Display substrate, display screen and preparation method of display substrate

Abstract

The embodiment of the invention provides a display substrate, a display screen and a preparation method of the display substrate. The display substrate comprises a substrate body, a pixel structure, an isolation structure, a touch control structure and a packaging structure. The pixel structure is arranged on the substrate, the isolation structure is arranged between sub-pixels of the pixel structure, the touch structure is arranged on the side, away from the substrate, of the isolation structure, and at least part of touch electrodes in the touch structure are electrically connected with the isolation structure; the packaging structure is used for packaging the pixel structure, the isolation structure and the touch control structure. The touch control structure is arranged on the isolation structure, at least part of the touch control electrodes in the touch control structure are electrically connected with the isolation structure, the isolation structure serves as a part of the touch control structure, then packaging is conducted, the number of film layers of the display substrate is reduced, and the thickness of a display product with the touch control function can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate, a display screen, and a method for preparing the display substrate. Background Art

[0002] With the continuous development of display technology, OLED (Organic Light-Emitting Diode) display products have occupied an important position in the market with their advantages such as excellent image quality, fast response and flexible design, and the demand for OLED display products with touch function is also increasing. In the related technology, when preparing the display substrate of OLED display products, it is usually necessary to prepare at least two touch layers and multiple encapsulation layers on the encapsulation layer after preparing the pixel layer and TFE (Thin Film Encapsulation). However, the display substrate prepared by this method has a large number of film layers, resulting in a larger thickness of the display product with touch function. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a display substrate, a display screen and a method for manufacturing a display substrate, so as to reduce the thickness of a display product with a touch function. The specific technical solution is as follows:

[0004] In a first aspect, an embodiment of the present application provides a display substrate, wherein the display substrate comprises:

[0005] Substrate, pixel structure, isolation structure, touch structure and packaging structure;

[0006] The pixel structure is arranged on the substrate, the isolation structure is arranged between the sub-pixels of the pixel structure, the touch structure is arranged on a side of the isolation structure away from the substrate, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure; the packaging structure is used to package the pixel structure, the isolation structure and the touch structure.

[0007] In a possible implementation, the touch control structure includes a first touch control electrode and a second touch control electrode, and the packaging structure includes a first packaging layer and a first insulating layer; the first packaging layer is arranged on a side of the first insulating layer away from the substrate;

[0008] The first touch electrodes are arranged in the first packaging layer and connected to the isolation structure through first vias in the first insulating layer, the first touch electrodes in the same row are electrically connected, and the first touch electrodes in different rows are not connected;

[0009] The second touch electrodes are arranged in the first packaging layer, the second touch electrodes in the same column are electrically connected via wirings in the first packaging layer, and the second touch electrodes in different columns are not connected.

[0010] In a possible implementation, the isolation structure includes a first metal layer, two first touch electrodes above the same isolation structure are electrically connected to the first metal layer through the first via, and a wiring connecting the second touch electrode is arranged in the gap between the two first touch electrodes.

[0011] In a possible implementation, the touch control structure includes a first touch control electrode and a second touch control electrode, the isolation structure includes a first metal layer, a second metal layer and a third metal layer, the third metal layer is located on a side of the second metal layer close to the substrate, and the first metal layer is located on a side of the second metal layer away from the substrate;

[0012] The first touch electrode and the second touch electrode are arranged on a side of the first metal layer away from the substrate;

[0013] The substrate includes multiple column wirings and multiple walking wirings. The first touch electrodes in the same column are connected to the same column wiring, and the first touch electrodes in different columns are connected to different column wirings; the second touch electrodes in the same row are connected to the same walking wiring, and the second touch electrodes in different rows are connected to different walking wirings.

[0014] In a possible implementation, the pixel structure includes a cathode layer, the isolation structure further includes a pixel defining layer, and the pixel defining layer is disposed on the substrate;

[0015] The first touch electrode and the second touch electrode are made of the material of the cathode layer, and the first touch electrode and the second touch electrode are respectively connected to the cathode layers of different sub-pixels;

[0016] The pixel defining layer is provided with a second via hole, the cathode layer connected to the first touch electrode is electrically connected to the column wiring through the second via hole, and the cathode layer connected to the second touch electrode is electrically connected to the wiring through the second via hole.

[0017] In a possible implementation manner, the sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel;

[0018] The red sub-pixels and the green sub-pixels are alternately arranged in a column direction to form a first pixel column, the blue sub-pixels are repeatedly arranged in a column direction to form a second pixel column, and the first pixel column and the second pixel column are alternately arranged in a row direction;

[0019] The first touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the second touch electrode is located on a side of the first isolation structure close to the green sub-pixel; or, the second touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the first touch electrode is located on a side of the first isolation structure close to the green sub-pixel, wherein the first isolation structure is an isolation structure between the red sub-pixel and the green sub-pixel.

[0020] In a possible implementation, the column wiring is electrically connected to the Tx pin and cathode pin of the driver chip; the walking wiring is electrically connected to the Rx pin and cathode pin of the driver chip; or, the column wiring is electrically connected to the Rx pin and cathode pin of the driver chip; the walking wiring is electrically connected to the Tx pin and cathode pin of the driver chip.

[0021] In a possible implementation, a first electroluminescent layer is included between the first touch electrode and the first metal layer, a second electroluminescent layer is included between the second touch electrode and the first metal layer, and there is no contact between the first electroluminescent layer and the second electroluminescent layer.

[0022] In a second aspect, an embodiment of the present application provides a display screen, comprising any display substrate described in the first aspect.

[0023] In a third aspect, an embodiment of the present application provides a method for preparing a display substrate, the method comprising:

[0024] Forming a substrate, a pixel structure, and an isolation structure, wherein the cathode layer in the pixel structure overlaps the metal isolation column in the isolation structure;

[0025] A touch control structure is prepared on a side of the isolation structure away from the substrate, wherein at least part of the touch control electrodes in the touch control structure are electrically connected to the isolation structure;

[0026] Prepare the subsequent packaging structure.

[0027] In a possible implementation manner, before the step of preparing a touch structure on a side of the isolation structure away from the substrate, the method further includes:

[0028] Preparing a temporary encapsulation layer on the pixel structure and the isolation structure;

[0029] Drilling holes above the first position and the second position of the metal isolation column by a via process;

[0030] preparing a second encapsulation layer on the temporary encapsulation layer;

[0031] Drilling holes above the first position and the second position of the metal isolation column by a via process;

[0032] The step of preparing a touch structure on a side of the isolation structure away from the substrate comprises:

[0033] Preparing a first touch electrode and a second touch electrode on the second packaging layer, wherein the first touch electrode is electrically connected to the metal isolation column through the via holes at the first position and the second position;

[0034] A first insulating layer is prepared on the second encapsulation layer, the first touch electrode and the second touch electrode.

[0035] In a possible implementation, the substrate includes a plurality of column wirings and a plurality of running wirings, and the cathode layers of at least some sub-pixels in the pixel structure are electrically connected to the column wirings or the running wirings through vias; the isolation structure includes a cathode layer;

[0036] A touch control structure is prepared on a side of the isolation structure away from the substrate, comprising:

[0037] A patterning operation is performed on the cathode layer of the isolation structure to generate a first touch electrode and a second touch electrode.

[0038] Beneficial effects of the embodiments of the present application:

[0039] The embodiments of the present application provide a display substrate, a display screen, and a method for preparing a display substrate. The display substrate includes: a substrate, a pixel structure, an isolation structure, a touch structure, and a packaging structure; the pixel structure is arranged on the substrate, the isolation structure is arranged between the sub-pixels of the pixel structure, the touch structure is arranged on the side of the isolation structure away from the substrate, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure; the packaging structure is used to package the pixel structure, the isolation structure, and the touch structure. The touch structure is arranged on the isolation structure, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure. The isolation structure is used as a part of the touch structure and then packaged, which reduces the number of film layers of the display substrate and can reduce the thickness of the display product with touch function.

[0040] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0042] Figure 1 A schematic cross-sectional structure diagram of a first display substrate provided in an embodiment of the present application;

[0043] Figure 2 A schematic cross-sectional structure diagram of a second display substrate provided in an embodiment of the present application;

[0044] Figure 3 A schematic diagram of the arrangement of the first touch electrodes provided in an embodiment of the present application;

[0045] Figure 4 A schematic diagram of the arrangement of the second touch electrodes provided in the embodiment of the present application;

[0046] Figure 5 A schematic cross-sectional structure diagram of a third display substrate provided in an embodiment of the present application;

[0047] Figure 6 A schematic cross-sectional structure diagram of a fourth display substrate provided in an embodiment of the present application;

[0048] Figure 7 A schematic top view of a sub-pixel arrangement provided in an embodiment of the present application;

[0049] Figure 8a A schematic diagram of the wiring of the first touch electrode provided in an embodiment of the present application;

[0050] Figure 8b A schematic diagram of the wiring of the second touch electrode provided in an embodiment of the present application;

[0051] Fig. 9 A schematic cross-sectional structure diagram of a fifth display substrate provided in an embodiment of the present application;

[0052] Fig.10 A schematic flow chart of a first method for preparing a display substrate provided in an embodiment of the present application;

[0053] Fig.11 A schematic flow chart of a second method for preparing a display substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0055] With the continuous development of display technology, OLED display products have occupied an important position in the market with their advantages such as excellent image quality, fast response and flexible design. With the emergence of various types of mobile terminal products (such as smart phones, tablet computers, smart watches, etc.), the demand for OLED display products with touch functions is also increasing. In the related art, when preparing the display substrate of the OLED display product, it is usually after preparing the pixel layer and TFE, the touch part is continued to be prepared above the encapsulation layer. However, the display substrate prepared by this method has a complex structure, resulting in a large thickness of the display product with a touch function, which is not only not conducive to the miniaturization of the device, but also increases the production cost. How to simplify the structure of the display substrate containing the touch structure and reduce the thickness of the display product with a touch function has become a problem that needs to be further solved. Based on this, the embodiment of the present application proposes a display substrate, a display screen and a method for preparing a display substrate.

[0056] In a first aspect of the embodiments of the present application, a display substrate is provided. Figure 1 , is a schematic cross-sectional structure diagram of a first display substrate provided in an embodiment of the present application, wherein the display substrate comprises:

[0057] Substrate 1, pixel structure 2, isolation structure 3, touch structure 4 and packaging structure 5;

[0058] The pixel structure 2 is arranged on the substrate 1, the isolation structure 3 is arranged between the sub-pixels of the pixel structure 2, the touch structure 4 is arranged on a side of the isolation structure 3 away from the substrate 1, and at least part of the touch electrodes in the touch structure 4 are electrically connected to the isolation structure 3; the packaging structure 5 is used to package the pixel structure 2, the isolation structure 3 and the touch structure 4.

[0059] In the display substrate provided in the embodiment of the present application, substrate 1 is located at the bottom layer. Substrate 1 is a composite film layer used to arrange transistors and other structures in the pixel circuit, which may include TFT (Thin Film Transistor) and various wirings, etc. Substrate 1 can be a glass substrate or a silicon substrate. Its specific structure can be referred to the prior art and is not specifically limited in this application.

[0060] A pixel structure 2 is arranged on the substrate 1. It can be understood that the pixel structure 2 includes a plurality of sub-pixels, and generally the sub-pixels include red sub-pixels, green sub-pixels, and blue sub-pixels. The isolation structure 3 is arranged between two different sub-pixels to isolate sub-pixels of different colors. The touch structure 4 is a structure used to realize the touch function in the display substrate, which is arranged on the side of the isolation structure 3 away from the substrate 1, and at least part of the touch electrodes are electrically connected to the isolation structure 3. For example, the touch electrodes in the row direction or the column direction can be electrically connected to the isolation structure 3, or all the touch electrodes can be electrically connected to the isolation structure 3. The packaging structure 5 is used to package the pixel structure 2, the isolation structure 3 and the touch structure 4. In order to ensure the packaging effect, the packaging structure can have more than one layer, that is, it can be a single-layer packaging structure or a multi-layer packaging structure.

[0061] From the above, it can be seen that in the display substrate provided in the embodiment of the present application, the touch structure is arranged on the isolation structure, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure. The isolation structure is used as a part of the touch structure and then packaged, which reduces the number of film layers of the display substrate and can reduce the thickness of the display product with touch function.

[0062] In one possible implementation, see Figure 2 , is a schematic cross-sectional structure diagram of a second display substrate provided in an embodiment of the present application, wherein the touch structure 4 includes a first touch electrode 41 and a second touch electrode 42, and the packaging structure 5 includes a first packaging layer 51 and a first insulating layer 52; the first packaging layer 51 is disposed on a side of the first insulating layer 52 away from the substrate 1;

[0063] The first touch electrodes 41 are disposed in the first packaging layer 51 and connected to the isolation structure 3 through the first via holes in the first insulating layer 52. The first touch electrodes in the same row are electrically connected, and the first touch electrodes in different rows are not connected.

[0064] The second touch electrodes 42 are disposed in the first packaging layer 51 . The second touch electrodes in the same column are electrically connected via wiring in the first packaging layer, and the second touch electrodes in different columns are not connected.

[0065] In the display substrate of the embodiment of the present application, the encapsulation structure 5 includes a first encapsulation layer 51 and a first insulating layer 52. The first encapsulation layer 51 is arranged on the side of the first insulating layer 52 away from the substrate 1. The material of the first encapsulation layer 51 can be an inorganic insulating material. The first insulating layer 52 is prepared with insulating material. In addition to the insulating function, the first insulating layer 52 is also used to achieve flattening of the hierarchical structure to facilitate the preparation of subsequent film layers.

[0066] The touch electrode 4 includes a first touch electrode 41 and a second touch electrode 42. Figure 2 The position of a first touch electrode 41 and a second touch electrode 42 is schematically shown. The first touch electrode 41 and the second touch electrode 42 are arranged in the first packaging layer above the isolation column, wherein two adjacent first touch electrodes 41 are connected to the isolation structure 3 through the first via hole in the first insulating layer 52, and the isolation structure 3 is used as a bridge electrode to realize the electrical connection between the two first touch electrodes 41. The first touch electrodes in the same row are electrically connected, and the first touch electrodes in different rows are not connected. The second touch electrode 42 is arranged in the first packaging layer 51, and in the first packaging layer 51, between the two bridged first touch electrodes 41, a wiring for connecting the second touch electrode 42 is also arranged, and the second touch electrodes in the same column are electrically connected through the wiring in the first packaging layer, and the second touch electrodes in different columns are not connected. In the embodiment of the present application, the first touch electrode and the second touch electrode can adopt a self-capacitive structure or a mutual-capacitive structure, both of which are within the protection scope of the present application.

[0067] In one possible implementation, see Figure 2 The isolation structure 3 includes a first metal layer 31, and two first touch electrodes above the same isolation structure are electrically connected to the first metal layer through the first via holes, and the wiring connecting the second touch electrodes is arranged in the gap between the two first touch electrodes.

[0068] In the embodiment of the present application, the isolation structure includes a first metal layer 31, and the material of the first metal layer 31 can be titanium (Ti). Figure 3 , Figure 3 This is a schematic diagram of the arrangement of the first touch electrodes provided in the embodiment of the present application, which corresponds to Figure 2 The touch electrode structure comprises a plurality of rows of first touch electrodes and a plurality of columns of second touch electrodes, Figure 3 Four rows of first touch electrodes and two columns of second touch electrodes are schematically drawn in the figure. The number of first touch electrodes and second touch electrodes in each row and column is five. In actual application, the number of rows of first touch electrodes, the number of columns of second touch electrodes and the number of two touch electrodes can be set according to actual needs, and this application does not limit this. The first touch electrodes are connected through bridge electrodes. In the embodiment of this application, the first metal layer 31 of the isolation structure can be used as a bridge electrode, and each row of first touch electrodes and each column of touch electrodes are connected to the driver chip through wiring.

[0069] It is understandable that there is no electrical connection between the first touch electrode and the second touch electrode. This is because the first touch electrode in the embodiment of the present application uses the first metal layer of the isolation structure as a bridge electrode, and the second touch electrode is connected through the wiring set in the first packaging layer. The wiring of the second touch electrode and the bridge electrode are not in the same film layer, so there is no connection between the two touch electrodes. For the first touch electrodes on different isolation structures, electrical connection can be achieved through wiring in the cathode layer or the substrate, or by wiring in the first packaging layer. The top view is shown in FIG. Figure 3 shown.

[0070] It can be seen from the above that the display substrate provided in the embodiment of the present application can use the first metal layer of the isolation structure as the bridge electrode of the first touch structure, without the need for separate wiring to achieve connection between the first touch electrodes.

[0071] In another possible implementation, the second touch electrode may also be arranged between two first touch electrodes on different isolation columns, that is, the first touch electrode and the second touch electrode are arranged alternately. In order to reduce the impact on the transmittance, the material of the touch electrode may be selected to be indium tin oxide (ITO), see Figure 4 , is a schematic diagram of the arrangement of the second touch electrodes provided in an embodiment of the present application, including a plurality of rows of first touch electrodes and a plurality of columns of second touch electrodes, Figure 4 Four rows of first touch electrodes and four columns of second touch electrodes are schematically drawn in the figure. The number of first touch electrodes and second touch electrodes in each row and column is five. In actual applications, the number of rows of first touch electrodes, the number of columns of second touch electrodes and the number of two touch electrodes can be set according to actual needs, and this application does not impose any restrictions on this. In this case, the first touch electrodes on the same isolation structure are connected through bridge electrodes, and the first touch electrodes on different isolation structures can be electrically connected through the cathode layer or the wiring in the substrate. In addition, each row of first touch electrodes and each column of touch electrodes also need to be connected to the driver chip through wiring to realize the detection of the touch position.

[0072] For an example, see Figure 5, is a schematic diagram of the cross-sectional structure of the third display substrate provided in an embodiment of the present application, comprising a substrate 1, a pixel structure comprising a cathode layer 21, an electroluminescent layer 22, and an anode layer 23, wherein the cathode layer 21 is arranged on the electroluminescent layer 22 on a side away from the substrate 1; an isolation structure comprising a first metal layer 31, a second metal layer 32, a third metal layer 33, and a pixel defining layer 34, wherein the first metal layer 31 and the third metal layer 33 may be Ti metal layers, and the second metal layer 32 may be an AL metal layer; the touch electrode comprises a first touch electrode 41 and a second touch electrode 42; the encapsulation structure comprises a first encapsulation layer 51, a first insulating layer 52, a protective layer 53, a second encapsulation layer 54, and a temporary encapsulation layer 55, wherein the second encapsulation layer 54 and the temporary encapsulation layer 55 are used to encapsulate and protect the pixel structure, and the materials thereof may be inorganic materials, the first insulating layer 52 plays an insulating role, and realizes the flattening of the hierarchical structure, and may specifically be an OC (Over Coat, insulating cover) layer to facilitate the preparation of subsequent film layers, and its material can be organic glass material. The first packaging layer 51 and the protective layer 53 are used to encapsulate and protect the touch structure, and its material can be inorganic material. In one possible embodiment, the cathode layer 21 can also overlap with the third metal layer 33 and the second metal layer 32 of the isolation structure, and the first touch electrodes 41 in the same row on different isolation structures can be electrically connected through the isolation structure and the cathode layer 21. In another possible embodiment, the first touch electrodes 41 in the same row on different isolation structures can be electrically connected by routing in the first packaging layer, and its top view is shown in FIG. Figure 3 shown. Figure 5 There is a residual structure of the cathode layer 21 and the electroluminescent layer 22 between the second packaging layer 54 and the first metal layer 31 , and a hole may be punched in the residual structure by etching technology to achieve connection between the first touch electrode 41 and the first metal layer 31 .

[0073] In one possible implementation, see Figure 6 , is a schematic cross-sectional structure diagram of a fourth display substrate provided in an embodiment of the present application, wherein the touch structure 4 includes a first touch electrode 41 and a second touch electrode 42, the isolation structure 3 includes a first metal layer 31, a second metal layer 32 and a third metal layer 33, the third metal layer 33 is located on a side of the second metal layer 32 close to the substrate 1, and the first metal layer 31 is located on a side of the second metal layer 32 away from the substrate 1;

[0074] The first touch electrode 41 and the second touch electrode 42 are arranged on a side of the first metal layer 31 away from the substrate 1;

[0075] The substrate 1 includes a plurality of row wirings and a plurality of running wirings ( Figure 6(not shown), the first touch electrodes in the same column are connected to the same column wiring, and the first touch electrodes in different columns are connected to different column wirings; the second touch electrodes in the same row are connected to the same wiring, and the second touch electrodes in different rows are connected to different wirings.

[0076] The touch electrodes of the display substrate of the embodiment of the present application include a first touch electrode and a second touch electrode, and the first touch electrode and the second touch electrode can be a self-capacitive structure or a mutual-capacitive structure. The isolation structure includes a first metal layer, a second metal layer and a third metal layer. In one example, the materials of the first metal layer and the third metal layer can be the same material, such as Ti, and the material of the second metal layer can be Al. A plurality of column routings and a plurality of routings are arranged in the bottom substrate, and the column routings and the routings are located in different film layers. The first touch electrodes in the same column are connected to the same column routing, and the first touch electrodes in different columns are connected to different column routings; the second touch electrodes in the same row are connected to the same routing, and the second touch electrodes in different rows are connected to different routings. Through such a routing connection method, the first touch electrodes in the same column can be connected, the second touch electrodes in the same row can be connected, and the touch electrodes in different rows and columns are not connected, which can improve the accuracy of touch.

[0077] In one possible implementation, see Figure 6 , the pixel structure 2 includes a cathode layer 21, the isolation structure 3 further includes a pixel defining layer 34, and the pixel defining layer 34 is disposed on the substrate;

[0078] The first touch electrode 41 and the second touch electrode 42 are made of the material of the cathode layer 21, and the first touch electrode 41 and the second touch electrode 42 are respectively connected to the cathode layers of different sub-pixels;

[0079] The pixel defining layer 34 is provided with a second via hole, and the cathode layer connected to the first touch electrode 41 is electrically connected to the column wiring through the second via hole, and the cathode layer connected to the second touch electrode 42 is electrically connected to the wiring through the second via hole.

[0080] In the embodiment of the present application, the pixel structure includes a cathode layer, and the first touch electrode and the second touch electrode are made of the material of the cathode layer, which can be a metal material or an alloy material, such as Figure 6As shown, the first touch electrode 41, the second touch electrode 42 and the cathode layer 21 are made of the same material, which is indicated by the same background filling, and the first touch electrode 41 and the second touch electrode are respectively connected to the cathode layer of the sub-pixel close to them. The isolation structure includes a pixel definition layer (Pixel Definition Layer, PDL), which can not only divide the light-emitting area of ​​the sub-pixel and reduce the color mixing between adjacent pixels, but also, by setting a second via hole on the pixel definition layer, the cathode layer connected to the first touch electrode can be electrically connected to the column wiring arranged in the substrate through the second via hole, and the cathode layer connected to the second touch electrode can be electrically connected to the wiring arranged in the substrate through the second via hole.

[0081] In a possible implementation manner, the sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel;

[0082] The red sub-pixels and the green sub-pixels are alternately arranged in a column direction to form a first pixel column, the blue sub-pixels are repeatedly arranged in a column direction to form a second pixel column, and the first pixel column and the second pixel column are alternately arranged in a row direction;

[0083] The first touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the second touch electrode is located on a side of the first isolation structure close to the green sub-pixel; or, the second touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the first touch electrode is located on a side of the first isolation structure close to the green sub-pixel, wherein the first isolation structure is an isolation structure between the red sub-pixel and the green sub-pixel.

[0084] See also Figure 7 , is a top view schematic diagram of a sub-pixel arrangement provided in an embodiment of the present application, R is a red sub-pixel, G is a green sub-pixel, and B is a blue sub-pixel. In this schematic diagram, the red sub-pixel and the green sub-pixel are sub-pixels isolated by a first isolation structure, and the first touch electrode is arranged on a side close to the red sub-pixel, and the second touch electrode is arranged on a side close to the green sub-pixel. In another embodiment, the first touch electrode can also be arranged on a side close to the green sub-pixel, and the second touch electrode can be arranged on a side close to the red sub-pixel.

[0085] In a possible implementation, the column wiring is electrically connected to the Tx pin and cathode pin of the driver chip; the walking wiring is electrically connected to the Rx pin and cathode pin of the driver chip; or, the column wiring is electrically connected to the Rx pin and cathode pin of the driver chip; the walking wiring is electrically connected to the Tx pin and cathode pin of the driver chip.

[0086] In the embodiment of the present application, Tx (transmitting electrode) and Rx (receiving electrode) can be used as the first touch electrode and the second touch electrode respectively. Tx can be the first touch electrode and Rx can be the second touch electrode, or Tx can be the second touch electrode and Rx can be the first touch electrode. Figure 8a , is a schematic diagram of the wiring of the first touch electrode provided in an embodiment of the present application, in which R is a red sub-pixel, G is a green sub-pixel, and B is a blue sub-pixel. The cathode of the red sub-pixel is connected to Tx, and the cathode of the green sub-pixel is connected to Rx. The cathode / Tx wiring of the red sub-pixel, the cathode / Rx wiring of the green sub-pixel, and the cathode wiring of the blue sub-pixel are performed only. Each wiring is connected to the corresponding pin on the driver chip, wherein each wiring is a vertical wiring. See Figure 8b , is a schematic diagram of the routing of the second touch electrode provided in an embodiment of the present application, the cathode / Rx routing of the green sub-pixel is a horizontal routing, and the cathode / Tx routing of the red sub-pixel and the cathode routing of the blue sub-pixel are located in the same film layer, and the cathode / Rx routing of the green sub-pixel is located in another film layer, that is, the routings are not connected to each other. In another embodiment, the cathode of the red sub-pixel can be connected to Rx, and the cathode of the green sub-pixel can be connected to Tx, and the cathode / Rx routing of the red sub-pixel, the cathode / Tx routing of the green sub-pixel, and the cathode routing of the blue sub-pixel are performed, and each routing is connected to the corresponding pin on the driver chip. The driver chip can drive the cathode and the touch electrode by a time-sharing driving method. For example, assuming that a driving cycle is 10ms, the driver chip can be set to drive the cathode in the first 5ms of 10ms and drive the touch electrode in the last 5ms, or to drive the cathode in the first 6ms of 10ms and drive the touch electrode in the last 4ms, etc.

[0087] In the embodiment of the present application, two different touch electrodes are connected through the cathode layer of the red sub-pixel and the cathode layer of the green pixel respectively, and each wiring is connected to the corresponding pin on the driver chip, and the sub-pixel cathode and touch electrode are driven by a time-sharing drive method.

[0088] In a possible implementation, a first electroluminescent layer is included between the first touch electrode and the first metal layer, a second electroluminescent layer is included between the second touch electrode and the first metal layer, and there is no contact between the first electroluminescent layer and the second electroluminescent layer.

[0089] In the embodiment of the present application, a first electroluminescent layer is included between the first touch electrode and the first metal layer, and a second electroluminescent layer is included between the second touch electrode and the first metal layer. During pixel etching in the preparation process, it is necessary to ensure that the first electroluminescent layer and the second electroluminescent layer on the first metal layer are separated, that is, there is no contact between the two.

[0090] For an example, see Fig. 9 , is a schematic diagram of the cross-sectional structure of the fifth display substrate provided in an embodiment of the present application, comprising a substrate 1, a pixel structure comprising a cathode layer 21, an electroluminescent layer 22, and an anode layer 23; an isolation structure comprising a first metal layer 31, a second metal layer 32, a third metal layer 33, and a pixel defining layer 34, wherein the first metal layer 31 and the third metal layer 33 may be Ti materials, and the second metal layer 32 may be Al materials; a packaging structure comprising a first packaging layer 51, a first insulating layer 52, a second packaging layer 54, and a temporary packaging layer 55, wherein the second packaging layer 54 and the temporary packaging layer 55 are used to package and protect the pixel structure, and the materials thereof may be inorganic materials, the first insulating layer 52 plays an insulating role and realizes the flattening of the hierarchical structure to facilitate the preparation of subsequent film layers, and in an embodiment of the present application, the first insulating layer 52 may be prepared by inkjet printing technology (IJP), and the first packaging layer 51 is used to package and protect the touch structure, and the materials thereof may be inorganic materials.

[0091] A second aspect of the embodiments of the present application provides a display screen, comprising a display substrate as described in any one of the first aspects above.

[0092] In a third aspect of the embodiments of the present application, a method for preparing a display substrate is provided. Fig.10 , is a schematic flow chart of a first display substrate preparation method provided in an embodiment of the present application, comprising the following steps S101-S103.

[0093] Step S101: forming a substrate, a pixel structure, and an isolation structure, wherein a cathode layer in the pixel structure is overlapped with a metal isolation column in the isolation structure.

[0094] A specific implementation of the above step S101 may include the following steps A-H.

[0095] Step A: forming a substrate and an isolation column layer.

[0096] Step B: etching and removing the isolation column layer at the first position.

[0097] Step C: evaporating a first sub-pixel and forming a first temporary encapsulation layer, wherein a first cathode of the first sub-pixel is overlapped with the metal of the isolation column layer.

[0098] Step D: etching and removing the first sub-pixels and the first temporary encapsulation layer at the second position and the third position.

[0099] Step E: evaporating a second sub-pixel and forming a second temporary encapsulation layer, wherein a second cathode of the second sub-pixel is overlapped with the metal of the isolation column layer.

[0100] Step F: etching and removing the second sub-pixel and the second temporary encapsulation layer at the first position and the third position.

[0101] Step G: evaporating a third sub-pixel and forming a third temporary encapsulation layer, wherein a third cathode of the third sub-pixel is overlapped with the metal of the isolation column layer.

[0102] Step H: etching and removing the third sub-pixel and the third temporary encapsulation layer at the first position and the second position.

[0103] The first position, the second position and the third position are positions where three sub-pixels of different colors are formed. The first temporary encapsulation layer, the second temporary encapsulation layer and the third temporary encapsulation layer are all the above-mentioned Figure 5 The temporary encapsulation layer in the display substrate embodiment is only a temporary encapsulation layer that needs to be prepared once for each sub-pixel during the preparation process. In order to distinguish different preparation times, the temporary encapsulation layer is referred to as the first temporary encapsulation layer, the second temporary encapsulation layer, and the third temporary encapsulation layer in this embodiment. Among them, etching away the sub-pixels at other positions includes etching away the cathode and the temporary encapsulation layer corresponding to the sub-pixel. The collection of all sub-pixels finally formed is the pixel structure, and the collection of isolation columns is the isolation structure.

[0104] Step S102: preparing a touch control structure on a side of the isolation structure away from the substrate, wherein at least part of the touch control electrodes in the touch control structure are electrically connected to the isolation structure.

[0105] In one possible implementation, see Fig.11 , is a schematic flow chart of a second method for preparing a display substrate provided in an embodiment of the present application, which includes the following steps S104 to S107 before the above-mentioned step S102.

[0106] Step S104: preparing a temporary encapsulation layer on the pixel structure and the isolation structure.

[0107] Step S105: drilling holes above the first position and the second position of the metal isolation column by a via process.

[0108] Step S106: preparing a second encapsulation layer on the temporary encapsulation layer.

[0109] Step S107: drilling holes above the first position and the second position of the metal isolation column by a via process.

[0110] The materials of the temporary encapsulation layer and the second encapsulation layer may be inorganic materials.

[0111] The above step S102 includes the following steps S102A-S102B.

[0112] Step S102A: preparing a first touch electrode and a second touch electrode on the second packaging layer, wherein the first touch electrode is electrically connected to the metal isolation column through the via holes at the first position and the second position.

[0113] Step S102B: preparing a first insulating layer on the second packaging layer, the first touch electrodes and the second touch electrodes.

[0114] The material of the first insulating layer may be an organic material, or may be prepared by an inkjet printing process (IJP).

[0115] Step S103: preparing a subsequent packaging structure.

[0116] After the touch structure and the first insulating layer are prepared, a first encapsulation layer (such as depositing an inorganic film layer) may be further prepared to cover the touch structure, and an organic film layer may be coated on the first encapsulation layer to protect and planarize the electrodes.

[0117] From the above, it can be seen that the display substrate preparation method provided in the embodiment of the present application, by setting the touch structure on the side of the isolation structure away from the substrate, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure, and then packaging is performed, it is possible to simplify the structure of the display substrate including the touch structure and reduce the thickness of the display product with touch function.

[0118] In a possible implementation, the substrate includes a plurality of column wirings and a plurality of running wirings, and the cathode layers of at least some sub-pixels in the pixel structure are electrically connected to the column wirings or the running wirings through vias; the isolation structure includes a cathode layer;

[0119] A touch control structure is prepared on a side of the isolation structure away from the substrate, comprising:

[0120] A patterning operation is performed on the cathode layer of the isolation structure to generate a first touch electrode and a second touch electrode.

[0121] In the display substrate preparation method provided in the embodiment of the present application, a plurality of column wirings and a plurality of running wirings are arranged in the substrate, the cathode layer of at least some sub-pixels in the pixel structure is electrically connected to the column wirings or the running wirings through vias, and the cathode layer on the isolation structure is patterned to generate a first touch electrode and a second touch electrode, wherein the formed first touch electrode and the second touch electrode can be a self-capacitive structure or a mutual-capacitive structure.

[0122] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0123] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the display screen and display substrate preparation method embodiments, since they are basically similar to the display substrate embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the display substrate embodiment.

[0124] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A display substrate, characterized in that: The display substrate comprises: Substrate, pixel structure, isolation structure, touch structure and packaging structure; The pixel structure is arranged on the substrate, the isolation structure is arranged between the sub-pixels of the pixel structure, the touch structure is arranged on a side of the isolation structure away from the substrate, and at least part of the touch electrodes in the touch structure are electrically connected to the isolation structure; the packaging structure is used to package the pixel structure, the isolation structure and the touch structure.

2. The display substrate according to claim 1, characterized in that: The touch control structure includes a first touch control electrode and a second touch control electrode, and the packaging structure includes a first packaging layer and a first insulating layer; the first packaging layer is arranged on a side of the first insulating layer away from the substrate; The first touch electrodes are arranged in the first packaging layer and connected to the isolation structure through first vias in the first insulating layer, the first touch electrodes in the same row are electrically connected, and the first touch electrodes in different rows are not connected; The second touch electrodes are arranged in the first packaging layer, the second touch electrodes in the same column are electrically connected via wirings in the first packaging layer, and the second touch electrodes in different columns are not connected.

3. The display substrate according to claim 2, characterized in that: The isolation structure includes a first metal layer, two first touch electrodes above the same isolation structure are electrically connected to the first metal layer through the first via holes, and a wiring connecting the second touch electrodes is arranged in a gap between the two first touch electrodes.

4. The display substrate according to claim 1, characterized in that: The touch control structure includes a first touch control electrode and a second touch control electrode, the isolation structure includes a first metal layer, a second metal layer and a third metal layer, the third metal layer is located on a side of the second metal layer close to the substrate, and the first metal layer is located on a side of the second metal layer away from the substrate; The first touch electrode and the second touch electrode are arranged on a side of the first metal layer away from the substrate; The substrate includes multiple column wirings and multiple walking wirings. The first touch electrodes in the same column are connected to the same column wiring, and the first touch electrodes in different columns are connected to different column wirings; the second touch electrodes in the same row are connected to the same walking wiring, and the second touch electrodes in different rows are connected to different walking wirings.

5. The display substrate according to claim 4, characterized in that: The pixel structure includes a cathode layer, and the isolation structure further includes a pixel defining layer, and the pixel defining layer is disposed on the substrate; The first touch electrode and the second touch electrode are made of the material of the cathode layer, and the first touch electrode and the second touch electrode are respectively connected to the cathode layers of different sub-pixels; The pixel defining layer is provided with a second via hole, the cathode layer connected to the first touch electrode is electrically connected to the column wiring through the second via hole, and the cathode layer connected to the second touch electrode is electrically connected to the wiring through the second via hole.

6. The display substrate according to claim 5, characterized in that: The sub-pixels include a red sub-pixel, a green sub-pixel and a blue sub-pixel; The red sub-pixels and the green sub-pixels are alternately arranged in a column direction to form a first pixel column, the blue sub-pixels are repeatedly arranged in a column direction to form a second pixel column, and the first pixel column and the second pixel column are alternately arranged in a row direction; The first touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the second touch electrode is located on a side of the first isolation structure close to the green sub-pixel; or, the second touch electrode is located on a side of the first isolation structure close to the red sub-pixel, and the first touch electrode is located on a side of the first isolation structure close to the green sub-pixel, wherein the first isolation structure is an isolation structure between the red sub-pixel and the green sub-pixel.

7. The display substrate according to claim 5, characterized in that: The column wiring is electrically connected to the Tx pin and cathode pin of the driver chip; the walking wire is electrically connected to the Rx pin and cathode pin of the driver chip; or, the column wiring is electrically connected to the Rx pin and cathode pin of the driver chip; the walking wire is electrically connected to the Tx pin and cathode pin of the driver chip.

8. The display substrate according to claim 5, characterized in that: A first electroluminescent layer is included between the first touch electrode and the first metal layer, a second electroluminescent layer is included between the second touch electrode and the first metal layer, and there is no contact between the first electroluminescent layer and the second electroluminescent layer.

9. A display screen, characterized in that: Comprising the display substrate described in any one of claims 1-8.

10. A method for preparing a display substrate, characterized in that: The method comprises: Forming a substrate, a pixel structure, and an isolation structure, wherein the cathode layer in the pixel structure overlaps the metal isolation column in the isolation structure; A touch control structure is prepared on a side of the isolation structure away from the substrate, wherein at least part of the touch control electrodes in the touch control structure are electrically connected to the isolation structure; Prepare the subsequent packaging structure.

11. The method according to claim 10, characterized in that Before the step of preparing a touch structure on a side of the isolation structure away from the substrate, the method further includes: Preparing a temporary encapsulation layer on the pixel structure and the isolation structure; Drilling holes above the first position and the second position of the metal isolation column by a via process; preparing a second encapsulation layer on the temporary encapsulation layer; Drilling holes above the first position and the second position of the metal isolation column by a via process; The step of preparing a touch structure on a side of the isolation structure away from the substrate comprises: Preparing a first touch electrode and a second touch electrode on the second packaging layer, wherein the first touch electrode is electrically connected to the metal isolation column through the via holes at the first position and the second position; A first insulating layer is prepared on the second encapsulation layer, the first touch electrode and the second touch electrode.

12. The method according to claim 10, characterized in that The substrate includes a plurality of column wirings and a plurality of running wirings, and the cathode layers of at least some sub-pixels in the pixel structure are electrically connected to the column wirings or the running wirings through vias; the isolation structure includes a cathode layer; A touch control structure is prepared on a side of the isolation structure away from the substrate, comprising: A patterning operation is performed on the cathode layer of the isolation structure to generate a first touch electrode and a second touch electrode.

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