Micro-optical module for evaluating optical current sensor and method for manufacturing same

Abstract

The invention relates to a micro-optical module (1) for evaluating an optical current sensor, a method for producing the micro-optical module, and a method for assembling a printed circuit board, in which the micro-optical module (1) has at least one housing (2) comprising at least one predetermined holder (3) for at least one optical and / or electro-optical component (4). At least one housing (2) with at least one predetermined holder (3) is produced by 3D printing.

Description

Technical Field

[0001] The invention relates to a micro-optical module for evaluating optical current sensors and its production, as well as a method for assembling a circuit board, wherein the micro-optical module comprises at least one housing comprising at least one predetermined holder for at least one optical and / or electro-optical component. Background Art

[0002] The manufacture of electronic components and modules can be carried out in a simple and cost-effective manner in large quantities and with high quality, both manually and in a semi-automatic and fully automatic manner. In this case, circuit boards, in particular printed circuit boards (PCBs), can be assembled with electrical components such as resistors, capacitors and other electronic components. Photodiodes convert light into electric current and are mounted in standard housings and likewise do not cause problems for modern circuit board assembly machines. However, only simple binary or analog intensity measurements can be made using photodiodes.

[0003] More complex optical structures, including for example beam splitting, polarization filtering, interference filtering, fiber coupling, cannot be manufactured with high quality directly on the circuit board by assembly machines or by hand. These are realized separately from the circuit board in independent high-precision optical structures. For the optical components, very precise clamping or fixing is required, sometimes with temperature compensation. This leads to high material and manufacturing costs and thus to high product costs. Therefore, in the case of low-cost products, the use of optical structures is omitted if possible.

[0004] If optical sensors are required, only those are used which reduce the property to be detected to an intensity measurement. This also applies to optical current sensors. As a result, the functional scope of the components and / or modules is limited.

[0005] Measuring instruments that use optical components inside are constructed according to the principles of free-beam optics or fiber optics. If the free-beam optics method is used, any optical structure that does not exceed the dimensions specified for the product can be obtained. For these structures, optical components that are large and heavy compared to microelectronics are used, the material value of these components is very high. The manufacturing of free-beam optical structures is carried out in dust-reduced clean rooms. It requires very costly precision optomechanical fixtures that are adjusted to micrometer accuracy by a skilled staff in a laborious manufacturing process.

[0006] A second possibility, the use of optical fibers, is the development of free-beam optics. In this case, handling the very sensitive optical fibers is time-consuming and also requires well-trained personnel. In addition, not all optical components are available as fiber-optic components or can be obtained from suppliers in reproducible quality. Optical fibers and available optical components are very sensitive to temperature and shocks, because the beam propagates in an optical medium that changes its optical properties under pressure and temperature changes. If the beam propagates over long distances in the optical fiber, then these effects become even more pronounced, resulting in a high risk of errors.

[0007] Both methods of realizing the optical structure are incompatible with the assembly of electronic circuit boards. Summary of the invention

[0008] The object of the present invention is to propose a micro-optical module, a method for manufacturing the same and a method for manufacturing a circuit board that solve the above-mentioned problems. In particular, the object of the present invention is to provide a simple, cost-effective and stable micro-optical module, to specify a simple possibility of manufacturing the micro-optical module, and to specify its use in connection with a circuit board.

[0009] According to the invention, this object is achieved by a micro-optical module for evaluating an optical current sensor having the features of claim 1, a method for manufacturing a micro-optical module for evaluating an optical current sensor, in particular a micro-optical module as described above, according to claim 11, and / or a method for manufacturing a circuit board comprising the above-described micro-optical module, according to claim 12. Advantageous embodiments of the micro-optical module for evaluating an optical current sensor according to the invention are specified in the dependent claims. In this case, the subject matter of the main claim can be combined with the features of the dependent claims, and the features of the dependent claims can be combined with each other.

[0010] The micro-optical module for evaluating an optical current sensor according to the invention comprises at least one housing comprising at least one predetermined holder for at least one optical and / or electro-optical component. According to the invention, at least one housing with at least one predetermined holder is produced by 3D printing.

[0011] 3D printing makes it possible to provide a stable housing for a micro-optical module for evaluating an optical current sensor in a simple and cost-effective manner, the housing having at least one predetermined fixture or having predetermined fixtures for optical and / or electro-optical components. 3D printing makes it possible to produce fixtures for components in the housing with high precision and small deviations in a simple and cost-effective manner, which meets the high requirements for the adjustment of optical and / or electro-optical components. Complex readjustments and settings manually by highly qualified and expensive staff can be omitted.

[0012] The at least one housing can be made of metal and / or include metal, in particular aluminum, steel, copper, bronze and / or tungsten carbide. These materials are temperature-resistant, show little volume change in the event of temperature changes, are mechanically and long-term stable, are cost-effective, and can be easily processed by 3D printing.

[0013] At least one housing can include at least one device for fastening to a circuit board, in particular for manual and / or automatic assembly of the circuit board. This allows simple, cost-effective assembly of the circuit board with the micro-optical module, in particular manual, semi-automatic and / or fully automatic assembly.

[0014] The housing can be configured as an SMD or through-hole component for manual and / or automated assembly of circuit boards. This allows simple, cost-effective production of circuit boards assembled with micro-optical modules without the need to re-adjust the optical and / or electro-optical components on the circuit board, with the advantages described above.

[0015] The housing may comprise a micro-optical module having at least one optical and / or electro-optical component. The micro-optics in the housing may be manufactured in a simple and cost-effective manner without complex readjustment of the individual optical and / or electro-optical components, since the holders may be produced in 3D printing without significant manufacturing deviations or errors. Thus, the micro-optical module may be produced in a simple and cost-effective manner and may be easily further processed, for example in the assembly of a circuit board.

[0016] The housing may comprise at least one optical filter, at least one optical lens, at least one beam splitter plate and / or at least one polarization beam splitter as optical components. The housing may comprise at least one light emitter, in particular an LED, and / or at least one electro-optical sensor, in particular a photodiode, as electro-optical components. Using such components, micro-optical devices can be produced in a simple and cost-effective manner with a large range of functions, in particular for optical current measurement.

[0017] The housing may comprise at least one holder for an optical fiber. In this way, optical signals, in particular in the case of current measurements, can be easily and reliably coupled into and / or out of the micro-optical module.

[0018] The dimensions of the housing, in particular height, length and width, may be in the range of millimeters to a few centimeters, for example in the range of 1 to 10 millimeters and / or in the range of 1 millimeter to 10 centimeters. Thus, the dimensions of the micro-optical module are in a range that is very suitable for a circuit board.

[0019] The weight of the micro-optical module may be in the gram range, in particular in the range of 1 to 100 grams. Thus, the micro-optical module, in particular on a circuit board, is unlikely to experience significant vibrations and movements, which could lead to damage or even destruction. A low mass corresponds to a low material usage, which is associated with low costs. As described above, in this way the disadvantages of optical structures with high mass and large dimensions can be avoided.

[0020] According to the method for manufacturing a micro-optical module for evaluating an optical current sensor, in particular the above-mentioned micro-optical module, the micro-optical module has at least one housing including at least one predetermined fixture for at least one optical and / or electro-optical component, the method comprising producing at least one housing having at least one predetermined fixture by 3D printing.

[0021] The method according to the invention for manufacturing a circuit board comprising at least one micro-optical module as described above comprises assembling the circuit board with at least one micro-optical module, in particular configured as an SMD or through-hole component, manually and / or using at least one assembly machine.

[0022] The advantages of the method according to the invention for producing a micro-optical module for evaluating an optical current sensor, in particular a micro-optical module as described above, according to claim 11, and the advantages of the method according to the invention for producing a circuit board comprising at least one micro-optical module as described above, according to claim 12, are analogous to the above-described advantages of the micro-optical module according to the invention for evaluating an optical current sensor, according to claim 1, and vice versa. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the following, embodiments of the invention are schematically shown in the drawings and are described in more detail below.

[0024] In the figure:

[0025] Figure 1 is a schematic diagram of a micro-optical module 1 for evaluating an optical current sensor according to the invention, the micro-optical module 1 comprising a holder 3 for an optical and / or electro-optical component 4 in a housing, the holder 3 being manufactured by 3D printing, and

[0026] Figure 2 yes Figure 1 Schematic diagram of a micro-optical module 1 comprising a cover 10 arranged on a circuit board 8, an optical fiber 7 and terminals 9 for an electro-optical component 4. DETAILED DESCRIPTION

[0027] Figure 1is a schematic plan view of a micro-optical module 1 for evaluating an optical current sensor according to the invention. The micro-optical module 1 comprises a housing 2 which can be easily manufactured by 3D printing, in particular very precisely in terms of dimensions, with low manufacturing tolerances, and with low cost and effort. The housing 2 is made of metal and / or comprises metal, in particular aluminum, steel, copper, bronze and / or tungsten carbide, for example, which leads to high mechanical stability, in particular long-term stability, with a stable shape, even in the event of temperature changes. A holder 3 for an optical and / or electro-optical component 4 is formed in the housing 2.

[0028] The highly mechanical and temperature-stable shape of the housing 2 allows the optical and / or electro-optical components 4 to be accurately, particularly aligned, held or carried and / or arranged in the housing 2. Expensive readjustments in terms of time and personnel are omitted. The optical component 4 is, for example, an optical filter, an optical lens, a beam splitter or a beam splitter, and / or a polarizing beam splitter or a polarizing filter. The electro-optical component 4 is, for example, a light emitter, in particular an LED, and an electro-optical sensor, in particular a photodiode. These are configured as, for example, micro-optical devices, i.e., small in size, in particular in the range of a few millimeters to a few centimeters, and light in weight, in particular in the range of one gram to a few grams. The housing 2 is also configured to have small dimensions, i.e., measured values, in particular height, length and width, in the range of, for example, millimeters up to a few centimeters, in particular in the range of 1 to 10 millimeters and / or in the range of 1 millimeter to 10 centimeters, and weight, for example, in the range of grams, in particular in the range of 1 to 100 grams, allowing a small and light micro-optical module 1.

[0029] The micro-optical module 1 can be mounted or arranged on a circuit board 8, the micro-optical module 1 having, for example, dimensions in the range of millimeters to several centimeters, in particular dimensions in the range of 1 to 10 millimeters and / or in the range of 1 millimeter to 10 centimeters, and having, for example, a weight in the range of grams, in particular a weight in the range of 1 to 100 grams. The low weight means that the circuit board 8 is only slightly damaged in the event of vibrations of the micro-optical module 1, and damage or even destruction of the assembled circuit board 8 can be prevented. The assembly or arrangement of the micro-optical module 1 on the circuit board 8 is performed, for example, manually or using an assembly machine. For this purpose, the micro-optical module 1 is configured, for example, as an SMD (surface mounted device) and / or a through-hole component, i.e., for example, has a device 5 for fixing the micro-optical module 1 on the circuit board 8. The device 5 comprises, for example, soldered joints and / or drilled holes or through-holes, by which the micro-optical module 1 can be arranged or positioned and / or fastened on the circuit board 8, for example, by welding, riveting, bolting and / or screwing.

[0030] Figure 2 yes Figure 1 Schematic diagram of a micro-optical module 1, comprising a cover 10, an optical fiber 7 and a terminal 9 for an electro-optical component 4. Figure 2 In the embodiment of the present invention, the micro-optical module 1 is arranged on a circuit board 8. The optical signal to be processed, in particular the optical signal for current measurement, is coupled or fed into the micro-optical module 1, for example, via an optical fiber 7, the end of which is arranged in a holder 6 formed in the housing 2.

[0031] The holder 3 for components 4 such as electro-optical sensors and optical components, i.e. in 3D printing with a shaped or predetermined holder 3, already integrated in the housing 2 of the micro-optical module 1, makes it possible in particular to arrange electro-optical sensors with terminals 9 at defined positions, wherein, for example, the terminals 9 can emerge from the housing 2 and can be electrically connected to electronic components of a circuit board 8, which are not shown in the figure for the sake of simplicity. Circuits for controlling and processing electrical signals of electro-optical components 4 such as sensors and LEDs arranged in or on the housing 2 of the micro-optical module 1, in particular circuits on the circuit board 8, can be electrically connected to the electro-optical components 4 in this way. The optical parts or optical components 4 can be positioned sufficiently precisely by the integrated optical holder 3, i.e. without adjustment, and contribute to the formation of the predetermined micro-optical device. External optical sensors can be connected to the micro-optical device. Externally connected optical sensors can receive optical input signals, and their returned optical output signals can be coupled into the micro-optical device again. In this case, the light signal or optical signal can optionally be conducted via further miniaturized optical components having different functions and can be used to connect optical sensors for current measurement, which are based on the Faraday effect, for example.

[0032] Figure 1 By way of example, two optical components 4, such as in particular plate-shaped beam splitters and / or polarization beam splitters, are shown in a holder 3. Figure 2 As shown, an optical fiber 7 is fixed in or on the housing 2 in a spatially defined and aligned manner by means of a holder 6. On the opposite side of the housing 2 a holder 3 for an electro-optical component 4, such as an LED, is arranged. Figure 2 The electrical terminals 9 of the electro-optical component 4 are shown by way of example with three bars. These can be connected to circuit components on a circuit board 8. The circuit electrically excites the electro-optical component 4, for example an LED, and the light generated by the LED is coupled into the optical fiber 7 via the beam splitter section.

[0033] The optical fiber 7 passes by an electrical conductor whose current is to be measured or determined, which is not shown in the figure for the sake of simplicity. In the case of a current flowing in the conductor through which the current flows, the light of the LED in the optical fiber 7 is affected or changed by the Faraday effect, depending on the current flow, such as the polarization of the light being changed, which is polarized, for example, when passing through a polarization beam splitter. For example, at the mirror end of the optical fiber 7 (not shown in the figure for the sake of simplicity), the light changed by the current is reflected back and enters the micro-optical module 1 again through the optical fiber 7.

[0034] In each case, two holders 3 for optical and / or electro-optical components 4 are arranged perpendicularly to the optical axis between the LED and the optical fiber 7, on two parallel axes, such as Figure 1 As shown. Figure 2 As shown, the optical and / or electro-optical component 4 is arranged in the holder. For example, a lens as an optical component 4 can be arranged in the holder 3 in order to guide light from the micro-optical module 1 to an external electro-optical component, such as a photodiode, in particular a photodiode on the circuit board 8. Alternatively or additionally or in combination, a photodiode as an optical component 4 can be arranged directly and in a spatially stable manner in the holder 3 in order to measure the light or the intensity of the light and convert it into an electrical signal, which is evaluated, for example, by a component on the circuit board 8.

[0035] The optical signal emerging from the optical fiber 7 after being influenced by the current to be measured or determined and coupled or radiated into the micro-optical module 1 strikes two plate-shaped beam splitters and / or polarization beam splitters and is directed and / or reflected from there to two photodiodes for measurement or intensity determination. As a reference signal, the light and / or polarized light of the LED is directed and / or reflected by two plate-shaped beam splitters and / or polarization beam splitters before entering the optical fiber 7 to two photodiodes opposite the first two photodiodes for measurement or intensity determination. This allows the output signal and the measurement of the optical signal influenced by the current, in particular the intensity measurement, which is converted into an electrical signal that can be compared and / or evaluated by a corresponding circuit on the circuit board 8.

[0036] As a result, the circuit on the circuit board 8 delivers an output signal, for example optically on a display and / or electrically for further processing, which corresponds to a standardized current measurement. The result can be visualized, for example, by comparing the output signal of the LED and / or the polarized light in the optical fiber 7 with the light from the optical fiber 7, wherein the light from the optical fiber 7 is filtered, for example after polarization or polarization change, after passing adjacently through the conductor through which the current flows. The intensity is measured, for example, by a photodiode and processed, for example by an operational amplifier, by an electronic circuit, in particular on the circuit board 8, as an electrical signal or pulse of the photodiode, which is further processed by the electronic circuit, in particular on the circuit board 8, into a signal that depends on the current to be measured. The current intensity, in particular in the range of amperes to kiloamperes, can be determined by the measurement, in particular in high-voltage equipment.

[0037] The above-described embodiments can be combined with each other and / or can be combined with the prior art. Thus, for example, in addition to the current, other physical variables that change the optical signal can also be measured. Further applications of micro-optics are possible. A very wide range of optical and / or electro-optical components 4 can be used for different arrangements and measurements. The structure of the fixture 3 in the housing 2 shown in the figure is only an example of an application. For different components and applications, other arrangements of the fixture 3 with different shapes and numbers of fixtures 3 are possible. The advantage of 3D printing is that for many possible application areas, a micro-optical module 1 can be manufactured in a simple and cost-effective manner, and the micro-optical module 1 has a stable fixture, which allows the optical and / or electro-optical components to be arranged in a simple, cost-effective and long-term stable manner without the need for high personnel costs for adjustment. Small size and low weight allow simple installation on, for example, a PCB (printed circuit board) or a circuit board without the risk of damage in the event of vibration.

[0038] Reference Symbols List

[0039] 1 Micro-optical module

[0040] 2 Housing

[0041] 3. Holders for optical and / or electro-optical components

[0042] 4 Optical and / or electro-optical components

[0043] 5Device for fixing on circuit board

[0044] 6 Holder for optical fiber

[0045] 7. Fiber Optics

[0046] 8 Circuit Board

[0047] 9 Terminals for electro-optical components

[0048] 10 Cover

Claims

1. A micro-optical module (1) for evaluating an optical current sensor, comprising at least one housing (2) comprising at least one predetermined holder (3) for at least one optical and / or electro-optical component (4), characterized in that The at least one housing (2) having the at least one predetermined fixture (3) is manufactured by 3D printing.

2. The micro-optical module (1) according to claim 1, characterized in that: The at least one housing (2) is made of metal and / or comprises metal, in particular aluminum, steel, copper, bronze and / or tungsten carbide.

3. The micro-optical module (1) according to claim 1, characterized in that The at least one housing (2) comprises at least one device (5) for fastening to a circuit board, in particular for manual and / or automatic assembly of a circuit board (8).

4. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) is configured as a SMD or through-hole component for manual and / or automatic assembly of a circuit board (8).

5. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) comprises a micro-optical device having at least one optical and / or electro-optical component (4).

6. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) comprises at least one optical filter, at least one optical lens, at least one beam splitter plate and / or at least one polarization beam splitter as the optical component (4).

7. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) comprises as the electro-optical component (4) at least one light emitter, in particular an LED, and / or at least one electro-optical sensor, in particular a photodiode.

8. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) comprises at least one holder (6) for an optical fiber (7).

9. The micro-optical module (1) according to any one of the preceding claims, characterized in that The housing (2) has measurements in the millimeter range up to several centimeters, in particular measurements of height, length and width, in particular in the range of 1 to 10 millimeters and / or in the range of 1 millimeter to 10 centimeters.

10. The micro-optical module (1) according to any one of the preceding claims, characterized in that The weight of the micro-optical module (1) is in the gram range, in particular in the range of 1 to 100 grams.

11. A method for producing a micro-optical module (1) for evaluating an optical current sensor, in particular a micro-optical module (1) according to any one of the preceding claims, the micro-optical module (1) comprising at least one housing (2) comprising at least one predetermined holder (3) for at least one optical and / or electro-optical component (4), characterized in that The at least one housing (2) having the at least one predetermined fixture (3) is manufactured by 3D printing.

12. A method for manufacturing a circuit board, the circuit board comprising at least one micro-optical module (1) according to any one of claims 1 to 10, characterized in that: The circuit board (8) is assembled with the at least one micro-optical module (1) manually and / or using at least one assembly machine, in particular configured as a SMD or through-hole component.

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