Optical module and optical device

Abstract

The invention provides an optical module and an optical device. The optical module comprises a circuit board; the light receiving component comprises a light receiving chip array and an optical device, the optical device is located above the light receiving chip array, and the light receiving chip array comprises a first light receiving chip and a second light receiving chip; the optical device comprises a demultiplexing substrate, the demultiplexing substrate comprises a reflecting surface, a turning surface and a bottom surface, the reflecting surface is located on one side of the demultiplexing substrate, the turning surface is located on the other side of the demultiplexing substrate, and the bottom surface is located at the bottom of the demultiplexing substrate; a light inlet is formed in the reflecting surface, and an optical signal enters the demultiplexing substrate from the light inlet; a first beam splitting film and a second beam splitting film are arranged on the bottom face and located below the turning face. The turning surface is used for turning the light beams transmitted to the turning surface; the first beam splitting film is located above the first light receiving chip, and the first beam splitting film is located above the second light receiving chip. And the optical module can receive multi-wavelength receiving optical signals conveniently.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module and an optical device. Background Art

[0002] With the development of new services and application modes such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is required to be continuously improved.

[0003] At present, in order to improve the transmission rate of the optical module, multiple transmission channels are set in the optical module, that is, the transmission capacity is improved by multi-channel design in the optical module. For example, the transmission optical signal output by the optical module includes multiple wavelengths, and the receiving optical signal input to the optical module includes multiple wavelengths. Summary of the invention

[0004] The present disclosure provides an optical module and an optical device, which facilitate the optical module to receive multi-wavelength receiving optical signals.

[0005] In a first aspect, the present disclosure provides an optical module, comprising:

[0006] Circuit boards;

[0007] A light receiving component, comprising a light receiving chip array and an optical device, wherein the optical device is located above the light receiving chip array, the optical device is used to transmit a received optical signal to the light receiving chip array, and the light receiving chip array is used to receive the optical signal; wherein the light receiving chip array comprises a first light receiving chip and a second light receiving chip;

[0008] Wherein, the optical device comprises a demultiplexing substrate, the demultiplexing substrate comprises a reflecting surface, a turning surface and a bottom surface, the reflecting surface is located on one side of the demultiplexing substrate, the turning surface is located on the other side of the demultiplexing substrate, and the bottom surface is located at the bottom of the demultiplexing substrate; a light inlet is arranged on the reflecting surface, and the optical signal enters the demultiplexing substrate from the light inlet; a first beam splitting film and a second beam splitting film are arranged on the bottom surface, and the first beam splitting film and the second beam splitting film are located below the turning surface; the turning surface is used to turn the light beam transmitted to the turning surface;

[0009] The first beam splitting film is located above the first light receiving chip, and the first beam splitting film is located above the second light receiving chip.

[0010] In a second aspect, the present disclosure provides an optical module, comprising: a circuit board;

[0011] A light receiving component, comprising a light receiving chip array and an optical device, wherein the optical device is located above the light receiving chip array, the optical device is used to transmit a received optical signal to the light receiving chip array, and the light receiving chip array is used to receive the optical signal; wherein the light receiving chip array comprises a plurality of light receiving chips;

[0012] Wherein, the optical device further comprises a demultiplexing substrate and a lens array, the demultiplexing substrate comprises a reflecting surface, a turning surface and a bottom surface, the reflecting surface is located on one side of the demultiplexing substrate, the turning surface is located on the other side of the demultiplexing substrate, and the bottom surface is located at the bottom of the demultiplexing substrate; a light inlet is arranged on the reflecting surface, and the optical signal enters the demultiplexing substrate from the light inlet; the turning surface is used to turn the light beam transmitted to the turning surface; the lens array is located below the turning surface and connected to the bottom surface, and the lens array is located above the optical receiving chip;

[0013] A beam splitter film array is arranged at the connection between the lens array and the bottom surface, and the beam splitter films in the beam splitter film array selectively transmit the received light signal of the corresponding wavelength according to the wavelength of the received light signal, and the reflecting surface and the turning surface are used to transmit the received light signal of the corresponding wavelength in the received light signal to the corresponding beam splitter film in the beam splitter film array, and the received light signal passing through the corresponding beam splitter film is converged by the corresponding lens in the lens array and transmitted to the corresponding light receiving chip.

[0014] In a third aspect, the present disclosure provides an optical device, comprising: a light receiving component used in an optical module; comprising:

[0015] A demultiplexing substrate, one side of which includes a reflective surface, the other side of which includes a turning surface, and the bottom of which includes a bottom surface; a light inlet is arranged on the reflective surface, and the turning surface is used to turn the light beam transmitted to the turning surface;

[0016] A lens array is located at the bottom of the demultiplexing substrate and below the turning surface; a beam splitting film array is arranged between the lens array and the demultiplexing substrate;

[0017] Among them, the received light signal is incident on the demultiplexing substrate from the light input port, and the received light signal is transmitted between the reflecting surface, the turning surface and the beam splitting film array and is filtered and transmitted by the beam splitting films in the beam splitting film array, so that the light signal of the target wavelength in the received light signal passes through the corresponding beam splitting films in the beam splitting film array and the corresponding lenses in the lens array.

[0018] In the optical module and optical device provided by the present disclosure, the optical device includes a demultiplexing substrate and a lens array, the demultiplexing substrate includes a reflecting surface and a turning surface, and a light inlet is arranged on the reflecting surface; the lens array is located at the bottom of the demultiplexing substrate and a beam splitting film array is arranged at a position in contact with the demultiplexing substrate. In use, the received light signal enters the demultiplexing substrate through the light inlet, the received light signal is transmitted between the turning surface, the beam splitting film array and the reflecting surface and is screened by the beam splitting film array, and the corresponding beam splitting film in the beam splitting film array only allows the corresponding target wavelength of the light signal to pass through and output through the corresponding lens array. Therefore, the optical device provided by the present disclosure can split the received light signal and change the transmission direction, and the light signal output by the optical device can be directly transmitted to the optical receiving chip, which is convenient for the optical module to receive multi-wavelength received light signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0021] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0022] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0023] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 5 A schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 6 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 1 ;

[0026] Figure 7 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 2 ;

[0027] Figure 8 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 3 ;

[0028] Fig. 9 A schematic diagram of the structure of an optical device provided according to some embodiments of the present disclosure Figure 1 ;

[0029] Fig.10 A schematic diagram of the structure of an optical device provided according to some embodiments of the present disclosure Figure 2 ;

[0030] Fig.11 A schematic diagram of the structure of an optical device provided according to some embodiments of the present disclosure Figure 3 ;

[0031] Fig.12 A top view of an optical device provided according to some embodiments of the present disclosure;

[0032] Fig.13 A front view of an optical device provided according to some embodiments of the present disclosure;

[0033] Fig.14 A side view of an optical device provided according to some embodiments of the present disclosure;

[0034] Fig.15 A diagram of an assembly state of an optical device provided according to some embodiments of the present disclosure;

[0035] Fig.16 A partial structure diagram of a second light receiving component provided according to some embodiments of the present disclosure Figure 1 ;

[0036] Fig.17 A schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure Figure 1 ;

[0037] Fig.18 A schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure Figure 2 ;

[0038] Fig.19 is an exploded schematic diagram of a second optical device provided according to some embodiments of the present disclosure;

[0039] Fig. 20 A partial structure diagram of a second light receiving component provided according to some embodiments of the present disclosure Figure 2 ;

[0040] Fig.21 A schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure Figure 1 ;

[0041] Fig. 22A schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure Figure 2 ;

[0042] Fig.23 A partial structural schematic diagram of a third light receiving component provided according to some embodiments of the present disclosure;

[0043] Fig.24 A schematic diagram of the structure of a third optical device provided according to some embodiments of the present disclosure Figure 1 ;

[0044] Fig.25 A schematic diagram of the structure of a third optical device provided according to some embodiments of the present disclosure Figure 2 ;

[0045] Fig.26 is an exploded schematic diagram of a third optical device provided according to some embodiments of the present disclosure;

[0046] Fig. 27 It is a cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0047] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0048] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0049] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0050] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0051] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0052] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0053] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0054] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0055] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0056] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0057] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0058] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0059] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0060] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0061] Figure 3 The present invention is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0062] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0063] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0064] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0065] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the test host; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0066] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0067] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0068] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the test host, or to release the fixed connection between the optical module 200 and the test host.

[0069] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the test host. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the test host, so as to release the snap-fit ​​fixed connection between the optical module 200 and the test host, so that the optical module 200 can be pulled out of the cage 106.

[0070] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0071] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the test host cage.

[0072] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The gold finger is configured to establish an electrical connection with the test host to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0073] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0074] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger. In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors. In some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0075] Figure 5 FIG. 1 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. Figure 5 As shown, the optical transmitting component 400 is embedded in the circuit board 300, and the optical receiving component 500 is arranged on the circuit board 300; a first optical fiber 401 is arranged at one end of the optical transmitting component 400, and a first optical fiber adapter 402 is arranged at one end of the first optical fiber 401; a second optical fiber 501 is arranged at one end of the optical receiving component 500, and a second optical fiber adapter 502 is arranged at one end of the second optical fiber 501; the first optical fiber adapter 402 and the second optical fiber adapter 502 are fixed to the optical port of the optical module. The first optical fiber adapter 402 and the second optical fiber adapter 502 are used to connect to an external optical fiber. The optical signal generated by the optical transmitting component 400 is transmitted to the first optical fiber adapter 402 through the first optical fiber 401, and is coupled to the external optical fiber through the first optical fiber adapter 402; the optical signal from the external optical fiber is coupled to the second optical fiber 501 through the second optical fiber adapter 502, and is transmitted to the optical receiving component 500 through the second optical fiber 501, and the optical receiving component 500 receives the optical signal and converts the received optical signal into an electrical signal.

[0076] In some embodiments, the optical emission component 400 includes an emission cavity, and an optical emission chip array, a lens array, and an optical multiplexing component are arranged inside the emission cavity. The optical emission chip array emits multiple optical signals, the lens array collimates the multiple optical signals, and the optical multiplexing component combines the collimated multiple optical signals into one optical signal, and transmits the optical fiber to the outside. Exemplarily, the optical emission chip array includes four optical emission chips, and the corresponding lens array includes four collimating lenses. The optical emission chip array emits four optical signals (each optical signal has a wavelength), and the four optical signals enter the optical multiplexing component, and are combined into one optical signal by the optical multiplexing component, and then the one optical signal is transmitted to the outside of the optical module through the first optical fiber 401.

[0077] In some embodiments, the optical receiving component 500 includes a protective cover 510, the bottom of the protective cover 510 is connected to the circuit board 300, and the protective cover 510 and the circuit board 300 form a receiving cavity, which can be used to accommodate an optical device that changes the transmission direction of the received optical signal and a device for receiving the optical signal, such as an optical receiving chip. Exemplarily, the optical receiving chip is arranged on the circuit board 300, and the photosensitive surface of the optical receiving chip faces the top direction of the optical module. The optical signal input by the external optical fiber is transmitted to the optical receiving component 500 through the second optical fiber 501, and the optical device therein changes the received optical signal from being transmitted along the extension direction of the second optical fiber 501 to being transmitted along the direction perpendicular to the extension direction of the second optical fiber 501, and finally transmitted to the optical receiving chip.

[0078] In some embodiments, the optical signal inputted by the external optical fiber includes multiple wavelengths, which are transmitted to the optical receiving component 500 through the second optical fiber 501. The optical device in the optical receiving component 500 performs beam splitting according to the wavelength of the received optical signal. The transmission direction of the optical signal after beam splitting is changed and transmitted to the corresponding optical receiving chip accordingly. In the embodiments of the present disclosure, multiple optical receiving components are provided.

[0079] Figure 6 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 1 , Figure 7 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 2 , Figure 8 Schematic diagram of the internal structure of the first light receiving component provided according to some embodiments of the present disclosure Figure 3 .like Figure 6-Figure 8As shown, a light receiving chip array 310 and a transimpedance amplifier 320 are arranged on the circuit board 300, and the light receiving chip array 310 and the transimpedance amplifier 320 are electrically connected to the circuit board 300 respectively; the light receiving chip array 310 and the transimpedance amplifier 320 are located in the accommodating cavity formed by the protective cover 510 and the circuit board 300. The light receiving chip array 310 includes two or more light receiving chips, such as the light receiving chip array 310 includes four light receiving chips. Exemplarily, the light receiving chip array 310 includes a first light receiving chip, a second light receiving chip, a third light receiving chip and a fourth light receiving chip, and the first light receiving chip, the second light receiving chip, the third light receiving chip and the fourth light receiving chip share a substrate. Of course, in some embodiments of the present disclosure, the light receiving chip array 310 and the transimpedance amplifier 320 may not be directly arranged on the circuit board 300, such as the light receiving chip array 310 and the transimpedance amplifier 320 may also be arranged in the light receiving cavity, and the circuit board 300 is electrically connected through an electrical connector, a flexible electrical connection board, etc.

[0080] In some embodiments, the first optical receiving component 500a further includes a first optical device 520 and a substrate 530. The bottom of the substrate 530 is fixedly connected to the circuit board 300, and the top of the substrate 530 is supported and connected to the first optical device 520, so that the light output end of the first optical device 520 is located above the optical receiving chip array 310. The first optical device 520 is used to split the input optical signal according to the wavelength and transmit the split optical signal to the corresponding optical receiving chip. Therefore, the first optical device 520 can not only split the optical signal, but also change the plane where the transmission optical path of the optical signal is located, such as changing the plane where the optical signal transmission optical path is located from a horizontal plane to a vertical plane.

[0081] In some embodiments, according to the number of wavelengths in the received optical signal, the first optical device 520 divides the received optical signal into a corresponding number of optical signals. Exemplarily, the received optical signal includes light beams of four wavelengths of 1271nm / 1291nm / 1311nm / 1331nm, and the first optical device 520 divides the received optical signal into four beams. Of course, if the received optical signal includes light beams of two wavelengths, the first optical device 520 divides the received optical signal into two beams. For example, the received optical signal includes light beams of two wavelengths, a first wavelength optical signal and a second wavelength optical signal, and the optical receiving chip array 310 includes a first optical receiving chip and a second optical receiving chip. The first optical device 520 splits the first wavelength optical signal and the second wavelength optical signal, and correspondingly transmits the first wavelength optical signal to the first optical receiving chip and the second wavelength optical signal to the second optical receiving chip.

[0082] In some embodiments, the first optical receiving component 500a further includes an optical fiber connector 540, which is connected to the other end of the second optical fiber 502 and is used to fix the end of the second optical fiber 502. The light output end of the optical fiber connector 540 is located in the light input direction of the first optical device 520, so as to facilitate coupling the optical signal input through the second optical fiber 502 to the first optical device 520, thereby ensuring the coupling efficiency of the optical signal to the first optical device 520. Exemplarily, the optical fiber connector 540 is arranged on the top surface of the substrate 530, and the substrate 530 fixedly supports the optical fiber connector 540. In some embodiments, the optical fiber connector 540 is a FA capillary connector, which is relatively small in size, so as to facilitate reducing the occupied volume of the optical fiber connector 540 in the optical module and adapt to the small volume packaging requirements of the optical module; and the side of the FA capillary connector is a plane, which is convenient for fixing on the substrate 530. In some embodiments, the optical fiber connector 540 can also use an optical fiber connector with an optical fiber ferrule and a sleeve.

[0083] In some embodiments, the light-emitting surface of the optical fiber connector 540 is an inclined surface, and the inclined surface is used to reduce the optical signal reflected back by the first optical device 520 and the like from re-entering the second optical fiber 502. The inclined angle of the inclined surface is 2-10°, such as 2-7°.

[0084] In some embodiments, the first light receiving component 500a further includes a collimating lens 550, which is disposed between the light outlet of the optical fiber connector 540 and the light inlet of the first optical device 520. The collimating lens 550 is used to collimate the optical signal output by the optical fiber connector 540, so as to convert the divergent light beam output by the optical fiber connector 540 into a collimated light beam, thereby improving the coupling efficiency of the optical signal to the first optical device 520.

[0085] Fig. 9 A schematic diagram of a demultiplexing component provided according to some embodiments of the present disclosure Figure 1 , Fig.10 A schematic diagram of a demultiplexing component provided according to some embodiments of the present disclosure Figure 2 , Fig.11 A schematic diagram of a demultiplexing component provided according to some embodiments of the present disclosure Figure 3 .like Figure 9-11 As shown, the first optical device 520 includes a demultiplexing substrate 521 and a lens array 522 , and the lens array 522 is disposed at the bottom of the demultiplexing substrate 521 .

[0086] One side of the demultiplexing substrate 521 includes a reflective surface 5211, the other side of the demultiplexing substrate 521 includes a turning surface 5212, and the bottom of the demultiplexing substrate 521 includes a bottom surface 5214; the reflective surface 5211 and the turning surface 5212 are used to realize the reflection transmission of the received optical signal in the demultiplexing substrate 521, and the bottom surface 5214 can transmit the received optical signal reflected by the turning surface 5212. A light inlet 5213 is set on the reflective surface 5211, and the light inlet 5213 is used to input the received optical signal into the demultiplexing substrate 521. The lens array 522 is located below the turning surface 5212, and the lens array 522 includes two or more lenses, such as the lens array 522 includes four lenses. The lens is used to transmit and converge the received optical signal to the optical receiving chip. Exemplarily, the lens array 522 includes a first lens 5221, a second lens 5222, a third lens 5223 and a fourth lens 5224. In some embodiments, the reflective surface 5211 is a total reflective surface, and the optical signal inside the demultiplexing substrate 521 is transmitted to the reflective surface 5211 and is totally reflected on the reflective surface 5211. In some embodiments, the lens array 522 may be an integrated lens structure, with multiple protrusion-shaped structures provided on one side to form multiple lenses.

[0087] In some embodiments, the demultiplexing substrate 521 is a straight prism structure, the reflective surface 5211 is perpendicular to the bottom surface 5214, and the angle between the turning surface 5212 and the bottom surface 5214 is less than 90°, so as to control the space occupied by the assembly of the demultiplexing substrate 521 in the optical module. For example, the angle between the turning surface 5212 and the bottom surface 5214 is 45-48°, which can ensure that the distance between the position of the received optical signal transmitted from the bottom surface 5214 and the reflective surface 5211 is within a small range.

[0088] The first optical device 520 further includes a beam splitter film array 523, and the beam splitter film array 523 includes two or more beam splitter films, such as the beam splitter film array 523 includes four beam splitter films. The beam splitter film array 523 is arranged on the bottom surface 5214, and the beam splitter films in the beam splitter film array 523 are correspondingly located at the contact between the lens in the lens array 522 and the demultiplexing substrate 521. Exemplarily, the lens array 522 includes a first lens 5221 and a second lens 5222, and the beam splitter film array 523 includes a first beam splitter film 5231 and a second beam splitter film 5232; the first beam splitter film 5231 is located at the contact between the first lens 5221 and the demultiplexing substrate 521, and the second beam splitter film 5232 is located at the contact between the second lens 5222 and the demultiplexing substrate 521. Correspondingly, if the lens array 522 further includes a third lens 5223 and a fourth lens 5224, the beam splitter film array 523 further includes a third beam splitter film 5233 and a fourth beam splitter film 5234; the third beam splitter film 5233 is located at the contact between the third lens 5223 and the demultiplexing substrate 521, and the fourth beam splitter film 5234 is located at the contact between the fourth lens 5224 and the demultiplexing substrate 521. The beam splitters in the beam splitter film array 523 are used to select and transmit a received optical signal of a target wavelength, such as the first beam splitter film 5231 is used to transmit a first wavelength optical signal, and the second beam splitter film 5232 is used to transmit a second wavelength optical signal, etc.

[0089] In some embodiments, the beam splitters in the beam splitter array 523 are disposed on the bottom surface 5214 of the demultiplexing substrate 521 or on the lenses of the lens array 522. Exemplarily, the first beam splitter 5231 is disposed on the top of the first lens 5221, the second beam splitter 5232 is disposed on the top of the second lens 5222, and the top of the first lens 5221 and the top of the second lens 5222 are connected to the demultiplexing substrate 521, respectively.

[0090] In some embodiments, a convergence surface is provided at the bottom of the lens in the lens array 522, and the convergence surface focuses the transmitted light signal, so that the light signal converges and is transmitted to the light receiving chip array, thereby improving the coupling efficiency of the received light signal to the light receiving chip in the light receiving chip array. Exemplarily, a convergence surface is provided at the bottom of the first lens 5221, and the convergence surface focuses and transmits the first wavelength light signal, so that the first wavelength light signal converges and is transmitted to the first light receiving chip; a convergence surface is provided at the bottom of the second lens 5222, and the convergence surface focuses and transmits the second wavelength light signal, so that the second wavelength light signal converges and is transmitted to the second light receiving chip. In some embodiments, anti-reflection films are respectively provided on the convergence surfaces to improve the transmittance of the received light signal.

[0091] In some embodiments, the first optical device 520 further includes a coupling prism 524, one end of the coupling prism 524 is used for incident light signals, and the other end of the coupling prism 524 is connected to the reflective surface 5211 of the demultiplexing substrate 521. The received light signal is coupled into the demultiplexing substrate 521 through the coupling prism 524. A light incident end face 5241 is provided at one end of the coupling prism 524, and the light incident end face 5241 is an inclined surface, that is, the light incident end face 5241 is not perpendicular to the central axis of the coupling prism 524; the received light signal is refracted through the inclined light incident end face 5241, so that the received light signal is deflected, so that the received light signal is obliquely transmitted to the demultiplexing substrate 521, which is convenient for the transmission of the received light signal, and controls the distance between the lenses in the lens array 522, which is convenient for the setting of the lens array 522. The inclination angle of the light incident end face 5241 is 5-12°, such as 7-10°. Exemplarily, the other end of the coupling prism 524 is connected to one end of the reflective surface 5211 , and the coupling prism 524 is located at the edge of the end of the reflective surface 5211 .

[0092] In some embodiments, an anti-reflection film is disposed on the light incident end face 5241 to improve the coupling efficiency of the received light signal to the coupling prism 524 .

[0093] Fig.12 is a top view of a demultiplexing component provided according to some embodiments of the present disclosure, Fig.13 is a side view of a demultiplexing component provided according to some embodiments of the present disclosure, Fig.14 A front view of a demultiplexing component provided according to some embodiments of the present disclosure; Figure 12-14 A splitting optical path diagram of a received optical signal is shown in FIG. 1 , where the received optical signal includes four wavelengths, λ1, λ2, λ3 and λ4. Figure 12-14As shown, the received light signal including wavelengths of λ1, λ2, λ3 and λ4 is horizontally transmitted to the coupled prism 524, and refracted at the light incident end face 5241, so that the transmission direction of the received light signal is deflected and transmitted to the turning surface 5212; the received light signal is reflected by the turning surface 5212, so that the received light signal is transmitted in the direction of the first lens 5221; the received light signal is transmitted to the first beam splitter film 5231, the light signal with a wavelength of λ1 passes through the first beam splitter film 5231 and is converged by the first lens 5221 and output from the first optical device 520, and the light signals with wavelengths of λ2, λ3 and λ4 are reflected by the first beam splitter film 5231. The optical signal including the wavelengths of λ2, λ3 and λ4 is reflected by the first beam splitter film 5231 and transmitted to the turning surface 5212, reflected by the turning surface 5212 and transmitted to the reflecting surface 5211, reflected by the reflecting surface 5211 and then transmitted to the turning surface 5212; reflected by the turning surface 5212 and transmitted in the direction of the second lens 5222, transmitted to the second beam splitter film 5232, the optical signal with a wavelength of λ2 passes through the second beam splitter film 5232 and is converged by the second lens 5222 and output from the first optical device 520, and the optical signals with wavelengths of λ3 and λ4 are reflected by the second beam splitter film 5232. The optical signal including the wavelengths of λ3 and λ4 is reflected by the second beam splitter film 5232 and transmitted to the turning surface 5212, reflected by the turning surface 5212 and transmitted to the reflecting surface 5211, reflected by the reflecting surface 5211 and then transmitted to the turning surface 5212; reflected by the turning surface 5212 and transmitted in the direction of the third lens 5223, transmitted to the third beam splitter film 5233, the optical signal with a wavelength of λ3 passes through the third beam splitter film 5233 and is converged by the third lens 5223 and output from the first optical device 520, and the optical signal with a wavelength of λ4 is reflected by the third beam splitter film 5233. The light signal with wavelength λ4 is reflected by the third beam splitter film 5233 and transmitted to the turning surface 5212, reflected by the turning surface 5212 and transmitted to the reflecting surface 5211, reflected by the reflecting surface 5211 and then transmitted to the turning surface 5212; reflected by the turning surface 5212 and transmitted in the direction of the fourth lens 5224, transmitted to the fourth beam splitter film 5234, passed through the third beam splitter film 5233 and converged by the third lens 5223, and output from the first optical device 520.

[0094] Fig.15 FIG. 1 is an assembly state diagram of a demultiplexing component provided according to some embodiments of the present disclosure. Fig.15 As shown, when assembling the first optical device 520, the first optical device 520 is first set on the substrate 530, so that one end of the bottom of the first optical device 520 is connected to the substrate 530 and the other end is suspended; then the optical fiber connector 540 and the collimating lens 550 are coupled and fixed, and the first optical device 520, the optical fiber connector 540 and the collimating lens 550 are coupled to the optical receiving chip through the substrate 530 carrying the first optical device 520, the optical fiber connector 540 and the collimating lens 550, and finally the substrate 530 and the circuit board 300 are fixedly connected.

[0095] The first optical device 520 provided in the embodiment of the present disclosure can not only realize beam splitting according to the wavelength of the received optical signal, but also change the transmission direction of the optical signal, that is, the first optical device 520 provided in the present disclosure integrates the functions of beam splitting and changing the transmission of the received optical signal. And compared with the use of arrayed waveguide grating (AWG) in some embodiments, the optical waveguide chip in the AWG is used to split the light in the form of a waveguide, thereby reducing the insertion loss. In some demultiplexing components, the received optical signal input in the horizontal direction and the received optical signal after beam splitting are output in the horizontal direction. They need to be converged and turned by focusing lenses, turning prisms, etc., and then transmitted to the optical receiving chip. There are many devices involved, and the optical path coupling is difficult. Therefore, the first optical device 520 provided in the present disclosure increases the integration of the demultiplexing component and simplifies the difficulty of optical path coupling.

[0096] In some embodiments, if total reflection cannot be achieved through the reflective surface 5211, a high-reflective film is provided on the reflective surface 5211 to improve the reflectivity of the reflective surface 5211. Exemplarily, the surface of the reflective surface 5211 is coated with a high-reflective film.

[0097] In some embodiments, a high-reflection film is disposed on the turning surface 5212 to help improve the reflectivity of the turning surface 5212 .

[0098] The first optical device 520 provided in the embodiment of the present disclosure is not limited to being used in the first optical receiving component 500a provided in the above embodiment. In some embodiments, the optical receiving component 500 includes an optical receiving cavity, and a receiving cavity is provided on the optical receiving cavity. The optical receiving chip, the first optical device 520, etc. are arranged in the receiving cavity to carry the optical receiving chip, the first optical device 520, etc. through the optical receiving cavity.

[0099] Fig.16 A partial structure diagram of a second light receiving component provided according to some embodiments of the present disclosure Figure 1 .like Fig.16As shown, the second optical receiving component 500b includes a second optical device 560 and an optical receiving chip array 310, the light input end of the second optical device 560 is connected to the second optical fiber 501, the light output end of the second optical device 560 is located above the optical receiving chip array 310, and the optical receiving chip array 310 is arranged on the circuit board 300. The received optical signal transmitted by the second optical fiber 501 is input to the second optical device 560, and is transmitted to the optical receiving chip array 310 after the second optical device 560 changes the transmission direction. In some embodiments, the second optical fiber 501 can be used to transmit received optical signals including different wavelengths, and the second optical device 560 transmits the received optical signals of different wavelengths to the corresponding optical receiving chips in the optical receiving chip array 310. Exemplarily, the second optical fiber 501 can be used to transmit received optical signals of 4 different wavelengths, the optical receiving chip array 310 includes 4 optical receiving chips, and the second optical device 560 transmits the received optical signals of 4 different wavelengths to the corresponding optical receiving chips.

[0100] In some embodiments, the second optical fiber 501 includes one optical fiber, so that the second optical receiving component 500b receives a beam of received optical signals through the second optical fiber 501. Of course, the embodiments of the present disclosure are not limited to the second optical fiber 501 including one optical fiber; the second optical fiber 501 may also include two optical fibers. Exemplarily, the second optical fiber 501 includes two optical fibers, each of which is used to transmit received optical signals of four different wavelengths, and the optical receiving chip array 310 includes eight optical receiving chips, and each four of them receive received optical signals of four wavelengths transmitted by one optical fiber.

[0101] Fig.17 A schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure Figure 1 , Fig.18 A schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure Figure 2 , Fig.19 FIG. 1 is a schematic diagram of an exploded view of a second optical device provided according to some embodiments of the present disclosure. Figure 17-Figure 19 As shown, the second optical device 560 includes a first optical fiber fixing portion 561 , an AWG 562 , a first supporting plate 563 and a lens array 522 .

[0102] The first optical fiber fixing portion 561 is fixedly connected to the end of the second optical fiber 501 to fix and support the end of the second optical fiber 501. Exemplarily, the end of the second optical fiber 501 extends from one end of the first optical fiber fixing portion 561 to the other end of the first optical fiber fixing portion 561. AWG562 and the first support plate 563 are located at the other end of the first optical fiber fixing portion 561, and AWG562 and the first support plate 563 are respectively connected to the first optical fiber fixing portion 561; the second optical fiber 501 is optically coupled to the AWG562, so that the light receiving optical signal transmitted by the second optical fiber 501 is coupled to the AWG562; the first support plate 563 is located below the AWG562, so that the first support plate 563 supports and connects the AWG562.

[0103] One end of AWG562 is the light input end, and the other end is the light output end. AWG562 can filter the transmitted light signal according to the wavelength of the received light signal to split the received light signals of different wavelengths. For example, when the light signals including 4 wavelengths enter the AWG562 through the light input end, 4 received light signals of a single wavelength will be output from the light output end of AWG562.

[0104] The lens array 522 is located below the light-emitting end of the AWG 562, and the lens array 522 is connected to the first support plate 563, and the first support plate 563 supports and connects the lens array 522, so that the lens array 522 is suspended above the light receiving chip array 310. Exemplarily, the top of the lens array 522 is connected to the first support plate 563, and the bottom of the lens array 522 forms a plurality of protrusions, and each light outlet in the AWG 562 is located above the corresponding protrusion.

[0105] The first support plate 563 is made of a light-transmitting material, such as glass, so that the light receiving optical signal output by the AWG 562 can pass through the first support plate 563 and be transmitted to the lens array 522 via the first support plate 563 .

[0106] In some embodiments, the other end of the first optical fiber fixing portion 561 is provided with a first connection surface 5611, which is a flat end surface formed at the end of the first optical fiber fixing portion 561; the first connection surface 5611 connects the light input end of the AWG 562 and one end of the first support plate 563. The second optical fiber 501 is inserted into the first optical fiber fixing portion 561, and the first connection surface 5611 is flush with the end surface of the second optical fiber 501.

[0107] In some embodiments, the first support plate 563 is bonded and fixed to the AWG 562. Exemplarily, a first fixed support surface 5631 is provided on the top of the first support plate 563, and a first overflow glue groove 5632 is provided on the first fixed support surface 5631. The first fixed support surface 5631 is bonded to the bottom of the AWG 562 by glue, and the AWG 562 covers the top of the first overflow glue groove 5632. In some embodiments, the first overflow glue groove 5632 is close to one end of the first support plate 563 connected to the lens array 522 to prevent glue from overflowing and contaminating the light output end of the AWG 562.

[0108] In some embodiments, the length of the first support plate 563 is greater than the length of the AWG 562, so that the end surface of the other end of the first support plate 563 exceeds the light-emitting end of the AWG 562. The other end of the first support plate 563 exceeds the light-emitting end of the AWG 562, which can protect the light-emitting end of the AWG 562 and effectively reduce the damage to the light-emitting end of the AWG 562 caused by collision.

[0109] In some embodiments, a first lens mounting surface 5633 is disposed at the bottom of the first support plate 563 , and the first lens mounting surface 5633 is disposed at the edge of the other end of the first support plate 563 ; the top of the lens array 522 is connected to the first lens mounting surface 5633 .

[0110] In some embodiments, the first lens mounting surface 5633 is an inclined surface, and the first lens mounting surface 5633 is inclined from the bottom surface of the first support plate 563 to the direction where the top surface of the first support plate 563 is located, so that the normal line of the first lens mounting surface 5633 is not perpendicular to the extension direction of the second optical fiber 501. The inclination angle of the first lens mounting surface 5633 is 5-10°, such as the inclination angle of the first lens mounting surface 5633 is 8°.

[0111] Fig. 20 A partial structure diagram of a second light receiving component provided according to some embodiments of the present disclosure Figure 2 , Fig. 20 FIG. 3 shows an optical path of a received optical signal from the optical output end of AWG562 to the optical receiving chip array 310. Fig. 20 As shown, the received optical signal after splitting by AWG562 is incident on the first support plate 563 and transmitted to the first lens mounting surface 5633, refracted by the first lens mounting surface 5633 and transmitted to the lens array 522, and converged by the corresponding lenses in the lens array 522 and transmitted to the corresponding optical receiving chip of the optical receiving chip array 310.

[0112] In the disclosed embodiment, the first support plate 563 can both support and fix the AWG562 and install the lens array 522, so as to facilitate the installation of the lens array 522 below the AWG562, ensure the assembly accuracy between the AWG562 and the lens array 522, and ensure the coupling efficiency of the received optical signal output by the AWG562 to the optical receiving chip array 310. In addition, an inclined first lens mounting surface 5633 is provided on the first support plate 563 for mounting the lens array 522, so that the optical axis of the lens array 522 is not perpendicular to the photosensitive surface of the optical receiving chip, which can prevent the optical signal reflected by the photosensitive surface of the optical receiving chip from returning to the lens array 522, thereby reducing the return loss caused by the reflected optical signal; and the inclined first lens mounting surface 5633 can make the optical axis of the received optical signal output by the AWG562 parallel to the optical axis of the lens array 522, increase the coupling efficiency of the received optical signal output by the AWG562 to the lens array 522, and thereby ensure the coupling efficiency of the received optical signal to the optical receiving chip array 310.

[0113] Fig.21 A schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure Figure 1 , Fig. 22 A schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure Figure 2 .like Fig.21 and Fig. 22 As shown, in the second optical device 560, two second optical fibers 501 are connected to the first optical fiber fixing portion 561, so that the second optical receiving component 500b can receive two beams of received optical signals, each of which includes multiple wavelength optical signals. Correspondingly, the lens array 522 includes more lenses, and the optical receiving chip array 310 includes more optical receiving chips.

[0114] Fig.23 FIG. 1 is a partial structural diagram of a third type of light receiving component provided according to some embodiments of the present disclosure. Fig.23 As shown, the third optical receiving component 500c includes a third optical device 570 and an optical receiving chip array 310. The third optical device 570 is connected to the second optical fiber 501. The light output end of the third optical device 570 is located above the optical receiving chip array 310. The optical receiving chip array 310 is arranged on the circuit board 300. The third optical device 570 fixes the end of the second optical fiber 501 and transmits the optical signal output by the second optical fiber 501 to the optical receiving chip array 310.

[0115] In some embodiments, the second optical fiber 501 includes multiple optical fibers, which are used to realize that the third optical receiving component 500c receives multiple beams of received optical signals. Exemplarily, the second optical fiber 501 includes four optical fibers, and the four optical fibers transmit four beams of received optical signals of different wavelengths; the optical receiving chip array 310 includes four optical receiving chips, and each optical receiving chip corresponds to receiving a received optical signal transmitted by an optical fiber. Of course, in the embodiment of the present disclosure, the number of optical fibers in the second optical fiber 501 is not limited to four, and can also be two, three, eight, etc.

[0116] Fig.24 A schematic diagram of the structure of a third optical device provided according to some embodiments of the present disclosure Figure 1 , Fig.25 A schematic diagram of the structure of a third optical device provided according to some embodiments of the present disclosure Figure 2 , Fig.26 FIG. 1 is a schematic diagram of an exploded view of a third optical device provided according to some embodiments of the present disclosure. Figure 24-26 As shown, the third optical device 570 includes an optical fiber fixture 571 and a lens array 522. The optical fiber fixture 571 is connected to the end of the second optical fiber 501, and the lens array 522 is located below the end of the second optical fiber 501. A reflective end face 5011 is provided at the end of the optical fiber in the second optical fiber 501. The reflective end face 5011 is used to reflect the received optical signal, so as to reflect and transmit the received optical signal transmitted by the second optical fiber 501 to the lens array 522. Exemplarily, the end of the second optical fiber 501 is embedded with the optical fiber fixture 571, and the reflective end face 5011 is exposed outside the optical fiber fixture 571, and the reflective end face 5011 is located above the lens array 522. A lens mounting surface is provided at the top edge of the optical fiber fixture 571, and the lens mounting surface is an inclined surface. The top of the lens array 522 is connected to the lens mounting surface, so that the lens array 522 is suspended below the reflective end face 5011.

[0117] In some embodiments, the reflective end face 5011 is an inclined face, and the received optical signal transmitted by the second optical fiber 501 is totally reflected at the reflective end face 5011. Exemplarily, the inclination angle of the reflective end face 5011 is 46-50°, such as 48°.

[0118] In some embodiments, the optical fiber fixing member 571 includes a second optical fiber fixing portion 5711, a second supporting plate 5712, and an upper cover plate 5713. The second optical fiber fixing portion 5711 is fixedly connected to the end of the second optical fiber 501 to fix and support the end of the second optical fiber 501. Exemplarily, the end of the optical fiber in the second optical fiber 501 extends from one end of the second optical fiber fixing portion 5711 to the other end of the second optical fiber fixing portion 5711. The second supporting plate 5712 is connected to the second optical fiber fixing portion 5711, and the second supporting plate 5712 supports the end of the second optical fiber 501, so that multiple optical fibers in the second optical fiber 501 are arranged side by side and evenly spaced from each other; the upper cover plate 5713 covers and connects the second optical fiber fixing portion 5711 and the second supporting plate 5712, so that the second supporting plate 5712 and the upper cover plate 5713 wrap the end of the second optical fiber 501, so that multiple optical fibers in the second optical fiber 501 are arranged side by side in the optical fiber fixing member 571.

[0119] The lens array 522 is connected to the second support plate 5712, and the second support plate 5712 supports and connects the lens array 522, so that the lens array 522 is suspended above the light receiving chip array 310. Exemplarily, the top of the lens array 522 is connected to the second support plate 5712, and the bottom of the lens array 522 forms a plurality of protrusions, and the reflective end face 5011 of the optical fiber in the second optical fiber 501 is located above the corresponding protrusions.

[0120] The second support plate 5712 is made of a light-transmitting material, such as glass, so that the light receiving optical signal output by the second optical fiber 501 can pass through the second support plate 5712 and be transmitted to the lens array 522 via the second support plate 5712 .

[0121] In some embodiments, the top support of the second optical fiber fixing part 5711 is connected to the upper cover plate 5713, and the side of the second optical fiber fixing part 5711 is connected to the second support plate 5712. Exemplarily, the top of the second optical fiber fixing part 5711 is provided with a second connection surface 5711a, and the side of the second optical fiber fixing part 5711 is provided with a third connection surface 5711b; the second connection surface 5711a is supported and connected to one end of the bottom of the upper cover plate 5713, and the third connection surface 5711b is connected to the end of the second support plate 5712. The top of the third connection surface 5711b is lower than the second connection surface 5711a, so that the second optical fiber 501 passing through the second optical fiber fixing part 5711 is located on the top surface of the second support plate 5712, so as to fix each optical fiber in the second optical fiber 501.

[0122] In some embodiments, the first assembly surface 5713a and the second assembly surface 5713b of the upper cover plate 5713 are located higher than the second assembly surface 5713b, and a step is formed between the first assembly surface 5713a and the second assembly surface 5713b; the first assembly surface 5713a is assembled and connected to the second optical fiber fixing portion 5711, and the second assembly surface 5713b is assembled and connected to the second support plate 5712. Exemplarily, the first assembly surface 5713a is assembled and connected to the second connection surface 5711a, and the second assembly surface 5713b is assembled and connected to the top of the second support plate 5712.

[0123] In some embodiments, a plurality of optical fiber assembly grooves 5713 c are provided on the second assembly surface 5713 b , and the optical fiber assembly grooves 5713 c are used to assemble and connect optical fibers in the second optical fiber 501 .

[0124] In some embodiments, the second support plate 5712 is bonded and fixed to the upper cover plate 5713. Exemplarily, a second fixed support surface 5712a is provided on the top of the second support plate 5712, and a second overflow glue groove 5712b is provided on the second fixed support surface 5712a; the second fixed support surface 5712a is bonded to the upper cover plate 5713 by glue, and the upper cover plate 5713 covers the second overflow glue groove 5712b, and the second overflow glue groove 5712b can prevent the glue from contaminating the end face of the optical fiber in the second optical fiber 501. Exemplarily, the second overflow glue groove 5712b is close to one end of the second support plate 5712 connected to the lens array 522, and is used to prevent the glue from overflowing and contaminating the reflective end face 5011 of the optical fiber in the second optical fiber 501.

[0125] In some embodiments, the other end of the second support plate 5712 extends beyond the other end of the upper cover plate 5713, and the end face of the optical fiber in the second optical fiber 501 is flush with the other end of the upper cover plate 5713, so that the end face of the optical fiber in the second optical fiber 501 is protected by the second support plate 5712, effectively reducing damage to the end face of the optical fiber in the second optical fiber 501 caused by collision.

[0126] In some embodiments, a second lens mounting surface 5712c is disposed on the top of the second support plate 5712, and the second lens mounting surface 5712c is disposed on the edge of the other end of the second support plate 5712; the top of the lens array 522 is connected to the second lens mounting surface 5712c.

[0127] In some embodiments, the second lens mounting surface 5712c is an inclined surface, so that the normal line of the second lens mounting surface 5712c is not perpendicular to the extension direction of the second optical fiber 501. The inclination angle of the second lens mounting surface 5712c is 5-10°, such as 8°.

[0128] Fig. 27is a cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure, Fig. 27 A transmission optical path for receiving an optical signal is shown in FIG. Fig. 27 As shown, the received light signal input through the optical fiber in the second optical fiber 501 is transmitted to the reflective end surface 5011, the received light signal reflected by the reflective end surface 5011 is incident on the second support plate 5712 and transmitted to the second lens mounting surface 5712c, refracted by the second lens mounting surface 5712c and transmitted to the lens array 522, and converged by the corresponding lenses in the lens array 522 and transmitted to the corresponding light receiving chip of the light receiving chip array 310.

[0129] In the disclosed embodiment, the second support plate 5712 can both support and fix the optical fiber in the second optical fiber 501 and install the lens array 522, so as to facilitate the arrangement of the lens array 522 below the reflective end face 5011 of the optical fiber in the second optical fiber 501, thereby ensuring the assembly accuracy between the reflective end face 5011 of the optical fiber in the second optical fiber 501 and the lens array 522, so as to ensure the coupling efficiency of the received light signal reflected by the reflective end face 5011 of the optical fiber in the second optical fiber 501 to the optical receiving chip array. In addition, an inclined second lens mounting surface 5712c is provided on the second support plate 5712 for mounting the lens array 522, so that the optical axis of the lens array 522 is not perpendicular to the photosensitive surface of the light receiving chip, thereby preventing the light signal reflected by the photosensitive surface of the light receiving chip from returning to the lens array 522 along the original path, thereby reducing the return loss caused by the reflected light signal; and the inclined second lens mounting surface 5712c can make the optical axis of the received light signal reflected by the reflecting end surface 5011 parallel to the optical axis of the lens array 522, thereby increasing the coupling efficiency of the received light signal reflected by the reflecting end surface 5011 to the lens array 522, thereby ensuring the coupling efficiency of the received light signal to the light receiving chip array 310.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light receiving component, comprising a light receiving chip array and an optical device, wherein the optical device is located above the light receiving chip array, the optical device is used to transmit a received optical signal to the light receiving chip array, and the light receiving chip array is used to receive the optical signal; wherein the light receiving chip array comprises a first light receiving chip and a second light receiving chip; Wherein, the optical device comprises a demultiplexing substrate, the demultiplexing substrate comprises a reflecting surface, a turning surface and a bottom surface, the reflecting surface is located on one side of the demultiplexing substrate, the turning surface is located on the other side of the demultiplexing substrate, and the bottom surface is located at the bottom of the demultiplexing substrate; a light inlet is arranged on the reflecting surface, and the optical signal enters the demultiplexing substrate from the light inlet; a first beam splitting film and a second beam splitting film are arranged on the bottom surface, and the first beam splitting film and the second beam splitting film are located below the turning surface; the turning surface is used to turn the light beam transmitted to the turning surface; The first beam splitting film is located above the first light receiving chip, and the first beam splitting film is located above the second light receiving chip.

2. The optical module according to claim 1, characterized in that: The optical device further comprises a coupling prism, and the coupling prism is arranged at the light entrance; the light entrance end face of the coupling prism is an inclined face, and an anti-reflection film is arranged on the light entrance end face.

3. The optical module according to claim 1, characterized in that: The optical device further includes a first lens and a second lens, wherein the first lens is located above the first light receiving chip, and the second lens is located above the second light receiving chip; The top of the first lens is connected to the first beam splitter film, and the top of the second lens is connected to the second beam splitter film.

4. The optical module according to claim 3, characterized in that: A converging surface is provided at the bottom of the first lens, and an anti-reflection film is provided on the converging surface; a converging surface is provided at the bottom of the second lens, and an anti-reflection film is provided on the converging surface; A high-reflection film is arranged on the side surface of one side of the demultiplexing substrate, and a high-reflection film is arranged on the turning surface.

5. The optical module according to claim 2, characterized in that: The inclination angle of the light incident end face is 7-10°; The optical receiving component further comprises a second optical fiber, a second optical fiber adapter is arranged at one end of the second optical fiber, an optical fiber connector is arranged at the other end of the second optical fiber, the second optical fiber is used to transmit and receive optical signals, and the optical fiber connector is used to fix the end of the second optical fiber; A collimating lens is arranged between the optical fiber connector and the coupling prism.

6. The optical module according to claim 5, characterized in that: The optical receiving component further comprises a substrate, the bottom of which is connected to the circuit board, and the top of which supports and connects the optical fiber connector, the collimating lens and the demultiplexing matrix.

7. An optical module, characterized in that: include: Circuit boards; A light receiving component, comprising a light receiving chip array and an optical device, wherein the optical device is located above the light receiving chip array, the optical device is used to transmit a received optical signal to the light receiving chip array, and the light receiving chip array is used to receive the optical signal; wherein the light receiving chip array comprises a plurality of light receiving chips; Wherein, the optical device further comprises a demultiplexing substrate and a lens array, the demultiplexing substrate comprises a reflecting surface, a turning surface and a bottom surface, the reflecting surface is located on one side of the demultiplexing substrate, the turning surface is located on the other side of the demultiplexing substrate, and the bottom surface is located at the bottom of the demultiplexing substrate; a light inlet is arranged on the reflecting surface, and the optical signal enters the demultiplexing substrate from the light inlet; the turning surface is used to turn the light beam transmitted to the turning surface; the lens array is located below the turning surface and connected to the bottom surface, and the lens array is located above the optical receiving chip; A beam splitter film array is arranged at the connection between the lens array and the bottom surface, and the beam splitter films in the beam splitter film array selectively transmit the received light signal of the corresponding wavelength according to the wavelength of the received light signal, and the reflecting surface and the turning surface are used to transmit the received light signal of the corresponding wavelength in the received light signal to the corresponding beam splitter film in the beam splitter film array, and the received light signal passing through the corresponding beam splitter film is converged by the corresponding lens in the lens array and transmitted to the corresponding light receiving chip.

8. The optical module according to claim 7, characterized in that: The light receiving component further comprises a coupling prism, and the coupling prism is arranged at the light entrance; the light incident end face of the coupling prism is an inclined face, and an anti-reflection film is arranged on the light incident end face.

9. The optical module according to claim 7, characterized in that: The beam splitter films in the beam splitter film array are arranged on the top surfaces of the lenses in the lens array, and the top surfaces of the lenses are in contact with and connected to the top of the demultiplexing substrate.

10. An optical device, characterized in that: A light receiving component used in an optical module; comprising: A demultiplexing substrate, one side of which includes a reflective surface, the other side of which includes a turning surface, and the bottom of which includes a bottom surface; a light inlet is arranged on the reflective surface, and the turning surface is used to turn the light beam transmitted to the turning surface; A lens array is located at the bottom of the demultiplexing substrate and below the turning surface; a beam splitting film array is arranged between the lens array and the demultiplexing substrate; Among them, the received light signal is incident on the demultiplexing substrate from the light input port, and the received light signal is transmitted between the reflecting surface, the turning surface and the beam splitting film array and is filtered and transmitted by the beam splitting films in the beam splitting film array, so that the light signal of the target wavelength in the received light signal passes through the corresponding beam splitting films in the beam splitting film array and the corresponding lenses in the lens array.

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