area.

[0034] In one embodiment, the display panel further includes a light emitting device layer, which is located between the substrate and the encapsulation layer and is located in the display area;

[0035] Optionally, the substrate comprises a flexible substrate;

[0036] Optionally, the display panel is a foldable display panel.

[0037] A second aspect of the present application provides a method for preparing a display panel, comprising:

[0038] preparing a packaging layer on a substrate;

[0039] Prepare a first organic layer on the surface of the encapsulation layer away from the substrate;

[0040] Prepare a touch layer on the surface of the first organic layer away from the substrate;

[0041] A second organic layer is prepared on the surface of the touch layer away from the substrate.

[0042] In one embodiment, the touch layer includes a second conductive layer, a fourth organic layer, and a third conductive layer which are stacked, and preparing the touch layer on a surface of the first organic layer away from the substrate includes:

[0043] On the surface of the first organic layer away from the substrate, a second conductive layer, a fourth organic layer and a third conductive layer are sequentially stacked;

[0044] Optionally, after the second organic layer is formed on the surface of the touch layer away from the substrate, the method further includes: forming a third inorganic layer on the surface of the second organic layer away from the substrate;

[0045] Optionally, after preparing the third inorganic layer on the surface of the second organic layer away from the substrate, the method further comprises:

[0046] A black matrix is ​​prepared on a side of the second organic layer away from the substrate, and a plurality of openings are formed in the black matrix;

[0047] preparing a color resist unit in the opening;

[0048] Optionally, after the color resist unit is formed in the opening, the method further includes: forming a fifth organic layer covering the color resist unit and the black matrix on a surface of the black matrix away from the substrate.

[0049] A third aspect of the present application provides a display device, comprising the aforementioned display panel, or comprising a display panel prepared by the aforementioned preparation method.

[0050] In the embodiment of the present application, the first organic layer and the second organic layer are respectively introduced between the encapsulation layer and the touch layer, and on the surface of the touch layer away from the substrate, which can effectively release the stress in the touch layer and effectively avoid problems such as cracks and breakages in the touch layer; and the first organic layer and the second organic layer can effectively act as a flat layer with a relatively excellent flattening effect, which can effectively alleviate the problem of uneven surface caused by the encapsulation layer and can significantly improve the color deviation problem of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a schematic diagram of the cross-sectional structure of a display panel in one embodiment of the present application.

[0052] Figure 2 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0053] Figure 3 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0054] Figure 4 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0055] Figure 5 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0056] Figure 6 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0057] Figure 7 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0058] Figure 8 This is a schematic diagram of the cross-sectional structure of a display panel in another embodiment of the present application.

[0059] Fig. 9 The figure is a schematic diagram of a top view of the structure of a display panel in one embodiment of the present application.

[0060] Fig.10 The figure is a schematic flow chart of a method for preparing a display panel in one embodiment of the present application.

[0061] Fig.11 This is a schematic flow chart of a method for preparing a display panel in another embodiment of the present application.

[0062] Fig.12 This is a schematic flow chart of a method for preparing a display panel in another embodiment of the present application.

[0063] Fig.13 This is a schematic flow chart of a method for preparing a display panel in another embodiment of the present application. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0065] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0066] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0067] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0068] In the current display panel, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. A touch layer is made on the surface of the encapsulation layer away from the substrate. The touch layer includes a touch metal layer, an inorganic layer, and a bridge metal layer that are stacked. Due to the presence of stress, the inorganic layer, the touch metal layer, and the bridge metal layer in the touch layer are prone to cracks and disconnections. Especially in flexible display panels, the above problems will cause the life of the display panel to be shortened and cannot be used normally. Moreover, in the current display panel, due to the height differences of the support column (Spacer, SPC), the pixel opening of the pixel definition layer (Pixel Definition Layer, PDL), the metal routing and other structures, when the organic encapsulation layer is formed by inkjet printing, there will inevitably be an uneven organic encapsulation layer, which will cause the encapsulation layer to be uneven, and ultimately cause the display panel to have problems such as color deviation.

[0069] In view of this, the first aspect of the present application provides a display panel, referring to Figure 1 The structure diagram of the display panel shown in FIG. 1 includes a substrate 100 , an encapsulation layer 200 , a first organic layer 300 , a touch layer 400 and a second organic layer 500 .

[0070] The encapsulation layer 200 is located on one side of the substrate 100 ; the first organic layer 300 is located on the surface of the encapsulation layer 200 away from the substrate 100 ; the touch layer 400 is located on the surface of the first organic layer 300 away from the substrate 100 ; and the second organic layer 500 is located on the surface of the touch layer 400 away from the substrate 100 .

[0071] In the embodiment of the present application, the first organic layer 300 and the second organic layer 500 are introduced between the encapsulation layer 200 and the touch layer 400, and on the surface of the touch layer 400 away from the substrate 100. The first organic layer 300 and the second organic layer 500 can release the stress in the touch layer 400, effectively alleviate the stress problem in the touch layer 400, and effectively avoid problems such as cracks and disconnections in the touch layer 400; and the first organic layer 300 and the second organic layer 500 can effectively act as a flat layer, and the flat effect is relatively excellent, which can effectively alleviate the problem of uneven surface caused by the encapsulation layer 200, and can significantly improve the color deviation problem of the display panel. The first organic layer 300 may include an organic insulating layer. The second organic layer 500 may include an organic insulating layer.

[0072] In one embodiment, referring to Figure 2 As shown in the structural diagram of the display panel, the display panel further includes: a black matrix 600, which is located on a side of the second organic layer 500 away from the substrate 100, and the black matrix 600 has a plurality of openings.

[0073] For example, the display panel further includes: a color resist unit 700, at least a portion of which is located in the opening. Thus, the display panel is a display panel having a color filter on encapsulation layer (COE) structure.

[0074] Exemplarily, the materials of the black matrix 600 include but are not limited to black colorants (such as carbon black, etc.), adhesives, organic solvents, dispersants, etc., among which the black colorants, adhesives, organic solvents, and dispersants are all conventional materials and will not be described in detail here.

[0075] It is understandable that the color resist unit 700 includes a red color resist unit, a green color resist unit and a blue color resist unit. The materials of the color resist unit include resin and pigment. For example, the red color resist unit includes resin and red pigment, and the resin and pigment are conventional materials, which will not be described in detail here.

[0076] It is understandable that the display panel with a COE structure has a higher requirement for flatness and requires that the thickness of the encapsulation layer 200 should not be too thick, otherwise it is easy to cause problems such as color deviation. In the embodiment of the present application, the first organic layer 300 and the second organic layer 500 can effectively act as a flat layer, so that the thickness of the third organic layer in the encapsulation layer 200 is relatively thin, and the surface of the second organic layer 500 away from the substrate 100 is relatively flat, which effectively avoids the color deviation problem of the display panel.

[0077] In one embodiment, referring to Figure 3 As shown in the structural schematic diagram of the display panel, the encapsulation layer 200 includes a first inorganic layer 210, a third organic layer 220 and a second inorganic layer 230 stacked in sequence, and the second inorganic layer 230 is located on a side of the first inorganic layer 210 away from the substrate.

[0078] It is understandable that the third organic layer 220 can be formed by inkjet printing. At present, the thickness of the third organic layer 220 is generally 10 μm, and a thicker thickness is required to make the encapsulation layer relatively flat, but there will still be a color deviation problem of the display panel; and when the thickness of the third organic layer 220 is too thick, when preparing a display panel with a COE structure, the opening of the required black matrix 600 will be larger, resulting in poor reflectivity, or in the case of the same black matrix 600 opening, the color deviation of the display panel at low viewing angles is more serious. In an embodiment of the present application, along the thickness direction Z of the substrate 100, the thickness H (for example, the maximum thickness, or the thickness of the light-emitting area) of the third organic layer 220 is less than or equal to 6 μm, and the thickness of the third organic layer 220 is relatively thin. Under the condition of the same opening of the black matrix 600, the display panel has almost no color deviation phenomenon; and the arrangement of the first organic layer 300 and the second organic layer 500 can make the surface of the second organic layer 500 away from the substrate 100 relatively flat. The black matrix 600 and the color resist unit 700 are prepared on the surface of the second organic layer 500 away from the substrate 100, which can effectively avoid the color deviation problem of the display panel.

[0079] Illustratively, along the thickness direction Z of the substrate 100 , the thickness of the third organic layer 220 is greater than or equal to 4 μm and less than or equal to 6 μm, for example, 4 μm, 4.5 μm, 5 μm, 5.5 μm or 6 μm.

[0080] Optionally, along the thickness direction Z of the substrate 100, the thickness of the third organic layer 220 is less than or equal to 5 μm. The thickness of the third organic layer 220 is relatively thin, and under the same opening of the black matrix 600, the display panel has almost no color shift phenomenon; and the arrangement of the first organic layer 300 and the second organic layer 500 can make the surface of the second organic layer 500 away from the substrate 100 relatively flat, and the black matrix 600 and the color resistance unit 700 are prepared on the surface of the second organic layer 500 away from the substrate 100, which can effectively avoid the color shift problem of the display panel.

[0081] Exemplarily, the touch layer 400 includes a self-capacitive touch layer or a mutual-capacitive touch layer.

[0082] In one embodiment, referring to Figure 4 In the structural diagram of the display panel shown in FIG. 1 , the touch layer 400 includes a first conductive layer 410. When the touch layer 400 only includes one first conductive layer 410, the touch layer 400 can achieve a self-capacitive touch effect; and the first organic layer 300 and the second organic layer 500 on both sides of the first conductive layer 410 can effectively release the stress in the first conductive layer 410, thereby preventing the first conductive layer 410 from cracking or breaking.

[0083] It is understandable that the first conductive layer 410 includes a self-capacitive touch electrode, which is a conventional self-capacitive touch electrode and is not an improvement of the present application, and will not be described in detail here. The material of the first conductive layer includes but is not limited to indium tin oxide (ITO), silver nanowire, carbon nanotube, graphene, and conductive polymer. The first conductive layer 410 may include materials such as metal or metal oxide layer.

[0084] In another embodiment, referring to Figure 5 In the structural schematic diagram of the display panel shown in the figure, the touch layer 400 includes a second conductive layer 420, a fourth organic layer 430 and a third conductive layer 440 which are stacked in sequence, and the second conductive layer 420 is located on the side of the third conductive layer 440 close to the substrate 100. Thus, the touch layer 400 can achieve a self-capacitive or mutual-capacitive touch effect. The materials of the second conductive layer 420 and the third conductive layer 440 include but are not limited to indium tin oxide (ITO), silver nanowires, carbon nanotubes, graphene, and conductive polymers. The fourth organic layer 430 may include an organic insulating layer. The second conductive layer 420 may include materials such as metals or metal oxide layers. The third conductive layer 440 may include materials such as metals or metal oxide layers.

[0085] Exemplarily, the second conductive layer 420 includes touch electrodes arranged in an array, the touch electrodes arranged in the row direction may be touch drive electrodes Tx, the touch electrodes arranged in the column direction may be touch sensing electrodes Rx, and the third conductive layer 440 includes a bridging portion for bridging the touch drive electrodes Tx or the touch sensing electrodes Rx; or, the second conductive layer 420 includes a bridging portion, and the third conductive layer 440 includes touch electrodes arranged in an array, and the above arrangement of the second conductive layer 420 and the third conductive layer 440 is conducive to obtaining a mutual capacitive touch layer. The touch electrodes and the bridging portion are conventional touch electrodes and bridging portions, and are not improvements of the present application, and will not be described in detail here.

[0086] Exemplarily, the second conductive layer 420 includes touch electrodes arranged in a row direction, which may be touch driving electrodes Tx, and the third conductive layer 440 includes touch electrodes arranged in a column direction, which may be touch sensing electrodes Rx. The arrangement of the second conductive layer 420 and the third conductive layer 440 is conducive to obtaining a self-capacitive touch layer. The touch electrodes and the bridge portion are conventional touch electrodes and bridge portions, which are not improvements of the present application and will not be described in detail here.

[0087] In one embodiment, referring to Figure 5The structural diagram of the display panel shown in the figure, the display panel also includes: a third inorganic layer 800, and the third inorganic layer 800 is located on the surface of the second organic layer 500 away from the substrate 100. Therefore, the third inorganic layer 800 can effectively block water and oxygen, and has a certain encapsulation effect on the structure on the side close to the substrate 100. The third inorganic layer 800 can be an inorganic encapsulation layer. The third inorganic layer 800 may include an inorganic insulating layer.

[0088] Exemplarily, the third inorganic layer 800 is located between the second organic layer 500 and the black matrix 600 , and between the second organic layer 500 and the color resist unit 700 .

[0089] In one embodiment, referring to Figure 6 The structure diagram of the display panel shown in the figure further includes: a fifth organic layer 900, which is located on the surface of the black matrix 600 away from the substrate 100 and covers the color resist unit 700. Therefore, the fifth organic layer 900 can effectively protect the black matrix 600 and the color resist unit 700, and can also serve as a flat layer.

[0090] It is understandable that the second organic layer 500 and the fifth organic layer 900 are respectively disposed on both sides of the third inorganic layer 800 , which can effectively release the stress in the third inorganic layer 800 and prevent the third inorganic layer 800 from being broken.

[0091] For example, the display panel further includes a light emitting device layer 1100 , which is located between the substrate 100 and the encapsulation layer 200 and located in the display area AA.

[0092] In a specific embodiment, referring to Figure 6The structural schematic diagram of the display panel shown in the figure, the display panel also includes: a pixel defining layer 10 and a light emitting device layer 1100, the light emitting device layer 1100 includes a first electrode layer 30, a light emitting layer 40 and a second electrode layer 50 stacked in sequence in a direction away from the substrate; the pixel defining layer 10 is located on the side of the substrate 100 close to the encapsulation layer 200, and the pixel defining layer 10 defines a plurality of pixel openings. The display panel may also include a support column 20, which is located on the surface of the pixel defining layer 10 away from the substrate 100. The first electrode layer 30 is located between the pixel defining layer 10 and the substrate 100, and at least part of the light emitting layer 40 and at least part of the second electrode layer 50 are located at the pixel opening. Due to the presence of the pixel opening in the pixel defining layer 10 and the support column 20 and other structures, the surface of the encapsulation layer 200 is uneven. After the black matrix 600 and the color resistance unit 700 are prepared on the side of the encapsulation layer 200 away from the substrate 100, the problem of color deviation is prone to occur. The inventor of the present application discovered the above problem after extensive research, and arranged the first organic layer 300 and the second organic layer 500 on opposite sides of the touch layer 400, so that the first organic layer 300 and the second organic layer 500 act as a flat layer, effectively alleviating the color deviation problem of the display panel. At the same time, the first organic layer 300 and the second organic layer 500 can also effectively delay the intrusion of water and oxygen into the light-emitting layer, effectively extending the service life of the display panel. The pixel defining layer 10 and the support column 20 can be an integrated structure.

[0093] In one embodiment, referring to Figure 7 The structural schematic diagram of the display panel shown in the figure includes a display area AA and a non-display area NA, for example, the non-display area NA at least partially surrounds the display area AA, and the display panel further includes: a first retaining wall 1000, located in the non-display area NA. Optionally, the first retaining wall 1000 and the encapsulation layer 200 are located on the same side of the substrate 100, and the encapsulation layer 200 extends from the display area AA to the non-display area NA and covers the first retaining wall 1000.

[0094] Exemplarily, the light emitting device layer 1100 is located between the substrate 100 and the encapsulation layer 200 , and is located in the display area AA.

[0095] In one embodiment, the encapsulation layer 200 includes a first inorganic layer 210, a third organic layer 220, and a second inorganic layer 230 which are stacked in sequence, and the second inorganic layer 230 is located on a side of the first inorganic layer 210 away from the substrate; the first inorganic layer 210 extends from the display area AA to the non-display area NA, covers the first retaining wall 1000, and extends to a side of the first retaining wall 1000 away from the display area AA. Thus, the encapsulation effect of the display panel is better, and the first inorganic layer 210 has a better effect of isolating water and oxygen.

[0096] In one embodiment, the third organic layer 220 extends from the display area AA to the non-display area NA, and the third organic layer 220 is located on a side of the first retaining wall 1000 that is away from the display area AA and close to the display area AA. When preparing the third organic layer 220, the first retaining wall 1000 can block the overflow of the organic material, thereby achieving a narrow frame.

[0097] In one embodiment, the second inorganic layer 230 extends from the display area AA to the non-display area NA, covers the first retaining wall 1000, and extends to the side of the first retaining wall 1000 away from the display area AA. Thus, the encapsulation effect of the display panel is better, and the second inorganic layer 230 has a better effect of isolating water and oxygen.

[0098] In one embodiment, the first organic layer 300 extends from the display area AA to the non-display area NA and to the side of the first retaining wall 1000 away from the display area AA. Thus, the encapsulation effect of the display panel is better, and the effect of isolating water and oxygen from invading the display area AA is better.

[0099] In one embodiment, the second organic layer 500 extends from the display area AA to the non-display area NA and to the side of the first retaining wall 1000 away from the display area AA. Thus, the encapsulation effect of the display panel is better, and the effect of isolating water and oxygen from invading the display area AA is better.

[0100] For example, at a side of the first retaining wall 1000 away from the display area AA, the second inorganic layer 230 is in contact with the first inorganic layer 210. Thus, the encapsulation effect of the display panel is better.

[0101] In one embodiment, on the side of the first retaining wall 1000 away from the display area AA, the second organic layer 500 covers the first organic layer 300. This facilitates manufacturing and provides a better packaging effect.

[0102] In one embodiment, the touch layer 400 includes a second conductive layer 420, a fourth organic layer 430, and a third conductive layer 440, which are stacked. The second conductive layer 420 is located on the side of the third conductive layer 440 close to the substrate 100. The fourth organic layer 430 extends from the display area AA to the non-display area NA, and extends to the side of the first barrier wall 1000 away from the display area AA. As a result, the encapsulation effect of the display panel is better, and the effect of isolating water and oxygen from invading the display area AA is better.

[0103] In one embodiment, on the side of the first retaining wall 1000 away from the display area AA, the second organic layer 500 covers the fourth organic layer 430, and / or the fourth organic layer 430 covers the first organic layer 300. This facilitates manufacturing and has a better packaging effect.

[0104] In one embodiment, the display panel further includes a third inorganic layer 800, which is located on the surface of the second organic layer 500 away from the substrate 100; the third inorganic layer 800 extends from the display area AA to the non-display area NA, and extends to the side of the first retaining wall 1000 away from the display area AA; on the side of the first retaining wall 1000 away from the display area AA, the third inorganic layer 800 is in contact with the second inorganic layer 230 and / or the first inorganic layer 210. For example, on the side of the first retaining wall 1000 away from the display area AA, the third inorganic layer 800 covers the second organic layer 500 and is in contact with the second inorganic layer 230. As a result, the display panel has an excellent encapsulation effect and an excellent effect of isolating water and oxygen from invading the display area AA. The third inorganic layer 800 may include an insulating material, such as silicon oxide, silicon nitride, etc. The third inorganic layer 800 may be an inorganic encapsulation layer. The first organic layer 300 may be an organic encapsulation layer. The second organic layer 500 may be an organic encapsulation layer. The fourth organic layer 430 may be an organic encapsulation layer.

[0105] In one embodiment, referring to Figure 8 and Fig. 9 , the display panel further includes: a second retaining wall 1200, located in the non-display area NA and on the side of the first retaining wall 1000 away from the display area AA; the first organic layer 300 is located on the side of the second retaining wall 1200 close to the display area AA; the second organic layer 500 is located on the side of the second retaining wall 1200 close to the display area AA; the fourth organic layer 430 is located on the side of the second retaining wall 1200 close to the display area AA; on the side of the second retaining wall 1200 away from the display area AA, the third inorganic layer 800 is in contact with the second inorganic layer 230 and / or the first inorganic layer 210. For example, on the side of the second retaining wall 1200 away from the display area AA, the second inorganic layer 230 is in contact with the first inorganic layer 210. It should be noted that, Figure 8 Can be Fig. 9 A schematic diagram of a cross-sectional structure of a display panel in the AA' direction, Figure 1 Can be Fig. 9 Schematic diagram of another cross-sectional structure of the display panel in the BB' direction.

[0106] When preparing at least one of the first organic layer 300 , the second organic layer 500 , the fourth organic layer 430 , and the third organic layer 220 , the second barrier wall 1200 may be used to block the overflow of the organic material, thereby achieving a narrow frame.

[0107] When preparing at least one of the first organic layer 300 , the second organic layer 500 , the fourth organic layer 430 , and the third organic layer 220 , the first barrier wall 1000 may be used to block the overflow of the organic material, thereby achieving a narrow frame.

[0108] It is understandable that, referring to Fig. 9, the light emitting device layer 1100 includes a plurality of light emitting devices 1110 .

[0109] Exemplarily, the substrate 100 includes a flexible substrate to obtain a flexible display panel that can be folded or bent. For example, the display panel is a foldable display panel.

[0110] It is understandable that the substrate includes a pixel driving circuit and a substrate, the film layer where the pixel driving circuit is located is located between the substrate and the encapsulation layer, and the substrate can be a flexible substrate, for example, the material of the substrate can include but is not limited to polyimide, etc., so that the display panel with a flexible substrate can achieve deformation such as stretching and bending. During the process of stretching, bending and other deformation of the display panel, due to the stress buffering effect of the first organic layer 300, the second organic layer 500 and / or the fourth organic layer 430, the stress between the film layers of the display panel during deformation can be effectively released, and the risk of cracks or disconnection of the conductive layer in the touch layer can be effectively reduced.

[0111] It is understandable that the materials of the first organic layer 300, the second organic layer 500, the third organic layer 220, the fourth organic layer 430 and the fifth organic layer 900 may include but are not limited to acrylic series, epoxy resin series or silicone series materials. The first organic layer 300, the second organic layer 500 and / or the fourth organic layer 430 can not only achieve a flat effect, but also release the stress in the touch layer and achieve an encapsulation effect. Specifically, it can delay the intrusion of water and oxygen into the light-emitting layer, effectively extend the service life of the display panel, and avoid color deviation of the display panel.

[0112] It should be noted that Figures 1 to 8 In the figure, the direction Z refers to the direction perpendicular to the plane where the substrate 100 is located.

[0113] The second aspect of the present application provides a method for preparing a display panel, which can be used to prepare the display panel in the above embodiment. Fig.10 The schematic flow chart of the method for preparing a display panel is shown, and the method for preparing the display panel includes the following steps.

[0114] S100: preparing a packaging layer on a substrate.

[0115] In one embodiment, the encapsulation layer 200 includes a first inorganic layer 210, a third organic layer 220, and a second inorganic layer 230 stacked in sequence, the second inorganic layer is located on a side of the first inorganic layer away from the substrate, and preparing the encapsulation layer on one side of the substrate includes:

[0116] A first inorganic layer is prepared on a substrate, a third organic layer is prepared on a surface of the first inorganic layer away from the substrate, and a second inorganic layer is prepared on a surface of the third organic layer away from the substrate. The first inorganic layer and the second inorganic layer may be formed by methods including but not limited to vacuum evaporation, ion beam sputtering, chemical vapor deposition, etc. This embodiment does not limit the method for forming the first inorganic layer and the second inorganic layer. Optionally, the thickness of the first inorganic layer may be 0.5 to 1.5 microns, and the material of the first inorganic layer may be SiNx, SiOx, SiONx, SiCNx, Al 2 O 3 、TiO 2 、ZrO 2 The thickness of the second inorganic layer can be 0.5 to 1.5 microns, and the material of the second inorganic layer can be SiNx, SiOx, SiONx, SiCNx, Al 2 O 3 、TiO 2 、ZrO 2 The material and thickness of the second inorganic layer may be the same as or different from those of the first inorganic layer. The third organic layer may be formed by inkjet printing (IJP), screen printing, plasma enhanced vapor deposition (PEVCD), etc. Among them, the inkjet printing process is the preferred method for forming the third organic layer due to its advantages of fast deposition speed and good uniformity.

[0117] Exemplarily, before the encapsulation layer is formed on the substrate, the method further includes: preparing a first electrode layer on the substrate; preparing a pixel defining layer on the surface of the first electrode layer away from the substrate, the pixel defining layer including a plurality of pixel openings, and the first electrode layer at least partially exposed to the pixel openings; forming support columns on the surface of the pixel defining layer away from the substrate; and sequentially preparing a light-emitting layer and a second electrode layer in the pixel openings. It is understandable that the encapsulation layer is located on the surface of the second electrode layer away from the substrate and covers the support columns. Due to the presence of the support columns and the pixel openings in the pixel defining layer, the surface of the second electrode layer and the support columns away from the substrate is uneven. The inventor of the present application discovered the above problem based on a large amount of research, and formed the first organic layer and the second organic layer on the side of the encapsulation layer away from the substrate, thereby effectively solving the problem of the uneven surface of the encapsulation layer away from the substrate, and effectively improving the color deviation problem of the display panel.

[0118] Exemplarily, the substrate includes a substrate and a pixel driving circuit located between the substrate and the encapsulation layer, and the first electrode layer is connected to the pixel driving circuit.

[0119] S200: preparing a first organic layer on a surface of the encapsulation layer away from the substrate.

[0120] It should be noted that the first organic layer is consistent with the above description and will not be described in detail here.

[0121] Exemplarily, the first organic layer 300 is prepared on the surface of the encapsulation layer away from the substrate in a manner including coating, inkjet printing (IJP), screen printing, plasma enhanced vapor deposition, and the like.

[0122] S300: preparing a touch layer on a surface of the first organic layer away from the substrate.

[0123] It should be noted that the touch layer 400 is consistent with the above description and will not be described in detail here.

[0124] Exemplarily, the touch layer includes a first conductive layer. In this case, the touch layer can realize self-capacitive touch. Preparing the touch layer on the surface of the first organic layer away from the substrate includes preparing the first conductive layer on the surface of the first organic layer away from the substrate. It can be understood that the method of preparing the first conductive layer on the surface of the first organic layer away from the substrate includes but is not limited to: forming a whole conductive layer on the surface of the first organic layer away from the substrate, and patterning the conductive layer (such as chemical etching or photolithography, etc.) to obtain the first conductive layer.

[0125] Exemplarily, the touch layer 400 includes a second conductive layer, a fourth organic layer and a third conductive layer which are stacked. In this case, the touch layer can realize mutual capacitive touch. Preparing the touch layer on the surface of the first organic layer away from the substrate includes: preparing a second conductive layer, a fourth organic layer and a third conductive layer which are stacked in sequence on the surface of the first organic layer away from the substrate. It can be understood that the method of forming the second conductive layer on the surface of the first organic layer away from the substrate includes but is not limited to: forming a whole conductive layer on the surface of the first organic layer away from the substrate, and patterning the conductive layer (such as chemical etching or photolithography, etc.) to obtain the second conductive layer. The method of forming the fourth organic layer on the surface of the second conductive layer away from the substrate includes but is not limited to coating, inkjet printing (IJP), screen printing, plasma enhanced vapor deposition, etc. The method of forming the third conductive layer on the surface of the fourth organic layer away from the substrate includes but is not limited to: forming a whole conductive layer on the surface of the fourth organic layer away from the substrate, and patterning the conductive layer (such as chemical etching or photolithography, etc.) to obtain the third conductive layer.

[0126] S400: preparing a second organic layer on a surface of the touch layer away from the substrate.

[0127] It should be noted that the second organic layer 500 is consistent with the above description and will not be described in detail here.

[0128] Illustratively, the method of preparing the second organic layer on the surface of the touch layer away from the substrate includes coating, inkjet printing (IJP), screen printing, plasma enhanced vapor deposition, and the like.

[0129] In one embodiment, referring to Fig.11 The schematic flow chart of the method for preparing a display panel shown in the figure further includes the following steps after the second organic layer is prepared on the surface of the touch layer away from the substrate.

[0130] S500: forming a third inorganic layer on a surface of the second organic layer away from the substrate.

[0131] It can be understood that the third inorganic layer 800 is consistent with the above description and will not be described in detail here.

[0132] Illustratively, methods for preparing the third inorganic layer on the surface of the second organic layer away from the substrate include, but are not limited to, vacuum evaporation, ion beam sputtering, chemical vapor deposition, and the like.

[0133] In one embodiment, referring to Fig.12 The schematic flow chart of the method for preparing a display panel shown in the figure further includes the following steps after the third inorganic layer is prepared on the surface of the second organic layer away from the substrate.

[0134] S600: preparing a black matrix on a side of the second organic layer away from the substrate, wherein a plurality of openings are formed in the black matrix.

[0135] It should be noted that the black matrix 600 is consistent with the above description and will not be described in detail here.

[0136] Exemplarily, the method of forming a black matrix includes but is not limited to coating the material forming the black matrix on the surface of the third inorganic layer away from the substrate to form a whole black shading layer, and opening multiple openings in the whole black shading layer to form a black matrix.

[0137] S700: preparing a color resist unit in the opening.

[0138] It should be noted that the color resistance unit 700 is consistent with the above description and will not be described in detail here.

[0139] Illustratively, methods for preparing the color resist unit in the opening include, but are not limited to, dyeing, printing, inkjet, and electroplating, etc., which are conventional methods and will not be described in detail herein.

[0140] In one embodiment, referring to Fig.13 The schematic flow chart of the method for manufacturing a display panel shown in the figure further includes the following steps after the color resist unit is prepared in the opening.

[0141] S800: preparing a fifth organic layer covering the color resist unit and the black matrix on a surface of the black matrix away from the substrate.

[0142] It should be noted that the fifth organic layer 900 is consistent with the above description and will not be described in detail here.

[0143] Exemplarily, methods for preparing the fifth organic layer covering the color resist unit and the black matrix on the surface of the black matrix away from the substrate include but are not limited to coating, inkjet printing (IJP), screen printing, plasma enhanced vapor deposition and the like.

[0144] A third aspect of the present application provides a display device, which includes the above-mentioned display panel, or a display panel prepared by the above-mentioned method for preparing a display panel.

[0145] It is understandable that, in addition to the display panel described above, the display device may also include structures that a conventional display device should have, such as a cover plate, a housing, etc., which will not be described in detail here.

[0146] Exemplarily, the display device may be a flexible display device that can be stretched, bent, etc. The display device may also be a transparent display device or a non-transparent display device.

[0147] Exemplarily, the types of display devices may include but are not limited to computers, tablets, wearable devices, mobile phones, etc. As long as they can meet the requirements, technicians in this field can make flexible choices based on actual conditions.

[0148] For example, the display device may be used for color display or black and white display, and those skilled in the art may flexibly select a specific application scenario according to actual conditions.

[0149] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0150] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

[0151] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: substrate; A packaging layer, wherein the packaging layer is located on one side of the substrate; a first organic layer, wherein the first organic layer is located on a surface of the encapsulation layer away from the substrate; A touch layer, the touch layer is located on a surface of the first organic layer away from the substrate; A second organic layer is located on a surface of the touch layer away from the substrate.

2. The display panel according to claim 1, characterized in that: The encapsulation layer comprises a first inorganic layer, a third organic layer and a second inorganic layer stacked in sequence, wherein the second inorganic layer is located on a side of the first inorganic layer away from the substrate; Preferably, along the thickness direction of the substrate, the thickness of the third organic layer is less than or equal to 6 μm; Preferably, along the thickness direction of the substrate, the thickness of the third organic layer is greater than or equal to 4 μm and less than or equal to 6 μm; Preferably, along the thickness direction of the substrate, the thickness of the third organic layer is less than or equal to 5 μm.

3. The display panel according to claim 1, characterized in that: The touch layer includes a first conductive layer; or the touch layer includes a second conductive layer, a fourth organic layer and a third conductive layer stacked in sequence, and the second conductive layer is located on a side of the third conductive layer close to the substrate; Preferably, the touch layer includes a self-capacitive touch layer or a mutual-capacitive touch layer.

4. The display panel according to claim 1, characterized in that: The display panel further includes a third inorganic layer, and the third inorganic layer is located on a surface of the second organic layer away from the substrate.

5. The display panel according to claim 1, characterized in that: Also includes: A black matrix, the black matrix is ​​located on a side of the second organic layer away from the substrate, and the black matrix has a plurality of openings; a color-resistance unit, at least a portion of which is located in the opening; Preferably, the display panel further comprises: a fifth organic layer, the fifth organic layer being located on a surface of the black matrix away from the substrate and covering the color resistance unit; Preferably, the display panel further includes: a third inorganic layer, wherein the third inorganic layer is located between the second organic layer and the black matrix, and the third inorganic layer is located between the second organic layer and the color resist unit.

6. The display panel according to claim 1, characterized in that: The display panel includes a display area and a non-display area, and the display panel further includes: a first barrier wall located in the non-display area, Preferably, the first organic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area; Preferably, the second organic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area; Preferably, the encapsulation layer comprises a first inorganic layer, a third organic layer and a second inorganic layer which are stacked in sequence, and the second inorganic layer is located on a side of the first inorganic layer away from the substrate; The first inorganic layer extends from the display area to the non-display area, covers the first retaining wall, and extends to a side of the first retaining wall away from the display area; and / or, the third organic layer extends from the display area to the non-display area, and the third organic layer is located on a side of the first retaining wall away from the display area and close to the display area; and / or, the second inorganic layer extends from the display area to the non-display area, covers the first retaining wall, and extends to a side of the first retaining wall away from the display area; Preferably, on a side of the first retaining wall away from the display area, the second organic layer covers the first organic layer; Preferably, the display panel further comprises a third inorganic layer, and the third inorganic layer is located on a surface of the second organic layer away from the substrate; the third inorganic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area; Preferably, on a side of the first retaining wall away from the display area, the third inorganic layer is in contact with the second inorganic layer and / or the first inorganic layer; Preferably, the display panel further comprises: a second retaining wall located in the non-display area and located on a side of the first retaining wall away from the display area; the first organic layer is located on a side of the second retaining wall close to the display area; the second organic layer is located on a side of the second retaining wall close to the display area; the third inorganic layer is in contact with the second inorganic layer and / or the first inorganic layer on a side of the second retaining wall away from the display area; and / or the second inorganic layer is in contact with the first inorganic layer on a side of the second retaining wall away from the display area; Preferably, the touch layer comprises a second conductive layer, a fourth organic layer and a third conductive layer stacked in sequence, wherein the second conductive layer is located on a side of the third conductive layer close to the substrate; the fourth organic layer extends from the display area to the non-display area, and extends to a side of the first retaining wall away from the display area; Preferably, on a side of the first retaining wall away from the display area, the second organic layer covers the fourth organic layer, and / or the fourth organic layer covers the first organic layer; Preferably, the fourth organic layer is located on a side of the second barrier wall close to the display area.

7. The display panel according to claim 6, characterized in that: The display panel further comprises a light emitting device layer, which is located between the substrate and the encapsulation layer and is located in the display area; Preferably, the substrate comprises a flexible substrate; Preferably, the display panel is a foldable display panel.

8. A method for preparing a display panel, characterized in that: include: preparing a packaging layer on a substrate; Prepare a first organic layer on a surface of the encapsulation layer away from the substrate; preparing a touch layer on a surface of the first organic layer away from the substrate; A second organic layer is prepared on a surface of the touch layer away from the substrate.

9. The preparation method according to claim 8, characterized in that: The touch layer includes a second conductive layer, a fourth organic layer and a third conductive layer which are stacked, and preparing the touch layer on a surface of the first organic layer away from the substrate includes: On a surface of the first organic layer away from the substrate, a second conductive layer, a fourth organic layer and a third conductive layer are sequentially stacked; Preferably, after preparing the second organic layer on the surface of the touch layer away from the substrate, the method further comprises: preparing a third inorganic layer on the surface of the second organic layer away from the substrate; Preferably, after preparing the third inorganic layer on the surface of the second organic layer away from the substrate, the method further comprises: A black matrix is ​​prepared on a side of the second organic layer away from the substrate, and a plurality of openings are formed in the black matrix; preparing a color resist unit in the opening; Preferably, after the color resist unit is prepared in the opening, the method further comprises: preparing a fifth organic layer covering the color resist unit and the black matrix on a surface of the black matrix away from the substrate.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 7, or a display panel prepared by the preparation method according to claim 8 or 9.

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